• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
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  • 优先权
    • 专利摘要:
    A solder wave surface forming means for melting the solder to form a solder wave surface, and a separator dispersing means for dispersing a solder oxide separating the solder and the solder oxide into the solder oxide. Provided is a soldering apparatus, a solder and a solder oxide separating agent, and a method for separating the powder, legume powder, grains or powder of seeds, soybean meal powder, and peanut shell powder. do.
    公开号:KR19990072895A
    申请号:KR1019990006090
    申请日:1999-02-24
    公开日:1999-09-27
    发明作者:가와시마야스지；시미즈가오루
    申请人:마츠시타 덴끼 산교 가부시키가이샤；
    IPC主号:
    专利说明:

    Soldering Apparatus, Solder and Solder Oxide Separation and Separation Method {SOLDERING APPARATUS, AND AGENT AND METHOD FOR SEPARATING SOLDER AND SOLDER OXIDES}
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus and a solder recovery apparatus for use in a printed wiring board, and more particularly, to a soldering apparatus and a solder recovery apparatus for separating and recovering solder oxides attached with solder into solder and solder oxides.
    The present invention also relates to a method of separating the solder oxide with solder into solder and solder oxide, and a method of separating the solder oxide in contact with the molten solder into solder and solder oxide.
    The present invention also relates to a separator that separates the solder oxide from the solder oxide to which the solder adheres or the solder oxide in contact with the molten solder.
    Moreover, this invention relates to the storage container which accommodates the solder oxide with which the solder adhered, or the solder oxide which contacts the molten solder.
    When soldering an electronic component to a printed wiring board or the like using a dip-type soldering apparatus or a flow-type soldering apparatus, a large amount of solder oxide is generated. Furthermore, when the solder oxide is removed from the molten solder and discharged out of the solder bath to solidify, it is observed that a large amount of solder adheres to the solder oxide.
    Solder oxides to which these solders are attached are sold at low prices to reclaimers. In order to prevent the oxidation of the solder, an antioxidant such as heat-resistant mineral oil is added to the surface of the molten solder or an inert gas such as nitrogen gas is enclosed in the solder bath and the surroundings to reduce the oxygen concentration to minimize the oxidation of the solder. there was.
    On the other hand, powder products prepared by adding potassium salt to ammonium borohydrochloride as a solder oxide separator / reducing agent capable of separating solder from solder oxide to which solder adheres can remove only solder oxide are commercially available ( Product name: KLEENOX OR-904P, sold by ELECTROVERT.
    Furthermore, Japanese Unexamined Patent Application Publication No. 5-63349, for example, proposes a flow solder tank provided with means for flowing solder oxide out of the solder bath while maintaining the heat resistance.
    However, the above-described conventional method of selling solder oxide to a reclaimer has a large loss of solder because expensive solder is attached to the solder oxide in large quantities.
    The method of adding an antioxidant to the surface of the molten solder is not only annoying to clean, but also adheres to a printed wiring board because the solder tank is sticky and dirty with antioxidant oil or the like.
    The solder tank disclosed in Japanese Patent Laid-Open No. 5-63349 also has similar problems, such as heat-resistant oil retention in the solder storage portion or clogging of the duct for solder.
    The method of using inert gas is expensive and equipment becomes large or complicated.
    Powdered separators containing ammonium borate as the main component are expensive at around 6000 yen / 450g and require safety management such as being careful not to touch the skin or wearing protective glasses when handling.
    SUMMARY OF THE INVENTION The main object of the present invention is to provide a soldering apparatus and a solder recovery apparatus which can prevent the soldering apparatus from being contaminated with an antioxidant such as maintaining heat resistance, which is safe and pollution-free, and which can easily remove the solder oxide floating on the molten solder. will be.
    Another object of the present invention is to provide a method for removing a solder oxide, which can prevent the soldering device from being contaminated with an antioxidant such as maintaining heat resistance, and is safe and pollution-free, and can easily remove solder oxide floating on the molten solder. will be.
    It is still another object of the present invention to provide a separator capable of easily separating and removing only the solder oxide when the solder oxide to which the solder is attached is immersed in the molten solder, and a solder recovery apparatus using the separator.
    It is still another object of the present invention to provide a separator capable of easily separating the solder oxide from the solder oxide to which the solder adheres or the solder oxide in contact with the molten solder.
    It is a further object of the present invention to provide a storage container for accommodating solder oxide to which solder is attached or solder oxide in contact with molten solder.
    These and other objects and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings.
    1 is a sectional view of an essential part of a soldering apparatus as one embodiment of the present invention;
    FIG. 2 is a view showing a method for removing solder oxide using a soldering apparatus shown in cross-sectional view of the main part shown in FIG.
    3 is a perspective view of an essential part of a solder flow dividing device constituting the soldering apparatus of FIG. 1;
    4 is a side cross-sectional view showing a main portion of a separator dispersing device of one embodiment constituting the soldering apparatus of FIG. 1;
    Fig. 5 is a side sectional view showing a main part of a separator dispersing device of another embodiment constituting the soldering device of Fig. 1.
    Fig. 6 is a side cross-sectional view showing a main portion of a separator dispersing device of still another embodiment of the soldering device of Fig. 1.
    7 is a schematic view showing each step of the method for separating solder and solder oxide.
    In order to solve the above problems, the soldering apparatus of the present invention comprises solder wave surface forming means for melting the solder to form a solder wave surface, and a separator for separating the solder and the solder oxide onto the solder oxide ( A separating agent dispersing means for coating, wherein the separating agent is a vegetable member, more specifically bran type, grain or powder of grains, powder of legumes, grain or powder of seeds, soybean meal powder, and The composition consists of any one or a combination thereof selected from the group consisting of peanut shell powder.
    In the soldering apparatus of the present invention, the vegetable separating agent that separates the solder and the solder oxide is rice bran, rice bran, bran, barley mixed bran, rice barley bran, rice barley mixed bran, etc. Blood, sorghum, rice, and the like, soybean powder, soybean, red bean, peanut, coconut, etc .; seeds or powder of sesame seeds, sunflower, palm, rapeseed, cottonseed, or the like, or a combination thereof. It is a soldering apparatus.
    For example, the separating agent which mixed rice bran and sesame powder in the ratio of weight ratio 100: 20-100: 5 may be sufficient. Mixing sesame powder with bran lengthens the duration of separation.
    Of course, other combinations or mixtures of two or more kinds of separation agents may be optionally used.
    Furthermore, the method for separating the solder oxide from the molten solder according to the present invention includes the steps of floating the solder oxide floating on the molten solder (around 280 ° C to 290 ° C) into a container, and any one of the above-described separating agents (for example, rice bran). Or a step of dusting the combination on the solder oxide, a step of pulling the container out of a solder bath to separate the solder and the solder oxide, and a step of discharging the separated solder oxide (oxidized dregs). It is.
