• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Device for cooling a flow of cryogenic fluid, especially for the condensation of a gas within a mixture of fluid (s) (gas and / or liquid), the device (1) comprising a cryo-cooler (2) ) having a cold head (3) provided with an exchange surface (4), the exchange surface (4) of the cold head (3) being in heat exchange with a heat exchanger comprising a mass (5) of thermal conductive material, the mass (5) of conductive material being in heat exchange with the flow of cryogenic fluid to be cooled, characterized in that the cryogenic fluid circuit to be cooled comprises a pipe (6) for supplying a flow fluid for thermally exchanging with the mass (5) of conductive material and a pipe (7) for recovering the thermally exchanged fluid flow with the mass (5) of conductive material
    公开号:FR3064730A1
    申请号:FR1752916
    申请日:2017-04-04
    公开日:2018-10-05
    发明作者:Fabien Durand；Pierre BARJHOUX；Martin Staempflin；Patrick Bravais
    申请人:Air Liquide SA；LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude；
    IPC主号:
    专利说明:

    Holder (s): AIR LIQUIDE, ANONYMOUS COMPANY FOR THE STUDY AND EXPLOITATION OF GEORGES CLAUDE PROCESSES Société anonyme.
    Extension request (s)
    Agent (s): AIR LIQUIDE.
    DEVICE AND METHOD FOR COOLING A FLOW OF CRYOGENIC FLUID.
    FR 3 064 730 - A1
    Device for cooling a flow of cryogenic fluid, in particular for the condensation of a gas within a mixture of fluid (s) (gas and / or liquid), the device (1) comprising a cryo-cooler (2 ) comprising a cold head (3) provided with an exchange surface (4), the cold head exchange surface (4) (3) being in heat exchange with a heat exchanger comprising a mass (5) of thermal conductive material, the mass (5) of conductive material being in heat exchange with the flow of cryogenic fluid to be cooled, characterized in that the circuit of cryogenic fluid to be cooled comprises a pipe (6) for supplying a flow fluid intended to thermally exchange with the mass (5) of conductive material and a pipe (7) for recovering the flow of fluid having thermally exchanged with the mass (5) of conductive material

    The invention relates to a device for cooling a cryogenic fluid.
    The invention relates more particularly to a device for cooling a flow of cryogenic fluid, in particular for the condensation of a gas within a mixture of fluid (s) (gas and / or liquid), the device comprising a cryocooler comprising a cold head provided with an exchange surface, the exchange surface of the cold head being in heat exchange with a heat exchanger comprising a mass of thermal conductive material, the mass of conductive material being in heat exchange with the flow of cryogenic fluid to be cooled.
    The invention relates in particular to a device for cooling a cryogenic fluid composed of a gaseous or partly liquid mixture.
    In particular, the invention may advantageously relate to the condensation of neon in a flow of a mixture of helium and neon in which the mixture is brought close to the triple point of the Neon (24.5 K).
    This invention can be applied to any type of mixture for which it is desired to cool, or even condense, one or more constituents, by heat exchange with a flat cold surface. This invention has a large developed exchange surface in a small footprint.
    The known solutions of cooling devices for producing such condensation, although satisfactory, are either expensive / complex or have insufficient efficiency.
    An object of the present invention is to overcome all or part of the drawbacks of the prior art noted above.
    To this end, the device according to the invention, furthermore in accordance with the generic definition given in the preamble above, is essentially characterized in that the cryogenic fluid circuit to be cooled comprises a supply line of a fluid flow intended to exchange thermally with the mass of conductive material and a pipe for recovering the flow of fluid having thermally exchanged with the mass of conductive material.
