美国专利US20010008042A1 Method of using a tube feeder for circuit board components

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专利说明

权利要求

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引用文献

法律状态

优先权

专利摘要:
A method of picking up components for delivery to a circuit board in a pick and place machine includes moving a plurality of components along a channel from a receiving location to a pick-up location; moving the components to an elevated zone at the pick-up location; pivoting the components on the elevated zone to a desired orientation; and picking up the components with a pick-up head.
公开号:US20010008042A1
申请号:US09/777,855
申请日:2001-02-07
公开日:2001-07-19
发明作者:Maurice Davis
申请人:Davis Maurice M.；
IPC主号:H05K13-0434

专利说明:
[0001] 1. Field of the Invention [0001]
[0002] The present invention relates to an apparatus and method for feeding components to an apparatus which automatically places the components on a substrate, such as a printed circuit board or the like. [0002]
[0003] 2. Description of Related Art [0003]
[0004] Automated equipment exists for picking up a component to be placed on a substrate, such as a printed circuit board or the like and rapidly placing the component into its selected place on the printed circuit board for mounting thereon. Such equipment frequently uses a head for picking up the component and carrying it to the appropriate place on the printed circuit board. The head is usually movable in X, Y, Z, coordinate axes. The placement head shuttles between a pick-up location where one or more components are delivered and the appropriate place on the circuit board for mounting the component. [0004]
[0005] Such machines are referred to as pick and place machines, and include machines which are manufactured and marketed by Universal Instruments Corporation of Binghamton, N.Y., under the designation “General Surface Mount Application Machines” or “GSM”. U.S. Pat. No. 5,649,356 relates to automated pick and place machines. [0005]
[0006] The known pick and place machines typically distinguish between components of a conventional shape, such as a substantially rectilinear integrated circuit chip, and such components known as “odd form” components which could include a number of different components of an irregular shape. Such odd form components include USB plugs, MINI DIN sockets, phone jacks transformers, crystals, switches, relays, speakers, transformers, capacitors, and many other different types of components. The present invention can be used with both odd form components, as well as with conventionally shaped rectilinear components. [0006]
[0007] Some known pick and place machines utilize a tube feeder which feeds the components to the pick-up location within the pick and place machine. One such tube feeder is the “Multi-Tube Feeder for the Universal GSM” manufactured and distributed by Universal Instruments Corporation of Binghamton, N.Y. Pending U.S. patent application Ser. No. 09/337,894, the subject matter of which is hereby incorporated herein in its entirety by reference, discloses a tube feeder, and is assigned to the assignee of the present application. U.S. Pat. No. 4,862,578 also discloses a tube feeder. [0007]
[0008] The pick and place head may include a vacuum head connected to a vacuum source for grabbing the components through a rigid vacuum nozzle presented to the component. For many conventionally shaped components, the vacuum nozzle of the vacuum head can easily find a flat, planar surface on the conventional component for making sufficient contact. However, some components, including some of the odd form components, do not include a predictable geometric shape that consistently presents a flat surface for the vacuum nozzle of the vacuum head to sealingly contact the component. In some situations, the configuration of the odd form component causes the component to wobble or tip slightly as it proceeds along the tube feeder to the pick-up location where it is received by the pick and place machine's vacuum head. In addition, leads or burrs extending from the component may cause the component to wobble, rotate, or otherwise not present itself in a proper orientation for pick-up by the head. [0008]
[0009] As a result, when the component is delivered to the pick-up location on the tube feeder, the surface to which the head is intended to make contact may be presented at an angle with respect to the head. For example, the surface of the component to which the head is intended to make contact may be presented at an angle with respect to the plane in which the vacuum nozzle resides. In such a case, the vacuum head may not be able to make a firm, sealed connection or vacuum with the component. As a result, the component may not be picked up by the vacuum head. When this occurs, delays and/or errors may occur. [0009]
[0010] In addition to vacuum heads, some pick and place machines utilize gripping fingers to grip a component. See fingers 46, 48 in U.S. Pat. No. 4,955,653, the contents of which are incorporated by reference herein in its entirety. Orientation of the component may also be important for gripping or other types of heads in order to ensure dependable results. [0010] OBJECTS AND SUMMARY
[0011] It is an object of the present invention to provide a tube feeder for pick and place machines which enables components to be delivered to a receiving location on the tube feeder in such a manner that the component can be easily picked up by a vacuum head with great predictability. [0011]
