• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The wiring board 1 of this invention has flexibility, and the 1st shield film 18 is connected to the ground wiring 11 in the bottom surface of the opening 14 provided in the cover film 13. Moreover, the 1st shield film 18 is connected to the 2nd shield film 19 through the through-hole 15 which penetrates from the front surface side to the back surface side of the base film 10. FIG. Therefore, the 2nd shield film 19 is connected to the ground wiring 11 via the 1st shield film 18, and the whole wiring board 1 is shielded.
    公开号:KR20030016428A
    申请号:KR10-2003-7001128
    申请日:2001-07-23
    公开日:2003-02-26
    发明作者:우에노요시후미；다끼까와유끼히로
    申请人:소니 케미카루 가부시키가이샤；
    IPC主号:
    专利说明:

    Wiring board {WIRING BOARD}
    [2] Background Art Conventionally, a wiring board having a plurality of wirings arranged in parallel with each other has been widely used as a flat cable.
    [3] Reference numeral 101 in Fig. 15 denotes a conventional flat cable, and a plurality of wirings 112 are arranged in parallel along the longitudinal direction on the elongated base film 111. Ten wirings 112 are shown in this figure.
    [4] Except for both ends of the wiring 112, a cover film 113 is attached to the wiring 112, and a portion of each wiring 112 covered by the cover film 113 becomes the signal portion 122. The part located in the both ends and not covered with the cover film 113 becomes the pad part 121.
    [5] When electrically connecting between electric circuits using this flat cable 101, the pad part 121 located in the one end of the flat cable 101 is connected to one electric circuit, and is located in the other end. The pad portion 121 is connected to the other electrical circuit.
    [6] Each wiring 112 is comprised of copper foil of several tens of micrometers in thickness, and since the wiring 112, the base film 111, and the cover film 113 have flexibility, an electrical circuit is bent while bending the flat cable 101. FIG. It is possible to connect between.
    [7] The flat cable 101 as described above has recently been used in a variety of devices, it is pointed out that the flat cable 101 attracts noise.
    [8] If the entire flat cable 101 is covered with a metal foil, the metal foil can have an electromagnetic shielding action, but the work of connecting the metal foil to the wiring of the ground potential becomes complicated.
    [9] The present invention has been made to solve the problems of the prior art, an object of the present invention is to provide a flat cable with an electromagnetic shield that does not require a connection to the ground wiring.
    [1] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board with an electromagnetic shield, and more particularly, to a wiring board with which the electromagnetic shielding can be easily grounded.
    [24] 1A is a cross-sectional view 1 for explaining the manufacturing process of the wiring board according to the first example of the present invention.
    [25] 1B is a cross-sectional view 2 for explaining the manufacturing process of the wiring board according to the first example of the present invention.
    [26] 1C is a cross-sectional view 3 for explaining the manufacturing process of the wiring board according to the first example of the present invention.
    [27] 1D is a cross-sectional view 4 for explaining the manufacturing process of the wiring board according to the first example of the present invention.
    [28] Fig. 1E is a cross-sectional view 5 for explaining the manufacturing process of the wiring board of the first example of the present invention.
    [29] FIG. 1F is a cross-sectional view 6 for explaining the manufacturing process of the wiring board according to the first example of the present invention.
    [30] Fig. 1G is a cross-sectional view 7 for explaining the manufacturing process of the wiring board of the first example of the present invention.
    [31] Fig. 2 is a plan view corresponding to Fig. 1C.
    [32] 3 is a plan view corresponding to FIG. 1 (d).
    [33] FIG. 4 is an enlarged view of FIG.
    [34] Fig. 5 is an enlarged view of Fig. 2B.
    [35] Fig. 6 is an enlarged plan view corresponding to Fig. 1E.
    [36] Fig. 7 is an enlarged plan view corresponding to Fig. 1F.
    [37] 8 is a plan view for explaining a wiring board according to a second example of the present invention.
    [38] FIG. 9A is a cutaway view taken along the line B 1 -B 1 in FIG. 8.
    [39] FIG. 9B is a sectional view taken along the line B 2 -B 2 in FIG. 8.
    [40] FIG. 9C is a cross-sectional view taken along the line B 3 -B 3 in FIG. 8.
    [41] 10 is a plan view for illustrating a wiring board according to a third example of the present invention.
    [42] FIG. 11A is a sectional view taken along the line C 1 -C 1 in FIG. 10.
    [43] FIG. 11B is a sectional view taken along the line C 2 -C 2 in FIG. 10.
    [44] FIG. 11C is a cross-sectional view taken along the line C 3 -C 3 of FIG. 10.
    [45] FIG. 11D is a cross-sectional view taken along the line C 4 -C 4 of FIG. 10.
    [46] Fig. 12A is a diagram for explaining a manufacturing step 1 of the wiring board of the fourth example of the present invention.
    [47] 12B is a diagram for explaining a manufacturing step (2) of the wiring board of the fourth example of the present invention.
    [48] 12C is a diagram for explaining a manufacturing step 3 of the wiring board of the fourth example of the present invention.
    [49] 12D is a diagram for explaining a manufacturing step 4 of the wiring board of the fourth example of the present invention.
    [50] 12E is a diagram for explaining a manufacturing step 5 of the wiring board of the fourth example of the present invention.
    [51] Fig. 13A is a diagram for explaining a manufacturing step 1 of the wiring board of the fifth example of the present invention.