    Furthermore, another solder oxide separation method according to the present invention comprises the steps of dispersing any one of the above-described separators (e.g., coarse grains) or a combination thereof in a solder oxide suspended on the molten solder, and a solder oxide suspended on the molten solder. It takes out the process of floating out and putting into a container, a process of pulling up the said container from a solder tank, separating a solder and a solder oxide, and a process of discharge | released the separated solder oxide.
    Furthermore, the container (used in the above-described soldering apparatus or method) which floats the solder oxide suspended above the molten solder according to the present invention has a mesh opening, (through hole) area of about 1 to 10 mm 2 , preferably it was configured to form a press-forming a punching metal having a plurality of apertures with 1~2.25mm 2 about the network baskets (netted basket), or 2 1~2.25mm degree of opening areas to the bottom surface and each side.
    The range setting of the opening area of 1 to 10 mm 2 in the net basket or punching metal is performed in the experiment for the purpose that the solder separated from the solder oxide is smoothly refluxed into the molten solder bath so that the oxide residue (solder oxide) stays in the container. Obtained by The constituent members of the mesh basket or punched metal are made of a material which is free of solder such as stainless steel.
    The mesh basket described above is formed with the diameter of the constituent wire of the mesh about 0.3 to 0.7 mm and one side of the rectangular opening about 1.0 to 3 mm. Preferably, the diameter of the constituent wire of the network is about 0.5 mm, and one side of the rectangular opening is 1.2 mm.
    The mechanism for separating the solder oxide attached to the solder or the solder oxide in contact with (or floating thereon) into the solder and the solder oxide by the above-described separating agents can be considered as follows. That is, the oil component constituting the separating agent (the organic acid R- (COOH) n component (i.e., oleic acid, linoleic acid, palmitic acid, etc.) contained in the oil) has a reduction effect as illustrated in the following scheme with respect to the metal oxide. Indicates.
    SnO 2 + 4RCOOH → [RCOO] 4 Sn + 2H 2 O
    Moreover, it is thought that the phosphorus (P) and fats and oils contained in a separating agent exhibit the antioxidant function of a solder.
    In addition, it is thought that the fibers, hydrocarbons, and the like constituting the separating agent bind to the solder oxide to inhibit the bonding between the molten solder and the solder oxide.
    It is thought that the component heated with the molten solder and converted into carbon (C) reacts as shown in the following reaction formula.
    SnO 2 + C → Sn + CO 2
    At this time, carbon acts as a reducing agent.
    Furthermore, if sodium (Na) is contained in the separating agent, Na also acts as a reducing agent.
    The particle size distribution of each powdery separator does not need to be adjusted in particular.
    The particle size distribution produced during the polishing process of brown rice or during the manufacturing of flour may be used (a range of about 0.01 μm to 1 mm).
    In this regard, one of the bran components among the types of bran, for example, phosphorus (P) 2% or less, protein 13.4%, crude fat 17.1%, crude fiber 7.9%, crude ash 10.2%, Calcium 0.06%, most of the rest is digestive components (chicken, pigs, cattle, etc.) (other components are omitted). The rice bran is made of pulverized products such as rinds of skin, seed, and embryo obtained when white rice or the like is whitened.
    Some commercially available pickled rice bran is added with salt, kelp, red pepper, etc., but the effect as a separating agent is equivalent to that of rice bran itself.
    Furthermore, a predetermined amount of a preservative (for example, a benzoic acid compound) and an insect repellent may be mixed in rice bran, and preservative or insect repellent treatment may be performed.
    For the grains of crude, sorghum and blood in cereals, each component contains approximately 7.0 g of fat, 240 mg of phosphorus (P), 7 mg of sodium (Na), 21 mg of calcium (Ca), 5 mg of iron, protein in 100 g of edible portion. 9.9 g (other components are omitted) and the like.
    Sorghum is composed of 9.1 g of fat, 270 mg of phosphorus (P), trace amounts of sodium (Na), 20 mg of calcium (Ca), 3.5 mg of iron, and 12.7 g of protein (excluding other components).
    Blood is composed of 8.3 g of fat, 330 mg of phosphorus (P), trace amounts of sodium (Na), 33 mg of calcium (Ca), 3.5 mg of iron, and 9.3 g of protein (omit other components).
    Among the beans, the soybean is composed of 17.5 g of fat, 470 mg of phosphorus (P), 3 mg of sodium (Na), 190 mg of calcium (Ca), 7 mg of iron, and 34.3 g of protein (omit other components). (In either of the above cases, refer to the "Chemical Application", Japanese Chemical Society, 1973 Edition, pages 1366-1367, pages 1404-1405, and KK Corporation).
    Therefore, since each of the above-mentioned separation agents other than rice bran contains an oil component, phosphorus or an oil component, the solder oxide contacting the molten solder or the solder oxide to which the solder adheres like the rice bran is separated into solder and solder oxide.
    Particularly effective are powders of legumes rich in fats and oils (soybeans, red beans, peanuts, coconuts, etc.) or seeds or powders (seeds, sunflowers, palms, rapeseeds, etc.). Sesame fatty acids contain large amounts of oleic and linoleic acid.
    Crude grains are odorless and easily supplied in grains in cereals. The crude granules are generally spherical or popcorn-shaped and have an outer diameter of about 1 to 2 mm and a length of about 1 to 2 mm. The particle size adjustment and the pulverization may be optionally performed as necessary. The crude grains are fed in the same amount as the rice bran when the solder oxide is separated.
    Moreover, the separating agent of the present invention may be combined with two or more kinds of members as described above in addition to being composed of one kind of members.
    Furthermore, the present invention provides a bran type (e.g. rice bran, rice bran, bran, barley mixed bran; rice barley bran, rice barley mixed bran, etc.), legume powder (soybean) , Soybean meal powder, peanut shell powder, seed powder (such as sesame seeds, sunflowers, palms, rapeseeds, cotton thread, etc.), or a combination thereof.
    Further, the present invention provides a process for injecting solder oxide with solder into a container, immersing the container in a molten solder bath (about 280 ° C to 290 ° C) to melt the solder oxide with solder, and Dispersing any one of the separating agents (e.g. rice bran) or combinations thereof in solder oxide to which the solder is attached, and pulling the container out of the molten solder bath to separate the solder from the solder oxide. A method of separating the adhered solder oxide into solder and solder oxide.
    Furthermore, the present invention is a method of separating the solder oxide attached with the solder into solder and solder oxide, wherein the container is pulled up from the solder bath and immersed in the solder bath again, or after spreading the separating agent, a plurality of containers are held up and down. It relates to a separation method further comprising a step of moving once.
    Furthermore, the present invention is another method of separating the solder oxide with solder into solder and solder oxide, comprising the steps of injecting the solder oxide with solder into a container, and any one of the above-described separating agents (for example, rice bran). Or dispersing the combination in solder oxide with solder, immersing the container in a molten solder bath to melt solder oxide with solder, and pulling the container out of the solder tank to obtain solder and solder oxide. It relates to a separation method comprising the step of separating.
