• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method of providing a self-assembled extended field of view receiver for a lidar system. The method comprises: manufacturing a plurality of subunits (402) on a flat substrate, each subunit (402) comprising: an optical sensing structure configured to receive at least a portion of an optical wavefront incident on one or more of the subunits (402), and material that forms a portion of a hinge (408) in a neighborhood of an edge with at least one adjacent subunit (402); removing at least a portion of the substrate at respective edges between each of at least three different pairs of subunits (402) to enable relative movement between the subunits (402) in each pair limited by one of the hinges (408); and providing one or more actuators configured to apply a force to fold a connected network of multiple subunits (402) into a non-planar formation. (Machine-translation by Google Translate, not legally binding)
    公开号:ES2868573A1
    申请号:ES202030328
    申请日:2020-04-21
    公开日:2021-10-21
    发明作者:Balbás Eduardo Margallo
    申请人:Mouro Labs S L；
    IPC主号:
    专利说明:

    [0002] OBJECT OF THE INVENTION
    [0004] This disclosure relates to the provision of a self-assembled extended field of view receiver for a LiDAR system.
    [0006] BACKGROUND OF THE INVENTION
    [0008] A variety of types of LiDAR systems use various kinds of optical elements to receive light in a desired field of view (FOV). In some systems, clusters of focal planes are used in an imaging configuration, in which different parts of a field of view are represented in different respective elements of the cluster. In some systems, elements can be manufactured on a convex substrate, but some manufacturing processes, such as manufacturing that requires manual assembly, can add undue cost and complexity to the assembly process.
    [0010] DESCRIPTION OF THE INVENTION
    [0012] In one aspect, in general, a method comprises: fabricating a plurality of subunits on a planar substrate, wherein each subunit comprises: an optical sensing structure configured to receive at least a portion of an optical wavefront incident on a or more of the subunits, and material that forms at least a portion of a hinge in a neighborhood of an edge with at least one adjacent subunit; removing at least a portion of the substrate at respective edges between each of at least three different pairs of subunits to enable relative movement between the subunits in each pair limited by one of the hinges formed from the material; and providing one or more actuators configured to apply a force to fold a connected network of multiple subunits into a non-planar formation.
    [0014] Aspects may include one or more of the following characteristics:
    [0015] One or more of the actuators are configured to apply a magnetic force.
    [0017] One or more of the actuators configured to apply a magnetic force comprise a ferromagnetic material.
    [0019] One or more of the actuators configured to apply a magnetic force comprise a flat coil formed on a surface of a subunit.
    [0021] The removal comprises removing at least a portion of the substrate at an edge between each of at least eleven different pairs of subunits.
    [0023] The method further comprises fabricating at least one layer on the planar substrate that includes conductive material to provide electrical communication between at least one pair of adjacent subunits.
    [0025] The method further comprises fabricating at least one layer on the planar substrate that includes an optical waveguide to provide optical communication between at least one pair of adjacent subunits.
    [0027] The method further comprises securing the subunits together after the actuators fold the connected array of multiple subunits into the non-planar array.
    [0029] The method further comprises positioning a solid support body in proximity to at least one of the subunits to limit movement of at least one of the multiple subunits and to at least partially determine a non-planar array geometry.
    [0031] The solid support body has a remanent magnetization and interacts with the subunits through its magnetic field.
    [0033] The method further comprises attaching the subunits to the support body.
    [0035] In another general aspect, an article of manufacture comprises: a plurality of subunits fabricated on a planar substrate, wherein each subunit comprises: an optical sensing structure configured to receive at least a portion of a optical wavefront incident on one or more of the subunits, and material that forms at least a portion of a hinge in a vicinity of an edge with at least one adjacent subunit; at least one gap along respective edges between each of at least three different pairs of subunits to enable relative movement between the subunits in each pair limited by one of the hinges formed from the material; and one or more actuators configured to apply a force to fold a connected network of multiple subunits into a non-planar formation.
    [0037] Aspects may comprise one or more of the following characteristics:
    [0039] The article further includes at least one emission module configured to provide an optical wave of illumination that illuminates at least a portion of a field of view.
