• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a chip card (1) having a plastic card body and having at least one functionality managed by a controller (18) and a power supply device, such as a battery (19). . Various components, such as a bank transaction chip (16), a biometric feature sensor (5), a display device, etc. are integrated in modules placed in cavities (6, 7) formed in constituent layers (8, 10) of the body of the card (1). The invention also relates to a method of manufacturing such a smart card.
    公开号:FR3063555A1
    申请号:FR1751760
    申请日:2017-03-03
    公开日:2018-09-07
    发明作者:Yean Wei Yeap；Christophe Mathieu
    申请人:Linxens Holding SAS；
    IPC主号:
    专利说明:

    Holder (s): LINXENS HOLDING Simplified joint-stock company.
    Extension request (s)
    Agent (s): INNOVATION COMPETENCE GROUP.
    CHIP CARD AND METHOD FOR MANUFACTURING A CHIP CARD.
    FR 3,063,555 - A1 f5g) The invention relates to a smart card (1) comprising a plastic card body and having at least one functionality managed by a controller (18) and a device for supplying electrical energy, such as a battery (19). Various components, such as a chip for banking transactions (16), a biometric characteristics sensor (5), a display device, etc. are integrated into modules placed in cavities (6, 7) formed in constituent layers (8, 10) of the body of the card (1).
    The invention also relates to a method of manufacturing such a smart card.

    i
    Smart card and method for manufacturing a smart card [ooi] The invention relates to the field of smart cards. Chip cards are well known to the public, which has many uses: payment cards, SIM cards for mobile phones, transport cards, identity cards, etc.
    Smart cards include transmission means for transmitting data from an electronic chip (integrated circuit) to a card reader device (reading), or from this à la carte device (writing). These transmission means can be "contact", "contactless" or dual-interface, in particular "dual", when they combine the two previous means.
    Chip cards are generally made up of a rigid card body made of PVC, PVC / ABS, PET or polycarbonate type plastic, constituting the bulk of the card, in which an electronic module is incorporated. The electronic module generally comprises a flexible printed circuit provided with an electronic chip and contact pads electrically connected to connection pads of the chip. The contact areas are flush with the electronic module, on the surface of the card body, for connection by electrical contact with a card reader device. Dual interface, and in particular “dual” smart cards, also include at least one antenna for transmitting data between the chip and a radio frequency system enabling data to be read or written without contact.
    In “dual” cards, the electronic module comprising contacts and the chip, on the one hand, and the antenna possibly integrated into a support (“inlay” according to English terminology), on the other hand , are usually made separately. Then the antenna and its possible support are laminated with at least one other sheet of plastic, to form the body of the card. A cavity is then milled in the body of the card and the module is housed in this cavity and connected to the antenna.
    In order to provide other functions to smart cards, a method of manufacturing a smart card is proposed according to the invention in which
    at least one upper sheet, one lower sheet and one intermediate sheet comprising at least one conductive circuit are provided,
    - the upper, lower and intermediate sheets are laminated together, to form a plastic card body,
    - A first cavity is made in the thickness of the card body to place a first module there and connect it to the conductive circuit, [006] According to this method, there is also produced at least a second cavity in the thickness of the body of card, for example by milling after lamination or cutting of one of the sheets before lamination, to place therein at least a second module comprising an electronic component, and to connect this second module to the conductive circuit intended to be connected to the first module or to another conductive circuit.
    [007] Thus, thanks to the invention, it is possible to add at least one other functional module to a smart card. This additional module can be connected to a conductive circuit laminated in the card body before or after lamination. In all cases, a surface of the modules is flush with the surface of the card for example to establish electrical contact, or to allow interaction with a user (for fingerprint detection, to display information, to exert pressure on a push button, etc.), or for any other function which requires that a part of the module is not embedded in the card body. A module is, for example, a substrate, consisting of a layer of flexible dielectric material, supporting at least one electronic component. A module can be an electronic component, such as a biometric characteristics sensor, or a display device, or a push button, etc. A module can also include a device for supplying electrical energy, electrically connected to the electronic component. This electrical energy supply device can be a battery - possibly rechargeable by photovoltaic effect - or a capacity discharging on demand its electric charge, stored thanks to an electromagnetic coupling between an antenna connected to this capacity (called "super-capacity" ) and the antenna of a contactless reader. In other cases, the module does not have its own power supply system and it is the contact reader which supplies the energy necessary for the operation of the components when the card is inserted into this reader.
