Soft Mold for Organic Electroluminescent Device and Method for Fabricating the same

专利摘要:
PURPOSE: A soft mold for an organic electroluminescent device and a manufacturing method thereof are provided to improve the encapsulation adhesive strength by providing the soft mold provided with a concavity on an opposite position of a border of a display area and a non-display area of a substrate provided with a seal pattern. CONSTITUTION: A substrate(110) has a display area(III), a non-display area(IV) around the display area(III), and an encapsulation region(V) on a border of the display area(III) and the non-display area(IV). First and second electrodes are formed on the substrate(110). An organic electroluminescent layer is provided between the first and second electrodes. A soft mold(114) of the organic electroluminescent layer is used in a patterning process of a carrier transmitting layer. An opening unit(112) has volume opposite to the display area(III). A concave pattern(116) forms a separate space between the encapsulation region(V) and the soft mold(114).
公开号:KR20040015505A
申请号:KR1020020047776
申请日:2002-08-13
公开日:2004-02-19
发明作者:배성준；김관수；김진욱
申请人:엘지.필립스 엘시디 주식회사；
IPC主号:

专利说明:

Soft mold for organic electroluminescent device and manufacturing method thereof {Soft Mold for Organic Electroluminescent Device and Method for Fabricating the same}
[11] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to organic electroluminescent devices, and more particularly, to a soft mold used for patterning a carrier transmitting layer for organic electroluminescent devices and a method of manufacturing the same.
[12] In the field of flat panel display (FPD) including the organic light emitting device, a liquid crystal display device (LCD) has been the most noticeable display device until now, but the liquid crystal display device Since the light-receiving device, not the light-emitting device, has technical limitations such as brightness, contrast, viewing angle, and large area, development of a new flat panel display device capable of overcoming these disadvantages is being actively developed.
[13] The organic light emitting display device, which is one of the new flat panel displays, has a better viewing angle, contrast, and the like than a liquid crystal display because it is self-luminous, and is lightweight and thinner because it does not require a backlight. In addition, since it is possible to drive DC low voltage, fast response speed, and all solid, it is strong against external shock, wide use temperature range, and especially inexpensive in terms of manufacturing cost.
[14] In particular, unlike the liquid crystal display device or the plasma display panel (PDP), all of the deposition and encapsulation equipments are manufactured in the organic electroluminescent device manufacturing process. Therefore, the process is very simple.
[15] 1 is a diagram illustrating a band diagram of a general organic electroluminescent device.
[16] As shown, the organic electroluminescent device comprises a hole transporting layer 3, an emission layer 4, and an electron transporting layer between an anode electrode 1 and a cathode electrode 7. (electron transporting layer) 5.
[17] In order to inject holes and electrons more efficiently, a hole injection layer (2) between the anode (1) and the hole transport layer (3), and between the electron transport layer (5) and the cathode (7) Each of the electron injection layer 6 may be further included.
[18] In this case, holes injected from the anode 1 into the light emitting layer 4 through the hole injection layer 2 and the hole transport layer 3, and the electron injection layer 6 and the electron transport layer 5 from the cathode 7 The electrons injected into the light emitting layer 4 form an exciton 8, from which the light corresponding to the energy between the holes and the electrons is emitted.
[19] The anode 1 is selected from a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO) having a high work function, and light is emitted toward the anode 1. On the other hand, the cathode 7 is selected from metals having a low work function and chemically stable.
[20] 2 is a process flowchart showing step by step a manufacturing process of a conventional active matrix organic electroluminescent device.
[21] In st1, forming a plurality of gate wires in a first direction on a display area of a substrate in which a display area where a screen is implemented and a non-display area forming a periphery of the display area are defined, and crossing the gate wires Staggering a plurality of data wires and power supply wires in a second direction; forming a switching thin film transistor at a point where the gate wire and the data wire cross each other; and forming a drain electrode and a power supply wire of the switching thin film transistor. Comprising a step of forming a drive thin film transistor to be connected to complete the array element layer.
