• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A printed circuit board of memory module is provided to use a printed circuit board in common for DIMM(Dual In-line Memory Module) 4Mx64 and DIMM 4Mx72 CONSTITUTION: The printed circuit board of memory module comprises: mounting part to ount 18 memory component, a printed circuit board of buffered memory module formed a buffer, switching part to distribute CAS signal in order to use selectively one of the printed circuit board of the buffered DIMM 4Mx64 module and the printed circuit board of the buffered DIMM 4Mx72. As a wiring of the switching part is changed, the printed circuit board is used in common. As a result, the problems of stocks is solved.
    公开号:KR20000004731A
    申请号:KR1019980026227
    申请日:1998-06-30
    公开日:2000-01-25
    发明作者:안재석；윤용식；박승운
    申请人:김영환；현대전자산업 주식회사；
    IPC主号:
    专利说明:

    Printed Circuit Board of the Memory Module
    The present invention relates to a printed circuit board of a memory module, and more particularly, to a printed circuit board of a buffered 4M × 64 module and a printed circuit board of a buffered 4M × 72 module. It relates to a circuit board.
    Memory is a general term used to temporarily or permanently store data or instructions used in computers, communication systems, image processing systems, and the like, and is typically a semiconductor, tape, disk, or optical method. Occupies. There are many kinds of such semiconductor memories, such as DRAM, SRAM, Flash Memory, and ROM, which are classified according to electrical characteristics of a data storage method.
    The DRAM (Dynamic Random Access Memory) requires a periodic refresh operation to restore the storage potential to its original state periodically because the storage potential changes with time, and the read operation because the amount of charge stored in the capacitor serves as a data determination criteria. Because the voltage difference is induced by the difference of the charge amount, the voltage difference is sensed and amplified and the data is output. Therefore, the leaked or transmitted stored data must be recovered and stored in the cell.
    When the above memory is actually used in a system, it is produced by making it into a module. A module is a set of devices having a single function, and various packaging devices such as semiconductor devices are mounted on a printed circuit board (PCB). It is connected to the panel and installed by a plurality of connecting pins.
    FIG. 1 is a diagram illustrating a printed circuit board of a memory module that can be commonly used for an unbuffered DIMM 4M × 64 module and an unbuffered DIMM 4M × 72 module.
    As shown in Fig. 1, 9 parts are formed on the front side and the back side to be used for the 4M × 72 module so that 4M × 4 components 30 can be mounted on the substrate. By not mounting the component 30 to a part of it, it becomes possible to use it mutually.
    That is, when the components are mounted on both the first mounting portion 1 to the ninth mounting portion 9 on the front side and the rear side, it is used as a 4M × 72 module and is used on the remaining portions except for the fifth mounting portion 5 on the front side and the rear side. When the component 30 is mounted, it is used as a 4M × 64 module.
    The CAS signal line is connected as follows. CAS lines of the first and second mounting parts (1) and (2)And the CAS lines of the 3, 4, 5 mountings (3) (4) (5)Connected to the CAS line of the sixth and seventh mounting parts (6) and (7)Connected to the CAS line of the eighth and ninth mounts (8) and (9)Is connected to. The wiring on the back side is made the same as the front side.
    As described above, the CAS lines used by the unbuffered DIMM 4M × 64 module and the unbuffered DIMM 4M × 72 module are identical to each other, so that the component 30 is not mounted to a part of the mounting portion on the printed circuit board. Will be available to the public.
    FIG. 2 is a printed circuit board of a buffered DIMM 4M × 64 module as a printed circuit board of a memory module. FIG. .
    And the CAS signal is the CAS line of the first and second mounting portion (1) (2)Connected to the CAS line of the third and fourth mounting portions 3 and 4Connected to the CAS line of the fifth and sixth mounting portions 5 and 6Connected to the CAS line of the seventh and eighth mounting parts (7) (8)Is connected to. Also on the back,,,This is connected in the same way.
    3 is a diagram illustrating a printed circuit board of a buffered DIMM 4M × 72 module as a printed circuit board of a memory module. In FIG. 3, 9 M 4 4 components 30 are formed on the front and rear surfaces thereof. And the buffer is mounted.
