METHOD OF INSERTING A WIRE INTO A GROOVE OF A SEMICONDUCTOR CHIP, AND EQUIPMENT FOR IMPLEMENTING SUC

专利摘要:
The invention relates to a method for inserting a wire (7a, 7b) in a longitudinal groove of a semiconductor chip (1) for assembly, the groove containing a stud (6a, 6b) consisting of a bonding material having a determined melting temperature, the method comprising: - in a placing step, arranging a longitudinal section of the wire (7a, 7b) along the groove, forcibly abutting against the stud (6a, 6b); in an insertion step, exposing an area containing at least a portion of the pad (6a, 6b) at a treatment temperature greater than the melting temperature of the bonding material and for a period of time sufficient to melt at least partially the stud (6a, 6b), and cause the insertion of the wire (7a, 7b) in the groove. The invention also relates to an equipment for implementing the insertion method.
公开号:FR3062515A1
申请号:FR1750728
申请日:2017-01-30
公开日:2018-08-03
发明作者:Emmanuel Arene；Robin Lethiecq；Pavina NGUYEN；Christopher Mackanic
申请人:Primo1d；
IPC主号:

专利说明:

Holder (s):
PRIMO1D.
O Extension request (s):
(® Agent (s): IP TRUST.
® PROCESS FOR INSERTING A WIRE IN A GROOVE OF A SEMICONDUCTOR CHIP, AND EQUIPMENT FOR IMPLEMENTING SUCH A PROCESS.
FR 3,062,515 - A1 (57) The invention relates to a method of inserting a wire (7a, 7b) into a longitudinal groove of a semiconductor chip (1) for the purpose of their assembly, the groove containing a stud (6a, 6b) made of a bonding material having a determined melting temperature, the method comprising:
- In an installation step, arrange a longitudinal section of the wire (7a, 7b) along the groove, in forced abutment against the stud (6a, 6b);
- in an insertion step, exposing an area containing at least part of the pad (6a, 6b) to a treatment temperature higher than the melting temperature of the bonding material and for a sufficient time to melt at least in part the stud (6a, 6b), and cause the insertion of the wire (7a, 7b) in the groove.
The invention also relates to equipment making it possible to implement the insertion method.