[22] In this step, the method may further include forming a gate pad at one end of the gate line, and forming a data pad at one end of the data line.
[23] The gate pad and the data pad are positioned in the non-display area to transfer external circuit signals to the array element layer.
[24] At st2, the barrier rib is formed at a position surrounding the subpixel region boundary on the thin film transistor, and the first electrode, the first carrier transfer layer, the light emitting layer, and the second carrier transfer layer are sequentially formed on the barrier rib. It is formed to be automatically separated by sub-pixel unit by the partition wall. In addition, a second electrode is formed on the entire surface of the substrate covering the second carrier transfer layer.
[25] For example, when the first electrode corresponds to an anode and the second electrode corresponds to a cathode, the first carrier transport layer corresponds to a hole injection layer and a hole transport layer in order, and the second carrier transport layer is an electron transport layer in order. This corresponds to the electron injection layer.
[26] The first and second carrier transport layers and the light emitting layer form an organic light emitting layer, and the organic light emitting layer described above interposed between the first and second electrodes and the first and second electrodes forms an organic light emitting diode device.
[27] at st3, encapsulating the two substrates by forming a seal pattern at an edge portion between the substrate on which the organic light emitting diode element is formed and an encapsulation substrate provided to encapsulate the organic light emitting diode substrate. to be.
[28] The seal pattern is formed at a boundary between the display area and the non-display area of the substrate on which the organic light emitting diode device is formed, and the aforementioned boundary area may be defined as an encapsulation area.
[29] On the other hand, in more detail with respect to the first and second carrier transport layer manufacturing step in the st2, typically, the first and second carrier transport layer is formed on the entire surface of the substrate by a spin coating method using a polymer material, Since a separate etching process is required when the first and second carrier transport layers are formed in the non-display area, a method of selectively patterning the first and second carrier transport layers only in the display area using a soft mold made of PDMS (polydimethylsiloxane) This has been proposed.
[30] The PDMS is mainly used as a mold material because it does not have any defects in removing the mold from the substrate after coating the solution because of excellent adsorption with the substrate and low wettability with respect to the solution to be coated.
[31] 3A to 3D are perspective views showing step-by-step patterning processes of a carrier transport layer for an organic light emitting device using a conventional soft mold.
[32] In FIG. 3A, a frame in which an opening 12 is formed at a position corresponding to the above-described display region I at a predetermined interval on the substrate 10 on which the display region I and the non-display region II are defined. ) Placing the soft mold 14 of the shape, and adsorbing the soft mold 14 on the substrate 10 in the direction of the arrow.
[33] The reason why the opening 12 is formed in the soft mold 14 is that the carrier is selectively contained only in the display area I while blocking the carrier transfer material, which is not shown in the non-display area II, from being coated. This is to form a transport layer.
[34] Although not shown in detail in the drawings, the first electrode for the organic light emitting diode device is formed on the substrate before the soft mold 14 is formed, and in the case of an active matrix type organic light emitting device, an array element layer including a thin film transistor; First electrodes for organic electroluminescent diode elements are formed in sequence.
[35] The non-display area II includes a gate pad, a data pad part, and an encapsulation area.
[36] In FIG. 3B, the coating solution 16 is dropped onto the substrate 10 on which the soft mold 14 is adsorbed.
[37] The coating solution 16 corresponds to a material forming the carrier transport layer for the organic light emitting layer.
[38] Subsequently, in FIG. 3C, the spin coating is performed by rotating the substrate 10 coated with the polymer layer 18 made of the coating solution (16 of FIG. 3B) in a predetermined direction.
[39] This step includes baking the polymer layer 18.
