专利摘要:
A movable stage system is configured to support an object subjected to a lithography process. A short stroke part is configured to support the object and a long stroke part is configured to support the short stroke part. The short stroke part is movable over a relative small range of movement with respect to the long stroke part. The long stroke part is movable over a relative large range of movement with respect to a base support arranged to support the long stroke part. A shielding element is arranged between the short and long stroke parts. A position control system maintains a substantially constant distance between the shielding element and the short stroke part.
公开号:NL2010193A
申请号:NL2010193
申请日:2013-01-28
公开日:2013-08-06
发明作者:Bastiaan Ven;Antonius Groot;Johannes Vermeulen;Theodorus Petrus Maria Cadee;Robertus Mathijs Gerardus Rijs;Richard Henricus Adrianus Lieshout
申请人:Asml Netherlands Bv;Koninkl Philips Electronics Nv;
IPC主号:
专利说明:

A STAGE SYSTEM AND A LITHOGRAPHIC APPARATUS
BACKGROUND
Field of the Invention
[0001] The present invention relates to a stage system and a lithographic apparatuscomprising a stage system.
Description of the Related Art
[0002] A lithographic apparatus is a machine that applies a desired pattern onto asubstrate, usually onto a target portion of the substrate. A lithographic apparatus can beused, for example, in the manufacture of integrated circuits (ICs). In such a case, apatterning device, which is alternatively referred to as a mask or a reticle, may be usedto generate a circuit pattern to be formed on an individual layer of the IC. This patterncan be transferred onto a target portion (e.g. including part of, one, or several dies) on asubstrate (e.g. a silicon wafer). Transfer of the pattern is typically via imaging onto alayer of radiation-sensitive material (resist) provided on the substrate. In general, asingle substrate will contain a network of adjacent target portions that are successivelypatterned. Conventional lithographic apparatus include so-called steppers, in whicheach target portion is irradiated by exposing an entire pattern onto the target portion atonce, and so-called scanners, in which each target portion is irradiated by scanning thepattern through a radiation beam in a given direction (the “scanning”-direction) whilesynchronously scanning the substrate parallel or anti-parallel to this direction. It is alsopossible to transfer the pattern from the patterning device to the substrate by imprintingthe pattern onto the substrate.
[0003] The known lithographic apparatus comprises a movable stage systemconfigured to support a substrate. The stage system is movable to position the substratesupported thereon in six degrees of freedom with high accuracy. The main plane ofmovement of the stage system is parallel to the main plane of the substrate, for examplethe horizontal plane, although the stage system is usually also capable of moving thesubstrate over a small range in the direction perpendicular to the main plane of thesubstrate, e.g. the vertical direction.
[0004] In an embodiment, the stage system is a dual part substrate stage comprising ashort stroke part configured to support the substrate and a long stroke part configured to support the short stroke part, wherein said short stroke part is movable over a first rangeof movement with respect to the long stroke part, and wherein said long stroke part ismovable over a second range of movement with respect to a base support arranged tosupport the long stroke part, wherein said second range of movement is substantiallylarger than the first range of movement.
[0005] The short stroke part is arranged above the long stroke part at a relatively smalldistance. Movement and/or deformation of the long stroke part may result indisturbances on the short stroke part. These disturbances caused by the long stroke partmay be of different types such as electromagnetic forces, air pressure disturbances dueto movements or deformations of the long stroke part, and thermal loads. Also dynamiclinks, such as flexes, hoses, fibers or cables running between the long stroke part andthe short stroke part may transfer disturbances from the long stroke part to the shortstroke part.
[0006] In particular, shape changes or movement of the long stroke part, for instancebending due to actuation of the coils in the long stroke part may result in pressurevariations in the space between the short stroke part and the long stroke part. Thesepressure variations in the space between the short stroke part and the long stroke part,may have a substantial negative effect on the overlay and focus performance of theshort stroke part. The movement and/or deformation of the long stroke part may alsohave a disturbing effect on other parts of the lithographic apparatus, such as encodersystem grid plates arranged above the stage system.
SUMMARY
[0007] Generally, it is desirable to provide an improved substrate stage system.Further, it is desirable to provide a stage system having a short stroke part long strokepart, with improved positioning of the short stroke part, and which is preferably lesssensitive to disturbances caused by the long stroke part. It is also desirable to provide allithographic apparatus with a first and a second object, wherein the position of thesecond object is less influenced by disturbance of the first object. In particular, it isdesirable to provide a lithographic apparatus comprising a stage system, having a shortstroke part long stroke part, with improved positioning of the short stroke part, andwhich is preferably less sensitive to disturbances caused by the long stroke part.
[0008] According to an embodiment of the invention, there is provided a movable stagesystem configured to support an object, wherein the stage system comprises: a short stroke part configured to support the object and a long stroke partconfigured to support the short stroke part, wherein said short stroke part is movableover a first range of movement with respect to the long stroke part, and wherein saidlong stroke part is movable over a second range of movement with respect to a basesupport arranged to support the long stroke part, wherein said second range ofmovement is substantially larger than the first range of movement, a shield element arranged between the short stroke part and the long stroke part,and configured to shield the short stroke part for pressure variations in a space betweenthe long stroke part and the short stroke part, which pressure variations are caused bymovements and/or deformations of the long stroke part, and a position control system to control a position related quantity of the shieldingelement, wherein said position control system is configured to maintain a substantiallyconstant distance between the shielding element and the short stroke part, wherein theposition control system comprises a sensor to determine a position related quantity ofthe shielding element with respect to the short stroke part, a controller to provide acontrol signal on the basis of the determined position related quantity and at least oneactuator to actuate the shielding element on the basis of the control signal, andwherein the actuator is arranged between the shielding element and the long stroke partor between the shielding element and the base support.