    The method according to the invention optionally includes one or the other of the following characteristics considered in isolation or in combination with one or more others: [ooio] - the upper, lower and intermediate sheets are laminated together before place a module in one of the cavities;
    [ooii] - we cut at least one cavity in at least one of the upper and lower sheets, before placing a module in this cavity;
    - at least one cut is made in one of the lower and upper sheets, they are laminated with the intermediate sheet to form the card body, then a module is placed in a cavity corresponding to this cut;
    - A module is placed on the intermediate sheet, a cut is made at this module, in one of the lower and upper sheets, then the lower, upper and intermediate sheets are laminated together to form the card body ;
    - It provides an electrical energy supply device on a module and it is electrically connected to an electronic component supported by this module, before placing, in its cavity, the module which supports the energy supply device electrical and electronic component and to connect this module to a conductive circuit possibly including active and / or passive components reported;
    - We provide a device for supplying electrical energy to the intermediate sheet and it is connected to the conductive circuit before laminating the upper, lower and intermediate sheets together;
    - On the conductive circuit, at least two connection pads are produced, each comprising a first and a second portion electrically connected to each other, and the second portion of each connection pad is connected to a module;
    - connecting the first portion of each connection pad to an antenna;
    - Using at least one connection unit attached to the intermediate sheet to connect a module to an electrical circuit.
    According to another aspect, the invention relates to a smart card comprising a plastic card body with a cavity formed in the thickness of the card body and with a module housed in this cavity, this module being connected to a conductive circuit inserted in the card body. This card also comprises at least one other cavity formed in the thickness of the card body, with another module housed in this other cavity, this other module being connected to a conductive circuit intended to be connected to one of the modules or to both modules.
    The smart card according to the invention optionally includes one or the other of the following characteristics considered in isolation or in combination with one or more others: [0021] - a first and a second cavity are provided in the thickness of the card, the first cavity housing a first module having contacts flush with the surface of the card and being intended to establish an electrical connection with a card reader device, and the second cavity housing a second module comprising a powered electronic component by an electrical energy supply device;
    - the first module comprises an integrated circuit electrically connected to the contacts and managing at least one first function, - the electronic component of the second module is connected to a microcontroller making it possible to control at least one additional function different from a first function performed by the first module;
    - the additional function is chosen from the list comprising the reading of biometric characteristics, the communication by radio link at short distance, the radio communication of Wifi, Bluetooth or ZigBee type, the management of card verification values, the display of data on a display device, switching on and off of a light device;
    - the first and second modules are electrically connected via a flexible electrical circuit laminated with at least one other sheet constituting the card; - the flexible electrical circuit includes an antenna;
    -A biometric sensor is supported by a module housed in a cavity and this sensor opens or closes at least part of an electrical circuit comprising the antenna, depending on biometric information that it detects.
    Other features and advantages of the invention will appear on reading the detailed description which follows, as well as in the accompanying drawings. In these drawings:
    - Figure 1 shows schematically in perspective an embodiment of a smart card according to the invention;
    - Figure 2 shows schematically in perspective and in an exploded manner the embodiment of the smart card shown in Figure 1;
    - Figure 3 shows schematically in section the embodiment of the smart card shown in Figures 1 and 2;
    - Figure 4 shows, similarly to Figure 3, a second exemplary embodiment of a smart card according to the invention;
    - Figure 5 shows similarly to Figures 3 and 4, a third exemplary embodiment of a smart card according to the invention;
    - Figure 6 shows similarly to Figures 3 to 5, a fourth exemplary embodiment of a smart card according to the invention;
    - Figure 7 shows, seen from above, a conductive interconnection circuit used in the composition of an intermediate sheet intended to be inserted in the body of a smart card according to the embodiment of Figure 6;
    - Figure 8 shows, seen from below, the conductive circuit of Figure 7;
    FIGS. 9 and 10 are an exploded view, respectively seen from above and seen from below, of a set of sheets forming the smart card according to the embodiment of FIG. 6.
