• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Disclosed is a double-sided substrate. The present invention provides a substrate having a through hole, an upper surface pattern formed on an upper surface of the substrate, a lower surface pattern formed on a lower surface of the substrate, and an Fs inserted into the through hole to electrically connect the upper surface pattern and the lower surface pattern. Provided is a double-sided board comprising an eyelet. It is preferable to comprise the said board | substrate with a phenol board | substrate. The Fs eyelet is a structure in which a flux is filled in the copper base material and a solder is applied to the outside of the copper base material. The double-sided substrate of the present invention can achieve cost reduction and prevent breakage of the phenolic substrate by inserting the fs eyelets into the through-holes of the phenolic substrate and soldering the soldering process.
    公开号:KR19980058921A
    申请号:KR1019960078257
    申请日:1996-12-30
    公开日:1998-10-07
    发明作者:이경래
    申请人:구자홍；엘지전자 주식회사；
    IPC主号:
    专利说明:

    Double-sided board and its construction method
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided substrate and a method of constructing the same, and to a double-sided substrate having an eyelet (hereinafter referred to as F S eyelet) including flux and solder, and a method of constructing the same. .
    As the electronic equipment becomes more functional, the density of the board becomes higher, so that the circuit of the printed circuit board cannot be configured in the single-sided board, and thus the circuit is formed on both sides. The double-sided board constituting the circuit on both sides is required because the circuit is configured on both the upper and lower sides, a structure for transmitting electrical signals of the upper and lower sides.
    On the other hand, the conventional double-sided substrate uses a silver through hole as a signal transmission tool for the upper and lower sides. Here, a configuration method of a conventional double-sided board using silver through holes will be described.
    1 to 3 are cross-sectional views illustrating a method of constructing a double-sided substrate according to the prior art.
    Specifically, the upper surface pattern 1 and the lower surface pattern 3 are formed on the upper surface and the lower surface, respectively, and a substrate 7 having a silver through hole 5, for example, a phenol substrate (phenol) is prepared (FIG. 1). Subsequently, a silver paste 9 is filled in the silver through hole 5 to perform a curing process at 150 ° C. for 1 hour (FIG. 2). In this case, a silver paste 9 is filled in the silver through-hole 5 to complete a double-sided board on which the upper surface pattern 1 and the lower surface pattern 3 are electrically connected (FIG. 3).
    However, in the conventional method of constructing a double-sided board as described above, the price of the phenol double-sided board to which the silver through hole is applied is about twice as expensive as a general phenolic double-sided board.
    In addition, in order to cure the silver paste during the above-mentioned manufacturing process, the curing should be performed at 150 ° C. for 1 hour, during which the phenolic substrate is strongly changed, so that a large number of cracking defects are generated by the impact during subsequent substrate operations. There is a disadvantage.
    Therefore, the technical problem of the present invention is to provide a double-sided board that can solve the above disadvantages.
    In addition, another technical problem of the present invention is to provide a configuration method of the above-mentioned double-sided board.
    1 to 3 are cross-sectional views illustrating a method of constructing a double-sided substrate according to the prior art.
    4 (a) and 4 (b) are cross-sectional views illustrating the F islet used in the present invention.
    5 to 9 are cross-sectional views illustrating a method of constructing a double-sided substrate according to the present invention.
    In order to achieve the above technical problem, the present invention provides a substrate having a through hole, an upper surface pattern formed on the upper surface of the substrate, a lower surface pattern formed on the lower surface of the substrate, and the upper surface pattern and the lower surface pattern inserted into the through hole Provided is a double-sided board comprising a fs (FS) eyelet to electrically connect the.
    It is preferable to comprise the said board | substrate with a phenol board | substrate. The Fs eyelet is a structure in which a flux is filled in the copper base material and a solder is applied to the outside of the copper base material.
    In order to achieve the above technical problem, the present invention provides a substrate having a through hole and having a top pattern and a bottom pattern, respectively, on the top and bottom surfaces, and inserting the fs eyelets into the through holes; A method of forming a double-sided substrate, the method comprising: closing a lower portion of the Fs eyelet to closely contact the lower surface pattern, and soldering the substrate to which the Fs eyelet is inserted to electrically connect the upper surface pattern to the lower surface pattern. To provide.
    The soldering is performed by using a molten solder pot, and the F islet is filled with a flux in a copper base material and a solder is applied to the outside of the copper base material.
    According to the present invention, cost reduction is possible and the breakage of the substrate can be prevented by inserting the F islets into the substrate and performing soldering in the soldering process.
    Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
    First, F S eyelet used in the present invention will be described.
    4 (a) and 4 (b) are cross-sectional views illustrating the F islet used in the present invention.
    Specifically, in the structure of the F S islet of the present invention, a flux 13 is filled in the copper base material 11 and a solder 15 is applied to the outer surface. The flux 13 is filled to a thickness of about 0.1 mm, and the solder 15 is applied to a thickness of 1.5 mm.
    Next, a method of constructing a double-sided board using the F S eyelet of the present invention will be described.
    5 to 9 are cross-sectional views illustrating a method of constructing a double-sided substrate according to the present invention.
    Referring to FIG. 5, a substrate 27, for example, a phenol substrate, having a through hole 21 and having an upper surface pattern 23 and a lower surface pattern 25 on the upper and lower surfaces, respectively, is prepared (FIG. 5).
    6 and 7, the F islet 29 is inserted into the through hole 21. As described above, the Fs eyelet 29 is filled with a flux in the copper base material and a solder is applied to the outside of the copper base material.
    Referring to FIG. 8, when the insertion process of FIGS. 6 and 7 is completed, the F islet 29 is clenched outward so that the bottom pattern 25 of the substrate and the F islet 29 closely contact each other.
    Referring to FIG. 9, the substrate 27 on which the insertion of the Fs eyelet 29 is completed is mechanically inserted but not electrically connected. Accordingly, the upper surface pattern 23 and the lower surface pattern 25 are electrically connected by soldering a substrate into which the Fs eyelet 29 is inserted by a molten solder pot.
    Looking at this process in detail, when the molten solder of 250 ℃ contact the portion where the CS eyelet 29 is cleaved in Figure 8 the flux filled in the F islet (29) rapidly transfers heat to the solder applied to the outside At the same time as melting starts, the surface of the copper base material is cleaned, and the top pattern 23 and the F islet 29 are soldered. As a result, the solder which has started to melt proceeds to the upper part to solder the base material of the upper surface pattern 23 and the F eyelet 29 so that the upper surface soldering is completed. The eyelet 29 is soldered to allow the upper and lower patterns to be connected.
    As a result, the double-sided substrate of the present invention can transmit the electrical signals of the upper and lower sides by soldering the Fs eyelet using a Fs eyelet containing flux on the general phenol substrate and applying lead and soldering process.
    The present invention is not limited to the above embodiments, and it is apparent that many modifications are possible by those skilled in the art within the technical idea of the present invention.
    As described above, the double-sided board of the present invention can achieve a significant cost reduction by not using silver through-holes by inserting the F islets into the through-holes of the phenolic board and soldering them in the soldering process, and prevents the defect of the substrates. can do. In addition, there is an advantage that does not require a new production system because it is inserted at the same time as other general insertion components and the soldering is completed in the soldering process.
    权利要求:
    Claims (6)
    [1" claim-type="Currently amended] A substrate having a through hole;
    An upper surface pattern formed on the upper surface of the substrate;
    A lower surface pattern formed on the lower surface of the substrate; And
    And a FS eyelet inserted into the through hole and electrically connecting the upper surface pattern and the lower surface pattern.
    [2" claim-type="Currently amended] The double-sided substrate according to claim 1, wherein the substrate is made of a phenol substrate.
    [3" claim-type="Currently amended] The double-sided substrate of claim 1, wherein the Fs eyelet is a structure in which a flux is filled in the copper base material and solder is applied to the outside of the copper base material.
    [4" claim-type="Currently amended] Preparing a substrate having a through hole and having a top surface pattern and a bottom surface pattern on the top and bottom surfaces, respectively;
    Inserting an Fs eyelet into the through hole;
    Pressing a lower portion of the inserted Fs eyelet to closely contact the bottom pattern; And
    And soldering the substrate into which the Fs eyelets are inserted to electrically connect the upper surface pattern and the lower surface pattern.
    [5" claim-type="Currently amended] The method of claim 4, wherein the soldering is performed by using a molten solder pot.
    [6" claim-type="Currently amended] 5. The method of claim 4, wherein the F islet is filled with a flux in a copper base material and a solder is applied to the outside of the copper base material.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-12-30|Application filed by 구자홍, 엘지전자 주식회사
    1996-12-30|Priority to KR1019960078257A
    1998-10-07|Publication of KR19980058921A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019960078257A|KR19980058921A|1996-12-30|1996-12-30|Double-sided board and its construction method|
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