Process for preparing highly reactive low viscosity modified phenolic resin

专利摘要:
Processes for producing highly reactive low viscosity modified phenolic resins include polycondensation of petroleum heavy oil or pitch, formaldehyde polymers and phenols in the presence of an acid catalyst to produce modified phenolic resins; Reacting the resulting modified phenolic resin with phenol in the presence of an acid catalyst at a temperature higher than 120 ° C. and not higher than 200 ° C. to lower the molecular weight of the modified phenolic resin. The highly reactive low viscosity modified phenolic resin obtained according to this method has high reactivity with epoxy resin and low resin melt viscosity. In addition, this resin can be used to produce molding materials having good moldability and relatively low moisture absorption when combined with epoxy resins.
公开号:KR19980032032A
申请号:KR1019970003658
申请日:1997-02-06
公开日:1998-07-25
发明作者:타시마마사오；미야시타히로미；하세가와마코토；오야마카네요시；후지이토모아키
申请人:후쿠다타케지；카시마오일캄파니리미티드；
IPC主号:

专利说明:

Process for producing highly reactive low viscosity modified phenolic resin
The present invention is directed to a highly reactive low viscosity modified phenolic resin which has a low resin melt viscosity and is combined with an epoxy resin to provide excellent formability and low water absorption to provide improved dimensional stability without dimensional change due to water absorption. It relates to a manufacturing method. The present invention also relates to materials for molding materials, electrical and electronic components, and semiconductor sealants based on modified phenolic resins, including highly reactive, low viscosity modified phenolic resins and epoxy resins prepared through this method. Related.
Phenolic resins provide moldings with good mechanical properties and have therefore been widely used for a long time, either alone or in admixture with other resins such as epoxy resins. However, the phenol resins themselves and mixtures have disadvantages in that they are relatively low in light and alkali resistance, absorb water or alcohol, change their numerical and electrical resistance, and have low thermal resistance, in particular oxidation resistance at high temperatures.
In order to overcome these disadvantages, various modifications of the phenol resin have been studied. For example, various modified phenolic resins have been proposed that have improved resistance to degradation and oxidation by light, chemicals, etc. by modification with fatty, oil, rosin or neutral aromatic compounds.
For example, Japanese Patent Laid-Open No. 61 (1986) -235413 discloses a phenol resin having excellent heat resistance obtained by selecting a reactant of a phenol-modified aromatic hydrocarbon resin. However, the phenolic resin obtained by this method does not disadvantageously harden unless it is kept at high temperature for a long time in the molding process by its use.
Japanese Patent Application Laid-Open No. 2 (1990) -274714 describes a modified phenolic resin which is useful as a molding material having excellent heat and oxidation resistance, which is unpredictable from conventional phenolic resins. It is disclosed that it is obtained by using as a result and selecting special reaction conditions.
In addition, Japanese Patent Application Laid-Open No. 4 (1992) -145116 discloses that in the production of such phenolic resins, crude modified, phenolic resins obtained by polycondensation of starting compounds are neutralized, washed with water and / or extracted. It is disclosed that a modified phenolic resin is provided which is treated to remove any acid remaining in the neutralized and co-modified phenolic resin so as not to corrode metal groups in contact with the resin.
In the above method for producing the modified phenolic resin, the acid remaining in the crude modified phenolic resin is actually neutralized and removed by neutralization treatment with amine, followed by water washing treatment. However, the modified phenolic resin obtained through the purification step including the neutralization and water washing treatment tends to have a neutralization product remaining therein, so that it is resistant to heat and corrosion resistance such as molding materials for electric or electronic components and materials for semiconductor sealants. There is a problem that it is unsatisfactory as a molding material to be used in a product to which strict requirements are imposed.
Japanese Patent Laid-Open No. 6 (1994) -228257 teaches that a modified phenolic resin that is substantially free of acid can be obtained by purifying the crude modified phenolic resin through a purification step including a special extraction treatment. do. The substantially acid-free modified phenolic resin obtained through this purification step can be combined with the epoxy resin to obtain a molding material that not only has excellent heat and moisture resistance but also does not corrode any metal.
However, the modified phenolic resin has the disadvantage that the melt viscosity of the resin is too high to be suitable for rapid mass production of molded articles having a complicated structure. In addition, further improvements in thermal stability, dimensional stability and strength and other mechanical properties are required to use modified phenolic resins in combination with epoxy resins.
The present inventors have found that high-responsive modified phenolic resins have low resin melt viscosity and improved reactivity with epoxy resins by reacting the modified phenolic resin with phenol in the presence of an acid catalyst to lower the molecular weight of the modified phenolic resin. A production method was proposed (Japanese Patent Laid-Open No. 7 (1995) -252339).
In the lower molecular weight step of the process, the acetal bonds and / or methylene ether bonds present in the modified phenolic resin are broken and decomposed to lower the molecular weight of the modified phenolic resin, and the phenol is bound to the decomposition end to increase the phenolic content. It is feed. Thus, the molecular weight lowering reaction is typically carried out at a temperature at which the acetal bonds and / or methylene ether bonds break and decompose in modified phenolic resin molecules, i.e. 50-120 ° C.
The highly reactive modified phenolic resins obtained as described above are relatively low in viscosity and can provide molding materials with good thermal stability and formability as well as good mechanical strength such as dimensional stability when combined with epoxy resins.
However, the viscosity of the highly reactive modified phenolic resin obtained by the method is not sufficiently low, although significantly lower than that of conventional modified phenolic resins. In particular, when applied to a semiconductor sealant, a lower viscosity is required to further improve moldability while maintaining high reactivity with an epoxy resin.
In this regard, the resin molding material tends to expand and deteriorate in dimensional stability when absorbing moisture. When the resin molding material is used as a composite material with an electrical or electronic component, in particular with a metal such as the resin portion of the semiconductor sealant, the moisture absorbed by the resulting resin package is rapidly evaporated during welding mounting at high temperature. This causes expansion and cracking of the resin package. Moisture-containing resin parts corrode metal parts, severely affecting product life and reliability. Accordingly, in applications where moisture absorption of molding materials is undesirable, it is desired to reduce the water absorption of molding materials comprising the highly reactive modified phenolic resins.
The inventors have conducted intensive research on such drawbacks associated with the prior art. As a result, the polycondensation reaction product is purified as it is or after reacting with phenol at a predetermined temperature in the absence of formaldehyde polymer and other crosslinking agents and in the presence of an acid catalyst to lower its molecular weight while maintaining high reactivity with the epoxy resin. It is possible to produce modified phenolic resins having a low viscosity which cannot be obtained by conventional molecular weight reduction reactions, and that molding materials formed by the combination of such modified phenolic resins and epoxy resins have low water absorption. Found. The present invention has thus been completed.
The present invention seeks to overcome the above mentioned problems in the prior art. An object of the present invention is a highly reactive low viscosity modified phenol that can provide molding materials that are highly reactive with epoxy resins, have particularly low resin melt viscosities, and which, when combined with epoxy resins, have good moldability and low water absorption. It is to provide a method for producing a resin.
Another object of the present invention is a highly reactive modification, which is substantially free of acid and thus not only has a marked improvement in the reaction with the low melt viscosity and epoxy resin, but also is suitable for the production of modified phenolic resins which do not exhibit corrosive action. It is to provide a method for producing a phenol resin.
High reactivity, low viscosity modified phenolic resins and epoxy resins having a resin melt viscosity of 0.2 to 4.5 poise at 150 ° C., which can be achieved by the process of the present invention, with excellent moldability and low water absorption It is another object of the present invention to provide a molding material which can provide a molded article having, in particular, an electrical and electronic component and a material for a semiconductor sealant.
A process for producing a highly reactive low viscosity modified phenolic resin according to the present invention comprises the steps of preparing a modified phenolic resin by polycondensing petroleum heavy oil or pitch, formaldehyde polymer and phenol in the presence of an acid catalyst; Molecular weight of the modified phenol resin produced by reacting the resulting modified phenolic resin with phenol in the substantial absence of formaldehyde as crosslinking agent in the presence of an acid catalyst at a temperature higher than 120 ° C. and not higher than 200 ° C., preferably 140 ° C. to 180 ° C. The step of lowering.
Examples of phenols which are advantageously used in the process of the invention include hydroxybenzene compounds and hydroxynaphthalene compounds. In particular, the resulting highly reactive low viscosity modified phenolic resins have a particularly low resin melt viscosity when the hydroxybenzene compound is used as the phenol in the molecular weight reduction step. On the other hand, the heat resistance and the resistance to water absorption of the resulting highly reactive low viscosity modified phenolic resin are particularly improved when the hydroxynaphthalene compound is used as the phenol in the molecular weight reduction step.
In the method for producing a highly reactive low viscosity modified phenolic resin according to the present invention, in the polycondensation step, formaldehyde polymer and petroleum heavy oil or petroleum heavy oil in a molar ratio of 1: 1 to 15: 1 The mixture containing the pitch and formaldehyde polymer is heated under stirring in the presence of an acid catalyst and the phenol is gradually added to the mixture while heating under stirring until the molar ratio of phenol and petroleum oil or pitch is between 0.3: 1 and 5: 1. It is preferred to carry out polycondensation of these starting materials by addition.
In the present invention, the modified phenol resin prepared in the polycondensation step is used to extract and remove not only formaldehyde polymers as crosslinking agents but also solvent-soluble components containing unreacted components and / or catalyst residues, each of (i) A solvent containing at least one compound selected from the group consisting of aliphatic and cycloaliphatic hydrocarbons having up to 10 carbon atoms and / or (ii) an extraction solvent capable of dissolving the acid catalyst used in the polycondensation with a solubility of 0.1 or less And by treating with most modified phenolic resins, the resulting modified phenolic resins are purified prior to entering the molecular weight lowering step. Therefore, entering into the molecular weight lowering step together with the acid catalyst residue and the formaldehyde polymer used in the polycondensation step is effectively suppressed.
The molding materials based on the modified phenolic resins according to the invention according to the above process have (A) a resin melt viscosity of 0.2 to 4.5 poise, in particular 0.2 to 3.0 poise or 1.0 to 4.5 poise at 150 ° C. High reactivity low viscosity modified phenolic resins and (B) epoxy resins obtainable. Modified phenolic resins may also include (C) curing agents and / or curing accelerators, and (D) inorganic fillers in addition to the resin components (A) and (B).
The molding material based on the modified phenolic resin according to the present invention preferably contains a highly reactive low viscosity modified phenolic resin (A) and an epoxy resin (B) in a weight ratio of 10:90 to 90:10.
The material for electric and electronic parts according to the present invention is characterized by being produced by molding the molding material based on a highly reactive low viscosity modified phenolic resin.
The semiconductor sealant according to the present invention comprises the molding material based on the highly reactive low viscosity modified phenolic resin.
The invention will be explained in more detail below.
In the method for producing a highly reactive low viscosity modified phenolic resin according to the present invention, the modified phenolic resin obtained in a specific polycondensation step has a molecular weight in particular in a molecular weight lowering step performed under specific conditions at a higher temperature than a conventional method. This lowers to produce a highly reactive low viscosity modified phenolic resin.
In the polycondensation step of the process of the invention, in particular petroleum heavy oil or pitch, formaldehyde polymer and phenol are polycondensed in the presence of an acid catalyst.
Petroleum heavy oil or pitch used as a raw material in the polycondensation reaction may be obtained by distillation residues of crude oil, hydrocracking residues of naphtha or LPG, catalytic cracking residues, thermal cracking residues and vacuum distillates of these residues, and solvent extraction. Extracts and heat treatment products. Preference is given to using petroleum heavy oil or pitch having the appropriate fraction of aromatic carbon (fa) and the appropriate hydrogen ratio (Ha) of the aromatic ring.