    [0041] The article further includes circuitry configured to determine distances associated with one or more portions of the field of view based on outputs from the optical sensing structures.
    [0043] The non-planar array is designed to combine the field of view of the optical sensing structures into an uninterrupted composite field of view.
    [0045] At least one optical waveguide connecting the subunits is used to provide a time, frequency or phase reference to enable ranging.
    [0047] At least one electrical conductor connecting the subunits is used to provide a time, frequency, or phase reference to enable ranging.
    [0049] Aspects can have one or more of the following advantages:
    [0051] An advantage is the simplicity of the assembly process, which allows a greater number of individual sensors to be used, with a more granular subdivision of the field of view. Sufficiently high space density sampling can reduce or eliminate the need for mechanical scanning, as long as there are no blind regions between individual FOVs. Conversely, greater coverage can be achieved for a limited field of view given by individual sensor.
    [0052] DESCRIPTION OF THE DRAWINGS
    [0054] To complement the description made and to help towards a better understanding of the characteristics of the invention, according to a preferred example of practical embodiment thereof, a set of drawings is attached as an integral part of said description in which, with illustrative and non-limiting character, the following is represented:
    [0056] Figures 1A and 1B.- Show diagrams of a dodecahedron-shaped sensor showing an assembled view and a flat deployed view, respectively.
    [0058] Figures 2A and 2B.- Show diagrams of example hinge assemblies.
    [0060] Figures 3A and 3B.- Show diagrams of a truncated icosahedron-shaped sensor showing an assembled view and a flat deployed view, respectively.
    [0062] Figure 4.- Shows a diagram of a sensor with the shape of a dodecahedron and magnetic components.
    [0064] Figures 5A and 5B.- Show example magnetic field pattern diagrams.
    [0066] Figure 6.- Shows a graph of examples of various effects and corresponding regions of maximum displacement versus maximum force.
    [0068] Figure 7.- Shows a diagram of an example hemispherical housing with an array of microlenses for focus or FOV adjustment.
    [0070] PREFERRED EMBODIMENT OF THE INVENTION
    [0072] Implementations of a light sensing and distance measurement system may include a self-assembled sensor that provides extended angular coverage. This self-assembled sensor can be achieved, for example, by combining the individual fields of view of multiple individual subunits to collectively form a composite field of view, in which the subunits are assembled into a three-dimensional (3D) structure designed on a single planar substrate.
    [0073] Self-assembly refers to any of a variety of features that can be included in or attached to the subunits to enable or facilitate relative movement of the subunits such that they transition from an initial state (e.g., an initial flat state) to an assembled state, such as the designed 3D structure, in which the sensor will be used, as described in more detail below.
    [0075] Figure 1A shows an example dodecahedron-shaped sensor (100) in an assembled state. The entire sensor has a large compound field of view. Each subunit (eg, subunit i and subunit j) has a smaller individual field of view (eg, FOVi and FOVj), each of which is centered on an axis in a different direction. There is also a mechanical hinge (102) between some of the subunits to enable self-assembly. Figure 1B shows a flat deployed state of the sensor (100) showing a position of one of the mechanical hinges (102) between two of the subunits.
    [0077] The subunit structure can be assembled into a support body (eg, a rigid hollow support body, or a solid support body), for example, by folding a flat sensor pattern into the support body. This planar sensor design of the preassembled subunits can be in the form of an array of subunits interconnected. This arrangement can be manufactured using planar technology, in which each subunit is formed on a different portion of a substrate that is provided as a wafer of a substrate material. Such wafers can be produced from glass, quartz, sapphire, for example, or from semiconductor materials such as silicon, indium phosphide, gallium arsenide, and others.
    [0079] Each of the subunits in the array can be configured to function as an individual sensor element that is capable of LiDAR imaging within its individual field of view. For this, different techniques can be applied, such as time of flight LiDAR, frequency modulated continuous wave LiDAR, two wavelength LiDAR, etc. The subunits can be configured to use focal plane groupings, aperture plane groupings, or can be configured to include mechanical scanning techniques based on MEMS.
    [0081] In some implementations of the manufacturing process, steps are introduced at a given point in the process to produce mechanical connections between the subunits.
