• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In a motor driving device, an IC chip of a drive circuit for driving a motor is die-bonded to one island of a leadframe, and a diode chip of a protection diode for preventing the drive circuit from being destroyed when supplied power is connected to the IC chip with reverse polarities is die-bonded to another island of the leadframe. The supplied-power pad of the IC chip is wire-bonded to the second island, which serves as the cathode electrode of the diode chip.
    公开号:US20010002723A1
    申请号:US09/726,563
    申请日:2000-12-01
    公开日:2001-06-07
    发明作者:Kazuhiko Nishimura
    申请人:Rohm Co Ltd；
    IPC主号:H01L24-06
    专利说明:
    [0001] 1. Field of the Invention [0001]
    [0002] The present invention relates to a motor driving device. [0002]
    [0003] 2. Description of the Prior Art [0003]
    [0004] Motor driving devices are known that are provided with a drive circuit for driving a motor and a protection diode for preventing the drive circuit from being destroyed when a power source is connected thereto with reverse polarities. FIG. 2 shows an example of the circuit configuration of the output stage of a pre-drive circuit [0004] 1 for a two-phase half-wave fan motor. A MOS-type field-effect transistor (or bipolar transistor) 100 and a resistor 200 are connected in series between a supplied-power terminal Ti and a ground terminal T2. The node between the transistor 100 and the resistor 200 is connected to an output terminal T3.
    [0005] In actual use, to the output terminal T[0005] 3, the base of an NPN-type power transistor 3 is connected through a resistor 6. The transistor 3 has its emitter grounded, and has its collector connected to one end of the coil 4 of a fan motor. The other end of the coil 4 is connected to the cathode of a diode 5. The anode of the diode 5 is connected to a supplied voltage Vcc.
    [0006] With a motor driving device provided with a pre-drive circuit [0006] 1 as described above, there is a risk of a power source being connected thereto with reverse polarities, for example, as a result of improper insertion of a connector. Therefore, to prevent destruction, resulting from reverse connection of a power source, of the circuit elements, such as the MOS transistor 100, constituting the pre-drive circuit 1, it has been customary to connect to the supplied-power terminal T1 of the pre-drive circuit 1 the cathode of a protection diode 2 of which the anode is connected to a terminal (not shown) to which the supplied power is supplied.
    [0007] Here, the current that flows into the base of the transistor [0007] 3 to drive the motor is supplied directly from the power source, and therefore the protection diode 2 needs to have a high current capacity. In general, however, it is difficult to obtain a satisfactorily high current capacity with a diode formed within an IC (integrated circuit). For this reason, usually, in FIG. 2, whereas the pre-drive circuit 1 is formed as a one-chip IC, the protection diode 2 is connected externally to the IC. As a result, conventional motor driving devices provided with a pre-drive circuit and a protection diode has the disadvantage of requiring an unduly large mounting area and also requiring an extra assembly step.
    [0008] The same problem is addressed by Japanese Patent Application Laid-Open No. H[0008] 7-130927, which proposes, as a solution, mounting a MOS transistor and a diode on a single island. However, this is possible only with a single MOS transistor; that is, with a common IC, which is not formed on a single substrate together with a diode, it is impossible to mount the IC and the diode on a single island. SUMMARY OF THE INVENTION
    [0009] An object of the present invention is to provide a motor driving device that, despite being provided with a drive circuit for driving a motor and a protection diode, requires a reduced mounting area and a reduced number of assembly steps. [0009]
    [0010] To achieve the above object, according to the present invention, a motor driving device is provided with: an IC chip incorporating a circuit for driving a motor; a diode chip provided in a power-supply path through which electric power is supplied to the IC chip; a leadframe having a first island on which the IC chip is mounted and a second island on which the diode chip is mounted; a wire connecting together a supplied-power island provided on the IC chip and the second island; and a package incorporating the leadframe, the IC chip, and the diode chip. [0010]
    [0011] This structure eliminates the need to connect a protection diode externally. Moreover, this structure makes it possible to obtain not only a higher current capacity but also a higher peak inverse voltage in the protection diode than when it is formed within an IC. [0011] BRIEF DESCRIPTION OF THE DRAWINGS
    [0012] This and other objects and features of the present invention will become clear from the following description, taken in conjunction with the preferred embodiments with reference to the accompanying drawings in which: [0012]
    [0013] FIG. 1 is a diagram showing the structure inside the package of a motor driving device embodying the invention; and [0013]
    [0014] FIG. 2 is a diagram showing an example of the circuit configuration of the output stage of a conventional motor driving device provided with a protection diode. [0014] DESCRIPTION OF THE PREFERRED EMBODIMENTS
    [0015] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing in detail the structure inside the package [0015] 40 of a motor driving device embodying the invention. A leadframe 30 has a first island I1, a second island I2, eight inner leads L1, L2, L3, L4, L5, L6, L7, and L8, and three support bars S1, S2, and S3.
