• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Provided is a lead-free solder alloy that does not contain Pb at all and prevents environmental pollution caused by Pb when the joined product is discarded, and can increase the mechanical strength of the solder joint as a result of this alloying. A lead-free solder alloy comprising 0.05 to 2.0% by weight of Cu, 0.001 to 2.0% by weight of Ni and the remainder of Sn.
    公开号:KR20010112212A
    申请号:KR1020017003432
    申请日:2000-03-17
    公开日:2001-12-20
    发明作者:사와무라다다시；고미야히사시
    申请人:와다 겐이치；가부시키가이샤 도쿄 다이이치 쇼코；
    IPC主号:
    专利说明:

    Pb-free Soldering Alloy
    [2] Conventionally, a eutectic solder alloy composed of 60 wt% Sn and 40 wt% Pb or a eutectic solder alloy composed of 63 wt% Sn and 37 wt% Pb is used for bonding electronic components. It is used over time.
    [3] Conventionally, when the electronic device bonded with the solder alloy containing a lot of Pb is discarded, the environmental problem arises that Pb elutes by acid rain and becomes sulfuric acid and contaminates groundwater. In addition, Pb enters the body, paralyzing the central nervous system, and causing hemoglobin in the blood.
    [4] Accordingly, the present invention is to provide a lead-free solder alloy that does not contain any Pb, even if the joined product is discarded, to prevent environmental pollution by Pb, and as a result of alloying, can increase the mechanical strength of the solder joints. The purpose.
    [5] [Initiation of invention]
    [6] The present invention is a lead-free solder alloy comprising 0.05 to 2.0% by weight of Cu, 0.001 to 2.0% by weight of Ni, and the remainder being Sn.
    [7] According to the present invention, by adding 0.001 to 2.0% by weight of Ni to the Sn-Cu solder alloy containing no Pb, the mechanical strength is improved by about 15 to 30%.
    [8] Since Cu and Ni are alloys which form the electrolytic solid solution, Ni naturally added to the precipitated Cu in the binary alloy called Sn-Cu is also dissolved. As a result, the mechanical strength is increased.
    [9] In addition, since Pb is not contained, environmental pollution by Pb is prevented even when the joined product is discarded.
    [10] Best Mode for Carrying Out the Invention
    [11] EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated according to the embodiment.
    [12] As described above, the present invention replaces a part of the Cu addition composition in a known Sn-Cu alloy with Ni as a Pb-free solder alloy, and as can be seen from the examples shown in Table 2, According to the provision conditions, the ratio of Cu and Ni is selected suitably. Of course, as the solder alloy, in addition to mere mechanical strength, it is also necessary to consider "wetability". It was confirmed that "wetability" as the solder alloy did not deteriorate by replacing a part of the added Cu with Ni, and in some embodiments, "wetability" was improved by combining Cu and Ni.
    [13] In addition, in soldering fixing, it is required to have a low melting temperature as much as possible. As the Sn-Ni-Cu ternary solder alloy, there is a possibility of low temperature, but as shown in Table 1, Cu-Sn, Ni It can be estimated to some extent from the composition of the -Sn binary system and its melting temperature.
    [14] Ternary Process Composition and Temperature of Sn-Cu and Sn-Ni
    [15] TABLE 1
    [16] Binary system Chemical composition (rest Sn weight%) Melting temperature (℃) Sn-Ni Ni 0.15 wt% 231 ℃ Cu-Sn Cu 0.7 wt% 227 ℃
    [17] Therefore, it is considered that relatively low temperature can be achieved as a three-way process in the vicinity of the temperature section of Ni <0.15 wt% and Cu <0.7 wt%.
    [18] In the examples, as shown in Table 2, the addition of Ni and Cu did not deteriorate the mechanical strength, and furthermore, the increase in the melting point was only a small amount, even if it was, and the problem as a Pb-free solder alloy was none.
    [19] Chemical Composition and Mechanical Strength of Examples
    [20] TABLE 2
    [21] Example number Chemical composition (% by weight) (rest Sn) Mechanical strength (kgf / cm 2 ) Ni Cu One none none 5.9 2 none 0.3 6.2 3 0.02 none 6.0 4 0.70 0.02 6.3 5 1.00 0.05 6.4 6 0.50 0.10 6.6 7 0.90 0.80 6.9 Conventional example Sn 60 wt%, Pb 40 wt% 5.6
    [1] The present invention relates to a lead-free solder alloy containing no Pb.
    权利要求:
    Claims (1)
    [1" claim-type="Currently amended] A lead-free solder alloy comprising 0.05 to 2.0% by weight of Cu, 0.001 to 2.0% by weight of Ni and the remainder of Sn.
    类似技术:
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    同族专利:
    公开号 | 公开日
    EP1225001A1|2002-07-24|
    WO2001070448A1|2001-09-27|
    CA2347194A1|2001-09-17|
    HU0104903A2|2002-03-28|
    AU3193700A|2001-10-03|
    HU0104903A3|2002-05-28|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-03-17|Application filed by 와다 겐이치, 가부시키가이샤 도쿄 다이이치 쇼코
    2000-03-17|Priority to PCT/JP2000/001636
    2001-12-20|Publication of KR20010112212A
    优先权:
    申请号 | 申请日 | 专利标题
    PCT/JP2000/001636|WO2001070448A1|1999-02-08|2000-03-17|Lead-free solder alloy|
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