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    • 专利摘要:
    A process for forming a nanoporous insulating film on a substrate is provided. The process comprises forming a substantially uniform alkoxysilane gal composition consisting of a combination of at least one alkoxysilane, organic solvent composition, water and any base catalyst on the substrate surface, and placing the substrate in an organic solvent vapor atmosphere. Concentrating the gal compositions by heating to a sufficient time and at a sufficient temperature, and curing the gal compositions to form nanoporous insulating films having high mechanical strength on the substrate.
    公开号:KR20010073054A
    申请号:KR1020017002564
    申请日:1999-08-17
    公开日:2001-07-31
    发明作者:우후이-중；드래지제임스에스.；브런가르드트리사베쓰；라모스테라사；스미스더글라스엠.；월레스스테판；로데릭케빈
    申请人:크리스 로저 에이치；알라이드시그날 인코포레이티드；
    IPC主号:
    专利说明:

    Process for optimizing the mechanical strength of nanoporous silica {PROCESS FOR OPTIMIZING MECHANICAL STRENGTH OF NANOPOROUS SILICA}
    [2] In integrated circuit fabrication, the problems of interconnect RC delay, power consumption and crosstalk are becoming more and more serious as the shape size approaches 0.25 micrometers or less. The use of low dielectric constant (K) materials in interlevel dielectric and intermetal dielectric applications is known to partially alleviate these problems. However, candidates for each material having a significantly lower dielectric constant than the presently used high density silica have disadvantages in consideration of industrial aspects. The development of mostly low dielectric constant materials utilizes spin-on-glasses and K> 3 fluorinated plasma chemical vapor deposition SiO 2 . Some organic inorganic polymers have dielectric constants in the range of about 2.2-3.5, but they have problems with degraded mechanical properties including low thermal stability, low glass transition temperature, sample outgassing and long-term reliability. .
    [3] One solution is to use nanoporous silica with a dielectric constant in the range of about 1-3 as the porous substrate, interlevel and intermetallic dielectrics. Nanoporous silica membranes are typically formed on a substrate by methods such as dip-coating or spin-coating. Nanoporous silica is noted for its ability to carefully control its pore size and pore distribution, and is currently spin-on-glass (SOG's) and CVD because it uses simple precursors such as tetraethoxysilane (TEOS). Used for SiO 2 . In addition to having a low dielectric constant, nanoporous silica has other advantages over microelectronics: thermal stability up to 900 ° C, small pore size (<< microelectronics shape), materials widely used in the semiconductor industry, namely The use of silica and its precursors provides the ability to match a wide range of dielectric constants, and deposition using simple tools such as those used for conventional spin-on glass processes. The accompanying EP patent application EP 0 775 669 A2 refers to a process for producing nanoporous silica membranes having a uniform density over film thickness.
    [4] A key parameter controlling important properties in nanoporous silica dielectrics is porosity, which is inversely related to density. Materials with higher porosities have lower dielectric constants than high density materials. As porosity increases, density and dielectric constant decrease. However, the mechanical strength of the material also decreases. Mechanical strength is essential for the manufacture of integrated circuits. During fabrication of integrated circuits, multiple metal conductors and insulating dielectric films are deposited on a substrate. These layers can withstand multiple temperature changes at very high temperatures. Such temperature cycling can cause high stress levels between the individual layers of the integrated circuit due to mismatches in the coefficient of thermal expansion. Inadequate mechanical strength of any of the layers can cause cracking or delamination that results in yield degradation. In addition to temperature cycling, mechanical strength is essential for chemical mechanical polishing of the layers. Degraded mechanical strength degrades the nanoporous membrane and its layers during the polishing step. Obviously, what is needed is a method of making nanoporous membranes with adequate mechanical strength and low K used to fabricate appropriate integrated circuits.
    [5] The present invention provides a solution to this problem. After deposition of an alkoxysilane gel composition on a substrate, heating the alkoxy silane gel composition in a wet state in an organic solvent vapor atmosphere results in higher mechanical strength and lower K. It was unexpectedly found that a nanoporous dielectric film having was obtained. In accordance with the present invention, the wet alkoxysilane gel composition is formed on a suitable substrate and disposed within the organic solvent vapor branch. The gel composition with very low mechanical strength is then aged by heating in a solvent vapor atmosphere. The solvent vapor atmosphere prevents the gel composition from drying during heating. After heating, the aged alkoxy silane gel composition of the present invention is cured or dried. Using this process, relatively uniform nanoporous silica membranes with optimum mechanical strength and low K are produced.
    [1] The present invention relates to nanoporous dielectric films and processes for their manufacture. Such films are useful for fabricating integrated circuits.
    [6] The present invention is a step of forming a nanoporous dielectric film on a substrate,
    [7] (a) forming on the substrate surface a substantially uniform alkoxysilane gel composition consisting of a combination of at least one alkoxysilane, organic solvent composition, water and any base catalyst,
    [8] (b) concentrating the gel composition by heating the substrate to a sufficient time and at a sufficient temperature in an organic solvent vapor atmosphere, and
    [9] (c) curing the gel composition to form a nanoporous dielectric film on the substrate.
    [10] The present invention further provides a semiconductor device manufactured by the above process, wherein the substrate is a semiconductor substrate.
