• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: An apparatus for uniformly plating a substrate is provided which prevents plating defects inside via holes by installing a fixing frame for fixing the substrate so that the frame is ascended or descended and vibrated, and installing an ultrasonic oscillator on the inner side of a plating vessel into which the substrate is submersed. CONSTITUTION: The apparatus for uniformly plating a substrate comprises a fixing frame(100) to which a plurality of substrates(110) are fixed, and from both sides of which rotation axes are projected; a substrate fluctuation part in which rotation plates fixed through motors(240) and fixing axes(220) are installed at a supporter(210) to the lower parts of which ascent and descent cylinders(260) are connected so that the rotation axes are eccentrically connected to the rotation plates, and an oscillator(270) installed on the supporter is elastically connected to the upper side of the fixing frame(100); and a plating vessel(300) in which the fixing frame(100) is inserted, and an ultrasonic oscillator(320) is installed at the inner side of the plating vessel(300) in which a plating solution is filled, wherein the ultrasonic oscillator(320) installed in the plating vessel(300) is a round type.
    公开号:KR20020017260A
    申请号:KR1020000050472
    申请日:2000-08-29
    公开日:2002-03-07
    发明作者:송창규；김원회；강장규；탁철；고경환
    申请人:이형도；삼성전기주식회사；
    IPC主号:
    专利说明:

    Substrate uniform plating equipment {AN APPARATUS FOR UNIFORM COATING OF BOARD}
    [9] According to the present invention, in a plating apparatus for a substrate, a fixed frame on which the substrate is fixed is provided to raise and lower the vibration, and an ultrasonic vibrator is installed inside the plating bath in which the substrate is deposited to prevent the plating defect in the via hole. It relates to a uniform plating apparatus.
    [10] In more detail, by supporting both sides of the fixed frame for fixing the substrate to install the substrate oscillation unit to vibrate and up and down the fixed frame on one side, and to install the ultrasonic vibrator inside the plating bath in which the substrate is deposited. It is done.
    [11] Generally known multilayer boards are via holes for wiring electrical wiring connecting circuit components according to circuit design, corroding portions other than the circuit with chemicals to form a substrate having a predetermined pattern, and electrically connecting the layers. And a plurality of through holes through which parts and components are mounted.
    [12] In the conventional substrate plating apparatus related to the above technique, as shown in FIG. 1, the fixed shaft 30 protrudes on both sides of the fixed frame 20 to which the plurality of substrates 10 are fixed, and one end thereof is the rotating plate 40. Eccentrically fixed to the rotation), the rotating shaft 40a is fixed to the center of the rotating plate 40 is supported on the upper side of the support 50 to be raised and lowered, so that the rotating shaft 40a is connected to the motor 60 And, the lower side of the fixing frame 20 is made of a configuration in which the plating bath 70 is filled with the plating liquid 70a is installed.
    [13] In the substrate plating apparatus as described above, when the fixing frame 20 to which the plurality of substrates 10 are fixed is introduced into the plating bath 70 in a state in which the support base 50 is lowered, the substrate 10 is the plating solution 70a. ) Is rotated so that the fixed plate 20 is rotatably connected through the fixed shaft 30 so that the fixed plate 20 is rotatable, and the rotating plate 40 is supported by the support 50. When the 40 is rotated as the motor 60, the fixed shaft 30 is eccentrically rotated so that the substrate 10 supported by the fixing frame 20 is rotated up, down, left, and right in the plating bath 70, and plating is performed. Will be.
    [14] However, in the substrate plating apparatus as described above, in the case of the fine via hole formed in the substrate 70, plating is completed only by a simple rotation operation of the substrate, so that coating of the plating solution becomes thinner or difficult to inflow into the via hole. As a result, there is a problem that the reliability of the product is lowered, and thus fine via holes are impossible to be formed, resulting in constraints on the circuit arrangement of the substrate.
    [15] The present invention is to solve the various problems of the prior art as described above, the purpose of the plating thickness is kept constant inside of the via hole, as well as to prevent the unplated phenomenon, to minimize the diameter of the via hole to limit the constraints of the circuit arrangement The present invention provides a uniform plating apparatus for a substrate, which minimizes and provides plating reliability accurately and consistently throughout the substrate to provide product reliability and to suppress product defects due to plating.