    Furthermore, the present invention is another method of separating the solder oxide with solder into solder and solder oxide, the process of immersing the container in the molten solder tank about half, and injecting the solder oxide with solder into the container. And dispersing any one of the above-described separating agents (for example, rice bran) or a combination thereof in the solder oxide to which the solder is attached, and after melting the solder oxide to which the solder is attached, the container is pulled up from the solder bath and soldered. It relates to a separation method comprising a step of separating and the solder oxide.
    Furthermore, the present invention is a method of separating the solder oxide in contact with the molten solder into the solder and the solder oxide, the step of removing the floating solder oxide on the molten solder into a container, and any one of the above-described separating agent (such as rice bran) Or a step of dispersing the combination in solder oxide and a step of lifting the container out of the solder bath to separate the solder and the solder oxide.
    Furthermore, the present invention provides a method of dispersing any one of the above-described separating agents (for example, rice bran) or a combination thereof in solder oxide suspended on the molten solder, removing the solder oxide suspended on the molten solder and placing it in the container, and the container. And a step of separating the solder and the solder oxide from the solder tank by the step of separating the solder and the solder oxide into the solder and the solder oxide.
    In addition, the present invention is a mesh (mesh) opening (through hole) area of an opening with 1~10mm 2, preferably about 2 1~2.25mm the network baskets or 2 1~2.25mm degree of opening areas of the The storage container which accommodates the solder oxide with which the solder adhered, or the solder oxide which contact | connects a molten solder consists of a press-formed punching metal which has a bottom face and a plurality in each side.
    The structural members of the mesh basket or the punching metal are made of a material which is free of solder such as stainless steel.
    The mesh basket is formed with a diameter of about 0.3 to 0.7 mm and a side of a rectangular opening of about 1.0 to 3 mm. Preferably, the diameter of the mesh is about 0.5 mm. Let one side of about 1.2mm.
    According to the essential configuration described above, it is possible to provide a solder and solder oxide separating agent, a method of separating solder, and a soldering apparatus (or solder recovery apparatus), which are safe in operation, inexpensive, harmless to humans, and do not cause pollution. Moreover, the present invention can easily automate the separation operation of the solder oxide and reduce the amount of solder discarded while attached to the solder oxide. As a result, the utilization rate, recovery rate, and the like of the solder can be improved, which is useful for protecting the global environment.
    A first embodiment of the present invention includes a solder wave surface forming means for melting solder to form a solder wave surface, and a means for dispersing a solder oxide separating the solder and the solder oxide in the solder oxide. It provides a soldering apparatus, characterized in that any one or combination thereof selected from the group consisting of grains or powder of grains, powders of legumes, grains or powders of seeds, soybean meal powder and peanut shell powder. This soldering apparatus is harmless and does not cause pollution, and can very easily separate solder and solder oxide. In addition, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    According to a second embodiment of the present invention, the bran type is any one selected from the group consisting of rice bran, rice bran, bran, barley mixed bran, rice barley bran, rice barley mixed bran, and combinations thereof. And any one or a combination thereof selected from the group consisting of rice, and the beans may be any one or a combination thereof selected from the group consisting of soybean, red bean, peanut, and coconut, and the seeds may be sesame, sunflower, palm, or rapeseed. The soldering apparatus according to the first embodiment is characterized in that it is any one selected from the group consisting of, or a combination thereof. According to this soldering apparatus, solder and solder oxide can be separated very inexpensively, and waste can be effectively used.
    Furthermore, the third embodiment of the present invention provides the soldering apparatus according to the first embodiment, further comprising means for extracting the solder oxide. According to this soldering apparatus, removal of solder oxide can be automated and soldering of a printed wiring board can be performed continuously.
    Moreover, the 4th Embodiment of this invention provides the soldering apparatus which concerns on 3rd Embodiment characterized by further equipped with the discharge means which discharge | releases the discharged solder oxide from a container. According to this soldering apparatus, removal of solder oxide can be automated and soldering of a printed wiring board can be performed continuously.
    Furthermore, the fifth embodiment of the present invention spreads a step of floating the solder oxide floating on the molten solder into the container, and the separating agent of any one or a combination of the separating agents according to the first or second embodiment. And a step of separating the solder and the solder oxide by pulling the container out of the solder tank, and discharging the separated solder oxide (oxidized dreg). By this method, the removal of the solder oxide can be automated and the soldering operation of the printed wiring board can be performed continuously. Furthermore, the amount of solder discarded with the solder oxide attached can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the sixth embodiment of the present invention is a step of dispersing any one or a combination of the separators according to the first or second embodiment in solder oxide floating on the molten solder, and the solder floating on the molten solder. A step of removing the oxide into the container, lifting the container out of the solder tank to separate the solder and the solder oxide, and discharging the separated solder oxide (oxide residue); Provided is a method for separating solder oxides. According to this method, removal of solder oxide can be automated and soldering of a printed wiring board can be performed continuously. Furthermore, the amount of solder discarded with the solder oxide attached can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the seventh embodiment of the present invention provides the soldering apparatus according to the first embodiment, further comprising a solder oxide scraping means for scraping the solder oxide separated from the molten solder out of the solder bath. do. This soldering apparatus is harmless and does not cause pollution, and can very easily separate solder and solder oxide. In addition, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the eighth embodiment of the present invention provides the soldering apparatus according to the first embodiment, further comprising solder oxide flow means for flowing the solder oxide separated from the molten solder as an inert gas. This soldering apparatus can separate solder and solder oxide extremely easily. Moreover, it is useful to protect the global environment because it can improve the utilization and recovery rate of solder.