    Unlike buffered DIMM 4M × 64, the buffered DIMM 4M × 72 module has a CAS signal from the first mounting portion (1) to the ninth mounting portion (9).9 components (30)Is connected to.
    Due to the above difference, the buffered DIMM 4M × 64 module and the buffered DIMM 4M × 72 module cannot use a common printed circuit board. Therefore, even if a stock of a printed circuit board occurs, there was a problem that can not be used in the other side.
    The present invention was created to solve the above problems, and an object of the present invention is to use a printed circuit board of the buffered DIMM 4M × 64 module and the printed circuit board of the buffered DIMM 4M × 72 module to be used in common with each other. To provide a printed circuit board of the memory module.
    1 is a view showing a compatible printed circuit board of an unbuffered DIMM 4M × 64 and 4M × 72 modules as a printed circuit board of a general memory module.
    FIG. 2 shows a printed circuit board of a buffered DIMM 4M × 64 module as a printed circuit board of a general memory module.
    3 is a diagram illustrating a printed circuit board of a buffered DIMM 4M × 72 module as a printed circuit board of a general memory module.
    4 is a view showing a compatible printed circuit board of a buffered DIMM 4M × 64 and a 4M × 72 module as a printed circuit board of the memory module according to the present invention.
    FIG. 5 is a diagram illustrating the switching unit of FIG. 4. FIG.
    FIG. 6 is a diagram illustrating a switching unit located at a rear surface of FIG. 4.
    FIG. 7 is a diagram illustrating a connection state of a switching unit when a printed circuit board of a memory module according to the present invention is used in a buffered DIMM 4M × 72 module.
    8 is a diagram illustrating a connection state of a switching unit when a printed circuit board of a memory module according to the present invention is used in a buffered DIMM 4M × 64 module.
    -Explanation of symbols for the main parts of the drawings-
    1-18: 1st mounting part-18th mounting part
    20: substrate 30: component
    40: buffer 50: switching unit
    51 to 62, 51 'to 62': contact point
    70: resistance
    In order to achieve the above object, the present invention provides a printed circuit board of a buffered memory module having a mounting portion and a buffer in which 18 memory components can be mounted, and a printed circuit board of a buffered DIMM 4M × 64 module and a buffered circuit. And a switching unit for distributing the CAS signal for use as a printed circuit board of the DIMM 4M × 72 module.
    Referring to the operation of the present invention made as described above are as follows.
    By varying the wiring of the CAS signal supplied to each memory component from the switching unitToIt is used as a printed circuit board for a buffered DIMM 4M × 64 module by connecting all signals to memory components.WowOnly signals can be supplied to each memory component and used as a printed circuit board for buffered DIMM 4M × 72 memory modules.
    Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the present embodiment is not intended to limit the scope of the present invention, but is presented by way of example only and the same parts as in the conventional configuration using the same reference numerals and names.
    4 is a front view of a printed circuit board which can be used as a buffered DIMM 4M × 64 module and a buffered DIMM 4M × 72 module as a printed circuit board of the memory module according to the present invention.
    As shown in Fig. 4, a mounting portion for mounting nine components 30 on the front surface of the substrate is formed, and a buffer 40 is mounted at the center thereof, and a 4M × 64 module and 4M are provided at the output of the buffer 40. One switching unit 50 is provided to select the x72 module. In addition, the rear surface is formed in the same manner as the front surface.
    The CAS signal is connected to the CAS lines of the first and second mounting parts 1 and 2 by the same line, and the CAS lines of the third and fourth mounting parts 3 and 4 are connected by the same line. The CAS lines of the mounting portions 5, 6 and 7 are connected in the same line, and the eighth and ninth mounting portions 8 and 9 are connected in the same line, and the tenth and eleven positions are located on the back of the printed circuit board 20. CAS lines of the mounting portions 10, 11 are connected in the same line, CAS lines of the 12, 13 mounting portions 12, 13 are connected in the same line, and 14, 15, 16 mounting portions 14, 15 ( The CAS lines of 16) are connected in the same line, and the CAS lines of the 17th and 18th mounting parts 17 and 18 are connected in the same line.