i
INSERTION PROCESS
OF A THREAD IN A GROOVE OF A CHIP OF
SEMICONDUCTOR, AND
EQUIPMENT
FOR THE IMPLEMENTATION OF SUCH
PROCESS
DOMAIN OF
THE INVENTION
The present invention relates to a method of inserting a wire into a groove of a semiconductor chip with a view to their assembly. It also relates to equipment implementing this insertion process. It finds an example of application in the field of electronic RFID labeling ("Radiofrequency Identification" according to English terminology) to directly associate an antenna with a transmit-receive chip and provide a particularly small and simple radiofrequency device Manufacturing. This device can be integrated into a textile thread and this thread itself integrated into a wide variety of objects for their identification, monitoring and administration.
TECHNOLOGICAL BACKGROUND OF THE INVENTION
For example, documents US8471713 are known,
2015230336 the technology of assembling a wire and a chip designated by the trade name
E-THREAD ™.
According to this technology, the chip is provided with a longitudinal groove and a longitudinal section of the wire is inserted into this groove. The assembly can be obtained by embedding the wire in the groove, the dimensions of the wire and the groove being then sufficiently adjusted to mechanically secure the two elements to one another. Additionally or alternatively, the assembly can be obtained or reinforced by the addition of an adhesive material between the wire and the chip, by welding or soldering the wire and the chip.
In document US8471773, the wire is electrically conductive and the semiconductor chip contains a receive transmit circuit. The assembly of the wire and the chip makes it possible to bring the wire into contact with an input-output terminal of the reception transmission circuit to form a functional reception transmission device. The wire constitutes an antenna of this device.
The insertion of the wire into the groove of the chip is a particularly delicate operation, especially in an industrial context where it is necessary to be able to maintain a high production rate.
The document US8782880 discloses insertion equipment making it possible to maintain such a rate. Large wires are provided in the equipment in the form of coils and the chips stored in a tank. Two wires are unwound from the coils to be brought, parallel to each other, at a pinch area of the equipment. The latter is also configured to successively bring chips from the reservoir to this pinch zone, between the two wires, and embed a longitudinal section of each wire in a longitudinal groove of the chip. Alternatively, this document provides for soldering the wire and a metal stud disposed in the groove to each other to secure the chip and the wire, at the outlet of the insertion equipment. In this way, a chain is made up of a plurality of chips connected by large wires. The chip chain can be wound on a support to form a storage reel. Segments of this chain can be taken from the storage reel by cutting the wires according to a desired cutting pattern.
The insertion technology provided in this equipment requires the application of relatively great efforts on the wires to embed them in the grooves. This “forced” insertion of the wire into the groove can weaken it or cause it to break during or after its insertion. In addition, this insertion technology is particularly sensitive to the proper adjustment of the dimensions of the groove and the wire. A bad adjustment can lead to an insufficiently robust assembly, or on the contrary, require an excessive force which can lead to the rupture of the wire or to its damage.
It would be advantageous to be able to have an insertion technique which does not require the application of efforts as great as those of the state of the art. It would also be advantageous to be able to carry out the insertion and assembly of the wire and the chip in the same step, without excessive effort.
BRIEF DESCRIPTION OF THE INVENTION
With a view to achieving at least one of these aims, the object of the invention proposes, according to a first aspect, a method of inserting a wire into a longitudinal groove of a semiconductor chip for their assembly, the groove containing a stud made of a bonding material having a determined melting temperature, the method comprising:
in a positioning step, arrange a longitudinal section of the wire along the groove, in forced abutment against the stud;
in an insertion step, exposing an area containing at least part of the pad to a treatment temperature higher than the melting temperature of the bonding material and for a time sufficient to at least partially melt the pad, and causing the insertion of the wire in the groove.
According to other advantageous and non-limiting characteristics of the invention, taken alone or in any technically feasible combination
- The method comprises, at the end of the insertion step, the solidification of the bonding material to assemble the wire and the chip;
- The wire is kept in tension opposite the groove and the positioning step consists in pressing the wire against the stud;
- the pad is brought to the induction treatment temperature by exposing the area to a flow of hot air or to a luminous flux;
- The process includes, before or during the setting stage
place, a stage of preparation of the section longitudinal wire to be inserted into the groove r the preparation stage includes the deposit of a layer coating on the longitudinal section of the wire r the preparation stage includes a step of cleaning
and / or deoxidation of the longitudinal section of the wire;
the insertion step is followed by a strengthening step comprising the dispensing of an adhesive in the groove and on the longitudinal section of the wire exposed in the groove;
the insertion step is followed by a step for encapsulating the chip and / or the wires;
- the wire is electrically conductive;
- The method comprises repeating the steps of positioning and insertion so as to insert a plurality of chips on the wire and form a chain (16, 21).
According to another aspect, the invention also provides equipment for inserting a wire into at least one chip, the chip having a groove for receiving a longitudinal section of the wire and the groove containing a stud made of a connecting material having a determined melting temperature, the equipment comprising:
- placement members for deploying and moving a length of the wire between a first and a second end of a work space;
- A chip handling device capable of placing the chip in an insertion position in which the groove is placed opposite the wire;
- A setting member for arranging the longitudinal section of the wire along the groove, in forced abutment against the stud;
- A heating element for bringing to an treatment temperature an area comprising the pad when the chip is placed in the insertion position.
According to other advantageous and non-limiting characteristics of the invention, taken alone or in any technically feasible combination:
- The placement members are configured to deploy two parallel wires between the first and the second end, and in which the insertion position is located between the two wires;
the insertion equipment comprises at least one additional member disposed in the workspace, downstream or upstream from the insertion position of the chip;
- the additional member and the positioning member are positioned and configured in the workspace so that the treatments carried out by these members can be carried out simultaneously.
BRIEF DESCRIPTION OF THE DRAWINGS
Other characteristics and advantages of the invention will emerge from the detailed description of the invention which will follow with reference to the appended figures in which:
Figures la and lb show, in perspective and in section, a chip compatible with an insertion method according to the invention;
Figures 2a to 2e show the steps of a method according to the invention;
Figures 3a and 3b show equipment configured to implement a method according to the invention, at two particular moments of its operation;
FIGS. 4a to 4c represent an example of application of the method to the manufacture of a first transmission-reception device;
FIGS. 5a to 5c represent an example of application of the method of the invention to the manufacture of a second reception transmission device.
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1a represents, in perspective, an electronic component 1, designated by the term “semiconductor chip” or more simply “chip” in the remainder of this description, compatible with an insertion method according to the invention. FIG. 1b is a sectional view of such a chip 1.