    Furthermore, the ninth embodiment of the present invention is a bran type (rice bran, rice bran, bran, barley mixed bran, barley rice bran, barley rice mixed bran, etc.) for separating the solder oxide to which the solder adheres or the solder oxide in contact with the molten solder. , Soybean powder (soybean, red bean, peanut, coconut, etc.), soybean meal powder, peanut shell powder and seed powder (sesame, sunflower, palm, rapeseed, etc.) any one or a combination thereof. This embodiment can provide an extremely inexpensive separating agent that is harmless to the human body and does not cause pollution. In addition, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the tenth embodiment of the present invention is a step of injecting solder oxide with solder into a container, immersing the container in a molten solder bath to melt the solder oxide with solder described above, and a ninth embodiment. A step of dispersing any one or a combination of solar separators and a step of lifting the container out of the solder bath to separate the solder and the solder oxide. And a method for separating into the solder oxide. According to this embodiment, the solder oxide separation operation can be carried out simply and easily, and the amount of solder discarded while attached to the solder oxide can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the eleventh embodiment of the present invention comprises the steps of injecting a solder oxide with solder into a container, and any one or a combination of the separators according to the ninth embodiment is applied to the solder oxide with the above-described solder. Spreading, immersing the container in a molten solder bath to melt the solder oxide adhered to the solder, and pulling the container out of the solder bath to separate the solder and the solder oxide. The present invention also provides a method for separating the solder oxide to which the solder is attached into the solder and the solder oxide. According to this embodiment, the separation operation of the solder oxide can be performed easily and easily, and the amount of solder discarded while the solder oxide is attached can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Further, the twelfth embodiment of the present invention is one of the steps of immersing a container in a molten solder tank halfway, injecting solder oxide with solder into the container, and the separators according to the ninth embodiment. Or a step of dispersing the combination in the solder oxide to which the solder is attached, and after melting the solder attached to the solder oxide, pulling the container out of the solder bath to separate the solder and the solder oxide. It provides a method for separating the solder and the solder oxide attached to the solder. According to this embodiment, the separation operation of the solder oxide can be performed easily and easily, and the amount of solder discarded while attached to the solder oxide can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Further, the thirteenth embodiment of the present invention comprises the steps of removing the floating solder oxide on the molten solder into the container, dispersing any one or a combination of the separating agents according to the ninth embodiment, and Provided is a method for separating solder oxide in contact with molten solder into solder and solder oxide, the method comprising pulling up from a solder bath to separate solder and solder oxide. According to this embodiment, the separation operation of the solder oxide can be performed easily and easily, and the amount of solder discarded while attached to the solder oxide can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the fourteenth embodiment of the present invention is a process of dispersing any one or a combination of the separators according to the ninth embodiment in a solder oxide floating on the molten solder, and removing the solder oxide floating on the molten solder. A method of separating solder oxide in contact with molten solder into solder and solder oxide, comprising the steps of putting the container into a container and separating the solder and the solder oxide from the solder tank. According to this embodiment, the separation operation of the solder oxide can be performed easily and easily, and the amount of solder discarded while attached to the solder oxide can be reduced. As a result, the utilization rate and recovery rate of the solder can be improved, which is useful for protecting the global environment.
    Furthermore, the fifteenth embodiment of the present invention has a plurality of openings each having an opening area of 1 to 2.25 mm 2 at the bottom and each side thereof to accommodate solder oxides to which solder is attached or solder oxides in contact with molten solder. Provide a storage container. This container can separate the solder and the solder oxide easily and efficiently.
    Furthermore, the sixteenth embodiment of the present invention is made of a mesh basket and has a diameter of 0.3-0.7 mm in the diameter of the mesh wire, 1.0-1.5 mm in one side of the rectangular opening, and preferably a diameter of the diameter of the mesh wire. A storage container for accommodating solder oxide with solder or solder oxide in contact with the molten solder is provided, wherein one side of the 0.5 mm and rectangular opening is about 1.2 mm. This container can separate the solder and the solder oxide easily and efficiently.
    EXAMPLE
    In the following Examples, the present invention will be described, but the scope of the present invention is not limited to these examples.
    1 is a cross-sectional view of an essential part of a soldering apparatus in one embodiment of the present invention, FIG. 2 is a view showing one embodiment of a method for separating or removing solder oxide using the soldering apparatus of FIG. The perspective view of the main part of the solder outflowing device which comprises the soldering apparatus of this invention is shown.
    In Fig. 1, reference numeral 1 denotes a solder jet nozzle, 2 a front baffle plate, 3 a rear rectifier plate, 4 a porous plate, 5 a solder bath, 6 a solder corrugated plate of molten solder. 7 is a solder oxide to which solder is attached, 8 is a separator (such as rice bran), 9 is a container (such as a mesh basket), 10 is a sifting container for receiving and dispersing, 11 is a partition plate, 17 denotes a solder oxide (oxide residue), 20 denotes a soldering device, and 30 denotes a frit wiring board. In Fig. 3, reference numeral 12 denotes a through hole, 13 denotes a discharge pump, 14 denotes a shaft, 15 denotes a duct 16 of molten solder, and 21 denotes a solder dividing device.
    1 and 3, the solder corrugated surface 6 is formed by molten solder refluxed by the solder splitter 21, and solders the printed wiring board 30 moving in the direction of the arrow in a given pattern.
    The solder sorting device 21 is provided in a solder bath. In the solder flow dividing apparatus 21, the discharge pump 13 sucks molten solder from the opening 16 and blows it out of the solder flow dividing nozzle 1 through the duct 15 to discharge the front rectifying plate 2 and the rear rectifying plate. (3) forms a desired solder wave surface.
    The porous plate 4 provided in the middle of the solder classification nozzle 1 has a plurality of passage holes formed in a plurality of rows and columns at a predetermined pitch, and impurity and metal mixed in the molten solder. Remove lumps, lead wires, etc. In other words, the porous plate 4 serves as a filter.
    The molten solder that has flowed out of the rear rectifying plate 3 is circulated by the discharge pump 1, resulting in a large amount of solder oxide in contact with the air. The generated solder oxide moves on the surface of the molten solder in the direction of the partition plate 11 shown in FIG. 1 and accumulates therein.
    The solder oxide storage container 9 is provided in the molten solder in the vicinity of the partition plate 11. The storage container 9 is made of a mesh basket on a mesh, the diameter of the constituent wire of the mesh is about 0.5 mm, and one side of the rectangular opening is about 1.2 mm. The container 9 is configured to be lifted from the (A) position in the solder bath 5 to stop at the (B) position or to be inverted to the (C) state. Moreover, it is comprised so that a container can be stopped in arbitrary positions, such as position (D) shown in FIG. The container 9 may be driven using a common general mechanism (not shown) such as a fluid cylinder and a pulse motor.
    Furthermore, a sifting container 10 is disposed above the container 9 outside the solder bath 5. In the sieving container 10, powdery separating agents such as rice bran are stored, and the separating agent is scattered on the solder oxide accumulated in the vicinity of the partition plate 11 by shaking, vibration or the like from the meshed portion of the lower surface. do. Oscillation and vibration can be performed using any general means, such as an electromagnetic vibrator, an eccentric cam, a motor, and a link mechanism.
    On the right side of the partition plate 11, a space for depositing and storing the solder oxide (oxidized residue) 17 is also configured. (Of course, you may arrange a dedicated container)
    Next, a method of separating the solder oxide floating on the molten solder using the soldering apparatus of the above-described configuration will be described.
    (Separation method 1)
    In the first step, the solder oxide 7 floating on the molten solder is floated into a mesh basket (container 9) and then the mesh basket is pulled up to about half (see FIG. 2; Mesh basket is in position of (D)].
    In the second step, the sifting container 10 is vibrated to scatter (or sprinkle) the separating agent 8 such as powdered rice bran, which is stored, on the surface of the solder oxide 7. The amount of dispersion of the separating agent may be such that the surface of the solder oxide 7 is almost covered. For example, with respect to 100 ml of the volume of the solder oxide 7, the spreading amount of the separating agent is made from a small amount to about 0.7 spoons with a small spoon.
    In the third step, the net basket is moved up and down or left and right so that the solder oxide 7 rises and falls from the molten solder surface. This operation is repeated several times.