    In this document the terms "front", "rear", "above", "below", etc. are purely conventional and, where appropriate, refer to the orientations as shown in the figures.
    FIG. 1 shows a first exemplary embodiment of a smart card 1 according to the invention. This smart card 1 comprises a card body 2, a first module 3 and a second module 4.
    The first module 3 is for example of the banking type and corresponds to the ISO 7816 standard. The second module 4 comprises for example a sensor of biometric characteristics 5 (see also Figure 3), of fingerprints in this case. The biometric characteristics sensor 5 is for example marketed by Fingerprints cards AB®, NEXT Biométries® or IDEX®.
    The first 3 and second 4 modules are housed in cavities 6, 7 made in the card body 2 (see Figure 2). One and / or the other of these cavities 6, 7 can be milled from one of the faces of the card body 2 after it has been produced by laminating several sheets 8, 9, 10 of plastic material (figure 3). Alternatively, one and / or the other of these cavities 6, 7 are cut from a sheet 10 of plastic material before it is laminated with other sheets 8, 9 of plastic material to form the body of card 2 (see figure 2).
    The card shown in Figure 2 is of the "dual" type. The electronic chip of the first module 3 is connected both to the contacts 11 flush with the surface of the card 1 (see FIG. 1) and to an antenna 12 (see FIG. 2). It can operate in “with” or “contactless” mode. It comprises at least one lower sheet 8, an intermediate sheet 9 forming an antenna support (also called an "inlay" according to English terminology), and an upper sheet 10. Each of these three sheets 8, 9, 10 can possibly be made up of several sub-layers (for example, the lower 8 and upper 10 sheets may include a finishing layer, a printing layer, etc.).
    The lower 8 and upper 10 sheets, for example, consist of one or more layers of PVC. The intermediate sheet 9 is generally itself, in known manner, composed of one or more layers on, or between, which is integrated an antenna 12 wired or engraved in a metal sheet. The different layer or layers constituting the intermediate sheet 9 are for example also made of PVC.
    The antenna 12 comprises for example a conductive line wound on several loops or turns extending around the periphery of the card 1.
    In the example shown in Figure 2, the turns of the antenna 12 are interrupted on two connection areas 13, 14: a first connection area 13 located at the first cavity 6, to connect the first module 3 to the antenna 12, and a second connection zone 14 located at the second cavity 7 for connecting the second module 4 to the antenna 12. The connection between the conductive line of the antenna 12 and the first 3 and the second 4 modules is produced, for example, using solder drops, conductive paste, an anisotropic conductive film, or any other suitable material.
    So, in this example, the conductive line of the antenna 12 is used both as a conductive circuit for wiring, or interconnection, to connect the first 3 and second 4 modules together and both to ensure the antenna function required to use the card in "contactless" mode.
    The opening or closing of the conductive circuit consisting of the conductive line of the antenna 12 is controlled by the second module 4. More specifically, the closure of this interconnection circuit can only be achieved if the footprint digital of a holder authorized to use the card 1 is recognized by the biometric sensor 5 supported by the second module 4. In FIG. 3, the body of the card 2 is shown after laminating the lower 8 and upper 10 sheets , sandwiching the intermediate sheet 9. This card body 2 comprises the two cavities 6, 7 for example produced by milling in order to expose the first 13 and second 14 connection areas of the antenna.