    [52] Fig. 13B is a diagram for explaining a manufacturing step 2 of the wiring board of the fifth example of the present invention.
    [53] Fig. 13C is a diagram for explaining a manufacturing step 3 of the wiring board of the fifth example of the present invention.
    [54] Fig. 13D is a diagram for explaining a manufacturing step 4 of the wiring board of the fifth example of the present invention.
    [55] Fig. 13E is a diagram for explaining a manufacturing step 5 of the wiring board of the fifth example of the present invention.
    [56] 13F is a diagram for explaining a manufacturing step 6 of the wiring board of the fifth example of the present invention.
    [57] Fig. 13G is a diagram for explaining a manufacturing step 7 of the wiring board of the fifth example of the present invention.
    [58] Fig. 14A is a diagram for explaining a manufacturing step 1 of the wiring board of the sixth example of the present invention.
    [59] Fig. 14B is a diagram for explaining a manufacturing step 2 of the wiring board of the sixth example of the present invention.
    [60] 14C is a diagram for explaining a manufacturing step 3 of the wiring board of the sixth example of the present invention.
    [61] 14D is a diagram for explaining a manufacturing step 4 of the wiring board of the sixth example of the present invention.
    [62] Fig. 14E is a diagram for explaining a manufacturing step 5 of the wiring board of the sixth example of the present invention.
    [63] 14F is a diagram for explaining a manufacturing step 6 of the wiring board of the sixth example of the present invention.
    [64] 15 is a diagram for explaining a wiring board of the prior art.
    [65] In each figure, the code | symbol 1-6 shows a wiring board. Reference numerals 8a to 8f denote the wiring board main body. Reference numerals 10, 20, 30 and 40 represent base films. Reference numerals 11, 11b, 21, 31, and 41 denote ground wires. Reference numerals 12, 22a, 22b, 32, and 42 denote signal wirings. Reference numerals 13, 23, 33 and 43 represent cover films. Reference numerals 14, 14a, 24a, 24b and 44 denote openings. Reference numerals 15, 25, 35 and 45 represent through holes. Reference numerals 18, 28, 38, and 48 represent the first shield film. Reference numerals 19, 29, 39, and 49 denote the second shield film. Reference numeral 61 denotes a wide lead portion. Reference numerals 62a, 62b, 64a, and 64b denote terminal portions. Reference numeral 63 denotes a narrow lead portion.
    [10] The present invention provides a wiring board body having a base film, a plurality of metal wires arranged on the base film, a cover film arranged on a surface of the side on which the metal wires of the base film are arranged, and the wiring board main body. It is a wiring board which has the 1st, 2nd shield film arrange | positioned at the surface of the said cover film side, and the surface on the opposite side, respectively, The said opening is formed in the said cover film in the predetermined position on the said metal wiring, and the said 1st shield film Is connected to the metal wiring exposed under the opening, the wiring board main body is provided with a hole penetrating at least the base film and the cover film, and the first and second shield films are connected to each other through the hole. Wiring board.
    [11] In the present invention, the hole is a wiring board in which the metal wiring also penetrates the cover film and the base film.
    [12] Moreover, in this invention, the said hole and the said opening are a wiring board arrange | positioned in the position which at least one part overlaps.
    [13] In the present invention, the hole is smaller than the opening, and the hole is a wiring board arranged in the opening.
    [14] In addition, the metal wiring is a wiring board disposed on both sides of the base film.
    [15] In the present invention, the metal wiring has a plurality of signal wirings and at least one ground wiring that is wider than the signal wiring, and the opening is a wiring board arranged on the ground wiring.
    [16] Moreover, in this invention, the said signal wiring is a wiring board which has a narrow conductor part and a terminal part connected to the both ends of the said narrow conductor part, and wider than the said narrow conductor part.
    [17] The present invention is also a wiring board having a wide conductive line portion and a terminal portion connected to both ends of the wide conductive line portion and having a narrower width than the wide conductive line portion.
    [18] In the present invention, the ground wiring has a wide conductive line portion and a terminal portion connected to both ends of the wide conductive line portion and having a narrower width than that of the wide conductive line portion. The terminal portion of the wiring is a wiring board formed with approximately the same width.
    [19] Moreover, this invention is the wiring board which the said wide conducting wire part of the said ground wiring penetrated by the said through hole.
    [20] Moreover, another this invention is the wiring board main body which has a base film, the some metal wiring arrange | positioned on the said base film, the cover film arrange | positioned at the surface of the said metal wiring side of the said base film, and the said wiring board main body of It is a wiring board which has the 1st, 2nd shield film arrange | positioned at the surface on the said cover film side, and the opposite surface, respectively, The said base film, the said cover film, and the said metal in the predetermined position on the said metal wiring of the said wiring board main body. A hole penetrating the wiring is provided, a metal film is formed on the inner circumferential surface of the hole, the metal wiring exposed to the inner circumferential surface of the hole and the metal film are connected, and the first and second shield films are connected to each other through the hole. At the same time, at least one shield film is a wiring board connected to the metal film.
    [21] In the wiring board, the metal wiring may be disposed on both surfaces of the base film.
    [22] Since this invention is comprised as mentioned above, the 1st shield film and the ground wiring are connected in the bottom surface of the opening provided in the cover film, and the hole provided in the cover film, and the 1st, 2nd shield film is a hole | hole with a hole. It is connected via.