    [11] According to the present invention, an alkoxy silane gel composition is formed on a substrate from at least one alkoxy silane, organic solvent composition, water and any base catalyst.
    [12] The alkoxy silane gel composition may be formed on the surface of the substrate in various ways. In one embodiment, the alkoxy silane composition is formed by depositing a preformed mixture of alkoxy silane, organic solvent composition, water and any base catalyst on the substrate surface. In another embodiment, a stream in which the alkoxy silane, the organic solvent composition and any base catalyst are mixed is deposited on a substrate and then exposed to water. In yet another embodiment, the combined stream is exposed to water prior to being deposited on the substrate. In yet another embodiment, the mixed stream is deposited on the substrate simultaneously with exposure to water. The water may be in the form of a water stream or steam. The alkoxy silane, organic solvent composition, water and an optional base catalyst are mixed and deposited on a substrate and then subjected to an aging process by oven heating in a hotplate or solvent vapor, and then the alkoxy silane gel composition is formed on the substrate. do. Once removed from the solvent vapor, the aged gel is cured or dried to form a nanoporous dielectric coating having appropriate mechanical strength on the substrate.
    [13] Alkoxy silanes useful in the present invention include those having the following structural formula.
    [14] [Formula 1]
    [15]
    [16] At least two of said R groups are independently selected from C 1 to C 4 alkoxy groups and the remainder, if any, are independently selected from the group consisting of hydrogen, alkyl, phenyl, halogen, substituted phenyl. In the present invention, the term alkoxy includes any other organic group that can be readily decomposed by hydrolysis from silicon at temperatures near room temperature. The R group may be ethylene glycol or propylene glycol, and the like, but preferably all four R groups are methoxy, ethoxy, propoxy or butoxy. Most preferred alkoxy silanes include, but are not limited to, tetraethoxysilane (TEOS) and tetramethoxysilane.
    [17] The alkoxysilane component of the alkoxysilane gel composition is preferably present in an amount of about 3 to 50% by weight of the total mixture, more preferably about 5 to 45%, and most preferably about 10 to 40%.
    [18] Preferably, the organic solvent composition is a relatively high volatile solvent or a relatively low volatile solvent or both is a relatively high volatile solvent and comprises a relatively low volatile solvent. The solvent, which is usually a higher volatile solvent, evaporates at least partially immediately after deposition on the substrate. This partial drying results in a lower viscosity of the material after the first solvent or portions of the solvent have evaporated, resulting in better planarity. More volatile solvents evaporate over a period of seconds or minutes.
    [19] The temperature may optionally be raised slightly to accelerate this step. Such temperature is preferably about 20 to 80 ° C, more preferably about 20 to 50 ° C, most preferably 20 to 35 ° C.
    [20] In the present invention, a relatively high volatile solvent is one that evaporates at a lower temperature, preferably at a very low temperature, than a relatively low volatile solvent. The relatively high volatile solvent preferably has a boiling point of about 120 ° C. or less, more preferably about 100 ° C. or less. Suitable high volatility solvents include, but are not limited to, methanol, ethanol, n-propanol, isopropanol, n-butanol and mixtures thereof. Another relatively high volatility solvent that can be combined with other ingredients can be readily determined by those skilled in the art.
    [21] The relatively low volatile solvent is one that evaporates at a higher temperature, preferably at a very high temperature, than the relatively high volatile solvent. The relatively low volatile solvent is preferably at least about 175 ° C., more preferably at least about 200 ° C., at the boiling point. Such is preferably those having the formula R 1 (OR 2 ) n OH, wherein R 1 is a straight or branched C 1 -C 4 alkyl group, R 2 is a C 1 -C 4 alkylene group, and n is 2 to 4 Preferred low volatility solvent composition components include di (ethylene) glycol monomethyl ether; tri (ethylene) glycol monomethyl ether, tetra (ethylene) glycol monomethyl ether; di (propylene) glycol monomethyl ether, tri (propylene) glycol mono Methyl ether and mixtures thereof. Other suitable low volatility solvent compositions include, but are not limited to, ethylene glycol, 1,4-butylene glycol, 1,5-pentanediol, 1,2,4-butanetriol, 1,2,3-butane Triol, 2-methyl-propanetriol, 2- (hydroxymethyl) -1,3-propanediol, 1,4,1,4-butanediol, 2-methyl-1,3-propanediol, tetra Ethylene glycol, triethylene glycol monomethyl ether, glycerol, di (ethylene) glycol, tri (ethylene) glycol, tetra (ethylene) glycol; penta (ethylene) glycol, di (propylene) glycol, hexa (ethylene) glycol and mixtures thereof Alcohols and polyols, including glycols such as; Other relatively low volatility solvents that can be combined with other ingredients can be readily determined by those skilled in the art.
    [22] The organic solvent component is present in the alkoxy silane gel composition in an amount of about 20 to 90% by weight, more preferably 30 to 70%, and most preferably about 40 to 60% of the composition. When a high volatile solvent and a low volatile solvent are present together, the low volatile solvent is preferably about 1 to 40% by weight of the alkoxy silane gel composition, more preferably about 3 to 30% and most preferably the alkoxy silane Present in an amount of about 5-20% by weight of the gel composition.
