• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a polyester film having a three-layer or more structure in which a polymer having a melt resistivity of 30 GPa or more and a polymer having a thickness of 0.5 µm or more as an inner layer and a polymer having a melt resistivity of 1 to 29 GPa as an outer layer. The ester film is particularly useful as an insulating material or dielectric material for capacitors because of its thin film thickness and excellent electrical properties such as dielectric constant, dielectric loss characteristic and fracture toughness.
    公开号:KR19990038507A
    申请号:KR1019970058273
    申请日:1997-11-06
    公开日:1999-06-05
    发明作者:한준희；황준호；김종순
    申请人:장용균；에스케이씨 주식회사；
    IPC主号:
    专利说明:

    Biaxially Oriented Polyester Film for Capacitor
    The present invention relates to a biaxially oriented polyester film for capacitors, and more particularly, to a three-layered polymer having a melt resistivity of at least 30 GPa and having a thickness of 0.5 μm or more as an inner layer and a polymer having a melt resistivity of 1 to 29 GPa as an outer layer. The present invention relates to a biaxially oriented polyester film for a capacitor, which can be thinned and has excellent electrical characteristics such as dielectric constant, dielectric loss characteristic, and fracture toughness.
    Saturated linear polyester films, represented by polyethylene terephthalate, have excellent mechanical properties, heat resistance, weather resistance, electrical insulation, chemical resistance, and the like, and thus are widely used in fields such as packaging, photography, electrical, and capacitors. In particular, it is widely used as an insulating material or dielectric material for capacitors, because the biaxially oriented polyethylene terephthalate film exhibits excellent mechanical properties, so that the deposition and running characteristics are good in the deposition or slitting process, and also in the capacitor manufacturing process. Polyethylene terephthalate film has stable running characteristics and electrical characteristics, and it is comparable to polyolefin film which has dielectric constant, dielectric loss, and breakdown characteristics, and can be thinned down to thickness of about 1㎛ and dielectric constant value is about 3.2. Since it is larger than polyolefin, it is advantageous to manufacture a small capacitor having a relatively large capacity, and thus it is widely used as a dielectric material for capacitors.
    Today, miniaturization of capacitors, which are passive devices, is required due to the miniaturization of electrical and electronic devices. Therefore, polyethylene terephthalate films having a relatively high dielectric constant and thinning compared to other films are widely used as dielectric and insulating materials. .
    As a method of manufacturing such a thin film, there is a step of solidifying the molten polymer coming out of the die against a rotating cooling drum by electrostatic application to smooth biaxial stretching and to obtain a film having a uniform thickness during film production. . To this end, electrostatic application should be more excellent, and in order to improve such electrostatic application, various types of metal catalysts can be added during the polymerization process. Increasing the amount of metal organic matter or inorganic compound in the polymer sheet increases the amount of electrons flowing out of the metal component or the inorganic particles in the polymer during electrostatic application, thereby increasing the charge amount, and thus the adhesion between the sheet and the cooling drum is better.
    On the other hand, in the polyester film used as the dielectric of the capacitor, the dielectric loss is inversely proportional to the resistance value of the dielectric, so the higher the insulation resistance is, the better the film is. In other words, if the insulation resistance in the sheet is high, the electrical characteristics including the dielectric loss of the film are excellent.
    Originally, polyester is a structurally almost perfect insulator in the pure state without additives, and its insulation resistance is high.However, when the electrostatic application is applied, the amount of charge decreases, resulting in poor adhesion, resulting in uneven film thickness and deterioration of mechanical properties. . In addition, although the polyesters to which the metal catalysts are added to improve the electrostatic application property mentioned above have improved electrostatic application property, the metal catalysts are often present as ions at high temperature, and thus the insulation resistance of the film is lowered to the dielectric. The dielectric loss of the film used is increased. Due to these conflicting requirements in manufacturing process and product quality, there have been many difficulties in producing polyester films for capacitors.
