• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an RFID card (2) comprising a substrate (5); a wired-type radiofrequency (RF) antenna (12) formed in the substrate (5); and an electronic module (4), disposed in the substrate (5), comprising: an RF chip (3), a capacitance (CP) in the form of a discrete component external to the RF chip (3), and a housing ( 14) in which the RF chip (3) and the capacitor (CP) are encapsulated; the RF chip (3) and the capacitance (CP) being each electrically connected in parallel at two ends (12A, 12B) of the RF antenna (12) so that the electronic module (4) can communicate in non-contact mode with the outside of the card (2) using said RF antenna (12).
    公开号:FR3062503A1
    申请号:FR1750679
    申请日:2017-01-27
    公开日:2018-08-03
    发明作者:Ahmed Ali
    申请人:Oberthur Technologies SA；
    IPC主号:
    专利说明:

    @ Holder (s): OBERTHUR TECHNOLOGIES Limited company.
    ® Agent (s): CABINET BEAU DE LOMENIE.
    ® RFID DEVICE AND MANUFACTURING METHOD.
    (57) The invention relates to an RFID card (2) comprising a substrate (5); a wire type radio frequency (RF) antenna (12) formed in the substrate (5); and an electronic module (4), disposed in the substrate (5), comprising: an RF chip (3), a capacitor (CP) in the form of a discrete component external to the RF chip (3), and a housing ( 14) in which the RF chip (3) and the capacity (CP) are encapsulated; the RF chip (3) and the capacitor (CP) each being electrically connected in parallel at two ends (12A, 12B) of the RF antenna (12) so that the electronic module (4) can communicate in contactless mode with the outside of the card (2) using said RF antenna (12).
    Invention background
    The invention relates to the field of RFID devices (for "radio frequency identification" in English) and relates more particularly to an RFID card configured to operate in contactless mode.
    In known manner, an RFID device (or “RFID tag” in English) is intended to communicate by radio frequency (RF) with an RFID reader, for example at a frequency of 13.56 MHz. RFID devices are today widely used in various fields of applications, in particular for the identification of people, contactless payment, control of connected objects ...
    Technological advances today make it possible to integrate such an RFID device into a card having for example the format of a bank card (ID-1 format according to ISO standard 7810). The inclusion of an RFID device in such a card notably facilitates handling for the user. One can thus present an RFID card in front of an RFID reader to pay for a transport ticket or identify oneself with a given service, for example.
    FIG. 1 schematically represents the structure of a conventional RFID card 80. In this example, the RFID card 80 comprises a card body 82 in which are disposed an RF microcontroller (or transponder) 84 and an RF antenna 86. The RF microcontroller 84, being in the form of an electronic chip, is configured to cooperate in contactless mode according to ISO 14443 with an external reader, by means of the RF antenna 86 to which the RF microcontroller 84 is electrically connected. The RF antenna 86 may include one or more turns extending in the card body 82.
    As is well known, the RF microcontroller 84 operates in contactless mode using the energy collected by the RF antenna 86 from RF signals from a contactless reader.
    For large format RFID cards, such as ID-1 format according to ISO 7810 standard for example, the RF 86 antenna can be produced according to a well-known wire manufacturing technique consisting in forming the RF 86 antenna in the form a conductive wire which is integrated into the card body 82 to produce at least one turn. The wire formation technique is now well mastered and allows precise control of the working frequency of the RF 84 antenna by adjusting the number of turns, the diameter of the antenna wire, or the spacing between each turn. .
    Thanks to progress in terms of miniaturization, it is now possible to manufacture RFID cards of format smaller than ID-1 format according to ISO 7810. However, certain technical constraints, and in particular the reduced space available in RFID cards small, require mounting additional capacity in parallel with the RF microcontroller 84 in order to achieve the desired specifications.
    FIG. 2 represents the electrical diagram of a small RFID card (smaller than ID-1) in which an additional capacity has been incorporated in parallel as indicated above. More specifically, an RF microcontroller 92 is connected via two electrical terminals to the ends of an RF antenna 90. The RF microcontroller 92 here is electrically equivalent to a capacitor Cb connected in parallel with a resistor Rb while the RF antenna 90 here is electrically equivalent to an assembly comprising a resistance Ra in series with an inductance La, this assembly being mounted in parallel with a capacitance Ca.
    As illustrated in FIG. 2, an additional capacity AC is mounted in parallel across the terminals of the RF microcontroller 92 in order to be able to adjust the working frequency of the RF antenna 90, in particular when the number of turns is limited.
    However, adding this AC capacity poses manufacturing problems. In practice, this capacitance AC is a discrete component mounted on the surface on the substrate of the card. However, the presence of such a component is not suitable for implementing the wire manufacturing technique for producing the RF 90 antenna. The formation of a wire RF antenna requires in particular the use of a electric arc welding technique which is incompatible with a discrete surface-mounted component such as AC capacity.
    Also, for format sizes smaller than ID-1 according to the ISO 7810 standard, the RF antenna is now manufactured according to another manufacturing technique, in this case by etching on a printed circuit, called PCB for “Printed Circuit Board ”.
    FIG. 3 schematically represents the structure of an RFID card 100 in accordance with the electrical diagram shown in FIG. 2. The RFID card 100 is smaller than ID-1 according to ISO standard 7810. In this example, the card body 102 of the RFID card 100 includes a detachable element 104 fixed to the rest of the body 102 by means of mechanical links 108 that a user can manually break.
    The detachable element 104 comprises, on a PCB 110, an RF antenna 116 electrically connected in parallel to an RF microcontroller 112 and to a capacitor 114, the latter being a discrete component mounted on the surface on the PCB 110. The formation of the RF antenna 116 by etching on the PCB does not damage capacitance 114 since the electric arc welding technique is not used in this case (use of an Ag-based conductive paste for example).
    However, the fabrication of an RF antenna by etching on a PCB has major drawbacks. In particular, the production of a PCB is generally complex and generates a high manufacturing cost. In addition, it is not possible to laminate a PCB with layers of PVC as can be done for ID-1 format cards, which prevents customizing the aesthetic appearance of the card satisfactorily.