For example, petroleum heavy oil or pitch preferably has a fa value in the range of 0.40 to 0.95, especially 0.5 to 0.8, and a Ha value of 20 to 80%, in particular 25 to 60%.
The aromatic hydrocarbon fraction (fa) and the hydrogen ratio (Ha) of the aromatic ring are given by the following formulas from the data obtained by 13C-NMR and 1H-NMR measurements of petroleum heavy oil or pitch, respectively.
Number of aromatic carbon atoms in oil or pitch
fa value = -----------------------
Number of all carbon atoms in oil or pitch
Number of hydrogen atoms in aromatic rings in oil or pitch
Ha value = -----------------------
All hydrogen atoms in oil or pitch
When the value of fa of petroleum heavy oil or pitch is less than 0.4 as a raw material, the aromatic content is low, and the effect of improvement such as heat and oxidation resistance of the produced phenol resin is likely to be less.
On the other hand, when petroleum heavy oil or pitch has a fa value greater than 0.95, the reactivity of the hydrogen atoms of the aromatic ring having formaldehyde tends to be disadvantageously low.
When the Ha value of petroleum heavy oil or pitch as a raw material is lower than 20%, the amount of aromatic ring hydrogen atoms reacting with formaldehyde is small, and the reactivity is lowered, and the effect of improvement of a phenol resin tends to be low.
On the other hand, when petroleum heavy oil or pitch having a Ha value of greater than 80% is used as a raw material, the strength of the modified phenol resin tends to be poor.
In the aromatic hydrocarbon constituting petroleum heavy oil or pitch used in the present invention, the number of condensed rings is not particularly limited. However, it is generally preferred that petroleum heavy oil or pitch consists mainly of polycyclic aromatic hydrocarbons each having 2 to 4 condensed rings. When petroleum heavy oil or pitch each contains condensed polycyclic aromatic hydrocarbons having at least 5 condensed rings in high content, these condensed polycyclic aromatic hydrocarbons generally have a high boiling point, that is, a boiling point higher than 450 ° C. Therefore, the boiling point fluctuation becomes large, and since the boiling point of the aromatic hydrocarbon constituting petroleum heavy oil or pitch cannot be in a narrow range, the quality of the product becomes unstable. On the other hand, when petroleum heavy oil or pitch is mainly composed of monocyclic aromatic hydrocarbons, the reactivity with formaldehyde is so low that the effect of improving the quality of the resulting phenol resin tends to be low.
In the present invention, the formaldehyde polymer used as a raw material in combination with petroleum heavy oil or pitch serves as a crosslinking agent. Specific examples of such formaldehyde polymers include linear polymers such as paraformaldehyde and polyoxymethylene (particularly oligomers), and cyclic polymers such as trioxane.
In the polycondensation step of the method of the present invention, the petroleum heavy oil or pitch is a ratio of the number of molecules calculated from the formaldehyde polymer, the number of molecules in the formaldehyde of the formaldehyde polymer and the average molecular weight of the petroleum heavy oil or the pitch is usually 1 to 15, preferably Is mixed 2 to 12, more preferably 3 to 11.
When the mixing ratio of formaldehyde polymer and petroleum heavy oil or pitch is lower than 1, the strength of the molding cured from the resulting modified phenolic resin is disadvantageously low. On the other hand, when the mixing ratio is greater than 15, the obtained cured molding properties and yields no longer change, so it is useless to use formaldehyde polymer at a ratio greater than 15. Excessive use of formaldehyde polymer has the potential to hinder the molecular weight reduction of the modified phenolic resin in the following molecular weight reduction step.
Specific examples of phenols used as raw materials in the polycondensation step include hydroxybenzene compounds such as phenol, cresol, xylenol, resorcinol, catechol, hydroquinone, bisphenol A and bisphenol F; And hydroxynaphthalene compounds such as monohydroxynaphthalene compounds such as alpha-naphthol and beta-naphthol, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene , 2,3-dihydroxynaphthalene, 3,6-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 2,6- Dihydroxynaphthalene, and dihydroxynaphthalene compounds such as 2,7-dihydroxynaphthalene, and 2-methyl-1-naphthol, 4-phenyl-1-naphthol, 1-bromo-2-naphthol and 6- Monohydroxynaphthalene and dihydroxynaphthalene compounds mentioned above having substituents containing alkyl groups, aromatic groups, or halogen atoms such as bromo-2-naphthol are included.
The phenol is added to the feed mixture until the ratio of the number of moles of phenol and the number of molecules calculated from the average molecular weight of petroleum heavy oil or pitch is usually 0.3 to 5, preferably 0.5 to 3.
If the ratio is lower than 0.3, since the reactivity between petroleum heavy oil or pitch and formaldehyde is lower than the reactivity between phenol and formaldehyde, satisfactory crosslinking density cannot be reached and the strength of the cured molding is conventional phenolic resin. Can be worse compared to In particular, cured moldings are disadvantageously prone to exhibit low impact resistance and easily brittle properties. On the other hand, when phenol is added at a ratio higher than 5, the deformation effect of the phenol resin in quality improvement is reduced.
In the polycondensation step of the process of the invention, the acid catalyst is used for the polycondensation of petroleum heavy oil or pitch, formaldehyde polymer and phenol. Bronsted or Lewis acids can be used as such acid catalysts. Bronsted acid is preferred. Examples of Bronsted acids include toluenesulfonic acid, xylenesulfonic acid, hydrochloric acid, sulfuric acid and formic acid. Of these, p-toluenesulfonic acid and hydrochloric acid are particularly preferable.
The acid catalyst is preferably used in an amount of 0.1 to 30% by weight, more preferably 1 to 20% by weight based on the total weight of petroleum heavy oil or pitch, formaldehyde polymer and phenol.
When the amount of acid catalyst is too small, the reaction time is disadvantageously long, and satisfactory reaction cannot be obtained unless the reaction temperature is increased. On the other hand, when the amount of acid catalyst is larger than this, the reaction rate is no longer increased in proportion to the amount, so it is likely to be disadvantageous in terms of cost.
In the polycondensation step in which the raw material and the acid catalyst are employed, for example, gradually adding phenol to the ratio containing the petroleum heavy oil or the pitch and formaldehyde polymer in the above ratio while heating under stirring in the presence of the acid catalyst. By polycondensation.
Phenol is preferably added gradually by dropwise addition or by other methods at a rate of 0.05 to 5% by weight relative to the total weight of the reaction mixture, more preferably 0.1 to 2% by weight.
When the addition rate is lower than 0.05% by weight, the time required for the addition is too long to increase the cost. On the other hand, when the addition rate exceeds 5% by weight / minute, the added phenol reacts with the free formaldehyde too quickly to form a homogeneous mixture or condensate.
The reason for this heterogeneity is that the reactivity of formaldehyde with phenol is much greater than that of petroleum oil or pitch, so that if the initial concentration of phenol is not kept low, formaldehyde is formed by phenol or a condensation reaction. Selective reaction with is carried out to hardly dissolve in the reaction system.
In the polycondensation reaction of the method of the present invention, the time for adding phenol to petroleum heavy oil or a mixture of pitch and formaldehyde polymer is not particularly limited. The gradual addition of phenols, however, can be achieved from when the expected conversion of formaldehyde from the amount of free formaldehyde remaining is substantially 0%, from when the conversion of formaldehyde is 70% or lower, in particular 50% or lower. It is preferably carried out during the period of.
When the formaldehyde conversion exceeds 70%, the amount of formaldehyde capable of reacting with the added phenol is low, so that the quality of the resulting modified phenolic resin is likely to be degraded.
In the heating and stirring of petroleum heavy oil or pitch and formaldehyde polymer mixtures in the presence of an acid catalyst, the reaction temperature and time depend on the raw material composition, the rate of addition of phenol and the properties of the resin obtained. Naturally, reaction temperature and reaction time are mutually influential factors. The heating under stirring of the raw material mixture in the presence of an acid catalyst is preferably carried out at 50 to 160 ° C., especially at 60 to 120 ° C. for 0.5 to 10 hours, in particular 1 to 5 hours.
When the preparation of the modified phenolic resin of the present invention is carried out by a batch process, the reaction can be carried out in one step and this is advantageous. In addition, when the preparation is carried out by a continuous process, it is not necessary to use a mechanism employed in the production of a conventional modified phenolic resin, in which a plurality of reaction materials must be continuously mixed at predetermined ratios, respectively, and thus difficult control is inevitable. Instead, continuous preparation can be carried out by placing the complete mixed reaction vessel in between or at the time of adding phenol therein at a predetermined rate. This lowers the instrument cost relatively and ensures good workability.
In the present invention, the polycondensation reaction of petroleum heavy oil or pitch, formaldehyde polymer and phenol can be carried out in the absence of solvent. However, an appropriate solvent may be used to lower the viscosity of the reaction mixture (reaction system) to ensure a uniform reaction.
Examples of such solvents include aromatic hydrocarbons such as benzene, toluene and xylene; Halogenated aromatic hydrocarbons such as chlorobenzene; Nitro-substituted aromatic hydrocarbons such as nitrobenzene; Nitro-substituted aliphatic hydrocarbons such as nitroethane and nitropropane; And halogenated aliphatic hydrocarbons such as perchloroethylene, trichloroethylene and carbon tetrachloride.
In the method for producing a highly reactive low viscosity modified phenolic resin according to the present invention, the modified phenolic resin obtained by the polycondensation reaction is used in the following molecular weight lowering step. In the lower molecular weight step, the modified phenolic resin has a reduced molecular weight by reacting with phenol under certain thermal conditions in the absence of formaldehyde polymer and other crosslinking agents in the presence of an acid catalyst. In this step of lowering the molecular weight, the different reaction conditions and the amount of the raw materials and the catalyst are adjusted so that the modified phenol resin has the desired viscosity in the reaction with the phenol.
In addition to the modified phenolic resins, acid catalysts, unreacted materials, low molecular weight components, solvents, and the like may remain in the reaction mixture obtained by the polycondensation reaction, which are raw materials and catalysts included in the reaction conditions and reactions during the molecular weight reduction step. Affects the amount of. For example, when the modified phenolic resin used in the molecular weight reduction step contains an acid catalyst, the amount of acid catalyst added to the step is affected. Moreover, especially when the modified phenolic resin contains a large amount of formaldehyde polymer as a crosslinking agent as an unreacted component, polycondensation of the modified phenolic resin, formaldehyde polymer and phenolic resin is preceded to reduce the molecular weight of the modified phenolic resin. Disturb.
Therefore, the modified phenolic resin for use in the molecular weight lowering step is suppressed from the viewpoint of appropriately adjusting the reaction conditions so as to perform the efficient lowering of the molecular weight of the modified phenolic resin through the reaction with phenol during the molecular weight lowering step. It is preferred that it does not contain an acid catalyst, an unreacted substance or a reaction solvent, and in particular does not contain an acid catalyst and a formaldehyde polymer.
The modified phenol resin is to adjust the amount of the raw material, the acid catalyst and the reaction solvent, or the polycondensation reaction conditions employed in the polycondensation reaction to prevent excessive unreacted components, acid catalyst and the reaction solvent from remaining in the reaction mixture, Or by appropriately purifying the reaction mixture obtained in the polycondensation reaction to remove unreacted components, low molecular weight components, acid catalysts and reaction solvents.
The process for purifying a crude modified phenolic resin containing a reaction mixture, i.e. an acid catalyst, an unreacted component and a reaction solvent, for example, (i) treating the reaction mixture with a specific solvent to cause precipitation to cause unreacted reaction. Purification treatment to remove solvent-dissolving components containing components, and (ii) Purification treatment to dissolve the reaction mixture in a specific solvent to extract any catalyst residues.
In the refining treatment (i), the components contained as raw materials in petroleum heavy oil or pitch, which have low reactivity and remain in the reaction mixture in an unreacted or incomplete reaction state, and are particularly selective for the polycondensation reaction with formaldehyde polymer as a crosslinking agent. The solvent used is removed.
This purification treatment (i) is carried out at any time after preparation of the reaction mixture obtained in the polycondensation step, in a solvent containing at least one compound selected from the group consisting of aliphatic and alicyclic hydrocarbons having up to 10 carbon atoms, respectively to precipitate the main component of the resin. By removing the components dissolved in the solvent, that is, unreacted and remaining components due to incomplete reaction and the solvent used in the polycondensation reaction. Aliphatic and cycloaliphatic hydrocarbons such as pentane, hexane, heptane and cyclohexane are used as such purification hydrocarbon solvents. n-hexane is particularly preferred.