[0012] According to one aspect of the present invention, a tube feeder for feeding a plurality of components to a pick and place machine includes an elongated channel having a first end and a second end. The first end of the channel is arranged so as to receive a component from a source of the components and the second end of the channel has a pick-up location. The pick-up location includes an elevated zone on which the components can pivot. [0012]
[0013] Another aspect of the present invention includes a method of picking up components for delivery to a circuit board in a pick and place machine comprising the steps of moving a plurality of components along a channel from a receiving location to a pick-up location; moving the components to an elevated zone at the pick-up location; pivoting the components on the elevated zone; and picking up the components with a pick-up head. Interaction between the pick-up head and the components causes the components to be oriented in a preferred orientation for pick-up by the pickup head. [0013] BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a perspective view of a tube feeder used in accordance with the present invention. [0014]
[0015] FIG. 2 is a detailed partial top view of the end of the conveyor track of the tube feeder of FIG. 1. [0015]
[0016] FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2. [0016]
[0017] FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 2. [0017]
[0018] FIG. 5 is a view of a prior art apparatus that corresponds to the FIG. 4 view. [0018]
[0019] FIG. 6[0019] a is a side elevational view and FIG. 6b is a top plan view of an alternative embodiment of the present invention.
[0020] FIG. 7[0020] a is a side elevational view and FIG. 7b is a top plan view of another alternative embodiment of the present invention.
[0021] FIG. 8[0021] a is a side elevational view and FIG. 8b is a top plan view of yet another alternative embodiment of the present invention.
[0022] FIG. 9 is a side elevational view, in partial cross-section, of an alternative embodiment of a vacuum head having a resilient suction cup in addition to the rigid vacuum nozzle. [0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] The present invention is a method and apparatus for the high speed and accurate delivery of components to a pick-up location in an automatic pick and place machine. In particular, the present invention relates to an improvement in a tube feeder device to be used with such automatic pick and place machines. [0023]
[0024] A tube feeder [0024] 10 according to the present invention is illustrated in FIG. 1. Tube feeders, per se, are known in the prior art, and are intended to be detachably mounted on the automatic pick and place machines in an arrangement that depends upon the particular components to be mounted on a circuit board. The tube feeders come in many different configurations and varying sizes. One preferred embodiment of a tube feeder for use in the present invention is disclosed in the '894 patent application, previously referenced and incorporated herein.
[0025] The tube feeder [0025] 10 is mounted such that the feeding end 11 is enclosed within a cabinet of the pick and place machine and the opposite end 13 extends outside of the cabinet of the pick and place machine. The opposite end 13 includes a rack 15 for retaining a plurality of feed tubes 12. The components 18 to be mounted on the pick and place machine are arranged within the individual tubes 12. To load the components on the pick and place machine, a plurality of feed tubes 12, each containing a plurality of components 18 to be mounted on the circuit board, are arranged within the rack 15 on the tube feeder 10.
[0026] A known mechanism (not shown) extracts the components from the feed tubes [0026] 12 and moves the components along an elongated channel 14. The components may be pushed out of the feed tubes 12 by a mechanism at the second end 13 of the tube feeder 10. Alternatively, or in combination, the components may be moved out of the tubes 12, and along the elongated channel 14, by a vibratory mechanism or an air jet (not shown).
[0027] Some of the components [0027] 18 have leads 34 extending from a bottom side thereof (see FIG. 3). In such a case, the channel 14 is provided with grooves or tracks 20 for receiving and guiding the leads 34 of the components 18.
[0028] The preferred embodiment of the present invention is illustrated for use with a plurality of small speakers [0028] 18. However, the present invention is adaptable for use with a number of different types of components. As set forth above, some of the many types of components that can be used in accordance with the present invention are MINI DIN sockets, USB plugs, phone jacks, transformers, crystals, switches, relays, audio jacks, speakers, and capacitors, among others. The present invention is most suitable for irregularly shaped components, sometimes referred to as “odd form” components. However, the present invention can be used with other conventional, rectilinearly shaped components, such as IC chips. Such components may be surface mounted components or may be components that are mounted in through holes.