    5 is an enlarged and detailed view of the switching unit 50 of the printed circuit board of the memory module according to the present invention. As shown in FIG. 5, the output terminal CAS0 of the buffer 40 and the first, third, and fifth contact 51, 53, and 55 are connected to the CAS line of the second mounting part 2, and the buffer 40 Output ofAnd the second contact 52 are connected, the output terminal of the buffer 40And the fourth contact 54 are connected, and an output terminal of the buffer 40And the sixth contact 56 is connected, the first ', 2' contact 51 ', 52' is connected to the CAS line of the fourth mounting portion 4, the third ', 4' contact 53 ' 54 'is connected to the CAS line of the sixth mounting portion 6, and the fifth' and 6 'contacts 55' and 56 'are connected to the CAS line of the eighth mounting portion 8.
    6 is an enlarged view of the switching unit 50 installed on the rear surface of the printed circuit board of the memory module according to the present invention. As shown in Figure 6, the output end of the buffer 40And the seventh, nineth, and eleventh contacts 57, 59, and 61, and are connected to the CAS line of the tenth mounting portion 10, and the output terminal of the buffer 40.And the eighth contact 58 and the output terminal of the buffer 40And the tenth contact 60 and an output terminal of the buffer 40And the twelfth contact 62, the 7 ', 8' contact 57 ', 58' is connected to the CAS line of the twelfth mounting portion 12, the 9 ', 10' contact 59 ' ) 60 'is connected to the CAS line of the 14th mounting part 14, and the 11', 12 'contact 61', 62 'is connected to the CAS line of the 16th mounting part 16.
    In order to explain in detail the operation of the present embodiment made as described above the Figure 7 showing the front of the state using the printed circuit board of the memory module according to the present invention as a buffered DIMM 4M × 64 module of the memory module according to the present invention Referring to the drawing of FIG. 8 showing the front surface of the printed circuit board using the buffered DIMM 4M × 72 module as follows.
    First, as shown in FIG. 7 using a printed circuit board of a memory module as a buffered DIMM 4M × 72 module, the first contact 51 and the first 'contact 51' are used, and the third contact 53 and the third '. The contact 53 'is connected to the fifth contact 55 and the fifth contact 55' with a 0 kΩ resistor 70, and the seventh contact 57 and the seventh contact 57 'on the back are connected. The ninth contact 59 and the ninth contact 59 are connected to each other, and the eleventh contact 61 and the eleventh contact 61 are connected to each other with a 0Ω resistor 70. Then, the component 30 is mounted on all the mounting portions.
    thenThe signal is input to the CAS lines of the second, fourth, sixth and eighth mounting parts 2, 4, 6 and 8The signal is input to the CAS lines of the tenth, twelve, fourteen, and sixteen mounting portions 10, 12, 14, and 16, and has the same wiring as the dedicated buffered DIMM 4M × 72 module used alone. The printed circuit board of the memory module can be used as a buffered DIMM 4M × 72 module.
    Next, as shown in FIG. 8 using the printed circuit board of the memory module as the buffered DIMM 4M × 64 module, the second contact 52 and the second 'contact 52' are used, and the fourth contact 54 and the fourth contact. The contact 54 'is connected to the sixth contact 56 and the sixth contact 56' with a 0 kΩ resistor 70, and the eighth contact 58 and the eighth contact 58 'on the back are connected. The tenth contact 60 and the tenth 'contact 60' are connected to the twelfth contact 62 and the twelfth 'contact 62' with a 0Ω resistor 70. The component is mounted on all the remaining mounting portions without mounting the component 30 in the fifth mounting portion 5 and the fourteenth mounting portion 14 on the rear surface.
    thenThe signal is input to the CAS line of the second mounting part 2The signal is sent to the CAS line of the fourth mounting portion 4,The signal to the CAS line of the sixth mounting part 6,Signals are respectively connected to the CAS line of the eighth mounting portion 8 and are not shown in the drawing.The signal is on the CAS line of the tenth mounting portion 10,The signal to the CAS line of the twelfth mounting portion 12,The signals are respectively connected to the CAS lines of the fourteen mounting parts 14.
    Therefore, the same wiring as the dedicated buffered DIMM 4M × 64 module used exclusively enables the printed circuit board of the memory module according to the present invention to be used as the buffered DIMM 4M × 64 module.