[0009] According to an embodiment of the invention, there is provided a lithographicapparatus comprising: an illumination system configured to condition a radiation beam;a support constructed to support a patterning device, the patterning device beingcapable of imparting the radiation beam with a pattern in its cross-section to form apatterned radiation beam; a substrate support constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto atarget portion of the substrate, wherein the lithographic apparatus comprises a movablestage system configured to support an object, wherein the stage system comprises:a short stroke part configured to support the object;a long stroke part configured to support the short stroke part, whereinsaid short stroke part is movable over a first range of movement with respect to the long stroke part, and wherein said long stroke part is movable over a second range ofmovement with respect to a base support arranged to support the long stroke part,wherein said second range of movement is substantially larger than the first range ofmovement, a shield element arranged between the short stroke part and the longstroke part, and configured to shield the short stroke part for pressure variations in aspace between the long stroke part and the short stroke part, which pressure variationsare caused by movements and/or deformations of the long stroke part, and a position control system to control a position related quantity of theshielding element, wherein said position control system is configured to maintain asubstantially constant distance between the shielding element and the short stroke part,wherein the position control system comprises a sensor to determine a position relatedquantity of the shielding element with respect to the short stroke part, a controller toprovide a control signal on the basis of the determined position related quantity and atleast one actuator to actuate the shielding element on the basis of the control signal,wherein the actuator is arranged between the shielding element and the long stroke partor between the shielding element and the base support, and wherein the stage system is the patterning device support or thesubstrate support.
[0010] According to an embodiment of the invention, there is provided a lithographic apparatus comprising: an illumination system configured to condition a radiation beam;a support constructed to support a patterning device, the patterning device beingcapable of imparting the radiation beam with a pattern in its cross-section to form apatterned radiation beam; a substrate support constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto atarget portion of the substrate,a first object,a second object, a shield element arranged between the first object and the second object, andconfigured to shield the second object for pressure variations in a space between thefirst object and the second object, which pressure variations are caused by movementsand/or deformations of the first object, and a position control system to control a position related quantity of the shieldingelement, wherein said position control system is configured to maintain a substantiallyconstant distance between the shielding element and the second object, wherein theposition control system comprises a sensor to determine a position related quantity ofthe shielding element with respect to the second object, a controller to provide a controlsignal on the basis of the determined position related quantity and at least one actuatorto actuate the shielding element on the basis of the control signal.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Embodiments of the invention will now be described, by way of example only,with reference to the accompanying schematic drawings in which correspondingreference symbols indicate corresponding parts, and in which:
[0012] Figure 1 depicts a lithographic apparatus according to an embodiment of theinvention;
[0013] Figure 2 depicts a side view of a stage system according to a first embodimentof the invention
[0014] Figure 3 depicts a schematic top view of the embodiment of Figure 1;
[0015] Figure 4 depicts a side view of a stage system according to a secondembodiment of the invention; and
[0016] Figure 5 depicts a side view of a stage system according to a third embodimentof the invention.
nF.TATT.ED DESCRIPTION
[0017] Figure 1 schematically depicts a lithographic apparatus according to oneembodiment of the invention. The apparatus includes an illumination system(illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or anyother suitable radiation), a mask support structure (e.g. a mask table) MT constructed tosupport a patterning device (e.g. a mask) MA and connected to a first positioningdevice PM configured to accurately position the patterning device in accordance withcertain parameters. The apparatus also includes a substrate table (e.g. a wafer table) WTor "substrate support" constructed to hold a substrate (e.g. a resist-coated wafer) W andconnected to a second positioning device PW configured to accurately position the substrate in accordance with certain parameters. The apparatus further includes aprojection system (e.g. a refractive projection lens system) PS configured to project apattern imparted to the radiation beam B by patterning device MA onto a target portionC (e.g. including one or more dies) of the substrate W.
[0018] The illumination system may include various types of optical components, suchas refractive, reflective, magnetic, electromagnetic, electrostatic or other types ofoptical components, or any combination thereof, for directing, shaping, or controllingradiation.
[0019] The mask support structure supports, i.e. bears the weight of, the patterningdevice. It holds the patterning device in a manner that depends on the orientation of thepatterning device, the design of the lithographic apparatus, and other conditions, suchas for example whether or not the patterning device is held in a vacuum environment.The mask support structure can use mechanical, vacuum, electrostatic or otherclamping techniques to hold the patterning device. The mask support structure may bea frame or a table, for example, which may be fixed or movable as required. The masksupport structure may ensure that the patterning device is at a desired position, forexample with respect to the projection system. Any use of the terms “reticle” or “mask”herein may be considered synonymous with the more general term “patterning device.”
[0020] The term “patterning device” used herein should be broadly interpreted asreferring to any device that can be used to impart a radiation beam with a pattern in itscross-section so as to create a pattern in a target portion of the substrate. Tt should benoted that the pattern imparted to the radiation beam may not exactly correspond to thedesired pattern in the target portion of the substrate, for example if the pattern includesphase-shifting features or so called assist features. Generally, the pattern imparted tothe radiation beam will correspond to a particular functional layer in a device beingcreated in the target portion, such as an integrated circuit.
[0021] The patterning device may be transmissive or reflective. Examples of patterningdevices include masks, programmable mirror arrays, and programmable LCD panels.Masks are well known in lithography, and include mask types such as binary,alternating phase-shift, and attenuated phase-shift, as well as various hybrid masktypes. An example of a programmable mirror array employs a matrix arrangement ofsmall mirrors, each of which can be individually tilted so as to reflect an incomingradiation beam in different directions. The tilted mirrors impart a pattern in a radiationbeam which is reflected by the mirror matrix.