The chip 1 comprises two longitudinal grooves 2a, 2b, mutually parallel and respectively formed on two lateral faces 1a, 1b of the chip 1, opposite one another. This configuration makes it possible to keep all its generality in the description which follows, but the invention is in no way limited to this number and to this arrangement of grooves, and the chip 1 can completely be provided with a single or a 'Any number of grooves, each arranged in any orientation on any one of the faces of the chip 1, without departing from the scope of the invention. These longitudinal grooves 2a, 2b are provided for each to receive and accommodate a longitudinal section of a wire (not shown in these figures la and lb). To facilitate the insertion of the wire, each groove 2a, 2b extends, on the face of the chip on which it is arranged, from one side to the other of the chip 1. We will designate, in the following of this description, by “longitudinal section of the wire”, the portion of wire which is housed or is called to be housed in a groove of the chip, according to its length.
According to the invention, the height and depth dimensions of the grooves 2a, 2b are chosen to be sufficiently large, or the cross section of the wires chosen to be sufficiently small, so that each wire can be housed in a groove 2a, 2b without mechanically forcing it into being .
It is generally preferable, to promote the joining of the wire to the chip 1, that the longitudinal section of the wires can be entirely housed in the grooves, that is to say that the housed portion of each wire does not extend beyond the face of the chip on which the groove is formed. When the chip 1 has a plurality of grooves 2a, 2b as is the case in FIGS. 1a and 1b, these are not necessarily of the same dimensions.
Similarly, the wires which are intended to be housed in the grooves are not necessarily of the same nature and do not necessarily have cross sections of identical dimensions.
The chip 1 comprises a substrate 3 comprising a functional circuit 4, such as a transmission-reception circuit, a computing device, a sensor, an LED or any other form of integrated circuit produced on the substrate 3, for example at using known techniques in the semiconductor field. The functional circuit 4 can be electrically connected to one or a plurality of connection terminals 4a, 4b opening into one and / or the other of the grooves 2a, 2b using conductive tracks or vias formed on or in the substrate 3. One can then put in electrical contact at least one of the wires, when it is inserted into one of the grooves 2a, 2b with the functional circuit 4. In this case, the wire assembled to the chip 1 does not constitute not a simple mechanical support for this chip 1, but can contribute to its operation, for example by forming an antenna, or by electrically connecting the chip to a power supply, or by distributing a signal to another chip which would also be connected to it . In this case, of course, the wire is made up or comprises an electrically conductive material. If the wire is provided with an insulating sheath, it may be necessary to strip this wire at its longitudinal section called to be housed in the groove in order to allow electrical contact with a connection terminal.
Continuing the description of Figures la and lb, the chip also includes a cover 5, having a T-shaped section, the foot of the T being assembled with a substrate 3. There are longitudinal 2a, 2b between the main assembly surface main face of
the so the of them grooves T bar of hood 5 and the of substrate 3. All as the
provided with a functional substrate circuit 3, the cover 5 can also be connection terminals and / or conductive tracks or vias.
These elements can be electrically and functionally connected to the functional circuit 4.
Other configurations of the chip 1 than that represented in FIG. 1a and 1b are possible. For example, the chip 1 can be formed from a single flat support comprising the functional circuit 4, the longitudinal grooves 2a, 2b being formed, for example by etching, on two opposite lateral faces of this support, or on one and / or the other of the main faces of this support. According to another configuration, the chip 1 can be formed of two flat supports of identical or similar dimensions, one and / or the other comprising a functional circuit. The flat supports are each assembled on the two opposite faces of a spacer of smaller dimension, to define the two longitudinal grooves 2a, 2b of the chip 1. The spacer can consist of a solid part or consist of a sufficiently rigid adhesive layer.
Whatever the configuration chosen, a chip 1 compatible with an insertion method according to the invention comprises at least one longitudinal groove 2a, 2b making it possible to receive and accommodate a longitudinal section of a wire.
According to the invention also, the groove 2a, 2b contains at least one stud 6a, 6b formed of a bonding material. In the example shown in Figures la, lb, the pads 6a, 6b are arranged in the grooves 2a, 2b on the face of the support 5 forming one of the walls of the grooves 2a, 2b, and over all their lengths. One could also choose to arrange the pads 6a, 6b on another of the walls constituting the grooves 2a, 2b, for example on the side of the cover 5. One could also choose to constitute each pad 6a, 6b of a plurality of elementary pads, distinct from each other, arranged in a groove over a reduced length. Whatever the shape, the volume, the arrangement occupied by the studs 6a, 6b in the grooves 2a, 2b these have such a dimension, that in their presence it is not possible to perfectly accommodate the wires in the grooves 2a, 2b. As will be made explicit in the remainder of this description, each stud 6a, 6b forms a reserve of a connecting material which will allow the assembly and the good mechanical strength of the wire housed in each of the grooves 2a, 2b.
The material constituting each pad 6a, 6b is chosen so that its melting temperature is relatively low. This melting temperature is lower than the maximum temperature to which the functional circuit 4 of the chip 1 can be exposed without being damaged. If, for example this maximum temperature is 350 ° C., the material of the pads 6a, 6b will be chosen so that its melting temperature is smaller petitο than 350 ° C, for example 300 ° C. Advantageously, for reasons of simplicity of the insertion process, the description of which will follow, this material is chosen so that its melting temperature is between 80 ° C. and 100 ° C. or 150 ° C., or 250 ° C. The material constituting each pad 6a, 6b can comprise a plurality of elementary compounds. It may for example be an alloy of metals, for example tin, silver and copper. Note that the chip 1 is intended to be handled at atmospheric pressure, and therefore that the mentioned melting temperature is determined at this pressure. Furthermore, it is not
not necessary that all the pads 6a, 6b or all the studs elementary be incorporated of the same material.Chip 1 can be manufactured in large series, in
employing technologies from the field of semiconductor integrated circuits, as taught in the cited documents of the state of the art. The pads 6a, 6b can advantageously be manufactured during the manufacture of the chip 1, for example by forming them by deposition on the substrate 3 before its assembly with the cover 5 or, more generally before the formation of the cover 5. It is possible to also consider forming the pads 6a, 6b in the longitudinal grooves 2a, 2b after the fabrication of the chip 1, for example by dispensing the connecting material forming these pads 6a, 6b in liquid form, at a temperature above its point of fusion, directly in the grooves 2a, 2b.
The present invention takes advantage of the characteristics of the chip 1 to propose a method of inserting at least one wire into at least one groove 2a, 2b of the particularly clever chip 1, which does not require forced embedding of this wire , and which therefore limits the forces applied to the wire during its insertion. This process is described with reference to Figures 2a to 2e.
It is noted first of all that the wire can be of any nature insofar as it is sufficiently resistant to the mechanical and chemical treatments which will be exposed.
Advantageously, the wire is a conductive electric wire, for example made of stainless steel, a copper-based alloy or copper, and the insertion process makes it possible to electrically connect this wire with a terminal 4a, 4b of the functional circuit 4 of chip 1.
Figure 2a shows a chip 1 according to the description which has just been made.
During a positioning step, there is a longitudinal section of two wires 7a, 7b along two grooves 2a, 2b. The stud 6a, 6b occupies a sufficient portion of the groove 2a, 2b so as not to allow the wires to be entirely housed therein. During the positioning step, limited forces are exerted on the wire 7a, 7b to press it against the pad 6a, 6b and put it into forced abutment against it. Figures 2b and 2c show the chip 1 and two wires 7a, 7b at the end of this positioning step. The wires 7a, 7b are in contact with the pads 6a, 6b, they can also be in contact with one of the edges of the substrate 3 and / or of the cover 5 defining the contours of the grooves 2a, 2b on the lateral faces la, lb of the chip 1. In the case where a stud 6a, 6b does not extend over the entire length of a groove 2a, 2b, a portion of the longitude section of a wire may be partially housed therein. this.
It will be recalled that the diameter of the wires is chosen smaller than the height of the grooves, so that in the absence of the studs 6a, 6b, the wires can be inserted without any particular embedding effort and be housed in the grooves 2a, 2b.