    Today there is a need to compensate in particular for the drawbacks and inadequacies set out above.
    Subject and summary of the invention
    To this end, the present invention relates to an RFID card having an area less than or equal to 1 A of the surface of the ID1 format according to ISO standard 7810, the RFID card comprising:
    - a substrate;
    - a wire-type RF antenna disposed in the substrate; and
    - an electronic module, placed in the substrate, comprising:
    o an RF chip;
    o at least one capacity in the form of a discrete component external to the RF chip; and a case in which the RF chip and said at least one capacitor are encapsulated;
    wherein the RF chip and said at least one capacitor are each electrically connected in parallel at two ends of the RF antenna so that the RF module can communicate in contactless mode with the outside of the RFID card using said RF antenna .
    The invention advantageously makes it possible to produce a small RFID card with a wired type RF antenna. In other words, despite the small size of the RFID card requiring the presence of at least one capacitor to adjust the resonant frequency of the RF antenna, it is possible to use the wire manufacturing technique to form the RF antenna. In this way, it is not necessary to use a PCB to form the substrate of the RFID card, which makes it possible to limit the complexity of construction of the RFID card as well as the manufacturing costs. In addition, it is thus possible to personalize the aesthetic appearance of the RFID card with, if necessary, at least one protective layer laminated on one face of the RFID card.
    According to a particular embodiment, the RF chip and the capacitor are electrically connected to the ends of the RF antenna via wiring wires.
    According to a particular embodiment, the electronic module comprises a connection grid on which the RF chip and said at least one capacitor are mounted. The connection grid comprises for example a first and a second connection area, called internal connection areas, located in the housing, the wiring wires being configured so as to connect first and second internal connection areas to each of the chip RF and said at least one capacity.
    According to a particular embodiment, the connection grid extends so as to form a first and a second connection area, called external connection areas, located outside the housing of the electronic module, each external connection area being connected respectively to a respective end of the RF antenna and to a respective internal connection area.
    According to a particular embodiment, the substrate is plastic (PVC for example or equivalent). According to a particular example, the substrate is not (or does not include) PCB.
    According to a particular embodiment, said at least one capacity is of Si type.
    According to a particular embodiment, at least one upper protective layer and at least one lower protective layer are laminated on either side of the substrate. An upper and / or lower protective layer is for example laminated on the substrate so as to cover the electronic module.
    According to a particular embodiment, the RF antenna is integrated into the substrate by application of ultrasound (and possibly also of pressure).
    According to a particular embodiment, the RF antenna has a format conforming to class 5 or to class 6 according to standard ISO 14443.
    The invention also relates to a method for manufacturing an RFID card comprising the following steps:
    - supply of an electronic module comprising:
    o an RF chip;
    o at least one capacity in the form of a discrete component external to the RF chip; and a case in which the RF chip and said at least one capacitor are encapsulated;
    - mounting the electronic module on a substrate;
    - formation of a wire-type RF antenna in the substrate; and
    - electrical connection of the electronic module to two ends of the RF antenna, the RF chip and said at least one capacitor each being electrically connected in parallel to the two ends of the RF antenna, so that the RF module can communicate in contact with the outside of the RFID card using said RF antenna.
    According to a particular example, during the training step, the RF antenna is integrated into the substrate by application of ultrasound (and possibly also by application of pressure).
    According to a particular example, during the training step, the RF antenna is wound according to a mechanical template and then integrated into the substrate by application of an adhesive material.
    According to a particular embodiment, the electronic module comprises a connection grid on which the RF chip and said at least one capacitor are mounted, in which the connection grid extends outside the housing so as to form a first and a second connection area, called external connection areas, each external connection area being electrically connected to a respective end of the RF antenna, on the one hand, and to the RF chip as well as to said at least one capacitor, of on the other hand, in which, during the connection step, each end of the RF antenna is welded to a said respective external connection zone of the electronic module.
    According to a particular embodiment, the RF antenna is included in a layer of the substrate, the step of forming the RF antenna comprising the positioning of said layer on the substrate on which the electronic module is mounted so that the ends of the RF antenna are each located opposite a respective external connection area of the electronic module.
    According to a particular embodiment, at least one upper protective layer and at least one lower protective layer are laminated on either side of the substrate.
    According to a particular embodiment, the step of supplying the electronic module comprises the following steps:
    - Fixing the RF chip and said at least one capacity on a connection grid of the electronic module;
    connection of the RF chip and of said at least one capacitor, via wiring wires, to two internal connection zones of the connection grid; and
    - Formation of the housing of the electronic module from an encapsulation resin so that said resin encapsulates the wiring wires, the internal connection areas of the connection grid being located in the housing.
    The invention also relates to an RFID device comprising a body in which are arranged:
    - a wire-type RF antenna occupying a reception area whose surface is less than 10 cm 2 ; and
    - an electronic module comprising:
    o an RF chip;
    o at least one capacity in the form of a discrete component external to the RF chip; and a case in which the RF chip and said at least one capacitor are encapsulated;
    wherein the RF chip and said at least one capacitor are each electrically connected in parallel at two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the RFID device using said RF antenna;
    in which the body is molded so as to coat the RF antenna and the electronic module.
    The body forms, for example, a bracelet.
    Brief description of the drawings
    Other characteristics and advantages of the present invention will emerge from the description given below, with reference to the appended drawings which illustrate exemplary embodiments thereof without any limiting character. In the figures:
    - Figure 1 already described schematically shows a conventional RFID card according to a first example;
    - Figure 2 shows the electrical diagram of an RFID card according to a second example;
    - Figure 3 schematically shows a conventional RFID card according to another example;
    - Figure 4 is a sectional view schematically showing an RFID card according to a particular embodiment of the invention;
    - Figure 5 shows schematically the structure of an electronic module according to a particular embodiment of the invention;
    - Figure 6 schematically shows the structure of an RFID card according to a particular embodiment of the invention;
    - Figure 7 schematically shows the electrical diagram of an RFID card according to a particular embodiment of the invention;
    - Figure 8 shows, in the form of a flowchart, the steps of a method of manufacturing an RDIF card according to a particular embodiment of the invention; and
    - Figure 9 shows, in the form of a flowchart, the steps of a method of manufacturing an RFID card according to an alternative embodiment.
