• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method of integrating into a thin plastic card (1) a fingerprint sensor (2,3) comprising the steps of: welding the fingerprint sensor (2,3) to a printed circuit (5), covering the fingerprint sensor (2,3) with a protective sheet, resealing the assembly to form a central element (7), placing at least one upper plastic layer (8) above of the central element (7), placing at least one lower plastic layer (9) below the central element (7), rolling of the assembly (7, 8, 9), and withdrawal according to a withdrawal contour, the upper plastic layer (8), the central element (7) and the protective sheet (6) in line with the fingerprint sensor (2,3) so as to release the fingerprint sensor (2,3). Thin plastic card (1) incorporating a fingerprint sensor (2,3) obtained by such a method.
    公开号:FR3061333A1
    申请号:FR1663378
    申请日:2016-12-26
    公开日:2018-06-29
    发明作者:Elodie GRAGNIC；Olivier BOSQUET；Nicolas Bousquet
    申请人:Oberthur Technologies SA；
    IPC主号:
    专利说明:

    © Holder (s): OBERTHUR TECHNOLOGIES Limited company.
    o Extension request (s):
    (® Agent (s): SANTARELLI.
    (54) THIN PLASTIC CARD WITH INTEGRATED FINGERPRINT SENSOR AND METHOD FOR PRODUCING THE SAME.
    FR 3,061,333 - A1 (57) Method for integrating a fingerprint sensor (2,3) into a thin plastic card (1) comprising the following steps: soldering the fingerprint sensor (2,3 ) on a printed circuit (5), covering the fingerprint sensor (2,3) with a protective sheet, resinating the assembly in order to form a central element (7), placing at least one upper plastic layer (8) above the central element (7), placing at least one lower plastic layer (9) below the central element (7), laminating the assembly (7, 8, 9), and removal, according to a withdrawal contour, of the upper plastic layer (8), of the central element (7) and of the protective sheet (6) in line with the fingerprint sensor (2 , 3) in such a way as to release the fingerprint sensor (2,3).
    Thin plastic card (1) incorporating a fingerprint sensor (2,3) obtained by such a process.

    Thin plastic card incorporating a fingerprint sensor and production method
    The present invention relates to a method for integrating a component, such as a fingerprint sensor, into a thin plastic card, such as a bank card.
    In the field of component integration in a thin plastic card, it is known to machine a housing with vertical edges and to deposit the component in the housing. The component can, for example, be held in place in the housing by an adhesive. This embodiment is used for the module, a component comprising a microprocessor or “chip” and an apparent contact plate.
    This embodiment is not very suitable for a fingerprint sensor which has a much larger size and greater rigidity than that of the thin plastic card. Also, bending the thin plastic card may cause the component to be ejected from the housing.
    The present invention overcomes these various drawbacks according to a principle consisting in manufacturing a thin plastic card around the component.
    The subject of the invention is a method of integrating a fingerprint sensor into a thin plastic card comprising the following steps: soldering the fingerprint sensor onto a printed circuit, covering the fingerprint sensor with a protective sheet disposed on one side of the fingerprint sensor opposite to the side intended to be soldered to the printed circuit, resinating an assembly comprising at least the printed circuit, the fingerprint sensor and the protective sheet, to form a central element, placing at least one upper plastic layer above the central element, placing at least one lower plastic layer below the central element, laminating a assembly comprising the upper plastic layer, the central element and the lower plastic layer, and removal, according to a withdrawal contour, of the upper plastic layer, the central element and the protective sheet in line with the ca fingerprint sensor, so as to release, at least partially, the fingerprint sensor.
    According to another characteristic, the protective sheet has a thickness of between 30 and 100 μm, preferably equal to 60 μm and is preferably made of PET.
    According to another characteristic, an outline of the protective sheet is strictly included in the withdrawal outline.
    According to another characteristic, the protective sheet is assembled to the fingerprint sensor by an adhesive.
    According to another characteristic, the upper plastic layer is shaped to include a cavity capable of accommodating the fingerprint sensor, the bottom of the cavity being disposed opposite the fingerprint sensor.
