• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: An apparatus for transferring heat with a heat insulating unit is provided to stabilize initial operation of the apparatus. CONSTITUTION: A heat transfer apparatus(40) comprises a lower plate(42) and an upper plate(60). The lower plate includes an evaporation part(44) contacting with a heating element, and allowing liquefied refrigerant absorbing heat transferred from the heating element to be evaporated therein; a condensation part(48) in which gas flowing out of the evaporation part is condensed; a gas channel(46) through which gas flowing out of the evaporation part flows into the condensation part; a liquefied refrigerant channel allowing liquefied refrigerant to flows from the condensation part to the evaporation part therethrough, and having a part contacting with the evaporation part used as a channel area(56); and heat insulating units(52,54) formed at least between the gas channel and the liquefied refrigerant channel to prevent element obstructing supply of liquefied refrigerant from flowing from the gas channel to the liquefied refrigerant channel. The upper plate contacts with some components of the lower plate including the heat insulating units.
    公开号:KR20030034926A
    申请号:KR1020010066748
    申请日:2001-10-29
    公开日:2003-05-09
    发明作者:손상영；최문철；홍영기；조혜정；하병주
    申请人:삼성전자주식회사；
    IPC主号:
    专利说明:

    Heat transferring device having adiabatic means
    [36] The present invention relates to a heat transfer apparatus, and more particularly, to a heat transfer apparatus having heat insulation means.
    [37] With the development of electronic technology, the modularization, miniaturization and high output of electronic equipment are rapidly progressing. Accordingly, heat released per unit area of electronic equipment, that is, heat dissipation rate per unit area, is rapidly increasing. Therefore, controlling the temperature of electronic equipment by appropriately treating the heat emitted from the electronic equipment has become one of the main considerations in the design process of the electronic equipment.
    [38] The temperature of the electronic equipment can be controlled using heat conduction, natural convection / radiation or forced convection of air, liquid cooling, submersion cooling, heat pipes, and the like.
    [39] In addition, the temperature of the electronic equipment may be controlled using a capillary pumped loop flow (CPLF) by surface tension first proposed by the NASA Lewis center's stenger. In particular, Tuckerman and Pease have experimentally demonstrated that the micro-channel cooling method can be used for cooling high-heating electronic devices, and thus, among the components constituting the electronic equipment, By selectively cooling only elements with particularly high calorific value per unit area, the overall temperature of electronic equipment can be controlled.
    [40] FIG. 1 is a schematic configuration diagram of a capillary heat transfer device proposed by the stenger. Referring to this, a pipe 1 having a working fluid traveling path having a predetermined size forms a loop. An evaporator 2 is provided on the working fluid traveling path by the pipe 1. The evaporator 2 is provided with a porous body 22 in a case 21 through which heat is transferred from the outside. The porous body 22 has a fine pore causing a capillary phenomenon, thereby attracting the working fluid 23 by the capillary phenomenon. The working fluid in the pore is evaporated by the heat absorbed from the outside. The steam generated by the phase change of the working fluid is discharged in the direction opposite to the inflow direction of the working fluid 23 and proceeds along the pipe 1. The steam is gradually deprived of heat while proceeding through the pipe 1, and liquefied by sufficiently depriving of heat, and then proceeds to the evaporator 2 side again. In such a structure, since the vapor liquefies along the pipe 1 having a predetermined length, bubbles are generated in the middle of the pipe 1.
    [41] Such a conventional heat transfer device is inevitably large in size, and is inappropriate as a heat transfer device for a small electronic device. In addition, as described above, bubbles scattered on the pipe and non-condensing working fluid between them serve as resistance to the flow of the entire working fluid.
    [42] Therefore, the technical problem to be achieved by the present invention is to solve the conventional problem, to prevent the supply of the liquid refrigerant in the process of cooling the small electronic device, and the supply of the liquid refrigerant is momentarily stopped Edo provides a heat transfer apparatus that automatically supplies the liquid refrigerant to the ashes quickly and constantly supplies the liquid refrigerant to the evaporator to stabilize the initial operation of the apparatus.
    [1] 1 is a schematic plan view of a heat transfer apparatus according to the prior art.
    [2] 2 is a plan view of a glass lid covered heat transfer apparatus according to a first embodiment of the present invention manufactured by MEMS (Micro Electro Mechanical System) technology.
    [3] FIG. 3 is a cross-sectional view of FIG. 2 taken along the 3-3 'direction.
    [4] FIG. 4 is a cross-sectional view of FIG. 2 taken in the 4-4 'direction.
    [5] 5 is a perspective view of a lower plate of the heat transfer apparatus according to the first embodiment of the present invention.
    [6] FIG. 6 is a perspective view of a case in which a pattern provided on a lower plate is replaced with a cylinder in FIG. 5.
    [7] FIG. 7 is a perspective view of a case in which the evaporator pattern is replaced by a cylinder in the lower plate of FIG. 5.
    [8] FIG. 8 is a perspective view of an upper plate paired with a lower plate shown in FIG. 5.
    [9] 9 is a cross-sectional view illustrating a case where bubbles or non-condensable gas are collected in a chamber provided between a liquid refrigerant path pattern and a top plate in the heat transfer apparatus according to the first embodiment of the present invention.
    [10] 10 is a perspective view showing only the heat insulation means separately from the heat transfer apparatus according to the first embodiment of the present invention.
    [11] 11 and 12 are plan views showing modifications of the heat insulation means shown in FIG. 10.
    [12] FIG. 13 is a plan view of a heat transfer apparatus according to a second embodiment of the present invention including the heat insulating means shown in FIG.
    [13] FIG. 14 is a cross-sectional view taken along the 14-14 ′ direction of FIG. 13.
    [14] FIG. 15 is a cross-sectional view of FIG. 13 taken along the 15-15 'direction.
    [15] FIG. 16 is a plan view of a heat transfer apparatus according to a third embodiment of the present invention including the heat insulation means shown in FIG. 12.
    [16] 17 is a plan view of a heat transfer apparatus according to a fourth embodiment of the present invention.
    [17] 18 is a plan view of a heat transfer apparatus according to a fifth embodiment of the present invention.
    [18] 19 is a plan view of a heat transfer apparatus according to a sixth embodiment of the present invention.
    [19] * Description of Signs of Major Parts of Drawings *
    [20] 40, 80, 130, 160, 200: heat transfer device 42, 82, 110, 132, 162, 202: bottom plate
    [21] 60, 102, 134, 164, 204: Top plate 44, 112, 144, 166: Evaporation part
    [22] 46, 86, 114, 140, 168, 208: gas flow paths 48, 88, 110, 142, 170, 210: condensation
    [23] 50, 90, 118, 136, 172, 212: liquid refrigerant flow path
    [24] 52, 90, 120, 138: first heat insulating means 54, 92, 122, 148: second heat insulating means
    [25] 56, 96, 124, 146, 176, 214: Channel area 58: Refrigerant inlet
    [26] 62, 64, 104, 106: Chamber 70: Bubble or non-condensed gas
    [27] 152, 152a, 224, 226, 228, 180, 186, 188: area in contact with the lower plate on the upper plate
    [28] 230, 232, 154, 156, 182, 184: Area in the upper plate which is not in contact with the lower plate
    [29] 176, 214: heat insulating means 44a, 84a: evaporation pattern
    [30] 48a, 88a: condensation pattern
    [31] 50a, 50b, 66, 90a, 90b: liquid refrigerant flow path pattern
    [32] 52a, 54a: gaps provided in the first and second thermal insulation means
    [33] 60a: portion in contact with the channel region 56 of the top plate
    [34] 60b, 60c: part which contacts the 2nd and 1st heat insulation means 50 and 54 of an upper plate
    [35] 60e, 60f: recessed spaces P1, P2 of the top plate: cuboid
    [43] In order to achieve the above object, the present invention provides an evaporation unit for contacting the heating element and evaporating the liquid refrigerant absorbing heat transferred from the heating element; A condensation unit for condensing the gas discharged from the evaporation unit; A gas flow path that is a passage through which the gas flowing out of the evaporation unit flows into the condensation unit; A liquid refrigerant passage in which the liquid refrigerant flows from the condenser to the evaporator while a part of the liquid refrigerant flows into the channel region; And a lower plate provided with at least one heat insulating means between at least the gas flow path and the liquid coolant flow path to prevent an element from interfering with the supply of the liquid coolant from the gas flow path to the liquid coolant flow path. In addition, the present invention provides a heat transfer apparatus comprising an upper plate in contact with some elements of the lower plate.
