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    公开号:NL2010103A
    申请号:NL2010103
    申请日:2013-01-10
    公开日:2013-07-18
    发明作者:Erik Loopstra；Sjoerd Donders；Koen Zaal；Theodorus Cadee
    申请人:Asml Netherlands Bv；
    IPC主号:
    专利说明:

    A METHOD OF LOADING A FLEXIBLE SUBSTRATE, A DEVICE MANUFACTURING METHOD, AN APPARATUS FOR LOADING A FLEXIBLE SUBSTRATE, AND A LITHOGRAPHY APPARATUS
    Field
    [0001] The present invention relates to a method of loading a flexible substrate, a device manufacturing method, an apparatus for loading a flexible substrate, and a lithography or exposure apparatus.
    Background
    [0002] A lithographic or exposure apparatus is a machine that applies a desired pattern onto a substrate or part of a substrate. The apparatus may be used, for example, in the manufacture of integrated circuits (ICs), flat panel displays and other devices or structures having fine features. In a conventional lithographic or exposure apparatus, a patterning device, which may be referred to as a mask or a reticle, may be used to generate a circuit pattern corresponding to an individual layer of the IC, flat panel display, or other device). This pattern may transferred on (part of) the substrate (e.g. silicon wafer or a glass plate), e.g. via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. In a similar regard, an exposure apparatus is a machine that use a radiation beam in forming a desired pattern on or in a substrate (or a part thereof).
    [0003] Instead of a circuit pattern, the patterning device may be used to generate other patterns, for example a color filter pattern, or a matrix of dots. Instead of a conventional mask, the patterning device may comprise a patterning array that comprises an array of individually controllable elements that generate the circuit or other applicable pattern. An advantage of such a “maskless” system compared to a conventional mask-based system is that the pattern can be provided and/or changed more quickly and for less cost.
    [0004] Thus, a maskless system includes a programmable patterning device (e.g., a spatial light modulator, a contrast device, etc.). The programmable patterning device is programmed (e.g., electronically or optically) to form the desired patterned beam using the array of individually controllable elements. Types of programmable patterning devices include micro-mirror arrays, liquid crystal display (LCD) arrays, grating light valve arrays, arrays of self-emissive contrast devices, a shutter element/matrix and the like. A programmable patterning device could also be formed from an electro-optical deflector, configured for example to move spots of radiation projected onto the substrate or to intermittently direct a radiation beam away from the substrate, for example to a radiation beam absorber. In either such arrangement, the radiation beam may be continuous.
    Summary
    [0005] A substrate made from flexible material (e.g. plastic) is suitable for certain applications and/or often cheaper than an equivalent rigid substrate (e.g. glass). For example, a polyamide or polycarbonate substrate may be used. A method developed for loading a rigid substrate may cause an undesirable load (stress) within a flexible substrate. Such a stress may cause the substrate to be loaded in a deformed state. For example, the substrate may be deformed within the plane of the substrate. Deformation may cause distortion and/or overlay errors.
    [0006] It is desirable, for example, to provide an apparatus and method that enables a flexible substrate to be loaded reliably and without causing excessive distortion or overlay error.
    [0007] According to an embodiment, there is provided a method of loading a flexible substrate onto a support for use in an exposure apparatus, comprising: transferring the substrate progressively from a substrate carrier to the support in a way that a boundary line separating a region of the substrate that is loaded onto the support and a region of the substrate that is not yet loaded onto the support remains substantially straight during the loading process.
    [0008] According to an embodiment, there is provided an apparatus to load a flexible substrate, comprising: a support to hold the substrate during irradiation of the substrate by an exposure apparatus; and a substrate carrier, wherein the apparatus is configured to transfer a substrate mounted on the carrier to the support in a way that a boundary line separating a region of the substrate that is loaded onto the support and a region of the substrate that is not yet loaded onto the support remains substantially straight during the loading process.
    Brief Description of the Drawings
    [0009] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:
    [0010] Figure 1 depicts a part of a lithographic apparatus according to an embodiment of the invention; Γ0011] Figure 2 depicts a top view of a part of the lithographic apparatus of Figure 1 according to an embodiment of the invention;
    [0012] Figure 3 depicts a highly schematic, perspective view of a part of a lithographic apparatus according to an embodiment of the invention;
    [0013] Figure 4 depicts a schematic top view of projections by the lithographic apparatus according to Figure 3 onto a substrate according to an embodiment of the invention;
    [0014] Figure 5 depicts in cross-section, a part of an embodiment of the invention;
    [0015] Figure 6 depicts elements of an apparatus to load a flexible substrate, including a substrate carrier having a pair of opposed gas bearings and a transfer element having one or more gas bearing outlets;
    [0016] Figure 7 depicts elements of an apparatus to loading a flexible substrate, including a substrate carrier having a pair of opposed gas bearings and a transfer element having one or more gas bearing outlets;
    [0017] Figure 8 depicts an arrangement of the type shown in Figure 6, except with two of the transfer elements, the substrate being configured to pass in between them;
    [0018] Figure 9 depicts an arrangement of the type shown in Figure 8, except that the substrate carrier holds the substrate against gravity using a vacuum clamp;
    [0019] Figure 10 depicts an arrangement of the type shown in Figure 8, except that the transfer elements are provided at different heights above the support surface to vary the profile of the substrate between the carrier and the support;
    [0020] Figure 11 depicts an arrangement of the type shown in Figure 10, except that the two transfer elements are of the type shown in Figure 7 rather than the type shown in Figure 6;
    [0021] Figure 12 depicts a method of rolling the substrate freely onto the support;
    [0022] Figure 13 depicts an arrangement in which vacuum clamp inlets on a carrier are progressively switched off in order to allow the substrate to fall progressively onto the support;
    [0023] Figure 14 depicts an arrangement in which the substrate is held initially by a gas bearing above the surface of the support and allowed to drop progressively onto the support by progressively switching off the gas bearing and/or activating vacuum clamp inlets on the support;
    [0024] Figure 15 depicts an arrangement in which support members are driven around a continuous path using a conveyor system, with the substrate being provided in planar form; Γ0025] Figure 16 depicts an arrangement in which support members are unwound from a spindle, with the substrate being provided in planar form; and
    [0026] Figure 17 depicts the arrangement of Figure 15 or Figure 16, when viewed along the direction of movement of the substrate, showing a support member rail having an arrangement to implement vacuum clamping within the support members moving over the support member rail.