    According to another characteristic, the depth of withdrawal, at the strictly right of the strictly upper fingerprint, lower of the fingerprint sensor, is the thickness, at the right of the sensor, the upper plastic layer and the cumulative thickness, at the right of the fingerprint sensor, the upper plastic layer and the protective sheet, in order to remove the entire upper plastic layer, without risk to the fingerprint sensor.
    According to another characteristic, the method also comprises, prior to the resinating step, the following steps: installation of at least one plastic element comprising a cutout capable of accommodating the printed circuit and the fingerprint sensor, in place of the printed circuit and the fingerprint sensor in the cutout, assembly of said at least one plastic element with the printed circuit.
    According to another characteristic, the withdrawal contour is strictly included in an exterior contour of the fingerprint sensor, in order to maintain an overlap of the exterior contour of the fingerprint sensor by the upper plastic layer.
    According to another characteristic, the removal step uses a tool, such as a milling cutter, the end cone of which has a significant half-angle at the top so that the profile of the cut in the upper plastic layer has a gentle slope.
    According to another characteristic, the fingerprint sensor comprises a sensitive element and a conductive bezel disposed at the periphery of the sensitive element, and where the conductive bezel comprises a first printed circuit forming its upper face, a second printed circuit forming its underside, an insert disposed between the first printed circuit and the second printed circuit, and conductive means connecting the first printed circuit to the second printed circuit.
    According to another characteristic, the first printed circuit, the second printed circuit and the conductive means are cut in one piece from a flexible printed circuit sheet, the conductive means being a fastener disposed between the first printed circuit and the second printed circuit, said fastener being foldable, so as to form a sandwich enveloping the interlayer.
    According to another characteristic, the soldering step comprises a soldering step of the conductive bezel on the printed circuit and a soldering step of the sensitive element on the printed circuit, and the soldering step of the sensitive element is carried out before the covering step, or after the removing step.
    According to another characteristic, the conductive bezel forms a closed frame and includes a cavity capable of accommodating the sensitive element, and the covering step places the protective sheet on the conductive bezel so as to close the cavity and is preferably carried out before the step of welding the conductive bezel, in order to facilitate the handling of the conductive bezel by means of a suction gripper.
    According to another characteristic, prior to the resinating operation, the conductive bezel and the printed circuit are pierced with at least one opposite through hole.
    According to another characteristic, said at least one hole has a circular or oblong section.
    According to another characteristic, said at least one hole is disposed outside the contour of the protective sheet.
    According to another characteristic, said at least one hole is arranged outside the withdrawal contour.
    According to another characteristic, the thin plastic card complies with ISO / IEC 7810 standard.
    The invention also relates to a thin plastic card incorporating a fingerprint sensor obtained by such a method.
    Other characteristics, details and advantages of the invention will emerge more clearly from the detailed description given below by way of indication in relation to the drawings in which:
    - Figure 1 illustrates, in profile view, the installation of a sensitive element on a printed circuit, Figure 2 illustrates the installation of a conductive bezel, Figure 3 illustrates the cover of the fingerprint sensor digital with a protective sheet,
    - the figure 4 illustrated the resin, - the figure5 illustrates the establishment of a layer tick : superior and a plastic layer lower, - the figure 6 illustrated the rolling,- the figure 7 illustrated a variant of real isation, - the figure 8 illustrated the withdrawal,- the figure 9 illustrated the card obtained,- the figure 10 illustrates, seen from above, the relationships
    topologies between the different contours,
    FIG. 11 illustrates, in top view, an embodiment of a conductive bezel, from a printed circuit shown deployed,
    - Figure 12 illustrates, in profile view, the embodiment of Figure 11, the printed circuit being folded around an interlayer.