[0022] The term “projection system” used herein should be broadly interpreted asencompassing any type of projection system, including refractive, reflective,catadioptric, magnetic, electromagnetic and electrostatic optical systems, or anycombination thereof, as appropriate for the exposure radiation being used, or for otherfactors such as the use of an immersion liquid or the use of a vacuum. Any use of theterm “projection lens” herein may be considered as synonymous with the more generalterm “projection system”.
[0023] As here depicted, the apparatus is of a transmissive type (e.g. employing atransmissive mask). Alternatively, the apparatus may be of a reflective type (e.g.employing a programmable mirror array of a type as referred to above, or employing areflective mask).
[0024] The lithographic apparatus may be of a type having two (dual stage) or moresubstrate tables or "substrate supports" (and/or two or more mask tables or "masksupports"). In such “multiple stage” machines the additional tables or supports may beused in parallel, or preparatory steps may be carried out on one or more tables orsupports while one or more other tables or supports are being used for exposure.
[0025] The lithographic apparatus may also be of a type wherein at least a portion ofthe substrate may be covered by a liquid having a relatively high refractive index, e.g.water, so as to fill a space between the projection system and the substrate. Animmersion liquid may also be applied to other spaces in the lithographic apparatus, forexample, between the mask and the projection system. Immersion techniques can beused to increase the numerical aperture of projection systems. The term “immersion”as used herein does not mean that a structure, such as a substrate, must be submerged inliquid, but rather only means that a liquid is located between the projection system andthe substrate during exposure.
[0026] Illuminator IL receives a radiation beam from a radiation source SO. The sourceand the lithographic apparatus may be separate entities, for example when the source isan excimer laser. In such cases, the source is not considered to form part of thelithographic apparatus and the radiation beam is passed from the source SO to theilluminator IL with the aid of a beam delivery system BD including, for example,suitable directing mirrors and/or a beam expander. In other cases the source may be anintegral part of the lithographic apparatus, for example when the source is a mercurylamp. The source SO and the illuminator IL, together with the beam delivery systemBD if required, may be referred to as a radiation system.
[0027] The illuminator IL may include an adjuster AD configured to adjust the angularintensity distribution of the radiation beam. Generally, at least the outer and/or innerradial extent (commonly referred to as σ-outer and σ-inner, respectively) of theintensity distribution in a pupil plane of the illuminator can be adjusted. In addition, theilluminator IL may include various other components, such as an integrator EN and acondenser CO. The illuminator may be used to condition the radiation beam, to have adesired uniformity and intensity distribution in its cross-section.
[0028] The radiation beam B is incident on the patterning device (e.g., mask MA),which is held on the mask support structure (e.g., mask table MT), and is patterned bythe patterning device. Having traversed the mask MA, the radiation beam B passesthrough the projection system PS, which focuses the beam onto a target portion C of thesubstrate W. With the aid of the second positioning device PW and position sensor IF(e.g. an interferometric device, linear encoder or capacitive sensor), the substrate tableWT can be moved accurately, e.g. so as to position different target portions C in thepath of the radiation beam B. Similarly, the first positioning device PM and anotherposition sensor (which is not explicitly depicted in Figure 1) can be used to accuratelyposition the mask MA with respect to the path of the radiation beam B, e.g. aftermechanical retrieval from a mask library, or during a scan. In general, movement of themask table MT may be realized with the aid of a long-stroke module (coarsepositioning) and a short-stroke module (fine positioning), which form part of the firstpositioning device PM. Similarly, movement of the substrate table WT or "substratesupport" may be realized using a long-stroke module and a short-stroke module, whichform part of the second positioner PW. In the case of a stepper (as opposed to a scanner)the mask table MT may be connected to a short-stroke actuator only, or may be fixed.Mask MA and substrate W may be aligned using mask alignment marks Ml, M2 andsubstrate alignment marks PI, P2. Although the substrate alignment marks asillustrated occupy dedicated target portions, they may be located in spaces betweentarget portions (these are known as scribe-lane alignment marks). Similarly, insituations in which more than one die is provided on the mask MA, the mask alignmentmarks may be located between the dies.
[0029] The depicted apparatus could be used in at least one of the following modes:
[0030] 1. In step mode, the mask table MT or "mask support" and the substratetable WT or "substrate support" are kept essentially stationary, while an entire pattern imparted to the radiation beam is projected onto a target portion C at one time (i.e. asingle static exposure). The substrate table WT or "substrate support" is then shifted inthe X and/or Y direction so that a different target portion C can be exposed. In stepmode, the maximum size of the exposure field limits the size of the target portion Cimaged in a single static exposure.
[0031] 2. In scan mode, the mask table MT or "mask support" and the substrate table WT or "substrate support" are scanned synchronously while a pattern imparted tothe radiation beam is projected onto a target portion C (i.e. a single dynamic exposure).The velocity and direction of the substrate table WT or "substrate support" relative tothe mask table MT or "mask support" may be determined by the (de-)magnification andimage reversal characteristics of the projection system PS. In scan mode, the maximumsize of the exposure field limits the width (in the non-scanning direction) of the targetportion in a single dynamic exposure, whereas the length of the scanning motiondetermines the height (in the scanning direction) of the target portion.