    Detailed Description
    [0027] An embodiment of the present invention relates to an apparatus that may include a programmable patterning device that may, for example, be comprised of an array or arrays of self-emissive contrast devices. Further information regarding such an apparatus may be found in PCT patent application publication no. WO 2010/032224 A2, U.S. patent application publication no. US 2011-0188016, U.S. patent application no. US 61/473636 and U.S. patent application no. 61/524190 which are hereby incorporated by reference in their entireties. An embodiment of the present invention, however, may be used with any form of programmable patterning device including, for example, those discussed above.
    [0028] Figure 1 schematically depicts a schematic cross-sectional side view of a part of a lithographic or exposure apparatus. In this embodiment, the apparatus has individually controllable elements substantially stationary in the X-Y plane as discussed further below although it need not be the case. The apparatus 1 comprises a substrate table 2 to hold a substrate, and a positioning device 3 to move the substrate table 2 in up to 6 degrees of freedom. The substrate may be a resist-coated substrate. In an embodiment, the substrate is a wafer. In an embodiment, the substrate is a polygonal (e.g. rectangular) substrate. In an embodiment, the substrate is a glass plate. In an embodiment, the substrate is a plastic substrate. In an embodiment, the substrate is a foil. In an embodiment, the apparatus is suitable for roll-to-roll manufacturing.
    [0029] The apparatus 1 further comprises a plurality of individually controllable self-emissive contrast devices 4 configured to emit a plurality of beams. In an embodiment, the self-emissive contrast device 4 is a radiation emitting diode, such as a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode (e.g., a solid state laser diode). In an embodiment, each of the individually controllable elements 4 is a blue-violet laser diode (e.g., Sanyo model no. DL-3146-151). Such diodes may be supplied by companies such as Sanyo, Nichia, Osram, and Nitride. In an embodiment, the diode emits UV radiation, e.g., having a wavelength of about 365 nm or about 405 nm. In an embodiment, the diode can provide an output power selected from the range of 0.5 - 200 mW. In an embodiment, the size of laser diode (naked die) is selected from the range of 100 - 800 micrometers. In an embodiment, the laser >·) diode has an emission area selected from the range of 0.5 - 5 micrometers”. In an embodiment, the laser diode has a divergence angle selected from the range of 5 - 44 degrees. In an embodiment, the diodes have a configuration (e.g., emission area, divergence angle, output power, etc.) to provide a total brightness more than or equal to about 6.4 x 10 W/(m .sr).
    [0030] The self-emissive contrast devices 4 are arranged on a frame 5 and may extend along the Y-direction and/or the X direction. While one frame 5 is shown, the apparatus may have a plurality of frames 5 as shown in Figure 2. Further arranged on the frame 5 is lens 12. Frame 5 and thus self-emissive contrast device 4 and lens 12 are substantially stationary in the X-Y plane. Frame 5, self-emissive contrast device 4 and lens 12 may be moved in the Z-direction by actuator 7. Alternatively or additionally, lens 12 may be moved in the Z-direction by an actuator related to this particular lens. Optionally, each lens 12 may be provided with an actuator.
    [0031] The self-emissive contrast device 4 may be configured to emit a beam and the projection system 12, 14 and 18 may be configured to project the beam onto a target portion of the substrate. The self-emissive contrast device 4 and the projection system form an optical column. The apparatus 1 may comprise an actuator (e.g. motor) 11 to move the optical column or a part thereof with respect to the substrate. Frame 8 with arranged thereon field lens 14 and imaging lens 18 may be rotatable with the actuator. A combination of field lens 14 and imaging lens 18 forms movable optics 9. In use, the frame 8 rotates about its own axis 10, for example, in the directions shown by the arrows in FIG. 2. The frame 8 is rotated about the axis 10 using an actuator (e.g. motor) 11. Further, the frame 8 may be moved in a Z direction by motor 7 so that the movable optics 9 may be displaced relative to the substrate table 2.
    [0032] An aperture structure 13 having an aperture therein may be located above lens 12 between the lens 12 and the self-emissive contrast device 4. The aperture structure 13 can limit diffraction effects of the lens 12, the associated self-emissive contrast device 4, and/or of an adjacent lens 12 / self-emissive contrast device 4.
    [0033] The depicted apparatus may be used by rotating the frame 8 and simultaneously moving the substrate on the substrate table 2 underneath the optical column. The self-emissive contrast device 4 can emit a beam through the lenses 12, 14, and 18 when the lenses are substantially aligned with each other. By moving the lenses 14 and 18, the image of the beam on the substrate is scanned over a portion of the substrate. By simultaneously moving the substrate on the substrate table 2 underneath the optical column, the portion of the substrate which is subjected to an image of the self-emissive contrast device 4 is also moving. By switching the self-emissive contrast device 4 “on” and “off’ (e.g., having no output or output below a threshold when it is “off’ and having an output above a threshold when it is “on”) at high speed under control of a controller, controlling the rotation of the optical column or part thereof, controlling the intensity of the self-emissive contrast device 4, and controlling the speed of the substrate, a desired pattern can be imaged in the resist layer on the substrate.
    [0034] Figure 2 depicts a schematic top view of the apparatus of Figure 1 having self-emissive contrast devices 4. Like the apparatus 1 shown in Figure 1, the apparatus 1 comprises a substrate table 2 to hold a substrate 17, a positioning device 3 to move the substrate table 2 in up to 6 degrees of freedom, an alignment/level sensor 19 to determine alignment between the self-emissive contrast device 4 and the substrate 17, and to determine whether the substrate 17 is at level with respect to the projection of the self-emissive contrast device 4. As depicted the substrate 17 has a rectangular shape, however also or alternatively round substrates may be processed.