In the purification process (ii), formaldehyde polymer is removed as the acid catalyst and crosslinking agent remaining in the reaction mixture, thereby producing a modified phenolic resin that is substantially free of acid and crosslinking agent. When the catalyst residue remains in the modified phenolic resin, the amount of acid catalyst added in the molecular weight lowering step must be determined in consideration of the acid catalyst residue, making it difficult to control the reaction conditions.
The purification process (ii) is carried out by treating the reaction mixture with an extraction solvent which dissolves most modified phenolic resins but the acid catalyst used for the polycondensation of the raw material can be dissolved with a solubility of 0.1 or lower to form a catalyst residue and a crosslinking agent. By extracting and removing the aldehyde polymer.
The extraction solvent is not particularly limited as long as it has the above characteristics, but is preferably selected from aromatic hydrocarbons such as benzene, toluene and xylene. Among them, toluene is particularly preferred.
In the purification process (ii) of this invention, temperature and other conditions are not specifically limited as long as the said characteristic of an extraction solvent is fully shown. The reaction mixture may be placed in an extraction solvent or a solvent may be added to the reaction mixture. Thus, purification treatment (ii) can be performed easily and simply.
The modified phenolic resin, substantially free of acid, obtained by the purification treatment (ii) is usually in the form of a varnish with the resin dissolved in a solvent. The modified phenolic resin in varnish form can be used as is for the next molecular weight reduction step if it is a final purification product. Alternatively, the modified phenolic resin, such as n-hexane, may be placed in an insoluble solvent to cause precipitation, thereby obtaining a modified phenolic resin powder before use.
Most of the catalyst residues remaining in the reaction mixture are removed by purification process (ii). However, if desired, the modified phenolic resin obtained by purification treatment (ii) may be neutralized and / or washed with water to further remove catalyst residues such as acids in the resin.
The neutralization treatment can be carried out by adding a basic substance to the modified phenolic resin obtained by the purification treatment (ii). Examples of such basic materials include alkali and alkaline earth metal hydroxides such as sodium hydroxide, potassium, calcium and magnesium, ammonia, diethylenetriamine, triethylenetetramine, aniline and phenylenediamine.
In the purification steps that can be employed in the process of the invention, the purification treatments (i) and (ii) can be carried out in any order. However, since the modified phenolic resin obtained by the purification step (ii) is in the form of a varnish, from the viewpoint of processing in the step of lowering the molecular weight, the varnish is placed in a solvent in which the modified phenolic resin such as n-hexane is insoluble, for example. It is desirable to recrystallize and harvest the modified phenolic resin in the powder.
Since the varnish-modified phenolic resin is used as it is in the next molecular weight lowering step, it is preferable in terms of production cost that the purification treatment (ii) is performed after the purification treatment (i).
In the process for producing a highly reactive low viscosity modified phenolic resin according to the invention, the modified phenolic resin, i.e., the reaction product of the polycondensation step, is, as it is or is purified, a temperature higher than 120 ℃ and not higher than 200 ℃ Preferably, the phenolic resin modified by reacting with phenol in the absence of formaldehyde polymer and other crosslinking agents and in the presence of an acid catalyst at 140 ° C to 180 ° C has a lower molecular weight. Since the thermal resistance (Tg) of the molding material using the produced resin tends to deteriorate, a reaction temperature higher than 200 ° C is not preferable.
In the molecular weight reduction reaction carried out in this temperature range, the modified phenolic resin undergoes decomposition and separation of its intramolecular methylene bonds and the phenol is bound to the separation end to increase the phenolic content of the modified phenolic resin.
The reaction conditions other than the reaction temperature used in the molecular weight lowering step and the content, form and combination of the raw material and the acid catalyst are not limited as long as it is possible to lower the viscosity of the modified phenol resin and improve its reactivity with the epoxy resin.
Examples of the phenol used in the molecular weight lowering step include the hydroxybenzene and hydroxynaphthalene compounds described in the polycondensation step.
In the step of lowering the molecular weight of the method of the present invention, the phenol per 100 parts by weight of the modified phenol resin is usually at least 100 parts by weight, 100 to 300 parts by weight, more preferably 100 to 250 parts by weight, still more preferably 100 to 200 parts by weight. Is introduced in amounts. When the amount of phenol is at least 100 parts by weight, the molecular weight lowering reaction proceeds to a degree sufficient to obtain a desired effect. However, the use of excessive phenol causes excessive amounts of unreacted phenol to remain, thus resulting in increased post-treatment costs.
The acid catalyst is preferably added in an amount of 0.1 to 15 parts by weight, more preferably 0.2 to 10 parts by weight, per 100 parts by weight of the modified phenol resin.
In the lower molecular weight step, the reaction can be carried out in the presence or absence of the reaction solvent. The reaction solvent is not particularly limited as long as it does not inhibit the above molecular weight lowering reaction. For example, solvents usable for polycondensation and alcohols such as methyl alcohol, ethyl alcohol, butyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, nonyl alcohol and decyl alcohol can be used in the molecular weight reduction step. The solvent is preferably used in an amount of 0-300 parts by weight based on 100 parts by weight of the modified phenol resin.
The reaction temperature is not lower than the specific reaction temperature and is usually 120 to 200 ° C, preferably 140 to 180 ° C. The reaction time is not particularly limited and may be, for example, 15 minutes to 2.0 hours, with 30 minutes to 2.0 hours being preferred.
The highly reactive low viscosity modified phenolic resin obtained as a result of the molecular weight lowering step is lower than the modified phenolic resin obtained by the polycondensation step in (a) number average molecular weight and (b) resin melt viscosity.
According to the method of the present invention, there is provided a highly reactive modified phenolic resin having a number average molecular weight of 350 to 650 and a resin melt viscosity of 0.2 to 4.5 poise measured at 150 ° C.
More specifically, the melt viscosity of the highly reactive low viscosity modified phenolic resin can be significantly lowered when the hydroxybenzene compound is used as the phenol in the molecular weight lowering step. In this case, there is provided a highly reactive low viscosity modified phenolic resin having a number average molecular weight of 350 to 450, in particular 350 to 400, and a resin melt viscosity measured at 150 ° C. of 0.2 to 3.0 poise, especially 0.2 to 2.0 poise. do.
When the hydroxynaphthalene compound is used as the phenol in the molecular weight lowering step, the resulting highly reactive low viscosity modified phenolic resin is likely to have a higher melt viscosity than that obtained with the hydroxybenzene compound. However, thermal stability and resistance to water absorption are improved than when using a hydroxybenzene compound. In this case, the resin has a high number of molecular weights of 350 to 650, in particular 350 to 600, and a resin melt viscosity of 1.0 to 4.5 poises, especially 1.0 to 4.0 poises, measured at 150 ° C., having excellent heat resistance and resistance to water absorption. Reactive modified phenolic resins are provided.
Highly reactive low viscosity modified phenolic resins have a low resin melt viscosity, thus good moldability and high reactivity with epoxy resins. Therefore, highly reactive low viscosity modified phenolic resins can provide molding materials with significantly lower moisture absorption as well as mechanical properties including dimensional stability and strength when combined with epoxy resins.
As mentioned above, the inventors have carried out a molecular weight reduction step in Japanese Patent Application Laid-Open No. 7 (1995) -252339, which is performed at a temperature not higher than 120 ° C., resulting in decomposition of acetal bonds and / or methylene ether bonds in the resin molecule. Started.
However, the lower molecular weight step of the present invention is carried out at higher temperatures to allow the production of highly reactive modified phenolic resins with lower viscosities of 0.2 to 4.5 poises, which cannot be achieved by conventional methods. will be. This is because the lower molecular weight step performed at higher temperature causes decomposition and separation in a region or location different from acetal bonds and / or methylene ether bonds, ie decomposition and separation of methylene bonds in modified phenolic resin molecules. will be.
The highly reactive low viscosity modified phenolic resins obtained according to the process of the present invention have been found to exhibit significantly low water absorption when used as molding materials in combination with epoxy resins as follows. Such molding materials are advantageously employed for articles which do not wish to corrode metal parts and degrade numerical stability. In addition, the thermal stability and resistance to water absorption of the molding material are further improved by producing highly reactive low viscosity modified phenolic resins using hydroxynaphthalene compounds in the molecular weight lowering step.
The highly reactive low viscosity modified phenolic resin obtained in this molecular weight reduction step can be used as it is for various purposes. However, there is a possibility of remaining unreacted components and acid catalysts in the resin. Therefore, it is preferable to remove the unreacted component and acid catalyst in a similar manner by using the solvents described in the purification (i) and (ii) of the modified phenol resin or by using another solvent. Examples of the solvent suitably used for the purification of the highly reactive low viscosity modified phenolic resin include toluene; Mixed solvents of toluene with alcohols such as ethyl alcohol and methyl alcohol; And mixed solvents of toluene and ketones such as acetone, tetrahydrofuran, methyl ethyl ketone and methyl isobutyl ketone.
The highly reactive low viscosity modified phenolic resin is preferably washed with an unreacted component such as phenol and an acid catalyst, if necessary, using a mixed solution of distilled water and isopropyl alcohol.
If unreacted phenols remain after these treatments, they can be removed by distillation with water vapor. Unreacted phenol can also be removed by introducing nitrogen with heating instead of steam distillation. These methods may be performed in combination.
The highly reactive low viscosity modified phenolic resins may be preferably desolvated or precipitated with aliphatic or cycloaliphatic hydrocarbons having up to 10 carbon atoms, or mixtures thereof, after removing unreacted components and acid catalysts from them. . Hydrocarbon solvents include the solvents described in tablet (i) for modified phenolic resins. Of these, n-hexane is particularly preferred.
The purification removes the acid catalyst, unreacted substances and reaction solvent remaining in the resin, substantially free of acid, thereby exhibiting no corrosion effect on the metal and improving reactivity with the epoxy resin, thereby improving thermal resistance and dimensional stability. To provide a highly reactive modified phenolic resin having. As used herein, the term substantially free of acid means that the acid or similar material is completely absent or has a very small amount remaining but does not exhibit any significant corrosive action on the metal.
Molding materials based on modified phenolic resins according to the invention are obtained by (A) the process of the invention and have a high reactivity with resin melt viscosity of 0.2 to 4.5 poise, in particular 0.2 to 3.0 poise or 1.0 to 4.5 poise (B) epoxy resins with low viscosity modified phenolic resins. In molding materials based on the modified phenolic resins according to the invention, the highly reactive low viscosity modified phenolic resins (A) are prepared using resins or at least two resins, for example using hydroxybenzene compounds in a molecular weight reduction step. One highly reactive low viscosity modified phenolic resin and a highly reactive low viscosity modified phenolic resin prepared using a hydroxynaphthalene compound in the molecular weight reduction step.
Epoxy resins usually exhibit lower mold shrinkage, better thermal, wear and chemical resistance, and higher electrical insulation. Epoxy resins may optionally be used in combination with curing agents and / or curing accelerators (C).
Various epoxy resins can be used, including, for example, glycidyl ethers, glycidyl esters, glycidyl amines, mixed and cycloaliphatic epoxy resins.
In particular, examples of glycidyl ether (phenol-based) epoxy resins include bisphenol A, bisphenyl, bisphenol F, tetrabromobisphenol A, tetraphenyloletan, phenolic novolak and o-cresol novolak epoxy resins. Included.
Examples of glycidyl ether (alcohol-based) epoxy resins include polypropylene glycol and hydrogenated bisphenol A epoxy resins.
Examples of glycidyl ester epoxy resins include hexahydrophthalic anhydride and dimer acid epoxy resins.
Examples of glycidylamine epoxy resins include diaminodiphenylmethane, isocyanuric acid and hydantophosphate epoxy resins.
Examples of mixed epoxy resins include p-aminophenol and p-oxybenzoic acid epoxy resins. Among the epoxy resins, bisphenol A, biphenyl, glycidylamine and phenolic novolac epoxy resins are preferable. The said epoxy resin can also be used in combination.