    [0016] The first island I[0016] 1 is supported by the support bars S1 and S2, and the second island I2 is supported by the support bar S3. The inner leads L1, L2, L3, L4, L5, L6, L7, and L8 are so formed as to extend out of the package, and are used as terminals. The first island I1 is down-set at portions A and B of the support bars S1 and S2.
    [0017] An IC chip [0017] 10 of a drive circuit for driving a motor is die-bonded to the first island I1 of the leadframe 30. A diode chip 20 of a protection diode is die-bonded to the second island I2, so that the second island I2 serves as the cathode electrode of the diode chip 20. The IC chip 10 is, for example, an IC chip of a pre-drive circuit 1 for a two-phase half-wave fan motor that has a circuit configuration as shown in FIG. 2.
    [0018] On the top surface of the IC chip [0018] 10, eight bonding pads P1, P2, P3, P4, P5, P6, P7, and P8 are formed. Of these bonding pads, the supplied-power pad P1, i.e. the one connected to the power-supply line within the IC chip 10, is wire-bonded to the second island I2 (i.e. the cathode electrode of the diode chip 20).
    [0019] The other pads P[0019] 2, P3, P4, P5, P6, P7, and P8 are connected to the inner leads L2, L3, L4, L5, L6, L7, and L8 respectively. A bonding pad P that serves as the anode electrode of the diode chip 20 is wire-bonded to the inner lead L1.
    [0020] As described above, the motor driving device of this embodiment incorporates a drive circuit for driving a motor and a protection diode as separate chips. This eliminates the need to connect a protection diode externally. This in turn makes it possible to reduce the mounting area required and also reduce the number of assembly steps required. [0020]
    [0021] Moreover, it is possible to make the current capacity of the protection diode higher than when it is formed within the IC of the drive circuit. As a result, it is possible to supply a larger amount of current as a motor-driving current, and also make the peak inverse voltage of the protection diode higher. Thus, it is possible to enhance the function of preventing destruction of the circuit. [0021]
    [0022] As described above, according to the present invention, a motor driving device incorporates a drive circuit for driving a motor and a protection diode as separate chips. This eliminates the need to connect a protection diode externally. Thus, it is possible to reduce the mounting area required and also reduce the number of assembly steps required. [0022]
    [0023] Moreover, it is possible to make the current capacity of the protection diode higher than when it is formed within an IC. As a result, it is possible to supply a larger amount of current as a motor-driving current, and also make the peak inverse voltage of the protection diode higher. Thus, it is possible to enhance the function of preventing destruction of the circuit. [0023]
    权利要求:
    Claims (3)
    [1" id="US-20010002723-A1-CLM-00001] 1. A motor driving device, comprising:
    an IC chip incorporating a circuit for driving a motor;
    a diode chip provided in a power-supply path through which electric power is supplied to the IC chip;
    a leadframe having a first island on which the IC chip is mounted and a second island on which the diode chip is mounted;
    a wire connecting together a supplied-power pad provided on the IC chip and the second island; and
    a package incorporating the leadframe, the IC chip, and the diode chip.
