• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a structure of a printed circuit board for a ball grid array semiconductor package, wherein a substrate having a thermosetting resin composite material is formed at a center thereof, and a plurality of circuit patterns are formed with metallic thin films on both surfaces of the substrate. In the circuit pattern located on one side of the substrate, metallic solder ball lands are formed to have openings of different sizes, and a thin solder mask is applied to the circuit patterns except for the solder ball lands, thereby forming a ball grid array semiconductor package. Regardless of the curvature of the body and the printed circuit board formed of the encapsulant as an element, the structure of the solder ball land formed on the printed circuit board is improved to maintain the flatness of the solder ball serving as the input / output means. Minimize defect rate during mounting, resulting in ball grid The structure of the printed wiring substrate for a ball grid array semiconductor package, which can improve the reliability of the semiconductor package.
    公开号:KR19980054916A
    申请号:KR1019960074117
    申请日:1996-12-27
    公开日:1998-09-25
    发明作者:허영욱
    申请人:황인길；아남산업 주식회사；
    IPC主号:
    专利说明:

    Structure of Printed Circuit Board for Ball Grid Array Semiconductor Package
    The present invention relates to a structure of a printed circuit board for a ball grid array semiconductor package, and more particularly, to a printed circuit board, regardless of the bending of the body and the printed circuit board formed of an encapsulant as a component of the ball grid array semiconductor package. By improving the structure of the solder ball land formed on the main board, the flatness of the solder ball, which is the input / output means, is kept constant, thereby minimizing the defective rate when mounting to the main board, thereby improving the reliability of the ball grid array semiconductor package. The present invention relates to a structure of a printed circuit board for a ball grid array semiconductor package.
    The Ball Grid Array Semi-Conductor Package (hereinafter referred to as BGA Package), which is mainly attracting attention as a next-generation semiconductor package, uses the solder ball 300 as an input / output means to the main board. The solder ball 300 is a semiconductor package, and a plurality of solder balls 300 are two-dimensionally arranged and welded on the entire surface of the printed circuit board 200. However, such a BGA package has a thermal stress on the printed circuit board 200 and other components during the high temperature processes of the manufacturing process, and the body 100 made of each component, for example, an encapsulant. Due to the difference in the coefficient of thermal expansion between the printed circuit board 200 and the warp is generated in the BGA package with a constant height difference D as shown in FIG. 1A or 1B. Since the BGA package mainly supports the One Side Molding method in which only one side of the printed circuit board 200 is molded, the bending phenomenon is more severe. In this case, the solder balls 300 fused to one surface of the printed circuit board 200 are bent along with the bending of the printed circuit board 200, thereby deteriorating the flatness of the solder balls 300. When the flatness of the solder balls 300 is deteriorated in some way, when the BGA package is mounted on the main board, the solder balls 300 arranged at a specific position as shown in FIGS. 1A and 1B, that is, In the case of 1A, the solder balls 300 disposed at the outermost side of the printed circuit board 200 are not mounted on the main board in the case of FIG. 1B. As a result, the problem of losing the function of the BGA package occurs.
    Conventionally, in order to solve these problems, the focus was on preventing the bending of the body 100 and the printed circuit board 200 formed of the encapsulant. In other words, the shape of the body 100 in a general square or rectangular shape that is strong against thermal stress, for example, to transform the shape of the corner of the body 100 into a rounded round or the corner angle of the body 100 By increasing the angle from 7 ~ 12 ° to 25 ~ 35 ° to reduce the edge stress of the body 100 to try to minimize the bending of the body 100 and the printed circuit board 200.
    However, these efforts to prevent bending are not to consider the contact of the solder balls 300 when mounting the BGA package on the main board, but rather to protect the semiconductor chip, etc. in the body 100 and between each component These are to prevent cracking. Therefore, in the case of FIGS. 1A and 1B, the warpage phenomenon of the body 100 formed of the encapsulant is improved, but the warpage improvement of the printed circuit board 200 is difficult to expect.
    SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and has a structure of a solder ball land formed on a printed circuit board, regardless of the bending of the body and the printed circuit board formed of an encapsulant as a component of the BGA package. By improving the solder ball as the input / output means, the flatness of the printed circuit board for the BGA package can be improved by minimizing the defect rate during the mounting on the main board, and consequently improving the newness of the BGA package. To provide.
    1A and 1B are state diagrams illustrating a flatness failure state of solder balls according to warpage of a conventional ball grid array semiconductor package.
    2A and 2B illustrate a first embodiment of the present invention, which is a bottom view and cross-sectional view of a printed circuit board for a ball grid array semiconductor package.
    3A and 3B show a second embodiment of the present invention, which is a bottom view and a cross-sectional view of a printed circuit board for a ball grid array semiconductor package.
    Explanation of symbols on the main parts of the drawings
    100; Body 200; Printed circuit board
    210; Solder Ball Land
    220; Opening 230; Substrate
    240; Circuit Pattern
    250; Solder Mask
    300; Solder Ball
    In order to achieve the above object, a structure of a printed circuit board for a BGA package according to the present invention includes a body formed by encapsulating a semiconductor chip or the like with an encapsulant, a printed circuit board attached to one surface of the body, and the printed circuit board. In a BGA package composed of a plurality of solder balls fused and adhered to one surface, the printed circuit board has a substrate formed of a thermosetting resin composite in the center, and a plurality of circuit patterns are formed of metallic thin films on both sides of the substrate. In the circuit pattern positioned on one surface of the substrate, a metallic solder ball land is formed to have openings having different sizes, and a thin solder mask is applied to a region except the solder ball land.
    Here, the opening formed in the solder ball land is formed in the central portion of the printed circuit board to be the largest and the size is smaller toward the outside, or on the contrary, the opening is formed the largest at the outermost side of the printed circuit board, and the size is smaller toward the center It is also possible to achieve the object of the present invention by forming.
    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a structure of a printed circuit board for a BGA package according to the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. Is as follows.
    2A and 2B show a first embodiment of the present invention, which is a bottom view and cross-sectional view of a printed circuit board for a BGA package.
    First, as shown in FIG. 2B, the BGA package has a body 100 formed by encapsulating a semiconductor chip (not shown) or the like with an encapsulant on the upper portion, and a printed circuit board at the lower end of the body 100. 200 is located.
    Here, the printed circuit board 200 is composed of several layers, and a central portion of the substrate 230 is formed of a thermosetting resin composite (Glass Fiber Reinforced Thermosetting Composite), and both sides of the substrate 230 are metallic thin films. The circuit pattern 240, the solder mask 250, and the like are formed. When the circuit pattern 240 of the metallic thin film is usually formed of a copper layer, the solder mask 250 is made of an insulating polymer and a resin. A plurality of solder balls 300 are fused to the bottom of the printed circuit board 200 as input / output terminals. That is, in the printed circuit board 200 positioned between the mon 100 and the solder ball 300, a substrate 230 is formed at a central portion thereof, and a circuit pattern 240, which is a predetermined metal thin film, is formed on both surfaces thereof. The solder mask 250, which is a polymer resin, is thinly coated on the surface of the circuit pattern 240.
    On the other hand, a solder ball land 210 having a predetermined size to which solder balls 300 are fused is formed on the circuit pattern 240 formed on the bottom of the substrate 230. Each solder ball land 210 has a predetermined size. The opening 220 is formed. The opening 220 is formed at the largest solder ball land 210 in the center portion, and the size of the opening 220 formed at the solder ball land 210 is gradually smaller toward the outside thereof. That is, as shown in FIG. 2A, the opening 220 is formed in the solder ball land 210 formed in the center of the printed circuit board 200, and the opening 220 is smaller in size toward the outside. It is formed. The opening 220 formed in the solder ball land 210 according to the present invention is formed in a size having a different diameter of a circular, but can be manufactured in the form of a rectangle, a triangle, and various polygons.
    In addition, the solder ball land 210 has a three-layer structure, as shown in the enlarged view of FIG. 2B, each formed of a copper layer, a nickel layer, and a gold layer. The outermost layer of gold is formed to achieve the best fusion. These three layers are sequentially manufactured using chemical etching, electrolytic and electroless methods and are formed on one side of the circuit pattern 240, respectively. The same amount of solder balls 300 are fused to the solder ball lands 210 in which the openings 220 of different sizes are formed, and the volume of the solder balls 300 melted according to the size of the openings 220. As will be the height of the solder ball 300 will eventually be changed.