    [44] One direction of the evaporator is in contact with the channel region, and the other direction is in contact with the gas flow path.
    [45] The heat insulation means extends between the evaporator and the liquid refrigerant passage to contact the channel region.
    [46] The heat insulating means is a single heat insulating means provided in parallel with the first and second heat insulating means or the edge of the lower plate provided symmetrically. The single insulation means has a curved portion.
    [47] The liquid refrigerant passage is divided into two by the channel region.
    [48] Some of the liquid refrigerant passages are not in contact with the top plate.
    [49] Fine patterns are formed in the condenser, the liquid refrigerant passage, the channel region, and the evaporator to gradually increase capillary force with respect to the liquid refrigerant from the condenser to the liquid refrigerant passage, the channel region, and the evaporator. It is.
    [50] A chamber is formed between the patterns formed on the upper plate of the liquid coolant channel and the upper plate of the liquid coolant flow path and the upper plate to remove an inner side of the upper plate by a predetermined thickness.
    [51] Areas corresponding to the evaporation part, the gas flow path, and the condensation part of the upper plate are recessed to a predetermined depth compared to other parts.
    [52] The channel region is provided between the evaporator and an edge of the lower plate adjacent thereto.
    [53] The condensation part bypasses the upper end of the heat insulating means and is in contact with the liquid refrigerant flow path provided between the heat insulating means and the edge of the lower plate adjacent thereto.
    [54] When the liquid refrigerant passage is divided into two by the channel region, the heat insulating means comprises: first heat insulating means for blocking the liquid refrigerant passage and the gas passage provided between the condensation unit and the channel region; And a second heat insulation means provided in a direction perpendicular to the first heat insulation means to block the evaporation portion and the remaining portion of the liquid refrigerant flow path divided into two by the gas flow passage and the channel region.
    [55] Each of the first and second heat insulating means is a structure having a gap, or a barrier made of both insulating materials, or one of the first and second heat insulating means is a structure having a gap, and the other is made of an insulating material. It is a constructed barrier.
    [56] The single insulation means is a barrier composed of a structure or insulating material having a gap.
    [57] Using the present invention, the liquid refrigerant is prevented from being evaporated in the process of supplying the liquid refrigerant from the condenser to the evaporator. In addition, the supply of the liquid refrigerant can be prevented from being interrupted by bubbles, non-condensable gases, or the like. In addition, the liquid refrigerant flows from the condensation unit to the liquid refrigerant passage and the evaporation unit by itself, and the condensation unit, the liquid refrigerant passage, and evaporation even if the inflow of the liquid refrigerant is momentarily stopped by dry-out during the inflow process. The supply of the liquid refrigerant resumes on its own due to the slope of the capillary force present between the portions. Due to such capillary force gradient, since the liquid refrigerant may be introduced into the evaporator at all times before the operation of the heat transfer device starts, the heat transfer device may be stably operated.
    [58] Hereinafter, with reference to the accompanying drawings will be described in detail a heat transfer apparatus according to an embodiment of the present invention. In this process, the thicknesses of the layers or regions illustrated in the drawings are somewhat exaggerated for clarity.
    [59] <First Embodiment>
    [60] Referring to FIG. 2, reference numeral 40 denotes a heat transfer device, 42 denotes a bottom plate of the heat transfer device 40, and 60 denotes an upper plate, that is, a cover provided to be exactly matched with the lower plate 42. Since the upper plate 60 is a transparent material such as a glass substrate, it is not shown in the figure.
    [61] The heat transfer device 40 is a region in which evaporation of the refrigerant absorbing heat transferred from a heat generating element (not shown) in an electronic device such as a CPU occurs, and the back surface of the heat transfer device 40 directly contacts the heat generating element. Equipped. In addition, the condensation part 48 is provided with the gas conveyed from the evaporation part 44 condensed. The evaporator 44 and the condenser 48 are connected to a gas flow passage 46 that serves as a passage through which the gas is transferred from the evaporator 44 to the condenser 48. In addition, the liquid refrigerant passage 50 is provided between the condenser 48 and the evaporator 44 such that the gas condensed in the condenser 48, that is, the liquid refrigerant flows into the evaporator 44. A channel region 56 serving as a passage through which the liquid refrigerant flows into the evaporator 44 is provided at the boundary region between the liquid refrigerant passage 50 and the evaporator 44.
    [62] On the other hand, the liquid refrigerant passage 50 is provided symmetrically on both sides around the evaporator 44, the gas passage 46 and the condensation unit 48. Insulation means 52 and 54 are provided between the liquid refrigerant passage 50, the evaporator 44, and the gas passage 46. The heat insulation means 52 and 54 are means for preventing heat from being transferred from one region to another region, specifically, through the liquid refrigerant passage 50 from the evaporator 44 and the gas passage 46. Means for blocking heat transfer to the liquid refrigerant flowing into the evaporator 44 or means for reducing at least the amount of heat transferred to less than the minimum amount of heat that the liquid refrigerant can be evaporated. The heat insulation means 52 and 54 are provided symmetrically about the evaporation part 44 and the gas flow path 46, and are connected with the both sides of the channel area 56. As shown in FIG. In this way, the channel region 56 is the only passage through which the liquid refrigerant can flow from the liquid refrigerant passage 50 into the evaporator 44. The heat insulation means 52 and 54 are comprised with the 1st heat insulation means 52 on the left side, and the 2nd heat insulation means 54 on the right side centering on the channel area 56. As shown in FIG. Since the 1st and 2nd heat insulation means 52 and 54 are provided symmetrically, it is preferable that they are the same shape.
    [63] Due to the heat insulating means 52, 54, the liquid refrigerant is prevented from evaporating while the liquid refrigerant flows into the evaporator 44 from the condenser 48 through at least the liquid refrigerant passage 50. The heat insulation means 52, 54 extend to the predetermined area of the condensation part 48. The liquid refrigerant passage 50 is provided such that the liquid refrigerant flows into the channel region 56 by bypassing the heat insulating means 52 extended to the condensation unit 48. In other words, the liquid refrigerant passage 50 is provided in the form of a citron U between the edges of the evaporator 44, the gas passage 46, and the condensation unit 48 and the lower plate 42 which are sequentially provided. As a result, the heat insulating means 52, 54 are also shaped like the liquid refrigerant passage 50.