Regarding the proportion of the highly reactive modified phenolic resin of the present invention mixed with the epoxy resin, the modified phenolic resin is usually 10/90 to 90/10 (parts by weight), in particular 20/80 to 80/20 ( It is preferable to mix in the ratio of a weight part).
Various conventional curing agents and accelerators used to cure epoxy resins can be employed as curing agents and / or accelerators (C) introduced into molding materials based on modified phenolic resins according to the invention. Examples of such curing agents include cyclic amines, aliphatic amines, polyamides, aromatic polyamines and acid anhydrides.
In particular, examples of suitable cyclic amines include hexamethylenetetramine, examples of suitable aliphatic amines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperamine, Isophoronediamine, bis (4-amino-3-methylcyclohexyl) methane and methanediamine.
Examples of polyamides include condensates of distillate oil derived fatty acids (dimer or trimer acids) and aliphatic polyamines.
Examples of aromatic polyamines include m-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone and m-xylenediamine.
Examples of acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride , Chlorendic anhydride, dodecenylsuccinic anhydride, methyltetrahydrophthalic anhydride and methylendomethylenetetrahydrophthalic anhydride.
Examples of curing accelerators include diazabicycloalkenes and derivatives thereof such as 1,8-diazabicyclo (5,4,0) undecene-7; Tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol; Imidazoles such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; Organic phosphines such as tributylphosphine, methyldiphenylphosphine and triphenylphosphine; Tetra substituted-phosphinium tetra substituted-borate such as tetraphenylphosphinium tetraphenylborate; Tetraphenylborate such as 2-ethyl-4-methylimidazolyl tetraphenylborate and N-methylmorpholinyl tetraphenylborate; Lewis acids such as boron trifluoride / amine complexes; Lewis bases such as dicyanodiamide and adipodihydrazide; And polymer captanes and polysulfides. The curing agent and curing accelerator may be used alone or in combination.
Molding materials based on (A) highly reactive low viscosity modified phenolic resins and (B) epoxy resins exhibit low water absorption. This water absorption is lower than conventional high reactive modified phenolic resins. Such molding materials can be advantageously used in articles such as semiconductor sealants and electrical and electronic components that do not desire corrosion of metal parts and degradation of dimensional stability.
Molding materials based on the modified phenolic resins according to the present invention comprise inorganic fillers (D) in addition to highly reactive modified phenolic resins (A), epoxy resins (B) and optionally added curing agents and / or curing accelerators (C). It may include.
The strength and dimensional stability of the obtained molding can be further improved by adding an inorganic filler (D) to the molding material.
Various conventional inorganic fillers used as inorganic fillers or reinforcing agents for plastic materials can be used as the inorganic filler (D) of the present invention. Examples of such inorganic fillers include reinforcing fibers such as glass, carbon, phospho and boron fibers; Hydrated metal oxides such as aluminum hydroxide and magnesium; Metal carbonates such as magnesium carbonate and calcium; Metal borate such as magnesium borate; And inorganic reinforcing agents such as silica, mica and fused silica.
The amount of the inorganic filler (D) to be added is not particularly limited. However, it is preferred to add 20 to 800 parts by weight, in particular 50 to 600 parts by weight, of inorganic filler per 100 parts by weight of the highly reactive modified phenolic resin.
In addition, if desired, molding materials based on modified phenolic resins according to the invention may further comprise additives including internal mold release agents such as silicones and waxes, coupling agents, flame retardants, light stabilizers, antioxidants, pigments and extenders.
Molding materials based on the modified phenolic resins according to the invention described above can be used to modify the highly reactive low viscosity modified phenolic resins (A) and epoxy resins (B), optionally with curing agents and / or curing accelerators (C), inorganic fillers (D). ) And is mixed with various additives and used in various moldings.
In the present invention, the order in which the highly reactive low viscosity modified phenol resin (A), epoxy resin (B) and optionally added component (C) are mixed is not particularly limited. For example, a powdered compound is obtained by first mixing a highly reactive modified phenolic resin with an epoxy resin and then adding a curing agent (hardening accelerator) to the mixture, followed by a coalescing, and finally if desired Inorganic fillers and additives are then added.
In particular, the compounds may be prepared according to the following working sequence:
(1) mixing highly reactive low viscosity modified phenolic resin with epoxy mortar at room temperature with automatic mortar;
(2) adding and mixing other additives such as hardeners and waxes to the resulting mixture;
(3) adding an inorganic filler to the resulting mixture and mixing; And
(4) Further mixing is carried out with a roll heated at 80 to 90 ° C. for 3 to 10 minutes, cooled to room temperature and ground to obtain the desired compound.
In this working sequence, the addition of the inorganic fillers and other additives can be carried out separately after mixing the highly reactive low viscosity modified phenolic resin with the epoxy resin. This is not essential and the addition of the additive can be carried out at any time.
Molding materials based on highly reactive modified phenolic resins according to the present invention can be molded by a variety of conventional molding means, including, for example, compression, injection, injection, transfer and mold molding techniques.
In particular, when the molding material based on the modified phenolic resin according to the present invention is formed into a molding by the transition molding technique, the molding temperature is in the range of 120 to 200 ℃, the injection pressure is 5 to 300 kgf / cm 2, in particular 20 Molding conditions are preferably selected in the range from to 300 kgf / cm 2, the clamp pressure in the range from 50 to 250 kgf / cm and the molding time in the range from 1 to 10 minutes.
The resulting molding is preferably subjected to a post treatment comprising heating at 150 to 300 ° C. for 0.5 to 24 hours.
The aftertreatment further improves the thermal resistance of the molding.
Moldings obtained from molding materials based on modified phenolic resins according to the invention are excellent in electrical insulation and mechanical strength as well as resistance to moisture and high temperatures, for example, have the following properties:
Flexural Strength Room Temperature 8-22 kgf / mm2 150 ° C 3-14 kgf / mm2
Flexural Temperature 400-2000 kgf / mm2 150 ℃ 40-1500 kgf / mm2
Glass transition temperature (℃) 120-260 ℃
Heat deflection temperature 190-300 ℃ or above
Insulation Resistance Normal 1.8 x 1014-5.0 x 1014 Ohm After boiling 3.0 x 1013-2.0 x 1014 Ohm
Molding materials based on modified phenolic resins according to the invention have improved reactivity of the modified phenolic resins and epoxy resins such that molded articles made from these have improved mechanical properties, including numerical stability and thermal stability. The highly reactive low viscosity modified phenolic resins used have a low viscosity and thus good moldability and significantly low water absorption. In the molding material based on the modified phenolic resin according to the present invention, the modified phenolic resin which is substantially free of acid is used, thereby reducing or eliminating the possibility of the corrosive action on the metal. By adding an inorganic filler, it is possible to further improve the mechanical strength and electrical insulation properties of the resulting molded article.
Accordingly, molded articles made of materials based on modified phenolic resins are materials of electrical and electronic components and components such as printed substrates, insulating materials and sealants that do not want to absorb moisture and impose stringent demands on dimensional stability, heat resistance and formability. Useful as It is also particularly useful as a semiconductor sealant which requires improvement of heat resistance and dimensional stability in order to cope with stress breakdown and water absorption due to high integration.
Example
The invention will be further illustrated with reference to the following examples, which should not be construed as limiting the scope of the invention.
In the following examples, parts are parts by weight unless otherwise specified. The characteristics of the raw material oil as a raw material for polycondensation are shown in Table 1. The crude oil is obtained by distilling the bottom oil produced by liquid catalyst cracking (FCC) of vacuum gas oil.
TABLE 1
Average molecular weight271 Boiling point (℃)241.5-466.5 Aromatic hydrocarbon ratio (fa)0.65 Hydrogen ratio of aromatic ring (Ha) (%)28
Note: (1) Average molecular weight: value measured by vapor pressure osmosis meter (2) Boiling point: ℃ value measured according to ASTM D-1160 at atmospheric pressure
In the following examples, the number average molecular weight, reactivity with the epoxy resin (measured based on gelation time; shorter gelation time means greater reactivity), and resin melt viscosity were measured using the following instrument or measuring method .
Number average molecular weight
Measured using HLC-8020 GPC instrument (column; TSK gel 3000 HHR + TSK gel 2000 HHR, calculated using polystyrene as standard: manufactured by TOSOH CO., Ltd)
Viscosity measurement
Measured by ICI cone plate viscosity meter manufactured by ICI.
Gel time
Measured at 170 ° C in accordance with Japanese Industrial Standard (JIS) K 6910.
Glass transition temperature
Method: Dynamic Viscoelasticity
Apparatus: DVE RHEOSPECTOLER DVE-4V made by Rheorogy Co
Load method: tensile method
Frequency: 10 Hz
Temperature rise rate: 5 ℃ / min
Dynamic measuring displacement: ± 5 + 10-4 cm
Specimen: 4 mm wide, 1 mm thick, and 30 mm span
OH equivalent
Measured according to the acetyl chloride method
Example 1
(Condensation step)
334 g of raw material oil having the properties shown in Table 1, 370 g of paraformaldehyde, 137 g of p-toluenesulfonic acid monohydrate and 678.5 g of p-xylene were put into a glass reactor and the temperature was raised to 95 ° C while stirring. The mixture was left at 95 ° C. for 1 hour. 209 g of phenol were then added dropwise to the mixture at a rate of 1.3 g / min. After completion of the dropwise addition of the phenol, the reaction was continued by stirring for an additional 15 minutes. Next, the reaction mixture was precipitated according to 3,300 g of n-hexane. The precipitate was then filtered to remove unreacted components and reaction solvent. The resulting precipitate was washed with 1,600 g of n-hexane and dried in vacuo to yield a crude modified phenolic resin containing acid.
The modified phenolic resin was dissolved in 10 times the weight of toluene. An insoluble substance mainly composed of p-toluenesulfonic acid monohydrate was filtered out. The toluene solution of the resulting resin was concentrated to a 50% by weight resin concentrate to obtain a modified phenolic resin in varnish form. In addition, a small amount of triethylenetetramine was added thereto and neutralized. The resulting phenolic modified phenolic resin was precipitated according to 3.3-fold weight of n-hexane. The precipitated resin was filtered and vacuum dried to give 580 g of modified phenolic resin in powder.
(Molecular weight lowering step)
100 g of modified phenolic resin, 200 g of phenol, and 5 g of p-toluenesulfonic acid of the resulting powder were placed in a 1 liter glass reactor. The mixture was heated to 120 ° C. with stirring at 250-350 rpm. The mixture was allowed to react at 120 ° C. for 90 minutes to give a reaction product. The resulting reaction product was dissolved according to 400 ml of a mixed solution of toluene / methyl isobutyl ketone (mixing ratio 7/3). The resulting resin mixture was washed with distilled water to remove acid, and then the mixed solvent was removed using an evaporator to obtain 182 g of a highly reactive low viscosity modified phenolic resin.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2 together with the reaction conditions in the molecular weight lowering step including the reaction temperature.
Example 2-6
Example 1 was repeated except that the reaction conditions in the molecular weight reduction step were changed as shown in Table 2, to obtain a highly reactive low viscosity modified phenolic resin in the yield shown in Table 2.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2.
Example 7
100 g of the modified phenolic resin, 200 g of o-cresol, and 5 g of p-toluenesulfonic acid of the powder obtained in the polycondensation step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to a temperature of 140 ° C. with stirring at 250-350 rpm. The mixture was allowed to react at 140 ° C. for 90 minutes to give a reaction product.
The resulting reaction product was dissolved according to 400 ml of a mixed solution of toluene / methyl isobutyl ketone (mixing ratio 7/3). The resulting resin mixture was washed with distilled water to remove acid, and then the mixed solvent was removed using an evaporator to obtain 192 g of highly reactive low viscosity modified phenolic resin.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2.
Example 8
Example 7 was repeated except that the reaction conditions in the molecular weight reduction step were changed as shown in Table 2, to obtain a highly reactive low viscosity modified phenolic resin in the yield shown in Table 2.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2.
Example 9
Example 7 was repeated except that m-cresol was used instead of o-cresol as the hydroxybenzene compound in the molecular weight reduction step, yielding a highly reactive low viscosity modified phenolic resin based on m-cresol shown in Table 2 Got it.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2.
Example 10
200 g of modified phenolic resin, 200 g of phenol, and 5 g of p-toluenesulfonic acid in varnish form (resin concentration 50%) obtained in the polycondensation step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to a temperature of 160 ° C. while stirring at a rate of 250-350 rpm. The mixture was allowed to react at 160 ° C. for 90 minutes to give a reaction product.