    Furthermore, embodiments of the invention may include one or more of the following characteristics:
    the mass of conductive material consists at least in part of a metallic material, in particular copper, a copper alloy, aluminum or an aluminum alloy,
    the mass of conductive material is brought into contact with the exchange surface of the cold head and a layer of gilding and / or of gold and / or indium alloy and / or thermal grease is interposed between the mass of conductive material and the exchange surface of the cold head
    - at least one of the surfaces in contact with the mass of conductive material and the exchange surface of the cold head each have a gilding having a thickness of between 0.1 μm and 100 μm,
    - the cryogenic fluid circuit to be cooled comprises a coil conveying the flow of fluid to be cooled, said coil being wound around the mass of conductive material between the supply line and the recovery line,
    - the coil is wrapped around the mass of conductive material from a first lower end opposite the exchange surface to a second upper end adjacent to the exchange surface,
    the coil consists of a conduit made of thermal conductive material, in particular metallic, in particular copper, a copper alloy, aluminum or an aluminum alloy,
    the coil is fixed by brazing to the mass of conductive material and / or by welding and / or mechanical attachment, in particular mechanical tightening,
    the turns of the coil wound around the mass of conductive material are housed in respective grooves formed on the peripheral surface of the mass of conductive material,
    - the mass of conductive material comprises at least one of, at least one bore or thread provided for a fixing screw on the cold head, at least one bore provided for a temperature sensor, at least one bore provided for a member heating such as a heating resistor,
    - the mass of conductive material has a general shape of a cylinder whose central longitudinal axis and the generatrices are perpendicular to the exchange surface of the cold head.
    The invention also relates to a method of condensing neon in a gas mixture flow containing neon and helium in gaseous form in which the gas flow is cooled in a device according to any one of the characteristics below. -above or below at a temperature less than or equal to the condensation temperature of the neon.
    The invention may also relate to any alternative device or process comprising any combination of the above or below characteristics.
    Other particularities and advantages will appear on reading the description below, made with reference to the figures in which:
    FIG. 1 represents a side view, schematic and partial, illustrating an example of structure and operation of an example of a cooling device according to the invention,
    FIG. 2 represents a cross-sectional view along the line BB of FIG. 1,
    FIG. 3 represents a view in vertical longitudinal section along the line AA in FIG. 2.
    The cooling device 1 illustrated in the figures comprises a cryocooler 2 comprising a cold head 3 provided with a terminal exchange surface 4.
    The exchange surface 4 of the cold head 3, for example forms a disc in heat exchange with a heat exchanger comprising a mass 5 of thermal conductive material.
    The mass 5 of conductive material has for example a generally cylindrical shape whose end (upper face) is in contact with the terminal end 4 of the cold head 3.
    For example, the mass 5 of conductive material consists at least in part of a metallic material, for example copper or aluminum or a copper or aluminum alloy.
    Contact between the cold head 4 and the mass 5 can be achieved by mechanical tightening, by brazing (filler alloy based on tin or silver for example) or by welding.
    Preferably, the contact between the cold head and the mass 5 is made by mechanical clamping. For example, as illustrated in FIGS. 2 and 3, the mass 5 of conductive material may comprise a plurality of bores or tappings 11 arranged around the center of the mass and provided for fixing screws on the cold head 3.
    At least part of the rest of the body of the mass 5 of conductive material is in heat exchange with the flow of cryogenic fluid to be cooled.
    The device 1 comprises a cryogenic fluid circuit to be cooled comprises a line 6 for supplying a flow of fluid intended to thermally exchange with the mass 5 of conductive material and a line 7 for recovering or discharging the flow of fluid having heat exchanged with the mass 5 of conductive material.
    According to an advantageous feature, the mass 5 of conductive material can be brought into contact with the exchange surface 4 of the cold head 3 by interposing a layer 8, 9 of a material significantly improving the contact resistance between 4 and 5 ( gilding by electrochemical deposition or filler (“fillers” (of gold or indium alloys for example and / or thermal grease) between the mass 5 of conductive material and the exchange surface 4 of the cold head 3 .
    The thermal grease can for example be a grease type material for use under high vacuum.
    For example, the two surfaces in contact with the mass 5 of conductive material and the exchange surface 4 of the cold head 3 may each have a layer or gilding having a thickness of between 0.1 μm and 100 μm. Of course, as a variant, a single layer of gilding can also be provided on one of the two faces.
    This reduces the contact resistance with the cold surface. The efficiency of device 1 is improved. In addition, this also limits the risk of local corrosion / oxidation.