    [64] As such, in the process of supplying the liquid refrigerant from the condenser 48 to the evaporator 44, the liquid refrigerant is prevented from evaporating by heat transferred from the evaporator 44 and / or the gas flow passage 46. At the same time, the heat insulating means 52 and 54 are provided to prevent the evaporated gas from flowing into the liquid coolant flow path 50, thereby preventing the supply of the liquid coolant by dry-out. In addition, a fine pattern is formed on the path from the condenser 48 to the evaporator 44 through the liquid refrigerant passage 50 so that the capillary force with respect to the liquid refrigerant is gradually increased toward the evaporator 44. This will be described later. Therefore, even when dry-out occurs in any region on the liquid refrigerant passage 50 during the operation of the heat transfer device 40, the supply of the liquid refrigerant from the condenser 48 to the evaporator 44 is stopped. The capillary force directed to the area where dry-out has occurred causes the supply of the liquid refrigerant to be naturally resumed. In addition, since there exists a capillary force gradient from the condenser 48 to the liquid refrigerant passage 50 and the evaporator 44 and the capillary force at the evaporator 44 is the strongest, the heat transfer device 40 The liquid phase refrigerant may be stably supplied to the evaporator 44 at the time of initial operation. A coolant inlet 58 is provided at the edge of the lower plate 42 facing the channel region 56 with the liquid coolant flow path 50 interposed therebetween.
    [65] 2 along with FIG. 2 is a cross-sectional view taken in the 3-3 'direction across the center of channel region 56, evaporator 44, gas flow passage 46 and condensation portion 48. Referring to FIG. 2, the liquid refrigerant flow path 50 may be formed from the liquid refrigerant flow path 50 so that the liquid refrigerant flows into the evaporation unit 44 from the liquid refrigerant flow path 50 on the region corresponding to the evaporation unit 44 of the lower plate 42. An evaporation pattern 44a is formed which causes capillary force toward 44. Although the evaporation part pattern 44a was processed as a block for convenience, a detailed pattern shape is mentioned later. The liquid refrigerant path pattern 50a is formed on a region corresponding to the liquid refrigerant path 44. A portion of the liquid coolant flow path pattern 50a near the interface where the liquid coolant flow path pattern 50a and the evaporator pattern 44a contact each other is in contact with the upper plate 60. The contacted portion corresponds to the channel region 56. do. The condensation part pattern 48a is formed in the area | region corresponding to the condensation part 48 of the lower board 42, and the liquid refrigerant flow path pattern is formed in the area | region between the condensation part pattern 48a and the edge of the lower board 42 adjacent to this. 50b is formed. Both the liquid refrigerant path pattern 50a formed on the liquid refrigerant path between the evaporator pattern 44a and the edge of the lower plate 42 adjacent thereto and the liquid refrigerant path pattern 50b formed adjacent to the condensation part pattern 48a are condensed. Although it contributes to conveying a liquid refrigerant from the part 48 to the evaporation part 44, it is preferable that the shape and density of the formed pattern differ. In other words, the shape of the liquid coolant flow path pattern 50b formed between the condensation part pattern 48a and the edge of the lower plate 42 adjacent thereto is preferably the same as that of the condensation part pattern 48a, but the density of the condensation part 48 It is preferable that the capillary force that causes the liquid refrigerant to flow into the liquid refrigerant passage 50 is greater than the density of the condensation part pattern 48a so as to act on the liquid refrigerant. In other words, the liquid refrigerant path pattern 48a is formed to have a larger capillary force in the liquid refrigerant path 50 adjacent thereto than in the condensation unit 48.
    [66] Meanwhile, in the case of the liquid refrigerant channel pattern 50a formed between the evaporator pattern 44a and the edge of the lower plate 42 adjacent thereto, the liquid refrigerant channel is different from the liquid refrigerant channel pattern 50b adjacent to the condensation unit pattern 48a. The capillary force in the region adjacent to the evaporator 44 of 50 is formed to be smaller than the capillary force in the evaporator 44. However, the liquid refrigerant path pattern 50a formed on the region adjacent to the evaporator 44 among the liquid refrigerant paths 50 has a capillary force from the liquid refrigerant path, such as the condensation unit 48 and the liquid refrigerant path pattern 50b. It is formed to be larger than the capillary force resulting from the liquid refrigerant flow path pattern formed on the remaining area of the flow path 50.
    [67] The edge of the lower plate 42 is hermetically bonded to the upper plate 60, but the inside of the edge is a liquid refrigerant formed adjacent to the portion corresponding to the channel region 56 of the liquid refrigerant passage pattern 50a and the condensation portion pattern 48a. Except for the flow path pattern 50b, it is not in contact with the upper plate 60. In other words, a pattern formed between the edge of the lower plate 42 in which the channel region 56 and the coolant inlet port 58 are formed, the evaporation part pattern 44a, the condensation part pattern 48a and the lower plate among the liquid coolant flow path patterns 50a ( The gas flow passage 46 of 42 is not in contact with the top plate 60. A chamber 62 formed by removing the inside of the upper plate 60 to a predetermined thickness between an area not in contact with the upper plate 60 of the lower plate 42, that is, a region used as the gas flow passage 46 and the upper plate 60. ) Is formed. The chamber 62 extends over the evaporator pattern 44a and the condenser pattern 48a. In this way, the gas generated by absorbing the heat transferred from the heat generating element by the liquid refrigerant flowing into the evaporator 44 by the capillary force of the evaporator pattern 44a is evaporated to the condensation unit 48 through the chamber 62. Is transferred to). The other chamber 64 is formed on the area | region which is not in contact with the upper plate 60 among the liquid refrigerant | coolant flow path patterns 50a. The other chamber 64 is formed by removing the inside of the upper plate 60 by a predetermined thickness similarly to the chamber 62. These chambers 62 and 64 are formed simultaneously in the same process. The other chamber 64 may be used as a space for collecting the bubbles or non-condensable gas in the liquid refrigerant flowing into the evaporator 44 through the liquid refrigerant passage 50. In this way, the chamber 64 is provided on the liquid coolant flow path 50 to collect bubbles or non-condensable gas included in the liquid coolant, thereby preventing the supply of the liquid coolant by the bubbles or the non-condensable gas. Can be.
    [68] Subsequently, along with FIG. 2, a cross-sectional view of FIG. 2 is cut in the 4-4 'direction vertically across the center of the liquid coolant flow path 50 between the second heat insulating means 54 and the edge of the lower plate 42 adjacent thereto. Referring to FIG. 4, the condensation part 48 from the condensation part 48 to the evaporation part 44 on the flow path corresponding to the edge of the second heat insulating means 54 and the lower plate 42 adjacent thereto among the liquid refrigerant flow paths 50. A liquid coolant flow path pattern 66 is formed to supply a liquid coolant by a gradually increasing capillary force. Points in the block symbolically representing the liquid refrigerant flow path pattern 66 in the drawing indicate that the density of the pattern formed on the liquid refrigerant flow path 50 provided between the condensation part 48 and the evaporation part 44 is the evaporation part 44. It is indirectly represented as it increases. Since the capillary force is increased when the density of the pattern is increased, the condensation part 48 is due to the liquid refrigerant path pattern 66 formed on the liquid refrigerant path 50 provided between the condensation part 48 and the evaporation part 44. In the evaporator 44, the capillary force acting on the liquid refrigerant gradually increases.
