• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a pressing force control device for a molding press, and in particular, a drive shaft connected to the bevel gear reducer and driven when power is applied to the drive motor; A drive unit having a case in which a worm gear rotates by a driving force of the drive shaft and a case surrounding a ball bearing installed at upper and lower ends of the worm gear and fixed on a pressure plate; A lower end engaged with the worm gear, and an upper end of the movable screw for firstly raising the movable plate when the worm gear rotates while being coupled to the bottom of the movable plate; When the movable plate is first lifted by the movable screw, the presser plate is secondly raised according to the hydraulic supply of the hydraulic device, and the upper and lower molds are formed by the pressing piston. The lower mold is first mechanically raised by the upper mold. The secondary is hydraulically raised so that the resin molding can be easily formed on the semiconductor by controlling the pressing force during molding, and at the same time, minimizing the hydraulic system of the hydraulic device to reduce the production cost and lower the failure rate.
    公开号:KR19990046902A
    申请号:KR1019970065061
    申请日:1997-12-01
    公开日:1999-07-05
    发明作者:최녹일
    申请人:최녹일；
    IPC主号:
    专利说明:

    Pressure control device of molding press
    The present invention relates to a pressing force control device of a molding press, and in particular, the lower mold to be combined with the upper mold is raised mechanically (screw) and the second is hydraulically raised so that the pressing force during injection molding of the resin molding on the semiconductor chip. The present invention relates to a pressing force control device for a molding press that allows resin molding to be easily molded on a semiconductor chip, and at the same time minimizes the hydraulic system of the hydraulic device to reduce production cost and lower a failure rate.
    A semiconductor used in a circuit board of a conventional electronic product has a chip formed in the middle, and lead frames fixed to the circuit board are formed at both ends of the chip. In addition, a rectangular resin molding is formed in the semiconductor to protect the chip. The resin molding is made of a resin, and is injection molded into the semiconductor chip by an injection cylinder when molding the upper and lower molds of the molding press.
    Briefly described, a molding press for injection molding resin molding onto a semiconductor chip is largely fixed to a bottom surface of a fixed plate, a lower mold to be combined with the upper mold and to which a semiconductor is seated, and a semiconductor chip to be seated on the lower mold. It is composed of a hydraulic device for lifting the movable plate to form the upper and lower molds.
    Such a conventional molding press seats a semiconductor in a lower mold and operates a hydraulic device, and as the hydraulic pressure is supplied, the movable plate rises to the upper side, the upper mold and the lower mold are combined, and the injection cylinder operates to inject the resin molding into the semiconductor chip. Mold.
    However, the hydraulic device of such a conventional molding press can be molded by molding the upper and lower molds by raising the movable plate to the upper part, and then molding the resin molding onto the semiconductor chip. Since a lot of power is required at a time, the hydraulic circuit system increases accordingly, the production cost is increased, and there is a problem that easily breaks down during long-term use.
    Therefore, the present invention has been made to fundamentally solve the problems of the prior art, the purpose of which is to raise the lower mold to be combined with the upper mold to the first mechanical (screw), the second is to raise the hydraulic pressure while forming the hydraulic pressure The present invention provides a pressurization control device for a molding press that allows resin molding to be easily injection molded on a semiconductor chip, and at the same time minimizes the hydraulic system of the hydraulic device to reduce the production cost and lower the failure rate.
    1 is a cross-sectional view showing a state in which the pressing force adjusting device according to the present invention is installed in the molding press,
    2 is a plan view of the pressing force adjusting device according to the present invention,
    3 is a cross-sectional view showing a state in which the movable plate is first raised by the pressing force adjusting device according to the present invention;
    Figure 4 is a cross-sectional view showing a state in which the movable plate and the pressure plate secondary rise by the pressing force adjusting device according to the present invention.
    <Explanation of symbols for main parts of the drawings>
    100; Molding press 110; Upper mold 120; Bottom mold
    130; Movable plate 140; Pressure plate 150; Press pillar
    200; Hydraulic system 210; Hydraulic piping 300; driving axle
    310; Bevel gear reducer 320; Drive motor 400; Moving screw
    500; Driver 510; Worm gear 520; case
    530; Ball bearing 600; Pressurized piston
    As a means for achieving the above object, the present invention is connected to the bevel gear reducer and the drive shaft is driven when the power is applied to the drive motor, and a worm gear that is rotated by the driving force of the drive shaft is built-in ball bearing installed on the upper and lower ends of the worm gear The driving part is made of a case surrounding the fixing plate and fixed on the pressure plate, the lower end is engaged with the worm gear and the upper end is coupled to the bottom of the movable plate when the worm gear rotates, the movable screw to raise the movable plate to the top, and the When the movable plate is first lifted by the moving screw, the technical features include a pressurized piston configured to raise the presser plate secondly according to the hydraulic supply of the hydraulic device to form the upper and lower molds.
    Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
    (Example)
    1 is a cross-sectional view showing a state in which the pressure adjusting device according to the present invention is installed in a press, FIG. 2 is a plan view of the pressure adjusting device according to the present invention, and FIG. 3 is the first movable plate by the pressure adjusting device according to the present invention. 4 is a cross-sectional view showing a raised state, Figure 4 is a cross-sectional view showing a state in which the pressing plate is secondly raised by the pressing force adjusting device according to the present invention.
    1 to 4, the pressing force adjusting device (A) is provided on the bottom surface of the movable plate 130 and the pressure plate 140 so that the upper and lower molds 110 and 120 of the molding press 100 can be combined with each other. It is installed, the pressing force adjusting device (A) is composed of a drive shaft 300, a moving screw 400, a drive unit 500 for raising the movable plate 130 first mechanically, the pressure plate 140 by hydraulic 2 It is composed of a pressing piston 600 for differentially raising.
    The driving shaft 300 is installed on the pressure plate 140 to be driven when power is applied to the driving motor 320 in the state connected with the bevel gear reducer 310, the driving unit 500 is driven by the driving force of the driving shaft 300 Rotating worm gear 510 is built and consists of a case 520 surrounding the ball bearing 530 installed on the upper and lower ends of the worm gear 500 is fixed on the pressing plate 140 by a fastening bolt, respectively.
    The lower end of the movable screw 400 is engaged with the worm gear 510 and the upper end is coupled to the bottom surface of the movable plate 130 so that the movable plate 130 can be first raised upward when the worm gear 510 rotates. It is installed vertically to the worm gear 510, the pressure piston 600 is the pressure plate 140, the movable plate in accordance with the hydraulic supply of the hydraulic device 200 when the movable plate 130 is first raised by the moving screw 400 The upper portion is positioned on the bottom of the pressing plate 140 and the lower portion is located in the lower fixing plate 160 so that the upper and lower molds 110 and 120 are united to raise the 130, and the pressing piston 400 is operated up and down by a hydraulic device. To be connected.
    Here, since the hydraulic pipe 210 connected to the hydraulic device 200 and the pressure piston 600 is a commonly used technology, a detailed description thereof has been omitted.
    Reference numeral 150 is a press pillar that the movable plate 130 and the pressure plate 140 guides up and down.
    In order to use the present invention configured as described above, the semiconductor chip is first seated on the lower mold 120, and then, when power is applied to the driving motor 310, the worm gear 510 is ball bearing 530 as the driving shaft 300 is driven. Idle between them.
    At this time, the moving screw 400 engaged with the idle worm gear 510 rotates upward while rotating, and the movable plate 130 moves along the press column 150 by the moving screw 400 which is to rise upward. As in 3, the lower mold 120 is primarily moved to the upper section.
    As described above, when the lower mold 120 is moved for a certain period, the hydraulic apparatus 200 operates to generate hydraulic pressure, and the generated hydraulic pressure is raised to the lower side along the hydraulic pipe 210 to raise the pressure piston 600.
    At this time, since the pressing plate 140 ascends the movable plate 130 by the lifting force of the pressing piston 600, as shown in FIG. 4, the lower mold 120 is moved to the remaining movement section secondly, and the upper mold 110 is moved. Is matched with
    When the upper mold 110 and the lower mold 120 are combined as described above, the resin molding may be injection molded to the semiconductor chip by pressing the resin using an injection cylinder as in the prior art, and when the resin molding is molded to the semiconductor chip, the driving motor 320 is reversely rotated to return the movable plate 130 and the pressure plate 140.
    As described above, according to the present invention, since the lower mold to be molded with the upper mold is first raised by a mechanical (screw) and the second is lifted by a hydraulic type, the pressing force is controlled during molding, thereby easily molding the resin molding onto the semiconductor chip. In addition, since the hydraulic system of the hydraulic device does not have to be large as in the related art, production cost is reduced and failure rate is reduced.
    In the above, the present invention has been described with reference to specific preferred embodiments, but the present invention is not limited to the above-described embodiments and should be made by those skilled in the art to which the present invention pertains without departing from the gist of the present invention. Various changes and modifications can be made.
    权利要求:
    Claims (1)
    [1" claim-type="Currently amended] A drive shaft connected to the bevel gear reducer and driven when power is applied to the drive motor; A drive unit having a case in which a worm gear rotates by a driving force of the drive shaft and a case surrounding a ball bearing installed at upper and lower ends of the worm gear and fixed on a pressure plate; A lower end engaged with the worm gear, and an upper end of the movable screw for firstly raising the movable plate when the worm gear rotates while being coupled to the bottom of the movable plate; The pressurizing pressure regulating device of the forming press, characterized in that the movable plate is first raised by the movable screw is configured to pressurize the second plate in accordance with the hydraulic supply of the hydraulic device to form the upper and lower molds.
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    同族专利:
    公开号 | 公开日
    KR100243777B1|2000-02-01|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-12-01|Application filed by 최녹일
    1997-12-01|Priority to KR1019970065061A
    1999-07-05|Publication of KR19990046902A
    2000-02-01|Application granted
    2000-02-01|Publication of KR100243777B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970065061A|KR100243777B1|1997-12-01|1997-12-01|Molding press pressure control apparatus|
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