• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a power module (10) comprising: electrical equipment (12), at least a first (14) and a second (16) electronic card, and a cooling device (20), able to evacuate the heat dissipated by said electrical equipment and electronic cards. The cooling device comprises a first (34) and a second (36) thermally insulated surface from each other, the electrical equipment (12) being in thermal contact with the first surface and away from the second surface . The first electronic card (14) is attached to an electrical equipment (12) and thermally connected to the second surface (36) of the cooling device by a heat sink (42). The second electronic card (16) is disposed near the second surface (36), or in contact with said second surface.
    公开号:FR3063386A1
    申请号:FR1751602
    申请日:2017-02-28
    公开日:2018-08-31
    发明作者:Christophe AUDEMAR
    申请人:Alstom Transport Technologies SAS；
    IPC主号:
    专利说明:

    ® FRENCH REPUBLIC
    NATIONAL INSTITUTE OF INDUSTRIAL PROPERTY © Publication number: 3,063,386 (to be used only for reproduction orders) (© National registration number: 17 51602
    COURBEVOIE © Int Cl 8 : H 01 L 23/367 (2017.01), H 05 K 7/20
    A1 PATENT APPLICATION
    (§) Date of filing: 28.02.17.(30) Priority: © Applicant (s): ALSTOM TRANSPORT TECHNOLOGIES — TR. @ Inventor (s): AUDEMAR CHRISTOPHE. (© Date of public availability of the request: 31.08.18 Bulletin 18/35. (© List of documents cited in the preliminary search report: See the end of this brochure (© References to other related national documents: @ Holder (s): ALSTOM TRANSPORT TECHNOLOGIES. ©) Extension request (s): (© Agent (s): LAVOIX.
    POWER MODULE WITH ELECTRONIC BOARD COOLING SYSTEM.
    FR 3,063,386 - A1 (t ”) The present invention relates to a power module (10) comprising: electrical equipment (12), at least a first (14) and a second (16) electronic card, and a device for cooling (20), capable of removing heat dissipated by said electrical equipment and electronic cards.
    The cooling device comprises a first (34) and a second (36) thermally insulated surfaces from each other, the electrical equipment (12) being in thermal contact with the first surface and away from the second surface. . The first electronic card (14) is fixed to electrical equipment (12) and thermally connected to the second surface (36) of the cooling device by a heat sink (42). The second electronic card (16) is arranged close to the second surface (36), or in contact with said second surface.

    Power module with electronic card cooling system
    The present invention relates to a power module of the type comprising: electrical equipment, at least first and second electronic cards, and a cooling device, capable of removing heat dissipated by said electrical equipment and electronic cards.
    The electrical equipment of the power modules, such as IGBT packs, may give off significant heat during operation. The power modules are therefore typically equipped with cooling devices, as described for example in document US2011 / 0181105.
    Electronic control cards for electrical equipment are typically sensitive to high temperatures. In order for said cards to resist the heat emitted by the components of the module, the usual technical solutions consist in adapting the technology of said cards so that the latter remain functional at high temperatures.
    The object of the present invention is to propose a configuration of the module which protects electronic cards from the highest temperatures, which makes it possible to extend their service life while using less expensive technologies.
    To this end, the invention relates to a power module of the aforementioned type, in which; the cooling device comprises first and second surfaces thermally insulated from each other, the electrical equipment being in thermal contact with the first surface and away from the second surface; the first electronic card is fixed to electrical equipment, said first electronic card being thermally connected to the second surface of the cooling device by a heat sink; and the second electronic card is placed close to the second surface of the cooling device or in contact with said second surface.