    [0035] The self-emissive contrast device 4 is arranged on a frame 15. The self-emissive contrast device 4 may be a radiation emitting diode, e.g., a laser diode, for instance a blue-violet laser diode. As shown in Figure 2, the self-emissive contrast devices 4 may be arranged into an array 21 extending in the X-Y plane.
    [0036] The array 21 may be an elongate line. In an embodiment, the array 21 may be a single dimensional array of self-emissive contrast devices 4. In an embodiment, the array 21 may be a two dimensional array of self-emissive contrast device 4.
    [0037] A rotating frame 8 may be provided which may be rotating in a direction depicted by the arrow. The rotating frame may be provided with lenses 14, 18 (show in Figure 1) to provide an image of each of the self-emissive contrast devices 4. The apparatus may be provided with an actuator to rotate the optical column comprising the frame 8 and the lenses 14, 18 with respect to the substrate.
    [0038] Figure 3 depicts a highly schematic, perspective view of the rotating frame 8 provided with lenses 14, 18 at its perimeter. A plurality of beams, in this example 10 beams, are incident onto one of the lenses and projected onto a target portion of the substrate 17 held by the substrate table 2. In an embodiment, the plurality of beams are arranged in a straight line. The rotatable frame is rotatable about axis 10 by means of an actuator (not shown). As a result of the rotation of the rotatable frame 8, the beams will be incident on successive lenses 14, 18 (field lens 14 and imaging lens 18) and will, incident on each successive lens, be deflected thereby so as to travel along a part of the surface of the substrate 17, as will be explained in more detail with reference to Fig. 4. In an embodiment, each beam is generated by a respective source, i.e. a self-emissive contrast device, e.g. a laser diode (not shown in Figure 3). In the arrangement depicted in Figure 3, the beams are deflected and brought together by a segmented mirror 30 in order to reduce a distance between the beams, to thereby enable a larger number of beams to be projected through the same lens and to achieve resolution requirements to be discussed below.
    [0039] As the rotatable frame rotates, the beams are incident on successive lenses and, each time a lens is irradiated by the beams, the places where the beam is incident on a surface of the lens, moves. Since the beams are projected on the substrate differently (with e.g. a different deflection) depending on the place of incidence of the beams on the lens, the beams (when reaching the substrate) will make a scanning movement with each passage of a following lens. This principle is further explained with reference to Figure 4. Figure 4 depicts a highly schematic top view of a part of the rotatable frame 8. A first set of beams is denoted by Bl, a second set of beams is denoted by B2 and a third set of beams is denoted by B3. Each set of beams is projected through a respective lens set 14, 18 of the rotatable frame 8. As the rotatable frame 8 rotates, the beams B1 are projected onto the substrate 17 in a scanning movement, thereby scanning area A14. Similarly, beams B2 scan area A24 and beams B3 scan area A34. At the same time of the rotation of the rotatable frame 8 by a corresponding actuator, the substrate 17 and substrate table are moved in the direction D, which may be along the X axis as depicted in Figure 2), thereby being substantially perpendicular to the scanning direction of the beams in the area’s A14, A24, A34. As a result of the movement in direction D by a second actuator (e.g. a movement of the substrate table by a corresponding substrate table motor), successive scans of the beams when being projected by successive lenses of the rotatable frame 8, are projected so as to substantially abut each other, resulting in substantially abutting areas A11,A12, A13,A14 (areas A11, A12, A13 being previously scanned and A14 being currently scanned as shown in Figure 4) for each successive scan of beams Bl, areas A21, A22, A23 and A24 (areas A21, A22, A23 being previously scanned and A24 being currently scanned as shown in Figure 4) for beams B2 and areas A31, A32, A33 and A34 (areas A31, A32, A33 being previously scanned and A34 being currently scanned as shown in Figure 4) for beams B3. Thereby, the areas Al, A2 and A3 of the substrate surface may be covered with a movement of the substrate in the direction D while rotating the rotatable frame 8. The projecting of multiple beams through a same lens allows processing of a whole substrate in a shorter timeframe (at a same rotating speed of the rotatable frame 8), since for each passing of a lens, a plurality of beams scan the substrate with each lens, thereby allowing increased displacement in the direction D for successive scans. Viewed differently, for a given processing time, the rotating speed of the rotatable frame may be reduced when multiple beams are projected onto the substrate via a same lens, thereby possibly reducing effects such as deformation of the rotatable frame, wear, vibrations, turbulence, etc. due to high rotating speed. In an embodiment, the plurality of beams are arranged at an angle to the tangent of the rotation of the lenses 14, 18 as shown in Figure 4. In an embodiment, the plurality of beams are arranged such that each beam overlaps or abuts a scanning path of an adjacent beam.
    [0040] A further effect of the aspect that multiple beams are projected at a time by the same lens, may be found in relaxation of tolerances. Due to tolerances of the lenses (positioning, optical projection, etc), positions of successive areas All, A12, A13, A14 (and/or of areas A21, A22, A23 and A24 and/or of areas A31, A32, A33 and A34) may show some degree of positioning inaccuracy in respect of each other. Therefore, some degree of overlap between successive areas All, A12, A13, A14 may be required. In case of for example 10% of one beam as overlap, a processing speed would thereby be reduced by a same factor of 10% in case of a single beam at a time through a same lens. In a situation where there are 5 or more beams projected through a same lens at a time, the same overlap of 10% (similarly referring to one beam example above) would be provided for every 5 or more projected lines, hence reducing a total overlap by a factor of approximately 5 or more to 2% or less, thereby having a significantly lower effect on overall processing speed. Similarly, projecting at least 10 beams may reduce a total overlap by approximately a factor of 10. Thus, effects of tolerances on processing time of a substrate may be reduced by the feature that multiple beams are projected at a time by the same lens. In addition or alternatively, more overlap (hence a larger tolerance band) may be allowed, as the effects thereof on processing are low given that multiple beams are projected at a time by the same lens. Γ00411 Alternatively or in addition to projecting multiple beams via a same lens at a time, interlacing techniques could be used, which however may require a comparably more stringent matching between the lenses. Thus, the at least two beams projected onto the substrate at a time via the same one of the lenses have a mutual spacing, and the apparatus may be arranged to operate the second actuator so as to move the substrate with respect to the optical column to have a following projection of the beam to be projected in the spacing.