    [23] Water is contained in the alkoxy silane gel composition to provide a medium for hydrolyzing the alkoxy silane. The molar ratio of water to silane is preferably about 0-50, more preferably about 0.1-10 and most preferably about 0.5-1.5. The base may be mixed with a solvent for mixing with the alkoxy silane. Suitable solvents for the base include those mentioned above as high volatility solvents. The most preferred solvents for use with bases are alcohols such as ethanol and isopropanol.
    [24] Any base may be present in the alkoxy silane gel composition in an amount of catalyst that can be readily determined by those skilled in the art. The molar ratio of base to silane is preferably about 0 to 0.2, more preferably about 0.001 to 0.05, and most preferably about 0.005 to 0.02.
    [25] Suitable bases include, but are not limited to, ammonia and first, second, and third boiling points preferably of about 200 ° C. or less, more preferably 100 ° C. or less, and most preferably 25 ° C. or less. Amines such as alkyl amines, aryl amines, alcohol amines, and mixtures thereof. Preferred amines are alcoholamine, alkylamine, methylamine, monoethanol amine, diethanol amine, triethanol amine, dimethylamine, trimethylamine, n-butylamine, n-propylamine, tetramethyl ammonium hydroxide, piperidine , 2-methoxyethylamine, mono-, di- or triethanolamines, and mono, -di-, or tri-isopropanolamines.
    [26] Capacity of an amine to accept a proton in water is the basicity constant K b, and pK b - is measured by the logK = b. In a preferred embodiment, the pK b of the base is in the range of about 0-9, more preferably about 2-6, most preferably about 4-5.
    [27] Typical substrates are those suitable for processing into integrated circuits or other microelectronic devices. Substrates suitable for the present invention include, but are not limited to, semiconductor materials such as gallium arsenide (GaAs), silicon, and crystalline silicon, polysilicon, amorphous silicon, epitaxial silicon, and silicon dioxide (SiO 2 ). Compositions containing silicones and mixtures thereof. The substrate surface may optionally have lines. If present, the lines are typically formed by well known lithographic techniques and may be composed of metal, oxide, nitride or oxynitride. Suitable materials for the line include silica, silicon nitride, titanium nitride, tantalum nitride, aluminum, aluminum alloys, kappa, kappa alloys, tantalum, tungsten and silicon oxynitrides. These lines form the conductor or insulator of an integrated circuit.
    [28] Such lines are typically very close together and apart from each other, preferably about 20 μm or less, more preferably about 1 μm or less, and most preferably about 0.05 to 1 μm.
    [29] Organic solvents suitable for the vapor atmosphere include those mentioned above as low volatility solvents. The organic solvent is preferably present in an amount of about 50 to 99.9% saturation, more preferably about 70 to 99% saturation, and most preferably about 90 to 99.9% saturation in a solvent vapor atmosphere. The remainder of the atmosphere may be air, hydrogen, carbon dioxide, water vapor, basic steam or an inert gas such as nitrogen or argon. The coated substrate is then aged by heating at an appropriate temperature in an organic solvent vapor atmosphere for a sufficient time to concentrate the gel composition. Within the context of the present invention, condensing means to polymerize and strengthen the coating.
    [30] To age the gel, the deposited substrate is heated by conventional methods, such as by placing the substrate on a hot plate in a solvent vapor atmosphere or by heating the entire solvent vapor in an oven. Suitable heating temperatures are preferably about 30 to 200 ° C, more preferably about 60 to 150 ° C and most preferably about 70 to 100 ° C. The gel may optionally be partially heated with or without the solvent vapor prior to aging.
    [31] Suitable times for aging the gel are preferably about 10 seconds to 60 minutes, more preferably about 30 seconds to 3 minutes, and most preferably about 1 to 2 minutes.
    [32] The aged alkoxy silane gel composition is then cured or dried in conventional manner, i.e. in a solvent free atmosphere. The temperature may be raised to cure or dry the coating. Such temperatures are preferably in the range of about 20-450 ° C, more preferably about 50-350 ° C and most preferably about 175-320 ° C. In the present invention, the term "curing" means curing or drying of the bonded composition on a substrate after deposition and exposure to water.
    [33] As a result, a nanoporous dielectric film having a relatively uniform, high mechanical strength and low dielectric constant is formed on the substrate. Preferably, the nanoporous dielectric film has a dielectric constant of about 1.1 to 3.5, more preferably about 1.3 to 3.0, and most preferably about 1.5 to 2.5. The size of the pores in the nanoporous dielectric film is preferably in the range of about 1 to 100 nm, more preferably about 2 to 30 nm, and most preferably about 3 to 20 nm. The density of the nanoporous dielectric film including pores is preferably in the range of about 0.1-1.9 g / cm 2, more preferably about 0.25-1.6 g / cm 2, and most preferably about 0.4-1.2 g / cm 2.
