• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention is a wafer transfer mechanism that is held and transported without direct contact with the wafer, and solves the problem of contamination of the wafer surface due to contact or contamination such as particles to improve the yield of the product.
    公开号:KR19980066336A
    申请号:KR1019970001788
    申请日:1997-01-22
    公开日:1998-10-15
    发明作者:최정석
    申请人:문정환；엘지반도체 주식회사；
    IPC主号:
    专利说明:

    Wafer transfer mechanism
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer mechanism for holding and transporting wafers. In particular, wafer alignment is minimized by minimizing wafer damage due to scratches or contamination sources such as particles generated during wafer transfer into exposure equipment. The present invention relates to a wafer transfer mechanism suitable for preventing errors.
    1 is a view for explaining a conventional wafer transfer mechanism, (A) (B) (C) of (Fig. 1) is a view for explaining an embodiment of a conventional wafer transfer mechanism, (FIG. 1 (D) is a drawing to draw a problem of the conventional wafer transfer mechanism, when the wafer transfer using the conventional wafer transfer mechanism, the contamination source such as particles on the transfer mechanism attached to the back of the wafer The figure shows misalignment transferred to the exposure equipment.
    Hereinafter, a conventional wafer transfer tool will be described with reference to the accompanying drawings.
    In the process of manufacturing a semiconductor, during the transfer of wafers from each device to the equipment (particularly to the exposure equipment), conventional transfer mechanisms are vacuum as shown in FIG. 1 (A) (B) (C). Vacuum tweezers, chucks, belts and the like have been used.
    That is, as shown in FIG. 1A, a vacuum tweezer, which is a conventional wafer transfer mechanism, has a vacuum hole 10 formed on a surface of a portion 11 on which a wafer is seated, and a vacuum tube 12 connected to a vacuum hole therein. ) Is installed.
    Therefore, after the suction of the back side of the wafer using the vacuum hole (10) to hold, the transfer to the desired equipment by the robot arm (robot arm) connected to the wafer seating portion (11).
    In addition, the chuck, which is another conventional wafer transfer mechanism used for wafer transfer, most commonly used during wafer transfer, has a plurality of rubber pads 20 on the surface of the site where the wafer is seated, as shown in FIG. Was formed, and the wafer W and the rubber pad 20 were in contact with each other when the wafer (part indicated by the phantom line, W) was seated on the chuck, thereby preventing slipping during wafer transfer.
    As shown in FIG. 1C, another conventional transfer mechanism is used to hold and transfer the wafer using the rotational force of the belt 30 that is rotated.
    However, a vacuum tweezer, a chuck or a belt, which is a conventional wafer transfer mechanism as described above, has a problem such as a contamination source such as particles attached to the back surface of the wafer due to direct contact with the wafer and scratches.
    Therefore, when a wafer damaged by particles or scratches due to a conventional wafer transfer mechanism is aligned in an exposure apparatus or the like, as illustrated in FIG. 1D, the wafer W seated on the stage 40 may be a foreign material 41 or the like. Inclination is caused by the source of contamination, and errors due to misalignment occur.
    The present invention provides a wafer transfer mechanism that can safely hold and transport a wafer by preventing damage due to contamination sources such as particles generated on the wafer due to direct contact with the wafer and scratches on the wafer surface.
    The present invention is to provide a wafer transport mechanism that can safely transport and hold the wafer by preventing damage due to contamination sources such as particles generated on the wafer due to direct contact with the wafer and scratches on the wafer surface.
    The present invention relates to a wafer transfer mechanism that can be transported by fixing a wafer without direct contact with the wafer. The present invention solves the problem of contaminants such as scratches or particles on the wafer surface due to direct contact, thereby improving product yield.
    1 is a view for explaining a conventional wafer transfer mechanism,
    1 (A) (B) (C) is a diagram for explaining an embodiment of a conventional wafer transfer mechanism,
    FIG. 1D is a diagram illustrating a problem of the conventional wafer transfer mechanism.
    2 is a view for explaining the wafer transfer mechanism of the present invention,
    2 (A) is a plan view of the wafer transfer mechanism of the present invention,
    2B is a cross-sectional view of the wafer transfer mechanism of the present invention.
    ＊ Explanation of symbols on main parts of drawing
    10: vacuum hole, 11: seating area, 12: vacuum tube, 20: rubber pad, 30: belt, 40: stage, 41: foreign matter, 100: injection hole, 101: holding part, 102: support part, 103: gas line
    2 is a view for explaining the wafer transfer mechanism of the present invention, (A) of FIG. 2 is a plan view of the wafer transfer mechanism of the present invention, and (B) of FIG. 2 is the wafer of the present invention. Sectional view of the transfer mechanism.
    In the wafer transfer mechanism of FIG. 2, as shown in FIG. 2A, a plurality of injection holes 100 are formed at one edge of a surface, a surface corresponding to one surface is opened, and a side surface thereof has a predetermined width. It is composed of a cylindrical holding part (holhing part) 101 having a, and the support portion 102 having a gas line (103) connected to the holding part and connected to the injection hole 100 therein.