    As illustrated, the cryogenic fluid circuit to be cooled advantageously comprises a coil 10 conveying the flow of fluid to be cooled between the supply 6 and recovery 7 pipes.
    The coil 10 is wound around the mass 5 of conductive material between the supply line 6 and the recovery line 7.
    Preferably, the coil 10 is wound around the mass 5 of conductive material from a first lower end opposite the exchange surface 4 to a second upper end adjacent to the exchange surface 4 (i.e. say basic at the top in Figure 1). In other words, depending on the direction of circulation of the fluid in the coil 10, the fluid approaches the cold head 3 by traversing the peripheral surface of the mass 5 of conductive material.
    Preferably, the coil 10 consists of a conduit made of thermal conductive material, in particular metallic, in particular copper (or a copper alloy) or aluminum (or an aluminum alloy).
    In addition, the coil 10 can be fixed by brazing (based on tin or silver), mechanical welding or mechanical holding system (for example an outer casing in tight assembly surrounding the peripheral coil), on the mass 5 of conductive material.
    Furthermore, and as visible in FIG. 3, the turns of the coil 10 wound around the mass 5 of conductive material can be housed in respective grooves formed on the peripheral surface of the mass 5 of conductive material.
    This structure allows a significant efficiency of exchanges. In particular, the materials of the mass 5 and of the coil 10 can be selected to have a maximum thermal conductivity at operating temperatures in the case in particular of copper (strong increase in thermal conductivity between 4K and 40K) or aluminum, and thus minimizing the associated thermal resistances.
    The exchanger can be manufactured, for example, at least in part using silver or tin solder: Copper type CuC1 (coil) on Copper type CuC2 (mass), for example.
    As shown in Figure 3, a bore 12 or blind hole can be provided to accommodate a temperature sensor.
    The temperature sensor can be provided for regulating a heating member such as a heating resistor housed in a central bore 13 to finely regulate the temperature of the mass 5 and therefore control the cooling temperature.
    Thus, while being simple and reliable in structure, the device has great efficiency, in particular for condensing neon contained in a stream of helium and neon.
    权利要求:
    Claims (11)
    [1" id="c-fr-0001]
    1. Device for cooling a flow of cryogenic fluid, in particular for the condensation of a gas within a mixture of fluid (s) (gas and / or liquid), the device (1) comprising a cryo-cooler (2) comprising a cold head (3) provided with an exchange surface (4), the surface (4) for exchanging the cold head (3) being in heat exchange with a heat exchanger comprising a mass ( 5) of thermal conductive material, the mass (5) of conductive material being in heat exchange with the flow of cryogenic fluid to be cooled, characterized in that the cryogenic fluid circuit to be cooled comprises a line (6) for supplying a fluid flow intended to thermally exchange with the mass (5) of conductive material and a pipe (7) for recovering the flow of fluid having thermally exchanged with the mass (5) of conductive material.
    [2" id="c-fr-0002]
    2. Device according to claim 1, characterized in that the mass (5) of conductive material consists at least in part of a metallic material, in particular copper, a copper alloy, aluminum or a aluminum alloy.
    [3" id="c-fr-0003]
    3. Device according to claim 1 or 2, characterized in that the mass (5) of conductive material is brought into contact with the surface (4) for exchanging the cold head (3) and in that a layer ( 8, 9) of gilding and / or alloy of gold and / or indium and / or thermal grease is interposed between the mass (5) of conductive material and the surface (4) of exchange of the head cold (3).
    [4" id="c-fr-0004]
    4. Device according to claim 3, characterized in that at least one of the surfaces in contact with the mass (5) of conductive material and the surface (4) for exchanging the cold head (3) each comprise a gilding having a thickness between 0.1 μm and 100 μm.
    [5" id="c-fr-0005]
    5. Device according to any one of claims 1 to 4, characterized in that the cryogenic fluid circuit to be cooled comprises a coil (10) conveying the flow of fluid to be cooled, said coil (10) being wound around the mass (5) of conductive material between the supply line (6) and the recovery line (7).