[0029] As can be seen in FIG. 3, the components [0029] 18 move along the elongated track 14 in the direction of arrow A. A vacuum head 36 moves downwardly in a direction of arrow C so that a rigid vacuum nozzle 38 at a lower end of the vacuum head, typically constructed of a suitable material such as a ceramic, moves down and contacts an upper surface of the component 18. Once sealing contact is made, the component 18 is raised in the direction of arrow B while secured to the vacuum nozzle by the force of the vacuum exerted thereon. As can be seen in FIG. 5, if the component 18 is set at an angle with respect to the vacuum nozzle 38 of the vacuum head 36, the vacuum nozzle 38 will not make a secure, sealed contact with the component 18. Accordingly, in such a case, when the vacuum head 36 retracts, the component 18 will not be withdrawn with the vacuum head 36. Failure to successfully lift the component 18 with the vacuum head 36 causes slow-downs and possibly processing errors the pick and place machine.
[0030] In order to significantly minimize, and possibly even avoid, any failures in picking up the component [0030] 18 with the vacuum head 36, the present invention provides a raised zone 22 at the pick-up location of the channel 14. In a preferred embodiment of the present invention illustrated in FIGS. 2-4, the raised zone 22 comprises four planar surfaces 26, 28, 30, 32 which intersect along a straight edge 24. The intersecting edge 24 thus forms a peak of the elevated zone 22. Because the intersecting edge 24 is substantially linear, the component 18 cannot balance on the edge 24. When a component 18 is located in the elevated zone 22, the component can easily pivot from front to back, i.e., over surfaces 26 and 30. In addition, the component is also able to pivot from side to side, i.e., over surfaces 28 and 32.
[0031] As illustrated in FIG. 4, when the vacuum head [0031] 36 is lowered into place over the component 18, the rigid vacuum nozzle 38 presses downwardly on the component 18. The downward force of the vacuum head 36 on the component 18 causes the component 18 to pivot on the elevated zone 22. Because of the pivoting action of the component 18, represented by arrows D in FIG. 4, the downward pressure of the vacuum head 36 and vacuum nozzle 38 on the component 18 causes the component 18 to automatically align itself in a plane that is substantially perpendicular to the vacuum nozzle 38. Although this plane is usually horizontal, in some embodiments the plane may be set at an angle to the horizontal. As a result, a sufficient contact and good seal may be made between the vacuum nozzle 38 and the component 18.
[0032] As a result of this pivoting action, and the enhanced contacts between the vacuum nozzle [0032] 38 and the component 18, pick-up omissions and processing errors are substantially reduced, and possibly even eliminated.
[0033] As should be clear to those of ordinary skill in the art, there are many alternative embodiments of the present invention that may work instead of the specific arrangement illustrated in FIGS. [0033] 2-4. Several such alternative embodiments are illustrated in FIGS. 6-8.
[0034] In FIGS. 6[0034] a and 6 b, an alternative embodiment is illustrated wherein an elevated zone 122 at the pick-up location of the channel 14 includes four wall surfaces 126, 128, 130, and 132, which intersect at a point 124. Because the four wall surfaces 126, 128, 130, and 132 form a point 124 in the FIG. 6 embodiment, pivoting action is enhanced.
[0035] In a third preferred embodiment, an elevated zone [0035] 222 of the channel is in the form of a dome. The apex 224 of the dome is illustrated in FIG. 7b. The elevated dome 222 provides for uniform pivoting in all 360 degrees.
[0036] A fourth preferred embodiment is disclosed in FIGS. 8[0036] a and 8 b. In the fourth preferred embodiment, the elevated zone 322 includes a horizontal, planar elevated surface 324 that is formed by four intersecting surfaces 326, 328, 330, and 332. In the fourth embodiment, the elevated surface 324 must be sufficiently small so that it does not impede pivoting of the components 18 balanced on top thereof. One of ordinary skill in the art should be able to easily determine a maximum size for the elevated surface 324.
[0037] Although the present invention has been described in use with a vacuum head, alternative uses are contemplated as being within the scope of the present invention. Specifically, instead of a vacuum head, a head incorporating mechanical gripping fingers may also be used, such as is shown in the '653 patent, previously referenced and incorporated herein. FIG. 9 illustrates another alternate embodiment wherein a vacuum head [0037] 40 includes a resilient suction cup 42 mounted at a lower end thereof within the rigid vacuum nozzle 38. The suction cup 42 may be made of a flexible, resilient material, such as silicone rubber or latex, to assist the vacuum nozzle in making a sealing contact with the component. It should be understood that generally such suction cups generally do not have the strength to lift the component without the vacuum nozzle, nor would a suction cup constructed of a resilient material securely hold the component in a desired position for accurate placement on a substrate such as a printed circuit board.
[0038] While particular embodiments of the present invention have been shown and described herein, it is recognized that various modifications thereof will occur to those skilled in the art. Accordingly, the present application is defined by the claims appended hereto, and equivalents thereof. [0038]

