• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a flexible electronic card comprising: - a card body (1) comprising an upper surface (11) and a lower surface (12); at least one cavity (13, 13 ') formed in the card body opening out from the upper surface; - A fingerprint module (2) configured to acquire a fingerprint of a user, the fingerprint module being housed in the cavity (13) and is flush with the upper surface of the card body; the impression module (2) comprising a flexible substrate (22) comprising a so-called capture active portion (21) flush with the upper surface of the card body and a microcontroller (23) disposed below the substrate.
    公开号:FR3069081A1
    申请号:FR1756763
    申请日:2017-07-17
    公开日:2019-01-18
    发明作者:Sylvie Pompeani；Francois Germain
    申请人:Safran Identity and Security SAS；
    IPC主号:
    专利说明:

    GENERAL TECHNICAL AREA
    The invention relates to the field of electronic cards as well as the manufacture of such cards and more particularly relates to electronic cards comprising a fingerprint sensor.
    STATE OF THE ART
    Electronic cards comprising a fingerprint sensor are known.
    The current trend is that these electronic cards, with a fingerprint sensor, are as flexible as the usual smart cards while respecting at best constraints in terms of dimensions. These constraints of flexibility and dimensions are mentioned in the standards ISO 781 ID1, ISO 7816 for banking applications) and ISO 10373.
    One problem is that the fingerprint sensors are fragile and cannot necessarily support such flexibility and size requirements.
    In an attempt to resolve this problem, a number of electronic cards have been considered. These cards offer either to increase the rigidity of the card by increasing the thickness of the card (see document WO 2009/140968) or to introduce reinforcing elements in the card at the level of the fingerprint sensor (see document WO 2017/093514).
    Another problem with these cards is that the fingerprint sensor requires that some of its components (typically the processor and / or memory) be mounted within an embedded layer (inlay in English) between the two plastic layers of the menu.
    These solutions are however not satisfactory because the electronic card is complex to manufacture and the flexibility and dimension constraints of the ISO 7816 standard are not respected.
    PRESENTATION OF THE INVENTION
    An object of the invention is to have an electronic card comprising a fingerprint sensor which satisfies the constraints specified in the standards (ISO 781 ID1, ISO 7816 for banking applications) and ISO 10373 in terms of dimensions and flexibility. .
    Another object of the invention is to have a method of manufacturing an electronic card comprising a fingerprint sensor which is simple to implement.
    To this end, the invention provides a flexible electronic card comprising: a card body comprising an upper surface and a lower surface;
    - at least one cavity formed in the card body emerging from the upper surface;
    a fingerprint module configured to acquire a fingerprint of a user, the fingerprint module being housed in the cavity and flush with the upper surface of the card body; the imprint module comprising a flexible substrate comprising an active so-called capture part flush with the upper surface of the card body and a microcontroller disposed below the substrate.
    The invention is advantageously supplemented by the following characteristics, taken alone or in any of their technically possible combinations.
    The fingerprint module further comprises connection pads intended to connect said fingerprint module to an antenna or to a second module.
    The cavity has a maximum depth such that the distance between the lower surface of the card body and the bottom of the cavity is greater than or equal to 160 μm.
    The cavity has a three-dimensional internal profile so as to follow the internal relief of the impression module, the cavity comprising at least one stop configured to limit the deformations of the module housed in the cavity.
    The card includes two cavities, one cavity housing the fingerprint module, the other cavity housing a second typically banking or access module.
    The card body includes an intermediate layer, called an interconnection layer, of conductive material on which an antenna is integrated.
    The card body includes an intermediate layer, called an interconnection layer, of semiconductor material on which a circuit, configured to connect the imprint module to the second module.
    The card includes recesses formed from the at least one cavity towards the interconnection layer.
    The card body comprises from the upper surface to the lower surface the following laminated layers:
    an upper transparent protective layer;
    a first PVC substrate;
    the intermediate layer called interconnection;
    a second PVC substrate; a transparent protective bottom layer.