    According to other advantageous aspects of the invention, the power module comprises one or more of the following characteristics, taken in isolation or in any technically possible combination:
    - The first and second surfaces of the cooling device are substantially coplanar;
    - The cooling device comprises: a cooling panel, a first face of said panel forming the first and second surfaces of the cooling device; and ventilation fins, attached to a second side of the cooling panel;
    - Each of the first and second surfaces is formed of a thermally conductive material, the cooling panel further comprising a strip of a thermally insulating material, separating said first and second surfaces;
    - The cooling panel comprises at least one slot separating the first and second surfaces, said first and second surfaces being connected to each other at the ends of said slot;
    - The heat sink comprises a strip of thermally conductive material, a first and a second end of said strip being in thermal contact, respectively with the first electronic card and with the second surface;
    - thermal contact between the first electronic card and the first end of the heat sink is provided by a layer of thermally conductive paste or foam;
    - the power module comprises at least one thermally insulating wall disposed between the second electronic card and electrical equipment;
    - one side of the thermally insulating wall, facing the electrical equipment, is covered with a layer of a material that deflects infrared radiation.
    The invention will be better understood on reading the description which follows, given solely by way of nonlimiting example and made with reference to the drawings in which:
    - Figure 1 is a schematic view, in section, of a power module according to a first embodiment of the invention; and
    - Figure 2 is a partial schematic view of a power module according to a second embodiment of the invention.
    FIG. 1 represents a power module 10 according to a first embodiment of the invention. FIG. 2 partially represents a power module 110 according to a first embodiment of the invention.
    The power modules 10 and 110 will be described simultaneously, the common elements being designated by the same reference numbers.
    The power module 10, 110 comprises electrical equipment 12 and at least a first 14 and a second 16 electronic cards. The power module 10, 110 further comprises a bus bar 18. The electronic cards 14, 16 and the bus bus 18 are not shown in FIG. 2.
    The power module 10, 110 further comprises a cooling device 20, 120, capable of removing heat dissipated by the electrical equipment 12 and the electronic cards 14, 16.
    The electrical equipment 12 is of the electronic power component type, such as IGBT components (insulated gate bipolar transistor). The electrical equipment 12 is in particular liable to give off significant heat during operation.
    The electronic cards 14, 16, represented schematically in FIG. 1, conventionally comprise a support and a plurality of electronic components connected to said support. Electronic components are also likely to generate heat during operation. Furthermore, these electronic components are generally sensitive to high temperatures.
    In the embodiments of FIGS. 1 and 2, the cooling device 20, 120 is of the fin radiator type. More specifically, the cooling device 20, 120 comprises a cooling panel 22, 122 and ventilation fins 24, 26. Said fins 24, 26 are not visible in FIG. 2.
    The cooling panel 22, 122 is substantially planar. We consider an orthonormal base (X, Y, Z), the cooling panel 22, 122 being substantially arranged in a plane (X, Y).
    The cooling panel 22, 122 has a first 30 and a second 32 faces. The ventilation fins 24, 26 are fixed to said second face 32.
    The first face 30 of the cooling panel 22, 122 has a first surface 34, called "hot zone", and a second surface 36, called "cold zone". The first 34 and second 36 surfaces are thermally insulated from each other.
    In the embodiment of FIG. 1, each of the first 34 and second 36 surfaces is formed of a thermally conductive material and the cooling panel 22 further comprises a strip 38 of a thermally insulating material, separating said first 34 and second 36 surfaces. Furthermore, the fins 24, 26 form two groups located at a distance from each other. A first group of fins 24 is fixed to the first surface 34, a second group of fins 26 is fixed to the second surface 36. Preferably, each group of fins 24, 26 is made in one piece with the surface 34, 36 of the panel to which it is attached.
    In the embodiment of Figure 2, the cooling panel 122, shown in top view, is formed in one piece. Said panel has the shape of a rectangle whose sides extend in the X and Y directions. The first surface 34 has two parts located at the ends of the panel along X, the second surface 36 being disposed between said two parts. The cooling panel 122 has two slots 140 extending along Y and separating the second surface 36 from each part of the first surface 34. Said first 34 and second 36 surfaces are nevertheless connected to each other at the ends slots 140.