As shown in Figures 2d and 2e, the method of the invention also includes an insertion step, subsequent to the placement step. During this insertion step, an area comprising at least partially the pads 6a, 6b is exposed to a treatment temperature higher than the melting temperature of the bonding material composing them, and for a time sufficient to cause it to melt. . The transition to the liquid state of the connecting material, combined with the modest forces exerted on the wires 7a, 7b leads to the insertion of the latter into the grooves 2a, 2b as can be seen in FIG. 2e. It is not necessary that the bonding material of the pads 6a, 6b passes in its entirety in the liquid state to cause the insertion of the wires 7a, 7b. It suffices that only a portion of material liquefies to release a passage sufficient to allow the engagement and the accommodation of the wires 7a, 7b in the grooves 2a, 2b. The zone exposed to the treatment temperature advantageously includes all the pads 6a, 6b, but it is possible that only a part of these pads 6a, 6b is directly exposed to the treatment temperature, the being able to be caused by thermal conduction.
When the chip 1 has several grooves 2a, 2b to accommodate several wires 7a, 7b, as is the case in the example shown in FIGS. 2a to 2e, the insertion step can be carried out successively or simultaneously for each of the son. The area exposed to the treatment temperature can be wide enough to at least partially include all of the pads 6a, 6b. Alternatively, the insertion step can comprise the exposure of several distinct zones, simultaneously or successively, each including at least part of the pads 6a, 6b.
The insertion step can be implemented with a heating element, for example a generator of air flow or of another heated fluid, by induction, or by light irradiation such as laser irradiation or ultraviolet radiation, leading to the generation of a heat flux defining the heated area at the level of the chip 1. The flux is maintained long enough and has a sufficient temperature, higher than the melting point of the bonding material forming the pad 6a, 6b , to cause it to merge. Of course, the heating can be global, for example by placing the chip 1 in a heated enclosure, but this approach could be a little more complex to implement industrially.
As can be seen in FIG. 2e, the bonding material constituting the pads 6a, 6b, once in the liquid state, tends to become wrapped around the wire 7a, 7b, and to flow on the walls defining the grooves 2a, 2b. Part of the bonding material can be absorbed by the longitudinal section of wire and contributes to reinforcing the mechanical resistance of the wire 7a, 7b in the grooves 2a, 2b.
When the wires 7a, 7b are inserted into the grooves 2a, 2b, the heat treatment of the bonding material can be interrupted either by deactivating the heating member, or by moving the chip 1 and / or the member so as to extract chip 1 in the area exposed to the heat flow. The interruption of the heat treatment in the zone restores a temperature below the melting temperature of the bonding material, typically at room temperature, which leads to giving it a solid constitution and to integrally joining the wire to the chip. When the connection material and the wires are electrical conductors, it is thus possible to electrically connect the wires 7a, 7b to terminals 4a, 4b of the functional circuit 4. It is therefore noted that the method makes it possible, in a combined manner, to insert the wire and secure it to chip 1 without the need to deploy significant embedding efforts. The stud 6a, 6b somehow forms a reserve of an assembly material, predisposed in the grooves.
Before the installation step, or during this step, the method of the invention can provide a step of preparing the wires 7a, 7b. This step can thus comprise the removal of an insulating sheath surrounding a conductive heart, when the wires 7a, 7b are thus formed, so as to be able to form an electrically conductive assembly with the chip 1. Alternatively, or in addition, it is possible to provide a cleaning or deoxidation treatment of the wires 7a, 7b to improve the formation of this contact and / or the attachment of the bonding material of the pads 6a, 6b. In certain variants, the preparation step may include tinning the wires or, more generally, coating them with a material making it possible to promote electrical contact or the attachment of the bonding material. These treatments can for example be carried out by means of devices for spraying or spraying liquid fluids or made liquid according to the targeted treatment (acid, cleaning solution, liquid metal alloy,).
The method according to the invention may also include additional steps, after the wires 7a, 7b have been inserted into the grooves 2a, 2b, during or after their assembly to the chip 1 by solidification of the bonding material. Thus, the method can provide a step of strengthening the assembly of the wires 7a, 7b to the chip 1. This step is more particularly useful when unbalanced forces are applied to a plurality of wires 7a,
7b leading to the formation of shear stresses at their assemblies with the chip
1. The reinforcing step may include dispensing an adhesive in the grooves 2a, 2b and on at least part of the longitudinal section of the wires 7a,
7b exposed in the grooves. The dispensing of the adhesive can be supplemented by its exposure, for example by UV treatment, which can be of a very short duration, of the order of a second or a few seconds, to stiffen the adhesive and promote its joining. to the elements with which it is in contact.
The method may also include, as a complementary step, a step of encapsulating the chip 1 in a sufficiently rigid and waterproof material, such as resin, making it possible to protect it from mechanical or chemical stresses in its final application. Preferably, this encapsulation is such that all the faces of the chip 1, and particularly where the faces on which the grooves 2a, 2b have been formed, are well covered with the encapsulating material.
In certain cases, in particular when the chip 1 is associated with several conductive wires 7a, 7b, it may be necessary to electrically isolate the wires 7a, 7b from each other. The invention can therefore provide a complementary step aimed at having an electrical insulator on or between the wires 7a, 7b. The insulator may consist of a liquid material placed on and between the conductive wires 7a, 7b, or even on the chip 1 itself, before being made solid. Preferably, the electrical insulating material is not excessively rigid so as to retain the deformable nature of the wires 7a, 7b, which may be of particular interest depending on the intended application.
The method can also include, as a complementary step, a step of bringing the wires 7a, 7b into electrical contact, so as to form a loop. This contacting can implement the dispensing of a conductive adhesive.
The method can also include, as a complementary step, a step of cutting one or more wires 7a, 7b. It may be a question of removing a segment provided with at least one chip 1, with a view to its integration into an object. It can also be a matter of cutting a portion of wire in order to form a dipole antenna connected to the chip 1 as taught in document US8471773. The cutting of one or more wires 7a, 7b can be carried out by any means known per se, for example using a mechanical shearing tool or by laser cutting.
One can also provide an additional step of testing and / or programming the chip 1 after it has been assembled to the wires 7a, 7b in order to ensure that the preceding steps have not affected its functionalities and / or the make it fully functional.
The invention also provides equipment 8 for inserting a wire 7a, 7b into the groove 2a, 2b of a semiconductor chip 1, making it possible to implement a method in accordance with that which has just been described. The equipment 8 is particularly suitable for the repeated insertion of a wire into a plurality of chips 1, to form a chain of chips 1.
Figures 3a and 3b show such equipment at two particular times of its operation. The equipment 8 shown in these figures is configured to allow the simultaneous insertion of two wires 7a, 7b into two respective grooves 2a, 2b of a chip 1. But the equipment of the invention is in no way limited to this particular example and the same principles which will be explained may apply for the insertion of a different number of wires.
The equipment 8 comprises placement members 9, 9a, 9b for deploying, under controlled tension, a wire 7a, 7b between two ends of a work space. At a first end of this space, provision can therefore be made for a wire supply member 9a, such as a reel, allowing the two wires 7a, 7b to be extracted from two supply coils. These wires 7a, 7b extend over the entire length of the working space to reach the second end on which a storage member 9b can be provided such as a reel, making it possible to place the chain of chips which will be manufactured by the equipment