    The card also comprises a tactile mark and / or an alignment mark placed on the upper surface of the card body near the imprint module, said tactile mark being configured to allow correct positioning of a finger. on the fingerprint module.
    According to a second aspect, the invention also relates to a method for manufacturing an electronic card according to the invention, comprising steps of
    - obtaining a card body;
    - formation of at least one cavity in said card body;
    placement of an imprint module in the cavity, the imprint module comprising a flexible substrate comprising an active so-called capture part flush with the upper surface of the card body and a microcontroller disposed below the substrate.
    The step of obtaining the card body includes a substep of integrating an antenna on the intermediate layer.
    The method further comprises obtaining two cavities in the card body, and placing the imprint module in one of the two cavities and placing a second module in the other cavity, the step of obtaining the card body further comprises a step of integrating a connection circuit configured to connect the fingerprint module to the second module.
    The step of obtaining the card body includes a sub-step of hot lamination of the upper layer, the first substrate, the intermediate layer and the lower layer.
    The method includes a step of obtaining at least one recess in the card body from the cavity to the intermediate layer.
    With the card according to the invention, the entire imprint module is housed in the same cavity. There is therefore no need to provide an additional connection or cavity to accommodate this module.
    The fingerprint module can easily be integrated into a conventional electronic card.
    PRESENTATION OF THE FIGURES
    Other characteristics, objects and advantages of the invention will emerge from the description which follows, which is purely illustrative and not limiting, and which should be read with reference to the appended drawings in which:
    - Figures 1a and 1b respectively illustrate a top view and a side view of an electronic card according to an embodiment of the invention;
    - Figure 2 illustrates a profile view of an imprint module of an electronic card according to an embodiment of the invention;
    - Figure 3 illustrates a profile view of a fingerprint module, an electronic card according to an embodiment of the invention, subjected to a deformation introduced by a finger of a user;
    - Figure 4 illustrates a profile view of an imprint module in a three-dimensional cavity of an electronic card according to an embodiment of the invention;
    - Figure 5 illustrates a profile view of a card body of an electronic card according to an embodiment of the invention;
    - Figure 6 illustrates a top view of an electronic card comprising a tactile mark according to an embodiment of the invention;
    - Figure 7 illustrates a profile view of an electronic card according to an embodiment of the invention for a fingerprint sensor application;
    - Figure 8 illustrates a profile view of an electronic card according to an embodiment for a fingerprint sensor application coupled with another application;
    - Figure 9 illustrates a top view of an interconnection layer of the electronic card of Figure 8;
    FIG. 10 illustrates steps of a process for manufacturing an electronic card according to the invention.
    In all of the figures, similar elements bear identical references.
    DETAILED DESCRIPTION OF THE INVENTION
    Figures 1a and 1b illustrate an electronic card comprising a card body 1 and a fingerprint module 2.
    The card body 1 comprises an upper surface 11 and a lower surface 12 and has dimensions in accordance with the ISO 781 ID1 standard. In particular, the card body 1 has a thickness of between 780 and 840 μm.
    In addition, the card body comprises several layers assembled together by means of a hot lamination process so as to satisfy the constraints of holding the layers together of the ISO 781 ID1 standard.
    The electronic card comprises a footprint module 2 housed in a cavity 13 formed in the thickness of the card body 1. The cavity 13 opens out from the upper surface 11 of the card body 1 and is flush with the upper surface of the card body. The cavity 13 is advantageously obtained by milling the card body 1 over a desired thickness.
    The fingerprint module 2 is configured to acquire the image of a user's fingerprint and to verify the identity of the holder of the electronic card.
    The module 2 comprises a semiconductor and flexible substrate 22 typically made of polymer and epoxy material in order to be compatible with the flexibility constraints of the cited standard while being sufficiently solid.
    Part of this substrate 22 constitutes the active part 21 of the module on which the wearer will place his finger so that the image of his imprint is acquired.
    The rest of the substrate 22 allows the assembly of the imprint module 2 on the card and of the support for the assembly of a microcontroller 23 (configured to compare a freshly acquired imprint with a reference imprint) and possibly a memory. 24 (which may include a reference fingerprint of the user previously stored).