    Here, the solder ball 300 is not fused to the printed circuit board 200 of FIG. 2A.
    As described above, a plurality of solder balls 300 are fused to the solder ball lands 210 having the openings 220 having different sizes, and since the openings 220 have different sizes, solder balls ( It can be seen that the height of 300 is formed differently. That is, the solder ball 300 flows into the opening 220 in the central portion of the printed circuit board 200 having the opening 220 largely formed in the solder ball land 210, and the height of the solder ball 300 is relatively low. The height of the solder ball 300 is increased because the size of the opening 220 is made smaller toward the outside and toward the outside.
    However, since both ends of the printed circuit board 200 are bent upward to compensate for the height difference of the solder balls 300, the height of the contact surface at which the solder balls 300 are mounted on the main board, that is, the solder balls ( The flatness of 300 is kept constant.
    3A and 3B illustrate a bottom view and a cross-sectional view of a printed circuit board 200 for a BGA package according to a second embodiment of the present invention, in which the opening of the solder ball land 210 is reversed as in the first embodiment. The size of the opening 220 is the largest on the outermost side of the printed circuit board 200, and the opening 220 is smaller in size toward the center.
    Since the size of the opening 220 is the largest on the outermost side of the printed circuit board 200, the height of the solder ball 300 seated on the outermost side is the smallest and the height of the solder ball 300 in the center portion is increased. Although formed to be the largest, since the outermost sides of the printed circuit board 200 are bent to the lower end, the flatness of the solder ball 300 is actually kept constant.
    As described above, although the present invention has been described only for the above examples, various modifications and changes may be made without departing from the scope and spirit of the present invention.
    Therefore, in the structure of the printed circuit board for BGA package according to the present invention, a substrate having a thermosetting resin composite material is formed in the center, and a plurality of circuit patterns are formed with metallic thin films on both sides of the substrate. The metallic solder ball lands are formed in the circuit pattern positioned on one surface to have openings of different sizes, and a thin solder mask is applied to the areas except for the solder ball lands, thereby forming an encapsulant as a component of the BGA package. Regardless of the bending of the board by the body and the printed circuit board, the structure of the solder ball land formed on the printed circuit board is improved to maintain the flatness of the solder ball as the input / output means, thereby minimizing the defective rate when mounting to the main board. For BGA packages that can improve the reliability of the BGA package To provide a structure of a printed circuit board.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] A ball grid array semiconductor package comprising a body formed by sealing a semiconductor chip or the like with an encapsulant, a printed circuit board attached to one surface of the body, and a plurality of solder balls fused and attached to one surface of the printed circuit board,
    The printed circuit board has a substrate formed of a thermosetting resin composite in the center, and a plurality of circuit patterns are formed of metallic thin films on both sides of the substrate, and circuit patterns located on one surface of the substrate have different sizes. A metallic solder ball land is formed to have an opening, and a thin solder mask is applied to a region excluding the solder ball land, wherein the structure of the printed circuit board for the ball grid array semiconductor package.
    [2" claim-type="Currently amended] The structure of the printed circuit board of claim 1, wherein an opening formed in the solder ball land is formed at a central portion of the printed circuit board and is smaller in size toward the outside.
    [3" claim-type="Currently amended] The structure of the printed circuit board of claim 1, wherein the opening formed in the solder ball land is formed at the outermost side of the printed circuit board and is smaller in size toward the outside.
    [4" claim-type="Currently amended] The structure of a printed circuit board of a ball grid array semiconductor package according to any one of claims 1 to 3, wherein the solder ball land having the opening has a copper layer, a nickel layer, and a gold layer structure.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-12-27|Application filed by 황인길, 아남산업 주식회사
    1996-12-27|Priority to KR1019960074117A
    1998-09-25|Publication of KR19980054916A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019960074117A|KR19980054916A|1996-12-27|1996-12-27|Structure of printed circuit board for ball grid array semiconductor package|
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