权利要求:
Claims (16)
[1" id="US-20010008042-A1-CLM-00001] 1. A method of picking up components for delivery to a circuit board in a pick and place machine, comprising:
moving a plurality of components along a channel from a receiving location to a pick-up location;
moving the components to an elevated zone at the pick-up location;
pivoting the components on the elevated zone to a desired orientation; and
picking up the components with a pick-up head.
[2" id="US-20010008042-A1-CLM-00002] 2. The method of
claim 1 , wherein the pick-up head picks up the components with a vacuum driven vacuum nozzle.
[3" id="US-20010008042-A1-CLM-00003] 3. The method of
claim 1 , wherein the pivoting step pivots the components to a horizontal orientation.
[4" id="US-20010008042-A1-CLM-00004] 4. The method of
claim 2 , wherein the pivoting step pivots the components to a horizontal orientation.
[5" id="US-20010008042-A1-CLM-00005] 5. The method of
claim 1 , wherein the pivoting step includes applying pressure on the components with the pick-up head so as to orient the components in the desired orientation.
[6" id="US-20010008042-A1-CLM-00006] 6. The method of
claim 2 , wherein the pivoting step includes applying pressure on the components with the pick-up head so as to orient the components in the desired orientation.
[7" id="US-20010008042-A1-CLM-00007] 7. The method of
claim 3 , wherein the pivoting step includes applying pressure on the components with the pick-up head so as to orient the components in the desired orientation.
[8" id="US-20010008042-A1-CLM-00008] 8. The method of
claim 4 , wherein the pivoting step includes applying pressure on the components with the pick-up head so as to orient the components in the desired orientation.
[9" id="US-20010008042-A1-CLM-00009] 9. The method of
claim 1 , wherein the channel includes a substantially flat surface and the elevated zone of the pick-up location is higher than the flat surface.
[10" id="US-20010008042-A1-CLM-00010] 10. The method of
claim 1 , wherein the components are moved along the channel by a vibratory mechanism.
[11" id="US-20010008042-A1-CLM-00011] 11. The method of
claim 1 , wherein the components are moved along the channel by an air jet.
[12" id="US-20010008042-A1-CLM-00012] 12. The method of
claim 8 , wherein the components are moved along the channel by a vibratory mechanism.
[13" id="US-20010008042-A1-CLM-00013] 13. The method of
claim 8 , wherein the components are moved along the channel by an air jet.
[14" id="US-20010008042-A1-CLM-00014] 14. The method of
claim 1 , wherein the channel includes tracks and the components include leads, and the step of moving the components along the channel includes guiding the leads of the components through the tracks of the channel.
[15" id="US-20010008042-A1-CLM-00015] 15. The method of
claim 8 , wherein the channel includes tracks and the components include leads, and the step of moving the components along the channel includes guiding the leads of the components through the tracks of the channel.
[16" id="US-20010008042-A1-CLM-00016] 16. The method of
claim 1 , wherein the step of moving the components to the elevated zone includes moving the components up an inclined ramp connecting the channel to the elevated zone.