    [34] In any further step, the nanoporous dielectric film on the substrate may react with an effective amount of surface modification agent for a sufficient period of time to allow the surface modifier to penetrate the pore structure and make it hydrophobic. . The surface modification is done after aging but can be done before or after drying. The surface modifier is suitable for silylating some of the silanol on the hydrophobic, hydrophilic pore surface. The surface modifier preferably is: R 3 SiNHSiR 3 , R x SiCl y , R 3 SiOSiR 3 , R x Si (OR) y , M p Si (OH) [4-p] , R x Si (OCOCH 3 ) y , and combinations thereof, wherein x is an integer ranging from 1 to 3, y is an integer ranging from 1 to 3, y = 4-x, p is an integer ranging from 2 to 3, and each R is independently Selected hydrophobic organic moiety: each M is independently selected hydrophobic organic moiety: and R and M can be the same or different: a compound having a formula selected from the group consisting of: The R and M groups are preferably independently selected from the group of organic moieties consisting of alkyl, aryl and combinations thereof. The alkyl moiety is substituted or unsubstituted and is selected from the group consisting of straight alkyl, branched alkyl, cyclic alkyl and combinations thereof, wherein the alkyl moiety ranges from C 1 to C 18 . The aryl moiety is substituted or unsubstituted and ranges from C 5 to C 18 . Preferably, the surface modifier is acetoxytrimethylsilane, acetoxysilane, diacetoxydimethylsilane, methyltriacetoxysilane, phenyltriacetoxysilane, difetyldiacetoxysilane, trimethylethoxysilane, trimethylmethoxy Silane, 2-trimethylsiloxypent-2-ene-4-one, n- (triketylsilyl) acetamide, 2- (trimethylsilyl) acetic acid, n- (trimethylsilyl) imidazole, trimethylsilylpropiolate , Trimethylsilyl (trimethylsiloxy) -acetate, nonamethyltrisilazane, hexamethyldisilazane, hexamethyldisiloxane, trimethylsilanol, triethylsilanol, triphenylsilanol, t-butyldimethylsilanol, di Phenylsilanediol and combinations thereof. Most preferred said surface modifier is hexamethyldisilazane. The surface modifier may be mixed with a suitable solvent such as acetone, applied to the nanoporous silica surface in vapor form and then dried.
    [35] Hereinafter, the present invention will be described in more detail with reference to Examples.
    [36] Example 1
    [37] This embodiment illustrates that the low temperature hot plate treatment in the shield chamber can yield a low density uniform film.
    [38] The small void space of the chamber allows saturation of the porosity control solvent on the wafer with minimal evaporation.
    [39] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of triethylin glycol monomethyl ether (TriEGMME), 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask. It became.
    [40] The solution was mixed vigorously, then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [41] The solution was cooled and then stored refrigerated at 4 ° C.
    [42] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [43] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [44] Approximately 2.0 ml of precursor was deposited on two 4 inch silicon wafers on a spin chuck and spun at 2500 rpm for 30 seconds.
    [45] The film was gelled and aged in a vacuum chamber using the following conditions.
    [46] The chamber was evacuated to Hg-20 inches.
    [47] Next, 15M ammonium hydrooxide was heated and maintained at 45 ° C. and dosed for 2-3 minutes to increase the pressure to Hg-4.0 inches.
    [48] Finally, the chamber was evacuated to Hg-20.0 inches and then backfilled with nitrogen.
    [49] One membrane was heated in air at elevated temperature for 1 minute at 175 ° C and 320 ° C, respectively.
    [50] The other membrane was placed in a small void space chamber heated and maintained at 45 ° C.
    [51] The chamber includes approximately 2 mm void space on the wafer.
    [52] The membrane was placed in the chamber for 2 minutes, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [53] Next, the two films were observed by single wavelength multiple angle ellipsometry to measure the reflective index and thickness as shown in Table 1 below.
    [54] Results of Nanoporous Silica Thin FilmsLow temperature hot plate45 ℃ low temperature hot plate Thickness (A)34005616 Reflection index1.201.124
    [55] This example illustrates that the film treated with the low temperature hotplate shrinks less due to the increased strength by the heat treatment.
    [56] Example 2
    [57] This example demonstrates that low temperature hot plate treatment in the shield chamber can yield a low density uniform film.
    [58] The small void space of the chamber allows saturation of the porosity control solvent on the wafer with minimal evaporation.
    [59] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask.
    [60] This solution was vigorously mixed and then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [61] The solution was cooled and then stored refrigerated at 4 ° C.
    [62] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [63] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [64] Approximately 2.0 ml of precursor was deposited on two 4 inch silicon wafers on a spin chuck and spun at 2500 rpm for 30 seconds.
    [65] The membranes were gelled and aerated in a vacuum chamber using the following conditions.
    [66] The chamber was evacuated to Hg-20 inches.
    [67] Next, 15M ammonium hydrooxide was heated and maintained at 45 ° C. and filled for 2-3 minutes to increase the pressure to Hg-4.0 inches.
    [68] Finally, the chamber was evacuated to Hg-20.0 inches and then charged back with nitrogen.
    [69] One membrane was heated in air at elevated temperature for 1 minute at 175 ° C and 320 ° C, respectively.
    [70] The other membrane was placed in a small void space chamber heated and maintained at 45 ° C.
    [71] The chamber includes approximately 2 mm void space on the wafer.
    [72] The membrane was placed in the chamber for 1 minute, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [73] Next, the two films were observed by short wavelength elliptically polarized light to measure the reflection index and thickness as shown in Table 2 below.
    [74] Results of Nanoporous Silica Thin FilmsLow temperature hot plate45 ℃ low temperature hot plate Thickness (A)34004500 Reflection index1.201.15
    [75] This example illustrates that the film treated with the low temperature hotplate shrinks less because of the increased strength by the heat treatment.