    In a variant not shown, it is possible to mechanically assemble two radiators with a non-conductive joint in the middle.
    The electrical equipment 12 is fixed to the first surface 34, in thermal contact with said first surface called "hot zone". The second surface 36, known as the “cold zone”, is not in contact with the electrical equipment 12. Said second surface 36 is used to specifically cool the electronic cards 14, 16 in order to guarantee them protection against high temperatures.
    More specifically, for functional reasons, the first electronic card 14 is arranged near an electrical equipment 12. As visible in FIG. 1, said first electronic card 14 is therefore fixed to said electrical equipment.
    The busbar 18, or busbar, is an electrical conductor and is brought to be at high temperatures. The bus bar 18 is arranged above the first electronic card 14, near said card.
    The first electronic card 14 is thermally connected to the second surface 36 of the cooling panel 22, 122, by a heat drain 42. The heat drain 42 is for example formed from a strip of a thermally conductive material, a first and a second ends of said strip being in thermal contact, respectively with the first electronic card 14 and with the second surface 36. The heat sink 42 is for example made of copper or aluminum.
    The thermal contact between the first electronic card 14 and the heat sink 42 is for example provided by a layer 44 of thermally conductive paste or foam, of the "gap pad" type.
    Optionally, between its two ends, the heat sink 42 is covered with a thermally insulating sheath for convection and / or radiation. Optionally, a graphite sheet is bonded to the heat sink 42 to reinforce the thermal conduction between the first electronic card 14 and the second surface 36.
    It is considered that the second electronic card 16 has functions allowing it to be located at a distance from the electrical equipment 12. Said second electronic card 16 is therefore placed close to, or fixed to, the second surface 36 of the cooling panel 22, 122 .
    Optionally, the module 10, 110 comprises at least one thermally insulating wall 46, disposed between the second electronic card 16 and an electrical equipment 12. Preferably, one face 48 of said wall, oriented towards the electrical equipment 12, is covered with a layer of material that deflects infrared radiation.
    In the case where the module 10, 110 has a thermally insulating wall 46, it is not necessary to provide physical contact between the second electronic card 16 and the second surface 36. Indeed, the air surrounding the second electronic card 16 is cooled by the second surface 36 and remains at least partially isolated from the air surrounding the first electronic card 14, which provides a cooler environment for the second electronic card 16.
    A method of operating the module 10, 110 will now be described. The electrical equipment 12 in operation emits significant heat. This heat is diffused in the panel 22, 122 at the level of the first surface 34, then is evacuated by the fins 24. A part of this heat contributes however, by radiation and / or convection, to heat the air surrounding the first card. electronics 14. During the operation of the electrical equipment 12, the first surface 34, called the "hot zone", has a higher temperature than the second surface 36, called the "cold zone".
    Furthermore, the bus bar 18, placed above the first electronic card 14, creates a confinement of hot air around said card.
    The thermal contact between said second surface 36 and the first 14 and second 16 electronic cards, as described above, makes it possible to effectively cool said electronic cards 14, 16. The second electronic card 16 is also protected from the thermal radiation of electrical equipment. 12 by the thermally insulating wall 46.
    The exposure of electronic cards 14, 16 to the heat emitted by electrical equipment 12 is thus limited, which prolongs the life of said cards.
    权利要求:
    Claims (9)
    [1" id="c-fr-0001]
    1 Power module (10, 110) comprising:
    - electrical equipment (12),
    - at least a first (14) and a second (16) electronic card, and
    - a cooling device (20, 120), capable of removing heat dissipated by said electrical equipment and electronic cards;
    characterized in that:
    - the cooling device comprises a first (34) and a second (36) thermally insulated surfaces from each other, the electrical equipment (12) being in thermal contact with the first surface and away from the second area ;
    - The first electronic card (14) is fixed to electrical equipment (12), said first electronic card being thermally connected to the second surface (36) of the cooling device by a heat sink (42); and
    - The second electronic card (16) is arranged close to the second surface (36) of the cooling device or in contact with said second surface.