    Detailed description of several embodiments
    As indicated above, the invention relates to RFID devices and more particularly to RFID cards configured to operate in contactless mode.
    In this document, the terms "RFID card" or "RFID device" respectively denote a card or device conforming to ISO 14443 (for example the ISO / IEC 1444-1: 2016 version). Although the embodiments of the invention described below relate to an RFID card, other types of RFID devices are however possible within the scope of the invention.
    As indicated above, the use of a PCB to make an RFID card has major drawbacks. To overcome these drawbacks in particular, the invention proposes, according to various embodiments, an RFID card comprising a substrate in (or on) which are formed a wired type RF antenna and an electronic module. This electronic module comprises a radio frequency (RF) chip (and more particularly an RF microcontroller), at least one capacitor in the form of a discrete component external to the RF chip; and a housing in which the RF chip and said at least one capacitor are encapsulated. The RF chip and said at least one capacitor are each electrically connected in parallel at two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the card using said RF antenna. The invention finds a particular, but not limiting, application in the case where the RFID card has a size smaller than the ID-1 format according to ISO standard 7810. According to a particular example, the surface of the RFID card is less than or equal to 1 A of the surface of the format ID-1 according to ISO 7810, as described in more detail later.
    The present invention also relates to a method of manufacturing such an RFID card.
    Other aspects and advantages of the present invention will emerge from the exemplary embodiments described below with reference to the drawings mentioned above.
    Unless otherwise indicated, the elements common or analogous to several figures bear the same reference signs and have identical or analogous characteristics, so that these common elements or the like are generally not described again for the sake of simplicity.
    An RFID card 2 is now described with reference to Figures 4 and 5, according to a particular embodiment of the invention. FIG. 4 represents in section view the RFID card 2 comprising a substrate 5, an RF antenna 12 of wired type disposed in the substrate 5, and an electronic module 4 (or RF module) disposed in the substrate 5. FIG. 5 represents more particularly the structure of the electronic module 4 according to a particular example. As indicated below, many elements are described only by way of example.
    As indicated below, the RF wire antenna 12 can be manufactured directly in the substrate 5 or, alternatively, can be formed (or wound) separately and then assembled with the substrate 5.
    The RFID card 2 has for example a size smaller than the ID-1 format according to the ISO 7810 standard, such as for example the ID-000 format (sometimes referred to as "SIM format") according to the ISO 7810 standard. particular example, the RFID card 2 has a surface (in the plane in which it extends) less than or equal to 1 A of the surface of the ID-1 format according to the ISO 7810 standard. Note that, according to the ISO 7810 standard , the ID-1 format has a length L = 85.6 ± 0.12 mm, a width I = 53.97 ± 0.05 mm, the surface of the ID-1 format therefore being approximately 46.2 cm 2 . The surface of the ID-000 format is approximately 3.75 cm 2 (for dimensions of approximately 25 mm x 15 mm).
    More precisely, as illustrated in FIG. 4, the substrate 5 comprises layers 6, 8 and 10. The intermediate layer 8 and the upper layer 10 together form a layer 9 positioned on the lower layer 6. The formation of the substrate in 3 sub-layers 6 , 8 and 10, however, constitute only an exemplary embodiment, other implementations being possible according to which any number of layers (at least one) form the substrate 5.
    Layers 6, 8 and 10 are for example plastic (PVC, PETG or other) or any other suitable material.
    The substrate 5 has for example a thickness of the order of 400 μm, this thickness being able to vary depending in particular on the thickness of the electronic module 4 and the thicknesses of the capacity CP and of the RF microcontroller 3.
    In the example considered here, the substrate 5 is not a PCB (printed circuit). Its realization is therefore simple and inexpensive.
    In this example, the electronic module 4 is positioned on the first layer 6 of the substrate 5. Furthermore, the RF antenna 12, which here has a plurality of turns, is formed in the layer 9.
    In addition, two ends denoted 12A and 12B of the antenna 12 are respectively positioned on, and connected to, connection zones Z2A and Z2B, called external connection zones, of the electronic module 4. In this example, these ends of antenna 12A, 12B are included in the upper layer 10 of the substrate 5, although other arrangements are possible.
    The electrical connection of the antenna ends 12A and 12B on the corresponding external connection zones Z2A and Z2B is carried out for example by welding (for example by electric arc).
    According to a particular example, the RF antenna 12 has a size less than or equal to 14 of the size of an RF antenna conforming to class 1 according to the ISO 14443 standard. As a reminder, the ISO 14443 standard specifies that an RF antenna must extend (or be contained) in an area defined by two rectangles, namely an outer rectangle in which the RF antenna must be located and an inner rectangle (included in the outer rectangle) in which the RF antenna must not not lie. According to ISO 14443, a class 1 antenna for example must extend into an outside rectangle having the dimensions 81 mm x 49 mm, excluding (i.e. outside) an inside rectangle having the dimensions 64 mm x 34 mm. According to the embodiment considered here, the RF antenna 12 must be disposed in an external rectangle having a length and a width less than or equal to half the length and half the width of the external rectangle respectively as defined by ISO 14443 standard for a class 1 antenna.
    According to a particular example, the RF antenna 12 has a format conforming to class 5 or to class 6 according to standard ISO 14443.
    In general, it will be noted that various configurations of the RF antenna 12 are possible. In particular, it is possible to vary the number of turns, the diameter of the wire of the RF antenna 12 and / or the inter-turn spacing in order in particular to adapt the working frequency (i.e. the resonant frequency) of the RF antenna 12 according to the case in point, here within the limits imposed by the format of the RFID card 2. According to a particular example, the RF antenna 12 comprises at least one turn.
    As shown in FIG. 4, a cavity 13 is arranged in this example in the substrate 5 in order to accommodate the electronic module 4. This cavity 13 is here adapted to the shape of the electronic module 4, although other configurations of the substrate 5 be possible.