    [23] Therefore, without providing a special member, the 1st, 2nd shield film is connected to the ground wiring, and a wiring board with easy manufacture and high reliability can be obtained.
    [66] The wiring board of this invention is demonstrated with the manufacturing method.
    [67] Referring to Fig. 1A, reference numeral 10 denotes a base film having a thickness of 10 to 100 µm made of resin such as polyester or polyimide. An adhesive bond layer is formed on the surface of this base film 10, and the copper foil 9 of thickness about 50 micrometers is attached to the surface in which the adhesive bond layer of the base film 10 was formed.
    [68] On the copper foil 9, a resist film 55 patterned as shown in Fig. 1B is formed. An opening 56 is formed in the resist film 55, and a copper foil 9 is exposed on the bottom surface of the opening 56.
    [69] In that state, the copper foil 9 of the part exposed to the bottom surface of the opening 56 by etching is etched away, and after patterning the copper foil 9, the resist film 9 is peeled off.
    [70] 2 is a plan view of a portion of the base film 10 in that state. Reference numeral 7 in FIG. 2 shows a structural unit in which one wiring board is constituted by a process described later, and FIG. 4 is an enlarged plan view of one structural unit 7. FIG. 1C is a cross-sectional view taken along the line A-A of FIG. 1 (d) to (e) which will be described later similarly are cutaway views taken along line A-A of FIGS.
    [71] Here, a plurality of structural units 7 of the wiring board are arranged in a matrix form on one base film 10.
    [72] As shown in Fig. 1 (c), Fig. 2, and Fig. 4, the groove portion 57 is formed by a portion from which the copper foil 9 is removed by etching, and the ground wiring ( 11) and a plurality of signal wires 12 are formed, respectively. The groove portion 57 is separated between the ground wiring 11 and the signal wiring 12.
    [73] In one structural unit 7, one ground wiring 11 and a plurality of signal wirings 12 (eight in this figure) are arranged. The ground wiring 11 and the signal wiring 12 extend in the same direction.
    [74] In general, in a flat cable such as the wiring board of the present invention, one to two ground wires 11 and a plurality of signal wires 12 are provided. The ground wiring 11 and the signal wiring 12 are disposed inside the corner of the base film 10.
    [75] The ground wiring 11 and the signal wirings 12 extend in the same direction, and the ground wirings 11 are arranged at the center position, and four signal wirings 12 are arranged on both sides thereof. Between the ground wiring 11 and the signal wiring 12 and the signal wiring 12 are separated from each other by the groove part 57, and is insulated.
    [76] The ground wiring 11 and the signal wiring 12 each have elongate lead portions 61 and 63 and terminal portions 62a, 62b, 64a and 64b connected to both ends of the lead portions 61 and 63, respectively. .
    [77] The width and length of each terminal part 62a, 62b, 64a, 64b are equal, and about 1 mm and length are about 3 mm here.
    [78] The difference between the width and the length of each of the terminal portions 62a, 62b, 64a, and 64b is the difference between the pattern error and the degree of etching error when the metal foil is etched to form the ground wiring 11 and the signal wiring 12.
    [79] In addition, the space | interval of the adjacent terminal parts 62a, 62b, 64a, and 64b is about 40 to 60% of the width of the conducting-wire part 63 width | variety of the signal wiring 12, and therefore becomes narrower than 1 mm. have.
    [80] The lead portion 61 of the ground wiring 11 is formed to be wider than the width of each terminal portion 62a, 62b, 64a, 64b so as to easily form the through hole 15 described later. It is about 5 mm here.
    [81] On the other hand, the width of the lead portion 63 of the signal wiring 12 is narrower than that of the terminal portions 62a, 62b, 64a, and 64b, and the base film 10 of the base film 10 is avoided so as to avoid the wider lead portion 61. It extends toward the outside.
    [82] In the flat cable like the wiring board of this invention, the width | variety of the terminal parts 62a, 62b, 64a, and 64b cannot be made too narrow in order to ensure electrical connection with the electrical circuit side to be connected. On the other hand, the width | variety of the conducting wire part 63 of the signal wiring 12 can be narrowed to a process limit. Therefore, even when the terminal portions 62a, 62b, 64a, and 64b are arranged as close as possible and arranged horizontally, the conductive lines 63 of the plurality of signal wires 12 are narrowed, whereby the conductive wires of one ground wire 11 are narrowed. The wider the portion 61 is, the more absorbed it is. Therefore, the width of the portion where the conductive portions 61 and 63 are positioned does not become larger than the width of the portion where the terminal portions 62a, 62b, 64a and 64b are located.
    [83] Next, as shown in Fig. 3, the cover film 13 made of a resin such as polyester or polyimide having a thickness of about 10 to 100 µm, and in which an insulating adhesive layer is formed on one side of the base film 10, The ground wiring 11, the signal wiring 12, and the base film 10 are disposed on the surface on which the ground wiring 11 and the signal wiring 12 are formed, and the surface on which the adhesive layer of the cover film 13 is formed while being aligned. ) Is pressed and attached while heating.
    [84] The cover film 13 is provided with a plurality of through holes serving as openings 14 to be described later as through holes penetrating through the thickness direction, and through holes serving as window portions 16 to be described later.
    [85] One through hole serving as the opening 14 is disposed for one structural unit 7. This through hole is circular and has a diameter of about 4 mm smaller than the width of the conducting portion 61 of the ground wiring 11, and is disposed at the same interval as the space where the ground wiring 11 is arranged.