    [69] On the other hand, the portion adjacent to the condensation portion 48 of the liquid coolant flow path pattern 66 is bonded to the upper plate 60, but the chamber 64 is provided between the remaining portion and the upper plate 60. Although not shown in the drawing, the heat insulating means 52, 54 are preferably hermetically bonded to the top plate 60, so that the area of the chamber 64 is ultimately formed by the top plate 60, the heat insulating means 52, 54, and the bottom plate ( 42) It is determined by the adhesion of the pattern formed in the vicinity of the condensation part 48 in the edge and the liquid refrigerant flow path pattern 66. The area of the chamber 62 used as the gas flow passage 46 is the upper plate 60 and the heat insulating means 52, 54, the pattern formed on the channel region 56, the condensing unit 48 and the lower plate 42 adjacent thereto. It is determined by the adhesion of the liquid refrigerant path pattern 50b formed between the edges of the substrate.
    [70] 5 is a bottom plate provided with the evaporator pattern 44a, the liquid coolant flow path patterns 50a, 50b, and 66, the condenser part pattern 48a, the heat insulating means 52 and 54, and the coolant inlet port 58, and the like. As a perspective view of (42), referring to this, it can be seen that the heat insulating means 52, 54 are formed to have the same height as the edge surface of the lower plate (42). Accordingly, it can be seen that the evaporation unit 44, the gas flow passage 46, and the liquid refrigerant flow passage 50 may be completely separated by adhering the heat insulating means 52 and 54 and the upper plate 60. In addition, as described above, it is understood that the same-shaped patterns having the same height as the heat insulation means 52 and 54 are formed on the areas corresponding to the condensation part 48, the liquid refrigerant flow path 50, and the evaporation part 44. It can be seen that the density of the pattern increases from the condenser 48 to the evaporator 44. Thus, it can be seen that the capillary force increases from the condenser 48 to the evaporator 44.
    [71] More specifically, a plurality of pattern groups are formed in the condensation unit 48, and each pattern group is composed of a plurality of patterns, and is arranged vertically with another adjacent pattern group. Each pattern group is arranged side by side to have a predetermined interval a plurality of rectangular parallelepiped (P1), another pattern group perpendicular to this to have a plurality of rectangular parallelepiped (P2) in a direction perpendicular to the rectangular parallelepiped (P1) to have a predetermined interval. It is arranged side by side. If the direction of the flow of the liquid refrigerant can be given, the patterns constituting the pattern group may have a geometric shape different from the rectangular parallelepiped.
    [72] For example, all of the patterns formed in the liquid refrigerant path 50 and the evaporator 44 including the condenser 48 may be replaced by a cylinder P3 as shown in FIG. 6. Also in this case, the density of the cylinder P3 is preferably increased from the condensation part 48 toward the liquid refrigerant flow path 50 and the evaporation part 44.
    [73] As such, when the density of the patterns increases toward the evaporator 44, the spacing between the patterns becomes narrower toward the evaporator 44, and as a result, the capillary force increases gradually, so that the capillary tube in the evaporator 44 increases. Force is maximum.
    [74] Meanwhile, as shown in FIG. 6, instead of replacing the entire pattern formed on the lower plate 42 with another pattern, only some patterns may be replaced with another pattern, and FIG. 7 shows an example.
    [75] Referring to FIG. 7, the patterns formed on the condensation unit 48, the liquid refrigerant channel 50, and the channel region 56 are all rectangular parallelepipeds, while the patterns formed on the evaporator 44 are cylindrical.
    [76] As such, if the direction of the flow of the liquid refrigerant can be given, all of the patterns formed on the lower plate 42 may be replaced with other patterns, and only the patterns formed on at least one region are different from the patterns formed on the remaining regions. Can be replaced with
    [77] FIG. 8 is a perspective view of the inner surface of the upper plate 60, that is, the surface in contact with the lower plate 42, with reference numeral 60a indicating a portion in contact with the channel region 56 of the lower plate 42. 60c represents the part which contacts the 2nd heat insulation means 54 and the 1st heat insulation means 52, respectively. Reference numeral 60d denotes a condensation portion in the flow path between the condensation portion 48 and the edge of the lower plate 42 adjacent thereto and the flow path between the heat insulation means 52 and 54 and the edge of the lower plate 42 adjacent thereto. The surface which contacts the part near 48 is shown. Reference numeral 60e denotes a space used as a chamber (62 in FIG. 3) provided between the gas flow passage 46 and the upper plate 60 of the lower plate 42. Reference numeral 60f denotes a space corresponding to the chamber (64 of FIGS. 3 and 4) provided between the liquid refrigerant passage 50 and the upper plate 60 and used to collect bubbles or non-condensable gas contained in the liquid refrigerant. . Therefore, the spaces 60e and 60f used as the chambers 62 and 64 are recessed by a predetermined thickness compared to the portions 60a, 60b, 60c and 60d contacting the predetermined area of the lower plate 42. It can be seen that.
    [78] FIG. 9 shows that bubbles or non-condensable gases 70 included in the liquid refrigerant are collected in the chamber 64 provided between the liquid refrigerant path pattern 66 and the upper plate 60. As described above, bubbles or non-condensable gas contained in the liquid refrigerant supplied from the condensation part 48 to the evaporation part 44 using the chamber 64 provided between the liquid refrigerant path pattern 66 and the upper plate 60 ( 70) It is possible to smoothly supply the liquid refrigerant by removing elements from the liquid refrigerant that obstruct the supply of the liquid refrigerant.
    [79] On the other hand, the heat insulating means 52, 54 for blocking the liquid refrigerant passage 50, the evaporator 44 and the gas passage 46 is a structure having a gap (52a, 54a) in the center as shown in FIG. It is preferable. However, the heat insulating means 52, 54 may be a heat insulating material having no gaps 52a, 54a in the middle. The portion surrounding the evaporation portion 44 of the heat insulation means 52, 54 is gently curved to allow the liquid refrigerant to flow smoothly along the heat insulation means 52, 54.
    [80] The thermal insulation means 52, 54 may have other forms of modification than those shown in FIG. 10, FIGS. 11 and 12 are top views of some of the modified examples of the thermal insulation means 52, 54.
    [81] FIG. 11 shows a wider upper and middle width and a narrower lower thermal insulation means, and FIG. 12 shows a thermal insulation means that one side is bent vertically inward by a predetermined length.
    [82] Second Embodiment
    [83] FIG. 13 shows a plan view of the lower plate 82 in the heat transfer apparatus according to the second embodiment with the heat insulation means shown in FIG. 11. It was transparent as an upper plate glass substrate, and the illustration of the plane was abbreviate | omitted. Also, the illustration of the refrigerant inlet is omitted, but the illustration of the refrigerant inlet is omitted in all embodiments.
    [84] Referring to FIG. 13, the heat transfer apparatus 80 according to the second embodiment includes an evaporator 84 and a condenser 88. The gas flow path 86 which is a passage through which the gas generated from the evaporation part 84 is sent to the condensation part 88 between these is provided. In addition, a liquid refrigerant passage 90 for supplying a liquid refrigerant from the condenser 88 to the evaporator 84 is provided between the condenser 88 and the evaporator 84. The paths through which the gas flow path 86 and the liquid refrigerant flow path 90 connect the evaporator 84 and the condensation unit 88 are different from each other. First and second heat insulating means 92 and 94, as shown in FIG. 11, are provided between the region where the evaporator 84 and the gas flow passage 86 are combined with the liquid coolant flow passage 90. A portion of the first and second heat insulating means 92 and 94 having a narrow gap cuts off between the evaporator 84 and the liquid refrigerant passage 90, and a portion having a large gap has a gas passage 86 and a liquid refrigerant passage ( 90) The part with the large space | interval of the 1st and 2nd heat insulation means 92 and 94 is extended to the condensation part 88 by a predetermined length. Therefore, the predetermined region of the condensation part 88 which contacts the gas flow path 86, and the liquid refrigerant | coolant flow path 90 are also interrupted | blocked by the 1st and 2nd heat insulation means 92 and 94. FIG. The remaining region of the condensation unit 88 is opened with the liquid refrigerant passage 90. The narrow spaced portion and the large spaced portion of the first and second heat insulation means 92 and 94 are connected through a connection portion parallel to the boundary between the gas flow path 86 and the evaporation portion 84. Between the narrow space between the first and second heat insulating means 92 and 94 in the liquid coolant flow path 90 and the edge of the lower plate 82 adjacent thereto, that is, between the evaporator 84 and the edge of the lower plate 82 adjacent thereto. The flow path in contact with the top plate (not shown) is the channel region 96.