    [76] Example 3
    [77] This example demonstrates that low temperature hot plate treatment in the shield chamber can yield a low density uniform film.
    [78] The small void space of the chamber allows saturation of the porosity control solvent on the wafer with minimal evaporation.
    [79] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask.
    [80] This solution was vigorously mixed and then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [81] The solution was cooled and then stored refrigerated at 4 ° C.
    [82] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [83] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [84] Approximately 2.0 ml of precursor was deposited on two 4 inch silicon wafers on a spin chuck and spun at 2500 rpm for 30 seconds.
    [85] The membranes were gelled and aerated in a vacuum chamber using the following conditions.
    [86] The chamber was evacuated to Hg-20 inches.
    [87] Next, 15M ammonium hydrooxide was heated and maintained at 45 ° C. and filled for 2-3 minutes to increase the pressure to Hg-4.0 inches.
    [88] Finally, the chamber was evacuated to Hg-20.0 inches and then charged back with nitrogen.
    [89] One membrane was heated in air at elevated temperature for 1 minute at 175 ° C and 320 ° C, respectively.
    [90] The other membrane was placed in a small void space chamber heated and maintained at 50 ° C.
    [91] The chamber includes approximately 2 mm void space on the wafer.
    [92] The membrane was placed in the chamber for 2 minutes, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [93] Next, two films were observed by short wavelength elliptically elliptical polarization method to measure the reflection index and thickness as shown in Table 3 below.
    [94] Results of Nanoporous Silica Thin FilmsLow temperature hot plate45 ℃ low temperature hot plate Thickness (A)34004900 Reflection index1.201.14
    [95] This example illustrates that the film treated with the low temperature hotplate shrinks less due to the increased strength by the heat treatment.
    [96] Example 4
    [97] This example demonstrates that low temperature hotplate treatment in open hotplates can yield significantly lower density uniform films.
    [98] The low volatility of the porosity control solvent allows the membrane to be heated at low temperatures on an open hotplate that not only has some evaporation but also can achieve additional mechanical strength to reduce membrane shrinkage.
    [99] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask.
    [100] This solution was vigorously mixed and then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [101] The solution was cooled and then stored refrigerated at 4 ° C.
    [102] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [103] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [104] Approximately 2.0 ml of precursor was deposited on two 4 inch silicon wafers on a spin chuck and spun at 2500 rpm for 30 seconds.
    [105] The membranes were gelled and aerated in a vacuum chamber using the following conditions.
    [106] The chamber was evacuated to Hg-20 inches.
    [107] Next, 15M ammonium hydrooxide was heated and maintained at 45 ° C. and filled for 2-3 minutes to increase the pressure to Hg-4.0 inches.
    [108] Finally, the chamber was evacuated to Hg-20.0 inches and then charged back with nitrogen.
    [109] One membrane was heated in air at elevated temperature for 1 minute at 175 ° C and 320 ° C, respectively.
    [110] The other membrane was placed in an open hotplate heated to 45 ° C. and expanded.
    [111] The membrane was placed in the chamber for 2 minutes, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [112] Next, two films were observed by short wavelength elliptically polarized light in order to measure the reflection index and thickness as shown in Table 4 below.
    [113] Results of Nanoporous Silica Thin FilmsLow temperature hot plate45 ℃ low temperature hot plate Thickness (A)34003900 Reflection index1.201.165
    [114] This example illustrates that the film treated with the low temperature hotplate shrinks less due to the increased strength by the heat treatment.
    [115] Example 5
    [116] This example demonstrates that low temperature hotplate treatment in open hotplates can yield significantly lower density uniform films.
    [117] The low volatility of the porosity control solvent allows the membrane to be heated at low temperatures on an open hotplate that not only has some evaporation but also can achieve additional mechanical strength to reduce membrane shrinkage.
    [118] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask.
    [119] This solution was vigorously mixed and then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [120] The solution was cooled and then stored refrigerated at 4 ° C.
    [121] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [122] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [123] Approximately 2.0 ml of precursor was deposited on two 4 inch silicon wafers on a spin chuck and spun at 2500 rpm for 30 seconds.
    [124] The membranes were gelled and aerated in a vacuum chamber using the following conditions.
    [125] The chamber was evacuated to Hg-20 inches.
    [126] Next, 15M ammonium hydrooxide was heated and maintained at 45 ° C. and filled for 2-3 minutes to increase the pressure to Hg-4.0 inches.
    [127] Finally, the chamber was evacuated to Hg-20.0 inches and then charged back with nitrogen.
    [128] One membrane was heated in air at elevated temperature for 1 minute at 175 ° C and 320 ° C, respectively.
    [129] The other membrane was placed in an open hotplate heated and maintained at 45 ° C.
    [130] The membrane was placed in the chamber for 1 minute, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [131] Next, the two films were observed by short wavelength elliptically polarized light to measure the reflection index and thickness as shown in Table 5 below.
    [132] Results of Nanoporous Silica Thin FilmsLow temperature hot plate45 ℃ low temperature hot plate Thickness (A)34004100 Reflection index1.201.158
    [133] This example illustrates that the film treated with the low temperature hotplate shrinks less due to the increased strength by the heat treatment.
    [134] Example 6
    [135] This example illustrates that the nanoporous silica membrane can be heat treated in a solvent saturation environment to improve mechanical strength.