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引用文献:

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

US6385842B1|2000-01-14|2002-05-14|Delaware Capital Formation, Inc.|Tube feeder having a zone on which components can pivot|

US8912045B2|2012-06-12|2014-12-16|International Business Machines Corporation|Three dimensional flip chip system and method|

CN112520410A|2020-11-25|2021-03-19|群测科技（深圳）有限公司|Tube-packaged chip feeder and feeding control method|US3308977A|1965-10-04|1967-03-14|Ibm|Automatic tray handler|

JPS5738195B2|1978-08-31|1982-08-13|||

JPS639400B2|1979-03-05|1988-02-29|Matsushita Electric Ind Co Ltd||

US4403726A|1980-04-18|1983-09-13|Universal Instruments Corporation|Insertion head for high speed radial lead component sequencing and inserting machine|

JPS6355240B2|1980-12-05|1988-11-01|Mamiya Camera||

US4567652A|1982-11-18|1986-02-04|Reliability Incorporated|Burn-in board loader|

JPH0119278B2|1982-12-30|1989-04-11|Alps Electric Co Ltd||

JPH0221680B2|1983-01-14|1990-05-15|Sony Corp||

JPH0254679B2|1983-01-14|1990-11-22|Sony Corp||

US4507862A|1983-02-28|1985-04-02|Universal Instruments Corporation|Method and apparatus for high speed transfer and insertion of electrical components|

JPH0226800B2|1983-06-01|1990-06-12|Mitsubishi Electric Corp||

US4631812A|1984-05-10|1986-12-30|Quad Systems Corporation|Programmable substrate transport for electronic assembly|

US4611397A|1984-10-09|1986-09-16|Universal Instruments Corporation|Pick and place method and apparatus for handling electrical components|

US4599026A|1985-02-26|1986-07-08|Amp Incorporated|Apparatus for providing a continuous supply of workpieces|

KR900001090B1|1985-07-17|1990-02-26|후지쓰가부시끼가이샤|Electronic parts inserting apparatus|

JPH0336736B2|1985-11-20|1991-06-03|Sanyo Electric Co||

US4862578A|1987-08-20|1989-09-05|Holcomb Gregory W|Tube magazine component feeder|

US4927001A|1988-02-19|1990-05-22|Excellon Automation|Adjustable component cover plate for vibrating conveyor|

US4872258A|1988-09-22|1989-10-10|Universal Instruments Corporation|Pick and place method and apparatus|

US4917561A|1988-09-26|1990-04-17|Universal Instruments Corporation|Feeder cassette for a component processing unit|

US4955653A|1988-09-28|1990-09-11|Administrator, National Aeronautics And Space Administration|Spiral lead platen robotic end effector|

US4995157A|1989-05-16|1991-02-26|Reel-Tech Inc.|Component feeder system|

US5035316A|1990-01-22|1991-07-30|Universal Instruments Corporation|Isolating a first component to be pickup from other components on a vibratory feeder|

US5029383A|1990-06-07|1991-07-09|Universal Instruments Corporation|Articulating tip for pick and place head|

US5105528A|1991-01-22|1992-04-21|Universal Instruments Corporation|Method and apparatus for supplying and changing tips of a pick and place vacuum spindle|

US5123516A|1991-02-15|1992-06-23|Carrier Vibrating Equipment, Inc.|Article conveying and orienting apparatus|

US5201696A|1992-05-05|1993-04-13|Universal Instruments Corp.|Apparatus for replacement of vacuum nozzles|

US5456510A|1994-04-28|1995-10-10|Universal Instruments Corporation|Vacuum nozzle with a push-off device|

US5458388A|1994-08-03|1995-10-17|Universal Instruments Incorporated|Replaceable nozzle tip with vacuum actuated mechanical gripping fingers|

US5452824A|1994-12-20|1995-09-26|Universal Instruments Corporation|Method and apparatus for dispensing fluid dots|

US5649356A|1995-09-22|1997-07-22|Universal Instruments Corporation|Method and apparatus for supplying and placing components|

US5733093A|1995-12-22|1998-03-31|Robodyne Corporation|Stack tube feeder|

US5739846A|1996-02-05|1998-04-14|Universal Instruments Corporation|Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch|

US5743001A|1996-08-16|1998-04-28|Amistar Corporation|Surface mount placement system with single step, multiple place carriage|

US6105753A|1997-08-14|2000-08-22|Graham; S. Neal|Linear vibratory parts feeder|

US6126376A|1998-01-30|2000-10-03|Component Express Corporation|Quick change stacked tube feeder|