    [86] In addition, two through-holes used as the window part 16 are arrange | positioned with respect to one structural unit 7. This through hole is rectangular, and the distance between the centers of the two through holes is approximately equal to the distance between the terminal portions 62a and 64b on the opposite side to the one of the terminal portions 62a and 64a of the ground wiring 11 and the signal wiring 12. It is.
    [87] One of the two through-holes which is aligned with such a cover film 13 to form the window portion 16 is located at one end of the terminal portions 62a and 64a, and the other is located on the other end of the terminal portions 62b and 64b. When the cover film 13 is attached to the surfaces of the base film 10, the ground wiring 11, and the signal wiring 12 so that the cover film 13 is positioned on the base film 13, the base film 13 is formed on the lead portion 61 of the ground wiring 11. Circular through holes are arranged one by one, and a bottomed opening 14 is formed by the through holes and the ground wiring 11. Therefore, the surface of the lead portion 61 of the ground wiring 11 is exposed on the bottom surface of the opening 14.
    [88] The size of the through hole used as the window portion 16 is larger than the width and length of the portion where the terminal portions 62a, 62b, 64a, 64b of the ground wiring 11 and the signal wiring 12 are located. Accordingly, when the base film 13 is attached, the through-holes disposed at both ends of the ground wiring 11 and the signal wiring 12, the terminal portions 62a, 62b, 64a, and 64b located at the bottom surface thereof, and the base The bottomed window 16 is formed by the surface of the film 13.
    [89] As a result, as shown in FIG. 1D, the base film 10, the ground wiring 11, the signal wiring 12, the cover film 13, and the conductive portion of the ground wiring 11 on the bottom surface. (61) Wiring board main body 8a having an opening 14 through which the surface is exposed, and a window portion 16 with the surface of the terminal portions 62a, 62b, 64a, and 64b exposed on the bottom surface and the surface of the base film 10 exposed. ) Can be obtained.
    [90] Fig. 3 shows a plan view of the state, Fig. 5 is a partially enlarged view of the wiring board main body 8a, and Fig. 1 (d) is a sectional view taken along the line A-A of Fig. 5.
    [91] Since the diameter of the opening 14 is smaller than the width of the conducting wire part 61 of the ground wiring 11 here, the surface of the base film 10 is not exposed.
    [92] Next, as shown in FIGS. 1E and 6, the ground wiring 11 that is exposed to the bottom surface portion of the opening 14 through the bottom surface position of the opening 14 of the wiring board main body 8a. ) And a through hole 15 having a diameter smaller than that of the opening 14 in the base film 10 of the lower layer. In this case, since the through hole 15 having a diameter of about 3 mm is formed by matching the center thereof with the center of the opening 14, the outer periphery of the through hole 15 is located inside the corner of the opening 14, and the The hole 15 is disposed inside the opening 14.
    [93] In the case where the through hole 15 is smaller than the opening 14 and the through hole 15 is located inside the opening 14, the inner periphery of the through hole 15 of the lead portion 61 of the ground wiring 11 is formed. The end face and the end face of the base film 10 are exposed, and only the difference between the diameter of the through hole 15 and the diameter of the opening 14 is grounded around the opening portion on the ground wiring 1 side of the through hole 15. The surface of the lead portion 61 of the wiring 11 is exposed.
    [94] Two shield films in which a conductive adhesive is applied to a rolled copper foil having a thickness of about 20 to 40 µm or the like are prepared, one of which is used as the first shield film 18, and the other is used as the second shield film 19. As shown in Fig. 1 (f) and Fig. 7, the first and second shield films 18 and 19 are attached to the cover film 13 surface and the back surface of the base film 10, respectively.
    [95] Here, the length of the direction in which the ground wiring 11 and the signal wiring 12 extend among the lengths of the first and second shield films 18 and 19 is the same as or shorter than that of the cover film 13, Accordingly, the terminal portions 62a, 62b, 64a, 64b are exposed on the surface, and the first and second shield films 18, 19 do not contact the terminal portions 62a, 62b, 64a, 64b.
    [96] After attaching the 1st, 2nd shield films 18 and 19, the part located on the through-hole 15 of the 1st shield film 18 is pressed.
    [97] Since the diameter of the through hole 15 is very large compared to the thickness of the base film 10, the cover film 13, and the copper foil, when pressed, the first shield film 18 is recessed in the through hole 15 when pressed. A part is attached to the 2nd shield film 19 of the back surface of the base film 10, and the 1st, 2nd shield films 18 and 19 are electrically connected to each other.
    [98] When the first shield film 18 is recessed in the through hole 15, the first shield film 18 is exposed to the lead portion 61 of the ground wiring 11 exposed around the opening of the through hole 15. ) And is electrically connected to the ground wiring 11, and as a result, the second shield film 19 is connected to the ground wiring 11 via the first shield film 18.
    [99] If the 1st, 2nd shield films 18 and 19 are connected to the ground wiring 11, and it cuts and isolate | separates each other for each structural unit 7, the wiring board 1 of the 1st example of this invention can be obtained. .
    [100] The 1st, 2nd shield films 18 and 19, the ground wiring 11, and the signal wiring 12 are comprised by the thin copper foil 9, and the base film 10 and the cover film 13 are thin resin films. Since it is comprised by, each has flexibility. Therefore, this wiring board 1 and the wiring boards 2-6 of each Example of this invention mentioned later have flexibility.