    [6" id="c-fr-0006]
    6. Device according to claim 5, characterized in that the coil (10) is wound around the mass (5) of conductive material from a first lower end opposite the exchange surface (4) to a second upper end adjacent to the exchange surface (4).
    [7" id="c-fr-0007]
    7. Device according to claim 5 or 6, characterized in that the coil (10) consists of a duct made of thermal conductive material, in particular metallic, in particular copper, a copper alloy, aluminum or '' an aluminum alloy.
    [8" id="c-fr-0008]
    8. Device according to claim 7, characterized in that the coil (10) is fixed by brazing on the mass (5) of conductive material and / or by welding and / or mechanical attachment including mechanical tightening.
    [9" id="c-fr-0009]
    9. Device according to any one of claims 5 to 8, characterized in that the turns of the coil (10) wound around the mass (5) of conductive material are housed in respective grooves formed on the peripheral surface of the mass (5) of conductive material.
    [10" id="c-fr-0010]
    10. Device according to any one of claims 1 to 9, characterized in that the mass (5) of conductive material comprises at least one of, at least one bore or internal thread (11) provided for a fixing screw on the cold head (3), at least one bore (12) provided for a temperature sensor, at least one bore (13) provided for a heating member such as a heating resistor.
    [11" id="c-fr-0011]
    11. A method of condensing neon in a gas mixture flow containing neon and helium in gaseous form in which the gas flow is cooled in a device according to any one of claims 1 to 10 to a temperature less than or equal to the neon condensing temperature.
    1/1
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    同族专利:
    公开号 | 公开日
    FR3064730B1|2021-01-01|
    CN108917290A|2018-11-30|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
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    US3360955A|1965-08-23|1968-01-02|Carroll E. Witter|Helium fluid refrigerator|
    JP2005083588A|2003-09-04|2005-03-31|Taiyo Toyo Sanso Co Ltd|Helium gas liquefying device, and helium gas recovering, refining and liquefying device|
    US20090094992A1|2007-10-10|2009-04-16|Cryomech, Inc.|Gas liquifier|
    US20160231049A1|2015-02-03|2016-08-11|University Of Central Florida Research Foundation|Hydrogen liquefaction device|
    WO2010033373A2|2008-09-18|2010-03-25|Nellcor Puritan Bennett Llc|Compact cryogenic cooling chamber for oxygen liquefaction system|
    CN101655428B|2009-09-03|2011-09-14|华中科技大学|Cooling device based on G-M refrigerating machine|
    CN201975194U|2010-11-10|2011-09-14|安徽万瑞冷电科技有限公司|Helium liquefaction condenser structure for low temperature superconducting magnet device|
    CN204084931U|2014-10-16|2015-01-07|中国船舶重工集团公司第七研究院|A kind of cryogenic magnet refrigeration machine one-level cold head cold conduction device|CN110658870A|2019-09-25|2020-01-07|北京雪迪龙科技股份有限公司|Fluid temperature control system and method thereof, and device for controlling fluid temperature|
    CN111735924A|2020-07-13|2020-10-02|上海安杰环保科技股份有限公司|Measuring instrument for measuring chemical oxygen demand|
    CN111707527A|2020-07-13|2020-09-25|上海安杰环保科技股份有限公司|Quick cooling device of digestion device for determining chemical oxygen demand|
    法律状态:
    2018-04-20| PLFP| Fee payment|Year of fee payment: 2 |
    2018-10-05| PLSC| Search report ready|Effective date: 20181005 |
    2019-04-18| PLFP| Fee payment|Year of fee payment: 3 |
    2020-04-20| PLFP| Fee payment|Year of fee payment: 4 |
    2021-04-23| PLFP| Fee payment|Year of fee payment: 5 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1752916A|FR3064730B1|2017-04-04|2017-04-04|DEVICE AND METHOD FOR COOLING A CRYOGENIC FLUID FLOW|
    FR1752916|2017-04-04|FR1752916A| FR3064730B1|2017-04-04|2017-04-04|DEVICE AND METHOD FOR COOLING A CRYOGENIC FLUID FLOW|
    CN201810288722.XA| CN108917290A|2017-04-04|2018-04-03|For cooling down the device and method of cryogen stream|
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