    Thus, the microcontroller is configured to implement the acquisition of the fingerprint as well as the processing of said fingerprint. In particular, the image of the imprint is captured by the active part and then processed by the microcontroller so as to extract a model which will be used for comparison with the image that the carrier will have recorded in the card during a previous phase. enrollment.
    The imprint module therefore comprises a substrate 2 comprising an active face 221 and a connection face 222 opposite the active face 221. The active face 221 is the part of the imprint module which is flush with the upper surface of the card body 1 and which includes the active part 21.
    Advantageously, the microcontroller 23 and possibly the memory are assembled to the substrate 2 typically by anisotropic cold bonding or reflow at the connection face 222.
    The connection face 222 is the part of the imprint module which is in the cavity 13 formed in the card body 1 and includes connection pads 25 which allow the connection of the imprint module to one antenna or to another. module. We will come back to it.
    Note that in Figure 2 four connection pads are illustrated. However, a different number can be provided depending on the connections required.
    These connection pads 25 are arranged around the substrate 2 so as to lose as little space as possible for the active part 21 and the mounting of the components. However, no connection line and any component must be less than 0.3 mm from these studs in order to guarantee the correct mounting of the module on the card. In addition, reinforcement on the contour of the substrate is advantageously provided to avoid too much flexibility on this part used for assembly. This reinforcement can be a crown of conductive material internal to the substrate.
    The maximum height of the substrate and the components must be 600 μm so that it can be integrated into the card without damage and while guaranteeing a sufficient backdrop for compliance with the flexibility and robustness requirements of the ISO 781 ID1 standard. .
    As already mentioned, the substrate 22 of the footprint module 2 is flexible. Also, to prevent the substrate 22, under the effect of the deformations generated by the user's finger, from deteriorating, once assembled in the card, there is advantageously provided a cavity 13 having an internal three-dimensional profile in that it substantially matches the profile of the connected elements projecting from the connection face 212 of the substrate 22 of the imprint module 2.
    In FIG. 2, the cavity is said to be “standard” without any particular profile. In Figure 3, we show a cavity with the impression module deforming when a user's finger is placed on the active part of the impression module and in Figure 4 we show a cavity with a three-dimensional profile.
    The components 23, 24 are directly mounted below the substrate 2 on the connection face and participate in the limitation of deformations. In addition, the three-dimensional internal profile of the cavity substantially matching the shape of the imprint module, this makes it possible to have one or more abutment (s) 18 which will make it possible to limit the deformations of the substrate 22 of the imprint module 2.
    In relation to FIG. 5, the card body comprises the following stack from the upper surface 11 of the card body to the lower surface 12 of the card body 1:
    a transparent transparent upper protective layer 13;
    a first plastic substrate 14;
    an intermediate layer comprising a conductive material based on copper;
    a second plastic substrate 16;
    a lower transparent protective layer 17 of plastic.
    The plastic layers are for example PVC or PC or PET.
    The plastic layers are provided to support possible inscriptions (customer visual, various decorations, identity, etc.) and the protective layers are provided to protect the plastic layers and receive personalization information from the card holder.
    The intermediate layer 15 is intended to support possible conductive tracks for connecting the imprint module to an antenna or to another module. This aspect will be detailed later.
    Advantageously, in relation to FIG. 6, on the upper face 11 of the card body, the upper transparent protective layer 13 comprises a tactile mark 4 which is added by means of the printing of a tactile varnish, or by etching of the upper transparent protective layer 13. This tactile mark is placed in the close vicinity of the fingerprint sensor 21 (and therefore of the fingerprint module 2) so as to guide the user when he places his finger on the fingerprint sensor 21. The 4 touch mark makes it easier to acquire the fingerprint.
    In particular, the tactile mark 4 is such that when a user places his finger, the fingerprint to be acquired is correctly positioned on the fingerprint sensor 21.