    The electronic module 4 has in this example a profile in the form of a step on two opposite edges, these edges forming the external connection zones Z2A and Z2B. The shape and arrangement of these external connection zones Z2A, Z2B, and more generally of the electronic module 4, may vary depending on the case. The function of these external connection zones Z2A, Z2B is described in more detail below.
    As illustrated in Figures 4-5, the electronic module 4 comprises in this example an RF microcontroller (or transponder) 3, a capacity CP in the form of a discrete component (capacitor), and a housing 14 in which the RF microcontroller is encapsulated 3 and CP capacity. In this example, the RF microcontroller 3 is in the form of an electronic chip (called “RF chip”), the capacity CP being external to said chip.
    ίο
    The housing 14 is here formed from an appropriate encapsulation resin (for example an epoxy resin well known to those skilled in the art).
    Furthermore, the value of the capacitance CP can vary depending on the case and can in particular be chosen in order to fix the resonant frequency of the RF antenna 12 at a desired value. In a particular example, the capacity CP has a value between 50 pF (for "picofarad") and 500 pF, such as for example a value of 470 pF.
    According to a particular example, the capacity CP is a capacity of the Silicon (Si) type. The use of a capacity CP based on silicon, or more generally on semiconductor, makes it possible to obtain a discrete component of small size (in surface and in thickness). The CP capacity thus has a size of the same order as that of the RF chip 3, or even a size smaller than that of the RF chip 3. This also makes it possible to obtain the CP component in the form of a wafer than the we can treat according to the same manufacturing processes and same assembly steps as those implemented for the RF microcontroller 3. The choice of a CP capacity based on semiconductor offers a wide variety of finishes in terms of pads. connection, thus allowing easy adaptation to the desired assembly method and also to the frequency band of the application. One can for example opt for a finish based on Aluminum for wiring wires (wire-bonding) in Gold, or for finishes in Gold for high frequency applications (for example beyond 1GHz).
    In the example considered here, the RF chip 3 and the capacitor CP are each electrically connected in parallel to the two ends 12A, 12B of the RF antenna 12 so that the electronic module 4 (and more particularly the RF microcontroller 3) can communicate in contactless mode with the outside of the RFID card 2 using said RF antenna 12. The RF microcontroller 3 is configured to operate in contactless mode using the energy collected by the RF antenna 12 from RF signals from a contactless reader (not shown).
    The connection of the RF chip 3 and of the capacity CP is carried out using connection cables 22 encapsulated in the housing 4.
    More specifically, according to the example illustrated in FIGS. 4-5, the electronic module 4 comprises in this example a connection grid 16 (also called a lead frame, or "lead frame" in English) on which the electronic chip 3 is positioned and CP capacity (surface mounted components). This connection grid 16 is for example made from a metal or a metallic alloy (copper for example). In this example, the chip 3 and the capacitor CP are each fixed to the connection grid 16 using a non-conductive adhesive 15.
    In the example considered here, the connection grid 16 forms a first central zone, denoted Z0, on which the capacity CP and the RF chip 3 are positioned inside the housing 14. The connection grid 16 also forms two zones internal connection, denoted Z1A and Z1B, inside the housing 14, these internal connection areas being electrically isolated from the central area Z0. This insulation is produced in this example by separating the central zone ZO from the internal connection zones Z1A, Z1B situated on either side with encapsulation resin for the housing 4.
    To ensure the electrical connection with the exterior of the electronic module 4, a wiring wire 22a (and 22b respectively) connects the terminal CPI (and CP2 respectively) of the capacity CP to the internal connection area Z1A (and Z1B respectively) of the connection grid 16. The wiring wires 22a and 22b are here respectively fixed at points A2 and B2 of the internal connection zones Z1A and Z1B (FIG. 5). Similarly, a wiring wire 22c (and 22d respectively) connects the terminal 31 (and 32 respectively) of the RF chip 3 to the internal connection area Z1A (and Z1B respectively) of the connection grid 16. The wiring wires 22c and 22d are here respectively fixed at points A3 and B3 of the internal connection zones Z1A and Z1B (FIG. 5).
    The connection points A2 and A3 being both located on the internal connection pad Z1A, the wiring wires 22a and 22c are electrically connected to each other. Likewise, the connection points B2 and B3 being both located on the internal connection pad Z1B, the wiring wires 22b and 22b are electrically connected to each other.
    Furthermore, the internal connection zone Z1A and the external connection zone Z2A are connected together electrically, and together form a first connection zone ZA. Likewise, the internal connection zone Z1B and the external connection zone Z2B are connected together electrically, and together form a second connection zone ZB.
    As illustrated in FIG. 5, the end 12A of the RF antenna is positioned on (or facing) the external connection zone Z2A so that said antenna end 12A is electrically connected to the terminal CPI of the capacity CP (via the connection area ZA and the wiring wire 22a) and that this same antenna end 12A is electrically connected to the terminal 31 of the RF chip 3 (via the connection area ZA and the wiring wire 31 ). Similarly, the end 12B of the RF antenna is positioned on (or facing) the external connection area Z2B so that said antenna end 12B is electrically connected to the terminal CP2 of the capacity CP ( via the connection area ZB and the wiring wire 22b) and that this same antenna end 12B is electrically connected to the terminal 32 of the RF chip 3 (via the connection area ZB and the wiring wire 32).
    This particular configuration of the wiring 22 and of the connection grid 16 thus makes it possible to connect in parallel the RF microcontroller 3 and the capacity CP at the ends 12A and 12B of the RF antenna 12. This configuration makes it possible in particular to obtain the electrical diagram equivalent as illustrated in FIG. 7. The capacity 14 here constitutes the additional capacity AC as described above with reference to FIG. 2, with the difference that the capacity CP (corresponding to AC) is here positioned with the RF microcontroller 3 within an electronic module 4.
    It is understood that the RFID card 2 as described above with reference to FIGS. 4 and 5 is only a non-limiting example of an embodiment, alternative embodiments being possible within the framework of the invention. Those skilled in the art understand in particular that certain elements of the RFID card 2 are described here only to facilitate understanding of the invention, these elements not being necessary for implementing the invention.