8. The wires 7a, 7b are guided between the two ends by guide members 9 such as rollers or rollers making it possible to position and precisely guide the position in space of the wires 7a, 7b, in particular during their movements. The placement members 9a, 9b, 9 can be motorized to allow the wire to be driven, ensuring, as and when the treatment carried out by the equipment 8, the transfer of the wires 7a, 7b from their supply coils to the storage reel.
The placement members 9, 9a, 9b are also designed to control the tension of each thread 7a, 7b to be between a minimum tension for which the threads 7a, 7b are not stretched and a maximum tension for which the threads are susceptible to deteriorate or break. When the equipment 8 is designed to deploy a plurality of wires 7a, 7b, as is the case in the example shown, it may be advantageous to seek to maintain an identical tension between the two wires. Similarly, when a plurality of wires 7a, 7b are inserted into at least one chip 1, it is important that the movement of the wires 7a, 7b along the workspace during the treatments carried out by the equipment 8 is produced simultaneously and with the same speed for each wire 7a, 7b in order to avoid generating shearing forces on the chips 1, which could lead to the disassembly of the wires 7a, 7b from the grooves 2a, 2b.
In the example shown, the two wires 7a, 7b are arranged in the same horizontal plane so that they can be inserted in a chip 1 provided with two grooves 2a, 2b also arranged in the same plane. Another configuration of the grooves 2a, 2b on the chip 1 could lead to a different adjustment of the arrangement of the wires 7a, 7b relative to one another.
The workspace is composed of an intermediate zone 10a in which the step of assembling the wires 7a, 7b and the chip 1 are carried out.
Upstream of the intermediate zone 10a, on the side of the first end and of the supply member 9a, the two wires 7a, 7b are distant from each other by a distance greater than that separating the two wires 7a, 7b when they are inserted into the grooves 2a, 2b of the chip 1. When the distance separating the grooves 2a, 2b from a chip 1 is less than a millimeter, which is usual, the two wires 7a, 7b can be separated from each other, in the upstream area 10b, by a few millimeters, such as for example 3 mm.
Downstream of the intermediate assembly zone 10a, on the side of the second end of the equipment 8 and of the storage member 9b, the wires 7a, 7b are inserted into the grooves 2a, 2b and assembled with the chips 1. The distance separating the two wires 7a, 7b is therefore imposed by the geometry of the chip 1 and by the depth of its grooves. This distance is typically less than 1 mm.
The guide members 9 placed in the intermediate zone 10a, or directly near this zone, make it possible to guide
Wire spacing
7a, 7b between the spacing existing in the upstream area 10b and that existing in the downstream area 10c.
The equipment shown in FIGS. 3a, 3b also includes a handling device 11, making it possible to extract a chip 1 from a chip storage area to place it in an insertion position, located in the intermediate area 10a between the wires 7a, 7b. The insertion position can be materialized by a tray on which the chip 1 can be placed and fixedly held. When a chip 1 is correctly placed in the insertion position, the grooves 2a, 2b of the chip are positioned opposite and at the same elevation as the wires 7a, 7b and in the same plane. The device for handling the insertion of a nozzle technology can correspond to components (“Anglo-Saxon Pick”) comprising suction allowing storage and insertion area.
one and one automatic machine
Place ”according to the articulated arm provided with the place to grasp a chip with precision in its position
The equipment 8 also includes a setting member 12 for the wires 7a, 7b. This member 12 placed in the intermediate insertion area 10a can rest on the wires 7a, 7b in two configurations. In a first “open” configuration, shown in FIG. 3a, the positioning member 12 is not in contact or not in sufficient support on the wires 7a, 7b, leaving a space between these wires 7a, 7b in order to be able to place a chip 1 in the insertion position. In a second configuration of the positioning member 12, shown in FIG. 3b, it is in controlled support in order to place the wires 7a, 7b along the grooves 2a, 2b, pressed against the studs 6a, 6b arranged in these grooves, and therefore in forced abutment against the pads 6a, 6b.
According to the invention, the equipment 8 also comprises at least one heating member 13 disposed in or near the intermediate zone 10a, to bring to an treatment temperature a zone comprising at least a portion of the pads 6b arranged placed in description heating 12 allows in the detailed position grooves 2a, insertion.
2b, when a
As we have chip 1 seen in
6a, is the method of raising the temperature of the invention,
The connecting material member forming the pads 6a, 6b above its melting temperature. The member 12 may comprise a generator of hot air flow or of any other gaseous fluid, a generator of light radiation such as UV radiation or laser radiation, a generator for heating by induction. The member 12 may include several generators, each generator exposing a particular area, located for example at each of the grooves 2a, 2b of a chip 1 when the latter is placed in the insertion position.
All of the organs which have just been described can be connected to a processing device, not shown in the figures, ensuring the sequencing of the operations of moving the wires 7a, 7b, for placing the chip 1 in position d insertion, actuation of the positioning members 12, and of the heating member 13 to allow the implementation, at high speed, of the insertion process of the invention.
In addition to the members arranged in or near the intermediate assembly area 10a which have just been described, the equipment 8 can also provide, upstream and / or downstream of this area, other additional members 14 for producing the steps for preparing the wires 7a, 7b, and the additional steps on the assembly formed by the chip 1 and the wires 7a, 7b. These additional members may include dispensing nozzles making it possible, for example, to spray cleaning, deoxidation, tinning or adhesive fluids onto the wires 7a, 7b and / or into the grooves 2a, 2b. The additional members may also include a laser source for cutting a wire or a UV source for solidifying an adhesive or a resin. It can also be a mechanical device for cutting wires by shearing, or means for testing or programming a chip. Preferably, these additional members 14 make it possible to carry out treatments of the wires 7a, 7b or of the chip 1 without coming into contact with these elements.
The additional members 14 are advantageously distributed, in the working space, along the wires 7a, 7b on the side of the upstream area 10b and in the downstream area 10c so that the treatments carried out by these members and by those arranged in the intermediate zone 10a, can all be carried out simultaneously. In other words, when the wires 7a, 7b are driven by the supply organs 9a, guide 9 and storage 9b, to move them by a portion of length corresponding to the spacing between two chips, the organs additional are positioned opposite a chip (downstream of the intermediate insertion zone) or opposite a longitudinal section of wire (upstream of this zone) that they can process. When all of the treatments have been carried out by these members, the wires 7a, 7b can be driven and displaced by a portion of additional length.
In an alternative embodiment of the invention, it is possible to carry out continuous training of the wires 7a, 7b, in order to further increase the rate of work. In this case, the chip 1 can be positioned on a plate moving in the direction of drive of the wires and at an identical speed so as to make the chip 1 substantially immobile with respect to the wires 7a, 7b, and allow their insertion in the grooves 2a, 2b and their assemblies.
First example
The method and the equipment 8 which have just been described can be used to produce a transmission-reception device 15 and a chain of such devices, as described in the document US8471773.
Such a device 15 is formed by a chip 1 conforming to that shown in FIG. La, comprising two longitudinal grooves 2a, 2b arranged on faces opposite one another of the chip 1. Two conductive wires 7a, 7b are placed in the grooves 2a, 2b. These wires each extend on one side of the chip 1 to form a dipole-shaped antenna. The wires 7a, 7b are electrically connected to terminals 4a, 4b of a reception transmission circuit 4, arranged for example in the substrate 3 of the chip 1. FIG. 4a schematically represents such a reception transmission device 15.
For reasons of mechanical resistance, in particular when bending, the wire is preferably chosen from stainless steel. In certain cases, however, it may be preferable to use wires of a copper-based alloy or of copper.
