• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention discloses an epoxy resin attachment device for producing a semiconductor package. In the disclosed invention, the preheat rail 10 and the hardening rail 20 are arranged on the same line on the body frame 1. At the inlet of the preheating rail 10, a rotatable receiver 11 in which a plurality of thin plates is accommodated is installed, and the thin plates of the rotatable receiver 11 are placed on the preheating rail 10 one by one by a thin plate supply part. The epoxy resin supply part is arranged on the main body frame 1 which is the front side of the preheating rail 10. The base 35 on which the epoxy resin is removed is placed between the preheat rail 10 and the hardening rail 20, and the epoxy resin is cut into a rectangular shape on the base 35 and attached to the thin plate. Epoxy resin cutting / attachment part is arrange | positioned. In addition, a rotary arm 50 is installed between the preheating rail 10 and the hardening rail 20 to carry in the thin plate preheated by the preheating rail 1 to the epoxy resin cut / attachment part. Meanwhile, robots 61 and 62 for carrying in and taking out thin plates from the preheating rail 10 to the rotary arm 50 and from the rotary arm 50 to the hardening rail 20 are preheated rails 10. ) And the hardening rail 20.
    公开号:KR19990056742A
    申请号:KR1019970076753
    申请日:1997-12-29
    公开日:1999-07-15
    发明作者:채준식
    申请人:김영환；현대전자산업 주식회사；
    IPC主号:
    专利说明:

    Epoxy Resin Attachment Device for Semiconductor Package Manufacturing
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin attachment device for manufacturing a semiconductor package, and more particularly, to an apparatus for cutting and attaching an epoxy resin to a thin plate in order to adhere a thin plate to upper and lower surfaces of a chip of the semiconductor package.
    The conventional semiconductor package has a structure in which an inner lead of a pair of signal transmission leads is connected to a semiconductor chip placed on a paddle by a metal wire and supported by molding. The lower end of the outer lead 22 of the signal transfer lead is mounted on the substrate by soldering.
    By the way, in recent years, the method which adhere | attaches each thin plate in the state which apply | coated the epoxy resin which is an adhesive agent to the metal thin plate, and interposed the semiconductor chip between two thin plates, without supporting a semiconductor chip by molding. This method is commonly referred to as a metal-quad method.
    In order to adhere | attach a thin plate as mentioned above, you need to apply an epoxy resin to a thin plate first. In particular, the epoxy resin should not be applied to the entire surface of the thin plate, but only to the outside of the thin plate. That is, since the semiconductor chip is located in the center between the thin plates, the epoxy resin should be applied only to the outer edge of the thin plate. On the other hand, the epoxy resin has a long band shape, and is wound on a roller in a state in which interlayer paper is interposed therebetween so as not to adhere to each other.
    To this end, conventionally, after the epoxy resin was released from the roller, the epoxy resin was applied along the outline of the thin plate while the worker held the thin plate by hand. In particular, in order to reinforce the adhesive strength of the epoxy resin, it is necessary to carry out a preliminary step of preheating the thin plate to a temperature of 70 ° C. for about 5 minutes before operation.
    However, since the conventional method is a manual method, the work efficiency is inferior, and in particular, there is a problem in that the number of labors is too high, because a preliminary step of heating the thin plate must be performed.
    In addition, since the operator holds the thin plate by hand and applies the epoxy resin, there is also a problem that a mark such as stain occurs on the thin plate and the defective rate increases.
    In addition, there was also a problem that a cure operation cannot be performed immediately after the thin plate bonding operation.
    The present invention devised in order to solve the above problems, the epoxy resin for semiconductor package manufacturing that can be automatically attached to the pre-heated thin plate after separating the epoxy resin from the kanji, peeling off the rectangular frame shape It is an object to provide an attachment device.
    1 is a plan view showing the arrangement of the preheating and hardening rail and the rotary arm which is the main part of the present invention;
    Figure 2 is a perspective view showing an epoxy resin supply unit which is a main part of the present invention
    3 is a front view showing an epoxy resin cut / attach which is a main part of the present invention;
    Figure 4 is a plan view showing a rotating arm of the main part of the present invention
    -Explanation of symbols for the main parts of the drawing-
    1-body frame 10-preheat rail
    11-Rotary Receptor 12-Cartridge
    13-guide rail 14-slider
    15-Pneumatic cylinder for carrying in 16-Vacuum cup
    20-Curing Rail 30-Epoxy Resin Feed Roller
    31-Icebreaker winding roller 35-Base
    40-pneumatic cylinder for cutting 41-cutter
    50-Swivel Arm 51-Face Down
    52-Pneumatic cylinders for rotation 61-Robots for carrying
    62-Export Robot
    In order to achieve the above object, the present invention has the following configuration.
