Method of cooling devices

专利摘要:
The present invention is to extend the life of the device by reducing the temperature difference of the plurality of devices mounted on the printed circuit board without increasing the air flow rate of the cooling gas. In a cooling method of a plurality of driver ICs having a heat sink in which a plurality of heat dissipation fins are arranged in parallel with each other, the heat dissipation fins being positioned at an inclination angle θ with respect to the discharge direction of the cooling gas. It is.
公开号:KR20020087885A
申请号:KR1020020026712
申请日:2002-05-15
公开日:2002-11-23
发明作者:이토요치
申请人:안도덴키 가부시키가이샤；
IPC主号:

专利说明:

Cooling Method of Devices {METHOD OF COOLING DEVICES}
[7] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cooling a device, and more particularly, to a technique for cooling a plurality of devices installed in a straight line on a printed circuit board (PCB).
[8] In the case of using a large number of electronic devices having a large power capacity, each device is mounted on a heat sink and provided on a printed board with a predetermined interval therebetween. In addition, in such a case, when sufficient heat dissipation performance by a heat sink cannot be obtained, each heat sink is forcibly cooled by releasing the gas for cooling to each heat sink using a fan or the like.
[9] However, according to the conventional forced cooling method, it is difficult to uniformly cool a plurality of devices, and there is a problem that deterioration is faster than devices that are not sufficiently cooled. The reason for this is that a sufficient amount of cooling gas is not released to the heat sink (device) located further downstream of the cooling gas. As a simple solution to this problem, it is conceivable to enlarge the fan to increase the air volume of the gas for cooling, but it causes secondary problems such as an increase in power consumption and noise.
[10] This invention is made | formed in order to solve the above-mentioned problem, and it aims at reducing the temperature difference of the apparatus installed in multiple numbers, and extending the life of the whole device, without increasing the air volume of the gas for cooling.
[1] 1 is a device layout diagram according to a preferred embodiment of the present invention.
[2] Fig. 2 is a temperature characteristic diagram of each driver IC 4A to 4H when the inclination angle θ is set to 30 degrees.
[3] <Explanation of symbols for the main parts of the drawings>
[4] 1: Printed circuit board 2A-2H: Heat sink
[5] 3: Heat dissipation fins 4A to 4H: Driver IC (device)
[6] A: Mounting direction of cooling air (cooling gas)
[11] In order to achieve the above object, in the present invention, in the method of cooling a plurality of devices continuously provided on a printed circuit board (PCB) having a heat sink in which a plurality of heat dissipation fins are arranged in parallel with each other, The radiating fins are installed at a predetermined inclination angle θ with respect to the discharge direction of the gas for cooling.
[12] The present invention employs the second means, which is a driver IC for outputting a test signal to the device under test in the test head of the semiconductor integrated circuit test apparatus.
[13] The present invention employs third means in which the driver ICs in the second means are stacked in a row on a printed circuit board, and the cooling gas is discharged from a predetermined direction along the surface of the printed circuit board.
[14] The present invention employs fourth means in which the heat sink is mounted on the device by a heat conductive adhesive.
[15] The present invention employs the fifth means wherein the gas for cooling is air in any of the first to fourth means.
[16] The present invention employs the sixth means having an inclination angle θ of 30 degrees in any one of the first to fifth means.
[17] Referring to the drawings, a method of cooling a device according to a preferred embodiment of the present invention is described. In the above preferred embodiment, the present invention is applied to cooling for a driver IC installed in a test head of a semiconductor integrated circuit test apparatus. A plurality of driver ICs are provided in the test head to output a test signal to each terminal of the device under test (DUT).
[18] 1 is a device arrangement diagram according to a preferred embodiment of the present invention. In Fig. 1, reference numeral 1 denotes a printed circuit board, numerals 2A to 2H denote heat sinks, numeral 3 denotes a heat sink fin, numerals 4A to 4H denote driver ICs, and numeral A denotes cooling. The discharge direction of air (cooling gas).
[19] As shown in FIG. 1, the printed circuit board 1 is formed in a rectangular shape, and a plurality of driver ICs 4A to 4H having heat sinks 2A to 2H attached thereto are formed on the printed circuit board ( It is loaded in 1 line.
[20] In the heat sinks 2A to 2H, a plurality of heat dissipation fins 3 are arranged in parallel with each other, and are attached to the surfaces of the respective driver ICs 4A to 4H through silicon glass or a thermally conductive adhesive. By using the silicone glass or the thermally conductive adhesive, each of the heat sinks 2A to 2H and each of the driver ICs 4A to 4H is in a tightly connected heat connected state.
[21] As shown, the heat sinks 2A to 2H are positioned so that the heat dissipation fins 3 are inclined angle θ with respect to the discharge direction A of the cooling gas, and are attached to the respective driver ICs 4A to 4H. . The positioning of each of the heat sinks 2A to 2H with respect to the discharge direction A of the cooling air is a feature of the present invention.
[22] The heat radiating fins 3 are formed in the heat sinks 2A to 2H as protrusions arranged in parallel with each other at predetermined intervals as is well known, and efficiently radiate heat generated by the driver ICs 4A to 4H. As described above, the driver ICs 4A to 4H output test signals (pattern signals) to respective terminals of the device under test, and the amount of heat generated during operation is relatively large. Therefore, in order to operate the driver ICs 4A to 4H with predetermined performance, the heat sinks 2A to 2H need to be attached to the driver ICs 4A to 4H.
[23] In other words, as described above, the discharge direction A of the cooling air corresponds to the arrangement direction of the driver ICs 4A to 4H provided in a row on the printed circuit board 1, that is, the driver ICs 4A to 4A. 4H) is set parallel to the arrangement direction. Next to the printed circuit board 1, a fan for discharging cooling air to the driver ICs 4A to 4H is provided. By the operation of the fan, cooling air is discharged to each driver IC 4A to 4H from a direction parallel to the arrangement direction of the driver ICs 4A to 4H along the surface of the printed circuit board 1.
[24] According to a preferred embodiment of the present invention, since the direction of the heat dissipation fins 3 is inclined at an inclination angle θ with respect to the discharge direction A of the cooling air, the heat dissipation fins of the heat sinks 2A to 2H It passes through 3) relatively uniformly. That is, as for the cooling air, compared with the case where the heat radiation fins 3 of each of the heat sinks 2A to 2H are all set in parallel to the discharge direction of the cooling air, each of the heat sinks 2A to 2H. Since heat is uniformly removed from each other, the temperature of each driver IC 4A to 4H becomes uniform.
[25] Fig. 2 is a temperature characteristic diagram showing the temperature measurement values of the respective driver ICs 4A to 4H when the inclination angle θ is set to 30 degrees in comparison with the prior art. In Fig. 2, reference numeral T1 denotes a temperature characteristic of the preferred embodiment, and reference numeral T2 denotes a temperature characteristic of the prior art. Although the difference between the highest temperature and the lowest temperature of the driver ICs 4A to 4H is 20 degrees in this embodiment, it is 29 degrees in the prior art. That is, as a result of suppressing the temperature rise of the driver IC (for example, the driver ICs 4E to 4H) located further downstream of the cooling air, in this embodiment, the temperature difference between the highest temperature and the lowest temperature is It is 9 degrees lower than technology.
[26] Although the present invention is applied to the cooling of the driver ICs 4A to 4H provided in the test head, the scope of application of the present invention is not limited to the above embodiment. Any of a plurality of devices continuously installed on the printed circuit board in the state where the heat sink is attached can be applied to the cooling of various devices. Moreover, the present invention can also be applied to devices installed on substrates other than printed circuit boards.
[27] As described above, according to the present invention, the cooling gas can uniformly collide with each of the heat dissipation fins of the heat sink of each device without increasing the air volume of the cooling gas. Therefore, since it becomes possible to keep each device at a more uniform temperature, the improvement of the electrical performance of a device and the lifetime of a device are extended.