    [0042] In order to reduce a distance between successive beams in a group in the direction D (thereby e.g. achieving a higher resolution in the direction D), the beams may be arranged diagonally in respect of each other, in respect of the direction D. The spacing may be further reduced by providing a segmented mirror 30 in the optical path, each segment to reflect a respective one of the beams, the segments being arranged so as to reduce a spacing between the beams as reflected by the mirrors in respect of a spacing between the beams as incident on the mirrors. Such effect may also be achieved by a plurality of optical fibers, each of the beams being incident on a respective one of the fibers, the fibers being arranged so as to reduce along an optical path a spacing between the beams downstream of the optical fibers in respect of a spacing between the beams upstream of the optical fibers.
    [0043] Further, such effect may be achieved using an integrated optical waveguide circuit having a plurality of inputs, each for receiving a respective one of the beams. The integrated optical waveguide circuit is arranged so as to reduce along an optical path a spacing between the beams downstream of the integrated optical waveguide circuit in respect of a spacing between the beams upstream of the integrated optical waveguide circuit.
    [0044] A system may be provided for controlling the focus of an image projected onto a substrate. The arrangement may be provided to adjust the focus of the image projected by part or all of an optical column in an arrangement as discussed above.
    [0045] In an embodiment the projection system projects the at least one radiation beam onto a substrate formed from a layer of material above the substrate 17 on which a device is to be formed so as to cause local deposition of droplets of the material (e.g. metal) by a laser induced material transfer.
    [0046] Referring to FIG. 5, the physical mechanism of laser induced material transfer is depicted. In an embodiment, a radiation beam 200 is focused through a substantially transparent material 202 (e.g., glass) at an intensity below the plasma breakdown of the material 202.
    Surface heat absorption occurs on a substrate formed from a donor material layer 204 (e.g., a metal film) overlying the material 202. The heat absorption causes melting of the donor material 204. Further, the heating causes an induced pressure gradient in a forward direction leading to forward acceleration of a donor material droplet 206 from the donor material layer 204 and thus from the donor structure (e.g., plate) 208. Thus, the donor material droplet 206 is released from the donor material layer 204 and is moved (with or without the aid of gravity) toward and onto the substrate 17 on which a device is to be formed. By pointing the beam 200 on the appropriate position on the donor plate 208, a donor material pattern can be deposited on the substrate 17. In an embodiment, the beam is focused on the donor material layer 204.
    [0047] In an embodiment, one or more short pulses are used to cause the transfer of the donor material. In an embodiment, the pulses may be a few picoseconds or femto-seconds long to obtain quasi one dimensional forward heat and mass transfer of molten material. Such short pulses facilitate little to no lateral heat flow in the material layer 204 and thus little or no thermal load on the donor structure 208. The short pulses enable rapid melting and forward acceleration of the material (e.g., vaporized material, such as metal, would lose its forward directionality leading to a splattering deposition). The short pulses enable heating of the material to just above the heating temperature but below the vaporization temperature. For example, for aluminum, a temperature of about 900 to 1000 degrees Celsius is desirable.
    [0048] In an embodiment, through the use of a laser pulse, an amount of material (e.g., metal) is transferred from the donor structure 208 to the substrate 17 in the form of 100-1000 nm droplets. In an embodiment, the donor material comprises or consists essentially of a metal. In an embodiment, the metal is aluminum. In an embodiment, the material layer 204 is in the form a film. In an embodiment, the film is attached to another body or layer. As discussed above, the body or layer may be a glass.
    [0049] As introduced above, stress imparted to a flexible substrate on loading can cause distortion and/or overlay errors.
    [0050] In an embodiment, stress is reduced by transferring the substrate progressively from a substrate carrier to the substrate support. In an embodiment, the transfer is carried out in a way that a boundary line separating a region of the substrate that is loaded onto the support and a region of the substrate that is not yet loaded onto the support remains substantially straight during the loading process. Maintaining a substantially straight boundary line helps ensure that the substrate is loaded in a substantially stress-free state, thus reducing or minimizing distortion and/or overlay error.
    [0051] In an embodiment, the substrate is curved during the loading process. In an embodiment, the curvature is dcscribablc in terms of a radius of curvature or radii of curvature that is/arc defined relative to axes that are substantially parallel to each other and to the boundary line. In an embodiment, all portions of the support surface onto which the substrate will be loaded at the end of the loading process remain substantially co-planar during the loading process. Figures 6-14 depict example embodiments of this type.
    [0052] Figure 6 depicts an arrangement in which a substrate 38 is being loaded onto a support 42 from a substrate carrier 40. The portion of the substrate 38 that has been loaded onto the support 42 is planar (flat). The line 45 along which the substrate 38 starts to curve away from the support 42 is the boundary line 45 separating the region of the substrate 38 that is loaded onto the support 42 and the region of the substrate 38 that is not yet loaded. In the orientation of the embodiment as depicted, the boundary line 45 is substantially perpendicular to the page. In the embodiment shown, the portion of the support surface against which the substrate 38 will be loaded is the upper surface 43. However, this is optional. In another embodiment the portion of the support surface against which the substrate 38 will be loaded may have a different orientation. In an embodiment, all portions of the support surface against which the substrate 38 may come into contact are substantially co-planar.
    [0053] In an embodiment, a transfer element 44 is provided to disengage the substrate 38 from the substrate carrier 40. In an embodiment, the transfer element 44 is configured to move in a direction 46 substantially parallel to the plane of the portions of the support surface 43 onto which the substrate 38 will be loaded and substantially perpendicular to the direction of the boundary line 45. In an embodiment, the transfer element 44 is configured to engage with a portion of the substrate 38 (e.g. to push and/or pull the substrate) during this movement in order to force the substrate away from the substrate carrier 40 and onto the support 42.
