band clip device for leaf spring

专利摘要:
The present invention relates to a band clip device of a leaf spring, and interposed between a plurality of layers of plate spring forming plate spring to change the installation of the shock absorbing pad to reduce the friction between the plates to compensate for the wear of the shock absorbing pad plate The purpose is to reduce the noise generated by the friction between the plates during the damping action of the spring. In order to achieve the above object, the present invention provides a plate member 12 stacked in layers in a plurality of bands having different lengths, and a band clip configured to provide a restraining force by loading the plate members 12 in layers therein. In the leaf spring including 14, the opposite side portions 14a of the band clip 14 extend through the member and individually penetrate to the positions between the plate members 12 arranged in layers. A plurality of mounting holes 14b are formed, and a buffer pad 20 made of a flexible material is inserted into the mounting hole 14b, and the end of the buffer pad 20 is installed between the plates 12. It is characterized by.
公开号:KR20020030405A
申请号:KR1020000061021
申请日:2000-10-17
公开日:2002-04-25
发明作者:이기호
申请人:이계안；현대자동차주식회사；
IPC主号:

专利说明:

Band clip device for leaf spring
[10] The present invention relates to a band clip device of a leaf spring, and more particularly, to reduce the noise and damping characteristics due to the friction between the plate of the running plate spring to compensate for the wear of the buffer pad to prevent the friction between the plate spring. It relates to a band clip device of the leaf spring to prevent the.
[11] In general, the suspension system of the car is connected between the axle and the body so that the vibration or shock received from the road surface is not directly transmitted to the body while driving, thereby improving the ride comfort while preventing damage to the body and the loaded cargo. As an apparatus, it is composed of a chassis spring for mitigating an impact from a road surface, a shock absorber for controlling the free vibration of the chassis spring to improve ride comfort, a stabilizer bar for preventing rolling of the vehicle, and the like.
[12] Here, the chassis spring to mitigate the impact from the road surface is mostly a coil spring in the case of a passenger car, but in the case of a medium or large truck or more, a leaf spring is mainly used.
[13] On the other hand, the leaf spring is formed in the form of a layer formed by bending a plurality of band-shaped spring steel of different lengths, that is, the leaf spring 10 is shown in Figs. The band-shaped plates 12 of different lengths are stacked in a layer in a state of being slightly bent, and both portions are assembled in a band clip 14 having a cross section bent in a substantially "c" shape. An upper end portion of the upper portion 14 is fastened to each other via the bolt 16 and the nut 18 and has a structure capable of restraining the plurality of plate members 12 assembled therein.
[14] Accordingly, when the shock or vibration received from the tire from the road surface is transmitted to the axle, the leaf spring 10 absorbs or alleviates the vibration or shock transmitted to the axle in the middle of the vehicle body. It is to suppress transmission and to improve riding comfort.
[15] In addition, a buffer pad 20 made of a flexible material, such as rubber, is interposed between the plurality of layers of the plate 12 constituting the leaf spring 10, the buffer pad 20 is the leaf spring When (10) attenuates by shock or vibration transmitted from the road surface while driving, noise is prevented by mitigating the friction generated between the plates 12.
[16] However, as described above, the buffer pads 20 interposed between the plurality of plate members 12 are subjected to the friction force transmitted from the plate member 12 as the plate spring 10 receives compression load and repeats compression and expansion. As the wear of the shock absorbing pad 20 progresses, the shock absorbing pad 20 decreases in thickness due to lack of durability, and thus, the shock absorbing pad 20 interposed between the sheet 12 is made of sheet material. There is a problem of being separated from (12).
[17] Accordingly, the present invention has been made in view of the above-mentioned, by changing the installation of the buffer pad to reduce the friction between the plates interposed between the multiple layers of plate forming the leaf spring to compensate for the wear of the buffer pad The purpose of the present invention is to provide a band clip device of a leaf spring to reduce the noise generated by the friction between the plates during the damping action of the leaf spring.
[18] The present invention for achieving the above object is a plate spring including a plurality of strips of different lengths stacked in the form of a layer, and a band clip configured to provide a restraining force by loading the plate in a layer therein. In the opposite sides of the band clip, a plurality of mounting holes are formed, which extend through the members and are individually penetrated to the positions between the plate members arranged in layers in the end. In addition to the pad is inserted, the end of the buffer pad is characterized in that it is installed between each of the plate.
[1] 1 is a state diagram showing a leaf spring of a conventional general form.
[2] Figure 2 is a cross-sectional view showing a fastening portion of the conventional band clip shown in FIG.
[3] Figure 3 is a cross-sectional view showing a state in which the band clip device according to the invention is fastened on the leaf spring, the corresponding view of FIG.
[4] 4 is a plan view of FIG.
[5] <Description of Symbols for Main Parts of Drawings>
[6] 10-plate spring 12-plate
[7] 14-band clip 14a-opposite
[8] 14 b-mounting hole 16-bolt
[9] 18-nut 20-buffer pad
[19] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[20] 3 is a cross-sectional view showing a state in which the band clip device according to the present invention is fastened on the leaf spring, a corresponding view of Figure 2, Figure 4 is a plan view of FIG.
[21] In the present invention, as shown in the figure, in the leaf spring 10 is formed by stacking a plurality of strip-shaped plate material 12 of different lengths in a layered form, the cross-section at both ends of the leaf spring (10) A band clip 14 bent in a substantially "c" shape is assembled with a plurality of plate members 12 stacked in layers, and an upper end portion of the band clip 14 opposite to the bolt 16 and a nut ( 18) to be bound to each other through a plurality of plates 12 assembled therein.
[22] The opposite side portions 14a of the band clip 14 each have a plurality of installation holes 14b extending through the members and penetrating to the positions between the plate members 12 arranged in the layered manner. A buffer pad 20 made of a flexible material such as rubber is inserted into the installation hole 14b and accommodated in the space between the plate members 12.
[23] Here, the plurality of installation holes 14b formed on both opposing portions 14a of the band clip 14 are preferably formed at positions shifted along the thickness direction of the member, and ends of each installation hole 14b. Is formed at a position corresponding to the position between each of the plate members 12 arranged in layers.
[24] In addition, the shock absorbing pad 20 is interposed between the plate members 12, one end of which is inserted from both opposing portions 14a and the ends thereof are arranged in layers, and the opposite portions 14a of the shock absorbing pad 20 are disposed. The side end is exposed to the outside of both opposing parts 14a with a somewhat relaxed length.
[25] That is, the buffer pad 20 is disposed to pass each of the front end portions of the plate member 12 in the width direction between the plate members 12, and the end of the plate member 12 side of the buffer pad 20 is a predetermined distance. Exposed slightly spaced apart.
[26] Accordingly, the buffer pad 20 provided between the plate members 12 stacked in layers to form the leaf spring 10 presses the end portion of the band clip 14 on the opposite side 14a of the band clip 14 when worn. Thus, the end of the plate 12 side can further enter between the plate (12).
[27] As a result, the shock absorbing pad 20 interposed between each plate 12 of the leaf spring 10 receives frictional force from the plate 12 so as to be worn on both sides 14a of the band clip 14. Since the wear-free portion accommodated inside the side can be newly installed between each of the plates 12, the durability life of the shock absorbing pad 20 can be extended, and as a result, between the respective plates 12, It is possible to delay the timing of occurrence of friction or noise caused by wear of the shock absorbing pad 20.
[28] This results in that the shock absorbing pads 20 provided between the plate members 12 of the leaf spring 10 can directly respond to premature wear phenomenon occurring at both front end portions of the plate member 12 in the width direction. will be.
[29] Therefore, the leaf spring 10 is a shock or vibration received by the tire from the road surface while driving to the axle, the vibration or shock transmitted to the axle is absorbed or buffered in the middle to reduce the vibration and shock received from the vehicle body to ride comfort It can be improved.
[30] In addition, the buffer pad 20 interposed between the plate 12 of the plurality of layers constituting the leaf spring 10 is damped by the impact or vibration received from the road surface while the leaf spring 10 is running. When worn by the friction received from each of the plates 12, the unweared portion accommodated in the opposing portions 14a of the band clip 14 can be pushed into the gap between the plates 12. Therefore, the same effect as that of replacing the buffer pad 20 with a new one can be obtained.
[31] As described above, according to the band clip device of the leaf spring according to the present invention, in the leaf spring 10 formed by stacking a plurality of plate materials 12 in a layered manner, interposed between the plate members 12 to reduce the friction between the plates. The main buffer pad 20 can be accommodated with a clearance in the installation hole 14b formed in both opposing portions 14a of the band clip 14, so that the portion worn between the plate members 12 is opposed. Since it can be replaced with the unworn part accommodated in the installation hole 14b in the part 14a, it becomes possible to extend the durability life to the said buffer pad 20. FIG.
[32] In addition, when the plate spring 10 is repeatedly compressed and expanded by the impact received from the road surface while driving, through the extension of the endurance life of the shock absorbing pad 20, the friction between the plate 12 is caused by direct friction. It is possible to exclude the friction noise generated between the plates.