    The figures are only an illustration made for a better understanding and in which the dimensions and size ratios are not representative
    The present relates to a method for integrating a fingerprint sensor 2,3 into a thin plastic card 1. The principle adopted consists in manufacturing said thin plastic card 1 around the component 2,3. The invention is suitable for any type of fingerprint sensor 2,3. A fingerprint sensor can thus be of the thermal, capacitive, or other type. A fingerprint sensor comprises a sensitive element 2 comprising a substantially flat surface capable of receiving a finger and of "reading" the papillary lines of the dermatoglyph, or more precisely of the typist. A capacitive type fingerprint sensor further comprises a conductive bezel 3. Such a conductive bezel 3 is suitable and has the function of transmitting an electric current to the finger. The conductive bezel 3 is arranged on the periphery of the sensitive element 2, so that the finger placed on the sensitive element 2 simultaneously touches the conductive bezel 3. It follows that the entire upper surface of the sensitive element 2 must be accessible so that a finger can come into contact with it. Similarly, in the embodiments comprising a conductive bezel 3, at least part of the upper surface of the conductive bezel 3 must be accessible so that a finger can come into contact with it. Advantageously, these surfaces are arranged substantially flush with one of the surfaces of the thin plastic card 1.
    According to one embodiment, the integration method is illustrated in FIGS. 1 to 9. It comprises the following steps.
    A first step, illustrated in FIGS. 1 and 2, consists in soldering the fingerprint sensor 2,3 onto a printed circuit 5.
    In the case of a two-part fingerprint sensor, FIG. 2 more particularly illustrates a soldering of the conductive bezel 3 on the printed circuit 5, while FIG. 1 more particularly illustrates a soldering of the sensitive element 2 on the printed circuit 5. These welds can be carried out by any process and in any relative order or even simultaneously.
    By way of illustration, the sensitive element 2 and / or the conductive bezel 3 may comprise ball type contacts arranged in a matrix (in English Land Grid Array) capable of coming into contact with connectors arranged facing each other on the printed circuit 5.
    Another step, illustrated in FIG. 3, consists in covering the fingerprint sensor 2,3 by means of a protective sheet 6. This protective sheet 6 is arranged on the face of the fingerprint sensor 2, 3 opposite the face intended to be soldered to the printed circuit
    5. The protective sheet 6 is shaped so as to be impermeable to the resin.
    Another step, illustrated in FIG. 4, consists in carrying out a resinating. This resination drowns in a resin the assembly comprising at least the printed circuit 5, the fingerprint sensor 2,3 and the protective sheet.
    6. The result forms a central element 7. This central element 7 can be flat, of rectangular shape, included in the final shape desired for the thin plastic card 1 and of thickness less than the final thickness of the thin plastic card 1 The resin can be of any type, for example a thermosetting resin or an ultraviolet curing resin.
    According to another embodiment, illustrated in FIG.
    7. the central element 7 is formed by resinating said same assembly, to which is added, prior to resination, at least one plastic element 23, 24 comprising a cutout so as to frame the printed circuit 5 and the fingerprint sensor respectively 2.3.
    During other steps, at least one upper plastic layer 8 is placed above the central element
    7, and at least one lower plastic layer 9 is placed below the central element 7, as illustrated in FIG. 5.
    During another step, the stack of the upper plastic layer 8, of the central element 7 and of the lower layer 9, is then laminated, in order to form the thin plastic card 1, as illustrated in the figure 6.
    In order to clear the cavity 4 and provide access to the fingerprint sensor 2,3, another step removes the upper plastic layer 8, the central element 7 and the protective sheet 6, in line with the fingerprint sensor 2,3 as shown in the figure
    8, in order to produce a thin plastic card 1 as illustrated in FIG. 9.
    The removal step comprises, for example, machining in line with the fingerprint sensor 2,3. This machining is carried out according to a closed withdrawal contour 10, more particularly illustrated in FIG. 10. This closed withdrawal contour 10 is strictly included in an external contour 11 of the fingerprint sensor 2,3. Thus, the upper plastic layer 8 retains an overlapping portion of the outer contour 11 of the fingerprint sensor 2,3, thus ensuring effective retention of the fingerprint sensor 2,3 in the thin plastic card 1.
    A machining pass, along this closed withdrawal contour 10, cuts the upper plastic layer 8, the central element 7 and the protective layer 6, and allows a piece of upper plastic layer 8 to persist, here of substantially rectangular shape, in line with the sensitive element 2 of the fingerprint sensor 2.3. The removal step further comprises a step of removing this remaining piece, either simply by pulling, for example by means of a suction tool, such as a suction cup. This embodiment is advantageous in that the withdrawal contour 10 is advantageously external to the sensitive element 2, no machining, potentially annoying, is carried out in line with the fragile sensitive element 2. Alternatively, the remaining piece can be removed by machining sweeping the entire surface included in the withdrawal contour 10.