权利要求:
Claims (6)
[1" claim-type="Currently amended] A cooling method of a plurality of devices continuously provided on a printed circuit board having a heat sink in which a plurality of heat sink fins are arranged in parallel with each other,
Wherein each of the heat dissipation fins is positioned at a predetermined inclination angle θ with respect to the discharge direction of the gas for cooling.
[2" claim-type="Currently amended] The method of claim 1, wherein the device is a driver IC used in a test head of a semiconductor integrated circuit test apparatus for outputting a test signal to a device under test.
[3" claim-type="Currently amended] 3. The method of claim 2, wherein the driver ICs are installed in a line on a printed circuit board, and cooling gas is discharged along the surface of the printed circuit board from a given direction.
[4" claim-type="Currently amended] 4. A method according to any one of claims 1 to 3, wherein the heat sink is installed in the device by a thermally conductive adhesive.
[5" claim-type="Currently amended] The device cooling method according to any one of claims 1 to 4, wherein the cooling gas is air.
[6" claim-type="Currently amended] 6. The device cooling method according to any one of claims 1 to 5, wherein the inclination angle θ is set to 30 degrees.

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同族专利:

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公开号 | 公开日

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JP2002343912A|2002-11-29|

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US20020170702A1|2002-11-21|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2001-05-16|Priority to JPJP-P-2001-00146613

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2001-05-16|Priority to JP2001146613A

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2002-05-15|Application filed by 안도덴키 가부시키가이샤

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2002-11-23|Publication of KR20020087885A

优先权:

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申请号 | 申请日 | 专利标题

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JPJP-P-2001-00146613|2001-05-16|

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JP2001146613A|JP2002343912A|2001-05-16|2001-05-16|Device cooling method|