    [0054] In the arrangement of Figure 6, the substrate carrier 40 comprises a pair of gas bearings 52 (e.g., air bearings). The gas bearings 52 each comprise one or more gas outlets 48 to guide a flow of gas 50 into a space between the gas bearings 52. The flow of gas is such as to hold the substrate 38 in a contactless manner in the gap between the gas bearings 52. In an embodiment, the gas bearings are configured so that the flow of gas provides a component of force 54 that is opposite to the direction of movement of the substrate 38 out of the gap between the gas bearings. The force 54 provided by the flow of gas thus helps to maintain a tension in the substrate 38 during the transfer process. Maintaining a tension helps to maintain the shape of the substrate 38 during loading and/or prevents buckling or other uncxpcctcd/variablc behavior. In an embodiment, the component of force 54 is provided by tilting one or more of the gas outlets 48 towards the direction of the force 54.
    [0055] In an embodiment, the transfer element 44 comprises a gas bearing member that is configured to direct gas flow 59 against a portion of the substrate 38 that is curved about an axis of curvature lying parallel to the boundary line. Figure 6 depicts an example of such an embodiment. In this example, the gas bearing member is implemented by a housing that has an outer surface 57 conforming in shape to the expected curvature of the substrate 38 in the region of the transfer element 44. One or more gas bearing outlets 58 are provided to direct a flow of gas 59 into the region between the substrate 38 and the outer surface 57 of the housing. In this embodiment, the outer surface 57 is configured so that the distance between the outer surface 57 and the substrate 38 is approximately constant for most of the portion of the substrate 38 against which the transfer element 44 engages in use. This configuration helps the transfer element 44 to establish, for example, efficient gas bearing properties with a minimum of gas flow. In an embodiment, the substrate 38 has a substantially constant radius of curvature for most of the portion of the substrate 38 against which the transfer element 44 engages in use. In such an embodiment, at least the side of the outer surface 57 that faces the substrate 38 may be substantially cylindrical. In the example depicted, the whole of the outer surface 57 is cylindrical. In another embodiment, a different geometry may be adopted. In an embodiment, the outer surface 57 is elongate, with an axis of elongation substantially parallel to the boundary line 45. The gas flow 59 is directed radially outwards in this example, but another geometry is possible.
    [0056] In an embodiment, the transfer element 44 is configured to move away from the portion of the substrate (the leading edge 47 in the embodiment of Figure 6) that is first loaded onto the support 42 during the loading process. Tn this way, a gripping force applied to the substrate 38 by the support 42 (e.g. by a vacuum clamping system) can provide desirable tension in the substrate 38 during loading (in combination with the force component 54 provided by the gas flow in the gas bearings of the substrate carrier for example).
    [0057] In an embodiment, the support 42 comprises a vacuum clamp. In the embodiment of Figure 6, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 60. The gas flow 61 into the inlets 60 maintains a pressure lower than atmospheric pressure (i.c. a partial vacuum) in regions adjacent to the inlets 60 above the support surface 43. When the substrate 38 is brought into position above the inlets 61, the substrate 38 is held against the support surface 43 by the partial vacuum.
    [0058] Figure 7 depicts an embodiment that is the same as the embodiment of Figure 6, except for the configuration of the transfer element 44. In contrast to the transfer element 44 of Figure 6, the transfer element 44 of Figure 7 has an outer surface that is spaced further apart from the substrate 38 and does not necessarily have the same shape as the substrate 38. The flow of gas between the transfer element 44 and the substrate 38 is substantially free (unconstrained) in comparison with the flow of gas in between the substrate 38 and the outer surface 57 of the housing in the transfer element 44 of Figure 6. In an embodiment of this type, the total flow rate of gas may be higher than in the example of Figure 6. In an embodiment, the shape of the substrate 38 is maintained by the structural properties of the substrate 38 only or predominantly (rather than by a combination of the structural properties of the substrate 38 and the supporting properties of the transfer element 44, or by the supporting properties of the transfer element 44 only or predominantly). In such an embodiment, the sole or main function of the transfer element 44 is to provide a force to transfer the substrate 38 from the carrier 40 and load it onto the support 42. In an embodiment, the transfer element 44 comprises a single nozzle to provide the flow of gas 59. In an embodiment, the single nozzle is flared. In an embodiment, a plurality of nozzles are provided to help ensure the desired gas flow.
    [0059] The particular configuration of the transfer element 44 (e.g. the shape of the outer surface 57, the arrangement of outlets/nozzles, the gas flow rates, etc.) will depend on the physical properties of the particular substrate 38 that is being used and the speed at which it needs to be loaded.
    [0060] Tn embodiments of the type shown in Figures 6 and 7, the orientation of the substrate 38 is reversed as it is transferred from the carrier 40 to the support 42. In the orientation depicted, the surface of the substrate 38 that faces upwards in the carrier 40 faces downwards when the substrate 38 is loaded. In an embodiment, the transfer element 44 is configured so that the orientation is not reversed. In an embodiment, the orientation of the substrate in the carrier is not parallel to the orientation of the substrate when loaded.
    [0061] An example of a configuration in which the substrate is not reversed is shown in Figure 8. Here, the transfer element 44 comprises a first gas bearing element 44A and a second gas bearing element 44B. The substrate 38 passes in between the two gas bearing elements. In an embodiment, the first gas bearing member 44A directs gas flow against a portion of the substrate 38 that is curved in a first sense about an axis of curvature lying substantially parallel to the boundary line 45, and the second gas bearing member 44B directs gas flow against a portion of the substrate 38 that is curved in the opposite sense. The pair of gas bearing members thus allows the substrate 38 to be applied to the support in a curved manner without reversing its orientation. In an embodiment, the angle through which the substrate curves while engaged with the first gas bearing member 44A is equal and opposite to the angle through which the substrate curves while engaged with the second gas bearing member 44B (so that the total angle is zero).
    [0062] Figure 9 depicts an example embodiment that is the same as that of Figure 8, except that the substrate carrier 40 uses a vacuum clamp 56 to hold the substrate 38, rather than supporting the substrate 38 between a pair of gas bearings 52. hi the example shown, the vacuum clamp 56 uses a plurality of vacuum clamp inlets 77. In an embodiment, the vacuum clamp inlets 77 operate in an analogous manner to the vacuum clamp inlets 60 described above with reference to Figure 6.