The resulting reaction product was dissolved according to 400 ml of a mixed solution of toluene / methyl isobutyl ketone (mixing ratio 7/3). The resulting resin mixture was washed with distilled water to remove acid, and then the mixed solvent was removed using an evaporator to obtain 200 g of a highly reactive low viscosity modified phenolic resin.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2.
Comparative Example 1
100 g of the modified phenolic resin, 200 g of phenol, and 5 g of p-toluenesulfonic acid of the powder obtained in the polycondensation step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to a temperature of 95 ° C. with stirring at 250-350 rpm. The mixture was allowed to react at 95 ° C. for 90 minutes to give a reaction product.
The resulting reaction product was dissolved according to 400 ml of a mixed solution of toluene / methyl isobutyl ketone (mixing ratio 7/3). The resulting resin mixture was washed with distilled water to remove acid, and then the mixed solvent was removed using an evaporator to obtain 175 g of highly reactive low viscosity modified phenolic resin.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 2.
Example 11
9.17 parts by weight of the highly reactive low viscosity modified phenolic resin obtained in Example 3 and 14.89 parts by weight of biphenyl epoxy resin (trade name; YX4000H, manufactured by Yuka Shell Epoxy Co., Ltd.) and stirred using an automatic mortar at room temperature It was. Next, 0.49 parts by weight of triphenylphosphine (TPP) was added to the mixture as a curing accelerator to obtain a resin mixture containing a curing accelerator-containing resin mixture.
The gelation time of the curing accelerator-containing resin mixture is measured and shown in Table 3.
0.25 parts by weight of carnauba wax was added and mixed to the resulting curing accelerator-containing resin mixture. Next, 0.20 parts by weight of carbon black and 75 parts by weight of fused silica (trade name: CRS1102-GT200T, manufactured by Tatsumori Co., Ltd.) as inorganic fillers are added to and mixed with the mixture. The resulting mixture was mixed for an additional 3-10 minutes using a roll heated to 80-90 ° C. and then cooled to room temperature. Next, the resulting mixture was ground to obtain a compound. The composition of this compound is shown in Table 3.
The resulting compound was subjected to transition molding carried out at 175 ° C. for 90 seconds and post-treated at 175 ° C. for 6 hours to obtain a molded article.
Shore hardness, glass transition temperature, flexural properties and water absorption were measured for the molded article produced immediately after molding. The results are shown in Table 3.
Example 12-17
Replace the highly reactive low viscosity modified phenolic resin obtained in Example 3 with the highly reactive low viscosity modified phenolic resin obtained in Examples 4-10, respectively, and modify the modified phenolic resin and epoxy resin in the ratios shown in Table 3. Except for mixing, Example 11 was repeated to obtain a curing accelerator-containing resin mixture, a compound, and a molded article.
The resulting molded article was measured for the gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and water absorbency immediately after molding). The results are shown in Table 3.
Comparative Example 2
Example 11 was repeated except that the highly reactive low viscosity modified phenolic resin obtained in Example 3 was replaced with the modified phenolic resin obtained in Comparative Example 1 to obtain a curing accelerator-containing resin mixture, a compound and a molded article. .
The resulting molded article was measured for the gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and water absorbency immediately after molding). The results are shown in Table 3.
Example 18
9.39 parts by weight of the highly reactive low viscosity modified phenol resin obtained in Example 1 and 14.91 parts by weight of o-cresol novolak epoxy resin (trade name; EOCN1020, manufactured by Nippon Kayaku Kabushiki Kaisha) were mixed and stirred using an automatic mortar at room temperature. . Next, 0.25 parts by weight of triphenylphosphine (TPP) was added to the mixture as a curing accelerator to obtain a resin mixture containing a curing accelerator-containing resin mixture.
The gelation time of the curing accelerator-containing resin mixture is measured and shown in Table 4.
0.25 parts by weight of carnauba wax was added and mixed to the resulting curing accelerator-containing resin mixture. Next, 0.20 parts by weight of carbon black and 75 parts by weight of fused silica (trade name: CRS1102-GT200T, manufactured by Tatsumoro Co., Ltd.) as inorganic fillers are added to and mixed with the mixture. The resulting mixture was mixed for an additional 3-10 minutes using a roll heated to 80-90 ° C. and then cooled to room temperature. Next, the resulting mixture was ground to obtain a compound. The composition of this compound is shown in Table 4.
The resulting compound was subjected to transition molding carried out at 175 ° C. for 90 seconds and post-treated at 175 ° C. for 6 hours to obtain a molded article.
Shore hardness, glass transition temperature, flexural properties and water absorption were measured for the molded article produced immediately after molding. The results are shown in Table 4.
Example 19-23
Replace the highly reactive low viscosity modified phenolic resin obtained in Example 1 with the highly reactive low viscosity modified phenolic resin obtained in Examples 2-10, respectively, and modify the modified phenolic resin and epoxy resin in the ratios shown in Table 4. Except for mixing, Example 18 was repeated to obtain a curing accelerator-containing resin mixture, a compound, and a molded article.
The resulting molded article was measured for the gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and water absorbency immediately after molding). The results are shown in Table 4.
Comparative Example 3
Example 18 was repeated except that the highly reactive low viscosity modified phenolic resin obtained in Example 1 was replaced with the modified phenolic resin obtained in Comparative Example 1 to obtain a curing accelerator-containing resin mixture, a compound and a molded article. .
The gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and moisture absorbency immediately after molding) were measured for the resulting molded articles. The results are shown in Table 4.
Example 24
(Molecular weight lowering step)
100 g of the modified phenolic resin and 250 g of alpha-naphthol of the powder obtained in the molecular weight reduction step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to 120 ° C. with stirring at 250-350 rpm. A solution of 5 g of p-toluenesulfonic acid dissolved in 5 g of 1-butanol was added dropwise to the mixture, and the mixture was allowed to react at 120 ° C. for 120 minutes to obtain a reaction product.
The resulting reaction product was taken up in 800 ml of methyl isobutyl ketone and dissolved. The resulting resin mixture was washed with distilled water to remove acid, and then the mixed solvent was removed using an evaporator.
The resulting crude, highly reactive modified phenolic resin was steam distilled at 160-170 ° C. and nitrogen was introduced at the same temperature to remove unreacted alpha-naphthol from it, thereby removing 230 g of highly reactive, low viscosity modified phenolic resin. Got it.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 5 together with the reaction conditions in the molecular weight lowering step including the reaction temperature.
Example 25-27
Example 24 was repeated except that the reaction conditions in the lower molecular weight step were changed as shown in Table 5, to obtain a highly reactive low viscosity modified phenolic resin in the yield shown in Table 5.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 5.
Example 28
100 g of the modified phenolic resin, 101 g of alpha-naphthol, and 5 g of p-toluenesulfonic acid of the powder obtained in the polycondensation step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to a temperature of 140 ° C. with stirring at 250-350 rpm. The mixture was allowed to react at 160 ° C. for 60 minutes to give a reaction product. The resulting crude highly reactive modified phenolic resin was steam distilled at 160-170 ° C. and nitrogen was introduced at the same temperature to remove unreacted alpha-naphthol and phenol from the highly reactive low viscosity modified phenolic resin 220 g was obtained.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 5.
Example 29
100 g of modified phenolic resin and 200 g of beta-naphthol of the powder obtained in the polycondensation step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to a temperature of 140 ° C. with stirring at 250-350 rpm. A solution of 5 g of p-toluenesulfonic acid dissolved in 5 g of 1-butanol was added dropwise to the mixture and the mixture was allowed to react at 140 ° C. for 120 minutes to obtain a reaction product.
The resulting reaction product was taken up in 800 ml of methyl isobutyl ketone and dissolved. The resulting resin mixture was washed with distilled water to remove acid, and then the mixed solvent was removed using an evaporator.
The resulting crude highly reactive modified phenolic resin was steam distilled at 160-170 ° C. and nitrogen was introduced at the same temperature to remove unreacted beta-naphthol from it to obtain 220 g of highly reactive low viscosity modified phenolic resin. Got it.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 5.
Example 30
200 g of modified phenolic resin (50% resin concentration) and 250 g of alpha-naphthol in the varnish form obtained in the polycondensation step of Example 1 were placed in a 1 liter glass reactor. The mixture was heated to a temperature of 120 ° C. while stirring at 250-350 rpm. A solution of 5 g of p-toluenesulfonic acid dissolved in 5 g of 1-butanol was added dropwise to the mixture, and the mixture was allowed to react at 120 ° C. for 120 minutes to obtain a reaction product.
The resulting reaction product was taken up in 800 ml of methyl isobutyl ketone and dissolved. The resulting resin mixture was washed with distilled water to extract and remove the acid, and then the solvent was removed using an evaporator.
The resulting crude, highly reactive modified phenolic resin was steam distilled at 160-170 ° C. and nitrogen was introduced at the same temperature to remove unreacted alpha-naphthol from it, thereby removing 230 g of highly reactive, low viscosity modified phenolic resin. Got it.
The number average molecular weight, the viscosity at 150 ° C. and the hydroxyl equivalent were measured for the resulting highly reactive low viscosity modified phenolic resin. The results are shown in Table 5.
Example 31
11.71 parts by weight of the highly reactive low viscosity modified phenol resin obtained in Example 24 and 12.35 parts by weight of biphenylepoxy resin (trade name; YX4000H, manufactured by Yuka Shell Epoxy Co., Ltd.) were mixed and stirred using an automatic mortar at room temperature. It was. Next, 0.49 parts by weight of triphenylphosphine (TPP) was added to the mixture as a curing accelerator to obtain a curing accelerator-containing resin mixture.
The gelation time of the curing accelerator-containing resin mixture is measured and shown in Table 6.
0.25 parts by weight of carnauba wax was added and mixed to the resulting curing accelerator-containing resin mixture. Next, 0.20 parts by weight of carbon black and 75 parts by weight of fused silica (trade name: CRS1102-GT200T, manufactured by Tatsumori Co., Ltd.) as inorganic fillers are added to and mixed with the mixture. The resulting mixture was mixed for an additional 3-10 minutes using a roll heated to 80-90 ° C. and then cooled to room temperature. Next, the resulting mixture was ground to obtain a compound. The composition of this compound is shown in Table 6.
The resulting compound was subjected to transition molding carried out at 175 ° C. for 90 seconds and post-treated at 175 ° C. for 6 hours to obtain a molded article.
Shore hardness, glass transition temperature, flexural properties and water absorption were measured for the molded article produced immediately after molding. The results are shown in Table 6.
Example 32-37
Replace the highly reactive low viscosity modified phenolic resins obtained in Example 24 with the highly reactive low viscosity modified phenolic resins obtained in Examples 25-30, respectively, and modify the modified phenolic resins and epoxy resins in the proportions shown in Table 6. Except for mixing, Example 31 was repeated to obtain a curing accelerator-containing resin mixture, a compound, and a molded article.
The gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and moisture absorbency immediately after molding) were measured for the resulting molded articles. The results are shown in Table 6.
Example 38
The highly reactive low viscosity modified phenolic resin obtained in Example 24 was used together with the highly reactive low viscosity modified phenolic resin obtained in Example 4 mixed with each other in the proportions given in Table 6, and the modified phenolic resin and epoxy resin Example 31 was repeated except that the mixture was mixed at the ratio shown in Table 6 to obtain a curing accelerator-containing resin mixture, a compound, and a molded article.
The gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and moisture absorbency immediately after molding) were measured for the resulting molded articles. The results are shown in Table 6.
Example 39
11.76 parts by weight of the highly reactive low viscosity modified phenol resin obtained in Example 24 and 12.54 parts by weight of the o-cresol novolak epoxy resin (trade name; EOCN1020, manufactured by Nippon Kayaku Kabushiki Kaisha) were mixed and stirred using an automatic mortar at room temperature. . Next, 0.25 parts by weight of triphenylphosphine (TPP) was added to the mixture as a curing accelerator to obtain a curing accelerator-containing resin mixture.
The gelation time of the curing accelerator-containing resin mixture is measured and shown in Table 7.
0.25 parts by weight of carnauba wax was added to the resulting curing accelerator-containing resin mixture and mixed. Next, 0.20 parts by weight of carbon black and 75 parts by weight of fused silica (trade name: CRS1102-GT200T, manufactured by Tatsumoro Co., Ltd.) as inorganic fillers are added to and mixed with the mixture. The resulting mixture was mixed for an additional 3-10 minutes using a roll heated to 80-90 ° C. and then cooled to room temperature. Next, the resulting mixture was ground to obtain a compound. The composition of this compound is shown in Table 7.