To manufacture such a transmitting reception device, or a chain of such devices, two spools of thread are placed in the unwinders of the supply members 9a, and these threads 7a, 7b are deployed through the guide members 9 up to to fix them on the storage reel of the reel forming the storage member 9b. Once in place, the various placement members are actuated in order to place the wires in tension and in the same plane in order to prepare the insertion of the wires 7a, 7b into chips 1. Chips 1 of reception transmissions, for example RFID chips, are arranged at the chip storage area, and can be moved, successively during the treatment sequences, to the insertion position by the handling device 11. At each new treatment sequence, the organs component equipment 8 perform simultaneously the following operations, before moving the wire by a determined length and repeating these operations again.
In the upstream area 10b of the working space, at an additional member 14:
- cleaning, and possibly tinning of a longitudinal section of the wires 7a, 7b intended to be housed in the grooves 2a, 2b of a chip 1.
In the intermediate zone 10a, using the members arranged in this zone:
- removal of a chip 1 from the storage area and positioning of this chip 1 in the insertion position;
- insertion of the longitudinal sections of the wires 7a, 7b which have been previously prepared during a previous sequence;
- Assembling the wires 7a, 7b in the grooves 2a, 2b by liquefaction and solidification of the connection material initially forming the pads 6a, 6b.
In the downstream area 10c, with the aid of additional members 14 arranged in this area facing a plurality of chips 1 assembled to the son 7a, 7b during previous sequences:
- dispensing an adhesive in the grooves 2a, 2b and on the longitudinal sections of the wires exposed in these grooves and exposure of the adhesive to harden it and reinforce the assembly of the wires 7a, 7b to the chip 1;
- cutting of one of the two wires 7a, 7b in order to preform dipole-shaped antennas.
- Encapsulation of the chip 1 in a protective material such as a rigid resin, making it possible to protect it mechanically and chemically
- functional test of chip 1, and programming of chip 1 to assign it a unique identification number.
It is noted that the dispensing of an adhesive in the grooves 2a, 2b and on the longitudinal sections of the wires can lead to forming a meniscus of adhesive between the wire and an edge of the chip, perpendicular to the wire. This meniscus contributes to making the assembly of the chip and the wires 7a, 7b particularly robust to the forces which could be applied to the wires and which would tend to separate them from the chip.
At the end of the production, a storage reel is provided comprising a chain 16 of reception transmission devices 15, as shown diagrammatically in FIG. 4b. It is possible to take from this chain 16 segments forming a functional transmission-reception device 15 which can be integrated into an object, for example with a view to its identification.
As shown in FIG. 4a, each transmitting and receiving device 15 of the chain 16 comprises a chip 1 having two longitudinal grooves 2a, 2b parallel to one another and arranged on two opposite faces of the chip
1. The reception transmission device also comprises a functional reception transmission circuit 4, and two segments of wires 7a, 7b housed in the grooves 2a, 2b and projecting each on one side of a groove 2a, 2b to form a dipole shaped antenna. The wire segments 7a, 7b are in electrical contact with terminals 4a, 4b of the functional circuit 4, arranged in the groove, by means of a connecting material 17. The wire segments are also held in the grooves 2a , 2b by adhesive 18 placed in these grooves 2a, 2b and on the exposed side of the wires 7a, 7b. Chip 1 is also coated and encapsulated with a protective material
19.
Second example
This second example relates to a transmission-reception device 20, similar to that of the first example. In this second example, however, shown diagrammatically in FIG. 5a, the reception transmission device 20 has an antenna comprising a loop, formed by electrically connecting one end of a wire 7b to the other wire 7a. To manufacture this device, a manufacturing process similar to that of the previous example is deployed. At each new processing sequence, the components of the equipment 8 simultaneously perform the following operations, before moving the wire by a determined length and repeating these operations again.
In the upstream area 10b of the working space, at an additional member 14:
- cleaning, and possibly tinning of a longitudinal section of the wires 7a, 7b intended to be housed in the grooves 2a, 2b of a chip 1.
In the intermediate zone 10a, using the members arranged in this zone:
- removal of a chip 1 from the storage area and positioning of this chip 1 in the insertion position;
- insertion of the longitudinal sections of the wires 7a, 7b which have been previously prepared during a previous sequence;
- Assembling the wires 7a, 7b in the grooves 2a, 2b by liquefaction and solidification of the connection material initially forming the pads 6a, 6b.
In the downstream area 10c, with the aid of additional members 14 arranged in this area facing a plurality of chips 1 assembled to the son 7a, 7b during previous sequences:
- dispensing with an electrically insulating material at least on the two wires 7a, 7b arranged on one side of the chip to avoid putting them in electrical contact over a determined distance. The insulation can also be dispensed on the chip;
- Optionally, at the end of the insulating zone which has been formed or prior to this isolation step, put the two wires 7a, 7b in electrical contact, for example by bringing them closer to each other at the using mobile jaws similar to the positioning members 12 of the intermediate zone and by welding them to each other. Alternatively, provision can be made to provide a conductive adhesive or any other conductive material on and between the two wires 7a, 7b so as to establish this electrical contact. We thus form a loop. If this operation is not carried out, the formation of the loop can be obtained later, after the removal of a segment of the storage reel, before or during the incorporation of the device into an object;
- Encapsulation of the chip 1 in a protective material such as a rigid resin, making it possible to protect it mechanically and chemically. This encapsulation step can be omitted when an electrically insulating material has previously been dispensed on the chip and the wires;
- Cutting one of the wires along the chip 1, for example by forming a notch 22 with the laser in the encapsulation layer deep enough to cause local breakage of the wire;
- functional test of chip 1, and programming of chip 1 to assign it a unique identification number.
In this second example, it is not necessary to cut a segment of wire to form the antenna. Preserving a chain 21 composed of two wires 7a, 7b on which the chips 1 are assembled 1. It is possible to take from the device chain which is formed according to the method described above, segments forming a functional transmission-reception device which, similarly to the previous example, can be integrated an object in order to identify it. This chain 21 is shown diagrammatically in FIG. 5b
As shown in FIG. 5c, each transmitting and receiving device 20 comprises a chip 1 having two longitudinal grooves 2a, 2b parallel to one another and arranged on two opposite faces of the chip 1. The device transmission reception also includes a functional circuit 4 transmission reception, and two son segments 7a, 7b housed in the grooves 2a, 2b. It also comprises two segments of wires 7a, 7b housed in the grooves 2a, 2b and projecting each from parts and others from these grooves 2a, 2b.
The wires 7a, 7b can be in contact with each other on one side of the chip 1 to form a loop and the longitudinal section of the wires housed in the grooves 2a, 2b is in electrical contact with the terminals 4a, 4b of a functional circuit 4 arranged in the grooves 2a, 2b by means of a connecting material 17. The segments of wires constituting the loop, and possibly the chip, can be at least partially coated in an electrically insulating material 23 thus avoiding putting them in electrical contact with one another. The chip 1 is coated and encapsulated with a protective material 19, in particular when it has not been coated with the insulating material. The encapsulation material or materials have a notch 22 used to cut one of the wires to make the antenna functional.
The transmission and reception device 15, 20 of the first and second examples can be inserted into a textile thread, for example by wrapping, as taught in document US8814054. More generally, it can be inserted in a textile or plastic material, in a fabric or a sheath.
Thus, the textile thread or segments of this thread comprising the receiving emission device, or more generally the textile or plastic material, the tissue or the sheath in which the device has been inserted, may itself be integrated in a textile object or not.
Of course, the invention is not limited to the mode of implementation described and it is possible to make variant embodiments without departing from the scope of the invention as defined by the claims.