    [101] Moreover, since the structural unit 7 arrange | positioned in matrix form is cut out and isolate | separated from each other, the width | variety of the base film 10 and the cover film 13 of the wiring boards 1-6 of this invention are similarly the same. In addition, the width | variety of the 1st, 2nd shield films 18 and 19 is also the same magnitude | size. Therefore, the signal wiring 12 and the ground wiring 11 are sandwiched by the first and second shield films 18 and 19 even when the wiring boards 1 to 6 are separated from the original plate.
    [102] In addition, since the cutting | disconnection is performed in the position between each structural unit 7, it can be made to not expose the ground wiring 11 or the signal wiring 12 to a cut surface.
    [103] Such a wiring board 1 is used in an electronic device, and terminal portions 62a and 64a positioned at one end are connected to one circuit, and terminal portions 62b and 64b positioned at the other end are the other electronic circuit. When connected to the electronic circuit, the electronic circuit is electrically connected.
    [104] At this time, the terminal portion 63 of the signal wiring 12 is connected to the input / output terminal of the signal of the electronic circuit, and is used for signal transmission, while the terminal portion 61 of the ground wiring 11 is the ground terminal of the electronic circuit. Is connected to the ground potential.
    [105] As a result, the 1st, 2nd shield films 18 and 19 are provided in the ground potential, and are to shield the electromagnetic wave noise which wants to invade the signal wiring 12. As shown in FIG.
    [106] If necessary, as shown in Fig. 1G, the surface of the first and second shield films 18 and 19 may be covered with a resin film so as not to cover the terminal portions 62a, 62b, 64a, and 64b. Durability can be improved by attaching the protective films 51 and 52 which consist of.
    [107] The protective films 51 and 52 may be attached before the wiring board 1 is cut and separated, or may be attached after being separated.
    [108] When attaching after separating, the width | variety is made wider than the width | variety of the 1st, 2nd shield films 18 and 19 using the protective films 51 and 52 which have insulation, and the protective films 51 and 52 When the corner portions are protruded outward in the width direction than the first and second shield films 18 and 19 and the protrusions 53 and 54 are formed at the portions, the first and second shield films 18 and 19 become electrons. The condition is good as there is no possibility of contacting other wiring in the equipment.
    [109] In addition, although the width | variety and length of the said wiring board 1 are various, the thing of the length of the direction in which the ground wiring 11 and the signal wiring 12 were extended, for example, is 10 cm and a width of about 1 cm is used. .
    [110] In the wiring board 1, the wiring board 1 is formed to have a wide width over approximately the entire length of the connection portion 61 of the ground wiring 11, but only the portion where the opening 14 is provided is formed wide, and the other portion is connected to the signal wiring ( It is good also as a width similar to the conducting-wire part 63 of 12). In short, a part of the ground wiring 11 may be exposed on the bottom surface of the opening 14.
    [111] In the wiring board 1 of the first embodiment, the outer circumference of the through hole 15 is located inside the corner of the opening 14, and the through hole 15 is disposed inside the opening 14. And the through hole 15 and the opening 14 are formed at least partially overlapping each other so that at least a part of the ground wiring 11 is exposed at the bottom of the opening 14, and the hole 15 is formed on the wiring board main body 8a. If it penetrates from the front surface to the back surface, it is contained in the wiring board 1 of this invention.
    [112] Next, the wiring board of the 2nd example of this invention is demonstrated. 8 is a plan view of the wiring board 2, and the same reference numerals are given to the same members as the wiring board 1 of the first example, and description thereof is omitted.
    [113] In the wiring board 1 of the first example, the through hole 15 is formed inside the opening 14, whereas in the wiring board 2, the opening 14a of the cover film 13 is the ground wiring 11. The through hole 15a is formed at a position different from the opening 14a. The through hole 15a penetrates the cover film 13, the wide conductor portion 61 of the ground wiring 11, and the base film 10.
    [114] A cutaway view of the wiring board 2 shown in Fig. 8 is shown in Figs. 9A to 9C. 9A is a cross-sectional view taken along line B 1 -B 1 which is a position at which the through hole 15a is cut, and FIG. 9B is a cross-sectional view taken along a line B 2 -B 2 at a position that cuts the opening 14a. 9C is a cross-sectional view taken along line B 3 -B 3 at a position at which a portion where the opening 14a and the through hole 15a are not disposed is cut.
    [115] Reference numeral 8b in Figs. 9A to 9C shows a wiring board body including the base film 10, the ground wiring 11, the signal wiring 12, and the cover film 18. Figs.
    [116] The first shield film 18 attached on the cover film 13 is connected to the ground wiring 11 at a portion exposed to the bottom surface of the opening 14a, and the first shield film 18 is formed with a through hole ( It is recessed in 15a and is connected to the 2nd shield film 19 attached to the base film 10 at the bottom surface position of the through-hole 15a.
    [117] Similarly to the wiring board 1 of the first example, in the wiring board 2 of the second example, the first shield film 18 attached on the cover film 13 is directly connected to the ground wiring 11, and the base film is provided. The second shield film 19 attached to (10) is connected to the ground wiring 11 via the first shield film 18.
    [118] In addition, the through hole 15 is formed in the opening 14 in the wiring board 1 of the first example, and the position spaced apart from the opening 14a and the through hole 15a in the wiring board 2 of the second example. Although it was formed in, the opening and the through hole may be formed so as to overlap only a part.
