• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Disclosed is a discharge system of a semiconductor manufacturing device with a vacuum device. A discharge system according to the present invention comprises a dust collector for collecting reaction by-products discharged from a plurality of semiconductor manufacturing apparatuses through one downstream vacuum line, and a plurality of vacuum lines connected between each of the semiconductor manufacturing apparatuses and the downstream vacuum line. And a plurality of vacuum pumps each provided in the vacuum line to discharge reaction by-products discharged from the semiconductor manufacturing apparatus to the downstream vacuum line.
    公开号:KR19990034743A
    申请号:KR1019970056438
    申请日:1997-10-30
    公开日:1999-05-15
    发明作者:신광희
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Discharge System of Semiconductor Manufacturing Equipment with Vacuum Device
    TECHNICAL FIELD This invention relates to a semiconductor manufacturing apparatus. Specifically, It is related with the discharge system of the semiconductor manufacturing apparatus provided with a vacuum apparatus.
    The semiconductor manufacturing apparatus used in the semiconductor manufacturing process is performed in a vacuum state according to the characteristics of the manufacturing apparatus that performs each process corresponding to the unit process, and the reaction by-products generated during the process process the reactor and the exhaust system. Is discharged through.
    For example, an etching process for forming a metal wiring layer on a semiconductor substrate is performed in a state where a constant vacuum pressure is maintained in the reaction chamber, and the required vacuum state is formed by using a vacuum pump. The by-products generated as a result of the reaction in the reaction chamber have a great influence on the process characteristics. Therefore, these by-products are discharged directly through the vacuum pump.
    In a conventional semiconductor manufacturing apparatus, reaction by-products generated in each reaction chamber for each manufacturing apparatus are discharged through a vacuum line using a vacuum pump, and the discharged reaction by-products are filtered through each dust collecting apparatus and finally discharged. In the process of discharging the reaction by-products, the by-products are solidified by a temperature difference or a leakage phenomenon for each position of the vacuum lines, thereby causing the vacuum lines to be blocked. The location-specific temperature difference and the possibility of leakage in such a vacuum line increases as the device has a complicated structure. In the discharging system of the semiconductor manufacturing apparatus having the structure according to the prior art as described above, since each vacuum pump has a vacuum pump and a respective dust collector in each vacuum line, the apparatus is very complicated and the temperature difference of each vacuum line is different. Alternatively, by-products are likely to solidify in the vacuum line due to leakage, which often leads to blockage of the vacuum line, requiring frequent shutdown of the equipment.
    An object of the present invention is to provide a semiconductor manufacturing apparatus using a vacuum apparatus, which has a simple structure and which is easy to inspect and manage regularly.
    1 is a view schematically showing a configuration of an exhaust system of a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention.
    2 is a view schematically illustrating a configuration of an exhaust system of a semiconductor manufacturing apparatus according to a modified embodiment of the present invention.
    <Explanation of symbols for main parts of the drawings>
    10: semiconductor manufacturing apparatus, 20: vacuum pump
    30: vacuum line, 32: downstream vacuum line
    50: dust collector, 110: semiconductor manufacturing device
    120: vacuum pump, 130: vacuum line
    132: downstream vacuum line, 140: vacuum pump
    152, 154: dust collector, 160: switching valve
    170: control valve
    Discharge system of a semiconductor manufacturing apparatus according to an embodiment of the present invention for achieving the above object is a dust collecting device for collecting the reaction by-products discharged from a plurality of semiconductor manufacturing apparatus through one downstream vacuum line, each of the semiconductor manufacturing apparatus And a plurality of vacuum lines connected between the downstream vacuum line and each of the plurality of vacuum pumps, each provided in the vacuum line to discharge reaction by-products discharged from the semiconductor manufacturing apparatus to the downstream vacuum line. .
    A discharge system of a semiconductor manufacturing apparatus according to another embodiment of the present invention for achieving the above object is two dust collectors for collecting the reaction by-products discharged from a plurality of semiconductor manufacturing apparatus through one downstream vacuum line, each of the semiconductors A plurality of vacuum lines connected between a manufacturing apparatus and the downstream vacuum line, and a plurality of vacuum pumps each provided in the vacuum line one by one to discharge the reaction by-products discharged from the semiconductor manufacturing apparatus to the downstream vacuum line. do.
    Preferably, the apparatus further includes a switching valve installed in the downstream vacuum line to selectively open the path to any one of the two dust collectors.