权利要求:
Claims (12)
[1" id="c-fr-0001]
1. Method of inserting a wire (7a, 7b) in a longitudinal groove (2a, 2b) of a semiconductor chip (1) for their assembly, the groove containing a pad (6a, 6b ) consisting of a bonding material having a determined melting temperature, the method comprising:
- in an installation step, arrange a longitudinal section of the wire (7a, 7b) along the groove (2a,
[2" id="c-fr-0002]
2b), in forced abutment against the stud (6a, 6b);
- in an insertion step, exposing an area containing at least part of the pad (6a, 6b) to a treatment temperature higher than the melting temperature of the bonding material and for a sufficient time to melt at least in part the stud (6a, 6b), and cause the insertion of the wire (7a, 7b) in the groove (2a, 2b).
2. Insertion method according to the preceding claim comprising, at the end of the insertion step, the solidification of the connecting material to assemble the wire (7a, 7b) and the chip (1).
[3" id="c-fr-0003]
3. Method according to one of the preceding claims in which the wire (7a, 7b) is held in tension opposite the groove (2a, 2b) and in which the positioning step consists in pressing the wire (7a , 7b) against the stud (6a, 6b).
[4" id="c-fr-0004]
4. Method of insertion according to one of the preceding claims, in which the stud (6a, 6b) is brought to the treatment temperature by induction or by exposing the area to a flow of hot air or to a luminous flux.
[5" id="c-fr-0005]
5. Insertion method according to one of the preceding claims comprising, before or during the positioning step, a step of preparing the longitudinal section of wire intended to be inserted in the groove (2a, 2b).
[6" id="c-fr-0006]
6.
Insertion method according to the preceding claim
9.
in which the coating layer step on
Preparation insertion process includes depositing the longitudinal section of the wire.
according to one of the two preceding claims in which the preparation step comprises and / or deoxidizing the section a step of longitudinal cleaning of the wire.
Insertion method according to preceding claims in which step of strengthening in the
Previous insertion method in which the insertion step is followed by including the dispensing of a longitudinal adhesive according to
The step of inserting claims is followed by a step of encapsulating the chip
[7" id="c-fr-0007]
10. Insertion method according to one of the preceding claims wherein the electrically conductive wire.
[8" id="c-fr-0008]
11. Insertion method according to one of the preceding claims comprising repeating the steps of positioning and insertion so as to insert a plurality of chips (1) on the wire (7a, 7b) and form a chain (16, 21).
[9" id="c-fr-0009]
12. Equipment (8) for inserting a wire (7a, 7b) into at least one chip (1), the chip having a groove (2a, 2b) for receiving a longitudinal section of the wire and the
2b) containing a stud (6a, 6b) made of a bonding material having a determined melting temperature, the equipment comprising:
for deploying and moving a length of wire (7a, 7b) between a first and a second end of a work space;
- a handling device (11) of the chip (1) capable of placing the chip in an insertion position in which the groove (2a, 2b) is placed opposite the wire (7a, 7b);
a positioning member (12) for arranging the longitudinal section of the wire (7a, 7b) along the groove (2a,
2b), in forced abutment against the stud (6a, 6b);
- A heating element (13) for bringing to an treatment temperature an area comprising the stud (6a, 6b) when the chip (1) is placed in the insertion position.
[10" id="c-fr-0010]
13. insertion equipment (8) according to the preceding claim wherein the placement members (9a, 9b, 9) are configured to deploy two parallel wires between the first and second ends, and wherein the insertion position is located between the two wires.
[11" id="c-fr-0011]
14. Insertion equipment according to two preceding claims comprising at least one working member, downstream or upstream of the insertion position of the
[12" id="c-fr-0012]
15. Insertion equipment according to one of the three preceding claims in which the additional member are positioned and configured in the working space so that the treatments carried out by these members can be carried out simultaneously.
6b ---------------- 6a