    The 4 touch mark is advantageously printed by screen printing with a touch varnish or engraved when laminating the layers together (by means of engraved plates) or even engraved by Laser. It has a maximum thickness of 50 µm in order to be compatible with the size constraints of the ISO 781 standard
    ID1.
    For a rectangular impression module with a width between 15 mm and 18 mm, the tactile mark is located at a maximum distance of 8-12 mm from the active part, preferably 10 mm.
    The shape of the tactile mark is preferably in the shape of a half-moon (see FIG. 6). Other forms are possible.
    This tactile mark 4 has a pattern whose roughness is different from that of the surface supporting the mark.
    Alternatively or additionally, an alignment mark 5 making it possible, if necessary, to indicate to the user where to position his on the card body is printed on the first substrate 14 and protected by the upper transparent protective layer 13 . The alignment mark 5 is typically a portion of a circle representing the end of a finger.
    According to one embodiment, illustrated in FIG. 7, the electronic card is used for the purpose of operating by contactless interface (by radio frequency at short or medium range via an antenna). The authentication of the holder and the validation of his identity may trigger, by contactless, access, payment or other. The card is supplied via a contactless terminal which communicates with the card. This terminal, depending on the applications, is an access reader, a payment terminal or the like.
    As such, there is an antenna 30 connected to the footprint module 2. The antenna 30 is placed on the intermediate layer and laminated in the card body 1. At least one connection pad 25 is then connected to the antenna 30 by an electrical connection process via a conductive resin or the like. To allow connection of the footprint module 2 to the antenna 30 at least one cavity 41 is provided in the card body 1 which is filled for example with conductive resin 51 or the like.
    According to a so-called “contactless” operation, a contactless terminal communicates with the card and contains an antenna. This terminal is powered and thanks to the passage of an alternating current in its antenna, the terminal generates an alternating magnetic field. Thanks to its antenna, the card near this alternating field can extract its energy. In addition, the terminal's alternating current is modulated at two different frequencies, which allows data to be transmitted at the same time as energy. Thus, receiving its energy, the card will demodulate the signal and at the same time find the modulated data transmitted by the terminal.
    Contactless operation has been described, but the card described here applies to other operations, such as:
    - with contact (via a classic interface module conforming to ISO 7816-2 standard);
    - or "dual", that is to say with the two supply means (contact or not);
    The communication protocol between terminal and card is standardized to guarantee interoperability. Such standards are for example the ISO 14443 and ISO 15693 standards.
    In relation to FIG. 8, the electronic card comprises, in addition to a fingerprint module 2, a second module 3 comprising a chip configured to operate functions otherwise known to those skilled in the art such as a control function. access to a place and / or a transport network and / or a sovereign identification function for individuals and / or a payment function.
    According to this embodiment, the authentication of the card holder and the validation of his identity may trigger, by contact or contactless mode, access, payment or other.
    Still in relation to FIG. 8, the card therefore comprises a second module 3 housed in a dedicated cavity 13 ’.
    The second module 3 is connected to the imprint module 2 via a circuit 40 placed on the intermediate layer. Module 3 includes a microcontroller (chip)
    31.
    The footprint module 2 and the second module 3 are connected to the circuit via recesses 41, 42, 43, 44 formed in the body and filled, for example, with conductive resin 51 or the like. In FIG. 8, four recesses are illustrated, but it will be understood that there are as many recesses as necessary.
    FIG. 9 illustrates a detailed view of the interconnection layer of the electronic card of FIG. 8.
    In this figure, we see four connections to connect the fingerprint module 2 to the payment module 3. Of course, the number and arrangement of connections may vary depending on the type of connection circuit.
    In a complementary manner, the second module 3 can be interfaced according to the contact and contactless modes (we speak of operation in DUAL mode). As soon as the contactless mode is necessary, an antenna (not shown in Figure 8), is placed on the interconnection layer or is added directly to the second module 3.
    The electronic card described above is advantageously manufactured by means of a method described in relation to FIG. 10.