    In this figure, the first 3 and second 4 modules are positioned respectively above the first 6 and second 7 cavities, in which they will be housed. The first 3 and second 4 modules comprise for example a support 15 made of a flexible dielectric material (epoxy glass). On the front face of this support 15, the first module 3 comprises contacts 11 etched in a conductive layer (with possibly various coatings of this conductive layer in order to protect it from corrosion, to reduce its contact resistance, to improve it the visual aspect, etc.). The contacts 11 are electrically connected to an electronic chip 16 (for example of the banking type compatible with the EMV interoperability standard) and to connection pads 17 produced for example by etching a conductive layer deposited on the rear face of the support 15 The electrical connection between the contacts 11 and the electronic chip 16, on the one hand, and the connection pads 17, on the other hand can be carried out in known manner using metallized holes, conductive wires - "wire bonding ”according to the Anglo-Saxon expression, or using any other appropriate technique. The electronic chip 16 as well as its possible conducting wires are protected by encapsulation. As for the second module 4, it comprises on the front face of its support 15, a biometric sensor 5. The electrical connection between the biometric sensor 5 and the conductive circuit 12 can be carried out according to one of the methods mentioned in relation with the description of the connection of the first module 3 to the conductive circuit 12. The electrical circuit situated on the rear face of the support of the second module comprises a controller 18 and a battery 19 which can be protected by encapsulation (which is the technique represented in the figures 3 and 4, but which is not necessarily the most used to protect this type of component) or overmolding (for example using the so-called chip box or SCP technique of the Anglo-Saxon expression “Chip Scale Packaging ”), as well as connection pads 20 located outside the encapsulated or overmolded area 21. The battery 19 is for example a micro-battery of the super-capacity type marketed by I-Ten®.
    The connection between the antenna 12 and the connection pads 17, 20 located on the rear face of the first 3 and second 4 modules, can be made using one of the known types of connection: solder connection , using a solder paste or a conductive paste, or any other suitable material. Alternatively, this connection can be made using connection units such as those described in the patent application filed under the number FRI652762 and the description of which is incorporated by reference.
    The antenna 12, or other antenna dedicated to this function and / or the contacts 11 can be used to recharge the battery 19 (respectively by induction or direct contact).
    Thus, to manufacture such a card 1, one can realize on the one hand the card body 2, optionally implementing lamination steps, and on the other hand a functional module 4, possibly autonomous and comprising a power supply device 19.
    However, since the functional module 4 can be placed in a cavity in the body of the card 2 after it has been produced, the functional module is not likely to be degraded during the lamination steps.
    More particularly, with such a card 1, one can separate the stages and the elements of its manufacture which fall within the production of the body of the card and which present risks for certain functional components (and in particular for the battery 19) and the stages and the elements of its manufacture which relate to the production of the module or modules comprising the functional components to be protected. Thus, for example, a conductive circuit or an antenna can be laminated with the other sheets constituting the card body 2, while the functional module or modules are connected to the conductive circuit or to the antenna when they are placed in their cavities in the card body 2.
    Many variants can be considered in the embodiment described in connection with Figures 1 to 3. The first 3 and second 4 modules have been described above as double-sided circuits. Alternatively, they can be made using single-sided circuits, or one made in single-sided and the other in double-sided.
    Similarly, the second module 4 can include other functions in place of, or in addition to, the biometric measurement function mentioned above.
    FIG. 4 represents a card 1 comprising a first module 3 similar to that described in relation to the first embodiment, and a second module 4 integrating a chip 22 called "BLE" according to the acronym of the English expression -saxon "Bluetooth Low Energy". Other possible active or passive components, necessary for its operation, can be integrated into the second module 4, in addition to the battery 19. The “BLE” chip is for example marketed by Cypress®.
    5 shows a card also comprising a first module 3 similar to that described in connection with the first embodiment and a second module 4 incorporating a light emitting diode 23, for example intended to indicate the state of the banking transaction performed using the first module 3. Again, the energy supplied to the light emitting diode is supplied by a battery 19 located on the second module 4. Alternatively or in addition, a controller 18 can be used to trigger or not the ignition of the light-emitting diode 19 when the antenna 12 captures energy from an electromagnetic field suitable for carrying out a (banking) transaction at the level of the first module 3.