    Many studies have been conducted to solve the above-mentioned problems. For example, the sheet is brought into close contact with a rotating cooling drum by using an air knife instead of an electrostatic application, using the force of the wind, and spraying or applying a low surface tension liquid onto the rotating cooling drum. And the like have been proposed. However, this method has not been put to practical use due to the complexity of the process and the difficulty of controlling. In addition, Japanese Patent Application Laid-Open No. 63-182351 uses polyethylene terephthalate as a main component and copolymerizes polyethylene naphthalate and polycarbonate to improve the glass transition temperature of the polymer to improve dielectric loss at high temperature. It was complicated and had difficulty in practical application. In addition, Japanese Patent Application Laid-Open No. 2-49309 discloses that at least 97 mol% of the glycol component of polyester is 1,4-cyclohexane dimethanol component and at least 90 mol% is composed of terephthalic acid in order to increase the temperature of the sudden increase in dielectric loss. The copolymerized polyester film is reported to have a stable dielectric loss at 105 ℃ or more when used as a biaxially oriented film for the capacitor, but it was not practical because the supply of raw materials is not stable and the manufacturing process is complicated.
    Therefore, in order to produce polyethylene terephthalate having excellent dielectric loss characteristics, it is necessary to simultaneously satisfy the required characteristics of the electrostatic application and insulation resistance of the film.
    Accordingly, an object of the present invention is to provide a film that solves the above problems and maintains the thickness stability of a polyester film and at the same time improves the dielectric loss characteristic of polyethylene terephthalate within a range capable of thinning.
    1 is a diagram showing the resistance of the outer layer and inner layer of the sheet in comparison.
    The inventors believe that the electrostatically charged phenomenon occurs on the surface of the sheet, and that the insulation phenomenon is a resistance value in the thickness direction of the film. By increasing, it was found that two opposing properties could be satisfied simultaneously, thus completing the present invention. It simply indicates the same as FIG. 1, where R 1 and R 3 are the resistance of the polymer layer and the R 2 is the resistance of the inner layer of the polymer R 2 has a value greater than R 1 and R 3.
    The film of the present invention according to the above object has a structure of three or more layers with a polymer having a melt resistivity of 30 GPa or more and a thickness of 0.5 µm or more as an inner layer and a polymer having a melt resistivity of 1 to 29 GPa as an outer layer.
    Hereinafter, the present invention will be described in detail.
    In the film of the present invention, the outer layer (A and C layer) polymer has a melt resistivity of 1 to 29 GPa, and preferably 5 to 10 GPa. If the melt resistivity of the outer layer is 30 kPa or more, the amount of charge of the sheet decreases during electrostatic application, so that it cannot maintain stable adhesion. If the melt resistance is less than 1 kPa, there is a risk of discharge during electrostatic application.
    Further, the inner layer (B layer) polymer has a melt resistivity of 30 GPa or more, preferably 80 GPa or more, more preferably 200 GPa or more, and a thickness of 0.5 µm or more. If the melt resistivity of the inner layer is less than 30 kPa, the overall insulation resistance does not increase sufficiently, and improvement in dielectric loss cannot be expected.
    The melt resistivity of the polymer can be basically adjusted by changing the amount of metal catalyst used or the amount of stabilizer added to the phosphorus compound. The increase in the amount of metal catalyst used acts to lower the melt resistivity of the polymer, and the increase in the amount of stabilizer acts to increase the melt resistivity of the polymer. However, one thing to note is that excessively reducing the input of the metal catalyst to increase the melt resistivity affects the reactivity of the polymerization process, and thus the reaction of the metal catalyst is not completed or takes a long time to complete. The dosage should be used in combination as appropriate considering the melt resistivity of the polymer and the reactivity of the polymerization process.
    In the present invention, the polyester of each layer constituting the pre-stretch sheet is added to the master chip by adding a metal catalyst and a stabilizer dissolved in a dispersion medium such as ethylene glycol or water at any stage before the end of the polymerization reaction or as a slurry. Except for making and blending appropriately, there is no particular limitation and is prepared by applying the conventional polyester polymerization reaction as it is.
    In the present invention, as the metal catalyst, for example, acetate compounds such as manganese, calcium, zinc, magnesium, strontium, barium, radium, lithium, sodium, potassium, rubidium, cesium and francium elements, chlorides, carbonates, sulfates, phosphates , And hydrates thereof, and the like may be used, but the present invention is not limited thereto and may be applied to other compounds.
    In addition, in the present invention, as a stabilizer in the polymerization, for example, triethyl phosphonate, tripropyl phosphonate, dimethyl phosphonate, trimethyl phosphonate and phosphoric acid may be used, but is not limited to certain compounds.
    In order to adjust the running property, winding property, etc. of a film in the range which does not impair the objective of this invention, insoluble inorganic particle or organic particle | grains can be suitably selected and added to polyester.
