Multi-layer PCB manufacturing process

专利摘要:
PURPOSE: A method for manufacturing a multi-layer printed circuit board is provided to prevent the bending phenomenon of the multi-layer printed circuit board by forming a copper coil on a work panel area. CONSTITUTION: A plurality of multi-layer printed circuit board arrays(10) are manufactured on a work panel(20). The respective multi-layer printed circuit board arrays(10) are supported by a guide bar(12) made up of materials identical to an insulating layer of multi-layer printed circuit boards(10-1,...,10-N). A copper foil(14) is formed on the guide bar(12) based on a central layer of the multi layer printed circuit boards(10-1,...,10-N) so as to make a copper foil residual rate uniformly. Thus, the thickness of the insulating layer is uniformly maintained.
公开号:KR20020025558A
申请号:KR1020000057467
申请日:2000-09-29
公开日:2002-04-04
发明作者:김정묵
申请人:전세호；주식회사 심텍；
IPC主号:

专利说明:

Multi-layer PCB manufacturing process
[7] The present invention relates to a method for manufacturing a multilayer printed circuit board, and more particularly, to a method for manufacturing a multilayer printed circuit board which can prevent warpage of a multilayer printed circuit board generated when the multilayer printed circuit board is manufactured.
[8] In general, a multilayer printed circuit board is coated with copper foil on an epoxy-based insulated substrate, and may be classified into a single-sided multilayer printed circuit board, a double-sided multilayer printed circuit board, and a multilayered multilayer printed circuit board.
[9] The single-sided multilayer printed circuit board has a structure in which copper foil of a wiring pattern is coated on only one side of the insulated substrate, and the double-sided multilayer printed circuit board has a structure in which copper foil of a wiring pattern is coated on both sides of the insulated substrate. The multilayer printed circuit board has a structure in which a plurality of single-sided multilayer printed circuit boards or double-sided multilayer printed circuit boards are stacked.
[10] In this case, as shown in FIG. 1, the multilayer printed circuit board array includes a plurality of multilayer printed circuit boards 1-1 to 1 -N integrated with the multilayer printed circuit boards 1-1 to 1 -N. It is manufactured while being supported on the guide bar (2) of the same material as the insulating layer of the multilayer printed circuit board (1-1 to 1-N), the plurality of multilayer printed circuit board array on one work panel It is being produced.
[11] However, the multilayer printed circuit board as described above has a problem in that bending of the multilayer printed circuit board occurs when the multilayer printed circuit board is manufactured due to different residual rates of the copper foils attached to the insulating layers of the multilayer printed circuit board.
[12] Accordingly, the present invention has been made to solve the problems of the prior art as described above, it is possible to prevent the bending phenomenon of the multilayer printed circuit board generated during the manufacturing of the multilayer printed circuit board as well as the insulation layer thickness of the multilayer printed circuit board. It is an object of the present invention to provide a method for manufacturing a multilayer printed circuit board having a uniform thickness.
[13] In order to achieve the above object, a method of manufacturing a multilayer printed circuit board according to the present invention includes a workpiece except a multilayer printed circuit board such that copper foil residual ratios of both layers corresponding to each other are uniform based on the center layer of the multilayer printed circuit board. Copper foil is formed in a panel area | region.
[14] In addition, preferably, the copper foil is formed on the guide bar so that the remaining copper foil rate of each layer corresponding to each other on the basis of the center layer of the multilayer printed circuit board is uniform.
[1] 1 is a schematic diagram of a multilayer printed circuit board array according to the prior art;
[2] 2 is a schematic diagram of a multilayer printed circuit board array in accordance with the present invention.
[3] <Explanation of symbols for main parts of the drawings>
[4] 10: printed circuit board array 10-1 to 10-N: multilayer printed circuit board
[5] 12: guide bar 14: copper foil
[6] 20: Work Panel
[15] 2 is a schematic diagram of a multilayer printed circuit board array according to the present invention, in which a plurality of multilayer printed circuit board arrays 10 are manufactured on one work panel 20, and each of the multilayer printed circuit board arrays 10 is Manufactured integrally with the multilayer printed circuit boards 10-1 to 10-N, that is, manufactured while being supported by a guide bar 12 of the same material as the insulating layer of the multilayer printed circuit boards 10-1 to 10-N. It is becoming.
[16] The guide bars 12 are formed with copper foils 14 so that the residual ratio of copper foils on both sides becomes uniform with respect to the center layer of the multilayer printed circuit boards 10-1 to 10 -N.
[17] That is, by analyzing the design of the multilayer printed circuit boards 10-1 to 10-N, the layers of the multilayer printed circuit boards 10-1 to 10-N are classified around the center, and copper foils on both sides corresponding to each other are classified. After determining the residual ratio of the copper foil, the copper foil 14 is added to or removed from the part of the work panel 20 and / or the guide bar 12 to balance the copper foil remaining ratios of both sides, thereby preventing warpage of the multilayer printed circuit board. In addition, the insulating layer can be made uniform.
[18] As described above, according to the present invention, it is possible to prevent warpage of the multilayer printed circuit board generated when the multilayer printed circuit board is manufactured, and to have an uniform thickness of the insulating layer of the multilayer printed circuit board.

权利要求:
Claims (2)
[1" claim-type="Currently amended] A method of manufacturing a multilayer printed circuit board, wherein copper foil is formed in a work panel region excluding a multilayer printed circuit board so that the remaining copper foils of each layer corresponding to each other are uniform with respect to the center layer of the multilayer printed circuit board.
[2" claim-type="Currently amended] The method of claim 1,
A method of manufacturing a multilayer printed circuit board, characterized in that the copper foil is formed on the guide bar so that the residual ratio of the copper foil for each layer corresponding to each other on the basis of the center layer of the multilayer printed circuit board is uniform.

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同族专利:

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公开号 | 公开日

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2000-09-29|Application filed by 전세호, 주식회사 심텍

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2000-09-29|Priority to KR1020000057467A

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2002-04-04|Publication of KR20020025558A

优先权:

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申请号 | 申请日 | 专利标题

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KR1020000057467A|KR20020025558A|2000-09-29|2000-09-29|Multi-layer PCB manufacturing process|