    On one side of the main body frame is provided a rotary receiver in which the thin plate is accommodated so as to carry in a thin metal plate bonded to the upper and lower portions of the semiconductor chip. On the outer circumference of the rotary container, several cartridges in which a plurality of thin plates are stacked are housed at equal intervals. The preheat rails, which are transported while the thin plates taken out one by one from the cartridges are preheated, are installed laterally on the main frame. A vacuum cup for adsorbing the thin plate by vacuum pressure on the cartridge and placed on the preheating rail is disposed on the preheating rail, and the upper end of the vacuum cup is connected to the pneumatic cylinder for loading and lifted up and down. The pneumatic cylinder for loading is also connected to the slider and reciprocated between the preheating rails in the cartridge.
    On the other hand, on the main body frame of the preheating rail inlet, an epoxy feed roller on which an epoxy resin having a long strip shape and interleaved interlayer paper is interposed therebetween is rotatably provided. A base on which the epoxy resin supplied with the interleave is removed from the epoxy feeding roller is placed adjacent to the exit of the preheating rail. The base has a structure in which a square opening is formed in the center portion. A cutter is disposed on the base, and the cutter is the same as the size of the thin plate and an opening is formed along the periphery, thereby cutting the epoxy resin into a rectangular frame shape. The epoxy resin is cut while being received into the opening of the cutter and the remaining central portion is pulled through the opening of the base. The cutter is elevated by connecting the upper end to the cutting pneumatic cylinder.
    On the other hand, at the exit of the preheating rail, a rotary arm on which a preheated thin plate is placed is provided. The thin plate is placed on the rotary arm by a loading robot installed at the exit of the preheating rail. The rotary arm is rotated 180 degrees and enters between the base and the cutter, and the sheet is brought into contact with the lowered cutter, and the epoxy resin contained in the opening of the cutter is attached along the outline of the sheet.
    The thin plate with the epoxy resin attached is returned to its original position by the rotating arm rotated 180 degrees. The hardening rail is installed on the main frame along the same line as the preheating rail, and the thin plate with epoxy resin is carried out to the hardening rail by the unloading robot. The thin plate is cured under a predetermined temperature while being transferred by the hardening rail.
    According to the above-described configuration of the present invention, the epoxy resin is cut by a cutter in a rectangular frame shape, and the thin plate is attached to the epoxy resin carried by the rotary arm in a pre-heated state on a preheating rail, and is cut. In addition, the work man-hour can be greatly reduced, and since the operator does not need to touch the thin plate by hand, it is possible to prevent the occurrence of marks such as stains on the thin plate in advance.
    Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
    1 is a plan view showing the arrangement of the preheating and hardening rail and the rotary arm, which is the main part of the present invention, FIG. 2 is a perspective view showing an epoxy resin supply part, which is a main part of the present invention, and FIG. It is a front view which shows the attachment part, and FIG. 4 is a top view which shows the rotating arm which is a principal part of this invention.
    The configuration of the attachment device according to the present invention is largely divided into a main body frame 1, preheating and hardening rails 10 and 20 provided on the main body frame 1, a thin plate supply part provided at an outlet of the preheating rail 10, The epoxy resin supply part provided on the main body frame 1 which is the front side of the preheating rail 10, the epoxy resin cutting part provided between the preheating rail 10 and the hardening rail 20, and the thin plate by the preheating rail 10 It consists of a thin plate loading part carried in to a cut part.
    Each component is demonstrated in detail with reference to an accompanying drawing.
    First, as shown in FIG. 1, the preheating and curing rails 10 and 20 are installed along the same line on the main body frame 1, and each rail 10 and 20 is spaced apart from each other at a predetermined distance. Although not shown, each rail 10 and 20 is operated by motor drive and also provided with a heater.
    The rotary receiver 11 is installed at the outlet of the preheating rail 10. The rotary container 11 is cylindrical in shape, and several cartridges 12 are provided on the outer circumference at equal intervals. In each cartridge 12, a plurality of thin plates are stacked.
    In FIG. 3, a vacuum cup 16 is disposed on the preheat rail 10, which suctions and lifts up a thin plate contained in the cartridge 12. The vacuum cup 16 is connected to and lifted up by the pneumatic cylinder 15 for carrying in, and the pneumatic cylinder 15 for carrying in is connected to the slider 14. The slider 14 is movably connected to the guide rail 13 disposed in parallel with the preheat rail 10 to reciprocate between the cartridge 12 and the preheat rail 10.