    The manufacturing process essentially comprises the following stages:
    - obtaining 100 of a card body;
    - Formation 300 of at least one cavity 13, 13 'in the card body 1; placement 400 of the impression module 2 in the cavity.
    Depending on the application of the electronic card, obtaining the card body 1 includes:
    - a substep 110 of integrating an antenna 30 on the intermediate layer; and or
    - a substep 110 ’of integrating a connection circuit allowing the fingerprint module to be connected to the second module 3.
    The integration of the antenna and / or the connection circuit is implemented by means of a specific layer assembled with the other layers of the card body.
    Advantageously, the card body 1 is obtained (step 120) by means of a process for laminating the different layers constituting the card body 1: protective layers, layers on which the visual of the card including the mark is printed. alignment and the inner interconnection layer which can carry the antenna for a so-called contactless or DUAL operating mode.
    The parameters of this process are dependent on the materials used but and can vary from temperatures below 100 ° C for a few seconds to temperatures of more than 180 ° C for 20 minutes at different pressures. The aim of the operation is to obtain a homogeneous structure with adhesion of the different layers to each other in accordance with ISO 781 ID1 standard. During this process, the tactile mark can be generated using previously engraved lamination plates.
    If this is not the case during the lamination, in addition, a step of printing the tactile mark is implemented. The laminated layers are then printed using a tactile varnish. The process used is that of screen printing in order to obtain a thickness sufficient to obtain a feel while remaining within a thickness conforming to the standard (50 μm). Depending on the visual printed on the card, we can also consider adding this tactile mark by 5 etching using a laser. Dark visuals will be preferred to clear visuals to use this technology that masks the material of dark traces.
    In addition, before placing the module or modules in the cavities formed, the method comprises a step 200 of obtaining at least one recess in the card body from the cavity towards the intermediate layer. The recess (s) 10 allow the necessary connections to be made from the module (s) to the interconnection layer.
    权利要求:
    Claims (15)
    [1" id="c-fr-0001]
    1. Flexible electronic card including:
    a card body (1) comprising an upper surface (11) and a lower surface (12);
    - at least one cavity (13, 13 ’) formed in the card body opening out from the upper surface;
    a fingerprint module (2) configured to acquire a fingerprint of a user, the fingerprint module being housed in the cavity (13) and is flush with the upper surface of the card body; the imprint module (2) comprising a flexible substrate (22) comprising an active part (21) known as of capture flush with the upper surface of the card body and a microcontroller (23) disposed below the substrate.
    [2" id="c-fr-0002]
    2. Electronic card according to claim 1, in which the fingerprint module (2) further comprises connection pads intended to connect said fingerprint module to an antenna (30) or to a second module (3).
    [3" id="c-fr-0003]
    3. Electronic card according to one of the preceding claims, in which the cavity (13, 13 ') has a maximum depth such that the distance between the lower surface of the card body and the bottom of the cavity is greater than or equal to 160 pm.
    [4" id="c-fr-0004]
    4. Electronic card according to one of the preceding claims, in which the cavity (13, 13 ′) has a three-dimensional internal profile so as to follow the internal relief of the imprint module (2), the cavity comprising at least one stop. configured to limit deformation of the module housed in the cavity.
    [5" id="c-fr-0005]
    5. Electronic card according to one of the preceding claims, comprising two cavities (13, 13 ’), one cavity housing the fingerprint module, the other cavity housing a second module (3) typically banking or access.
    [6" id="c-fr-0006]
    6. Electronic card according to one of the preceding claims, in which the card body (1) comprises an intermediate layer, called an interconnection layer, of conductive material on which an antenna is integrated.
    [7" id="c-fr-0007]
    7. Electronic card according to claim 5, in which the card body (1) comprises an intermediate layer, called an interconnection layer, of semiconductor material on which a circuit, configured to connect the imprint module to the second module (3)
    [8" id="c-fr-0008]
    8. Electronic card according to the preceding claim, comprising recesses formed from the at least one cavity towards the interconnection layer.