    [119] Next, the wiring board of the 3rd example of this invention is demonstrated. Reference numeral 3 in Fig. 10 shows a wiring board of the third example. The wiring board 3 of this 3rd example also attaches | subjects the same code | symbol to the member same as the wiring board 1 of a 1st example, and abbreviate | omits description.
    [120] In the wiring board 3 of this third example, the lead portion 61b of the ground wiring 11b has a wide portion and a narrow portion, and the opening 14b of the cover film 13 has a wide width. It is arrange | positioned on a part, and the surface of the conducting-wire part 61b is exposed on the bottom surface.
    [121] In addition, after the cover film 13 is attached to the surface of the ground wiring 11b or the signal wiring 12b side of the base film 10, the wiring board 3 is connected to the ground wiring 11b or the signal wiring 12b. ), That is, the position where the conductive portion 61b of the ground wiring 11b is narrowed and the position between the adjacent signal wiring 12b is drilled, and the cover film 13 and the base film ( The through hole 15b penetrating 10 is formed.
    [122] 11 is a cross-sectional view of the wiring board 3 shown in FIG.
    [123] FIG. 11A is a cross-sectional view taken along the line C 1 -C 1 in a wide portion of the conductive portion 61b of the ground wiring 11 and in which the opening 14b is not disposed. FIG. ) Is a C 2 -C 2 cutaway view in which the opening 14b is cut, FIG. 11C is a C 3 -C 3 cutaway in which the through holes 15b are cut, (d) in FIG. Figure 4 is a sectional view taken along the line C - the wire section (61b) has a width narrow portion is formed, the through-hole (15b) is not disposed in position C 4. Reference numeral 8c in Figs. 11A to 11D shows a wiring board body including the base film 10, the ground wiring 11, the signal wiring 12, and the cover film 18. Figs.
    [124] In the wiring board 3 of the third example, similarly to the wiring boards 1 and 2 of the first and second examples, the first shield film 18 attached on the cover film 13 is disposed at the bottom surface of the opening 14a. The second shield film 19 directly connected to the ground wiring 11 and attached to the base film 10 is connected to the ground wiring 11 via the first shield film 18.
    [125] Although the wiring boards of the first to third examples were single-sided flat cables, the wiring board of the present invention also includes a double-sided flat cable.
    [126] 12A to 12E are cross-sectional views for explaining a step of manufacturing a double-sided flat cable included in the present invention. With reference to Fig. 12A, a ground wire 21 having a wide conducting portion and a conducting wire are provided on the surface side of the base film 20 made of the same resin as the base film 10 of the first embodiment to the third embodiment. A narrow additional signal line 22a is provided. Moreover, the signal wiring 22b with a narrow conducting wire part is provided in the back surface side of the base film 20. As shown in FIG. The grooves 66a and 66b are separated from each other between the signal wires 22a on the front side, between the signal wires 22a and the ground wire, and between the signal wires 22b on the back side.
    [127] From this state, first, as shown in Fig. 12B, two cover films 23a and 23b having openings 24a and 24b are formed on the surface of the ground wiring 21 with the openings 24a and 24b. And it is aligned so that it may be located in the back surface, and it attaches to the front surface side and the back surface side of the base film 20, respectively, and forms the wiring board main body 8d.
    [128] In this wiring board main body 8d, the surface of the ground wiring 21 is exposed on the bottom surface of the opening 24a of the surface side cover film 23a of the base film 20.
    [129] Next, as shown in Fig. 12C, the bottom surface of the opening 24a is formed in the portion constituting the wiring board main body 8d, and the opening 24a is formed in the ground wiring 21 and the base film 10. Figs. ), A through hole 25 having a smaller diameter is formed. In this state, the front and back surfaces of the base film 20 penetrate through the openings 24a and 24b and the through holes 25 at the bottom surface positions thereof.
    [130] Subsequently, as shown in Fig. 12 (d), the first and second shield films 28 and 29 made of metal foil are attached to the cover films 23a and 23b, respectively, and the first on the ground wiring 21 is formed. When the first shield film 28 is pressed and recessed in the hole formed by the openings 24a and 24b and the through holes 25, the first shield film 28 is exposed to the ground wire 21 exposed at the bottom surface of the opening 24a. It is attached to the surface of the and connected electrically.
    [131] At this time, when the back side second shield film 29 of the base film 20 is recessed in the opening 24b, the first and second shield films 28 and 29 are attached to each other and electrically connected. As a result, the second shield film 29 on the back side of the base film 20 is also electrically connected to the ground wiring 21 to obtain the shielded wiring board 4 having the signal wirings 22a and 22b disposed on both sides. Can be.
    [132] Here, although both the 1st, 2nd shield films 28 and 29 were recessed, only the 1st shield film 28 may be recessed and may be connected to the ground wiring 21 and the 2nd shield film 29. FIG.
    [133] On the 1st, 2nd shield films 28 and 29 of this wiring board 4, as shown in FIG.12 (e), protective films 61 and 62 can be affixed. Reference numerals 73 and 74 denote portions that protrude from the first and second shield films 28 and 29 of the protective films 61 and 62. In this wiring board 4, the terminal portions of both ends of the ground wiring 21 and the signal wiring 22 are exposed.
    [134] Next, the wiring board of the 5th example of this invention is demonstrated with the manufacturing method.