    According to another characteristic, the protective sheet 6 has a thickness of between 30 and 100 μm, preferably equal to 60 μm. The protective sheet 6 is preferably made of PET. It can alternatively be made of PI, PEN or any other equivalent material.
    According to another characteristic, an outline 12 of the protective sheet 6 is strictly included in the withdrawal outline 10. Thus the protective sheet 6 is completely removed during the removal operation. Alternatively, the protective sheet 6 can have a greater extension, but include a cut or precut along a contour 12 strictly included in the withdrawal contour 10.
    According to another characteristic, the protective sheet 6 is assembled to the fingerprint sensor 2,3, during the covering step, by an adhesive.
    According to an alternative embodiment, the upper plastic layer 8 comprises a blind cavity capable of accommodating the fingerprint sensor 2,3. When the fingerprint sensor 2,3 is placed in said cavity, the bottom of the cavity is placed opposite the fingerprint sensor 2,3.
    According to another characteristic, more particularly illustrated in FIG. 9, the withdrawal depth 13, in line with the fingerprint sensor 2,3, is strictly greater than the thickness 14, in line with the fingerprint sensor 2, 3, of the upper plastic layer 8. This characteristic ensures a cutting of the total upper plastic layer 8 in thickness, during the removal step. In addition, the withdrawal depth 13, in line with the fingerprint sensor 2,3, is strictly less than the cumulative thickness 15, in line with the fingerprint sensor 2,3, the upper plastic layer 8 and of the protective sheet 6. This characteristic makes it possible to remove the upper plastic layer 8 and, where appropriate, part of the central element 7 without the risk of coming into contact with the fingerprint sensor 2,3. The protective sheet 6 serves here as a martyr and extends between the tool 16 and the fingerprint sensor 2,3, throughout the removal step. This is made possible by the fact that the thickness of the protective sheet 6 is greater than the depth tolerance of the machining, which is typically of the order of +/- 15 μm. The thickness of the protective sheet 6 however advantageously remains sufficiently small for the protective sheet 6 to be able to be removed by tearing off by the tool 16 during removal. According to a preferred embodiment, the withdrawal depth 13 is adjusted in the middle of the thickness of the protective sheet 6.
    According to another characteristic, more particularly illustrated in FIG. 9, the removal step uses a tool 16, such as a milling cutter, the end cone of which has a significant half-angle at the top. We consider important a half-angle at the top greater than or equal to 80 °. This advantageously makes it possible to obtain a profile for cutting the upper plastic layer 8 which has a gentle slope 17. In addition to aesthetic virtues, this characteristic allows easy and pleasant tactile guidance of the finger in order to achieve centering on the sensitive element 2.
    It was previously mentioned a risk of ejection from the thin plastic card 1 due to the rigidity of the component
    2.3 integrated greater than that of the thin plastic card 1. Also it is desirable to have a component
    2,3 having a flexibility greater than or equal to that of the thin plastic card 1.
    For this it is necessary that all the components 2,3,5 of the component are flexible. Although this is not the subject of the present, it is known or in development of flexible sensitive elements 2. The printed circuit 5 is advantageously flexible.
    Up to now, it has been considered a fingerprint sensor of any type and which can be in one piece. In the following, it is considered that the fingerprint sensor comprises a sensitive element 2 and a conductive bezel 3. This conductive bezel 3 is arranged at the periphery of the sensitive element 2, on at least one side. The conductive bezel 3 thus borders the sensitive element 2 on one side, on two adjacent sides, on two opposite sides, on three sides or even on four sides, in that it completely surrounds the sensitive element 2.