    Also preferably, the apparatus further includes a plurality of control valves respectively installed downstream of the vacuum pump in the vacuum line to maintain a constant discharge pressure of the fluid passing through the vacuum line.
    A vacuum pump may be further provided in the downstream vacuum line to increase the amount of decompression in the downstream vacuum line.
    The discharge system of the semiconductor manufacturing apparatus according to the present invention has a simple structure, is easy to check and manage regularly, and the reaction by-products can be quickly discharged from the semiconductor manufacturing apparatus through the vacuum line.
    Next, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
    1 is a view schematically showing a configuration of an exhaust system of a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention.
    Referring to FIG. 1, in a discharge system of a semiconductor manufacturing apparatus 10 according to an embodiment of the present invention, reaction by-products discharged from a plurality of semiconductor manufacturing apparatuses 10 correspond to respective semiconductor manufacturing apparatuses 10. The vacuum pump 20 is discharged through the vacuum line 30 installed separately. The reaction by-products discharged from the semiconductor manufacturing apparatus 10 through the vacuum line 30 provided with a separate vacuum pump 20 are all combined into one downstream vacuum line 32, and one dust collector 50 is provided. Passed through and finally discharged.
    Although the reaction by-products discharged from the three semiconductor manufacturing apparatuses are treated by one dust collector in FIG. 1, the present invention is not limited thereto, and the present invention may be applied to a larger number of semiconductor manufacturing apparatuses. .
    As described above, in the discharging system according to the present invention, the reaction by-products discharged from each semiconductor manufacturing apparatus are first discharged from the plurality of semiconductor devices after passing through the respective vacuum pumps, without separately installing the dust collectors for each individual facility. Since the reaction by-products are collected in one place and discharged through one dust collector, it is advantageous in terms of the working environment, and can increase the vacuum discharge effect as well as simplify the structure. As a result, the vacuum line through which the reaction by-products are passed is reduced, and the possibility of the by-products solidifying in the vacuum line is reduced by the temperature difference or leakage phenomenon of the vacuum lines.
    2 is a view schematically illustrating a configuration of an exhaust system of a semiconductor manufacturing apparatus according to a modified embodiment of the present invention.
    Referring to FIG. 2, in a discharge system of a semiconductor manufacturing apparatus 110, for example, an etching apparatus for forming a metal wiring layer, reaction by-products discharged from a plurality of semiconductor manufacturing apparatus 110 are respectively. In response to the semiconductor manufacturing apparatus 110 of the vacuum pump 120 is discharged through the vacuum line 130 is installed separately. The reaction by-products discharged from the semiconductor manufacturing apparatus 110 through the vacuum line 130 in which the separate vacuum pump 120 is installed pass through the control valve 170 so as to be discharged at a constant discharge pressure. The reaction by-products passing through the control valve 170 are all combined into one downstream vacuum line 132 and then again passed through another vacuum pump 140 to increase the depressurization amount so that the reaction by-products can be immediately discharged. .
    In addition, in this embodiment, the reaction by-products discharged through the downstream vacuum line 132 are finally discharged through the two dust collectors 152 and 154. A switching valve 160 is installed between the vacuum pump 140 and the dust collectors 152 and 154. The switching valve 160 automatically shuts off the path to the dust collector when one of the dust collectors 152 and 154 is blocked by the reaction by-products and needs maintenance. It serves to open the path. Therefore, even when maintenance of any one of the dust collectors 152 and 154 is necessary, it is not necessary to interrupt work and it can be operated always.
    According to the above-described modified embodiment of the present invention, since another vacuum pump is installed in the middle of the vacuum line through which the reaction by-product is discharged from the semiconductor manufacturing apparatus via the vacuum pump, the reaction by-product can be discharged quickly, and the switching valve Since two dust collectors can be selectively used, there is no need to interrupt work even when maintenance of the dust collector is required.
    In addition, since a control valve is installed in the vacuum line to constantly sense the pressure at the front and rear ends of the vacuum pump and automatically detect and compare the discharge pressure, the reaction by-products may be discharged at a constant discharge pressure.
    As described above, the discharging system of the semiconductor manufacturing apparatus according to the present invention has a simple structure, is easy to check and manage regularly, and the reaction by-products can be quickly discharged from the semiconductor manufacturing apparatus through the vacuum line.
