• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    An on-board telematic device intended to be fixed on a metal part (3) of a motor vehicle body, comprises, according to the invention, a housing (1) incorporating a printed circuit board (5), one side of which carries at least one a power electronics component (6), a radiofrequency antenna (7) for extending through an opening of the metal portion (3), and a metal screen (9) interposed between a lower portion of the antenna (7) on the one hand, and the circuit board (5) component thereof, for isolating the parasitic emission antenna. The component (6) is placed in line with the metal screen (9) and in thermal contact with a portion of said screen, and said screen (9) is made of thermal conductive material so as to form a heat transfer means between the component (6) power electronics and the metal part (3).
    公开号:FR3069129A1
    申请号:FR1756748
    申请日:2017-07-17
    公开日:2019-01-18
    发明作者:Patrick Klein；Renato Curcio
    申请人:Valeo Comfort and Driving Assistance SAS；
    IPC主号:
    专利说明:

    DI SPOSI Tl F DE TELEMATI ON BOARD WITH REFRIGERATION
    I NTEGRE FOR MOTOR VEHICLE
    The present invention relates generally to on-board telematics devices intended to equip motor vehicles, and more specifically to the cooling of electronic power components integrated in such on-board telematics devices.
    On-board telematics devices increasingly include functions with high power dissipation using components with low temperature tolerance. For example, a telematics device with a NAD type functionality (English initials set for Network Access Device), incorporating a cellular modem, can dissipate several Watts in power, with junction temperatures of the components which must be lower. at 120 degrees Celsius.
    The design of an on-board telematics device can be complex in terms of managing thermal power dissipation, especially when the device has to be placed in places in the motor vehicle liable to be subjected to high temperatures, such as for example under the roof of the vehicle where the ambient temperature can be around 95 degrees Celsius.
    A conventional way to cool a power electronic component is to use a heat sink integrated in the on-board telematics device, as shown diagrammatically in FIG. 1. In this figure, a box 1 of an on-board telematics device 2 is illustrated fixed. under the roof 3 of a motor vehicle by means of fixing screws 4. The device 2 comprises, integrated into the housing 1, a printed circuit board 5 and a power electronics component 6 assembled on the printed circuit board 5. The power electronics component 6 can be assembled on the upper face of the printed circuit board 5 (case of FIG. 1 (a)), or on its lower face (case of FIG. 1 (b)). The device also comprises, for data exchange with the outside, an antenna 7 for radiofrequency transmission / reception, which extends vertically outside, through an opening of an opening provided in the bodywork, so as to emerge through the roof 3. A radome 8 preferably protects the antenna against infiltration. A metallic screen 9 interposed between the lower part of the antenna 7 on the one hand, and the printed circuit card 5 and the components which it carries on the other hand, makes it possible to isolate the antenna from the electronic components whose parasitic emissions would affect the transmission / reception performance of the antenna. This metallic screen 9 is generally fixed at the level of the roof 3, also metallic, for example by the same fixing screws 4 as those used to hold the housing 1, in order to provide good electrical contact and thus ensure continuity in the shielding produced by the screen 9. More specifically, the metal screen 9 has a flange resting on an external face of the housing 1 and peripheral to the opening, and the device is capable of being fixed to the metal part by the fixing screws crossing the rim and the external face of the housing together. Finally, to ensure the cooling of the component 6 of power electronics, the box 1 integrates, in line with the component and in thermal contact with an internal face of the upper part of the box, a heat sink 10, the metal parts of which increase the heat exchanges between the component 6 and the air, and thus limit an increase in temperature of the component. A layer 11 forming a thermal interface is preferably interposed between the lower part of the heat sink 10 and the upper part of the component (case (b)) or the printed circuit board (case (a)) to promote heat exchange.
    In another known embodiment, the heat sink 10 is replaced by a heat pipe allowing heat exchanges between the component 6 and other external elements (not shown).
    These known solutions all have an impact in terms of cost, size and weight by requiring the addition of a heat sink or a heat pipe.
    In other known embodiments which avoid the use of the heat sink 10, the housing 1 is chosen from a material with good thermal conductivity, and conforms to the right of the component 6 to perform the same cooling function as the heat sink 10.
    However, this solution remains expensive because of the choice of material with good thermal conductivity which must then be used for the entire housing.