    [135] Referring to Fig. 13 (a), copper foil is attached onto the base film 30 made of resin and patterned by etching, and the wiring line portion has a wide ground wire 31 and the signal line portion has a narrow signal wiring 32. To form. Between the ground wiring 31, the signal wiring 32, and the signal wiring 32 comrades are isolate | separated from each other by the groove part 76 which is a removal part of copper foil.
    [136] As shown in Fig. 13B, the cover film 33 is attached to the surface of the base film 30 on which the ground wiring 31 and the signal wiring 32 are formed, and the wiring board main body 8e is attached. To produce. In the wiring board main body 8e, the terminal portions at both ends of the ground wiring 31 and the signal wirings 32 are exposed, but the conductive portions connecting the terminals at both ends are covered with a cover film 33.
    [137] Subsequently, as shown in Fig. 13C, resist films 34a and 34b are attached to both surfaces of the wiring board main body 8e, and as shown in Fig. 13D, the wiring board is shown. In the main body 8e, the part where the ground wiring 31 and the cover film 33 are laminated | stacked is drilled, and the hole 35 smaller than the width | variety of the ground wiring 31 is formed. This hole 35 penetrates the resist films 34a and 34b, the cover film 33, the ground wiring 31, and the base film 30. As shown in FIG.
    [138] In this state, the catalyst films such as carbon particles are immersed in the plating pretreatment liquid dispersed therein, and then the resist films 34a and 34b are peeled off. After immersion in the copper plating solution, copper grows on the inner circumferential surface of the hole 35. Reference numeral 37 in FIG. 13E indicates a metal film made of copper grown on the inner circumferential surface of the hole 35. Since the cut surface of the ground wiring 31 is exposed on the inner circumferential surface of the hole 35, and the metal film 37 grows on the surface including the cut surface of the ground wiring 31, the metal film 37 is connected to the ground wiring ( 31) is electrically connected.
    [139] Subsequently, as shown in Fig. 13F, the first and second shield films 38 and 39 are attached to the surfaces of the cover film 33 and the base film 30, respectively, or either When the parts on the holes 35 of both the first and second shield films 38 and 39 are pressed and recessed in the holes 35, the first and second shield films 38 and 39 are attached to each other. Electrically connected.
    [140] At this time, the first and second shield films 38 and 39 are connected to the metal film 37 at the surface of the opening portion of the hole 35, and the recessed first shield film 38 is formed of the hole 35. It is connected to the metal film 37 in the inner peripheral surface, and the wiring board 5 with a shield can be obtained.
    [141] The protective films 71 and 72 can also be attached to the surface of the wiring board 5 of the fifth example as shown in Fig. 13G. In addition, the protrusions 83 and 84 may be provided on the insulating protective films 71 and 72.
    [142] In addition, in the wiring board 5 of the fifth example and the wiring boards 1 to 4 of the first to fourth examples, the holes 35, 15 and 25 are formed in the ground wirings 31, 11 and 21, but the holes ( You may form 35, 15, and 25 so that a part of ground wiring 31, 11, 21 may be cut out.
    [143] The wiring board 5 of the fifth example and the wiring boards 1 to 3 of the first to third examples are similar to the wiring board 4 of the fourth example, and the signal wiring 12 is formed on both surfaces of the base films 30 and 10. , 32) can be installed. The ground wires 11, 11b, 31 may be provided on both sides.
    [144] Next, the manufacturing method of the wiring board of a 6th example of this invention is demonstrated.
    [145] Referring to Figs. 14A to 14F, first, the copper foil 9 is attached onto the same base film 40 as in the above embodiments (Fig. 14A), and the copper foil 9 is removed. Pattern. Reference numerals 41 and 42 in Fig. 14B show ground wires and signal wires in the same pattern as those in Figs. 2 to 4, and are separated by the grooves 67. Figs.
    [146] After patterning, a wide portion of the ground wiring 41 is drilled to form the through hole 45 shown in Fig. 14C. This through hole 45 penetrates the ground wiring 41 and the base film 40.
    [147] In this state, as shown in FIG. 14 (d), the copper plating film 47 is grown on the surface and side surfaces of the ground wiring 41 and the signal wiring 42. As shown in FIG.
    [148] Subsequently, a window portion made of a resin film of the same material as that of each of the first to fifth embodiments described above to expose the terminal portions of the ground and signal wirings 41 and 42, and the through holes 45 in addition to the window portions. A cover film 43 having an opening 44 having the same diameter as or larger than that of the opening 44 is prepared and positioned so that the opening 44 is positioned over the through hole 45, and the cover film 43 is connected to the signal wiring ( 41 and 42 and the base film 40 exposed therebetween to form a wiring board main body 8f (Fig. 14 (e)).
    [149] In this state, the opening 44 and the through hole 45 penetrate from the front surface of the wiring board main body 8f to the rear surface, and as shown in FIG. 14 (f), on both sides of the wiring board main body 8f. When the 1st, 2nd shield films 48 and 49 in which the conductive adhesive layer was formed were attached, respectively, and the 1st shield film 48 was recessed in the hole comprised by the opening 44 and the through-hole 45, this invention The wiring board 6 of can be obtained.
    [150] Since the copper plating layer 47 is formed in the cut surface of the ground wiring 41 exposed on the inner circumferential surface of the through hole 45, the first shield film 48 is at least a part of the through hole inner circumferential surface 45, or the opening 44. Is connected to the copper plating layer 47 at the portion of the surface of the ground wiring 41 located on the bottom surface.