[0032] 3. In another mode, the mask table MT or "mask support" is kept essentially stationary holding a programmable patterning device, and the substrate tableWT or "substrate support" is moved or scanned while a pattern imparted to the radiationbeam is projected onto a target portion C. In this mode, generally a pulsed radiationsource is employed and the programmable patterning device is updated as required aftereach movement of the substrate table WT or "substrate support" or in betweensuccessive radiation pulses during a scan. This mode of operation can be readilyapplied to maskless lithography that utilizes programmable patterning device, such as aprogrammable mirror array of a type as referred to above.
[0033] Combinations and/or variations on the above described modes of use or entirelydifferent modes of use may also be employed.
[0034] Figure 2 depicts a movable substrate stage system of a lithographic apparatuscomprising short stroke part SS and a long stroke part LS. The short stroke part SS isconfigured to support a wafer W. the short stroke part SS may comprise an encoderblock. On the encoder block a number of encoder sensors may be mounted to cooperatewith one or more grid plates mounted to a reference element, for example a referenceframe, such as a melroframe or a reference object such as the projection system PS.
[0035] In an alternative embodiment the short stroke part SS may comprise a mirrorblock having a number of reflective surfaces which serve as mirror surfaces for an interferometer system. The encoder block or mirror block may support a substrate tableon which a substrate W can be held for instance by a vacuum clamp.
[0036] The short stroke part SS is movably supported on the long stroke part LS with aspace SP therebetween. Short stroke actuators (not shown) are provided to move theshort stroke part SS with respect to the long stroke part over a relatively small range ofmovement. Within this small range of movement, the short stroke part can bepositioned with high accuracy, normally in three or six degrees of freedom.
[0037] The long stroke part LS is supported on a base support BS, for example a baseframe, in particular a magnet plate mounted on the base frame. The long stroke part LSis movable over a relative large range of movement with respect to the base support BS, i.e. the range of movement of the long stroke part LS with respect to the base supportBS is substantially larger than the range of movement of the short stroke part SS withrespect to the long stroke part LS.
[0038] The accuracy of the positioning of the long stroke part LS may be relativelylow. The main task of the positioning of the long stroke part LS is to position the targetposition of the short stroke part SS within the range of movement of the short strokepart SS. Within this smaller range of movement, the short stroke part SS can bepositioned with high accuracy in the target location.
[0039] The long stroke part LS comprises a number of coils CL forming part of theshort stoke and/or long stroke actuators. Actuation of these coils CL may result inmovement and/or deformation of the long stroke part LS. This movement and/ordeformation may result in pressure variations in the space SP between the long strokepart LS and the short stroke part SS.
[0040] A shield element SE is arranged between the short stroke part SS and the longstroke part LS to shield the short stroke part SS from the effects of these pressurevariations. In the absence of such shield element SE, the pressure variations may have asubstantially larger negative effect on the position accuracy of the short stroke part SSand therewith have a substantial negative effect on the overlay and focus performanceof the short stroke part SS. In practice, the disturbances caused by the long stroke partLS may be the main limiting factor for the overlay and focus performance of the shortstroke part SS.
[0041] To shield the short stroke part SS from the pressure variations in the space SP, aposition control system PCS is provided which is configured to maintain a substantiallyconstant distance between the short stroke part SS and the shield element SE. The position control system PCS of the embodiment of Figure 2 is configured to maintain aconstant distance in the z-direction, as this is the main direction for transfer ofdisturbances due to pressure variations in the space SP.
[0042] The position control system PCS comprises sensors SEN, a controller CON andactuators ACT.
[0043] The sensors SEN are mounted on the short stroke part SS and arranged tomeasure a distance between the short stroke part SS and the shield element SE. Each ofthe sensors SEN is configured to measure the distance between the shield element SEand the short stroke part SS in the z-direction. The sensors SEN may be of any suitabletype, such as optical sensors or capacitive sensors. In an alternative embodiment, thesensors may be mounted on the shield element SE.
[0044] Also the sensor or sensors SEN may be mounted on an other object, wherebythe distance between the short stroke part SS and the shield element SE is determinedon the basis of a difference between a distance from the other object to the short strokepart SS and a distance from the other object to the shield element SE. An assembly ofsensors to determine such difference in distance is regarded to be a sensor to measurethe distance between the short stroke part SS and the shield element SE. For example,the metro-frame or base support can be used as an alternative mounting location of thesensors.
[0045] Kinematic couplings KC are provided to maintain the shield element SE insubstantially the same x-y position, but to make movements of the shield element SE inthe z-direction possible. The kinematic couplings KC may for instance be leaf springsholding the shield element SE in substantially the same x-y position, but which allowmovement of the shield element SE in the z-direction.
[0046] The measured distance between the shield element SE and the short stroke partSS is provided as a sensor signal to the controller CON. The controller CON may be aseparate controller or a part of any other control system, for example the stage positioncontrol system. The controller may also be part of a central processing unit of thelithographic apparatus.
[0047] The controller CON is configured to maintain substantially the same distancebetween the shield element SE and the short stroke part SS. The aim of the controllermay be to maintain the distance, in z-direction, between shield element SE and shortstroke part SS at a desired set-point. As an alternative, the controller may be aimed at maintaining the speed and/or acceleration of the shield element SE with respect to theshort stroke part SS at zero.
[0048] The controller CON provides a control signal to the actuators ACT. Theactuators ACT are provided to actuate the shield element SE in the z-direction. Theactuators ACT are provided between the long stroke part LS and the shield element SE.The actuators SE may be any type of actuators, such as piezo actuators, electromagneticactuators, Lorentz actuators. The range of movement of the actuators ACT shouldpreferably be as large as the range of movement required between the long stroke partLS and the short stroke part SS.