    [85] The hatched areas in FIG. 13, that is, the entire evaporation unit 84 and the gas flow path 86 and a part of the condensation unit 88 and the liquid evaporation unit 84 and the channel region 96 in the liquid refrigerant flow path 90, are shown in FIG. The remaining portions of the lower plate 82 except for the predetermined regions 98 and 100 provided at both sides, that is, the channel region 96, the remaining portion of the liquid refrigerant passage 90, and the liquid refrigerant passage among the condensation units 88. 90) and the open part is in contact with the top plate. In particular, the edge of the lower plate 82 and the first and second heat insulating means 92 and 94 are preferably in contact with the upper plate to be sealed.
    [86] Arrows in the figure indicate the direction in which gas flows or the direction in which the liquid refrigerant flows. It is preferable that the pattern configuration for each region constituting the lower plate 82 is the same as in the first embodiment. That is, it is preferable to form a pattern on each region of the lower plate 82 so that the capillary force increases from the condenser 88 through the liquid refrigerant passage 90 to the evaporator 84. Accordingly, the shapes of the patterns formed in the liquid refrigerant passage 90, the evaporator 84, and the condenser 88 including the channel region 96 may be the same, but the density thereof may be different.
    [87] FIG. 13 along with FIG. 13 shows a cross section taken along the 14-14 ′ direction through the center of the channel region 96, evaporator 84, gas flow path 86 and condenser 88. The lower surface is formed with a predetermined pattern 96a (hereinafter referred to as a channel region pattern 96a) for inducing capillary force for introducing the liquid refrigerant flowing into the channel region 96 into the evaporator 84. A predetermined pattern 84a (hereinafter referred to as an evaporator pattern 84a) is formed to uniformly supply liquid refrigerant flowing into the evaporator 84 through the channel region 96 to each of the evaporator 84. It is. The evaporation pattern 84a is formed to cause a capillary force greater than the capillary force induced by the channel region pattern 96a with respect to the liquid refrigerant. In this way, the liquid refrigerant flows into the evaporator 84 through the channel region 96 by itself, and the liquid refrigerant introduced into the evaporator 84 is a heating element (not shown) in contact with the back surface of the evaporator 84. E) is absorbed and evaporated from the heat transferred. A predetermined pattern 88a (hereinafter, referred to as condenser pattern 88a) is also provided on the condensation portion 88 that condenses the gas transferred from the evaporation portion 84 by a distance corresponding to the evaporation portion 84 and the gas flow passage 86. Is formed). The condensation part pattern 88a is a pattern having the lowest pattern density among the patterns formed on the lower plate 82. The predetermined pattern 90a (hereinafter, referred to as the liquid coolant flow path pattern 90a) formed on the liquid coolant flow path 90 between the edges of the lower plate 82 adjacent to the condensation part 84 is a condensation part pattern 88a. Since the capillary force is greater than the induced capillary force, the supply of the liquid refrigerant from the condensation unit 84 to the liquid refrigerant path 90 is made by itself.
    [88] The upper plate 102 adhered to the edge of the lower plate 82 is in contact with the channel region pattern 96a and the liquid coolant flow path pattern 90a, while the upper plate 102 is in contact with the evaporator pattern 84a and the condenser pattern 88a. Not. A chamber covering the evaporation portion 84, the gas flow passage 86, and the condensation portion 88 of the lower plate 82 between the channel region pattern 96a of the upper plate 102 and the portion in contact with the liquid refrigerant flow path pattern 90a. 104 is provided. The chamber 104 is the same as the chamber (62 in FIG. 3) of the first embodiment. Since the chamber 104 extends over the evaporator pattern 84a and the condenser pattern 88a, the gas generated in the evaporator 84 may be used as a passage through which the gas is introduced into the condenser 88.
    [89] Referring to FIG. 15, which shows a cross-sectional view of FIG. 13 taken along the direction of 15-15 ′ in conjunction with FIG. 13, the liquid refrigerant path between the first and second heat insulating means 94 and the edge of the lower plate 82 adjacent thereto is also defined. A pattern 90b, hereinafter referred to as a liquid refrigerant channel pattern 90b, is formed. The liquid refrigerant channel pattern 90b is in contact with the upper plate 102 except for a portion of the lower portion thereof. The chamber 106 is formed between the upper plate 102 and the portion not in contact with the upper plate 102 of the liquid refrigerant channel pattern 90b. The chamber 106 is formed in the same manner as the chamber of the first embodiment (64 in FIGS. 3 and 4) and serves the same role. The chamber 106 corresponds to the hatched portion 100 on the right side of the evaporator 84 and the channel region 96 in FIG. 13. The liquid coolant flow path pattern 90b has a pattern density similar to the liquid coolant flow path pattern (66 in FIG. 4) of the first embodiment. In other words, the density of the liquid refrigerant channel pattern 90b is gradually increased from top to bottom. As a result, the capillary force increases gradually. Accordingly, the liquid refrigerant flowing into the liquid refrigerant passage 90 from the condenser 88 flows into the channel region 96 without being interrupted. Even when the supply of the liquid refrigerant is suspended by dry-out or the like, as described above, since the liquid refrigerant passage 90 has an increasing capillary force gradient, the supply of the liquid refrigerant may be immediately measured. Arrows in the drawing indicate the direction in which the liquid refrigerant or gas flows.
    [90] Third Embodiment
    [91] 12. The heat transfer apparatus having the heat insulating means shown in FIG. 12, and as shown in FIG. 16, the first and second heat insulating means 120, 122 are the liquid refrigerant passage 118 and the gas flow passage 114. ) To block heat and gas from being transferred from the gas flow passage 114 to the liquid refrigerant flow passage 118. The first and second thermal insulation means 120, 122 are in contact with both sides of the channel region 124. The first and second heat insulating means 120 and 122 extend to a predetermined region of the condensation part 116 provided in contact with the gas flow passage 114. One side of the evaporator 112 through which the liquid refrigerant flows through the channel region 124 is in contact with the channel region 124, but the other is surrounded by the gas flow passage 114. The liquid coolant flow path 118 is similar to the first or second embodiment of the first and second heat insulating means 120 and 122, the condensation part 116 and the evaporation part 112, and the lower plate 110 adjacent to each of them. It is provided between the edges. The channel region 124 is a channel between the evaporator 112 and the edge of the lower plate 110 adjacent to the liquid refrigerant passage 118 provided in this way.
    [92] Portions hatched from the lower plate 110, that is, the entire evaporation unit 112 and the gas flow passage 114, a part of the condensation unit 116 in contact with the gas flow passage 114, and a channel region among the liquid refrigerant flow passage 118 ( The area between the edge of the lower plate 110 and the lower plate 110 adjacent thereto is an area not in contact with the upper plate (not shown), and the remaining portions including the edge of the lower plate 110, in particular, the first and second heat insulating means 120, 122) is in contact with the top plate. In this way, gas generated by evaporation of the liquid refrigerant from the gas flow passage 114 to the liquid refrigerant passage 114 is prevented from flowing. A portion of the upper plate corresponding to the hatched portions of the lower plate 110 is recessed to a predetermined depth as compared to other portions of the upper plate. Thus, a chamber (not shown) is formed between the hatched portions of the lower plate 110 and the upper plate. Arrows in the figure indicate the flow direction of the liquid refrigerant or gas.