    Examples of inorganic particles insoluble in polyester include inorganic particles known in the art such as calcium carbonate, dolomite, glass spheres, glass fibers, talc, kaolin, mica, silica, barium sulfate, aluminum silicate, alumina, titanium dioxide, and the like. Although it may be mentioned, in order to achieve the object of the present invention, it is preferable not to use particles of a metal compound having strong conductivity as much as possible.
    Organic particles insoluble in polyester include a copolymer of a monovinyl compound having one aliphatic unsaturated bond in a molecule and a compound having two or more aliphatic unsaturated bonds in a molecule as a crosslinking agent, a thermosetting phenol resin, a thermosetting epoxy resin, and a thermosetting urea resin. Fine powders of benzoguanamine resins, fluorine resins or mixtures thereof may be used, and their types and addition amounts are not particularly limited.
    Hereinafter, the present invention will be described in more detail with reference to Preparation Examples and Examples, but the present invention is not limited thereto. The measuring method of the physical property used in the Example and the comparative example and the performance evaluation method of the produced film are as follows.
    1) layer thickness
    The cross section of the film was cut out with a microtome and observed with an electron microscope.
    2) melt resistivity
    The polymer sample was vacuum dried at 150 ° C. for 2 hours to remove moisture in the film, melted at 275 ° C. for 2 hours, and then a voltage of 50 kV was applied thereto. As measurement electrodes, two stainless steel electrodes having an area of 1 cm 2 were arranged at intervals of 1 cm to measure the value 2 to 3 seconds after electrostatic application.
    3) permittivity and dielectric loss
    The dielectric constant and dielectric loss were measured using a DETA apparatus from Polymer Laboratory (UK), raising the temperature from room temperature to about 250 ° C. by 1 ° C. per minute. The thickness of the sample film before measurement was calculated by gravimetric method, and aluminum or gold was coated on the sample to give contact stability between the electrode and the sample.
    The rapid onset temperature of the dielectric loss measured the temperature (secondary increase temperature) at which the increase starts above 100 ° C.
    4) Evaluation of Approved Characteristics
    The sheet before stretching was visually observed and evaluated in four steps:
    Very smooth without defects: ◎
    Fairly smooth: ○
    Defect size within 1mm: □
    1 mm or more defective: △
    The following preparation examples are methods for polymerizing polymers having different melt specific resistances, and each of the examples was produced with a combination of these polymers during coextrusion.
    Preparation Example 1 Preparation of Polymer A
    Dimethyl terephthalate and ethylene glycol were mixed in an equivalence ratio of 1: 2, and polyethylene terephthalate monomer was added by adding 0.07% by weight of calcium acetate to dimethyl terephthalate and 0.02% by weight of manganese acetate as a catalyst for transesterification reaction. Was prepared. After the completion of the transesterification reaction, silica particles having an average particle size of 1.8 µm were added at 0.25% by weight, trimethylphosphate and antimony trioxide were added at 0.02% by weight as a stabilizer, and polymerization was carried out by a conventional method. Phthalate resin (polymer A) was obtained. Melt resistance of the polymer A was 8 GPa.
    Preparation Example 2 Preparation of Polymer B
    Polyethylene terephthalate resin (polymer B) was prepared in the same manner as in Preparation Example 1, except that zinc acetate was added instead of manganese acetate. The melt specific resistance of the polymer B was 10 kPa.
    Preparation Example 3 Preparation of Polymer C
    Polyethylene terephthalate resin (polymer C) was prepared in the same manner as in Preparation Example 1, except that magnesium acetate was added instead of manganese acetate. Melt resistance of the polymer B was 15 kPa.
    Preparation Example 4 Preparation of Polymer D
    Polyethylene terephthalate resin (polymer D) was prepared in the same manner as in Preparation Example 1, except that no manganese acetate was added. The melt specific resistance of the polymer D was 20 kPa.
    Preparation Example 5 Preparation of Polymer E
    The same method as in Preparation Example 1, except that calcium acetate was added in an amount of 0.05% by weight based on dimethyl terephthalate instead of 0.07% by weight of dimethyl terephthalate and 0.02% by weight of dimethyl terephthalate. Polyethylene terephthalate resin (polymer E) was prepared. The melt specific resistance of the polymer E was 37 kPa.