    The second module 4, or else another module similar in structure to that, may include a display device compatible for example with a "Dynamic verification code" function ("Dynamic CW" according to English terminology ) integrated in the same module, or in another, as well as a battery 19 in particular for supplying the display device. The display device is for example a device comprising an "electronic paper", called "ePaper", marketed by E-Ink ®.
    Other devices can be integrated into the card, in addition to or in place of one or the other of the devices already mentioned, either within a module such as the second module 4, or else another module similar in structure to this one: Passive components, push button (for example marketed by Nicomatic ®), etc.
    Thus, a fourth embodiment of the smart card according to the invention with a push button is shown in relation to Figures 6 to 10.
    According to this embodiment, the smart card 1 comprises a card body 2, a first module 3, a second module 4 and a third module 24. Figure 6 corresponds to a section passing through the first 3 and second 4 modules. Thus, the third module 24 does not appear, but on a section passing through this third module 24, it would be represented schematically in a manner similar to the second module 4, for example. As for the previous embodiments, the first module 3 is for example of the banking type and corresponds to the ISO 7816 standard. The second module 4 corresponds for example to a display device 35. The third module 24 corresponds for example to a button pusher.
    The smart card 1 also includes a lower sheet 8, an intermediate sheet 9 and an upper sheet 10, laminated together. The lower 8 and upper 10 sheets each respectively comprise an internal layer 25 and a finishing layer 26. Cavities 6, 7 are formed in the lower sheet 8, in the upper sheet 9 or in both. The intermediate sheet 9 comprises a conductive interconnection circuit 27. The conductive circuit 27 comprises for example a flexible substrate 28 on which electrically conductive tracks are produced, for example by etching a layer of conductive material laminated on the flexible substrate 28. The flexible substrate 28 is for example made of a polyimide . The flexible substrate 28 supports several components such as a battery 19 (Figure 7) and a microcontroller 18 (Figure 8) electrically interconnected by these conductive tracks. For example, the flexible substrate 28 has, on one side (Figure 7), connection pads 29 for connecting an antenna and connection pads for connecting a battery 19, and on ίο the other side (Figure 8) tracks and connection pads for interconnecting a display device 35, a push button 24 and a microcontroller 18.
    The connection pads 29 can be such as those made on the connection units already mentioned above and described in the patent application filed under the number FRI652762. For example, the connection pads 29 are produced on the flexible substrate 28 in the same way and at the same time as the conductive tracks. On the other hand, the connection pads 29 are not necessarily in electrical continuity with the conductive tracks. For example, connection pads 29 can be used to establish an electrical connection between an antenna and the first module 2, while other connection pads can be used to establish an electrical connection between the conductive circuit 27 and the second 4 and third 24 modules, without the antenna being connected to the conductive circuit 27. As shown in FIG. 7, two connection pads 29 intended for the connection of the first module 3 each comprise two portions 36, 37 electrically connected to each other . The outer portions 36 are intended for connection with the free ends of an antenna. The interior portions 37 are intended for connection with the first module 3.
    The antenna is described in relation to Figure 9. The antenna 12 consists of a conductive wire wound in the form of a coil, or a conductive track, with several turns and ending in two ends free. The antenna 12 is supported by a substrate 30. This substrate 30 is for example made of PVC or Polycarbonate. The antenna 12 may have been produced directly on the substrate 30 (for example by etching in a layer of conductive material laminated on the substrate 30 or by embedding in the substrate 30 - by the technology known as "wire embedding"). Alternatively, the antenna 12 is formed on a support before being transferred (without this support) to the substrate 30.
    The substrate 30 of the antenna 12 and the antenna 12, on the one hand, and the flexible substrate 28 are transferred to each other. The details of this operation are not shown. Only its result is visible in FIG. 9. Optionally, the flexible substrate 28 and / or the substrate 30 of the antenna 12 include cutouts at the location of certain components such as the battery 19, the microcontroller 18, etc. in order to compensate for an excess thickness that these could create in the card and / or limit stresses which could be generated on them during the lamination of the constituent layers of the card body 2. Optionally, compensation layers, with or without cutouts , can be added to the lower 8, intermediate 9 and upper 10 sheets for the same reasons.