[40] Finally, in FIG. 3D, the carrier transfer layer 20 is completed by removing the soft mold 14 from the substrate 10.
[41] However, the surface of the non-display area II of the substrate 10 that has been substantially adsorbed with the soft mold 14 is hydrophobic due to the adsorption characteristics of the soft mold 14 even after the soft mold 14 is removed. Will be displayed.
[42] That is, according to the conventional soft mold structure, since the hydrophobic treatment is performed to the encapsulation region, there is a problem that the adhesive force between the seal pattern and the encapsulation region of the substrate is inferior.
[43] In order to solve the above problems, an object of the present invention is to provide a mold structure for carrier transfer layer patterning that does not degrade the adhesion between the encapsulation seal pattern and the substrate.
[44] To this end, in the present invention, a soft mold having an opening in the display area and having a recess for preventing adsorption with the substrate at a position corresponding to the display area and the non-display area boundary of the substrate on which the encapsulation seal pattern is formed is formed. To provide.
[45] As an example, the adhesion test of the encapsulated and non-adsorbed substrate regions of the soft mold was carried out using the sealant test results. Adhesion dropped to 10% level.
[46] The sealant used was a UV (ultra violet) curable material commonly used as a sealant material for organic electroluminescent devices.
[1] 1 is a band diagram for a typical organic electroluminescent device.
[2] 2 is a process flowchart showing step by step a manufacturing process of a conventional active matrix organic electroluminescent device.
[3] 3A to 3D are perspective views showing step-by-step patterning processes of a carrier transport layer for an organic electroluminescent device using a conventional soft mold.
[4] 4A to 4D are perspective views showing step-by-step patterning processes of a carrier transport layer for an organic light emitting display device according to the present invention.
[5] 5 is a cross-sectional view of a mold for making a soft mold according to the present invention.
[6] 6 is a cross-sectional view of the soft mold structure manufactured by the mold of FIG.
[7] <Explanation of symbols for main parts of drawing>
[8] 210: soft mold 212: opening
[9] 214: concave pattern D: width of the concave pattern
[10] H: Height of concave pattern L: Width between concave pattern and opening
[47] In order to achieve the above object, in the first aspect of the present invention, a display area, a non-display area forming a periphery of the display area, and an encapsulation area positioned at a boundary between the display area and the non-display area are defined. In an organic light emitting display device having a first electrode and a second electrode formed on a substrate and an organic light emitting layer interposed between the first and second electrodes, the organic light emitting layer is included in the organic light emitting layer, and is a material layer for transferring a carrier A soft mold used for patterning a carrier transfer layer, comprising: an opening having an area corresponding to the display area; In the position surrounding the periphery of the opening, and provided spaced apart from the opening by a predetermined distance, and provides a soft mold for an organic electroluminescent device comprising a concave pattern forming a space between the encapsulation area and the soft mold.
[48] The height H and the width D of the concave pattern and the width L between the concave pattern and the opening satisfy the following relational expression.
[49] L / H = 0.2 to 20
[50] D ≤20H
[51] In addition, the material forming the soft mold is selected from any one of PDMS (polydimethylsiloxane) or silicon rubber (silicon rubber) containing a 10% by weight of the curing agent, the organic electroluminescent layer, the light emitting layer, between the first electrode and the light emitting layer And a second carrier transport layer positioned between the light emitting layer and the second electrode, wherein the first electrode is an anode, the second electrode is a cathode, and the first carrier is transported. The layer has a structure in which a hole injection layer and a hole transport layer are sequentially stacked, and the second carrier transport layer has a structure in which an electron transport layer and an electron injection layer are sequentially stacked, and the hole injection layer, the hole transport layer, and the electron The transport layer and the electron injection layer are each characterized by the soft mold.