    [0063] In an embodiment, the axes of the gas bearing members 44A,44B are substantially equidistant from the support surface 43. Figures 8 and 9 illustrate embodiments of this type. In an embodiment, the axes of the gas bearing members 44A,44B are not equidistant from the support surface. Figures 10 and 11 depict example embodiments of this type. The embodiment of
    Figure 10 uses gas bearing members 44A,44B that are each of the same type as the transfer element 44 of Figure 6. The embodiment of Figure 11 uses gas bearing members 44A,44B that are each of the same type as the transfer element 44 of Figure 7. In both embodiments, the gas bearing member 44A that is earlier in the path of the substrate 38 (i.e. nearer to the carrier 40 in the configurations shown) is higher than the other gas bearing member 44B. Arranging for the gas bearing members to have different separations from the support surface 43 provides flexibility for controlling the shape of the substrate 38 path from the carrier 40 to the support surface 43. Arranging for the gas bearing member 44A that is earlier in the substrate path to have a greater separation from the support surface 43 facilitates increasing the separation of the carrier 40 from the substrate 42, which may be convenient where space is limited and/or where it is otherwise desirable to minimize the proximity of components to the region of the support surface 43.
    [0064] In any of the embodiments described above with reference to Figures 8 to 11, either one of the gas bearing members 44A, 44B may be implemented using a transfer member 44 of the type shown in Figure 6 or the transfer member 44 of the type shown in Figure 7, in any combination.
    [0065] Figure 12 illustrates a further approach to load the substrate 38 onto the support 42. In an embodiment of this type, the substrate 38 is held by the substrate carrier in a curved state. The curved state represents a state in which the substrate 38 is curved along all or a portion of the length of the substrate. In an embodiment, the curvature of the substrate 38 in the curved state is describable in terms of one or more radii of curvature relative to one or more axes of curvature, each of the axes of curvature being substantially parallel to each other. In an embodiment, the carrier is configured to release the curved substrate 38 onto the support 42 in such a way that the substrate will deform freely 70 into a planar loaded state on the support 42. hr an embodiment, the deformation happens progressively starting from the point of the substrate 38 that first comes into contact with the support 42 and/or is first clamped against the support (where a clamping force is applied by the support). In an embodiment, the only external force acting on the portion of the substrate 38 that is deforming freely is gravity and/or force transmitted from one or more portions of the substrate 38 that are already loaded on the support 42. In an embodiment, the curved state is a rolled state, the curvature of the substrate 38 running through more than 360 degrees. The process of deforming freely in such an embodiment may be described as an unrolling process. During the process of deforming freely and/or unrolling (the loading process), the boundary line 45 separating the region of the substrate 38 that is already loaded onto the support 42 (i.e. the region that is already in the planar state) and the region of the substrate that is not yet loaded onto the support remains substantially straight during the loading process. In an embodiment, the process of deforming freely and/or unrolling is driven by gravity and/or by linear and/or angular momentum imparted to the substrate by the substrate carrier.
    Γ00661 Figure 13 illustrates a further approach to loading the substrate 38 onto the support 42. In an embodiment of this type, the substrate carrier 40 is configured to hold the substrate 38 using a vacuum clamp. In the example shown, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 62. In the example shown the substrate carrier 40 holds the substrate 38 against a planar surface. However, in an embodiment, another surface profile, for example a profile comprising a curved region, is used.
    [0067] In an embodiment, the vacuum clamp of the carrier 40 is controlled so that the vacuum (and therefore the clamping force) is removed progressively during the loading process. In an embodiment, the progressive removal of the clamping results in the surface of the carrier 40 comprising two separate regions: a region 64 where the clamp is active and a region 66 where the clamp is not active (or not sufficiently active to hold the substrate 38 against gravity). The line separating these two regions is located close to the point at which the substrate 38 starts to drop down 70 onto the support 42. In the example shown, the support 42 is also provided with a vacuum clamp. In an embodiment, the support vacuum clamp is implemented using a plurality of vacuum clamp inlets 68. In an embodiment, the vacuum clamp inlets 68 may also be activated progressively. In an embodiment, the progressive activation of the vacuum clamp inlets 68 is coordinated with the progressive deactivation of the vacuum clamp inlets 62. As loading progresses, the region 66 will expand to the right and the region 64 will contract from the left.
    [0068] Figure 14 illustrates a further approach to load the substrate 38 onto the support 42. In an embodiment of this type, the support 42 is provided with a plurality of gas bearing outlets 72.
    The gas bearing outlets 72 are configured to hold the substrate away from the support 42 (i.e. spaced apart from the substrate in a contactless manner). In an embodiment, the substrate 38 can be displaced easily in lateral directions when all of the substrate 38 is held away from the support 42. The support 42 thus acts as a substrate carrier when all of the substrate 38 is held away from the support 42.
    [0069] In the arrangement shown in Figure 14, the right-hand portion of the substrate 38 is held away from the support 42 and the left-hand portion of the substrate 38 is loaded against the support 42. The arrow 70 represents the transition region where the substrate is being transferred onto the support 42. In an embodiment, the apparatus is configured to progressively stop driving the gas bearing outlets 72 (i.e. from left to right) to allow the substrate 38 to drop progressively onto the support 42. In an embodiment, as shown in the example of Figure 14, the support 42 may be further provided with a vacuum clamp to hold the substrate 38 against the support 42. In an embodiment, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 68. In an embodiment, driving of the vacuum clamp inlets 68 is coordinated with the driving of the gas bearing outlets 72 to transfer the substrate 38 progressively onto the support 42. In an embodiment, the vacuum clamp inlets 68 arc turned on while adjacent gas bearing outlets 72 arc switched off. In the configuration shown in Figure 14, for example, in the region 76 where the substrate is loaded (in contact with the support 42) the vacuum clamp inlets 68 are turned on while the gas bearing outlets 72 are turned off. In the region 74 where the substrate is not yet loaded (held apart from the support 42), the vacuum clamp inlets 68 are turned off while the gas bearing outlets 72 are turned on. As loading progresses, the region 76 will expand to the right and the region 74 will contract from the left.