The resulting compound was subjected to transition molding carried out at 175 ° C. for 90 seconds and post-treated at 175 ° C. for 6 hours to obtain a molded article.
Shore hardness, glass transition temperature, flexural properties and water absorption were measured for the molded article produced immediately after molding. The results are shown in Table 7.
Example 40-45
Replace the highly reactive low viscosity modified phenolic resins obtained in Example 24 with the highly reactive low viscosity modified phenolic resins obtained in Examples 25-30, respectively, and modify the modified phenolic resins and epoxy resins in the proportions shown in Table 7. Except for mixing, Example 39 was repeated to obtain a curing accelerator-containing resin mixture, a compound, and a molded article.
The gelation time of the curing accelerator-containing resin mixture and the physical properties of the molded article (Shore hardness, glass transition temperature, flexural properties and moisture absorbency immediately after molding) were measured for the resulting molded articles. The results are shown in Table 7.
According to the process for producing the highly reactive low viscosity modified phenolic resin of the present invention, the modified phenolic resin is prepared by the above-mentioned polycondensation and molecular weight lowering step, so as to provide high reactivity with epoxy resin and especially low resin melt viscosity. A highly reactive low viscosity modified phenolic resin is provided.
The method of the present invention can further lower the melt viscosity of the highly reactive low viscosity modified phenolic resin by using a hydroxybenzene compound as the phenol in the molecular weight lowering step. In addition, the heat resistance and resistance to water absorption of the resulting highly reactive low viscosity modified phenolic resin can be further improved by using a hydroxynaphthalene compound as the phenol in the molecular weight lowering step.
In addition, according to the method for producing a highly reactive low viscosity modified phenolic resin of the present invention, the highly reactive low viscosity modified phenolic resin obtained in the molecular weight lowering step is substantially free of acid because any unreacted component and acid catalyst are purified and removed. In addition, there is provided a highly reactive low viscosity modified phenolic resin having not only a corrosive action on the metal but also a significantly low resin melt viscosity and high reactivity with the epoxy resin.
The molding material based on the modified phenolic resin of the present invention contains the highly reactive low viscosity modified phenolic resin and epoxy resin obtained by the method of the present invention, and has considerably low water absorption and good heat resistance and formability. It is possible to provide molding materials, in particular electrical and electronic components and semiconductor sealants, for molded articles with good mechanical properties including stability.
TABLE 2-1
Example 1Example 2Example 3Example 4 Amount of modified phenolic resin in powder(g)100100100100 The amount of modified phenolic resin in varnish form(g)---- Amount of phenol(g)200150200200 amount of o-cresol(g)---- amount of m-cresol(g)---- Amount of acid catalyst (PTS)(g)5555 Reaction temperature(℃)120140140140 Reaction time(minute)120120120120 Dilution solvent-Toluene / MIBKToluene / MIBKToluene / MIBKToluene / MIBK Amount of reaction products(g)182195195197 Viscosity at 150 ° C (ICI Viscometer)(p)3.02.01.20.6 Number average molecular weight (GPC)-490470400430 OH equivalent-124120120123
Table 2-2
Example 5Example 6Example 7Example 8 Amount of modified phenolic resin in powder(g)100100100100 The amount of modified phenolic resin in varnish form(g)---- Amount of phenol(g)200200-- amount of o-cresol(g)--200200 amount of m-cresol(g)---- Amount of acid catalyst (PTS)(g)5555 Reaction temperature(℃)180200140160 Reaction time(minute)120120120120 Dilution solvent-Toluene / MIBKToluene / MIBKToluene / MIBKToluene / MIBK Amount of reaction products(g)205196192195 Viscosity at 150 ° C (ICI Viscometer)(p)0.50.21.71.0 Number average molecular weight (GPC)-350330452420 OH equivalent-120126135140
TABLE 2-3
Example 9Example 10Example 11 Amount of modified phenolic resin in powder(g)100-100 The amount of modified phenolic resin in varnish form(g)-200- Amount of phenol(g)-200200 amount of o-cresol(g)--- amount of m-cresol(g)200-- Amount of acid catalyst (PTS)(g)555 Reaction temperature(℃)14016095 Reaction time(minute)120120120 Dilution solvent-Toluene / MIBKToluene / MIBKToluene / MIBK Amount of reaction products(g)185200175 Viscosity at 150 ° C (ICI Viscometer)(p)3.00.85.5 Number average molecular weight (GPC)-448370550 OH equivalent-134120127
Table 3-1
Example 5Example 6Example 7 Modified Phenolic ResinExample 3 Example 4 Example 5 Example 7 Example 8 Example 9 Example 10 Comparative Example 1Parts by weight parts by weight parts by weight parts by weight parts by weight parts by weight9.179.319.17 Epoxy resinYX-4000HParts by weight14.8914.7514.89 Curing acceleratorTPPParts by weight0.490.490.49 Fused silicaCRS1102-GT200TParts by weight757575 Carnauba WaxParts by weight0.250.250.25 Carbon blackParts by weight0.200.200.20 Gel time(170 ° C / sec)464652 Shore hardness immediately after molding-757570 Glass transition temperature (Tg)(℃)128124125 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)171890101920151920 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.2100.3000.2070.2930.2030.289
Table 3-2
Example 14Example 15Example 16 Modified Phenolic ResinExample 3 Example 4 Example 5 Example 7 Example 8 Example 9 Example 10 Comparative Example 1Parts by weight parts by weight parts by weight parts by weight parts by weight parts by weight9.8410.059.80 Epoxy resinYX-4000HParts by weight14.2214.0114.26 Curing acceleratorTPPParts by weight0.490.490.49 Fused silicaCRS1102-GT200TParts by weight757575 Carnauba WaxParts by weight0.250.250.25 Carbon blackParts by weight0.200.200.20 Gel time(170 ° C / sec)535546 Shore hardness immediately after molding-647067 Glass transition temperature (Tg)(℃)122120132 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)121840161950121920 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1930.2860.1850.2700.1940.285
Table 3-3
Example 17Comparative Example 2 Modified Phenolic ResinExample 3 Example 4 Example 5 Example 7 Example 8 Example 9 Example 10 Comparative Example 1Parts by weight parts by weight parts by weight parts by weight parts by weight parts by weight9.179.48 Epoxy resinYX-4000HParts by weight14.8914.58 Curing acceleratorTPPParts by weight0.490.49 Fused silicaCRS1102-GT200TParts by weight7575 Carnauba WaxParts by weight0.250.25 Carbon blackParts by weight0.200.20 Gel time(170 ° C / sec)4660 Shore hardness immediately after molding-7577 Glass transition temperature (Tg)(℃)120140 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)161950151800 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.2000.2900.2200.316
Table 4-1
Example 16Example 19Example 20 Modified Phenolic ResinExample 1 Example 2 Example 3 Example 6 Example 8 Example 10 Comparative Example 1Parts by weight parts by weight parts by weight parts by weight parts by weight9.399.199.19 Epoxy resinEOCN1020Parts by weight14.9115.1115.11 Curing acceleratorTPPParts by weight0.250.250.25 Fused silicaCRS1102-GT200TParts by weight757575 Carnauba WaxParts by weight0.250.250.25 Carbon blackParts by weight0.200.200.20 Gel time(170 ° C / sec)445055 Shore hardness immediately after molding-858585 Glass transition temperature (Tg)(℃)169167160 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)171880191900181900 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.2170.3150.2070.3060.2000.300
Table 4-2
Example 21Example 22 Modified Phenolic ResinExample 1 Example 2 Example 3 Example 6 Example 8 Example 10 Comparative Example 1Parts by weight parts by weight parts by weight parts by weight parts by weight9.4810.10 Epoxy resinEOCN1020Parts by weight14.8214.20 Curing acceleratorTPPParts by weight0.250.25 Fused silicaCRS1102-GT200TParts by weight7575 Carnauba WaxParts by weight0.250.25 Carbon blackParts by weight0.200.20 Gel time(170 ° C / sec)5665 Shore hardness immediately after molding-8583 Glass transition temperature (Tg)(℃)160145 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)181890191900 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1920.2890.1750.258
Table 4-3
Example 23Comparative Example 3 Modified Phenolic ResinExample 1 Example 2 Example 3 Example 6 Example 8 Example 10 Comparative Example 1Parts by weight parts by weight parts by weight parts by weight parts by weight9.199.53 Epoxy resinEOCN1020Parts by weight15.1114.77 Curing acceleratorTPPParts by weight0.250.25 Fused silicaCRS1102-GT200TParts by weight7575 Carnauba WaxParts by weight0.250.25 Carbon blackParts by weight0.200.20 Gel time(170 ° C / sec)5740 Shore hardness immediately after molding-8585 Glass transition temperature (Tg)(℃)158169 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)181900181800 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1980.2960.2350.344
Table 5-1
Example 24Example 25Example 26Example 27 Amount of modified phenolic resin in powder(g)100100100100 The amount of modified phenolic resin in varnish form(g)---- Amount of alpha-naphthol(g)250250250250 Amount of beta-naphthol(g)---- Amount of phenol(g)---- Amount of acid catalyst(g)5555 Reaction temperature(℃)120140160180 Reaction time(minute)120120120120 Dilution solvent-MIBKMIBKMIBKMIBK Amount of reaction products(g)230243250258 Viscosity at 150 ° C (ICI Viscometer)(p)4.4421.2 Number average molecular weight (GPC)-535486428370 OH equivalent-185180178176
Table 5-2
Example 28Example 29Example 30 Amount of modified phenolic resin in powder(g)100100- The amount of modified phenolic resin in varnish form(g)--200 Amount of alpha-naphthol(g)101-250 Amount of beta-naphthol(g)-200- Amount of phenol(g)132-- Amount of acid catalyst(g)555 Reaction temperature(℃)160140120 Reaction time(minute)6060120 Dilution solvent-Toluene / MIBKMIBKMIBK Amount of reaction products(g)220220230 Viscosity at 150 ° C (ICI Viscometer)(p)4.14.34.4 Number average molecular weight (GPC)-563560523 OH equivalent-149185185
Table 6-1
Example 31Example 32Example 33 Modified Phenolic ResinExample 4 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30Parts by weight parts by weight parts by weight parts by weight parts by weight parts by weight11.7111.5411.49 Epoxy resinYX-4000HParts by weight12.3512.5212.57 Curing acceleratorTPPParts by weight0.490.490.49 Fused silicaCRS1102-GT200TParts by weight757575 Carnauba WaxParts by weight0.250.250.25 Carbon blackParts by weight0.200.200.20 Gel time(170 ° C / sec)454750 Shore hardness immediately after molding-737373 Glass transition temperature (Tg)(℃)162160158 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)161870151820151830 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1590.2300.1540.2200.1490.212
Table 6-2
Example 34Example 35Example 36 Modified Phenolic ResinExample 4 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30Parts by weight parts by weight parts by weight parts by weight parts by weight parts by weight11.4210.4111.71 Epoxy resinYX-4000HParts by weight12.6413.6512.35 Curing acceleratorTPPParts by weight0.490.490.49 Fused silicaCRS1102-GT200TParts by weight757575 Carnauba WaxParts by weight0.250.250.25 Carbon blackParts by weight0.200.200.20 Gel time(170 ° C / sec)545358 Shore hardness immediately after molding-716767 Glass transition temperature (Tg)(℃)158144152 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)161850161800131770 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1350.1980.1900.2730.1480.219
Table 6-3
Example 37Example 38 Modified Phenolic ResinExample 4 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30Parts by weight parts by weight parts by weight parts by weight parts by weight parts by weight11.715.185.18 Epoxy resinYX-4000HParts by weight12.3513.71 Curing acceleratorTPPParts by weight0.490.49 Fused silicaCRS1102-GT200TParts by weight7575 Carnauba WaxParts by weight0.250.25 Carbon blackParts by weight0.200.20 Gel time(170 ° C / sec)4547 Shore hardness immediately after molding-7370 Glass transition temperature (Tg)(℃)161140 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)161860141850 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1580.2290.1830.260
Table 7-1
Example 39Example 40Example 41 Modified Phenolic ResinExample 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30Parts by weight parts by weight parts by weight parts by weight parts by weight11.7611.5911.54 Epoxy resinEOCN1020Parts by weight12.5412.7112.76 Curing acceleratorTPPParts by weight0.250.250.25 Fused silicaCRS1102-GT200TParts by weight757575 Carnauba WaxParts by weight0.250.250.25 Carbon blackParts by weight0.200.200.20 Gel time(170 ° C / sec)424448 Shore hardness immediately after molding-848382 Glass transition temperature (Tg)(℃)189187185 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)181900171890171800 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1640.2370.1520.2240.1460.220
Table 7-2
Example 42Example 43 Modified Phenolic ResinExample 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30Parts by weight parts by weight parts by weight parts by weight parts by weight11.4710.47 Epoxy resinEOCN1020Parts by weight12.8313.83 Curing acceleratorTPPParts by weight0.250.25 Fused silicaCRS1102-GT200TParts by weight7575 Carnauba WaxParts by weight0.250.25 Carbon blackParts by weight0.200.20 Gel time(170 ° C / sec)4948 Shore hardness immediately after molding-8077 Glass transition temperature (Tg)(℃)184175 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)161790181800 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1280.1890.2030.297
Table 7-3
Example 44Example 45 Modified Phenolic ResinExample 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30Parts by weight parts by weight parts by weight parts by weight parts by weight11.7611.76 Epoxy resinEOCN1020Parts by weight12.5412.54 Curing acceleratorTPPParts by weight0.250.25 Fused silicaCRS1102-GT200TParts by weight7575 Carnauba WaxParts by weight0.250.25 Carbon blackParts by weight0.200.20 Gel time(170 ° C / sec)5442 Shore hardness immediately after molding-7485 Glass transition temperature (Tg)(℃)178188 Flexural strengthRoom temperature(kgf / mm2) (kgf / mm2)141760181890 Water absorbent85 ° C / 85%-72 hours 85 ° C / 85%-168 hours(wt.%) (wt.%)0.1510.2180.1650.236