    [93] Description of the role of the chamber is omitted in the above-described embodiment. For the same reason, patterns formed in the condensation unit 110, the liquid refrigerant passage 118, and the evaporator 112 so that the liquid refrigerant flows from the condensation unit 110 to the liquid refrigerant passage 118 and the evaporator 112 by themselves. The description for the above is also omitted.
    [94] Next, the heat transfer apparatus according to the fourth to sixth embodiments of the present invention will be described. The heat transfer apparatus according to the fourth to sixth embodiments is asymmetrical even though the first to third embodiments described above are provided with two thermal insulation means symmetrically, even if they have one thermal insulation means or two thermal insulation means. It has its features.
    [95] The following description of the heat transfer device according to the fourth to sixth embodiments is limited to the arrangement and form of the heat insulating means, and which part is in contact with the top plate and which part is not in each area of the bottom plate. The type or arrangement of the pattern formed in the condensing part, the liquid refrigerant channel, part of which is used as a channel region, and the evaporation part all increase capillary force from the condensation part to the evaporation part through the liquid refrigerant channel, and as a result, the liquid refrigerant flows on its own. Since this is fully described in the above-described embodiments, further description thereof will be omitted.
    [96] Fourth Example
    [97] As shown in FIG. 17, the heat transfer device 130 according to the fourth embodiment separately shows the lower plate 132 and the upper plate 134. The upper plate 134 shown does not show the inner side in contact with the lower plate 132, but shows the upper surface, that is, the upper surface, which is not in contact.
    [98] Referring to these, the lower plate 132 and the gas flow path 140 in contact with two adjacent directions of the evaporator 144 and the evaporator 144, the condensation unit 142, a part of the condensation unit 142 and The liquid phase used as the channel region 146 which is in contact with and is in contact with the gas flow passage 140, a part of which is in contact with one of the remaining two directions of the evaporator 144 not in contact with the gas flow passage 140. The refrigerant passage 136 is configured. In addition, the liquid refrigerant passage 136 is relatively narrower than the gas passage 140, and heat insulating means 138 and 148 are provided between the liquid refrigerant passage 136. The heat insulation means 138 and 148 are all provided in parallel with the edge of the lower board 132. Among the heat insulation means 138 and 148, the first heat insulation means 138 is provided toward the condensation portion 142 starting from the portion where the channel region 146 of the liquid refrigerant flow passage 136 starts, and part of the heat insulation means 138 is condensed. It extends between the portion 142 and the liquid refrigerant passage 136. In other words, a part of the region contacting the liquid refrigerant passage 136 and the gas passage 140 of the condensation unit 142 is blocked by the first heat insulating means 138. A part of the condensation part 142 is in contact with a part of the edge of the lower plate 132 where the liquid coolant flow path 136 is in contact with the part of the condensation part 142 that is not in contact with the liquid coolant flow path 136. It is also in contact with the liquid refrigerant passage 136. The liquid refrigerant passage 136 is composed of two parts divided about the channel region 146 and the channel region 146. One of the two portions is a portion between the edge of the first heat insulating means 138 and the lower plate 132 adjacent thereto, and the other portion 150 is adjacent to the evaporator 144 and the gas flow passage 140. As a result, the contact with the evaporator 144 and the gas flow passage 140 is blocked by the second heat insulating means 148. The second heat insulating means 148 starts at the channel region 146 side of the border region of the channel region 146 and the evaporator 144, and is opposite to the channel region 146 and is different from the first heat insulating means 138. It is provided in the vertical direction. The second heat insulating means 148 is in contact with the other of the two directions not in contact with the gas flow path 140 of the evaporator 144.
    [99] The lower plate 132 is adjacent to the hatched portions, that is, the evaporator 144, the gas passage 140, and the condensation unit 142, and the evaporator 144 and the gas passage 140 of the liquid refrigerant passage 136. It is in contact with the top plate 134 except for one portion 150. The portions 154 and 156 of the upper plate 134 corresponding to the hatched portions of the lower plate 132 are portions recessed to a predetermined depth as compared to other portions. Of the portions 154 and 156 of the upper plate 134, a portion 156 and the portion 156 corresponding to the evaporation portion 144 of the liquid refrigerant flow passage 136 and the portion 150 adjacent to the gas flow passage 140. The chamber formed between the patterns (not shown) formed in the 150 is used as a reservoir for collecting the liquid or the non-condensable gas in the liquid refrigerant flowing into the liquid refrigerant passage 136 together with the storage of the extra liquid refrigerant. do. In the upper plate 134, reference numeral 152 denotes a portion between the first heat insulating means 138 and the liquid coolant flow path 136 between the edge of the first heat insulating means 138 and the lower plate 132 adjacent thereto, and the channel region 146. ) Indicates the part in contact with. And 152a shows the part which contacts the 2nd heat insulation means 148. As shown to FIG.
    [100] Fifth Embodiment
    [101] As shown in FIG. 18, the heat transfer device 160 according to the fifth embodiment includes a heat insulating means 176 formed on the lower plate 162 in parallel with one of the edges of the lower plate 162. The thermal insulation means 176 has a curved portion. The curved portion is preferably bent perpendicularly to the portion parallel to the edge of the heat insulating means 176, but may be an obliquely curved portion. Both ends of the heat insulating means 176 are spaced apart from the edge of the adjacent lower plate 162 by a predetermined interval. For convenience, the insulation means 176 is divided into an upper portion and a lower portion with the curved portion as a boundary. The length of the top of the insulation means 176 is relatively long compared to the bottom. Further, the spacing between the upper portion of the heat insulation means 176 and the edge of the lower plate 162 adjacent thereto is smaller than the spacing between the lower portion and the edge of the lower plate 162 adjacent thereto. However, the gap between the edge of the lower plate 162 which is parallel to the heat insulation means 176 but not adjacent to the top and bottom of the heat insulation means 176 is reversed.
    [102] The liquid refrigerant is connected to the condensation unit 170 between the insulation means 176 and the edge of the lower plate 162 adjacent to the insulation means 176 and passes through the channel region 174 to the evaporator 166. A liquid coolant flow path 172, which is a conveying passage, is provided and is evaporated from the bottom up to the channel region 174 between the edge of the lower plate 162 parallel to the heat insulation means 176 and the heat insulation means 176. The unit 166, the gas flow path 168, and the condensation unit 170 are sequentially provided. The channel region 174 and the evaporator 166 are provided between the lower portion of the heat insulation means 176 and the edge of the non-adjacent lower plate 162, and the gas flow path 168 and the condensation portion 170 are heat insulation means. It is provided between the upper part of 176 and the edge of the non-adjacent lower board 162. As shown in FIG. A part of the condensation unit 170 is in contact with the liquid refrigerant passage 172 by bypassing the upper portion of the heat insulating means 176. The portion 178 between the lower portion of the heat insulating means 176 and the edge of the lower plate 162 adjacent to the liquid refrigerant passage 172 extends to the channel region 174 by bypassing the lower portion of the heat insulating means 176.