    [0070] In the embodiments discussed above with reference to Figures 6 to 14, the straight boundary line 45 is achieved by bringing a curved substrate into contact with a support surface that is planar. In an embodiment, the straight boundary line 45 is achieved using a support surface that has curvature or a support surface that is dividing into portions (support members) that can be angled relative to each other. In an embodiment, the substrate is maintained substantially entirely planar during the loading process. In an example of such an embodiment, at least one of the portions of the support surface onto which the substrate will be loaded at the end of the loading process is not co-planar with at least one other of the portions of the support surface onto which the substrate will be loaded at the end of the loading process, during at least a portion of the loading process.
    [0071] Figures 15 to 17 illustrate an example embodiment in which the support comprises a plurality of support members 82. The support members 82 are moveable and can be angled relative to each other, for at least a subset of the range of positions through which the support members 82 can be moved. In an embodiment, the apparatus comprises a support member driving system 81. In an embodiment, the support member driving system 81 moves the support members 82 linearly through a range of positions 83 in which the substrate 38 may be brought into contact with the support member 82. In an embodiment, the support member driving system 81 drives the support members 82 along a curved path 85 and/or a path at a non-zero angle to the substrate 38, through a range of positions immediately prior to the support members 82 being brought into contact with the substrate 38. In embodiments of this type, the curved or angled path enables the substrate to be brought into contact with the support surface at a non-zero angle, even when all of the substrate is maintained in a planar state throughout the loading process. A straight boundary line 45 separating a region of the substrate that is loaded onto the support and a region of the substrate that is not yet loaded onto the support is maintained throughout the loading process. Loading the substrate 38 while maintaining all of the substrate in a planar state avoids Poisson bending (i.e. curvature induced bending caused by Poisson’s effect), which could lead to undesirable stress in the substrate.
    [0072] In the example arrangement of Figure 15, the support members 82 are driven around a continuous loop, for example in the manner of a conveyor. Arrows 89 show the opposite directions of motion of support members 82 traveling along the top of the continuous loop relative to the support members 82 traveling along the bottom of the continuous loop. In an embodiment, the support members 82 are connected to each other by a plurality of belts or by a continuous belt following the loop of the conveyor.
    [0073] In the example arrangement of Figure 16, the support members 82 are unwound from a spindle 92. In an embodiment, a second spindle is provided to receive the support members 82.
    [0074] In an embodiment, one or more support member rails 80 support the support members 82. In an embodiment, the support members 82 are configured to slide over the support member rails 80. In an embodiment, a plurality of support member rails 80 are provided, each support member rail 80 being spaced apart from at least one other of the support member rails 82 in the direction substantially perpendicular to the direction of movement of the substrate 38 over the support member rails 80. The plurality of support member rails 80 can thereby provide enhanced support across the width of the substrate 38 (i.e. the dimension substantially perpendicular to the direction of motion 87 of the substrate 38), thus reducing deformation of the substrate 38 in the width direction (due to the weight of the substrate 38 for example).
    [0075] In an embodiment, each of one or more of the support members 82 is configured to apply a vacuum clamping force to the substrate 38 when that support members 82 is in contact with the substrate 38. Such functionality is illustrated in Figure 17, which is an end view of a configuration of the type shown in Figure 15 or Figure 16, looking along the direction 87 (or opposite to the direction 87) of motion of the substrate 38. In an example embodiment of this type, each of the one or more support members 82 is provided with one or more vacuum clamp inlets 86. In an embodiment, vacuum clamp inlets 86 are spaced apart across the width of the substrate 38. In an embodiment, the support members 82 each comprise an internal cavity that is maintained at a pressure lower than atmospheric pressure when the vacuum clamp inlets 86 of that support member 82 are active. In an embodiment, the support member rail 80 is provided with a pumping system to extract gas through one or more pumping openings 90. In an embodiment, the support member 82 comprises an openings 91 on the side opposite to the vacuum clamp inlet 86. When the opening 91 in a support member 82 overlaps with the pumping opening 90 in one or more of the support member rails 80, the support member rail pumping system pumps gas out of the cavity in the support member 82. The reduced pressure in the support member 82 drives the vacuum clamp inlet 86 of that support member 82. If a substrate 38 is adjacent to the driven vacuum clamp inlet 86, the substrate 38 will be attracted to the surface of the support element 82 and clamped thereto. Where no substrate is adjacent to the support member 82 at a time when the vacuum clamp inlet 86 of that support member is driven, gas will leak into the pumping system of the support member rail 80. In an embodiment, such leakage is maintained at an acceptable level, for example by providing a vacuum clamp inlet 86 that has high flow impedance and/or by selecting an appropriate pumping rate for the support member rail pumping system.
    [0076] In an embodiment, the support member rail 80 is configured to supply gas via one or more pumping openings 88. In an embodiment, opening 88 is the same as the pumping opening 90 used to drive the vacuum clamp inlet 86. In an embodiment, the opening 88 is a different opening. In an embodiment, the one or more openings 88 are used to drive a gas bearing outlet in one or more of the support members 82. In an embodiment, one or more of the support members 82 is thereby configured to clamp the substrate for at least a given range of positions of the support member(s), while one or more of the support members is configured to support the substrate without clamping (using a gas bearing) for at least a given range of positions of the support member(s).
    [0077] In an embodiment, a support member driving system 81 drives movement of the support members 82. In an example embodiment of the type shown in the Figure 15, the driving system 81 drives one or more conveyor belt rollers. In an example embodiment of the type shown in Figure 16, the driving system drives rotation of the spindle 92. In an embodiment, the support member driving system 81 provides driving in a first direction (e.g. a first rotation sense) when loading a substrate and provides driving in the opposite direction (e.g. the opposite rotation sense) when unloading a substrate.