权利要求:
Claims (12)
[1" claim-type="Currently amended] Polycondensation of petroleum heavy oil or pitch, formaldehyde polymer and phenol in the presence of an acid catalyst to produce a modified phenolic resin;
Reacting the resulting modified phenolic resin with phenol in the presence of an acid catalyst at a temperature higher than 120 ° C. and not higher than 200 ° C. to lower the molecular weight of the modified phenolic resin. .
[2" claim-type="Currently amended] The process for producing a highly reactive low viscosity modified phenolic resin according to claim 1, wherein the hydroxybenzene compound is used as the phenol in the molecular weight lowering step.
[3" claim-type="Currently amended] The process for producing a highly reactive low viscosity modified phenolic resin according to claim 1, wherein the hydroxynaphthalene compound is used as the phenol in the molecular weight lowering step.
[4" claim-type="Currently amended] 4. The mixture according to any one of claims 1 to 3, wherein in the polycondensation step, the formaldehyde polymer has a molar ratio of formaldehyde polymer to petroleum heavy oil or pitch of 1 to 15, and a mixture containing petroleum heavy oil or pitch and formaldehyde polymer. Heated under stirring in the presence of an acid catalyst,
The phenol resin was modified by polycondensation of petroleum heavy oil or pitch, formaldehyde polymer and phenol by gradually adding phenol to the mixture while heating under stirring until the molar ratio of phenol to petroleum heavy oil or pitch became 0.3 to 5. Process for preparing a highly reactive low viscosity modified phenolic resin
[5" claim-type="Currently amended] The modified phenolic resin obtained in the polycondensation step contains at least one compound selected from the group consisting of (i) aliphatic and alicyclic hydrocarbons each having up to 10 carbon atoms. And / or (ii) the acid catalyst used in the polycondensation with an extraction solvent capable of dissolving to a solubility of 0.1 or less and most modified phenolic resins to remove formaldehyde polymers as catalyst residues and crosslinkers. A process for producing a highly reactive low viscosity modified phenolic resin, wherein the resulting modified phenolic resin is used in a molecular weight lowering step.
[6" claim-type="Currently amended] (A) a highly reactive low viscosity modified phenolic resin having a resin melt viscosity of 0.2 to 4.5 poise at 150 ° C., obtained according to any one of claims 1 to 5, and (B) an epoxy resin Molding materials based on modified phenolic resins.
[7" claim-type="Currently amended] 7. The molding material based on the modified phenolic resin according to claim 6, wherein the highly reactive low viscosity modified phenolic resin has a resin melt viscosity of 0.2 to 3.0 poise at 150 deg.
[8" claim-type="Currently amended] 7. The molding material based on the modified phenolic resin according to claim 6, wherein the highly reactive low viscosity modified phenolic resin has a resin melt viscosity of 1.0 to 4.5 poise at 150 deg.
[9" claim-type="Currently amended] The molding material according to any one of claims 6 to 8, further comprising (C) a curing agent and / or a curing accelerator, and (D) an inorganic filler.
[10" claim-type="Currently amended] The modified phenolic resin according to claim 6, wherein the highly reactive low viscosity modified phenolic resin (A) is mixed with the epoxy resin (B) in a ratio of 10:90 to 90:10 parts by weight. Based molding materials.
[11" claim-type="Currently amended] A material for electrical and electronic parts produced by molding a molding material based on the modified phenolic resin of any one of claims 6 to 10.
[12" claim-type="Currently amended] A semiconductor sealant made from a molding material based on the modified phenolic resin of claim 6.