    In the fourth step, it is confirmed that the volume of the solder oxide is reduced or that the solder attached to the solder oxide is separated, and the mesh basket is pulled up from the surface of the molten solder (the position in FIG. 1B).
    In the fifth step, the net basket is inverted and the oxidized waste 17 is discarded in the waste storage unit or the like (the position in FIG. 1C).
    In the first to fifth steps described above, the removal operation of the solder oxide suspended and accumulated on the molten solder is completed. At this time, the work takes about 1 minute.
    Furthermore, the above-described steps of the first to fifth steps may be arbitrarily changed, added or deleted as described below.
    (Separation Method 2)
    The above-mentioned second step, that is, dispersing the powdery separator 8 in the solder oxide 7 floating on the molten solder is first performed. Thereafter, the step of removing the floating solder oxide on the molten solder into the container, pulling the container out of the solder bath to separate the solder and the solder oxide, and inverting the mesh basket to invert the oxide residue 17 The waste disposal step may be performed sequentially (not shown).
    (Separation Method 3)
    Another separation method is to float the solder oxide (solder dross) 7 floating on the molten solder in the first step into a mesh basket (container 9) and collect the mesh basket on the surface of the molten solder. To a predetermined position of [osition in FIG. 1 (B)]. In this case, solder adheres to the solder oxide.
    In the second step, the sifting container 10 is vibrated to spread the contained separating agent 8 such as rice bran on the surface of the solder oxide 7. The amount of dispersion of the separating agent may be such that the surface of the solder oxide 7 is almost covered. For example, with respect to 100 ml of the volume of the solder oxide 7, the spreading amount of the separating agent is made from a small amount to about 0.7 spoons with a small spoon.
    In the third step, the net basket is lowered and immersed in the molten solder by about half (position (D) in Fig. 2). Thereafter, the mesh basket is moved up and down or left and right to cause the solder oxide 7 to rise and fall from the molten solder surface. This operation is repeated several times.
    In the fourth step, after confirming that the volume of the solder oxide is reduced and that the solder attached to the solder oxide has separated, the mesh basket is pulled up from the surface of the molten solder [Fig. 1 (B)].
    In the fifth step, the mesh basket is inverted and the oxidized waste 17 is discarded in the waste storage part or the like.
    Moreover, although the mesh basket was used as the storage container of the solder oxide 7 in the above-mentioned separation methods 1, 2 or 3, the container is not limited to the mesh basket and any member may be used. For example, the container may be formed of a punching metal formed by drilling a large number of circular or rectangular openings. As an example, a rectangular opening having an opening area of about 1 to 2.25 mm 2 is disposed on the bottom and each side of the container, and a plurality of rows and rows of about 1.5 to 2.0 mm are pitched. Matrix fashion].
    Similarly, in a flow type (wave-type) soldering apparatus, a plurality of solder jetting nozzles may be disposed, for example, two. Further, the separated solder oxide (oxidized dreg) 17 may be scraped off by a plate made of a heat-resistant squeegee, for example, stainless steel, instead of being lifted up by a container such as a net basket.
    Of course, an inert gas may be used to allow the solder oxide to flow from the molten solder surface into the waste storage portion. Furthermore, the time switch may be set to be controlled so as to automatically perform the removal operation of the solder oxide periodically, for example every two hours (not shown).
    Further, the dispersing means for the powdery separator may be any configuration other than the above. For example, as shown in Fig. 4, the hopper containing the separating agent and the cascade are electromagnetically vibrated, and the slide formed by forming through holes in the lower part of the hopper containing the separating agent as shown in Fig. 5. It is good also as a structure which arrange | positioned the board | plate, and the structure which arrange | positioned the rotor which formed many notches in the lower part of the hopper which accommodated the separating agent as shown in FIG.
    Furthermore, the above soldering apparatus may be used as a solder recovery apparatus for recovering solder from solder oxide to which solder is attached, in addition to being used as an apparatus for soldering various electronic components mounted on a printed wiring board. In this case, the method of recovering the solder is to immerse the solder oxide to which the solder adheres into the molten solder, and to separate and discharge only the solder oxide using the reducing or anti-oxidizing action of the separating agent.
    The solder recovery method of the present invention includes, for example, a step of injecting solder oxide attached with solder into a container having a plurality of openings in a bottom face and a side thereof, and immersing the vessel containing solder oxide attached with solder in molten solder. And dispersing the separating agent in the solder oxide to which the solder adheres; and pulling up the container from the molten solder. The separating agent is bran type, grains or powders of grains, powders of legumes and seeds. Or any one selected from the group consisting of powder, soybean meal powder, and peanut shell powder, or a combination thereof.
    Furthermore, in the solder recovery apparatus, instead of the flow type (classification) solder tank, a stationary (immersion type) solder tank having a flat solder wave surface may be used.
    (Separation Method 4)
    Next, FIG. 7 is a diagram showing a method for separating solder and solder oxide in one embodiment of the present invention. In FIG. 7, reference numerals 1 to 7 in parentheses indicate each step of the separation process.
    In the first step, a solder tank immersed in the solder oxide storage container 9 (about 0.5 mm in diameter of the mesh basket and wires of the mesh and about 1.2 mm in length of one side of the rectangular opening) attached to the solder (dip-solder bath). ) Or half immersed in a flow-solder bath (wave solder bath). The temperature of molten solder is set to about 280 degreeC-290 degreeC (FIG. 7 shows the flow solder tank 5).
    In the second and third stages, the mass of the solder oxide (solder oxide / solder dross attached) 7 to which the solder is attached is added to about half the volume of the net basket 9. . The container for discharging the solder dross 7 may use any means such as a spoon, nipper, tweezers, or the like.
    In the fourth step, the above-mentioned separating agent 8 such as rice bran is scooped out with a spoon and spread (spread) onto the surface of the solder oxide 7 to which the solder is attached. The amount of dispersion of the separating agent may be such that the above-mentioned solder almost covers the solder oxide 7 attached thereto. For example, with respect to 100 ml of the volume of the solder oxide 7 to which the solder adheres, the amount of dispersion of the separating agent may be about 0.7 spoons from a small spoon.
    In the fifth step, the mesh basket 9 is moved up and down or left and right so that the solder oxide 7 to which the solder is attached rises and falls from the molten solder surface 18. This operation is repeated several times.
    In the sixth step, the net basket 9 is pulled from the molten solder surface 18 after confirming that the volume of the solder oxide 7 adhered to the solder is reduced and that the solder attached to the solder oxide has melted.
    In the seventh step, the oxidized residue (solder oxide) 17 remaining in the net basket 9 is discarded in the waste container or the like.
    The separation operation of the solder and the solder oxide is completed by the above first to seventh steps. The working time for this separation is about 1 to 2 minutes. By this separation operation, more than 90% of the solder adhering to the solder oxide can be recovered, and the volume of the solder oxide itself can be reduced to about 10 to 20% of the original volume.