    [2" id="US-20010002723-A1-CLM-00002] 2. A motor driving device as claimed in
    claim 1 ,
    wherein a cathode of the diode chip is kept in contact with the second island, and the supplied-power pad of the IC chip is wire-bonded to the second island.
    [3" id="US-20010002723-A1-CLM-00003] 3. A motor driving device as claimed in
    claim 1 ,
    wherein the diode chip is provided for protection against connection of a power source with reverse polarities.
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    同族专利:
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    US6563203B2|2003-05-13|
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    引用文献:
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    US20030164536A1|2002-02-27|2003-09-04|Koichi Hirata|Semiconductor device|
    US20040094827A1|2002-11-18|2004-05-20|Hideya Takakura|Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment|
    US20050212549A1|2004-03-29|2005-09-29|Fanuc Ltd|Motor driving system having power semiconductor module life detection function|
    CN102034784A|2010-11-10|2011-04-27|吴江巨丰电子有限公司|28K lead frame|
    CN104037151A|2013-03-07|2014-09-10|国际整流器公司|Open source Power Quad Flat No-Leadleadframe|
    CN104810462A|2015-04-17|2015-07-29|广州华微电子有限公司|ESOP8 lead frame of medium-and high-power LED driving chip|
    CN110391199A|2018-04-20|2019-10-29|原相科技股份有限公司|Chip packing-body|JPS6081877A|1983-10-12|1985-05-09|Sharp Corp|Photocoupling semiconductor device|
    JPS60247940A|1984-05-23|1985-12-07|Hitachi Ltd|Semiconductor device and manufacture thereof|
    JP3022592B2|1990-10-31|2000-03-21|日本電気株式会社|Reflective photo sensor|
    JPH04354386A|1991-05-31|1992-12-08|Nec Corp|Photoelectric transfer device|
    JPH06342818A|1993-06-02|1994-12-13|Hitachi Ltd|Semiconductor device|
    US6184585B1|1997-11-13|2001-02-06|International Rectifier Corp.|Co-packaged MOS-gated device and control integrated circuit|
    JP3674333B2|1998-09-11|2005-07-20|株式会社日立製作所|Power semiconductor module and electric motor drive system using the same|US7145223B2|2002-05-22|2006-12-05|Matsushita Electric Industrial Co., Ltd.|Semiconductor device|
    US6903448B1|2002-11-12|2005-06-07|Marvell International Ltd.|High performance leadframe in electronic package|
    US7215012B2|2003-01-03|2007-05-08|Gem Services, Inc.|Space-efficient package for laterally conducting device|
    US20070200210A1|2006-02-28|2007-08-30|Broadcom Corporation|Methods and apparatus for improved thermal performance and electromagnetic interferenceshielding in integrated circuitpackages|
    SG139573A1|2006-07-17|2008-02-29|Micron Technology Inc|Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods|
    JP5486866B2|2009-07-29|2014-05-07|ルネサスエレクトロニクス株式会社|Manufacturing method of semiconductor device|
    法律状态:
    2000-12-01| AS| Assignment|Owner name: ROHM CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NISHIMURA, KAZUHIKO;REEL/FRAME:011324/0434 Effective date: 20001124 |
    2006-10-20| FPAY| Fee payment|Year of fee payment: 4 |
    2010-10-14| FPAY| Fee payment|Year of fee payment: 8 |
    2014-12-19| REMI| Maintenance fee reminder mailed|
    2015-05-13| LAPS| Lapse for failure to pay maintenance fees|
    2015-06-08| STCH| Information on status: patent discontinuation|Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
    2015-06-30| FP| Lapsed due to failure to pay maintenance fee|Effective date: 20150513 |
    优先权:
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    JP34719599A|JP3770763B2|1999-12-07|1999-12-07|Electrical equipment drive|
    JPH11-347195||1999-12-07||
    JP11-347195||1999-12-07||
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