[0049] The controller shown in Figure 2 controls the distance between the shieldelement SE and the short stroke part SS on the basis of a feedback loop from sensorsSEN measuring the distance between the short stroke part SS and the shield elementSE. As an alternative, or in addition thereto, a feed-forward loop may be used. Suchfeed-forward loop may use information on the movement and/or deformationsmeasured in the long stroke part LS to control the position of the shield element SE.Such feed-forward actuation of the shield element SE may also substantially correct forthe pressure variation effects in the space SP as a result of the movements and/ordeformation of the long stroke part LS. In such embodiment one or more sensors maybe provided, for example between the base support BS and the long stroke part LSand/or in the long stroke part LS to measure the movement and/or deformations of thelong stroke part LS.
[0050] By maintaining a constant distance between the shield element SE and the shortstroke part SS, the pressure variations in the space SP will have substantially less effecton the accuracy of the positioning of the short stroke part SS. As a result, the focus andoverlay performance of the short stroke part SS may be increased.
[0051] The shield element SE shown in Figure 2 is a plate shaped object. In alternativeembodiments, the shield element SE may have any shape that can be arranged betweenthe long stroke part LS and the short stroke part SS and which is capable of shieldingthe short stroke part SS from pressure variations in the space SP caused by movementsand/or deformation of the long stroke part LS. The shield element SE may alsocomprise multiple shield plates and/or other objects having a shielding effect.
[0052] The shield element SE is preferably made of light and stiff material. The shieldelement may for instance be at least partly constructed from ceramic material. Theshield element SE may further comprise material with high heat conductivity, and/or material which absorbs or reflect electromagnetic fields and/or electric field absorbingor reflecting materials. The shield element SE may be provided with a cooling system,for instance one or more cooling channels running through or on the shield element SE.By providing material with high heat conductivity or a cooling system, the heat transferof the long stroke part LS to the short stroke part SS can be decreased, which may havea positive effect on the position accuracy of the short stroke part SS. Further, theprovision of material which absorbs or reflects electromagnetic or electric fields on theshield element SE decreases the effect of electromagnetic fields and/or electric fieldsoriginating from the long stroke part LS on the positioning accuracy of the short strokepart SS.
[0053] Figure 3 shows schematically a top view on the long stroke part LS, the shortstroke part SS and the shield element SE. From the top view it can be seen that, in theprojection in the z-direction, i.e. the direction in which the distance between the shieldelement SE and the short stroke part SS is controlled, the surface area of the shieldelement SE extends over the complete surface area of the short stroke part SS.Therefore, substantially all pressure variations in the space SP in the controlledz-direction are shielded by the shielding element SE.
[0054] Generally, it is desirable that in a projection in the controlled direction, i.e. thedirection in which the distance between the short stroke part SS and the shield elementSE is controlled, the surface area of the shield element SE extends over a substantialpart of the surface area of the short stroke part SS, for example at least 50% of thesurface area of the long stroke part LS, preferably at least 75% of the surface area of thelong stroke part LS, more preferably at 100% of the surface area of the long stroke partLS.
[0055] Furthermore, the location of the shielding element may be arranged at a locationwhere the pressure variations are known to have a large effect on the accuracy ofpositioning of the short stroke part SS.
[0056] The size and location of the shield element SE may also be selected to shieldother parts of the lithographic apparatus from pressure variations resulting frommovement and/or deformation of the long stroke part. For example, the shield elementSE shown in Figure 2 may also substantially decrease the effect of pressure variationson grid plates or other parts of a position measurement system mounted above the shortstroke part.
[0057] Figure 4 shows a second embodiment of a stage system according to theinvention. The stage system comprises, corresponding to the embodiment of Figure 2, ashort stroke part SS and a long stroke part LS, wherein the asp is movable with respectto the long stroke part LS and the long stroke part LS is movable with respect to a basesupport BS.
[0058] Parts of the stage system having the same or substantially the same function asthe stage system in Figure 2 are indicated by the same reference signs.
[0059] Between the long stroke part LS and the short stroke part SS a shield element SEis arranged which shields the short stroke part SS from pressure variations in the spaceSP caused by movements and/or deformation of the long stroke part LS. The shieldelement encloses the long stroke part LS at least at the side faced towards the shortstroke part SS so that the influence of the disturbances caused by the long stroke part LSon the positioning may be further reduced. The base support BS and the shield elementSE fully enclose the long stroke part LS. Also, the short stroke part SS is substantiallyenclosed by the shield element SE, at least at the side directed towards the long strokepart LS.
[0060] The shield element SE is actuated and supported by actuators ACT whichdirectly cooperate with the base support BS. The shield element SE is movable in sixdegrees of freedom. The base support BS, for example a magnet plate, may be a stablestationary object and may be more suitable for actuation and support of the shieldelement SE than the long stroke part LS itself.
[0061] The sensors SEN are configured to determine the position of the shield systemSE in six degrees of freedom. The actuators ACT are configured to position the shieldsystem SE in six degrees of freedom. The controller CON is configured to maintain asubstantially constant distance between the shielding element SE and the short strokepart SS in three directions, i.e. the x-direction, the y-direction and the z-direction.
[0062] An advantage of the shield element SE enclosing the long stroke part LS is thatother objects sensitive for pressure variations caused by movement and/or deformationof the long stroke part LS may be properly shielded against these disturbances. Forexample, grid plates mounted on the metroframe or projection system above the stagesystem may be sensitive for disturbances caused by the movements and/ordeformations of the long stroke part LS. Enclosure of the long stroke part LS decreasesthese effects.