    According to the method of the present invention, the separation of the solder and the solder oxide can be carried out very easily and safely within a short time, and no wearing of protective equipment is required when handling the separating agent. Moreover, since rice bran is used as a separating agent, the method of the present invention can be carried out at a very low cost. In addition, in many cases, rice bran that has been treated as a waste can be efficiently used, which is useful for environmental protection.
    In this method, the separating agent is not limited to rice bran, bran type (rice bran, bran, barley mixed bran, rice barley bran, rice barley mixed bran, etc.), legume powder (soybean, red bean, peanut, coconut, etc.), soybean meal powder The solder oxide may be separated using any one or a combination thereof, which is selected from the group consisting of a powder of peanut shells and a powder of seeds (sesame, sunflower, palm, rapeseed, etc.). In particular, the powder of the seed exhibits a better separation action. The amount of the dispersant other than the rice bran is similar to that of the rice bran, and the amount of the dispersant may be about 0.7 spoons from a small amount of the spoon with respect to 100 ml of the solder oxide.
    Further, the order of the first to seventh steps may be arbitrarily changed, or any of these steps may be omitted.
    For example, a step of introducing the solder oxide to which the solder adheres into the container outside the molten solder (outside the solder bath or above the surface of the molten solder) may be performed first. Thereafter, any one or a combination of the separators is dispersed in the solder oxide to which the solder is attached, the process of immersing the container in a molten solder bath to melt the solder oxide to which the solder is attached, and the container. May be carried out in order to separate the solder and the solder oxide from the solder bath.
    Furthermore, the step of injecting the solder oxide attached to the solder from outside the molten solder into the container, the step of immersing the container in the molten solder tank to melt the solder oxide attached to the solder, any one or a combination of the above-mentioned separation agent The step of scattering the solder oxide attached with the solder described above and the step of pulling the container out of the solder tank to separate the solder and the solder oxide may be sequentially performed.
    (Separation Method 5)
    Next, as another embodiment of the present invention, a method (separation method 5) for separating the solder oxide suspended on the molten solder into the solder and the solder oxide will be described. The separating agent used in this case is the same as the separating method 4 (for example, using rice bran). The amount of rice bran dispersed in the solder oxide was the same as in the separation method 4. The sequence of separation process of solder and solder oxide is as follows.
    In the first step, immerse the storage container (about 0.5mm in diameter of the mesh wire, constituent wire of the mesh, and about 1.2mm in length of one side of the rectangular opening) in which the solder oxide is floated in the immersion solder tank or the flow solder tank. .
    In the second step, the solder oxide (solder dross) suspended on the molten solder is collected by floating in a mesh basket, and the mesh basket is pulled up to about half.
    In the third step, the separating agent of the present invention, such as rice bran, is spread (spread) onto the surface of the solder oxide floating on the molten solder using a spoon. The amount of dispersion of the separating agent may be such that it almost covers the surface of the solder oxide. For example, a small spoon may be about 0.7 spoons of the volume per 100 ml of the solder oxide.
    In the fourth step, the mesh basket is moved up and down or left and right to cause the solder oxide to rise and fall from the molten solder surface. This operation is repeated several times.
    In the fifth step, the net basket is pulled from the surface of the molten solder after confirming that the volume of the solder oxide is reduced and that the solder attached to the solder oxide is molten.
    In the sixth step, the oxide residue (solder oxide) remaining in the net basket is discarded in the waste container or the like.
    The separation operation of the solder and the solder oxide is completed by the above first to sixth steps. The working time for this separation process is about 1 minute (not shown). By this separation process (separation method 5), separation of the solder and the solder oxide can be carried out very easily and inexpensively in a short time.
    In this case as well, the order of the above first to sixth steps may be changed or added, or any step may be omitted.
    For example, by changing the order of the third step, a step of dispersing any one or a combination of the above-described separation agents into the solder oxide floating on the molten solder may be performed first. Thereafter, the steps of removing the solder oxide floating on the molten solder into the container and pulling the container out of the solder bath to separate the solder and the solder oxide may be performed sequentially (not shown in the drawing).
    In the above two embodiments (separation methods 4 and 5), an example of using a mesh basket as a storage container for accommodating solder oxide attached to the solder or solder oxide floating on the molten solder has been described. It is not limited, You may use arbitrary members. For example, the container may be formed of a punching metal in which a plurality of circular or rectangular openings are formed. As an example, a plurality of rectangular openings having an opening area of about 1 to 2.25 mm 2 at the bottom and each side of the storage container are disposed in a plurality of rows and columns (matrices) with a pitch of about 1.5 mm to 2 mm. A storage container is formed with the structure which was excreted.
    Furthermore, instead of the flow type (classification) soldering apparatus, a stationary immersion soldering apparatus may be used.
    Further, instead of removing the separated solder oxide (oxidized residue) into a net basket, the solder oxide may be scraped off by a heat-resistant plate or the like, or the solder oxide may flow off from the molten solder surface by an inert gas or the like.
    As described above, according to the present invention, the separation of the solder oxide floating on the molten solder can be easily and safely and harmless to the human body, without causing pollution. In addition, the amount of solder discarded by adhering to the solder oxide can be reduced.
    As a result, it is possible to contribute to the protection of the global environment by improving the utilization rate and recovery rate of the solder.
    权利要求:
    Claims (49)
    [1" claim-type="Currently amended] A solder wave surface forming means for melting the solder to form a solder wave surface, and a separator dispersing means for dispersing a solder oxide separating the solder and the solder oxide into the solder oxide. A soldering apparatus characterized in that any one or combination thereof selected from the group consisting of powder, legume powder, grains or powder of seeds, soybean meal powder and peanut shell powder.
    [2" claim-type="Currently amended] The bran type according to claim 1, wherein the bran type is any one or a combination thereof selected from the group consisting of rice bran, rice bran, bran, barley mixed bran, rice barley bran and rice barley mixed bran. Any one or a combination thereof selected from the group consisting of rice, and the legumes are any one or a combination thereof selected from the group consisting of soybean, red bean, peanut, and coconut, and the seed is composed of sesame, sunflower, palm, rapeseed and cottonseed. Soldering apparatus, characterized in that any one or a combination thereof selected from the group.
    [3" claim-type="Currently amended] The soldering apparatus according to claim 1 or 2, further comprising solder oxide extracting means for extracting the solder oxide suspended on the molten solder.
    [4" claim-type="Currently amended] 4. The soldering apparatus according to claim 3, wherein the means for discharging is a container, and the discharging means for discharging the discharged solder oxide from the container.
    [5" claim-type="Currently amended] The soldering apparatus according to claim 4, wherein the container has a plurality of openings having an opening area of 1 to 2.25 mm 2 on the bottom and side surfaces thereof.
    [6" claim-type="Currently amended] The soldering apparatus according to claim 5, wherein the container is formed of a punching metal.
    [7" claim-type="Currently amended] 6. The soldering apparatus according to claim 5, wherein the container is made of a mesh basket, and the diameter of the constituent wire of the mesh is 0.3 to 0.7 mm and the length of one side of the rectangular opening is 1.0 to 1.5 mm.