    [2" id="c-fr-0002]
    2, - Power module according to claim 1, wherein the first (34) and second (36) surfaces of the cooling device are substantially coplanar.
    [3" id="c-fr-0003]
    3. - Power module according to claim 2, in which the cooling device comprises:
    - a cooling panel (22, 122), a first face (30) of said panel forming the first and second surfaces of the cooling device; and
    - ventilation fins (24, 26), fixed to a second face (32) of the cooling panel.
    [4" id="c-fr-0004]
    4, - Power module (10) according to claim 3, wherein each of the first (34) and second (36) surfaces is formed of a thermally conductive material, the cooling panel (22) further comprising a strip ( 38) of a thermally insulating material, separating said first and second surfaces.
    [5" id="c-fr-0005]
    5. - Power module (110) according to claim 3, wherein the cooling panel (122) comprises at least one slot (140) separating the first (34) and second (36) surfaces, said first and second surfaces being connected to each other at the ends of said slot.
    [6" id="c-fr-0006]
    6. - Power module according to one of the preceding claims, in which the heat sink (42) comprises a strip of thermally conductive material, a first and a second end of said strip being in thermal contact,
    5 respectively with the first electronic card (14) and with the second surface (36).
    [7" id="c-fr-0007]
    7. - Power module according to claim 6, wherein a thermal contact between the first electronic card (14) and the first end of the heat sink (42) is provided by a layer (44) of paste or thermally foam
    10 conductive.
    [8" id="c-fr-0008]
    8. - Power module (10) according to one of the preceding claims, comprising at least one thermally insulating wall (46) disposed between the second electronic card (16) and electrical equipment (12).
    [9" id="c-fr-0009]
    9. - Power module according to claim 8, in which one face (48) of the thermally insulating wall, oriented towards the electrical equipment (12), is covered with a layer of a material which deflects infrared radiation.
    类似技术:
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    同族专利:
    公开号 | 公开日
    US10383260B2|2019-08-13|
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    CN108513494B|2021-06-04|
    CN108513494A|2018-09-07|
    FR3063386B1|2019-04-12|
    EP3367770B1|2019-07-24|
    BR102018003861A2|2019-01-22|
    US20180249591A1|2018-08-30|
    引用文献:
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    EP2658359A2|2012-04-26|2013-10-30|Hamilton Sundstrand Corporation|Thermal separation of electronic control chassis heatsink fins|
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    CN106413343B|2016-09-12|2019-04-26|华为技术有限公司|Radiator, radiator, cooling system and communication equipment|US10345874B1|2016-05-02|2019-07-09|Juniper Networks, Inc|Apparatus, system, and method for decreasing heat migration in ganged heatsinks|
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    法律状态:
    2018-02-23| PLFP| Fee payment|Year of fee payment: 2 |
    2018-08-31| PLSC| Publication of the preliminary search report|Effective date: 20180831 |
    2020-02-19| PLFP| Fee payment|Year of fee payment: 4 |
    2021-11-12| ST| Notification of lapse|Effective date: 20211005 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1751602|2017-02-28|
    FR1751602A|FR3063386B1|2017-02-28|2017-02-28|POWER MODULE WITH ELECTRONIC CARD COOLING SYSTEM|FR1751602A| FR3063386B1|2017-02-28|2017-02-28|POWER MODULE WITH ELECTRONIC CARD COOLING SYSTEM|
    US15/901,364| US10383260B2|2017-02-28|2018-02-21|Power module with cooling system for electronic cards|
    CN201810164074.7A| CN108513494B|2017-02-28|2018-02-27|Power module with electronic card cooling system|
    EP18158948.2A| EP3367770B1|2017-02-28|2018-02-27|Power module with cooling system for electronic cards|
    BR102018003861-3A| BR102018003861A2|2017-02-28|2018-02-27|power module|
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