    In the embodiments comprising a conductive bezel 3, the present relates to an embodiment of the conductive bezel 3 so that it is flexible. It follows from the principle of a fingerprint sensor comprising a conductive bezel 3 that said conductive bezel 3 must be electrically conductive and ensure electrical continuity between its upper face capable of coming into contact with the finger and its lower face capable of being connected, via the printed circuit 5. This can be achieved by providing a flexible conductive bezel 3 in the following manner, more particularly illustrated in FIGS. 11 and 12. According to one characteristic, the conductive bezel 3 comprises a first printed circuit 18 forming its upper face . It also comprises a second printed circuit 20 forming its lower face. An insert 19 is placed between the first printed circuit 18 and the second printed circuit 20 in order to obtain the desired thickness for the conductive bezel 3. The insert 19 does not have to be conductive and can be made of any material, advantageously in plastic. A conductive means 21 connects the first printed circuit 18 to the second printed circuit 20, in order to ensure the function of electrical continuity between upper face and lower face. The conductive means 21 can be produced by any means.
    According to another advantageous characteristic, the first printed circuit 18, the second printed circuit 20 and the conductive means 21 are cut in one piece from a flexible printed circuit sheet, the conductive means 21 being a fastener disposed between the first printed circuit 18 and the second printed circuit 20. An exemplary embodiment is proposed in FIG. 11. Said fastener, produced in flexible printed circuit, if necessary still softened, is foldable. This allows the first printed circuit 18 to be folded over the second printed circuit 20, so as to form a sandwich in which the insert 19 is inserted. This makes it possible to form a flexible conductive bezel 3 as illustrated in FIG. 12.
    The illustrations show a flexible conductive bezel 3 of rectangular shape able to frame the sensitive element 2. The principle described is obviously applicable to any shape (linear, one side, two sides, in one or more parts,
    etc. ) ofIn conductive bezel 3. modes of realization where the sensor imprint digital includes a conductive bezel 3, The stage Welding can get break down in one step of welding bezel
    conductor 3 on the printed circuit 5 and a step of soldering the sensitive element 2 on the printed circuit 5. These two steps can be carried out simultaneously or in any order.
    The establishment of the sensitive element 2 and its welding on the printed circuit 5, can be carried out at two times in the integration process. According to a first embodiment, the sensitive element 2 is introduced and welded before the covering step. It is then present during the subsequent stages and in particular undergoes the operations of resinating, rolling and shrinking. It is then protected by the protective sheet 6. It becomes accessible again following the removal step. According to another embodiment, the sensitive element 2 is introduced and welded after the removal step. In this other mode, the protective sheet 6 makes it possible to maintain a location for the sensitive element 2, including through the resinating operation. This other embodiment may prove to be advantageous in that it saves the sensitive element 2 from having to undergo the intermediate operations, in particular the operations of resinating, rolling and shrinking, which can be annoying.
    So far, it has been considered a conductive bezel 3 of any shape. In the following, it is considered that the conductive bezel 3 forms a closed frame and comprises a cavity 4 capable of accommodating the sensitive element 2. The conductive bezel 3, by its very form comprising a cavity 4, is not very capable of being gripped and manipulated by a suction gripper, a tool conventionally used for placing a component on a printed circuit
    5.
    Also, according to an advantageous characteristic, the covering step is carried out before the step of soldering the conductive bezel
    3.
    Thus, the conductive bezel 3, equipped with the protective sheet
    6, has a flat and continuous upper surface.
    The assembly can then be grasped and manipulated by means of a suction gripper coming into contact with protective sheet 6, typically in line with the cavity
    According to another characteristic, the conductive bezel 3aa and the a printed circuit 5 are advantageously drilled with at least hole 22 passing through, a hole 22 in the printed circuit 5 being disposed opposite a hole 22 in the conductive bezel
    3. Said at least one hole 22 is advantageously made prior to the resinating operation. It follows that this (s) hole (s) is (are) thus advantageously filled (s) with resin during the resinating step. This contributes to ensuring the assembly and cohesion of the conductive bezel 3 with the printed circuit 5.
    According to another characteristic, more particularly illustrated in FIG. 10, a hole 22 has a circular or oblong section.
    According to another characteristic, said at least one hole 22 is disposed outside the contour 12 of the protective sheet 6. Thus said at least one hole 22 is not closed by the protective sheet 6, allowing the penetration of resin.
    According to another characteristic, said at least one hole is disposed outside the withdrawal contour 10. Thus said at least one hole 22 is not discovered by the withdrawal operation and remains under the upper plastic layer 8 and masked by she.