    On the other hand, the detailed structure of an epoxy resin supply part is shown in FIG.
    As shown, the epoxy resin supply is disposed on the body frame 1 in front of the preheat rail. An epoxy supply roller 30 on which an epoxy resin interposed between the sheets is wound is rotatably installed on the bracket 36 provided on the front face of the inlet of the preheating rail 10. On the upper portion of the bracket 36, a slip sheet winding roller 31, in which only a roll is wound, is also rotatably installed. Another bracket 37 is installed in front of the exit of the preheating rail 10, and several guide rollers 32, 33, 34 for guiding the transfer of the epoxy resin are rotatably installed on the bracket 37.
    The base 35 on which the epoxy resin from which the slippers are removed is placed is disposed between the preheating rail 10 and the curing rail 20. As shown in FIG. 3, the cutting machine 41 is disposed on the base 35, and the cutting machine 41 is connected to the cutting pneumatic cylinder 40 to move up and down. A guide plate 43 is installed between the cutter 41 and the pneumatic cylinder 40 for cutting, and several guide rods 42 are vertically installed on the outer side of the guide plate 43, so that the cutter 41 moves up and down. Will be supported.
    Here, the base 35 has a rectangular frame shape. That is, the opening part is formed in the center, and it can cut | disconnect an epoxy resin in rectangular shape. Accordingly, the cutter 41 has a square corresponding to the size of the base 35, and an opening (not shown) is formed along the outer edge of the cutter 41 to accommodate the epoxy resin. That is, the epoxy resin settled on the base 35 is cut into the rectangular frame shape by the cutter 41, and the center part falls out through the opening of the base 35.
    Referring again to FIG. 1, a carry-in portion is provided between the preheating rail 10 and the hardening rail 20 to carry thin plates toward the cutter 41. As shown in detail in FIG. 4, the carry-in arm is provided with a settling surface 51 on which two thin plates are placed, and is connected to a rotating pneumatic cylinder 52 to rotate by 180 ° as shown in detail in FIG. 4. do.
    1, robots 61 and 62 for loading and unloading are installed between the preheating rail 10 and the hardening rail 20. The robot 61 for carrying in is a robot which carries in the thin plate preheated by the preheating rail 10 to the settled surface 51 of the rotary arm 50, and the robot 62 for carrying out carries out the thin plate with epoxy resin attached to the rotary arm. It is a robot carried out to the hardening rail 20 in 50.
    Hereinafter, the operation of this embodiment configured as described above will be described in detail.
    The thin plate accommodated in the cartridge 12 is sucked by the vacuum cup 16, the vacuum cup 16 is raised to a predetermined height by the pneumatic cylinder 15 for carrying in, and then the slider 14 is guide rail 13 ) Is moved onto the preheating rail 10 by being moved along), so that the thin plate is placed on the preheating rail 10.
    The thin plate conveyed along the preheat rail 10 is preheated to a predetermined temperature by a heater provided in the preheat rail 10. Here, when the temperature of the heater is 80 ° C, the motor rotational speed is preferably 90 rpm, 90 ° C., 120 rpm, and 110 ° C., 140 rpm.
    In this way, a plurality of thin plates are brought into the preheating rails 10 one by one from each cartridge 12 as the rotary receiver 11 is rotated.
    On the other hand, the epoxy resin wound up on the epoxy supply roller 30 is transported while being guided by the guide rollers 32, 33, 34, and the slip sheet is wound up on the slip sheet winding roller 31. The epoxy resin from which the slippers are removed is placed on the base 35. Subsequently, the cutting pneumatic cylinder 40 is operated to lower the cutter 41 onto the base 35. The epoxy resin is cut into rectangular frame shapes and accommodated in the opening of the cutter 41. The cutter 41 is raised to a predetermined height again.
    In this state, the preheated thin plates are placed on the settled surface 51 of the rotary arm 50 by two by the carrying-in robot 61. The rotary arm 50 is rotated 180 degrees by the driving of the rotary pneumatic cylinder 52, and enters between the cutter 40 and the base 35. Then, the cutter 40 is lowered again so that the epoxy resin in the opening is attached along the outline of the thin plate. At this time, since the thin plate is preheated in the preheating rail 10, the epoxy resin may be firmly attached.
    After the epoxy resin is attached to the thin plate, the rotary arm 50 is rotated by 180 degrees to return to its original position. Next, the thin plate is carried out on the hardening rail 20 by the robot 62 for carrying out. The curing rail 20 is maintained at 90 ° C. by the heater, and the rotational speed of the motor is maintained at about 70 rpm, so that the thin plate is transferred along the curing rail 20, so that the epoxy resin attached is cured and the adhesion is enhanced. do.