    [9" id="c-fr-0009]
    9. Electronic card according to one of claims 1 to 8, in which the card body comprises from the upper surface to the lower surface the following laminated layers:
    an upper transparent protective layer (13);
    a first PVC substrate (14);
    the so-called interconnection intermediate layer (15);
    a second PVC substrate (16);
    a transparent protective lower layer (17).
    [10" id="c-fr-0010]
    10. Electronic card according to one of the preceding claims, further comprising a touch mark (4) and / or an alignment mark (5) disposed on the upper surface of the card body near the module (2 ) fingerprint, said tactile mark being configured to allow correct positioning of a finger on the fingerprint module (2).
    [11" id="c-fr-0011]
    11. Method for manufacturing an electronic card according to one of the preceding claims, comprising steps of
    - obtaining (100) a card body;
    - Formation (300) of at least one cavity (13, 13 ’) in said card body; placement (400) of an imprint module (2) in the cavity, the imprint module (2) comprising a flexible substrate (22) comprising an active part (21) said to capture flush with the upper surface of the body card and a microcontroller (23) disposed below the substrate.
    [12" id="c-fr-0012]
    12. The manufacturing method according to claim 11, wherein the step of obtaining the card body comprises a substep (110) of integration of an antenna on the intermediate layer (15).
    [13" id="c-fr-0013]
    13. The manufacturing method according to one of claims 11 to 12, comprising obtaining (200) two cavities in the card body (1), and placing (400) the imprint module in one of the two cavities. and placing a second module (3) in the other cavity, the step of obtaining (100) the body (1) of the card further comprises a step of integrating (110 ') a circuit ( 40) connection configured to connect the fingerprint module (2) to the second module (3).
    [14" id="c-fr-0014]
    14. The manufacturing method according to one of claims 11 to 13, wherein the step (100) of obtaining the card body (1) comprises a sub-step (110) of hot lamination of the layer (13 ) upper, the first substrate (14), the intermediate layer (15) and the lower layer (17).
    [15" id="c-fr-0015]
    15. The manufacturing method according to one of claims 11 to 14, comprising a step (200) of obtaining at least one recess in the card body from the cavity to the intermediate layer.
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    同族专利:
    公开号 | 公开日
    PL3432221T3|2022-01-24|
    CN109271835A|2019-01-25|
    US10769405B2|2020-09-08|
    US20190019005A1|2019-01-17|
    EP3432221A1|2019-01-23|
    EP3432221B1|2021-11-03|
    FR3069081B1|2021-08-20|
    引用文献:
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    US10395164B2|2016-12-15|2019-08-27|Fingerprint Cards Ab|Fingerprint sensing module and method for manufacturing the fingerprint sensing module|USD855617S1|2017-01-17|2019-08-06|David Williams|Smart card|
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    法律状态:
    2019-01-18| PLSC| Publication of the preliminary search report|Effective date: 20190118 |
    2020-06-23| PLFP| Fee payment|Year of fee payment: 4 |
    2021-06-23| PLFP| Fee payment|Year of fee payment: 5 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1756763A|FR3069081B1|2017-07-17|2017-07-17|ELECTRONIC CARD INCLUDING A FOOTPRINT SENSOR AND METHOD FOR MANUFACTURING SUCH A CARD|
    FR1756763|2017-07-17|FR1756763A| FR3069081B1|2017-07-17|2017-07-17|ELECTRONIC CARD INCLUDING A FOOTPRINT SENSOR AND METHOD FOR MANUFACTURING SUCH A CARD|
    PL18305953T| PL3432221T3|2017-07-17|2018-07-13|Electronic card comprising a fingerprint sensor and method of manufacturing such a card|
    EP18305953.4A| EP3432221B1|2017-07-17|2018-07-13|Electronic card comprising a fingerprint sensor and method of manufacturing such a card|
    CN201810778810.8A| CN109271835A|2017-07-17|2018-07-16|Electron plate and its manufacturing method with fingerprint capturer|
    US16/038,090| US10769405B2|2017-07-17|2018-07-17|Electronic card comprising a fingerprint sensor and method of manufacturing such a card|
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