    When assembling the substrate 30 and the flexible substrate 28 one on the other, the outer portions 36 of each connection pad 29 are electrically connected each respectively to one end of the antenna 12.
    The assembly comprising the flexible substrate 28 and its components as well as the substrate 30 and its antenna 12 forms the intermediate sheet 9.
    The intermediate sheet 9 is laminated between lower sheets 8 and upper 10. The set of lower sheets 8, upper 10 and intermediate 9 is shown in the figures and 10 in an exploded manner. In FIGS. 9 and 10, the lower 8 and upper 10 sheets are shown with cutouts 31 made before laminating the lower 8, upper and intermediate sheets 9. These cutouts 31 are used to receive the first 3, second 4 and third 24 modules . One or more of these cutouts 31, or even all of them, are produced in the lower 8 or upper 10 sheets, before lamination of the lower 8, upper 10 and intermediate sheets 9. In this way, one or more of the modules 3, 4 , 24, or even all, are each placed and fixed respectively in a cavity formed by a cutout 31, before or after lamination of the lower 8, upper 10 and intermediate sheets 9. For example, in FIGS. 9 and 10, the first module 3 (with the contacts for connection with a smart card reader) and the second module 4 (with the display device), are housed in the cavities 6, 7 formed by the cutouts, after laminating the lower sheets 8, upper 10 and intermediate 9, while the third module 24 is fixed and connected to the conductive circuit 28 before lamination. Alternatively, the lower 8, upper 10 and intermediate 9 sheets are laminated together, with or without prior cutting 31 and the cavities 6, 7 necessary for receiving one or more modules 3, 4 are formed by milling in the lower sheets 8 and / or higher 10. It is therefore optionally possible, for the same smart card, to produce one or more cavities by prior cutting to receive one or more modules and to produce one or more other cavities by milling after lamination, to receive one or more other modules.
    权利要求:
    Claims (17)
    [1" id="c-fr-0001]
    Claims
    1. Method for manufacturing a smart card in which
    - at least one upper sheet (10), a lower sheet (8) and an intermediate sheet (9) comprising at least one conductive circuit (12, 27) are provided,
    - the upper (10), lower (8) and intermediate (9) sheets are laminated together, to form a card body (2) made of plastic,
    - a first cavity (6) is produced in the thickness of the card body (2) to place a first module (3) there and connect it to the conductive circuit (12), characterized in that at least a second cavity (7) in the thickness of the card body (2), for placing therein at least a second module (4, 24) comprising an electronic component (5, 18, 22, 23, 35), and for connecting this second module (4) to the conductive circuit (12) intended to be connected to the first module (3) or to another conductive circuit (27).
    [2" id="c-fr-0002]
    2. Method according to claim 1, in which the upper (10), lower (8) and intermediate (9) sheets are laminated together, before placing a module (3, 4, 24) in one of the cavities (6 , 7).
    [3" id="c-fr-0003]
    3. Method according to claim 2, in which at least one cavity (6, 7) is milled in at least one of the upper (10) and lower (8) sheets, before placing a module (3, 4, 24 ) in this cavity (6, 7).
    [4" id="c-fr-0004]
    4. Method according to one of the preceding claims, wherein at least one cutout (31) is made in one of the lower (8) and upper (9) sheets, they are laminated with the intermediate sheet (9) to form the card body (2), then a module (3, 4, 24) is placed in a cavity corresponding to this cutout (31).
    [5" id="c-fr-0005]
    5. Method according to one of the preceding claims, in which a module (3, 4, 24) is placed on the intermediate sheet (9), a cutout (31) is made at this module (3, 4, 24 ), in one of the lower (8) and upper (9) sheets, then the lower (8), upper (10) and intermediate (9) sheets are laminated together to form the card body (2).