    As described above, according to the present invention, all operations for cutting the epoxy resin and supplying the thin plate can be fully automated, thereby greatly improving the productivity.
    In addition, since the operation of preheating the thin plate is also advanced by the present apparatus, it is possible to eliminate the preheating operation, which is a preceding step for attaching the epoxy resin.
    In particular, since the operator does not need to touch the thin plate by hand, it is possible to prevent the thin plate from getting stains such as hand marks in advance.
    In addition, the epoxy resin attached to the thin plate is to be cured together while being taken out along the curing rail, it is possible to delete the separate curing operation.
    On the other hand, the present invention is not limited to the above-described specific preferred embodiments, and various changes can be made by those skilled in the art without departing from the gist of the invention claimed in the claims. will be.
    权利要求:
    Claims (7)
    [1" claim-type="Currently amended] An apparatus for attaching an epoxy resin along the outer periphery of the thin plate in order to install a thin plate on the upper and lower surfaces of the semiconductor chip,
    Body frame; A preheating and hardening rail disposed along the same line on the main frame, preheating the thin plate before attaching the epoxy resin, and curing the thin plate with the epoxy resin under the predetermined temperature; A rotatable receiver installed at an inlet of the preheating rail to accommodate a plurality of thin plates; A thin plate supply unit supplying thin plates one by one from the rotatable receiver to a preheating rail; An epoxy resin supply unit disposed on a main body frame on the front side of the preheating rail and supplying the epoxy resin interposed between the separators while removing the separators; An epoxy resin cut / attach portion installed between the preheat rail and the hardened rail to cut the epoxy resin from which the slip sheet is removed into a rectangular frame shape and attach the cut epoxy resin on a thin plate; A thin plate loading portion installed between the preheating rail and the hardening rail to carry the preheated thin plate into the epoxy resin cut / attach portion; Carrying-in robot which delivers the thin plate on a preheating rail to the said thin plate carrying part; And a carrying-out robot for transferring a thin plate having an epoxy resin attached thereto by the epoxy resin cutting / attaching portion from the thin plate loading portion to the curing rail.
    [2" claim-type="Currently amended] The device of claim 1, wherein the preheating and curing rails are provided with a heater and operated by a motor drive.
    [3" claim-type="Currently amended] 2. The epoxy resin attachment apparatus for manufacturing a semiconductor package according to claim 1, wherein the rotatable receiver has a cylindrical shape, and a plurality of cartridges in which a plurality of thin plates are stacked on the outer circumference thereof is installed.
    [4" claim-type="Currently amended] According to claim 1, The thin plate supply portion Pneumatic cylinder for carrying; A slider installed at a side of the pneumatic cylinder for carrying in, reciprocating between the rotatable receiver and the preheating rail; A guide rail provided on a main body frame between the rotatable receiver and a preheating rail to guide the reciprocating movement of the slider; And a vacuum cup installed at a lower end of the rod of the pneumatic cylinder for carrying in, to suck the thin plate by vacuum.
    [5" claim-type="Currently amended] The method of claim 1, wherein the epoxy resin supply unit is disposed in the main body frame which is the inlet of the preheating rail, the epoxy supply roller wound around the epoxy resin in the state of interleaving; A base installed between the preheating rail and the hardening rail, wherein only the epoxy resin from which the slipper is removed is placed, and having a rectangular frame shape; Several guide rollers disposed along a preheating rail to guide the epoxy resin supplied to the base; And a slip paper winding roller on which the slip paper removed from the epoxy resin is wound before being supplied to the base.
    [6" claim-type="Currently amended] The cutter of claim 1, wherein the epoxy resin cut / attach portion is disposed on a base, and an opening is formed along an outline to correspond to the rectangular frame shape of the base, and the cutter cuts the epoxy resin into the rectangular shape. ; And a pneumatic cylinder for cutting which lifts and lowers the cutter.
    [7" claim-type="Currently amended] According to claim 1, The thin plate loading portion is a rotary arm provided with a settled surface on which the thin plate is placed; And a pneumatic cylinder for rotating the rotary arm by 180 [deg.] Into the epoxy resin cut / attachment part.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-12-29|Application filed by 김영환, 현대전자산업 주식회사
    1997-12-29|Priority to KR1019970076753A
    1999-07-15|Publication of KR19990056742A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970076753A|KR19990056742A|1997-12-29|1997-12-29|Epoxy resin attachment device for semiconductor package manufacturing|
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