    [103] The hatched portions 166, 168, 170, and 178 in the lower plate 162 are portions that are not in contact with the upper plate 164, and the regions 182 and 184 corresponding to these portions in the upper plate 164 are different from each other. Small patterns (not shown) formed in the hatched portions 166, 168, 170, and 178 of the lower plate 162 and recessed to a predetermined depth relative to the region, and the regions 182 and 184 of the upper plate 164. A chamber is formed between. In the upper plate 164, reference numeral 180 denotes an area in the liquid refrigerant flow path 172 that is in contact with the upper portion of the heat insulating means 176 and the portion formed between the upper portion of the heat insulating means 176 and the edge of the lower plate 162 adjacent thereto. . And reference numeral 188 denotes an area in contact with the curved portion and the lower portion of the thermal insulation means 176, and 186 denotes an area in contact with the channel area 174.
    [104] Sixth Example
    [105] Referring to FIG. 19, the lower plate 202 of the heat transfer device 200 includes a heat insulating means 214, and a liquid refrigerant passage 212 is disposed between the heat insulating means 214 and the edge of the lower plate 202 adjacent thereto. And a channel region 216, an evaporator 206, a gas flow passage 208, which is a part of the liquid coolant flow passage 212, between the edges of the lower plate 202, which are not adjacent but parallel to the heat insulating means 214. The condensation unit 210 adjacent to the edge of the lower plate 202 is provided with the extended portion of the liquid refrigerant passage 212 interposed therebetween. The heat insulating means 214, the channel region 216, the evaporator 206 and the gas flow path 208 are the same as those provided in the lower plate 162 of the heat transfer device 160 according to the fifth embodiment. Most of the condensation unit 210 and the liquid refrigerant passage 212 are the same as those according to the fifth embodiment, but the condensation unit 210 has an upper inner side of the heat insulation means 214 bordering the upper end of the heat insulation means 214. The liquid refrigerant path 212 extends between the edges of the condensation unit 210 and the lower plate 202 adjacent to the upper end of the heat insulating means 214. In addition, the liquid refrigerant passage 212 extends downward between the channel region 216 and the edge of the lower plate 202 adjacent thereto by bypassing the lower end of the heat insulating means 214. As a whole, the liquid refrigerant passage 212 is a "c" shape surrounding three surfaces of the remaining area except for the liquid refrigerant passage 212 in the rectangular lower plate 202.
    [106] On the other hand, in the lower plate 202, the entire edge and the channel region 216, the entire portion except the portion 218 of the heat insulating means 214 between the condensation unit 210 and the liquid refrigerant flow path 212 and the liquid refrigerant flow path Only a portion of the region 212 is in contact with the top plate 204, and all the other regions are not in contact. The hatched portions of the lower plate 202 represent portions that are not in contact with the top plate 204, and the hatched portions 230 and 232 of the upper plate 204 are recessed portions having a predetermined depth compared to other portions. Corresponding to the hatched portions of the lower plate 202, respectively. The liquid coolant flow path 212 is in contact with the upper plate 204 only in a portion adjacent to the gas flow path 208, and in the portion adjacent to the condensation unit 210 and the lower plate 202 adjacent to the lower portion of the heat insulating means 214. The portion 220 provided between the edges and extending between the channel region 216 and the edge of the lower plate 202 adjacent thereto is not in contact with the upper plate 204.
    [107] The area indicated by reference numeral 222 in the upper plate 204 is an area in contact with the portion of the liquid refrigerant passage 212 that extends between the condensation unit 210 and the edge of the lower plate 202 adjacent thereto. The region indicated by 224 is an area in contact with the portion adjacent to the gas flow passage 208 of the liquid refrigerant flow passage 212. In addition, the area indicated by 228 is an area which is in contact with the bent portion and the lower part of the heat insulating means 214, and the area indicated by 226 is a part and the channel area (which is in contact with the channel area 216 under the heat insulating means 214). 216 is in contact with the area.
    [108] While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. For example, one of ordinary skill in the art of the present invention may be provided in a corresponding area inside the top plate instead of having the micro patterns causing the capillary force on the bottom plate. It is also possible to equip the heat insulating means in the corresponding position of the top plate instead of the bottom plate. In addition, a thin film may be provided which connects the evaporation part and the condensation part to the gas flow path and divides the gas flow path into several paths. In addition, various types of thermal insulation means for blocking at least the gas flow path and the liquid refrigerant flow path may be provided in a symmetrical or asymmetrical form. In addition, instead of having a micro pattern in the channel region, a porous medium having a smaller pore may be provided. In addition, the present invention may constitute a predetermined cooling device incorporating endothermic means capable of extracting heat from the condensation unit. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.
    [109] As described above, the heat transfer apparatus according to the present invention includes a heat insulating means between the gas flow path and the liquid coolant flow path in order to prevent the gas from flowing into the liquid coolant flow path and the heat transfer. Therefore, the liquid refrigerant is prevented from evaporating in the process of supplying the liquid refrigerant from the condenser to the evaporator. In addition, a chamber capable of collecting bubbles or non-condensable gas contained in the liquid refrigerant is provided between a portion of the liquid refrigerant passage and the upper plate, thereby preventing the supply of the liquid refrigerant to be interrupted by bubbles or non-condensable gas. In addition, since the micro-patterns are formed in the condensation unit, the liquid refrigerant passage including the channel region, and the evaporation unit to form a capillary force with respect to the liquid refrigerant toward the evaporation unit, the liquid refrigerant passage and the evaporation unit in the condensation unit. The liquid phase refrigerant flows by itself, and even though the flow of the liquid refrigerant is temporarily stopped by dry-out in the process of inflow, the liquid phase is inclined due to the inclination of the capillary force between the condensation unit, the liquid refrigerant passage, and the evaporation unit. The supply of refrigerant will automatically resume. In addition, since the capillary force gradient allows the liquid refrigerant to flow into the evaporator at all times before the operation of the heat transfer device starts, the heat transfer device can be stably operated.
    权利要求:
    Claims (37)
    [1" claim-type="Currently amended] An evaporator in contact with the heat generating element and evaporate the liquid refrigerant absorbing heat transferred from the heat generating element;
    A condensation unit for condensing the gas discharged from the evaporation unit;
    A gas flow path that is a passage through which the gas flowing out of the evaporation unit flows into the condensation unit;
    A liquid refrigerant passage in which the liquid refrigerant flows from the condenser to the evaporator while a part of the liquid refrigerant flows into the channel region; And
    And a lower plate provided with at least one heat insulating means between at least the gas flow path and the liquid coolant flow path to prevent an element that impedes the supply of the liquid coolant from the gas flow path to the liquid coolant flow path.
    And a top plate in contact with some of the elements of the bottom plate, including the thermal insulation means.
    [2" claim-type="Currently amended] The heat transfer apparatus according to claim 1, wherein said heat insulating means is in contact with said channel region.
    [3" claim-type="Currently amended] The heat transfer apparatus according to claim 1, wherein one direction of the evaporator is in contact with the channel region, and all other directions are in contact with the gas flow path.
    [4" claim-type="Currently amended] The heat transfer apparatus according to claim 1, wherein the heat insulation means extends between the evaporator and the liquid coolant flow path to contact the channel region.
    [5" claim-type="Currently amended] The heat transfer apparatus of claim 1, wherein the heat insulation means extends between the condensation unit and the liquid refrigerant passage.
    [6" claim-type="Currently amended] The heat transfer apparatus of claim 5, wherein the liquid refrigerant passage is extended between the condenser and an edge of the lower plate adjacent thereto.
    [7" claim-type="Currently amended] 7. The heat transfer apparatus according to claim 6, wherein the heat insulation means is composed of first and second heat insulation means provided symmetrically.