    In particular, the configuration of the electronic module 4, and in particular of the connection wiring, of the connection grid 16, of the arrangement of the capacity CP and of the RF chip 3, or also of the shapes and dimensions of the module 4 can be adapted as appropriate. The arrangement of the RF antenna 12 can also be adapted to the present case.
    It is further understood that certain elements generally present in an RFID card have been deliberately omitted because they are not necessary for understanding the present invention.
    The RFID card 2 as shown in Figures 4 and 5 can have various shapes and sizes depending on the case. As indicated above, the surface of the RFID card 2 (in its main plane) is for example less than or equal to 1 A of the surface of the ID1 format according to the ISO 7810 standard. According to another example, it is the RF antenna 12 of the RFID card 2 which has a size less than class 1 according to ISO 14443. The RF antenna 12 has for example a format conforming to class 5 or to class 6 according to ISO 14443.
    FIG. 6 represents the configuration of the RFID card 2 according to a particular example. The RFID card 2 here has an ID-000 (or 2FF) format in accordance with ISO standard 7810. As illustrated, the RF antenna 12 in this example has 3 turns and is electrically connected at its ends 12A, 12B to the zones external connection Z2A, Z2B respectively.
    According to a particular example, the RFID card 2 as described above with reference to FIGS. 4-6 may further comprise at least one upper protective layer and / or at least one lower protective layer (not shown) laminated on the side and other side of the RFID card 2. Advantageously, the substrate 5 is made of plastic, or any other suitable material which supports a lamination process.
    By lamination is meant in this document a mechanical process consisting in fixing at least one layer on one face of the RFID card by applying mechanical pressure for an appropriate duration, with or without the addition of heat, so that the constituent layers of the body of cards are assembled at pressure and temperature such that the materials (for example plastics) which constitute it reach their softening point of Vicat (or "Vicat softening point" in English) and interpenetrate locally to give laminated sets substantially coherent .
    Note that in the embodiments and variants described above, the RFID card 2 is a purely contactless card, that is to say configured to communicate only in contactless mode with the outside.
    As written above, the invention proposes to integrate at least one capacitor, in the form of a discrete component, in an electronic module further comprising an RF microcontroller. The electronic module is itself arranged in the card body of an RFID card. An RF antenna formed in the card body is electrically connected to the electronic module so that said at least one capacitor and the RF microcontroller are connected in parallel to the ends of the RF antenna.
    The invention advantageously makes it possible to produce a small RFID card with a wired type RF antenna. In other words, although it is necessary to equip an RFID card with at least one capacity to adjust the resonance frequency of the RF antenna, it is possible to use the wired manufacturing technique to form the RF antenna. . This is possible because the additional capacity which is necessary to adjust the resonance frequency of the RF antenna is protected in the case of the electronic module. Thus, it is possible to use the electric arc welding technique to electrically connect the wired RF antenna.
    The invention thus makes it possible to produce the RF antenna according to a wired manufacturing technique, and this for small RFID cards, such as cards of format smaller than ID-1 according to the ISO 7810 standard for example, and more particularly for RFID card formats as defined above. In particular, the invention applies to RFID cards having an area less than or equal to 1 A of the surface of the ID1 format according to the ISO 7810 standard (cards having the ID-000 format for example).
    In this way, it is not necessary to use a PCB to form the substrate of the RFID card, which makes it possible to limit the complexity of construction of the RFID card and the manufacturing costs. The wired manufacturing technique makes it possible to produce the RFID card from a plastic substrate or equivalent.
    Furthermore, by using the wired manufacturing technique to produce the RF antenna of the RFID card, it is advantageous to laminate upper and / or lower protective layers on the card, which is not possible when a PCB is used mainly because of the fragility of this type of structure. Thanks to the invention, it is thus possible to satisfactorily personalize an RFID card and thus significantly improve its aesthetic appearance and its functional reliability compared for example to an RFID card produced from a PCB.
    According to a particular embodiment, the RFID card of the invention is an RFID card configured to operate exclusively in contactless mode. In other words, this RFID card is devoid of any external contact intended to allow communication by contact with an external reader (or terminal).
    A method of manufacturing the RFID card 2 as described above is now described with reference to FIG. 8.
    More specifically, during a step S2, an electronic module 4 is provided as described above with reference to FIGS. 4-7. An example of manufacturing such a module is described in more detail later.
    The electronic module 4 is then mounted (S4) (or fixed) on a substrate, in this case the lower layer 6 as shown in FIG. 4.
    An RF antenna 12 of the wire type as described above is then formed (S6) in or on the substrate. To do this, we use a well-known wire manufacturing technique consisting in forming the RF antenna 12 in the form of a conductive wire (generally covered with a sheath, or resin, insulating) which is integrated into the substrate for make at least one turn. The wire formation technique makes it possible in particular to adjust the number of turns, the diameter of the antenna wire, or even the spacing between each turn. In the example considered here, the RF antenna 12 is integrated into a second substrate 9 comprising the layers 8 and 10 (FIG. 4). This second substrate 9, comprising the RF antenna 12, is then positioned on the first substrate 6 so as to respectively place the ends 12A and 12B of the RF antenna 12 opposite the external connection zones Z2A and Z2B. In this example, the electronic module 4 is thus positioned in the cavity 13 formed by the second substrate 9 with the first substrate 6.
    Note that in the example considered here, the RF wire antenna 12 is manufactured directly in part 9 of the substrate 5. Alternatively, the RF antenna 12 can be manufactured (or wound) separately and then assembled (or fixed) to the substrate . The RF antenna 12 can be formed in the substrate before or after mounting S4 of the electronic module 4.
    Once affixed (S6), the second substrate 9 forms with the first substrate 6 a global substrate 5 (Figure 4). A resin 11 can be used to fill a residual space at the interface between the electronic module 4 and the substrate 5.
    In this example, the positioning of the second substrate 9 on the first substrate 6 during step S6 of forming the RF antenna is carried out by lamination.
    Note that the integration of the RF antenna 12 into the second substrate 9 can be carried out for example by application of ultrasound in a manner well known to those skilled in the art, and possibly also by application of mechanical pressure on the 'together.