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同族专利:

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公开号 | 公开日

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EP0789042A2|1997-08-13|

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TW400359B|2000-08-01|

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EP0789042B1|2002-05-15|

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DE69712545D1|2002-06-20|

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DE69712545T2|2003-01-09|

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EP0789042A3|1997-09-24|

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US5936010A|1999-08-10|

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US5792826A|1998-08-11|

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KR100219298B1|1999-09-01|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
1996-02-09|Priority to JPP08-024173

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1996-02-09|Priority to JP8024173A

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1996-10-15|Priority to JPP08-272576

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1996-10-15|Priority to JP8272576A

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1997-02-06|Application filed by 후쿠다타케지, 카시마오일캄파니리미티드

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1998-07-25|Publication of KR19980032032A

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1999-09-01|Application granted

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1999-09-01|Publication of KR100219298B1

优先权:

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申请号 | 申请日 | 专利标题

---

JPP08-024173|1996-02-09|

---

JP8024173A|JPH09216927A|1996-02-09|1996-02-09|Manufacture of highly reactive low viscosity modified phenol resin, molding material containing the resin, electric and electronic part material and semiconductor sealant|

---

JPP08-272576|1996-10-15|

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JP8272576A|JPH10120869A|1996-10-15|1996-10-15|Production of highly reactive modified phenol resin, and molding material, material for electric and electronic parts, and semiconductor-sealing material containing the same|