    The thin plastic card 1 can be a plastic card as defined by standard ISO / IEC 7810. It can thus be a bank card, an access and transport card, a card insured person, an identity document. The fingerprint sensor then makes it possible to secure said card or said document in which / which it is integrated.
    The invention also relates to a thin plastic card 1 incorporating a fingerprint sensor 2,3 obtained by such a method.
    权利要求:
    Claims (19)
    [1" id="c-fr-0001]
    1. Method of integration into a thin plastic card (1) such as a fingerprint sensor (2,3), which it includes the printed circuit fingerprint sensor (5),
    - cover of the protective sheet fingerprint sensor (6) arranged with a fingerprint (2,3) welded to the circuit of a component characterized by welding the following digital steps (2,3) to a digital (2,3) on one side of the resining of a print (5), the protective sheet
    - placement (8) above
    - positioning (9) below the lower upper lamination by a sensor opposite the face intended to be printed (5), assembly comprising at least the fingerprint sensor (2,3): ion (6), in order to form an element of at least one layer the central element (7), a layer of at least
    1 circuit element and central plastic upper central lower plastic (7), comprising (8), the central element (7) and the layer (9), and according to a withdrawal contour (10), of the element central (7) of the fingerprint sensor to be released, at least digital (2,3).
    of a whole plastic plastic layer
    - removal, upper plastic (8), protective sheet (6) at the digital right (2,3) in such a way partially, the fingerprint sensor the layer and the
    [2" id="c-fr-0002]
    2. Method according to claim 1, wherein the protective sheet (6) has a thickness between 30 and 100 μm, preferably equal to 60 μm and is preferably made of PET.
    [3" id="c-fr-0003]
    3. Method according to any one of claims 1 to 2, wherein an outline (12) of the protective sheet (6) is strictly included in the withdrawal outline (10).
    [4" id="c-fr-0004]
    4. Method according to any one of claims 1 to 3, wherein the protective sheet (6) is assembled to the fingerprint sensor (2,3) by an adhesive.
    [5" id="c-fr-0005]
    5. Method according to any one of claims 1 to 4, wherein the upper plastic layer (8) is shaped to include a cavity capable of accommodating the fingerprint sensor (2,3), the bottom of the cavity being disposed next to the fingerprint sensor (2,3).
    [6" id="c-fr-0006]
    6. Method according to any one of claims 1 to 5, wherein the withdrawal depth (13), in line with the fingerprint sensor (2,3), is strictly greater than the thickness (14), in line the fingerprint sensor (2,3), the upper plastic layer (8) and strictly less than the cumulative thickness (15), in line with the fingerprint sensor (2,3), the plastic layer upper (8) and the protective sheet (6), in order to remove the upper plastic layer (8) entirely, without risk for the fingerprint sensor (2,3).
    [7" id="c-fr-0007]
    7. Method according to any one of claims 1 to 6, comprising before the resinating step the following steps:
    - establishment of at least one plastic element (23,24) comprising a cutout capable of accommodating the printed circuit (5) and the fingerprint sensor (2,3), establishment of the printed circuit (5) and the fingerprint sensor (2,3) in the cutout,
    - Assembling said at least one plastic element (23,24) with the printed circuit (5).
    [8" id="c-fr-0008]
    8. Method according to any one of claims 1 to 7, wherein the withdrawal contour (10) is strictly included in an external contour (11) of the fingerprint sensor (2,3), in order to maintain an overlap of the outer contour (11) of the fingerprint sensor (2,3) by the upper plastic layer (8).
    [9" id="c-fr-0009]
    9. Method according to any one of claims 1 to 8, wherein the removal step uses a tool (16), such as a milling cutter, the end cone of which has a large angle at the top so that the profile of the cutting of the upper plastic layer (8) has a gentle slope (17).
    [10" id="c-fr-0010]
    10. Method according to any one of claims 1 to 9, wherein the fingerprint sensor (2,3) comprises a sensitive element (2) and a conductive bezel (3) disposed at the periphery of the sensitive element ( 2), and where the conductive bezel (3) comprises a first printed circuit (18) forming its upper face, a second printed circuit (20) forming its lower face, an interlayer (19) disposed between the first printed circuit (18) and the second printed circuit (20), and conductive means (21) connecting the first printed circuit (18) to the second printed circuit (20).