[52] According to a second aspect of the present invention, there is provided a method of patterning a carrier transfer layer of an organic light emitting layer for an organic light emitting display device, the display area and a non-display area positioned at a periphery of the display area, and the display area and non-display. Adsorbing a soft mold having an opening at a position corresponding to the display region and having a concave pattern at a position corresponding to the encapsulation region on a substrate on which an encapsulation region positioned at an interface between regions is defined; ; Spin coating a polymer material on a substrate exposed by an opening of the soft mold while the soft mold is adsorbed; Removing the soft mold from the substrate on which the polymer material layer is formed, and patterning the carrier material layer for the organic electroluminescent device having a space between the encapsulation area of the substrate and the soft mold by the concave pattern. to provide.
[53] Before removing the soft mold, the spin coating step may include baking the polymer material, wherein the encapsulation region of the substrate includes: a substrate on which the organic light emitting diode is formed; A seal pattern for adhering the encapsulation substrate is formed.
[54] According to a third aspect of the present invention, there is provided a mold comprising a base substrate portion and a concave-convex pattern portion formed on the base substrate portion; And filling a soft mold material into the uneven pattern portion of the mold, wherein the uneven pattern portion includes a first convex pattern positioned at a central portion thereof, and a second formed at a position covering a peripheral portion spaced apart from the first convex pattern by a predetermined distance. A convex pattern and a third convex pattern formed at a position spaced apart from the second convex pattern by a predetermined distance and covering the outermost part of the mold, wherein the height of the third convex pattern is higher than that of the first and second convex patterns, The height of the second convex pattern is lower than the height of the third convex pattern, the highest height of the soft mold material is lower than the height of the third convex pattern, the organic electroluminescence characterized in that higher than the height of the second convex pattern. Provided is a method of manufacturing a soft mold for an element.
[55] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
[56] 4A to 4D are perspective views showing step-by-step patterning processes of a carrier transport layer for an organic light emitting display device according to the present invention, and show a soft mold structure.
[57] In FIG. 4A, the soft mold 114 having the opening 112 formed at a position corresponding to the above-described display region III is formed on the substrate 110 on which the display region III and the non-display region IV are defined. Disposing the soft mold 114 on the substrate 110 in the direction of the arrow to selectively expose only the display region III of the substrate 110 by the opening 112 and the remaining region of the soft mold. Adsorption to 114 is performed.
[58] In this case, a concave pattern may be formed on an inner surface of the soft mold 114 at a position corresponding to the encapsulation region V defined as a boundary region between the display region III and the non-display region IV of the substrate 110. 116 is formed, and in the step of adsorbing the soft mold 114 to the substrate 110, the encapsulation region V of the substrate 110 substantially positioned to correspond to the concave pattern 116 is formed. It is characterized in that it is not substantially in contact with the soft mold 114.
[59] In the conventional soft mold structure, the encapsulation adhesive strength is degraded as the hydrophobically deformed to the encapsulation region by direct contact between the encapsulation region of the substrate and the soft mold. By forming a recess pattern at a position aligned with the encapsulation area, a poor contact with the seal pattern can be effectively prevented.
[60] The soft constituent material is preferably selected from any one of PDMS (polydimethylsiloxane) mold or silicone rubber containing 10 wt% of a curing agent.
[61] The silicone rubber may be, for example, polyurethane rubber, elastomer, or the like.
[62] 4B illustrates a step of dropping the coating solution 120 into the exposed display area III of the substrate 110 on which the soft mold 114 is adsorbed using the nozzle device 118.
[63] The coating solution 120 corresponds to a polymer material constituting the carrier transport layer for the organic light emitting layer.