    The present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made by those skilled in the art within the scope of the technical idea of the present invention. Do.
    权利要求:
    Claims (5)
    [1" claim-type="Currently amended] A dust collector for collecting the reaction by-products discharged from the plurality of semiconductor manufacturing apparatuses through one downstream vacuum line,
    A plurality of vacuum lines connected between the semiconductor manufacturing apparatuses and the downstream vacuum lines;
    And a plurality of vacuum pumps, each provided in the vacuum line, for discharging the reaction by-products discharged from the semiconductor manufacturing apparatus to the downstream vacuum line.
    [2" claim-type="Currently amended] Two dust collectors for collecting reaction by-products discharged from the plurality of semiconductor manufacturing apparatuses through one downstream vacuum line,
    A plurality of vacuum lines connected between the semiconductor manufacturing apparatuses and the downstream vacuum lines;
    And a plurality of vacuum pumps installed in each of the vacuum lines to discharge reaction by-products discharged from the semiconductor manufacturing apparatus to the downstream vacuum line.
    [3" claim-type="Currently amended] 3. The discharge system according to claim 2, further comprising a switching valve installed in the downstream vacuum line to selectively open a path to any one of the two dust collectors.
    [4" claim-type="Currently amended] 4. The discharge of the semiconductor manufacturing apparatus according to claim 3, further comprising a plurality of control valves respectively installed downstream of the vacuum pump in the vacuum line to maintain a constant discharge pressure of the fluid passing through the vacuum line. 5. system.
    [5" claim-type="Currently amended] The discharge system of the semiconductor manufacturing apparatus according to claim 2, further comprising a vacuum pump provided in the downstream vacuum line to increase the amount of decompression in the downstream vacuum line.
    类似技术:
    公开号 | 公开日 | 专利标题
    JP3418411B2|2003-06-23|Vacuum unit
    KR101565437B1|2015-11-03|Gas supply apparatus for semiconductor manufacturing apparatus
    US7278831B2|2007-10-09|Apparatus and method for control, pumping and abatement for vacuum process chambers
    JP2852152B2|1999-01-27|Electronic equipment cooling system
    US5439026A|1995-08-08|Processing apparatus and flow control arrangement therefor
    US6649019B2|2003-11-18|Apparatus for conditioning the atmosphere in a vacuum chamber
    JP6023134B2|2016-11-09|Method and apparatus for efficient operation of an abatement system
    US20110265884A1|2011-11-03|Twin chamber processing system with shared vacuum pump
    US6602346B1|2003-08-05|Gas-purged vacuum valve
    JP5813557B2|2015-11-17|Method for controlling the operation of a processing system
    TW522443B|2003-03-01|A fluid control apparatus and a gas treating apparatus using the same
    KR20000052913A|2000-08-25|Gas panel
    KR100567621B1|2006-04-04|Contamination control apparatus and management system having the same
    KR100218916B1|1999-09-01|Power management system in usb hub unit
    US9841770B2|2017-12-12|Pressure-type flow control device and method for preventing overshooting at start of flow control performed by said device
    US7000454B2|2006-02-21|Particle measurement configuration and semiconductor wafer processing device with such a configuration
    WO1999036714A2|1999-07-22|Two out of three voting solenoid arrangement
    KR100271758B1|2001-01-15|Semiconductor manufacturing equipment and driving method thereof
    US8950429B2|2015-02-10|Valve-member monitoring system
    US20040026386A1|2004-02-12|Method for improving ash rate uniformity in photoresist ashing process equipment
    US20180003178A1|2018-01-04|Vacuum exhaust system and channel-switching valve used in this vacuum exhaust system
    EP1670040A4|2008-05-28|Projection exposure device, projection exposure method, and device manufacturing method
    FR2813377B1|2005-08-19|System for optimizing the performance of an oil supply
    EP2850322B1|2018-09-12|Method and apparatus for adjusting operating parameters of a vacuum pump arrangement
    WO2002047120A3|2002-12-27|Cooling gas delivery system for a rotatable semiconductor substrate support assembly
    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-10-30|Application filed by 윤종용, 삼성전자 주식회사
    1997-10-30|Priority to KR1019970056438A
    1999-05-15|Publication of KR19990034743A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970056438A|KR19990034743A|1997-10-30|1997-10-30|Discharge System of Semiconductor Manufacturing Equipment with Vacuum|
    [返回顶部]