• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Disclosed is a device for manufacturing a semiconductor device having a chuck part. The present invention includes a heater, a heater sensor cable, an RF filter, and a fixed breaker. The heater sensor cable is connected to the heater, and the heater sensor cable is connected to the RF filter by a connector. The fixed breaker catches the connector and secures it to the RF filter.
    公开号:KR19990070949A
    申请号:KR1019980006125
    申请日:1998-02-26
    公开日:1999-09-15
    发明作者:최성열
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Equipment for manufacturing semiconductor devices with chuck
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor devices and, more particularly, to manufacturing equipment having a chuck part.
    Among the manufacturing equipment used to manufacture semiconductor devices, there are equipment employing chucks. Such manufacturing equipment is used in processes such as silicon treatment.
    The manufacturing equipment described above has a chuck in which a semiconductor substrate is placed in a chamber, and has a heater for heating the semiconductor substrate mounted on the chuck. The heater sensor cable is connected to the heater. The heater sensor cable is connected by a connector to an RF filter (hereinafter referred to as an RF filter) fitted to a control unit outside the chamber.
    The chuck may be raised or lowered as necessary. The heater sensor cable and the connector may be rocked by an upward or downward movement of the chuck, that is, a reciprocating movement. Due to the fluctuation of the heater sensor cable or the connector, the connection between the heater sensor cable and the RF filter may become unstable.
    The above poor connection may result in poor temperature control of the heater. Alternatively, a momentary short may occur and the temperature of the heater may drop. That is, temperature loss may occur. This temperature loss can violate the temperature profile of the semiconductor substrate placed on the chuck and cause failures in processes that occur in the chamber, such as silicon processing.
    An object of the present invention is to provide a device for manufacturing a semiconductor device having a chuck that can minimize the temperature loss due to poor temperature control of the heater due to the fluctuation of the heater sensor cable and connector or a drop in temperature.
    BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram illustrating a device for manufacturing a semiconductor device having a chuck part according to an embodiment of the present invention.
    2 is a plan view schematically showing a planar shape of a fixed breaker.
    3 is a side view schematically showing the side shape of the fixed breaker.
    According to an aspect of the present invention to achieve the above technical problem, a semiconductor device manufacturing apparatus having a heater (heater sensor cable), RF filter (RF filter) and a fixed breaker to provide.
    The heater sensor cable is connected to the heater, and the heater sensor cable is connected to the RF filter by a connector. A fixed breaker catches the connector and fixes it to the RF filter.
    According to the present invention, an apparatus for manufacturing a semiconductor device having a chuck portion capable of minimizing a temperature loss due to a poor temperature control of a heater or a temperature drop due to a fluctuation of a heater sensor cable and a connector can be provided.
    Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, shapes and thicknesses in the drawings are simplified or exaggerated in order to emphasize clearer explanations, and the elements denoted by the same reference numerals in the drawings mean the same elements.
    1 schematically shows equipment for manufacturing a semiconductor device having a chuck 210 in accordance with an embodiment of the present invention.
    FIG. 2 schematically shows a planar shape of a fixed breaker, and FIG. 3 schematically shows a side shape of a fixed breaker.
    Referring to FIG. 1, a device for manufacturing a semiconductor device having a chuck 210 according to an embodiment of the present invention includes a heater 230, a heater sensor cable 400, an RF filter 500, and a fixed breaker 610, 650. ). The chuck 210 supports the semiconductor substrate 300, and the heater 230 heats the semiconductor substrate 300. Here, the chuck 210 may reciprocate up and down.
    A control unit (not shown) for controlling the temperature of the heater 230 is installed outside the chamber 100 having the chuck 210 and the like therein. The heater sensor cable 400 is connected to the heater 230, and the heater sensor cable 400 is connected to the RF filter 500 by a connector 450. The RF filter 500 is fitted to the controller. In this case, the fixing breakers 610 and 650 hold the connector 450 to fix the RF filter 500.
    2 and 3, the fixing breaker 610 is connected to the fixing part 610 having the means for fixing the connector 450 or the heater sensor cable and the fixing part 610 to be fixed to the fixing part. It consists of a connection portion 650 to secure the 610 to the RF filter 500. The fixing part 610 or the connecting part 650 or the like is formed of aluminum or stainless steel. The fixing means formed on the fixing part 610 includes a tie tap for binding the groove 615 into which the heater sensor cable 400 formed in the fixing part 610 is fitted and the fitted heater sensor cable 400. 611). The connection part 650 is fixed to the RF filter 500 with a screw 655 or the like. The fixing breakers 610 and 650 as described above fix the heater sensor cable 400 or the connector 450 so as not to swing. That is, even when the heater sensor cable 400 is oscillated by the vertical reciprocating motion of the chuck unit 210, the connector 450 connected to the RF filter 500 and the heater sensor cable 400 connected to the connector 450. Some of the) remain unstable and remain fixed. Thereby, generation | occurrence | production of the heater 230 temperature control failure or temperature fall due to a connection failure can be suppressed. That is, temperature loss can be prevented.
    As mentioned above, although this invention was demonstrated in detail through the specific Example, this invention is not limited to this, It is clear that the deformation | transformation and improvement are possible by the person of ordinary skill in the art within the technical idea of this invention.
    According to the present invention described above, by introducing a fixed breaker for fixing the connector or the heater sensor cable to the RF filter, the fluctuation of the connector or the heater sensor cable can be prevented. In this way, the fluctuation of the connector or the heater sensor cable can be prevented, so that the occurrence of a connection failure can be suppressed, thereby minimizing a temperature loss such as a poor heater temperature control or a drop in the heater temperature.
    权利要求:
    Claims (1)
    [1" claim-type="Currently amended] Heater;
    A heater sensor cable having one end connected to the heater;
    An RF filter to which the other end of the heater sensor cable is connected to a connector; And
    And a fixed breaker to hold the connector and secure it to the RF filter.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-02-26|Application filed by 윤종용, 삼성전자 주식회사
    1998-02-26|Priority to KR1019980006125A
    1999-09-15|Publication of KR19990070949A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019980006125A|KR19990070949A|1998-02-26|1998-02-26|Equipment for manufacturing semiconductor devices with chuck|
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