US6116822A|1998-08-03|2000-09-12|Motorola, Inc.|Movable abutment for a component feeder|

US6385842B1|2000-01-14|2002-05-14|Delaware Capital Formation, Inc.|Tube feeder having a zone on which components can pivot|KR100350811B1|2000-08-19|2002-09-05|삼성전자 주식회사|Metal Via Contact of Semiconductor Devices and Method of Forming it|

US6799368B2|2001-04-23|2004-10-05|Zierick Manufacturing Corporation|Feeder device and method of using same|

US6601291B2|2001-06-14|2003-08-05|Georgia-Pacific Resins, Inc.|Apparatus and method of producing a core board product|

US6719518B2|2001-10-15|2004-04-13|Anadigics, Inc.|Portable tube holder apparatus|

US7813559B2|2001-11-13|2010-10-12|Cyberoptics Corporation|Image analysis for pick and place machines with in situ component placement inspection|

US7442000B2|2003-03-07|2008-10-28|Ismeca Semiconductor Holding Sa|Method and device for extracting electronic components from tubes and electronic component feeding device|

EP1602266B1|2003-03-07|2007-07-11|ISMECA Semiconductor Holding SA|Method and device for the extraction of electronic components from tubes|

US7706595B2|2003-11-07|2010-04-27|Cyberoptics Corporation|Pick and place machine with workpiece motion inspection|

US20050226947A1|2004-02-04|2005-10-13|Dale Kern|Agents for sequestering serum aging factors and uses therefore|

SG116544A1|2004-05-03|2005-11-28|Ismeca Semiconductor Holding|Method and device for conditioning electronic components into tubes and electronic component outputting device.|

DE102005044087A1|2005-09-08|2007-03-15|Schott Ag|Actuator for moving a tool|

US7545514B2|2005-09-14|2009-06-09|Cyberoptics Corporation|Pick and place machine with improved component pick image processing|

US20090246153A1|2008-03-28|2009-10-01|Nu Skin International, Inc.|Cosmetic compositions for the inhibition of reactive oxygen species|

CN103200790A|2013-04-24|2013-07-10|昆山翰辉电子科技有限公司|General base plate for printed circuit broad screen printing plug hole|

法律状态:
2002-02-26| AS| Assignment|Owner name: DELAWARE CAPITAL FORMATION, INC., DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:UNIVERSAL INSTRUMENTS CORPORATION;REEL/FRAME:012619/0944 Effective date: 20020212 |

2006-04-14| FPAY| Fee payment|Year of fee payment: 4 |

2007-01-05| AS| Assignment|Owner name: UI HOLDING CO., NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DELAWARE CAPITAL FORMATION, INC.;REEL/FRAME:018711/0207 Effective date: 20061106 |

2007-12-20| AS| Assignment|Owner name: MORGAN STANLEY SENIOR FUNDING, INC., NEW YORK Free format text: PLEDGE AND SECURITY AGREEMENT (FIRST LIEN);ASSIGNOR:UI HOLDING CO.;REEL/FRAME:020270/0755 Effective date: 20061106 |

2010-06-21| REMI| Maintenance fee reminder mailed|

2010-07-08| AS| Assignment|Owner name: PATRIARCH PARTNERS AGENCY SERVICES, LLC, AS THE AD Free format text: CHANGE OF ADMINISTRATIVE AGENT;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING INC., AS THE ADMINISTRATIVE AGENT;REEL/FRAME:024640/0963 Effective date: 20081118 |

2010-11-12| LAPS| Lapse for failure to pay maintenance fees|

2010-12-13| STCH| Information on status: patent discontinuation|Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |

2011-01-04| FP| Expired due to failure to pay maintenance fee|Effective date: 20101112 |

优先权:

申请号 | 申请日 | 专利标题

US09/482,330|US6385842B1|2000-01-14|2000-01-14|Tube feeder having a zone on which components can pivot|

US09/777,855|US6478533B2|2000-01-14|2001-02-07|Method of using a tube feeder for circuit board components|US09/777,855| US6478533B2|2000-01-14|2001-02-07|Method of using a tube feeder for circuit board components|

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