    [8" claim-type="Currently amended] Solder corrugated surface forming means for melting solder to form a solder corrugated surface, separator dispersing means for dispersing solder and solder oxide in solder oxide, and solder oxide scraping and collecting solder oxide floating on the molten solder Scraping means, characterized in that the separating agent is any one selected from the group consisting of bran type, grains or powder of cereals, powder of legumes, grains or powder of seeds, soybean meal powder and peanut shell powder. Soldering apparatus.
    [9" claim-type="Currently amended] Solder wave surface forming means for melting the solder to form a solder wave surface, separator dispersing means for dispersing the solder and the solder oxide in the solder oxide, and solder oxide floating on the molten solder as inert gas. And a solder oxide flowing means, wherein the separating agent is any one or combination thereof selected from the group consisting of bran varieties, grains or powders of grains, powders of legumes, grains or powders of seeds, soybean meal powders and peanut shell powders. Soldering apparatus, characterized in that.
    [10" claim-type="Currently amended] Any one selected from the group consisting of scooping up the solder oxide suspended in the molten solder into a container, bran type, grain or powder of grains, powder of legumes, grain or powder of seeds, soybean meal powder and peanut shell powder Or a step of dispersing the separator in combination with the solder oxide described above, lifting the container out of the solder bath to separate the solder oxide from the molten solder, and inverting the container to discharge the oxide. Solder oxide removal method characterized in that.
    [11" claim-type="Currently amended] The bran type according to claim 10, wherein the bran type is any one or a combination thereof selected from the group consisting of rice bran, rice bran, bran, barley mixed bran, rice barley bran and rice barley mixed bran, Any one or a combination thereof selected from the group consisting of rice, and the legumes are any one or a combination thereof selected from the group consisting of soybean, red bean, peanut, and coconut, and the seed is composed of sesame, sunflower, palm, rapeseed and cottonseed. The solder oxide removal method, characterized in that any one or a combination thereof selected from the group.
    [12" claim-type="Currently amended] 12. The method for removing solder oxide according to claim 10 or 11, further comprising the step of moving the container a plurality of times up and down by pulling the container out of the solder tank after dispersing the separating agent and immersing the container again in the solder tank. .
    [13" claim-type="Currently amended] Dispersion of solder oxides of any one or combination thereof selected from the group consisting of bran varieties, grains or powders of grains, powders of legumes, grains or powders of seeds, soybean meal powders and peanut shell powders on solder oxides suspended on molten solder A step of removing the solder oxide floating in the molten solder into the container, a step of pulling the container out of the solder bath to separate the solder oxide from the molten solder, and inverting the container to discharge the solder oxide. A step of removing the solder oxide, comprising the step of.
    [14" claim-type="Currently amended] The method for removing solder oxide according to claim 13, further comprising, after dispersing the separating agent, pulling the container out of the solder bath and immersing it again in the solder bath to move the container up and down several times.
    [15" claim-type="Currently amended] The method for removing solder oxide according to any one of claims 10 to 14, wherein the separating agent is dispersed in the solder oxide to almost cover the surface of the solder oxide.
    [16" claim-type="Currently amended] A solder heating means for heating and melting the solder and a separator dispersing means for dispersing the solder and the solder oxide in the solder oxide, wherein the separator is bran type, grain or powder of grains, powder of beans, seeds The solder recovery device, characterized in that any one or combination thereof selected from the group consisting of granules or powder, soybean meal powder and peanut shell powder.
    [17" claim-type="Currently amended] The bran type according to claim 16, wherein the bran type is any one or a combination thereof selected from the group consisting of rice bran, rice bran, bran, barley mixed bran, rice barley bran and rice barley mixed bran, Any one or a combination thereof selected from the group consisting of rice, and the legumes are any one or a combination thereof selected from the group consisting of soybean, red bean, peanut, and coconut, and the seed is composed of sesame, sunflower, palm, rapeseed and cottonseed. Solder recovery apparatus, characterized in that any one or a combination thereof selected from the group.
    [18" claim-type="Currently amended] 17. The solder recovery apparatus according to claim 16, further comprising solder oxide extracting means for extracting the solder oxide suspended on the molten solder.
    [19" claim-type="Currently amended] 19. The solder recovery apparatus according to claim 18, wherein the discharging means is a container, and discharge means for discharging the discharged solder oxide from the container.
    [20" claim-type="Currently amended] 20. The solder recovery apparatus according to claim 19, wherein the container is made of a mesh basket, and the diameter of the constituent wire of the mesh is 0.3 to 0.7 mm, and the length of one side of the rectangular opening is 1.0 to 1.5 mm.
    [21" claim-type="Currently amended] A solder heating means for heating and melting the solder, a separator dispersing means for distributing the separator separating the solder and the solder oxide in the solder oxide, and a solder oxide scraping means for scraping and collecting the solder oxide floating on the molten solder. And the separating agent is any one selected from the group consisting of bran type, grains or powders of grains, powders of legumes, grains or powders of seeds, soybean meal powders, and peanut shell powders.
    [22" claim-type="Currently amended] Heating means for heating and melting the solder; separator dispersing means for dispersing the solder and the solder oxide in the solder oxide; and solder oxide flow means for flowing the solder oxide floating on the molten solder as an inert gas. And the separating agent is any one or combination thereof selected from the group consisting of bran varieties, grains or powders of grains, powders of legumes, grains or powders of seeds, soybean meal powders and peanut shell powders. .
    [23" claim-type="Currently amended] A separating agent for solder oxide with solder or a solder oxide in contact with molten solder, wherein the member separating the solder and the solder oxide is grained.
    [24" claim-type="Currently amended] 24. The separator for solder oxide in contact with solder or molten solder according to claim 23, wherein the grain is any one selected from the group consisting of crude, blood, sorghum and rice.
    [25" claim-type="Currently amended] 25. The solder oxide separating agent in contact with the solder oxide or the molten solder according to claim 23 or 24, wherein the grains are grains or powders or combinations thereof.
    [26" claim-type="Currently amended] A solder oxide-attached solder oxide or a solder oxide separator in contact with molten solder, characterized in that a type of a member separating the solder and the solder oxide is provided.
    [27" claim-type="Currently amended] 27. The solder-attached solder oxide or molten solder according to claim 26, wherein the bran type is any one selected from the group consisting of rice bran, rice bran, bran, barley mixed bran, rice barley bran and rice barley mixed bran. Solder oxide separating agent in contact with.
    [28" claim-type="Currently amended] A solder oxide-attached solder oxide or a solder oxide separator in contact with molten solder, wherein the member separating the solder and the solder oxide is a powder of legumes.
    [29" claim-type="Currently amended] 29. The solder oxide separator or solder oxide in contact with the solder according to claim 28, wherein the beans are any one or a combination thereof selected from the group consisting of soybean, red beans, peanuts, and coconut.