    [11" id="c-fr-0011]
    11. The method of claim 10, wherein the first printed circuit (18), the second printed circuit (20) and the conductive means (21) are cut in one piece from a flexible printed circuit sheet, the conductive means (21 ) being a fastener arranged between the first printed circuit (18) and the second printed circuit (20), said fastener being foldable, so as to form a sandwich enveloping the interlayer (19).
    [12" id="c-fr-0012]
    12. Method according to any one of claims 10 or
    11, where the step of soldering comprises a step of soldering the conductive bezel (3) on the printed circuit (5) and a step of soldering the sensitive element (2) on the printed circuit (5), and where l 'step of welding the sensitive element (2) is performed before the covering step, or after the removal step.
    [13" id="c-fr-0013]
    13. Method according to any one of claims 10 to
    12, where the conductive bezel (3) forms a closed frame and comprises a cavity (4) capable of accommodating the sensitive element (2), and where the covering step places the protective sheet (6) on the conductive bezel (3) so as to close the cavity (4) and is preferably carried out before the step of welding the conductive bezel (3), in order to facilitate the handling of the conductive bezel (3) by means of a suction gripper.
    [14" id="c-fr-0014]
    14. Method according to any one of claims 10 to 13, wherein, prior to the resinating operation, the conductive bezel (3) and the printed circuit (5) are pierced with at least one hole (22) passing through look.
    [15" id="c-fr-0015]
    15. The method of claim 14, wherein said at least one hole (22) has a circular or oblong section.
    [16" id="c-fr-0016]
    16. Method according to any one of claims 14 or
    15, wherein said at least one hole (22) is disposed outside the contour (12) of the protective sheet (6).
    [17" id="c-fr-0017]
    17. Method according to any one of claims 14 to
    16, wherein said at least one hole (22) is arranged outside the withdrawal contour (10).
    [18" id="c-fr-0018]
    18. Method according to any one of claims 1 to
    17, where the thin plastic card (1) complies with ISO / IEC 7810.
    [19" id="c-fr-0019]
    19. Thin plastic card (1) incorporating a fingerprint sensor (2,3) obtained by a method according to any one of the preceding claims.
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    引用文献:
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    WO2003017211A2|2001-08-10|2003-02-27|Infineon Technologies Ag|Chip card comprising an integrated fingerprint sensor|
    US20120049309A1|2010-09-01|2012-03-01|Shoichi Kiyomoto|Smartcard integrated with a fingerprint image acquisition sensor and a method for manufacturing the smartcard|
    US9342774B1|2015-07-08|2016-05-17|Wu-Hsu Lin|Smart card with a fingerprint identifying module|FR3095056A1|2019-04-15|2020-10-16|Idemia France|Display on a smartphone screen of a contactless card positioning pattern to improve near-field communication|
    WO2020212661A1|2019-04-19|2020-10-22|Linxens Holding|Biometric sensor module for a smart card and method for manufacturing such a module|
    FR3095531A1|2019-04-23|2020-10-30|Idemia Identity & Security France|Guarantee and test label for a biometric sensor, electronic device such as a smart card, manufacturing and testing processes|
    EP3734493A1|2019-05-03|2020-11-04|Idemia Identity & Security France|Case for enrolment for smart card|
    法律状态:
    2017-11-20| PLFP| Fee payment|Year of fee payment: 2 |
    2018-06-29| PLSC| Publication of the preliminary search report|Effective date: 20180629 |
    2019-11-20| PLFP| Fee payment|Year of fee payment: 4 |
    2020-10-16| CA| Change of address|Effective date: 20200909 |
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    2021-11-18| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1663378|2016-12-26|
    FR1663378A|FR3061333B1|2016-12-26|2016-12-26|PLASTIC THIN CARD INTEGRATING A DIGITAL FOOTPRINT SENSOR AND METHOD OF MAKING SAME|FR1663378A| FR3061333B1|2016-12-26|2016-12-26|PLASTIC THIN CARD INTEGRATING A DIGITAL FOOTPRINT SENSOR AND METHOD OF MAKING SAME|
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