    [0078] In an embodiment, the vacuum clamp inlet 86 and/or opening 91 in the support member 82 and/or the pumping opening 90 in the support member rail 80 arc switchablc. In an embodiment, the inlet 86, opening 91 and/or pumping opening 90 may be opened and closed selectively. In an embodiment, the inlet 86, opening 91 and/or pumping opening 90 may be controlled so that the vacuum clamp is only applied by a given support member 82 when the substrate 38 is in contact with that support member 82. In an embodiment, the switching is controlled using a signal from the support member driving system 81. In an embodiment, the signal indicates the state of actuation of the support member driving system 81, e.g. the angle through which a roller or spindle has been turned. The signal can thus be used to indicate the position of the substrate. In an embodiment, a position measuring device (e.g. photodetector) to measure the position of the substrate directly is provided, and the switching is controlled using a signal output from the measuring device.
    [0079] In an embodiment, the gas flow from one or more of the gas bearing outlets discussed above is/are thermally conditioned in order to thermally condition the substrate during the loading process.
    [0080] In an embodiment, one or more of the gas bearings described above comprise(s) both outlets and inlets. In each case, the inlets are provided to extract gas and/or adjust the force applied by, or the stiffness of, the gas bearing. Various configurations can be used as long as the net force is neutral or away from the surface and/or the gas bearing force/stiffness is as desired.
    [0081] In an embodiment, one or more of the vacuum clamps described above comprise(s) both inlets and outlets. In each case, the outlets supply gas and/or adjust the force applied by, or the stiffness of, the vacuum clamp. Various configurations can be used as long as the net force is towards the surface and/or the vacuum clamp force/stiffness is as desired.
    [0082] In accordance with a device manufacturing method, a device, such as a display, integrated circuit or any other item may be manufactured from the substrate on which the pattern has been provided.
    [0083] Although specific reference may be made in this text to the use of a lithographic or exposure apparatus in the manufacture of ICs, it should be understood that the apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion", respectively. The substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.
    [0084] While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. For example, the embodiments of the invention may take the form of a computer program containing one or more sequences of machine-readable instructions describing a method as disclosed above, or a data storage medium (e.g. semiconductor memory, magnetic or optical disk) having such a computer program stored therein. Further, the machine-readable instruction may be embodied in two or more computer programs. The two or more computer programs may be stored on one or more different memories and/or data storage media.
    [0085] The term “lens”, where the context allows, may refer to any one of various types of optical components, including refractive, diffractive, reflective, magnetic, electromagnetic and electrostatic optical components or combinations thereof.
    [0086] The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the clauses set out below. Other aspects of the invention are set out as in the following numbered clauses: 1. A method of loading a flexible substrate onto a support for use in an exposure apparatus, comprising: transferring the substrate progressively from a substrate carrier to the support in a way that a boundary line separating a region of the substrate that is loaded onto the support and a region of the substrate that is not yet loaded onto the support remains substantially straight during the loading process.
    2. The method according to clause 1, wherein at least a portion of the substrate is curved during the loading process and all portions of the support surface onto which the substrate will be loaded at the end of the loading process remain substantially co-planar during the loading process.
    3. The method according to clause 1, wherein all of the substrate is planar during the loading process and at least one of the portions of the support surface onto which the substrate will be loaded at the end of the loading process is not co-planar with at least one other of the portions of the support surface onto which the substrate will be loaded at the end of the loading process during at least a portion of the loading process.
    4. A device manufacturing method, comprising: loading a flexible substrate onto a support using the method of any of clauses 1-3; and using an exposure apparatus to irradiate the substrate loaded on the support as part of an exposure process.
    5. An apparatus to load a flexible substrate, comprising: a support to hold the substrate during irradiation of the substrate by an exposure apparatus; and a substrate carrier, wherein the apparatus is configured to transfer a substrate mounted on the carrier to the support in a way that a boundary line separating a region of the substrate that is loaded onto the support and a region of the substrate that is not yet loaded onto the support remains substantially straight during the loading process.
    6. The apparatus according to clause 5, configured such that at least a portion of the substrate is curved during the loading process and all portions of the support surface onto which the substrate will be loaded at the end of the loading process remain substantially co-planar during the loading process.
    7. The apparatus according to clause 5 or clause 6, further comprising a transfer element to disengage the substrate from the substrate carrier.
    8. The apparatus according to clause 7, wherein the transfer element is configured to move in a direction substantially parallel to the plane of the portions of the support surface onto which the substrate will be loaded and substantially perpendicular to the direction of the boundary line.
    9. The apparatus according to clause 8, wherein the transfer element is configured to move away from the portion of the substrate that is first loaded onto the support during the loading process.
    10. The apparatus according to clause 8 or clause 9, wherein the movement of the transfer element is such as to pull the substrate from the substrate carrier onto the support.
    11. The apparatus according to any of clauses 7-10, wherein the transfer element comprises a gas bearing member configured to direct gas flow against a portion of the substrate that is curved about an axis of curvature lying substantially parallel to the boundary line.
    12. The apparatus according to any of clauses 7-10, wherein: the transfer element comprises a first gas bearing member and a second gas bearing member; and the apparatus is configured so that the substrate passes in between the first gas bearing member and the second gas bearing member during the loading process.
    13. The apparatus according to clause 12, wherein: the first gas bearing member is configured to direct gas flow against a portion of the substrate that is curved in a first sense about an axis of curvature lying substantially parallel to the boundary line; the second gas bearing member is configured to direct gas flow against a portion of the substrate that is curved in a second sense about an axis of curvature lying substantially parallel to the boundary line; and the first sense is opposite to the second sense.
    14. The apparatus according to clause 12 or clause 13, wherein the first and second gas bearing members are elongate.
    15. The apparatus according to clause 14, wherein the axes of elongation of the first and second gas bearing members are at a substantially same distance from the surface of the substrate onto which the substrate will be loaded at the end of the loading process.
    权利要求:
    Claims (1)
    [1]
    A lithography device comprising: an exposure device adapted to provide a radiation beam; a carrier configured to support a patterning device, which patterning device is capable of applying a pattern in a section of the radiation beam to form a patterned radiation beam; a substrate table constructed to support a substrate; and a projection device adapted to project the patterned radiation beam onto a target area of the substrate, characterized in that the substrate table is adapted to position the target area of the substrate in a focal plane of the projection device.
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    法律状态:
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