    The present invention aims to overcome the drawbacks of the solutions hitherto proposed.
    This object is achieved according to the invention which relates to an on-board telematics device intended to be fixed to a metal part of a motor vehicle body, comprising a housing integrating a printed circuit board, one face of which carries at least one component. power electronics, a radiofrequency transmit / receive antenna, intended to extend through an opening of the metal part and a metal screen interposed between a lower part of the antenna on the one hand, and the printed circuit board and said at least one component, for isolating the antenna from parasitic emissions, said screen being intended to be fixed between said metal part and the housing so as to ensure electrical continuity, device in which said at least one component is placed in line with the metallic screen and in thermal contact with a portion of said screen, and said screen is made of material thermal conductor so as to form a means of thermal transfer between the power electronic component and the metallic part.
    In addition to the main characteristics which have just been mentioned in the preceding paragraph, the method according to the invention may have one or more complementary characteristics among the following:
    - The metal screen preferably has a flange resting on an external face of the housing and peripheral to the opening, and the device is capable of being fixed to the metal part by fixing screws passing together through said flange and the face external of the housing;
    - The conductive material preferably has a thermal conductivity greater than or equal to 50 W.m ' 1 .K'1;
    - the conductive material is for example steel, aluminum, or zamak;
    - In one embodiment, said at least one power electronics component is supported by one face of the printed circuit board directly facing the portion of said screen, and a layer forming a thermal interface is interposed between a lower part of the portion of said screen and the upper part of said component;
    - as a variant, said at least one power electronics component is supported by a first face of the printed circuit board opposite a second face of the card directly facing the portion of said screen, and a layer forming a thermal interface is interposed between a lower part of the portion of said screen and the first face of the printed circuit board;
    - In another embodiment, the edge of the metal screen extends parallel to the printed circuit board so as to form a face of said housing;
    - said flange may include a projection extending towards the inside of the housing, with a lower portion of said projection placed at right angles to and in thermal contact with another power electronic component carried by said printed circuit board.
    The invention will be better understood on reading the description which follows, made with reference to the appended figures, in which:
    - Figure 1, already described above, schematically illustrates two on-board telematics devices with integrated cooling of a power electronics component, in a position for attachment to the roof of a motor vehicle;
    - Figure 2 schematically illustrates a first embodiment of a telematics device according to the invention, in a position for attachment to the roof of a motor vehicle, and according to two alternative embodiments;
    - Figure 3 schematically illustrates a second embodiment of a telematics device according to the invention, in a position for attachment to the roof of a motor vehicle.
    In all of the figures, the different common elements have the same references.
    The principle of the invention is based on the presence in a device 2 of on-board telematics as described above with reference to FIG. 1, of the metal screen 9 used in first functionality to protect the antenna 7 of radiofrequency communication from the disturbances generated. by the electronic components of the device. According to the invention, it is proposed to assign a second functionality to this screen by also using it as a vector of thermal energy between the power electronics component and the metal portion of the vehicle body, for example the roof. of the vehicle, on which the device must be fixed.
    In doing so, the metallic screen 9 becomes a thermal conductor and causes the heat to dissipate up to the metallic portion of the bodywork which then serves as a heat sink.
    A first embodiment will now be described with reference to FIG. 2, which represents an on-board telematics device 2, already fixed to the metal portion of the vehicle body, here the roof 3. This device includes all the elements already described with reference to FIG. 1. Unlike this FIG. 1, however, the component 6 with power electronics which should be cooled is placed in line with the metallic screen 9 and in thermal contact with a portion of this screen. In addition, the screen 9 is made of thermal conductive material so as to form a means of thermal transfer between the component 6 of power electronics and the metal part 3.
    The conductive material is preferably chosen from metallic materials having a thermal conductivity greater than or equal to 50 W.m ' 1 .K' 1 . One can for example use steel, aluminum, or even zamak which is an alloy of zinc, aluminum and magnesium and copper.
    In the case of FIG. 2 (a), the component 6 of power electronics is supported by the upper face of the card 5, more generally by the face of the printed circuit card 5 directly facing the portion of the 'screen 9. In this case, a layer 11 forming a thermal interface is preferably interposed between a lower part of the portion of the screen 9 and the upper component.