[0063] In addition or as an alternative, a shield element may be provided between thelong stroke part LS and each of the grid plates. The position of the shield element maybe controlled to maintain substantially the same distance between the grid plate and theshield element. The shield element may be transparent to transmit a sensor beam of theencoder sensor mounted on the short stroke part SS.
[0064] Figure 5 shows a third embodiment of a stage system according to theinvention. The stage system comprises, corresponding to the embodiments of Figures 2and 4, a short stroke part SS and a long stroke part LS, wherein the asp is movable withrespect to the long stroke part LS and the long stroke part LS is movable with respect toa base support BS.
[0065] Parts of the stage system having the same or substantially the same function asthe stage system in Figure 2 are indicated by the same reference signs.
[0066] In the embodiment of Figure 5, a plate shaped shield element SE is providedbetween the long stroke part LS and the short stroke part SS, similar to the shieldelement of Figure 2. This plate shaped shield element SE may have some flexibility, forinstance as a result of a desired low mass.
[0067] The position control system PCS is configured to control a shape of the shieldelement SE. The shape of the shield element SE may be determined by multiplesensors, for example a one or multidimensional array of sensors SEN-1 to SEN-n,which each measure a distance between the short stroke part SS and the shield elementSE. Multiple actuators ACT-1 to ACT-n may be provided to actuate the shield elementSE at different locations on the shield element SE.
[0068] The position control system PCS of Figure 5 is provided to control the shape ofthe shield element SE in a single direction, i.e. the sensors SEN-1 to SEN-n areconfigured to measure the distance between the short stroke part SS and the shieldelement SE in a single direction, the z-direction, and the actuators ACT-1 to ACT-n areconfigured to actuate the shield element SE in a single direction, the z-direction. Inanother embodiment, the sensors SEN-1 to SEN-n and actuators ACT-1 to ACT-n maybe configured to act in multiple directions and/or multiple degrees of freedom, forinstance in three or six degrees of freedom.
[0069] In the embodiment of Figure 5, each of the sensors SEN-1 to SEN-n is alignedwith one of the actuators ACT-1 to ACT-n. This is in principle not required. Thesensors SEN-1 to SEN-n and actuators ACT-1 to ACT-n may be arranged at any suitable location. Also, the number of sensors SEN-1 to SEN-n and actuators ACT-1 toACT-n does not have to be the same.
[0070] The aim of the controller is to hold the shield element SE at substantially thesame distance from the short stroke part SS by holding the shield element SE in aset-point position with respect to the short stroke part SS or by maintaining the speeddifference or acceleration difference between the short stroke part SS and the shieldelement SE at zero. This aim may be achieved by a feedback loop as shown in Figure 5,and/or a feed-forward loop as described with respect to the embodiment of Figure 2.
[0071] The shield element SE shown in Figure 5 further supports a cable bundle holderCBH which holds a cable bundle CB running between the long stroke part LS and theshort stroke part SS. Since the distance between the short stroke part SS and the shieldelement SE is maintained substantially constant, at least in the z-direction, lessdisturbances are transferred from the long stroke part LS to the short stroke part SS viathe cable bundle CB.
[0072] The cable bundle CB may comprise any type of mechanical connectionsbetween the long stroke part LS and the short stroke part SS, such as electrical cables,optical fibers, hoses, control cables.
[0073] Although specific reference may be made in this text to the use of lithographicapparatus in the manufacture of ICs, it should be understood that the lithographicapparatus described herein may have other applications, such as the manufacture ofintegrated optical systems, guidance and detection patterns for magnetic domainmemories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magneticheads, etc. The skilled artisan will appreciate that, in the context of such alternativeapplications, any use of the terms “wafer” or “die” herein may be considered assynonymous with the more general terms “substrate” or “target portion", respectively.The substrate referred to herein may be processed, before or after exposure, in forexample a track (a tool that typically applies a layer of resist to a substrate and developsthe exposed resist), a metrology tool and/or an inspection tool. Where applicable, thedisclosure herein may be applied to such and other substrate processing tools. Further,the substrate may be processed more than once, for example in order to create amulti-layer IC, so that the term substrate used herein may also refer to a substrate thatalready contains multiple processed layers.
[0074] Although specific reference may have been made above to the use ofembodiments of the invention in the context of optical lithography, it will be appreciated that the invention may be used in other applications, for example imprintlithography, and where the context allows, is not limited to optical lithography. Inimprint lithography a topography in a patterning device defines the pattern created on asubstrate. The topography of the patterning device may be pressed into a layer of resistsupplied to the substrate whereupon the resist is cured by applying electromagneticradiation, heat, pressure or a combination thereof. The patterning device is moved outof the resist leaving a pattern in it after the resist is cured.
[0075] The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) radiation (e.g. having awavelength of or about 365, 248, 193, 157 or 126 nm) and extreme ultra-violet (EUV)radiation (e.g. having a wavelength in the range of 5-20 nm), as well as particle beams,such as ion beams or electron beams.
[0076] The term “lens”, where the context allows, may refer to any one or combinationof various types of optical components, including refractive, reflective, magnetic,electromagnetic and electrostatic optical components.
[0077] While specific embodiments of the invention have been described above, it willbe appreciated that the invention may be practiced otherwise than as described. Forexample, the invention may take the form of a computer program containing one ormore sequences of machine-readable instructions describing a method as disclosedabove, or a data storage medium (e.g. semiconductor memory, magnetic or optical disk)having such a computer program stored therein.