    According to another example, the RF antenna is formed by winding it according to a mechanical template and then integrating the coil into the substrate by applying an adhesive material.
    During a connection step S8, the ends 12A and 12B of the RF antenna 12 are electrically connected to the electronic module 4, and more precisely to the external connection zones Z2A and Z2B respectively, so that the capacity CP and the RF microcontroller 3 are connected in parallel to the antenna ends 12A and 12B, as explained above.
    The antenna ends 12A and 12B are here electrically welded at the desired welding points in the external connection zones Z2A and Z2B.
    Once the connection step S8 has been carried out, it is possible to laminate (S10) at least one upper protective layer and / or at least one lower protective layer on the two faces of the substrate 5 of the RFID card. At least one upper protective layer is for example laminated on the upper face of the RFID card 2 as shown in FIG. 4 in order to cover the upper face of the electronic module 4. In this way, no face of the module 4 is directly accessible from outside the RFID card 2. Additional layers can be laminated on at least one of the faces of the assembly to personalize the aesthetic appearance of the RFID card. These layers may in particular include any pattern.
    Note that various variant embodiments are however possible for manufacturing the RFID card 2. The order of the steps described above can in particular be adapted as the case may be. For example, the electronic module 4 can be mounted before or after the formation of the RF antenna 12 in the substrate.
    According to an alternative embodiment of the manufacturing method described above with reference to FIG. 8, the layer 8 (already defining the lower part of the cavity 13) can be placed on the layer 6. The electronic module 4 is then placed in the lower part of the cavity 13 defined by the layers 6 and 8. The turns of the RF antenna 12 are subsequently formed in the layer 8 according to any suitable technique as already explained above (for example by directly forming the antenna RF 12 in layer 8 or by winding the RF 12 antenna separately and then assembling it to layer 8). Once the RF antenna 12 has been formed in layer 8, the electrical connection S8 is made by welding the antenna ends 12a and 12B on the external connection zones Z2A and Z2B respectively, as already explained. To do this, the technique of electric arc welding is used, for example. The layer 10 is then placed on the layer 8 so as to place the electronic module 4 in the cavity 13 (FIG. 4). Layers 6, 8 and 10 are then laminated together to form the substrate 5 of the RFID card 2.
    An exemplary embodiment of the electronic module 4 as described above is now described with reference to FIG. 9. This embodiment occurs for example during the supply step S2 shown in FIG. 8.
    According to this exemplary embodiment, an attachment step S20 is carried out during which the RF chip 3 and the capacitor CP are mounted on the surface on the connection grid 16 (FIGS. 4 and 5). The RF chip 3 and the capacity CP are fixed on the connection grid using for example a non-conductive adhesive 15. In a particular example, the capacity CP and the RF chip 3 are fixed (S20) during 'the same bonding process. According to a variant, the capacity CP is fixed before or after the RF chip 3.
    According to a particular example, the same bonding technique is used to fix the capacity CP and the RF chip 3 to the connection grid 16.
    During a connection step S22, the RF chip 3 and the capacitor CP are each electrically connected to the connection grid 16, and more particularly to the internal connection zones Z1A and Z1B as described above. This connection is made using connection cables 22 shown in Figures 4-5, according to a technique well known to those skilled in the art (in Gold or Al for example).
    The RF chip 3, the capacity CP and the wiring wires 22 are then encapsulated (S24) in an encapsulating resin forming the housing 14 of the electronic module 4. The capacity CP is thus protected from possible external aggressions, such as in particular the high voltages and temperatures likely to be generated during connection (S8) of the wired RF antenna 12 to the electronic module 4.
    According to a particular example, recess zones (not shown) can also be formed along the contour of a first part of the card comprising the electronic module and the RF antenna, so that this first part of the card forms a detachable element vis-à-vis the rest of the card.
    Furthermore, it is possible in the context of the invention to envisage RFID devices in a form other than a card.
    According to another embodiment, an RFID device comprises a body in which are arranged:
    - a wired type RF antenna occupying a reception area whose surface is less than 10 cm 2 ; and
    - an electronic module comprising:
    o an RF chip;
    o at least one capacity in the form of a discrete component external to the RF chip; and a case in which the RF chip and said at least one capacitor are encapsulated;
    wherein the RF chip and said at least one capacitor are each electrically connected in parallel at two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the RFID device using said RF antenna;
    in which the body is molded so as to coat the RF antenna and the electronic module.
    As indicated above, the ISO 14443 standard specifies that an RF antenna must extend (or be contained) in an area defined by two rectangles, namely an outer rectangle in which the RF antenna and a rectangle must be located. inside (included in the outside rectangle) in which the RF antenna should not be located. More particularly, according to ISO standard 14443, a class 1 antenna must in particular be contained in an external rectangle having the dimensions 81 mm x 49 mm, which represents a reception area with a surface of 3969 mm 2 , c. i.e. approximately 40 cm 2 . The invention, according to the embodiment described here, is aimed at an RFID device comprising an RF antenna occupying a reception surface less than or equal to 1 A of the surface of 40 cm 2 of the external rectangle as provided for by standard ISO 14443 for a class 1 antenna. In other words, the RF antenna of this RFID device occupies a reception area less than or equal to 10 cm 2 .
    In this embodiment, the arrangement of the RF chip and of said at least one capacity in a housing of an electronic module advantageously makes it possible to use the wired technique to produce the RF antenna, even if the size of the antenna is relatively small and requires the presence of additional capacity as already explained above.
    In this embodiment, the molded body of the RDIF device can for example form a bracelet, such as a bracelet of a watch for example. A user can for example wear such a bracelet so as to be able to use the RFID device for a given application.
    To manufacture such an RFID device, it is for example possible to electrically connect the RF antenna (comprising at least one turn) to the electronic module 4 as described above (FIGS. 4-5) by electrically welding the two antenna ends on the external connection zones Z2A, Z2B as already explained previously. A coating material is then molded in order to coat both the RF antenna and the electronic module 4. The body thus formed is for example a bracelet.
    A person skilled in the art will understand that the embodiments and variants described above only constitute nonlimiting examples of implementation of the invention. In particular, a person skilled in the art can envisage any adaptation or combination of the embodiments and variants described above in order to meet a very specific need.