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同族专利:

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公开号 | 公开日

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JP2020505714A|2020-02-20|

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CN110326100A|2019-10-11|

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US20220066416A1|2022-03-03|

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WO2018138437A1|2018-08-02|

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FR3062515B1|2019-11-01|

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US20190391560A1|2019-12-26|

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EP3574521A1|2019-12-04|

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US11209799B2|2021-12-28|

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法律状态:
2018-01-25| PLFP| Fee payment|Year of fee payment: 2 |

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2018-08-03| PLSC| Publication of the preliminary search report|Effective date: 20180803 |

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2019-01-30| PLFP| Fee payment|Year of fee payment: 3 |

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2020-01-30| PLFP| Fee payment|Year of fee payment: 4 |

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2021-01-25| PLFP| Fee payment|Year of fee payment: 5 |

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2022-01-31| PLFP| Fee payment|Year of fee payment: 6 |

优先权:

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申请号 | 申请日 | 专利标题

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FR1750728A|FR3062515B1|2017-01-30|2017-01-30|METHOD OF INSERTING A WIRE INTO A GROOVE OF A SEMICONDUCTOR CHIP, AND EQUIPMENT FOR IMPLEMENTING SUCH A METHOD|

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FR1750728|2017-01-30|FR1750728A| FR3062515B1|2017-01-30|2017-01-30|METHOD OF INSERTING A WIRE INTO A GROOVE OF A SEMICONDUCTOR CHIP, AND EQUIPMENT FOR IMPLEMENTING SUCH A METHOD|

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CN201880008903.0A| CN110326100A|2017-01-30|2018-01-25|Method and apparatus for implementing the method for being inserted into wiring in the groove of semiconductor chip|

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JP2019561374A| JP2020505714A|2017-01-30|2018-01-25|Method for inserting a wire into a groove in a semiconductor chip and part of an apparatus for performing such a method|

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PCT/FR2018/050166| WO2018138437A1|2017-01-30|2018-01-25|Method for inserting a wire into a groove of a semiconductor chip, and piece of equipment for implementing such a method|

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EP18703075.4A| EP3574521B1|2017-01-30|2018-01-25|Method for inserting a wire into a groove of a semiconductor chip, and piece of equipment for implementing such a method|

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US16/481,754| US11209799B2|2017-01-30|2018-01-25|Method for inserting a wire into a groove of a semiconductor chip|

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US17/525,517| US20220066416A1|2017-01-30|2021-11-12|Method for inserting a wire into a groove of a semiconductor chip|