    [136] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask.
    [137] This solution was vigorously mixed and then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [138] The solution was cooled and then stored refrigerated at 4 ° C.
    [139] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [140] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [141] Approximately 2.0 ml of precursor was deposited on a 4 inch silicon wafer on a spin chuck and spun at 2500 rpm for 30 seconds.
    [142] The membrane was gelled and aired in a vacuum chamber heated and maintained at 30 ° C.
    [143] The following conditions were used to perform proper aeration.
    [144] The chamber was evacuated to Hg-20 inches.
    [145] Next, 15M ammonium hydrooxide was added for 2-3 minutes to heat and maintain at 45 ° C. to increase the pressure to Hg-4.0 inches.
    [146] Finally, the chamber was evacuated to Hg-20.0 inches and then charged back with nitrogen.
    [147] The membrane was placed in a vacuum chamber in which at least 95% of saturated gas of TriEGMME heated at 30 ° C. flowed through a nitrogen bubbler.
    [148] The membrane was placed in the chamber for 2 minutes, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [149] The film was observed by short wavelength dip ellipse polarization to measure the reflection index and thickness.
    [150] This embodiment illustrates that the film treated with the hot saturated gas shrinks very little due to the increased strength by the heat treatment.
    [151] Example 7
    [152] This example illustrates that the nanoporous silica membrane can be heat treated at 50 ° C. in a solvent saturation atmosphere to improve mechanical strength.
    [153] The precursor was synthesized by adding 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid together in a round bottom flask.
    [154] This solution was vigorously mixed and then heated to ˜80 ° C. and refluxed for 1.5 hours to form a solution.
    [155] The solution was cooled and then stored refrigerated at 4 ° C.
    [156] After cooling the solution was diluted 50 vol.% With ethanol to reduce the viscosity.
    [157] The precursor diluted as above was filtered to 0.1 mm using a Teflon filter.
    [158] Approximately 2.0 ml of precursor was deposited on a 4 inch silicon wafer on a spin chuck and spun at 2500 rpm for 30 seconds.
    [159] The membrane was gelled and aired in a vacuum chamber heated and maintained at 50 ° C.
    [160] The following conditions were used to perform proper aeration.
    [161] The chamber was evacuated to Hg-20 inches.
    [162] Next, 15M ammonium hydrooxide was heated and maintained at 45 ° C. and charged for 2-3 minutes to increase the pressure to Hg-4.0 inches.
    [163] Finally, the chamber was evacuated to Hg-20.0 inches and then charged back with nitrogen.
    [164] The film was placed in a vacuum chamber in which at least 95% of saturated gas of TriEGMME heated at 50 ° C. flowed through a nitrogen bubble.
    [165] The membrane was placed in the chamber for 2 minutes, then removed and heated in air at a temperature elevated for 1 minute at 175 ° C. and 320 ° C., respectively.
    [166] The film was observed by short wavelength dip ellipse polarization to measure the reflection index and thickness.
    [167] This embodiment illustrates that the film treated with the hot saturated gas shrinks very little due to the increased strength by the heat treatment.
    [168] Example 8
    [169] This example illustrates that the nanoporous silica membrane can be heat treated at 30 ° C. in a solvent saturated atmosphere to improve mechanical strength.
    [170] Precursors were synthesized by adding 94.0 mL of tetraethoxysilane, 1.0 mL of TriEGMME6, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid in a round bottom flask. The solution was mixed vigorously and heated to ˜80 ° C. and refluxed to form a solution. The solution was cooled and stored at 4 ° C. in a chilled state. After cooling the solution was diluted to 50 vol.% With ethanol to reduce its viscosity. The diluted precursor was filtered to 0.1 mm using a Teflon filter. Approximately 2.0 ml of the precursor was deposited on a 4 inch silicon wafer on a spin chuck and spun at 2500 rpm for 30 seconds. The membrane was gelled and aged in a vacuum chamber heated to 30 ° C. The conditions for proper aging are as follows. The chamber was evacuated to Hg -20.0 inches. Next, 15M ammonium hydroxide was heated to maintain at 45 ° C., and charged into the chamber to increase its pressure to Hg -4.0 inches for 2-3 minutes. Finally the chamber was again evacuated to Hg-20.0 inches and back filled with nitrogen. The membrane was placed in the chamber through which at least 95% saturated gas of TriEGMME heated to 50 ° C. by nitrogen bubbler.
    [171] The membrane was left in the chamber for 1 minute and then removed and heated to a temperature of 175 ° C. and 320 ° C., respectively, for 1 minute. The film was then irradiated with short wavelength elliptically polarized light to determine the reflection index and thickness. This embodiment illustrates that the film treated with the hot saturated gas shrinks less because of the increase in strength due to the heat treatment.
    [172] Example 9
    [173] This example illustrates that the nanoporous silica membrane can be heat treated at 50 ° C. in a solvent saturated atmosphere to improve its mechanical strength.