    [1] 1 is a schematic view showing a conventional substrate plating apparatus
    [2] Figure 2 is a schematic diagram showing a substrate plating apparatus according to the present invention
    [3] 3A and 3B are enlarged views of main parts of a substrate plating apparatus according to the present invention.
    [4] Explanation of symbols on the main parts of the drawings
    [5] 100 ... fixed frame 110 ... substrate
    [6] 120 ... spindle 210 ... support
    [7] 230 ... swivel plate 250 ... guide hole
    [8] 260.Wheel cylinder descending 300
    [16] The present invention as a technical configuration for achieving the above object, and a fixed frame for fixing the substrate,
    [17] A substrate oscillator which is eccentrically fixed to a rotating plate protruding from both sides of the fixed frame and connected to the fixed shaft, and supports the fixed shaft to vibrate and rotate the fixed frame;
    [18] The substrate is installed in the lower portion of the fixing frame to be deposited, and by providing a uniform plating apparatus of the substrate comprising a plating bath in which the ultrasonic vibrator is installed inside the plating liquid is filled.
    [19] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
    [20] Figure 2 is a schematic diagram showing a substrate plating apparatus according to the present invention, Figure 3A, B is an enlarged view of the main portion of the substrate plating apparatus according to the present invention, the present invention, the fixed frame 100 and the substrate swinging portion 200 and It is made as a plating bath (300).
    [21] The fixing frame 100 is formed to fix a plurality of substrates 110 through a general fixing pin (not shown), etc., and the rotation shaft 120 protrudes on both sides thereof.
    [22] The substrate oscillation part 200 for oscillating the substrate 110 on the fixed frame 100 supported by the rotation shaft 120 may include rotation shafts 120 at both ends of the fixed shaft 220 which is fixed to the support 210. ) Is connected to the rotating plate 230 and the motor 240 for driving the fixed shaft 220 is eccentrically connected, the guide piece 250 is formed on both sides of the support 210 is connected to the lifting cylinder 260 The vibrator 270 is elastically connected to the support 210.
    [23] The plating bath 300 in which the substrate 110 is deposited is formed to have the fixing frame 100 inserted therein, and the ultrasonic vibrator 320 is installed inside the plating solution 310.
    [24] Referring to the operation of the present invention made of such a configuration as follows.
    [25] 2 and 3, the substrate 110 is fixed to the fixing frame 100 by fixing the edges of the plurality of substrates 110 to the fixing frame 100 through general fixing pins.
    [26] Then, when the motor 240 connected to the fixed shaft 220 is rotated at a speed of 20 to 30 RPM per minute while being fixed to the support 210, the fixed shaft 220 rotates the rotating plate 230 fixed to the center. At this time, the rotating shaft 120 is eccentrically connected to the rotating plate 230 so as to be rotatable through a bearing (not shown) or a bush (not shown) to have a predetermined trajectory about the fixed shaft 220.
    [27] Subsequently, when the rotary shaft 120 is rotated while having a predetermined trajectory, the fixed frame 100 to which the rotary shaft 120 is connected is rotated at the same time.
    [28] After the substrate 110 is mounted on the fixed frame 100 using the above operation, the elevating cylinder 260 connected to the support 210 is operated to allow the plating solution 300 to be filled in the plating bath 300. 110 to be deposited, and simultaneously operating the motor 240 and the stroke about 3 to 6 cm and 20 to 30 times per minute and the oscillator 270 is installed to move back and forth at the same time the operation.
    [29] In addition, as the substrate 110 rotates and vibrates by the above operation, the plating solution 310 is uniformly applied to the via hole formed in the substrate 110 as well as is precisely doped, and at the same time as the operation, the inside of the plating bath 300 The ultrasonic vibrator 320 installed in the operation operates the plating solution 310 to be plated on the substrate 110.
    [30] In addition, the ultrasonic vibrator 320 is formed in a round type to perform the vibration of the front and rear, left and right and up and down in the plating bath 300.