    [8" claim-type="Currently amended] The heat transfer apparatus of claim 6, wherein the heat insulation means is a single heat insulation means provided side by side with the edge of the lower plate, and has a curved portion.
    [9" claim-type="Currently amended] The heat transfer apparatus according to claim 8, wherein the width of the liquid refrigerant passage provided between the heat insulating means and the edge of the lower plate adjacent thereto is different with respect to the curved portion.
    [10" claim-type="Currently amended] 10. The heat transfer apparatus according to claim 9, wherein the channel region and the evaporator are sequentially provided between a lower portion of the bent portion of the heat insulation means and an edge of the lower plate not adjacent thereto.
    [11" claim-type="Currently amended] The heat transfer apparatus of claim 10, wherein the liquid coolant flow path extends between the channel region and an edge of the lower plate adjacent to the channel region and is in contact with the channel region.
    [12" claim-type="Currently amended] 12. The heat transfer apparatus according to claim 11, wherein a region adjacent to the condensation portion of the liquid refrigerant passage is not in contact with the upper plate.
    [13" claim-type="Currently amended] 13. The heat transfer apparatus according to claim 12, wherein a portion between the lower portion of the curved portion of the heat insulating means and the edge of the lower plate adjacent to the heat insulating means and the portion extending therefrom are in contact with the upper plate.
    [14" claim-type="Currently amended] 14. The heat transfer apparatus according to claim 13, wherein a portion of the heat insulation means that blocks the condenser and the liquid refrigerant passage adjacent thereto is non-contacted with the top plate.
    [15" claim-type="Currently amended] 15. The method of claim 14, wherein the capillary force with respect to the liquid refrigerant gradually increases from the condensation unit, the liquid refrigerant passage, the channel region and the evaporator to the liquid refrigerant passage, the channel region and the evaporator. Heat transfer device, characterized in that micro patterns are formed.
    [16" claim-type="Currently amended] 15. The method of claim 14, wherein the chamber formed between the upper plate and the pattern formed in the non-contacted portion of the liquid refrigerant flow path of the liquid pattern and the upper plate is formed by removing the inside of the upper plate by a predetermined thickness is provided. Heat transfer device.
    [17" claim-type="Currently amended] 17. The heat transfer apparatus according to claim 16, wherein regions corresponding to the evaporation portion, the gas flow path, and the condensation portion of the upper plate are recessed to a predetermined depth relative to other portions.
    [18" claim-type="Currently amended] The heat transfer apparatus of claim 7, wherein the channel region is provided between the evaporator and an edge of the lower plate adjacent thereto.
    [19" claim-type="Currently amended] 19. The heat transfer apparatus of claim 18, wherein a portion of the liquid coolant flow path is in contact with the top plate.
    [20" claim-type="Currently amended] 20. The method of claim 19, wherein the capillary force for the liquid refrigerant gradually increases from the condenser to the liquid refrigerant passage, the channel region, and the evaporator. Heat transfer device, characterized in that micro patterns are formed.
    [21" claim-type="Currently amended] 21. The chamber of claim 20, wherein a chamber is formed by removing a thickness of an inner side of the upper plate between the patterns formed on both sides of the channel region which are not in contact with the upper plate of the liquid coolant flow path and the upper plate among the minute patterns. There is a heat transfer device.
    [22" claim-type="Currently amended] 22. The heat transfer apparatus according to claim 21, wherein the regions corresponding to the evaporation portion, the gas flow path, and the condensation portion of the upper plate are recessed to a predetermined depth relative to other portions.
    [23" claim-type="Currently amended] 6. The heat transfer apparatus according to claim 5, wherein the condensation portion bypasses an upper end of the heat insulation means and is in contact with a liquid coolant flow path provided between the heat insulation means and an edge of the lower plate adjacent thereto.
    [24" claim-type="Currently amended] 24. The heat transfer apparatus according to claim 23, wherein said heat insulation means is a single heat insulation means provided side by side with an edge of an adjacent lower plate and having a bent portion.
    [25" claim-type="Currently amended] 25. The heat transfer apparatus according to claim 24, wherein a part of the liquid refrigerant passage is in contact with the top plate.
    [26" claim-type="Currently amended] 26. The method of claim 25, wherein the capillary force with respect to the liquid refrigerant gradually increases from the condensation unit, the liquid refrigerant passage, the channel region, and the evaporator to the liquid refrigerant passage, the channel region, and the evaporator. Heat transfer device, characterized in that micro patterns are formed.
    [27" claim-type="Currently amended] 27. The method of claim 26, wherein a chamber formed by removing an inner portion of the upper plate by a predetermined thickness is provided between the upper plate and the patterns formed on a portion of the micro-pattern that is not in contact with the upper plate of the liquid refrigerant passage. Heat transfer device.
    [28" claim-type="Currently amended] 24. The heat transfer apparatus according to claim 23, wherein the liquid refrigerant passage is divided into two centers of the channel region.
    [29" claim-type="Currently amended] 29. The apparatus of claim 28, wherein the thermal insulation means comprises: first thermal insulation means for blocking the liquid refrigerant passage and the gas passage provided between the condensation unit and the channel region; And
    And a second heat insulating device provided in a direction perpendicular to the first heat insulating means and blocking the remaining portion of the liquid refrigerant flow path divided into two parts by the evaporation part and the gas flow path and the channel region. .
    [30" claim-type="Currently amended] 30. The heat transfer apparatus according to claim 29, wherein the remaining portion of the liquid refrigerant passage divided into two by the channel region is in contact with the top plate.
    [31" claim-type="Currently amended] 31. The method of claim 30, wherein the capillary force with respect to the liquid refrigerant gradually increases from the condensation unit, the liquid refrigerant passage, the channel region, and the evaporator to the liquid refrigerant passage, the channel region, and the evaporator. Heat transfer device, characterized in that micro patterns are formed.
    [32" claim-type="Currently amended] 32. The method of claim 31, wherein a chamber formed by removing an inner portion of the upper plate by a predetermined thickness is provided between the upper plate and the patterns formed on a portion of the micro-pattern that is not in contact with the upper plate of the liquid refrigerant channel. Heat transfer device.
    [33" claim-type="Currently amended] 30. The heat transfer apparatus as claimed in claim 7 or 29, wherein the first and second thermal insulation means are each a structure having a gap.
    [34" claim-type="Currently amended] 30. The heat transfer apparatus as claimed in claim 7 or 29, wherein the first and second heat insulating means are both barriers made of insulating material.
    [35" claim-type="Currently amended] 30. The heat transfer apparatus according to claim 7 or 29, wherein one of said first and second thermal insulation means is a structure having a gap, and the other is a barrier made of an insulating material.
    [36" claim-type="Currently amended] 25. A heat transfer apparatus as claimed in claim 8 or 24, wherein said single insulation means is a structure having a gap.
    [37" claim-type="Currently amended] 25. The heat transfer apparatus as claimed in claim 8 or 24, wherein the single heat insulating means is a barrier made of insulating material.
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    同族专利:
    公开号 | 公开日
    US20030079865A1|2003-05-01|
    US6698503B2|2004-03-02|
    KR100438825B1|2004-07-05|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2001-10-29|Application filed by 삼성전자주식회사
    2001-10-29|Priority to KR20010066748A
    2003-05-09|Publication of KR20030034926A
    2004-07-05|Application granted
    2004-07-05|Publication of KR100438825B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR20010066748A|KR100438825B1|2001-10-29|2001-10-29|Heat transferring device having adiabatic means|
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