[64] The carrier transport layer may correspond to any one of a hole injection layer, a hole transport layer or an electron transport layer, and an electron injection layer formed by a spin coating method, and the material forming the hole transport layer may be PEDOT-PSS (poly (3). , 4-ethylenedioxythiophene) -poly (styrene sulfonic acid)).
[65] In FIG. 4C, the coating solution (120 of FIG. 4B) is applied to the display area III of the substrate 110 and then rotated in a predetermined direction to evenly coat the coating solution (120 of FIG. 4B) on the entire surface of the substrate 110. Through the spin coating step of dispersing, the polymer material layer 122 is formed.
[66] This step may include curing the polymer material layer 122 by baking after the spin coating.
[67] In FIG. 4D, the soft mold 114 is removed from the substrate 110 to complete the patterned carrier transfer layer 124 in the display region III.
[68] 5 is a cross-sectional view of a mold for making a soft mold according to the present invention.
[69] As shown in the drawing, a mold 160 including a base substrate portion 140 and an uneven pattern portion 150 formed on the base substrate portion 140 is provided, and in the uneven pattern portion 150 of the mold 160. Is filled with mold material 170.
[70] In more detail, the uneven pattern 150 formed on the upper surface of the mold 160 has a first convex pattern 162 positioned at the center and both side portions spaced apart from the first convex pattern 162 by a predetermined distance. The second convex pattern 164 formed on each of the second convex pattern 166 formed on the outermost portion of the mold 160, respectively, in particular, the first height (h1) of the first convex pattern 162 is It is higher than the second and third heights h2 and h3 of the second and third convex patterns 164 and 166, and the second height h2 of the second convex pattern 164 is the third of the third convex patterns 166. It is characterized in that it is lower than the height h3.
[71] The maximum height h4 of the mold material 170 is lower than the third height h3 and higher than the second height h2.
[72] Accordingly, the mold material 170 filled in the section between the first convex pattern 162 and the third convex pattern 166 may have the first convex pattern 162 and the first convex pattern 164 interposed therebetween. The convex pattern is integrally formed between the three convex patterns 166 and has a concave pattern corresponding to the height of the second convex pattern 164 at a position corresponding to the second convex pattern 164.
[73] Although not shown in the drawings, the planar structure of the mold 160 has a first convex pattern 162 formed at the center thereof, and is spaced apart from the first convex pattern 162 by a predetermined distance from the periphery of the first convex pattern 162. As a result, the second convex pattern 164 is formed, and the second convex pattern 164 is spaced apart from the second convex pattern 164 by a predetermined distance to form a third convex pattern 166 at a position surrounding the edge of the mold 160.
[74] By filling the mold material 170 with the thickness having the above-described "h4" height condition in the mold 160, an opening is formed at a position corresponding to the first convex pattern 162 and the second convex pattern 164. ), A soft mold having a concave pattern can be produced.
[75] 6 is a cross-sectional view of the soft mold structure manufactured by the mold of FIG. 5.
[76] As illustrated, the soft mold 210 manufactured according to the mold of FIG. 5 described above (160 of FIG. 5) has an opening 212 in the center thereof, and is disposed on both lower surfaces spaced apart from the opening 212 by a predetermined distance. Concave pattern 214 is formed.
[77] At this time, when the height of the concave pattern 214 is "H", the width of the concave pattern 214 is "D", and the width between the concave pattern 214 and the opening 212 is "L", the soft mold ( In order to prevent the deflection phenomenon of the 210 and the bending of the uneven pattern portion ("VI" region on the drawing), it is preferable to produce the following relational expression.
[78] L / H = 0.2 to 20
[79] D ≤20H
[80] However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.
[81] As described above, according to the soft mold for organic electroluminescent device and the manufacturing method thereof according to the present invention, it is possible to improve the encapsulation adhesive strength by supplementing the disadvantages of the patterning method of the carrier transport layer using the conventional soft mold, the adhesive force As it secures, it effectively blocks moisture and air infiltration and can be easily applied to large area substrates, thereby enhancing product competitiveness.