    [174] Precursors were synthesized by adding together 94.0 mL of tetraethoxysilane, 61.0 mL of TriEGMME, 7.28 mL of deionized water, and 0.31 mL of 1N nitric acid in a round bottom flask. The solution was mixed vigorously and heated to 80 ° C. and refluxed to form a solution. The solution was cooled and stored at 4 ° C. in a chilled state. After cooling the solution was diluted to 50 vol.% With ethanol to reduce its viscosity. The diluted precursor was filtered to 0.1 mm using a Teflon filter. Approximately 2.0 ml of the precursor was deposited on a 4 inch silicon wafer on a spin chuck and spun at 2500 rpm for 30 seconds. The membrane was gelled and aged in a vacuum chamber that was heated to and maintained at 50 ° C. The conditions for proper aging are as follows. The chamber was evacuated to Hg -20.0 inches. Next, 15M ammonium hydroxide was heated to maintain at 45 ° C., and charged into the chamber to increase its pressure to Hg -4.0 inches for 2-3 minutes. Finally the chamber was again evacuated to Hg-20.0 inches and back filled with nitrogen.
    [175] The membrane was placed in the chamber through which at least 95% saturated gas of TriEGMME heated to 50 ° C. by nitrogen bubbler. The membrane was left in the chamber for 1 minute and then removed and heated to a temperature of 175 ° C. and 320 ° C., respectively, for 1 minute. The film was then irradiated with short wavelength elliptically polarized light to determine the reflection index and thickness. This embodiment illustrates that the membrane treated with the hot saturated gas shrinks less because of the increase in strength due to the heat treatment.
    [176] According to the present invention as described above, a relatively uniform nanoporous silica film having an optimum mechanical strength and a low K can be produced, which can be effectively used in the manufacture of integrated circuits.
    权利要求:
    Claims (31)
    [1" claim-type="Currently amended] (a) forming, on the substrate surface, a substantially uniform alkoxysilane gal composition consisting of a combination of at least one alkoxysilane, organic solvent composition, water and any base catalyst,
    (b) concentrating the gal composition by heating the substrate to a sufficient time and at a sufficient temperature in an organic solvent vapor atmosphere, and
    (c) forming a nanoporous insulating film on the substrate, comprising curing the gal composition to form a nanoporous insulating film on the substrate.
    [2" claim-type="Currently amended] The process of claim 1, wherein the organic solvent vapor atmosphere comprises a relatively low volatility organic solvent having a boiling point of about 175 ° C. or higher.
    [3" claim-type="Currently amended] The method of claim 2, wherein the organic solvent vapor atmosphere is di (ethylene) glycol monomethyl ether, tri (ethylene) glycol monomethyl ether, tetra (ethylene) glycol monomethyl ether, di (propylene) glycol monomethyl ether, tri (Propylene) glycol monomethyl ether, ethylene glycol, 1,4-butylene glycol, 1,5-pentanediol, 1,2,4-butanetriol, 1,2,3-butanetriol, 2-methyl Propanetriol, 2- (hydrooxymethyl) -1,3-propanediol, 1,4,1,4-butanediol, 2-methyl-1,3-propanediol, tetraethylene glycol, triethylene glycol monomethyl Relatively volatile selected from the group consisting of ether, glycerol, di (ethylene) glycol, tri (ethylene) glycol, tetra (ethylene) glycol, panta (ethylene) glycol, di (propylene) glycol, hexa (ethylene) glycol and mixtures thereof Nanoporous insulating coating on a substrate characterized by containing a low organic solvent Step of forming.
    [4" claim-type="Currently amended] The process of claim 1, wherein the organic solvent composition of step (a) comprises an organic solvent as in the organic solvent vapor atmosphere of step (b).
    [5" claim-type="Currently amended] The method of claim 1, wherein the solvent vapor atmosphere comprises forming a nanoporous insulating film on a substrate, characterized in that it comprises a relatively low volatility organic solvent present in an amount of about 50 to 99.9% saturated in the atmosphere. fair.
    [6" claim-type="Currently amended] The process of claim 1, wherein the selective organic catalyst is present in the alkoxysilane composition.
    [7" claim-type="Currently amended] The process of claim 1, wherein the alkoxysilane gal composition is formed by exposing the alkoxysilane to water in the form of steam.
    [8" claim-type="Currently amended] The process of claim 1, wherein the alkoxysilane gal composition is formed by exposing the alkoxysilane to a base catalyst in the form of a basic vapor.
    [9" claim-type="Currently amended] The process of claim 1, wherein the alkoxysilane gal composition is formed by exposing the alkoxysilane to both water in the form of steam and a base catalyst in the form of a basic vapor.
    [10" claim-type="Currently amended] The method of claim 1, wherein the alkoxysilane gal composition is formed by depositing the alkoxysilane and the organic solvent composition on the substrate in a stream form. .
    [11" claim-type="Currently amended] The nanoporous insulating film on the substrate of claim 1, wherein the alkoxysilane gal composition is formed by depositing the alkoxysilane, the organic solvent composition, and the water on the substrate in the form of a mixed stream. Forming process.
    [12" claim-type="Currently amended] The nanoporous insulating film on the substrate of claim 1, wherein the alkoxysilane gal composition is formed by depositing the alkoxysilane, the organic solvent composition, and the organic catalyst on the substrate in the form of a mixed stream. Forming process.
    [13" claim-type="Currently amended] The nanoparticle on the substrate of claim 1, wherein the alkoxysilane gal composition is formed by depositing the alkoxysilane, the organic solvent composition, the water, and the organic catalyst on the substrate in the form of a mixed stream. Forming porous insulating film.