[0078] The descriptions above are intended to be illustrative, not limiting. Thus, it willbe apparent to one skilled in the art that modifications may be made to the invention asdescribed without departing from the scope of the clauses set out below. Other aspectsof the invention are set out as in the following numbered clauses: 1. A movable stage system configured to support an object, wherein the stage systemcomprises: a short stroke part configured to support the object; a long stroke part configured to support the short stroke part, wherein said shortstroke part is movable over a first range of movement with respect to the long strokepart, and wherein said long stroke part is movable over a second range of movementwith respect to a base support arranged to support the long stroke part, wherein saidsecond range of movement is substantially larger than the first range of movement, a shield element arranged between the short stroke part and the long stroke part,and configured to shield the short stroke part for pressure variations in a space betweenthe long stroke part and the short stroke part, which pressure variations are caused bymovements and/or deformations of the long stroke part, and a position control system to control a position related quantity of the shieldingelement, wherein said position control system is configured to maintain a substantiallyconstant distance between the shielding element and the short stroke part, wherein theposition control system comprises a sensor to determine a position related quantity ofthe shielding element with respect to the short stroke part, a controller to provide acontrol signal on the basis of the determined position related quantity and at least oneactuator to actuate the shielding element on the basis of the control signal, and whereinthe actuator is arranged between the shielding element and the long stroke part orbetween the shielding element and the base support.
2. The stage system of clause 1, wherein a position related quantity of the shield elementis controlled in a first direction, and the shield element substantially extends over, in aprojection in the first direction overlapping surfaces of the short stroke part and the long stroke part.
3. The stage system of clause 1, wherein the sensor is arranged on the short stroke part.
4. The stage system of clause 1, wherein the position related quantity is a position, speedor acceleration of the shielding element with respect to the short stroke part.
5. The stage system of clause 1, wherein the shielding element is mounted on the longstroke part with one or more kinematic couplings to stabilize the shielding element inmain directions of movement of the stage system, and wherein the position controlsystem is configured to maintain a constant distance between the short stroke part andthe long stroke part in a direction substantially perpendicular to the main directions ofmovement.
6. The stage system of clause 1, wherein the position control system comprises one ormore sensors to determine a position related quantity of the shielding element withrespect to the short stroke part in three perpendicular directions and at least three actuators to actuate the shielding element on the basis of the sensor signal in the threedirections to maintain a substantially constant position of the shielding element withrespect to the short stroke part.
7. The stage system of clause 1, wherein the shielding element is a plate-shaped element.
8. The stage system of clause 1, wherein the shielding element substantially encloses thelong stroke part at at least a side of the long stroke part faced towards the short strokepart.
9. The stage system of clause 1, wherein the shielding element substantially encloses theshort stroke part at at least a side of the short stroke part faced towards the short strokepart.
10. The stage system of clause 1, wherein the position control system is configured tocontrol a shape of the shielding element.
11. The stage system of clause 10, wherein the position control system comprises multiplesensors to determine a shape of the shielding element, and multiple actuators mountedat multiple locations to the shielding element to control the shape of the shieldingelement.
12. The stage system of clause 1, wherein the shielding element comprises an active orpassive cooling system and/or heat absorbing or reflecting materials, and/orelectromagnetic absorbing or reflecting materials and/or electric field absorbing orreflecting materials.
f3. The stage system of clause 1, wherein the shielding element support a cable bundleholder to hold a cable bundle running between the long stroke part and the short strokepart.
14. A lithographic apparatus comprising: an illumination system configured to condition a radiation beam;a support constructed to support a patterning device, the patterning device beingcapable of imparting the radiation beam with a pattern in its cross-section to form apatterned radiation beam; a substrate support constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto atarget portion of the substrate, wherein the lithographic apparatus comprises the movable stage system ofclause 1, and wherein the stage system is the patterning device support or the substratesupport.
15. A lithographic apparatus comprising: an illumination system configured to condition a radiation beam;a support constructed to support a patterning device, the patterning device beingcapable of imparting the radiation beam with a pattern in its cross-section to form apatterned radiation beam; a substrate support constructed to hold a substrate; a projection system configured to project the patterned radiation beam onto atarget portion of the substrate,a first object,a second object, a shield element arranged between the first object and the second object, andconfigured to shield the second object for pressure variations in a space between thefirst object and the second object, which pressure variations are caused by movementsand/or deformations of the first object, and a position control system to control a position related quantity of the shieldingelement, wherein said position control system is configured to maintain a substantiallyconstant distance between the shielding element and the second object, wherein theposition control system comprises a sensor to determine a position related quantity ofthe shielding element with respect to the second object, a controller to provide a controlsignal on the basis of the determined position related quantity and at least one actuatorto actuate the shielding element on the basis of the control signal.
权利要求:
Claims (1)
[1]
A lithography device comprising: an illumination device adapted to provide a radiation beam, a support constructed to support a patterning device, which patterning device is capable of applying a pattern in a cross-section of radiation beam to form a patterned radiation beam; to support a substrate; and a projection device adapted to project the patterned radiation beam onto a target area of the substrate, characterized in that the substrate table is adapted to position the target area of the substrate in a focal plane of the projecting device.
类似技术:
公开号 | 公开日 | 专利标题
KR20180018604A|2018-02-21|Lithographic apparatus
US7253875B1|2007-08-07|Lithographic apparatus and device manufacturing method
US7903866B2|2011-03-08|Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object
TWI418923B|2013-12-11|Positioning system, lithographic apparatus and method
KR101321781B1|2013-10-28|Position control system, lithographic apparatus, and method to control a position of a movable object
US20210223703A1|2021-07-22|Lithographic apparatus
NL2010193A|2013-08-06|A stage system and a lithographic apparatus.