权利要求:
Claims (10)
[1" claim-type="Currently amended] A display region, a non-display region forming a periphery of the display region, first and second electrodes formed on a substrate having an encapsulation region positioned at a boundary between the display region and the non-display region, and the first In the organic electroluminescent device having an organic electroluminescent layer interposed between the two electrodes, the soft mold used in the patterning process of the carrier transport layer, which is a material layer that is included in the organic electroluminescent layer, and delivers a carrier (carrier) in soft mold,
An opening having an area corresponding to the display area;
A concave pattern positioned at a distance from the opening at a position surrounding the periphery of the opening, and forming a spaced space between the encapsulation region and the soft mold
Soft mold for an organic electroluminescent device comprising a.
[2" claim-type="Currently amended] The method of claim 1,
The height H and the width D of the concave pattern, and the width L between the concave pattern and the opening satisfy the following relational expression.
L / H = 0.2 to 20
D ≤20H
[3" claim-type="Currently amended] The method of claim 1,
The soft constituent material of the soft mold is selected from any one of PDMS (polydimethylsiloxane) or silicon rubber (silicon rubber) containing a curing agent 10% by weight.
[4" claim-type="Currently amended] The method of claim 1,
The organic electroluminescent layer is a soft mold for an organic electroluminescent device comprising a light emitting layer, a first carrier transporting layer located between the first electrode and the light emitting layer, and a second carrier transporting layer located between the light emitting layer and the second electrode. .
[5" claim-type="Currently amended] The method of claim 4, wherein
The first electrode is an anode, the second electrode is a cathode, the first carrier transport layer has a structure in which a hole injection layer and a hole transport layer are sequentially stacked, the second carrier transport layer is an electron transport layer, electron The soft mold for organic electroluminescent elements which consists of a structure which the injection layer laminated one by one.
[6" claim-type="Currently amended] The method of claim 5, wherein
And the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer are patterned by the soft mold, respectively.
[7" claim-type="Currently amended] In the method for patterning the carrier transport layer constituting the organic electroluminescent layer for an organic electroluminescent device,
An opening at a position corresponding to the display area on a substrate on which a display area and a non-display area positioned at a periphery of the display area and an encapsulation area located at a boundary between the display area and the non-display area are defined; Adsorbing a soft mold having a concave pattern at a position corresponding to the encapsulation region;
Spin coating a polymer material on a substrate exposed by an opening of the soft mold while the soft mold is adsorbed;
Removing the soft mold from the substrate on which the polymer material layer is formed
And a spaced space between the encapsulation area of the substrate and the soft mold by the concave pattern.
[8" claim-type="Currently amended] The method of claim 7, wherein
Before the removing the soft mold, after the spin coating step, baking the polymer material (baking) comprising the step of patterning a carrier material layer for an organic light emitting device.
[9" claim-type="Currently amended] The method of claim 7, wherein
The patterning method of the carrier material layer for an organic electroluminescent device is formed in the encapsulation region of the substrate, a substrate on which the organic electroluminescent device is formed and a seal pattern for adhering the encapsulation substrate.
[10" claim-type="Currently amended] Providing a mold comprising a base substrate portion and an uneven pattern portion formed on the base substrate portion;
Filling a soft mold material into the uneven pattern portion of the mold;
The convex-concave pattern portion includes a first convex pattern positioned at a central portion, a second convex pattern formed at a position surrounding a peripheral portion spaced apart from the first convex pattern by a predetermined distance, and spaced apart from the second convex pattern by a predetermined interval. And a third convex pattern formed at a position surrounding the outermost part of the mold, wherein the height of the third convex pattern is higher than the height of the first and second convex patterns, and the height of the second convex pattern is the height of the third convex pattern. Lower, the highest height of the soft mold material is lower than the height of the third convex pattern and higher than the height of the second convex pattern.

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同族专利:

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公开号 | 公开日

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KR100450460B1|2004-09-30|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2002-08-13|Application filed by 엘지.필립스 엘시디 주식회사

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2002-08-13|Priority to KR10-2002-0047776A

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2004-02-19|Publication of KR20040015505A

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2004-09-30|Application granted

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2004-09-30|Publication of KR100450460B1

优先权:

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申请号 | 申请日 | 专利标题

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KR10-2002-0047776A|KR100450460B1|2002-08-13|2002-08-13|Soft Mold for Organic Electroluminescent Device and Method for Fabricating the same|