    Preparation Example 6 Preparation of Polymer F
    The same method as in Preparation Example 1, except that calcium acetate was added 0.03% by weight relative to dimethyl terephthalate instead of 0.07% by weight relative to dimethyl terephthalate and 0.02% by weight relative to dimethyl terephthalate. Polyethylene terephthalate resin (polymer F) was prepared. Melt resistivity of the polymer F was 80 kPa.
    Preparation Example 7 Preparation of Polymer G
    Instead of adding calcium acetate 0.07% by weight of dimethyl terephthalate and manganese acetate 0.02% by weight of dimethyl terephthalate, add calcium acetate 0.03% by weight of dimethyl terephthalate and 0.04% by weight of trimethyl phosphate instead of 0.02% by weight. A polyethylene terephthalate resin (polymer G) was prepared in the same manner as in Preparation Example 1, except that it was added thereto. The melt specific resistance of the polymer G was 200 kPa.
    Preparation Example 8 Preparation of Polymer H
    Instead of adding calcium acetate to 0.07% by weight of dimethyl terephthalate and manganese acetate to 0.02% by weight of dimethyl terephthalate, add calcium acetate to 0.03% by weight of dimethyl terephthalate and 0.06% by weight of trimethyl phosphate instead of 0.02% by weight A polyethylene terephthalate resin (polymer H) was prepared in the same manner as in Preparation Example 1, except that it was added thereto. The melt specific resistance of the polymer H was 200 kPa.
    Example 1
    After drying polymer C (15 kPa) and polymer E (37 kPa), the polymer block is placed at the outer layer (A and C layer) and the polymer block is placed at the inner layer (B layer) at 290 ° C. Supply ratio of polymer Polymer C: Polymer E: Polymer C was fed to obtain an amorphous sheet having a three-layer structure. The sheet was subsequently stretched 3.5 times in the longitudinal direction at 90 ° C. and 4.3 times in the transverse direction at 110 ° C., and heat-treated at 220 ° C. for 3 seconds to give A, B and C layers of 0.5, 3.5 and 0.5 μm, respectively. Got.
    Example 2
    Polyethylene terephthalate film was prepared in the same manner as in Example 1 except that Polymer F (80 kPa) was used instead of Polymer E, and the supply ratio of Polymer C: Polymer F: Polymer C was 4: 1: 4. Prepared. The thicknesses of the produced films were A, B and C layers of 2.0, 0.5 and 2.0 mu m, respectively.
    Example 3
    Polyethylene terephthalate film was prepared in the same manner as in Example 2 except that the polymer C: Polymer F: Polymer C was 1: 1. The thicknesses of the prepared films were A, B and C layers of 1.5, 1.5 and 1.5 탆, respectively.
    Example 4
    A polyethylene terephthalate film was prepared in the same manner as in Example 1, except that Polymer F (80 μs) was used instead of Polymer E. The thicknesses of the prepared films were A, B and C, respectively, 0.5, 3.5 and 0.5 μm.
    Example 5
    A polyethylene terephthalate film was prepared in the same manner as in Example 1 except that Polymer G (200 μs) was used instead of Polymer E. The thicknesses of the prepared films were A, B and C, respectively, 0.5, 3.5 and 0.5 μm.
    Example 6
    A polyethylene terephthalate film was prepared in the same manner as in Example 1 except that Polymer H (300 Hz) was used instead of Polymer E. The thicknesses of the prepared films were A, B and C, respectively, 0.5, 3.5 and 0.5 μm.
    Example 7
    A polyethylene terephthalate film was prepared in the same manner as in Example 1 except that Polymer A (8 kPa) was used instead of Polymer C and Polymer F (80 kPa) was used instead of Polymer E. The thicknesses of the prepared films were A, B and C, respectively, 0.5, 3.5 and 0.5 μm.
    Example 8
    Polyethylene terephthalate film was prepared in the same manner as in Example 1 except that Polymer E (37 kPa) was used instead of Polymer C and Polymer F (80 kPa) was used instead of Polymer E. The thicknesses of the prepared films were A, B and C, respectively, 0.5, 3.5 and 0.5 μm.
    Comparative Example 1
    A polyethylene terephthalate film was prepared in the same manner as in Example 1, except that a single layer amorphous sheet was prepared using only Polymer E (37 mm 3). The thickness of the film produced was 4.5 μm.
    Comparative Example 2
    A polyethylene terephthalate film was prepared in the same manner as in Example 1 except that a single layer amorphous sheet was prepared using only Polymer B (10 Hz). The thickness of the film produced was 4.5 μm.