    [31] The support 210 supporting the lifting cylinder 260 has a guide hole 250 interposed with a bush (not shown) on both sides thereof so that the support 210 is elastically connected to the support 210 while the support 210 is raised and lowered. During the operation of the vibrator 270 is to vibrate the support 210 integrally.
    [32] According to the uniform plating apparatus of the substrate according to the present invention as described above, the plating thickness is kept constant inside the via hole as well as the unplating phenomenon is prevented, the diameter of the via hole is minimized to minimize the constraints due to the circuit arrangement, plating It is formed accurately and consistently throughout the substrate, thereby providing excellent product reliability, and suppressing the occurrence of product defects due to plating.
    权利要求:
    Claims (2)
    [1" claim-type="Currently amended] A fixed frame 100 having a plurality of substrates 110 fixed thereto, and rotating shafts 120 protruding from both sides thereof,
    The support plate 210 is connected to the bottom of the elevating cylinder 260 so that the rotary shaft 120 is eccentrically connected to the bottom plate 230 is fixed through the motor 240 and the fixed shaft 220 is installed, the support ( The oscillator 270 is installed in the 210 and the substrate swing portion 200 is elastically connected to the upper side of the fixed frame 100,
    The fixed frame 100 is formed to be inserted, the plating apparatus 300, characterized in that it comprises a plating bath 300 is installed inside the ultrasonic vibrator 320 is filled with the plating solution 310
    [2" claim-type="Currently amended] The uniform plating apparatus of the substrate according to claim 1, wherein the ultrasonic vibrator 320 installed in the plating bath 300 is a round type.
    类似技术:
    公开号 | 公开日 | 专利标题
    JP5568618B2|2014-08-06|Method of manufacturing a circuit carrier and use of the method
    TWI601199B|2017-10-01|Apparatus for substrate processing and method for substrate processing
    KR100659544B1|2006-12-19|Via-filling process
    KR101641475B1|2016-07-20|Apparatus and method for the electrolytic treatment of a plate-shaped product
    US6932868B2|2005-08-23|Coating film forming apparatus
    EP1303172B1|2015-07-08|Fluid material filling apparatus and related filling method
    US6632335B2|2003-10-14|Plating apparatus
    JP4067307B2|2008-03-26|Rotation holding device
    JP3274457B2|2002-04-15|Processing chamber and method for depositing and / or removing material from a substrate
    CN101027431B|2011-04-13|Plating method and plating apparatus
    US8329006B2|2012-12-11|Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
    US20050039948A1|2005-02-24|Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
    US6365843B1|2002-04-02|Multilayer printed wiring board
    US8033218B2|2011-10-11|Printing device, production unit, and production method of electronic parts
    KR20100059474A|2010-06-04|Substrate chucking member, substrate processing apparatus having the same and method of processing substrate using the same
    US6165892A|2000-12-26|Method of planarizing thin film layers deposited over a common circuit base
    EP1802186B1|2011-05-11|Printed circuit board
    EP1622435A1|2006-02-01|Method of manufacturing an electronic circuit assembly using direct write techniques
    US20040217009A1|2004-11-04|Electroplating bath
    DE60126596T2|2007-05-31|Pcb plate manufacturing method and pcb platform equipment
    JP2008130764A|2008-06-05|Printed wiring board manufacturing apparatus, printed wiring board, printed wiring board manufacturing method, and electronic apparatus
    EP1070159A4|2004-06-09|Electrodeposition of metals in small recesses using modulated electric fields
    JP2002506488A|2002-02-26|Electrochemical deposition system and substrate electroplating method
    KR100542151B1|2006-01-11|Method of forming resist layer and method of manufacturing photo mask
    US7686927B1|2010-03-30|Methods and apparatus for controlled-angle wafer positioning
    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-08-29|Application filed by 이형도, 삼성전기주식회사
    2000-08-29|Priority to KR1020000050472A
    2000-08-29|Priority claimed from KR1020000050472A
    2002-03-07|Publication of KR20020017260A
    2002-06-12|Application granted
    2002-06-12|Publication of KR100340425B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020000050472A|KR100340425B1|2000-08-29|An apparatus for uniform coating of board|
    [返回顶部]