    According to the variant of FIG. 2 (b), the component 6 of power electronics is supported by the other face of the printed circuit card, that is to say the face of the printed circuit card 5 opposite to that which is directly opposite the portion of the screen 9. Here again, a layer 11 forming a thermal interface is preferably interposed, this time between the lower part of the portion of said screen 9 and the face of the card 5 of printed circuit directly opposite with the screen portion 9.
    In both variants, the layer 11 is formed from a thermal grease, a thermal glue, a thermal paste, or any other material which makes it possible to fill the space between the elements and ensure good thermal conduction.
    In all cases, it is the metal portion of the bodywork, here the roof, which serves as a heat sink for the thermal energy which passes, as indicated by the arrows in broken lines, between the component 6 and the bodywork, via the metal screen 9.
    In a second embodiment illustrated schematically in FIG. 3, the edge of the metallic screen 9 is also of a dimension such that it extends parallel to the printed circuit board 5 so as to form a face ( in the example the upper face) of the housing 1.
    One advantage of this second embodiment is that the screen 9 can also serve as a vector of thermal energy for other components to be cooled of the device 2, such as a second component 6 ’of power electronics. This second component 6 'is here placed at right and in thermal contact with a lower portion of a projection 12, extending towards the inside of the housing 1, of the flange.
    权利要求:
    Claims (9)
    [1" id="c-fr-0001]
    1. On-board telematics device intended to be fixed to a metal part (3) of a motor vehicle body, comprising a housing (1) integrating a printed circuit card (5) of which one face carries at least one component (6 ) of power electronics, an antenna (7) for radiofrequency transmission / reception, intended to extend through an opening of the metal part (3) and a metal screen (9) interposed between a lower part of the antenna (7) on the one hand, and the printed circuit board (5) and said at least one component, for isolating the antenna from parasitic emissions, said screen being intended to be fixed between said metal part (3 ) and the housing (1) so as to ensure electrical continuity, device in which said at least one component (6) is placed in line with the metal screen (9) and in thermal contact with a portion of said screen, and said screen (9) is made of material thermal conductor so as to form a means of thermal transfer between the component (6) of power electronics and the metallic part (3).
    [2" id="c-fr-0002]
    2. Device according to claim 1, characterized in that the metal screen (9) has a flange resting on an external face of the housing and peripheral at the opening, and in that the device is able to be fixed on the metal part by fixing screws (4) passing together through said flange and the external face of the housing (1).
    [3" id="c-fr-0003]
    3. Device according to any one of the preceding claims, characterized in that the conductive material has a thermal conductivity greater than or equal to 50 W.m ' 1 .K' 1 .
    [4" id="c-fr-0004]
    4. Device according to claim 3, characterized in that the conductive material is steel.
    [5" id="c-fr-0005]
    5. Device according to claim 3, characterized in that the conductive material is aluminum.
    [6" id="c-fr-0006]
    6. Device according to claim 3, characterized in that the conductive material is zamak.
    [7" id="c-fr-0007]
    7. Device according to any one of the preceding claims, characterized in that said at least one component (6) of power electronics is supported by one face of the printed circuit board (5) directly opposite the portion of said screen (9), and in that a layer (11) forming a thermal interface is interposed between a lower part of the portion of said screen (9) and the upper part of said component.
    [8" id="c-fr-0008]
    8. Device according to any one of claims 1 to 7, characterized in that said at least one component (6) of power electronics is supported by a first face of the printed circuit board (5) opposite to a second face of the card (5) directly facing the portion of said screen (9), and in that a layer (11) forming a thermal interface is interposed between a lower part of the portion of said screen (9) and the first face of the printed circuit board (5).
    [9" id="c-fr-0009]
    9. Device according to any one of claims 2 to 8, characterized in that the edge of the metal screen (9) extends parallel to the printed circuit card (5) so as to form a face of said housing ( υ-
    ΙΟ.A device according to claim 9, characterized in that said flange comprises a projection extending towards the inside of the housing (1), with a lower portion of said projection placed in line with and in thermal contact with another component ( 6 ') of power electronics carried by said printed circuit card (5).