CN104081283A|2014-10-01|Lithographic apparatus with a metrology system for measuring a position of a substrate table
NL2010185A|2013-08-01|Lithographic apparatus and device manufacturing method.
KR20110139651A|2011-12-29|Lithographic apparatus
TW201812475A|2018-04-01|Lithographic apparatus, lithographic projection apparatus and device manufacturing method
US8982359B2|2015-03-17|System for detecting motion, lithographic apparatus and device manufacturing method
US20160004172A1|2016-01-07|Lithographic apparatus and device manufacturing method
NL2016688A|2017-01-17|Movable support and lithographic apparatus
CN108351602A|2018-07-31|Vibration isolation system and lithographic equipment
NL2016836A|2017-01-17|Position measurement system and lithographic apparatus
JP2013222962A|2013-10-28|Lithography device and method of compensating for intrinsic mode coupling
NL2022091A|2019-07-10|Positioning device, lithographic apparatus, method for compensating a balance mass torque and device manufacturing method
同族专利:
公开号 | 公开日
JP2015507369A|2015-03-05|
US20140375975A1|2014-12-25|
US9726985B2|2017-08-08|
JP5919395B2|2016-05-18|
WO2013113632A2|2013-08-08|
WO2013113632A3|2013-12-27|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题

EP0557100B1|1992-02-21|1999-01-13|Canon Kabushiki Kaisha|Stage driving system|
JPH10521A|1996-06-07|1998-01-06|Nikon Corp|Support device|
JPH10294272A|1997-04-18|1998-11-04|Nikon Corp|Aligner and exposure method|
WO1999010970A1|1997-08-21|1999-03-04|Nikon Corporation|Positioning device, driving unit, and aligner equipped with the device|
SG131766A1|2002-11-18|2007-05-28|Asml Netherlands Bv|Lithographic apparatus and device manufacturing method|
EP1524556A1|2003-10-17|2005-04-20|ASML Netherlands B.V.|Lithographic apparatus, device manufacturing method and positioning system|
WO2006007167A2|2004-06-17|2006-01-19|Nikon Corporation|Magnetic levitation lithography apparatus and method|
US20060061218A1|2004-09-21|2006-03-23|Nikon Corporation|Dual force wafer table|
US7462958B2|2004-09-21|2008-12-09|Nikon Corporation|Z actuator with anti-gravity|
US7283201B2|2005-10-25|2007-10-16|Nikon Corporation|Devices and methods for sensing secure attachment of an object onto a chuck|
US7492441B2|2005-12-22|2009-02-17|Asml Netherlands B.V.|Lithographic apparatus and device manufacturing method incorporating a pressure shield|
US7649613B2|2006-03-03|2010-01-19|Asml Netherlands B.V.|Lithographic apparatus, method of controlling a component of a lithographic apparatus and device manufacturing method|
US20070236854A1|2006-04-11|2007-10-11|Lee Martin E|Anti-Gravity Device for Supporting Weight and Reducing Transmissibility|
US7880864B2|2006-12-27|2011-02-01|Canon Kabusiki Kaisha|Stage apparatus, exposure apparatus, and device manufacturing method|
US7969550B2|2007-04-19|2011-06-28|Asml Netherlands B.V.|Lithographic apparatus and device manufacturing method|
NL2002902A1|2008-06-18|2009-12-22|Asml Netherlands Bv|Lithographic apparatus having a feed forward pressure pulse compensation for the metrology frame.|
JP2010067950A|2008-09-12|2010-03-25|Nikon Corp|Stage device, exposure device, and manufacturing method of device|
EP2189849B1|2008-11-21|2015-12-16|ASML Netherlands B.V.|A lithographic apparatus provided with a swap bridge|
JP2010238984A|2009-03-31|2010-10-21|Nikon Corp|Exposure apparatus, method for adjusting pressure for exposure apparatus and device manufacturing method|
JP2011060823A|2009-09-07|2011-03-24|Nikon Corp|Substrate holding device, exposure apparatus, device manufacturing method, and method for adjusting substrate holding device|
JP5606039B2|2009-10-26|2014-10-15|キヤノン株式会社|Stage device and wavefront aberration measuring device|
US9507277B2|2010-07-30|2016-11-29|Asml Netherlands B.V.|Lithographic apparatus and device manufacturing method|
US8988655B2|2010-09-07|2015-03-24|Nikon Corporation|Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method|
NL2008178A|2011-02-25|2012-08-28|Asml Netherlands Bv|LITHOGRAPHIC APPARATUS AND STAGE SYSTEM.|
EP2754173A4|2011-09-06|2015-01-28|Kla Tencor Corp|Linear stage for reflective electron beam lithography|
JP2015023768A|2013-07-23|2015-02-02|キヤノン株式会社|Stage device, lithography device, and article manufacturing method|JP6958356B2|2015-09-30|2021-11-02|株式会社ニコン|Exposure equipment, flat panel display manufacturing methods, device manufacturing methods, and exposure methods|
WO2017089214A1|2015-11-23|2017-06-01|Asml Netherlands B.V.|Positioning device, lithographic apparatus and device manufacturing method|
US10192773B2|2016-06-20|2019-01-29|Nexperia B.V.|Semiconductor device positioning system and method for semiconductor device positioning|
NL2021561A|2017-10-17|2019-04-23|Asml Netherlands Bv|Motor, dual stroke stage and lithographic apparatus|
法律状态:
2014-04-02| WDAP| Patent application withdrawn|Effective date: 20140121 |
优先权:
申请号 | 申请日 | 专利标题
US201261594443P| true| 2012-02-03|2012-02-03|
US201261594443|2012-02-03|
[返回顶部]