权利要求:
Claims (3)
[1" claim-type="Currently amended] In the leaf spring comprising a plurality of strips of different lengths in the form of a plate 12 stacked in the form of a layer, and the band clip (14) for loading the plate 12 in a layer therein to impart a binding force,
The opposite side portions 14a of the band clip 14 are formed with a plurality of installation holes 14b extending through the members and individually penetrating to positions between the plate members 12 arranged in layers. A band clip of a leaf spring, characterized in that the buffer pad 20 of a flexible material is inserted into the mounting hole 14b and the end of the buffer pad 20 is installed between the respective plate members 12. Device.
[2" claim-type="Currently amended] The method of claim 1,
A plurality of mounting holes 14b formed on both opposing portions 14a of the band clip 14 are formed at positions shifted along the thickness direction of the member, and ends of each of the mounting holes 14b are arranged in layers. Band clip device of the leaf spring, characterized in that formed in a position corresponding to the position between each plate (12).
[3" claim-type="Currently amended] The method of claim 1,
Band clip device of the leaf spring, characterized in that the front end of the buffer pad (20) is installed between the plate material 12 is arranged at a predetermined distance apart.

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同族专利:

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公开号 | 公开日

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2000-10-17|Application filed by 이계안, 현대자동차주식회사

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2000-10-17|Priority to KR1020000061021A

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2000-10-17|Priority claimed from KR1020000061021A

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2002-04-25|Publication of KR20020030405A

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2002-11-23|Application granted

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2002-11-23|Publication of KR100361294B1

优先权:

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申请号 | 申请日 | 专利标题

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KR1020000061021A|KR100361294B1|2000-10-17|band clip device for leaf spring|