    [6" id="c-fr-0006]
    6. Method according to one of the preceding claims, in which an electrical energy supply device (19) is provided on a module (4) and it is electrically connected to an electronic component (18, 22, 23, 35) supported by this module (4), before placing, in its cavity (7), the module (4) which supports the electrical energy supply device (19) and the electronic component (18, 22, 23) and connect this module to a conductive circuit (27).
    [7" id="c-fr-0007]
    7. Method according to one of claims 1 to 6, in which an electrical energy supply device (19) is provided on the intermediate sheet (9) and it is connected to the conductive circuit (27) before laminating the upper (10), lower (8) and intermediate (9) sheets.
    [8" id="c-fr-0008]
    8. Method according to one of the preceding claims, in which one carries out, on the conductive circuit (27), at least two connection pads (29) each comprising a first and a second portion electrically connected together, and the second portion of each connection pad to a module (3, 4, 24).
    [9" id="c-fr-0009]
    9. Method according to the preceding claim, in which the first portion of each connection pad (29) is connected to an antenna (12).
    [10" id="c-fr-0010]
    10. Method according to one of claims 8 or 9, in which at least one connection unit attached to the intermediate sheet (9) is used to connect a module (3, 4, 24) to an electrical circuit (12, 27 ).
    [11" id="c-fr-0011]
    11. Chip card comprising a card body (2) of plastic material with a cavity (6, 7) formed in the thickness of the card body (2) and with a module (3, 4, 24) housed in this cavity (6, 7), this module (3, 4, 24) being connected to a conductive circuit inserted in the card body (2), characterized in that it comprises at least one other cavity formed in the thickness of the card body (2), with another module (3, 4, 24) housed in this other cavity (6, 7), this other module (3, 4, 24) being connected to a conductive circuit (12, 27 ) intended to be connected to one of the modules (3, 4, 24) or to the two modules (3, 4, 24).
    [12" id="c-fr-0012]
    12. Card according to one of the preceding claim, with a first (6) and a second (7) cavities formed in the thickness of the card (1), the first cavity (6) housing a first module (3) having contacts (11) flush with the surface of the card (1) and intended to establish an electrical connection with a card reader device, and the second cavity (7) housing a second module (4) comprising an electronic component (18, 22, 23) supplied by an electrical energy supply device (19).
    [13" id="c-fr-0013]
    13. Card according to the preceding claim, in which
    the first module (3) comprises an integrated circuit (16) electrically connected to the contacts (11) and managing at least one first function, and
    - the electronic component (18, 22) of the second module (4) is connected to a microcontroller (18) making it possible to control an additional function different from a first function performed by the first module (3).
    [14" id="c-fr-0014]
    14. Card according to the preceding claim, in which the additional function is chosen from the list comprising the reading of biometric characteristics, the communication by radio link at short distance, the radio communication of the Wifi, Bluetooth or ZigBee type, the management of values of verification of cards, display of data on a display device, switching on and off of a light device.
    [15" id="c-fr-0015]
    15. Card according to one of claims 11 to 14, in which the first (3) and the second (4) modules are electrically connected by means of a flexible electrical circuit (9) laminated with at least one other sheet. (8 or 10) constituting the card (1).
    [16" id="c-fr-0016]
    16. The card of claim 15, wherein the flexible electrical circuit (9) comprises an antenna (12).
    [17" id="c-fr-0017]
    17. Card according to claim 16, comprising a biometric sensor (5) supported by a module (4) housed in a cavity (7) and opening or closing at least part of an electrical circuit comprising the antenna (12), based on information
    5 biometric that it detects.