    [14" claim-type="Currently amended] 2. The process of claim 1, wherein the organic solvent composition of step (a) comprises a relatively high volatility solvent and a relatively low volatility solvent.
    [15" claim-type="Currently amended] 15. The nanoporous insulation of claim 14 wherein the relatively volatile solvent has a boiling point of about 120 ° C. or less and the relatively volatile solvent has a boiling point of about 175 ° C. or more. Process of forming a film.
    [16" claim-type="Currently amended] 15. The composition of claim 14, wherein the relatively volatile solvent comprises one or more components selected from the group consisting of methanol, ethanol, n-propanol, isopropanol, n-butanol, and mixtures thereof. A low solvent composition is a process for forming a nanoporous insulating film on a substrate, characterized in that it comprises an alcohol or a polyol.
    [17" claim-type="Currently amended] The nanoporous insulation on a substrate of claim 1, wherein the base catalyst is selected from the group consisting of ammonia, first alkylamine, second alkylamine, third alkylamine, arylamine, alcoholamine and mixtures thereof. Process of forming a film.
    [18" claim-type="Currently amended] The group of claim 1, wherein the alkoxysilane is a group consisting of at least two R groups independently C 1 to C 4 alkoxy groups and the remainder, if present, hydrogen, alkyl, phenyl, halogen, substituted phenyl A process for forming a nanoporous insulating film on a substrate characterized by having the following structural formula independently selected.
    [Formula 1]
    [19" claim-type="Currently amended] 19. The process of claim 18 wherein each group is methoxy, ethoxy or propoxy.
    [20" claim-type="Currently amended] The method of claim 1, wherein the alkoxysilane composition is methanol, ethanol, n-propanol, isopropanol, n-butanol, ethylene glycol, 1,4-butylene glycol, 1,5-pentanediol, 1,2,4-butane Triol, 1,2,3-butanetriol, 2-methyl-propanetriol, 2- (hydrooxymethyl) -1,3-propanediol, 1,4,1,4-butanediol, 2-methyl- A process for forming a nanoporous insulating film on a substrate comprising at least one organic solvent selected from the group consisting of 1,3-propanediol, tetraethylene glycol, triethylene glycol monomethyl ether, glycerol and mixtures thereof. .
    [21" claim-type="Currently amended] The process of claim 1, wherein the substrate comprises silicon or gallium arsenide.
    [22" claim-type="Currently amended] The process of claim 1, wherein the substrate comprises at least one semiconductor material.
    [23" claim-type="Currently amended] 22. The method of claim 21 wherein the semiconductor material is selected from the group consisting of gallium arsenide, silicon, and compositions comprising silicon, such as crystalline silicon, polysilicon, amorphous silicon, epitaxial silicon and silicon dioxide, and mixtures thereof. A step of forming a nanoporous insulating film on a substrate characterized in that.
    [24" claim-type="Currently amended] The method of claim 1, wherein the substrate has a pattern of lines on its surface.
    [25" claim-type="Currently amended] 25. The process of claim 24, wherein the lines comprise metal, oxide, nitride or oxynitride.
    [26" claim-type="Currently amended] The process of claim 1, wherein the gal composition is cured by heating.
    [27" claim-type="Currently amended] The method of claim 1, wherein the nanoporous insulating film has a dielectric constant of about 1.1 to 3.5.
    [28" claim-type="Currently amended] The substrate of claim 1, further comprising treating a surface modifier on the nanoporous insulating film under conditions sufficient to render the nanoporous insulating film hydrophobic after step (b) and before and after step (c). Forming a nanoporous insulating film on the surface.
    [29" claim-type="Currently amended] 29. The process of claim 28, wherein said surface modifier comprises hexamethyldisilazane.
    [30" claim-type="Currently amended] A substrate having an insulating film formed by the process of claim 1.
    [31" claim-type="Currently amended] (a) forming on the surface of the semiconductor substrate a substantially uniform alkoxysilane gal composition consisting of a combination of at least one alkoxysilane, an organic solvent composition, water and any base catalyst,
    (b) concentrating the gal composition by heating the semiconductor substrate in an organic solvent vapor atmosphere at a sufficient time and at a sufficient temperature, and
    (c) hardening the gal composition to form a nanoporous insulating film on the semiconductor substrate.
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    同族专利:
    公开号 | 公开日
    TW594879B|2004-06-21|
    US20030062600A1|2003-04-03|
    JP2002524849A|2002-08-06|
    EP1118110A1|2001-07-25|
    AU5561899A|2000-03-21|
    WO2000013221A1|2000-03-09|
    CN1325542A|2001-12-05|
    CN1146964C|2004-04-21|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-08-27|Priority to US14128798A
    1998-08-27|Priority to US09/141,287
    1999-08-17|Application filed by 크리스 로저 에이치, 알라이드시그날 인코포레이티드
    1999-08-17|Priority to PCT/US1999/018497
    2001-07-31|Publication of KR20010073054A
    优先权:
    申请号 | 申请日 | 专利标题
    US14128798A| true| 1998-08-27|1998-08-27|
    US09/141,287|1998-08-27|
    PCT/US1999/018497|WO2000013221A1|1998-08-27|1999-08-17|Process for optimizing mechanical strength of nanoporous silica|
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