    Comparative Example 3
    A polyethylene terephthalate film was prepared in the same manner as in Example 1, except that Polymer D (20 Hz) was used instead of Polymer E. The thicknesses of the produced films were A, B and C layers of 0.5, 3.5 and 4.5 탆, respectively.
    Comparative Example 4
    Polyethylene terephthalate film was prepared in the same manner as in Example 1 except that polymer F (80 kPa) was used instead of polymer E and the feed ratio of polymer C: polymer F: polymer C was 7: 1: 1. Prepared. The thicknesses of the prepared films were A, B and C, respectively, 2.1, 0.3 and 2.1 μm.
    Example 9
    The performance evaluation results of the films prepared in Examples 1 to 8 and Comparative Examples 1 to 4 are shown in Table 1 below.
    Melt resistivityThickness (㎛)Accreditation CharacteristicsDielectric loss surge temperature (℃) A floorB floorC floorA floorB floorC floor Example 11537150.53.50.5○187 Example 21580152.00.52.0○185 Example 31580151.51.51.5○190 Example 41580150.53.50.5○196 Example 515200150.53.50.5○203 Example 615300150.53.50.5○205 Example 788080.53.50.5◎195 Example 83780370.53.50.5△198 Comparative Example 13737371.51.51.5△190 Comparative Example 21010101.51.51.5○170 Comparative Example 31520150.53.50.5○175 Comparative Example 41580152.13.52.1○175
    As can be seen from the comparison between Example 5 and Comparative Example 1, the three-layer film of Example 5, wherein the inner layer is made of a polymer having a high melt resistivity and the outer layer is made of a polymer having a low melt resistivity, has the same volume resistance. It showed that electrostatic application property was superior to a monolayer film.
    In addition, as can be seen from the comparison of Examples 1, 4, 5, 6 and Comparative Example 2, the comparative example in which the three-layer film of Examples 1, 4, 5, and 6, in which the inner layer has a melt specific resistance of 30 GPa or more, is a normal film. Dielectric loss at high temperature was improved over the single layer film of 2, and as the melting resistivity of the inner layer was increased, the soaring temperature of the dielectric loss was also increased. Therefore, it was found that the melt resistivity of the inner layer has an effect of improving the dielectric loss of the film only when the melt resistivity of the inner layer is 30 kPa or more, and the increase in the temperature of the dielectric loss of the film increases as the melt resistivity of the inner layer increases.
    As can be seen from the comparison of Examples 2, 3, and 4 and Comparative Example 4, the three-layer film of Examples 2, 3, and 4 having an inner layer thickness of 0.5 µm or more was larger than that of Comparative Example 4 having an inner layer thickness of 0.3 µm. Dielectric loss spike temperature was high. Therefore, it was found that the thickness of the inner layer should be 0.5 μm or more.
    As can be seen from the comparison of Examples 4, 7 and 8, it was found that the lower the melt specific resistance of the outer layer is, the lower it is in the range where there is no adverse effect on the electrostatic application and there is no risk of discharge.
    As can be seen in Table 1, the polyester film according to the present invention exhibits excellent melt resistivity characteristics, application characteristics and dielectric loss characteristics. Therefore, the polyester film of this invention is especially suitable for using as a film for capacitors.
    权利要求:
    Claims (3)
    [1" claim-type="Currently amended] In the multilayer polyester film,
    A biaxially oriented multilayer polyester film for capacitors comprising a polymer having a melt specific resistance of 30 GPa or more and a thickness of 0.5 µm or more as an inner layer and a polymer having a melt resistivity of 1 to 29 GPa as an outer layer.
    [2" claim-type="Currently amended] The method of claim 1,
    A film in which the polymer of the inner layer has a melt resistivity of 80 GPa or more.
    [3" claim-type="Currently amended] The method of claim 1,
    A film in which the polymer of the outer layer has a melt resistivity of 5 to 10 GPa.
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    同族专利:
    公开号 | 公开日
    KR100256549B1|2000-05-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-11-06|Application filed by 장용균, 에스케이씨 주식회사
    1997-11-06|Priority to KR1019970058273A
    1999-06-05|Publication of KR19990038507A
    2000-05-15|Application granted
    2000-05-15|Publication of KR100256549B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970058273A|KR100256549B1|1997-11-06|1997-11-06|Biaxially oriented polyester film for capacitor|
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