    权利要求:
    Claims (16)
    [1" id="c-fr-0001]
    1. RFID card (2) having an area less than or equal to 1 A of the surface of the ID1 format according to ISO standard 7810, the RFID card comprising:
    - a substrate (5);
    - a wire-type RF antenna (12) disposed in the substrate; and
    - an electronic module (4), placed in the substrate, comprising:
    o an RF chip (3);
    o at least one capacity (CP) in the form of a discrete component external to the RF chip; and a case (14) in which the RF chip and said at least one capacitor are encapsulated;
    wherein the RF chip (3) and said at least one capacitor (CP) are each electrically connected in parallel at two ends of the RF antenna (12) so that the electronic module can communicate in contactless mode with the outside of the RFID card using said RF antenna.
    [2" id="c-fr-0002]
    2. RFID card according to claim 1, in which the RF chip and the capacitor are electrically connected to the ends (12A, 12B) of the RF antenna via wiring wires (22).
    [3" id="c-fr-0003]
    3. RFID card according to claim 2, in which the electronic module comprises a connection grid (16) on which the RF chip and said at least one capacitor are mounted, the connection grid comprising a first and a second connection area ( Z1A, Z1B), said internal connection zones, located in the housing, the wiring wires (22) being configured so as to connect first and second internal connection zones to each of the RF chip and said at least one capacitor.
    [4" id="c-fr-0004]
    4. RFID card according to claim 3, in which the connection grid (16) extends so as to form a first and a second connection area (Z2A, Z2B), called external connection areas, located outside. of the housing (14) of the electronic module, each external connection zone (Z2A, Z2B) being connected respectively to a respective end (12A, 12B) of the RF antenna (12) and to an internal connection zone (Z1A, Z1B ) respective.
    [5" id="c-fr-0005]
    5. RFID card according to any one of claims 1 to 4, wherein the substrate (5) is plastic.
    [6" id="c-fr-0006]
    6. RFID card according to any one of claims 1 to 5, wherein said at least one capacity (CP) is of Si type.
    [7" id="c-fr-0007]
    7. RFID card according to any one of claims 1 to 6, in which at least one upper protective layer and at least one lower protective layer are laminated on either side of the substrate.
    [8" id="c-fr-0008]
    8. RFID card according to any one of claims 1 to 7, in which the RF antenna (12) has a format conforming to class 5 or to class 6 according to standard ISO 14443.
    [9" id="c-fr-0009]
    9. Method of manufacturing an RFID card (2) comprising the following steps:
    - supply (S2) of an electronic module comprising:
    o an RF chip (3);
    o at least one capacity (CP) in the form of a discrete component external to the RF chip; and a case (14) in which the RF chip and said at least one capacitor are encapsulated;
    - mounting (S4) of the electronic module on a substrate (6);
    - formation (S6) of an RF antenna (12) of the wired type in the substrate (5); and
    - electrical connection (S8) of the electronic module (4) to two ends (12A, 12B) of the RF antenna, the RF chip (3) and said at least one capacitor (CP) each being electrically connected in parallel at the two ends of the RF antenna, so that the RF module can communicate in contactless mode with the outside of the RFID card using said RF antenna.
    [10" id="c-fr-0010]
    10. The method of claim 9, wherein, during the forming step (S6), the RF antenna (12) is integrated into the substrate (5) by application of ultrasound.
    [11" id="c-fr-0011]
    11. The method of claim 9, wherein, during the forming step (S6), the RF antenna (12) is wound according to a mechanical template and then integrated into the substrate (5) by application of an adhesive material .
    [12" id="c-fr-0012]
    12. Method according to any one of claims 9 to 11, in which the electronic module (4) comprises a connection grid (16) on which the RF chip and said at least one capacitor are mounted, in which the connection grid extends out of the housing (14) so as to form a first and a second connection area (Z2A, Z2B), called external connection areas, each external connection area being electrically connected at one end (12A, 12B) the RF antenna, on the one hand, and the RF chip (3) as well as said at least one capacitor (CP), on the other hand, in which, during the connection step (S8) , each end (12A, 12B) of the RF antenna is welded to a said external connection area (Z2A, Z2B) of the electronic module.
    [13" id="c-fr-0013]
    13. Method according to any one of claims 9 to 12, in which the RF antenna (12) is included in a layer (9) of the substrate, the step of forming (S6) of the RF antenna comprising positioning of said layer (9) on the substrate (6) on which the electronic module (4) is mounted so that the ends (12A, 12B) of the RF antenna are each located opposite an external connection area ( Z2A, Z2B) respectively of the electronic module.
    [14" id="c-fr-0014]
    14. Method according to any one of claims 9 to 13, in which at least one upper protective layer and at least one lower protective layer are laminated on either side of the substrate.
    [15" id="c-fr-0015]
    15. Method according to any one of claims 9 to 14, in which the step of supplying the electronic module comprises the following steps:
    - fixing (S20) of the RF chip and of said at least one capacitor on a connection grid (16) of the electronic module;
    - connection (S22) of the RF chip and of said at least one capacity, via wiring wires (22), to two internal connection zones (Z1A, Z1B) of the connection grid; and
    - Formation (S24) of the housing (14) of the electronic module from an encapsulation resin so that said resin encapsulates the wiring wires, the internal connection areas of the connection grid being located in the housing.
    [16" id="c-fr-0016]
    16. RFID device comprising a body in which are arranged:
    - a wire-type RF antenna occupying a reception area whose surface is less than 10 cm 2 ; and
    - an electronic module comprising:
    o an RF chip;
    o at least one capacity in the form of a discrete component external to the RF chip; and a case in which the RF chip and said at least one capacitor are encapsulated;
    wherein the RF chip and said at least one capacitor are each electrically connected in parallel at two ends of the RF antenna so that the electronic module can communicate in contactless mode with the outside of the RFID device using said RF antenna;
    in which the body is molded so as to coat the RF antenna and the electronic module.