    In the present embodiment, the wiring of the switching unit 50 is connected by using a 0 kΩ resistor 70, but the same effect can be obtained even when the wiring is made of another material having no resistance.
    As described above, the present invention can be used in a buffered DIMM 4M × 64 module and a buffered DIMM 4M × 72 module by simply changing the wiring of the switching unit of the printed circuit board of the memory module. Even if the stock occurs on the printed circuit board of the advantage that can be easily changed and used.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] In a printed circuit board of a buffered memory module having a mounting portion and a buffer in which 18 memory components can be mounted,
    Switching unit for distributing CAS signal for use as printed circuit board of buffered DIMM 4M × 64 module and printed circuit board of buffered DIMM 4M × 72 module
    Printed circuit board of the memory module, characterized in that consisting of.
    [2" claim-type="Currently amended] The method of claim 1, wherein the switching unit
    The output signal of the bufferIs connected to the 1st to 9th mounting parts,Select to be connected to the tenth to eighteenth mounting portions;
    Is connected to the first and second mounting partsTo the 3rd and 4th mounting partsTo the 5th, 6th and 7th mounting partsTo the 8th and 9th mounting partsTo the 10th and 11th mounting partsTo the 12th and 13th mounting partsIs connected to the 14th, 15th and 16th mounting partsTo be connected to the 17th and 18th mounting parts
    Printed circuit board of the memory module, characterized in that.
    [3" claim-type="Currently amended] The method of claim 1, wherein the buffered DIMM 4M × 64 module
    With memory components mounted in both first to eighteen mounting parts
    Printed circuit board of the memory module, characterized in that.
    [4" claim-type="Currently amended] The method of claim 1, wherein the buffered DIMM 4M × 72 module
    With memory components in all mounting parts except the fifth and fourteenth mounting parts
    Printed circuit board of the memory module, characterized in that.
    类似技术:
    公开号 | 公开日 | 专利标题
    US9824036B2|2017-11-21|Memory systems with multiple modules supporting simultaneous access responsive to common memory commands
    US6109929A|2000-08-29|High speed stackable memory system and device
    US6692293B2|2004-02-17|Technique for identifying multiple circuit components
    US4825414A|1989-04-25|Semiconductor integrated circuit device having gate array and memory and input-output buffer
    JP4128234B2|2008-07-30|Memory device, processing system, method for controlling memory device and method for operating dynamic random access memory
    US5257233A|1993-10-26|Low power memory module using restricted RAM activation
    JP4020271B2|2007-12-12|Large memory capacity DIMM with data and state memory
    KR100509007B1|2005-08-18|Buffer to multiple memory interface
    JP4865182B2|2012-02-01|Printed circuit board for memory module and memory module
    TW426993B|2001-03-21|SIMM/DIMM memory module
    KR910000589B1|1991-01-26|Memory system providing a continuous address space
    US5953215A|1999-09-14|Apparatus and method for improving computer memory speed and capacity
    JP3077866B2|2000-08-21|Memory module
    US6202110B1|2001-03-13|Memory cards with symmetrical pinout for back-to-back mounting in computer system
    JP4225592B2|2009-02-18|Memory module
    US5371866A|1994-12-06|Simulcast standard multichip memory addressing system
    US5196994A|1993-03-23|Card type integrated circuit and respective 8/16-bit card connector
    US8516185B2|2013-08-20|System and method utilizing distributed byte-wise buffers on a memory module
    KR890004820B1|1989-11-27|Stacked double density memory module using industry standard memory chips
    US6233650B1|2001-05-15|Using FET switches for large memory arrays
    US7035116B2|2006-04-25|Memory system and memory subsystem
    US6697888B1|2004-02-24|Buffering and interleaving data transfer between a chipset and memory modules
    US20170249265A1|2017-08-31|Asymmetric-channel memory system
    DE10229120B4|2004-05-27|Method, adapter card and arrangement for installing memory modules
    DE69637344T2|2008-10-16|Semiconductor memory
    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-06-30|Application filed by 김영환, 현대전자산업 주식회사
    1998-06-30|Priority to KR1019980026227A
    2000-01-25|Publication of KR20000004731A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019980026227A|KR20000004731A|1998-06-30|1998-06-30|Printed circuit board of memory module|
    [返回顶部]