    [30" claim-type="Currently amended] A solder oxide-attached solder oxide or a solder oxide separator in contact with molten solder, wherein the member separating the solder and the solder oxide is made of soybean meal or peanut shell powder.
    [31" claim-type="Currently amended] A solder oxide separator or a solder oxide in contact with molten solder, wherein the member for separating the solder and the solder oxide is powder of a seed.
    [32" claim-type="Currently amended] 32. The solder oxide separator or solder oxide separator in contact with the solder according to claim 31, wherein the seed is any one selected from the group consisting of sesame, sunflower, palm, rapeseed and cotton thread.
    [33" claim-type="Currently amended] A process of injecting a solder oxide with solder into a container, a step of immersing the container in a molten solder tank, and dispersing the separating agent according to any one of claims 26 to 32 in the solder oxide to which the solder is attached. And a step of pulling the container out of the solder bath and separating the solder and the solder oxide.
    [34" claim-type="Currently amended] 34. The solder-attached solder oxide according to claim 33, further comprising a step of moving the container a plurality of times up and down by lifting the container out of the solder tank after dispersing the separating agent and immersing the container in the solder tank again. Separation Method.
    [35" claim-type="Currently amended] The dispersant according to any one of claims 26 to 32 is dispersed in the oxide with solder so that the solder almost covers the surface of the solder oxide with solder. Separation method of solder oxide with solder.
    [36" claim-type="Currently amended] A process of injecting a solder oxide with solder into a container, a process of dispersing the separating agent according to any one of claims 26 to 32 in the solder oxide to which the solder is attached, and immersing the container in a molten solder bath. And melting the solder oxide to which the solder adheres, and pulling the container out of the solder tank to separate the solder and the solder oxide.
    [37" claim-type="Currently amended] A process of immersing a container in a molten solder tank about half, Injecting the solder oxide with solder into the container, The solder oxide with the solder according to any one of claims 26 to 32 And a step of dispersing the container into a solder tank and separating the container into solder and solder oxide.
    [38" claim-type="Currently amended] A process of taking out a solder oxide floating on a molten solder and putting it in a container, Dispersing the separating agent of any one of Claims 26-32 in the solder oxide with which the said solder adhered, The said container is a solder tank And a step of separating the solder and the solder oxide from the solder oxide, wherein the solder oxide is in contact with the molten solder.
    [39" claim-type="Currently amended] 39. The solder oxide of claim 38, further comprising a step of moving the container a plurality of times up and down by lifting the container out of the solder bath after dispersing the separating agent and immersing the container in the solder bath again. Separation Method.
    [40" claim-type="Currently amended] 40. The method of claim 38 or 39, wherein the dispersant according to any one of claims 26 to 32 is dispersed in the oxide to which the solder is so attached that the solder almost covers the surface of the solder oxide to which the solder is attached. Separation method of solder oxide in contact with molten solder.
    [41" claim-type="Currently amended] A process of dispersing the separator according to any one of claims 26 to 32 in solder oxide floating on the molten solder, removing the solder oxide floating on the molten solder and placing the solder oxide in the container, and soldering the container. A method for separating solder oxide in contact with molten solder, comprising: pulling up from a bath to separate the solder and solder oxide.
    [42" claim-type="Currently amended] A method for separating solder oxide or solder oxide in contact with molten solder according to any one of claims 33 to 41, wherein the container is formed of a punching metal having a plurality of mesh baskets or openings.
    [43" claim-type="Currently amended] 43. The method for separating solder oxide with solder or solder oxide in contact with molten solder according to claim 42, wherein the bottom and side surfaces of the container have a plurality of openings having an opening area of 1 to 2.25 mm 2 .
    [44" claim-type="Currently amended] A storage container for solder oxide with solder or solder oxide in contact with molten solder, comprising a plurality of openings having an opening area of 1 to 2.25 mm 2 at the bottom and side surfaces of the container.
    [45" claim-type="Currently amended] 45. The storage container for solder oxide contacted with solder or molten solder according to claim 44, wherein a container is formed of a punched metal.
    [46" claim-type="Currently amended] A solder container with solder oxide or solder oxide in contact with molten solder, wherein the wire is made of a mesh basket, and the diameter of the mesh wire is 0.3 to 0.7 mm and one side of the rectangular opening is 1.0 to 1.5 mm.
    [47" claim-type="Currently amended] The solder oxide or molten solder with solder, wherein the separator according to any one of claims 26 to 32 is dispersed in the solder oxide, and the solder oxide is heated by molten solder to separate the solder and the solder oxide. Separation method of solder oxide in contact with.
    [48" claim-type="Currently amended] The solder oxide with solder, wherein the separator according to any one of claims 26 to 32 is dispersed in the solder oxide, and the solder oxide is heated by molten solder to remove the solder oxide by a net basket. Separation method of solder oxide in contact with molten solder.
    [49" claim-type="Currently amended] A solder oxide separator comprising at least two combinations selected from the group consisting of bran varieties, legume powder, soybean meal powder, peanut shell powder and seed powder.
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    同族专利:
    公开号 | 公开日
    EP0938944B1|2004-11-24|
    MY115409A|2003-05-31|
    SG80611A1|2001-05-22|
    US6235208B1|2001-05-22|
    TW404155B|2000-09-01|
    DE69922069T2|2006-03-02|
    EP1378309B1|2008-07-09|
    DE69939072D1|2008-08-21|
    CN1237874A|1999-12-08|
    EP0938944A2|1999-09-01|
    BR9900837A|1999-12-14|
    EP1378309A3|2005-06-08|
    EP0938944A3|2000-12-27|
    CZ301222B6|2009-12-16|
    DE69922069D1|2004-12-30|
    EP1378309A2|2004-01-07|
    CN1199535C|2005-04-27|
    KR100322901B1|2002-03-18|
    CZ53899A3|2000-06-14|
    US6214218B1|2001-04-10|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-02-27|Priority to JP4694398
    1998-02-27|Priority to JP98-046943
    1998-02-27|Priority to JP4694498A
    1998-02-27|Priority to JP98-046944
    1998-10-22|Priority to JP98-300546
    1998-10-22|Priority to JP30054698
    1998-12-17|Priority to JP35894798A
    1998-12-17|Priority to JP98-358947
    1999-02-24|Application filed by 마츠시타 덴끼 산교 가부시키가이샤
    1999-09-27|Publication of KR19990072895A
    2002-03-18|Application granted
    2002-03-18|Publication of KR100322901B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP4694398|1998-02-27|
    JP98-046943|1998-02-27|
    JP4694498A|JP2899584B1|1998-02-27|1998-02-27|Oxide separation agent, separation method and container|
    JP98-046944|1998-02-27|
    JP98-300546|1998-10-22|
    JP30054698|1998-10-22|
    JP35894798A|JP3241013B2|1998-02-27|1998-12-17|Soldering equipment, solder recovery equipment, oxide removal method and oxide separating agent|
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