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3069129B1|2019-08-16|INTEGRATED COOLING TELEMATICS DEVICE FOR MOTOR VEHICLE
    US8385070B2|2013-02-26|Portable electronic device
    EP2223583B1|2012-11-28|Device for cooling an electronic card by conduction comprising heat pipes, and corresponding method of fabrication
    EP3220729B1|2019-05-22|Electronic device and method for assembling such a device
    EP0558359A1|1993-09-01|Device for holding an electronic component to the side wall of a heat sink
    US20060274506A1|2006-12-07|Portable electronic apparatus
    EP1732230A2|2006-12-13|Portable electronic device
    EP3621093A1|2020-03-11|Capacitive block comprising a heat sink
    FR2797556A1|2001-02-16|Heat dissipater, especially for an active electronic box of a satellite or other space vehicle, comprises an L-shaped metal-encapsulated pyrolytic graphite plate fixed to the box and to a radiator
    FR3063386A1|2018-08-31|POWER MODULE WITH ELECTRONIC CARD COOLING SYSTEM
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    FR2934749A1|2010-02-05|DEVICE FOR ELECTROMAGNETIC SHIELDING AND HEAT DISSIPATION DISENGAGED BY AN ELECTRONIC COMPONENT AND CORRESPONDING ELECTRONIC CIRCUIT.
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    EP1054445A1|2000-11-22|Electronic package on circuit board and its manufacture
    EP0881873A1|1998-12-02|Electromagnetic shielding and circuit board provided with such a shielding
    EP3495720A1|2019-06-12|Light module for a motor vehicle
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    WO2018115709A1|2018-06-28|Power electronics module comprising a heat exchange face
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    CN215184999U|2021-12-14|Coaxial can-packaged laser diode and heat dissipation base thereof
    FR2817445A1|2002-05-31|Mobile telephone screened power integrated circuit having heat dissipation circuit with electromagnetic screen having integrated circuit thermal contact.
    FR3029688A1|2016-06-10|ELECTRONIC DEVICE WITH ANTENNA INTEGRATED WITH A THERMAL DISSIPATOR
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    FR3093890A1|2020-09-18|Thermal diode device for an electronic unit
    FR3103582A1|2021-05-28|Embedded computer with entrepreneur on the microprocessor chip
    同族专利:
    公开号 | 公开日
    WO2019016239A1|2019-01-24|
    EP3656193A1|2020-05-27|
    FR3069129B1|2019-08-16|
    JP2020527863A|2020-09-10|
    EP3656193B1|2021-07-07|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20020154487A1|2001-04-04|2002-10-24|Reinhard Weischhoff Van Rijn|Radio frequency module of an audio appliance having optimum heat dissipation|
    US20150123854A1|2012-05-16|2015-05-07|Continental Automotive Gmbh|Antenna module having a transmitting and receiving antenna element|
    WO2017076750A1|2015-11-02|2017-05-11|Taoglas Limited|A multi-network telematics device with multiple antennas|WO2021211387A1|2020-04-14|2021-10-21|Airgain, Inc.|Antenna assembly for a vehicle|
    US11165132B2|2019-01-01|2021-11-02|Airgain, Inc.|Antenna assembly for a vehicle|
    US10938084B2|2018-12-07|2021-03-02|Intel Corporation|Cooling system for radio|
    FR3093256B1|2019-02-27|2021-01-29|Psa Automobiles Sa|DISSYMMETRIC CALORIE TRANSFER WAVE EMISSION / RECEPTION DEVICE, FOR A BODY WALL OF A VEHICLE|
    法律状态:
    2019-01-18| PLSC| Search report ready|Effective date: 20190118 |
    2019-07-31| PLFP| Fee payment|Year of fee payment: 3 |
    2020-07-31| PLFP| Fee payment|Year of fee payment: 4 |
    2021-07-29| PLFP| Fee payment|Year of fee payment: 5 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1756748A|FR3069129B1|2017-07-17|2017-07-17|INTEGRATED COOLING TELEMATICS DEVICE FOR MOTOR VEHICLE|
    FR1756748|2017-07-17|FR1756748A| FR3069129B1|2017-07-17|2017-07-17|INTEGRATED COOLING TELEMATICS DEVICE FOR MOTOR VEHICLE|
    PCT/EP2018/069445| WO2019016239A1|2017-07-17|2018-07-17|On-board telematic device with integrated cooling for a motor vehicle|
    JP2020502191A| JP2020527863A|2017-07-17|2018-07-17|In-vehicle telematic device with integrated cooling function for automobiles|
    EP18738367.4A| EP3656193B1|2017-07-17|2018-07-17|On-board telematic device with integrated cooling for a motor vehicle|
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