    [151] Since the first shield film 48 and the second shield film 49 are attached to each other at the bottom surface position of the through hole 45, both of the first and second shield films 48 and 49 are connected to the ground wiring ( 41). A protective film may be attached to the surfaces of the first and second shield films 48 and 49.
    [152] Instead of the copper plating layer 47, a desired metal plating layer such as gold, platinum, or solder can be used.
    [153] The wiring boards 1-6 demonstrated above are flat cables with flexibility, and can be bent freely as long as it is not bent.
    [154] Although metal foil was used for the shielding film in each Example, this invention is not limited to this, What is necessary is just a film which has electroconductivity. The wiring film is not limited to copper, but may have conductivity. For example, aluminum or the like can be used.
    [155] In addition, although the wiring board in which the some wiring was insulated from each other was demonstrated above, the flexible wiring board in which some wiring was mutually connected, and the wiring board which joined the other wiring board to the wiring board of this invention are also this invention. Included in
    [156] Since the shield film provided at ground potential can be easily arrange | positioned at both sides of wiring, a manufacturing process becomes simple.
    权利要求:
    Claims (12)
    [1" claim-type="Currently amended] A wiring board body having a base film, a plurality of metal wires disposed on the base film, and a cover film disposed on a surface of the side on which the metal wires of the base film are disposed;
    It is a wiring board which has the said 1st, 2nd shield film arrange | positioned at the said cover film side surface of the said wiring board main body, and the opposite side surface, respectively,
    An opening is formed in a predetermined position on the metal wiring in the cover film, the first shield film is connected to the metal wiring exposed under the opening,
    The wiring board main body is provided with a through hole penetrating at least the base film and the cover film, and the first and second shield films are connected to each other via the hole.
    [2" claim-type="Currently amended] The wiring board according to claim 1, wherein the through hole penetrates through the metal wiring in the cover film and the base film.
    [3" claim-type="Currently amended] The wiring board according to claim 2, wherein the through hole and the opening are disposed at a position where at least a portion of the through hole overlaps.
    [4" claim-type="Currently amended] The wiring board according to claim 3, wherein the through hole is smaller than the opening, and the through hole is disposed in the opening.
    [5" claim-type="Currently amended] The wiring board according to claim 1, wherein the metal wirings are arranged on both sides of the base film.
    [6" claim-type="Currently amended] 2. The metal wire according to claim 1, wherein the metal wire has a plurality of signal wires, and at least one ground wire having at least a central portion wider than the signal wires.
    And the opening is disposed on the ground wiring.
    [7" claim-type="Currently amended] 7. The wiring board according to claim 6, wherein the signal wiring has a narrow conductor portion and a terminal portion connected to both ends of the narrow conductor portion and having a width wider than that of the narrow conductor portion.
    [8" claim-type="Currently amended] 7. The wiring board according to claim 6, wherein the ground wiring has a wide lead portion and a terminal portion connected to both ends of the wide lead portion and narrower than the wide lead portion.
    [9" claim-type="Currently amended] 8. The grounding wire according to claim 7, wherein the ground wire has a wide lead portion and a terminal portion connected to both ends of the wide lead portion, the terminal portion being narrower than the wide lead portion, and the terminal portion and the ground of the signal wire. A wiring board, characterized in that the terminal portion of the wiring is formed to have substantially the same width.
    [10" claim-type="Currently amended] The wiring board according to claim 8, wherein the wide conductive wire portion of the ground wiring penetrates through the through hole.
    [11" claim-type="Currently amended] With base film,
    A plurality of metal wires disposed on the base film;
    A wiring board main body having a cover film disposed on a surface of the base film on the metal wiring side;
    It is a wiring board which has the said 1st, 2nd shield film arrange | positioned at the said cover film side surface of the said wiring board main body, and the opposite side surface, respectively,
    A through hole penetrating the base film, the cover film, and the metal wiring is provided at a predetermined position on the metal wiring of the wiring board main body.
    A metal film is formed on an inner circumferential surface of the through hole, and the metal wire exposed to the inner circumferential surface of the through hole is connected to the metal film.
    The first and second shield films are connected to each other via the through hole, and at least one shield film is connected to the metal film.
    [12" claim-type="Currently amended] The wiring board according to claim 11, wherein the metal wirings are arranged on both sides of the base film.
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    同族专利:
    公开号 | 公开日
    US6777622B2|2004-08-17|
    WO2002011501A1|2002-02-07|
    CN1674759A|2005-09-28|
    JP3565768B2|2004-09-15|
    HK1080674A1|2008-08-15|
    HK1057959A1|2006-11-24|
    JP2002043708A|2002-02-08|
    CN1251561C|2006-04-12|
    CN1444837A|2003-09-24|
    US20030112617A1|2003-06-19|
    TW490681B|2002-06-11|
    CN100338978C|2007-09-19|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-07-27|Priority to JP2000226495A
    2000-07-27|Priority to JPJP-P-2000-00226495
    2001-07-23|Application filed by 소니 케미카루 가부시키가이샤
    2001-07-23|Priority to PCT/JP2001/006329
    2003-02-26|Publication of KR20030016428A
    优先权:
    申请号 | 申请日 | 专利标题
    JP2000226495A|JP3565768B2|2000-07-27|2000-07-27|Wiring board|
    JPJP-P-2000-00226495|2000-07-27|
    PCT/JP2001/006329|WO2002011501A1|2000-07-27|2001-07-23|Wiring board|
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