    1/4
    类似技术:
    公开号 | 公开日 | 专利标题
    EP3574451B1|2021-03-03|Rfid device and method for manufacturing same
    EP0207853B1|1991-01-23|Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card
    EP3567527B1|2021-10-13|Method of manufacturing a circuit for chip-card module and circuit for chip-card module
    FR2716281A1|1995-08-18|Method of manufacturing a contactless card.
    EP0207852B1|1989-11-08|Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card
    FR2996944A1|2014-04-18|SIMPLIFIED ELECTRONIC MODULE FOR A CHIP CARD WITH A DOUBLE COMMUNICATION INTERFACE
    EP3092604A1|2016-11-16|Electronic module, method for manufacturing same, and electronic device comprising a module of said type
    FR2998395A1|2014-05-23|Electronic module for smart card, has metal ISO contacts and terminals of antenna connected to contact pads of microelectronic chip, where antenna and ISO contacts are located on same surface of module
    EP2178032B1|2015-12-16|Module, chip card and corresponding manufacturing method
    FR3001070A1|2014-07-18|ANTENNA SYSTEM FOR CONTACTLESS MICROCIRCUIT
    FR2927441A1|2009-08-14|CONTACTLESS OBJECT WITH INTEGRATED CIRCUIT CONNECTED TO THE TERMINALS OF A CIRCUIT BY CAPACITIVE COUPLING
    CA2968070C|2021-05-11|Method for producing a single-sided electronic module including interconnection zones
    WO2017102667A1|2017-06-22|Radiofrequency device with adjustable lc circuit comprising an electrical and/or electronic module
    FR2997535A1|2014-05-02|METHOD FOR MANUFACTURING A CHIP CARD WITH MULTIPLE COMPONENTS AND CARD THUS OBTAINED
    FR2795202A1|2000-12-22|CARD AND METHOD FOR MANUFACTURING CARDS HAVING CONTACT AND NON-CONTACT COMMUNICATION INTERFACE
    WO2005064533A1|2005-07-14|Methods for the production of an external-contact-free card and card thus obtained
    EP2631849A1|2013-08-28|Method for manufacturing a device comprising a module with an electric and/or electronic circuit
    FR2872945A1|2006-01-13|ELECTRONIC ENTITY COMPRISING AN ANTENNA, INLAY AND MODULE FOR SUCH AN ENTITY
    EP3114612A1|2017-01-11|Simplified electronic module for a smartcard with a dual communication interface
    FR2795200A1|2000-12-22|ELECTRONIC DEVICE COMPRISING AT LEAST ONE CHIP FIXED ON A SUPPORT AND METHOD OF MANUFACTURING SUCH A DEVICE
    FR3024000A1|2016-01-22|RFID ELECTRONIC ENTITY WITH CONDENSER REPORTED
    WO2017191373A1|2017-11-09|Electronic module of small size for a chip card
    EP3314624A1|2018-05-02|Module equipped with a capacitor and an antenna, with improved capacitor electrode arrangement
    FR3016988A1|2015-07-31|ELECTRONIC MODULE WITH DOUBLE COMMUNICATION INTERFACE
    CA2786406A1|2011-02-10|Ohmic connection using widened connection zones in a portable electronic object
    同族专利:
    公开号 | 公开日
    EP3574451B1|2021-03-03|
    EP3574451A1|2019-12-04|
    ES2875373T3|2021-11-10|
    PL3574451T3|2021-10-11|
    WO2018138432A1|2018-08-02|
    FR3062503B1|2019-04-05|
    HUE054608T2|2021-09-28|
    PT3574451T|2021-06-04|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    WO1994018700A1|1993-02-11|1994-08-18|Indala Corporation|Method of producing a radio frequency transponder with a molded environmentally sealed package|
    EP1369816A1|2002-06-07|2003-12-10|Sony Corporation|Tuning capacitors for IC module in wireless IC card|
    WO2004019261A2|2002-08-26|2004-03-04|Dai Nippon Printing Co., Ltd.|Sim, sim holder, ic module, ic card and ic card holder|
    AU7916101A|2000-08-04|2002-02-18|Hei Inc|Structures and assembly methods for radio-frequency-identification modules|US10977540B2|2016-07-27|2021-04-13|Composecure, Llc|RFID device|
    MX2019001144A|2016-07-27|2019-06-10|Composecure Llc|Overmolded electronic components for transaction cards and methods of making thereof.|
    SG11202002064SA|2017-09-07|2020-04-29|Composecure Llc|Transaction card with embedded electronic components and process for manufacture|
    US11151437B2|2017-09-07|2021-10-19|Composecure, Llc|Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting|
    WO2019079007A1|2017-10-18|2019-04-25|Composecure, Llc|Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting|
    US10762412B2|2018-01-30|2020-09-01|Composecure, Llc|DI capacitive embedded metal card|
    法律状态:
    2017-12-18| PLFP| Fee payment|Year of fee payment: 2 |
    2018-08-03| PLSC| Publication of the preliminary search report|Effective date: 20180803 |
    2019-12-19| PLFP| Fee payment|Year of fee payment: 4 |
    2020-12-17| PLFP| Fee payment|Year of fee payment: 5 |
    2021-12-15| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1750679|2017-01-27|
    FR1750679A|FR3062503B1|2017-01-27|2017-01-27|RFID DEVICE AND METHOD OF MANUFACTURE|FR1750679A| FR3062503B1|2017-01-27|2017-01-27|RFID DEVICE AND METHOD OF MANUFACTURE|
    EP18703074.7A| EP3574451B1|2017-01-27|2018-01-24|Rfid device and method for manufacturing same|
    PT187030747T| PT3574451T|2017-01-27|2018-01-24|Rfid device and method for manufacturing same|
    HUE18703074A| HUE054608T2|2017-01-27|2018-01-24|Rfid device and method for manufacturing same|
    ES18703074T| ES2875373T3|2017-01-27|2018-01-24|RFID device and its manufacturing method|
    PL18703074T| PL3574451T3|2017-01-27|2018-01-24|Rfid device and method for manufacturing same|
    PCT/FR2018/050161| WO2018138432A1|2017-01-27|2018-01-24|Rfid device and method for manufacturing same|
    [返回顶部]