    Looking at the process of holding and transferring the wafer using the wafer transfer mechanism of the present invention having such a configuration as follows.
    First, the wafer W 'is introduced into an open portion of the holding part 101, and then gas is supplied through the gas line 103.
    As the gas supplied here, air or nitrogen gas is used.
    Subsequently, gas flowing in the gas line 103 is injected to the edge of the wafer W ′ through the injection hole 100.
    At this time, when the gas is injected through the injection hole 100 formed at the edge of the closed one surface of the holding portion 101, the interior of the injection hole in which the gas is injected becomes a low pressure state than the outside.
    Thus, the wafer is held in the air and fixed to the holding portion.
    Subsequently, the wafer fixed to the holding part of the present invention is transferred to a stage in the exposure apparatus to proceed with wafer alignment.
    The wafer transfer mechanism of the present invention introduces the wafer into the open portion of the holding portion, and then sprays gas onto the wafer through the injection hole to form the inside of the injection hole in a relatively low pressure state than the outside, thereby forming the wafer in the holding portion. Use the principle of fixing and conveying.
    As described above, in the wafer transfer mechanism of the present invention, gas is injected to the edge of the wafer without direct contact with the wafer, and the wafer is fixed to the holding part by a pressure difference between the inside and the outside of the injection hole through which the gas is injected.
    Unlike the conventional mechanism for holding a wafer through direct contact with the wafer and then transferring the wafer, the wafer transfer mechanism of the present invention has no direct contact with the wafer, so that the wafer is attached to a pollutant such as particles or the surface thereof is scratched. Damage can be prevented.
    Therefore, the yield of the product can be maximized.
    权利要求:
    Claims (5)
    [1" claim-type="Currently amended] A holding part having a plurality of injection holes formed at one edge thereof, a surface corresponding to the one surface being opened, and a side thereof having a predetermined width;
    It is connected to the holding part and provided with a supporting part having a gas line connected to the injection hole therein, the wafer is introduced into the open part of the holding part, and then gas is injected into the wafer edge through the injection hole. And the wafer is fixed to the holding part and transferred by the pressure difference inside the injection hole.
    [2" claim-type="Currently amended] The method according to claim 1,
    Wafer transport mechanism characterized in that the length from the center of the holding portion to the plurality of injection holes is smaller than the length of the wafer radius.
    [3" claim-type="Currently amended] The method according to claim 1,
    And the side thickness of the chuck is greater than the thickness of the wafer.
    [4" claim-type="Currently amended] The method according to claim 1,
    Wafer transport mechanism characterized in that the gas used nitrogen gas or air.
    [5" claim-type="Currently amended] The method according to claim 1,
    And a planar shape of the holding part is the same as a wafer having a flat zone formed on a side surface thereof.
    类似技术:
    公开号 | 公开日 | 专利标题
    US6817822B2|2004-11-16|Load port, wafer processing apparatus, and method of replacing atmosphere
    US5752796A|1998-05-19|Vacuum integrated SMIF system
    US6845779B2|2005-01-25|Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
    JP4027837B2|2007-12-26|Purge apparatus and purge method
    US8585830B2|2013-11-19|Substrate processing apparatus and substrate processing method
    US5711646A|1998-01-27|Substrate transfer apparatus
    US5613821A|1997-03-25|Cluster tool batchloader of substrate carrier
    TWI616239B|2018-03-01|Scrubber
    US5664925A|1997-09-09|Batchloader for load lock
    JP4175988B2|2008-11-05|Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus
    US20140120477A1|2014-05-01|Substrate processing apparatus
    KR102007042B1|2019-08-02|Delamination device
    KR100864126B1|2008-10-16|Substrate processing apparatus and method
    US6909276B2|2005-06-21|Rotating gripper wafer flipper
    US6361422B1|2002-03-26|Method and apparatus for transferring semiconductor substrates using an input module
    KR100393689B1|2003-11-28|Wafer Type Product Processing Equipment
    US4900214A|1990-02-13|Method and apparatus for transporting semiconductor wafers
    JP4218260B2|2009-02-04|Storage container body for processing object and processing system using the same
    US4306731A|1981-12-22|Wafer support assembly
    US5609459A|1997-03-11|Door drive mechanisms for substrate carrier and load lock
    DE3047513C2|1990-03-29|
    US6578891B1|2003-06-17|Substrate holder and substrate transfer apparatus using the same
    US6059893A|2000-05-09|Method for cleaning a semiconductor wafer
    TWI421974B|2014-01-01|Substrate holding and rotating device, substrate processing apparatus and substrate cleaning apparatus comprising the said device
    TW475218B|2002-02-01|Rotary processing apparatus
    同族专利:
    公开号 | 公开日
    KR100239785B1|2000-01-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-01-22|Application filed by 문정환, 엘지반도체 주식회사
    1997-01-22|Priority to KR1019970001788A
    1998-10-15|Publication of KR19980066336A
    2000-01-15|Application granted
    2000-01-15|Publication of KR100239785B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970001788A|KR100239785B1|1997-01-22|1997-01-22|Wafer transfer device|
    [返回顶部]