    1/4 3oq 35SS
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    CH700045A2|2010-06-15|Electronic card e.g. bank card, has control unit constituted of electrodes for defining screen with touch pads, where each pad is activated by finger or pen placed on contact surface opposite to pad for introducing data or command
    FR2944631A1|2010-10-22|Electronic device for use in portable telephone, for e.g. product payment operation, has battery supplying power to microcircuit, where battery is connected to card body by flexible member partially extending outside card body
    EP2095301A1|2009-09-02|Microcircuit boards for offset antenna and offset antennas
    同族专利:
    公开号 | 公开日
    CN110392894A|2019-10-29|
    EP3590075A1|2020-01-08|
    WO2018158644A1|2018-09-07|
    FR3063555B1|2021-07-09|
    KR20190122688A|2019-10-30|
    BR112019017778A2|2020-03-31|
    US20210133529A1|2021-05-06|
    AU2018227071B2|2021-11-11|
    AU2018227071A1|2019-08-29|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE19941637A1|1999-09-01|2001-03-08|Orga Kartensysteme Gmbh|Chip card and method for producing a chip card|
    DE20110585U1|2001-06-11|2001-11-15|Cubit Electronics Gmbh|Contactless transponder|
    WO2004034320A1|2002-10-11|2004-04-22|Nagraid Sa|Electronic module comprising an element exposed on one surface and method for making same|
    EP1411466A1|2002-10-17|2004-04-21|Giesecke & Devrient GmbH|Layer with functional modules for integration in a multifunctional card|
    US20110121081A1|2009-11-24|2011-05-26|Gary Beasley|Financial card having integrated balance calculation|
    FR3025634A1|2014-09-10|2016-03-11|Oberthur Technologies|ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT HAVING A DISPLAY AREA AND METHOD FOR MANUFACTURING SUCH A DEVICE|EP3663984A1|2018-12-06|2020-06-10|Thales Dis France SA|Method for manufacturing a smart card with interconnection of modules|
    EP3663983A1|2018-12-06|2020-06-10|Thales Dis France SA|Method for manufacturing a smart card, metal or not, with relay antenna|
    WO2020212661A1|2019-04-19|2020-10-22|Linxens Holding|Biometric sensor module for a smart card and method for manufacturing such a module|US8870080B2|2010-08-12|2014-10-28|Féinics Amatech Teoranta|RFID antenna modules and methods|
    KR101754095B1|2011-04-29|2017-07-05|인텔렉추얼디스커버리 주식회사|RFID tag for laundry|SG11202109820RA|2019-03-11|2021-10-28|Ellipse World Inc|Packaged electronic module and manufacturing method thereof|
    WO2022008941A1|2020-07-07|2022-01-13|Linxens Holding|A method of forming a prelam body of a smart card, a method of forming a smart card, a prelam body, and a smart card|
    法律状态:
    2018-02-19| PLFP| Fee payment|Year of fee payment: 2 |
    2018-09-07| PLSC| Publication of the preliminary search report|Effective date: 20180907 |
    2020-03-25| PLFP| Fee payment|Year of fee payment: 4 |
    2021-03-19| PLFP| Fee payment|Year of fee payment: 5 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1751760A|FR3063555B1|2017-03-03|2017-03-03|CHIP CARD AND PROCESS FOR MANUFACTURING A CHIP CARD|
    FR1751760|2017-03-03|FR1751760A| FR3063555B1|2017-03-03|2017-03-03|CHIP CARD AND PROCESS FOR MANUFACTURING A CHIP CARD|
    BR112019017778-7A| BR112019017778A2|2017-03-03|2018-03-05|METHOD FOR MAKING A CHIP CARD, AND CHIP CARD|
    EP18730099.1A| EP3590075A1|2017-03-03|2018-03-05|Chip card and method for fabricating a chip card|
    CN201880015535.2A| CN110392894A|2017-03-03|2018-03-05|Chip card and method for manufacturing chip card|
    AU2018227071A| AU2018227071B2|2017-03-03|2018-03-05|Chip card and method for fabricating a chip card|
    KR1020197025441A| KR20190122688A|2017-03-03|2018-03-05|Chip card and chip card manufacturing method|
    US16/486,967| US20210133529A1|2017-03-03|2018-03-05|Chip Card and Method for Fabricating a Chip Card|
    PCT/IB2018/000511| WO2018158644A1|2017-03-03|2018-03-05|Chip card and method for fabricating a chip card|
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