    [0082] Such connections are configured to allow the subunits to move angularly relative to each other while maintaining the distance across the connection substantially constant, effectively configuring a hinge between the two subunits. Such hinges can be made of materials that have sufficient elasticity / plasticity and are configured to allow such movement.
    [0084] Alternatively, the hinges can be made of substantially rigid materials, but are configured to have a discontinuity between the parts so that they can move relative to each other, with the geometry of the parts limiting movement to provide the desired hinge function. To make such hinges, layers of flexible materials can be used, including polymer layers, inorganic dielectric layers, metal or semiconductor layers. Such layers can then be embossed using photolithography, electron beam lithography, ion beam milling, or other methods.
    [0086] In a particular implementation of a hinge assembly shown in Figure 2A, a continuous strip of polymer connects two subunits, subunit i and subunit j, at two points through two cantilevers (202A, 202B) attached to two different locations at the two subunits. The rigidity of the subunits ensures that such cantilevers can only deform out of plane and provide the desired hinge functionality. The assembly also enables optical and / or electrical connections to be made between neighboring subunits at one or more locations, as shown by optical / electrical bus couplers (204) connecting to an optical / electrical bus (206) in proximity. to the hinge.
    [0088] In another particular implementation of a hinge assembly shown in Figure 2B, a thin silicon layer is stamped to produce several beams (210A, 210B, 210C, 210D) that act as torsional hinges between two subunits, subunit i and subunit j. The configuration of the multiple torsion hinges along a common axis ensures that rotation is substantially limited around that single axis.
    [0090] At a given point in the manufacturing process, steps are included to produce the couplers 204 and bus 206 that provide electrical and / or optical connections between the subunits. Such connections will provide a time base for the synchronization of the LiDAR receivers in each subunit with the emitter capable of producing the desired ranging function. This synchronization can be obtained from a phase, frequency, or time reference in an optical or electrical signal.
    [0092] For example, the edge of a pulse can be used to determine the start of a range period and the reference for measuring distances in a time-of-flight setting. Alternatively, the optical frequency in a waveguide can serve as a reference for calculating distance in a frequency modulated continuous wave (FMCW) scheme. In an alternative implementation, the phase can serve as a reference for calculating the distance in a phase shift keying (PSK) coding scheme. Such electrical and / or optical connections can additionally be used to transfer distance measurement and imaging information from each subunit, or to power individual subunits.
    [0094] Electrical connections can be provided by depositing one or more conductive or metallic layers on a block substrate and stamping them onto individual conductors that are part of the couplers (204) and bus (206). Suitable materials include aluminum, gold, chromium, titanium, platinum, copper, or indium tin oxide, among others. Deposition of these layers can be done using spraying, evaporation or metallization. Stamping of the layers can be done using photolithography, electron beam lithography, ion beam milling or otherwise.
    [0096] Optical connections can be provided by depositing one or more transparent materials on a block substrate, such as dielectrics and semiconductors, and stamping them to define waveguides that are part of the couplers (204) and bus (206). Commonly used materials include silicon oxide, silicon nitride, silicon oxynitride, silicon, gallium arsenide, indium phosphide, siloxane-based polymers, halogenated acrylate polymers, fluorinated acrylate polymers, and other polymers. The creation of these layers can be done using expitaxial growth, doping, evaporation, chemical vapor deposition, spraying or otherwise. Stamping of the layers can be done using photolithography, electron beam lithography, ion beam milling or otherwise.
    [0098] Given the mechanical movement that occurs during assembly, there will be stresses and forces that can be carefully managed to prevent breakage of electrical conductors and / or optical waveguides. In particular, it may be advisable to introduce serpentine bends or other spring-like structures that can absorb the deformation at low stress levels. Stress concentration points, such as those arising from geometry or abrupt transitions between two regions with different material properties, can be avoided. Additionally, it is possible to create long self-contained sections (220) along the rotational axis of the hinge to distribute the torsional stress (again referring to Figure 2A).
    [0100] At another point in the manufacturing process, measures will be introduced that will individualize (or separate) these subunits from the substrate block and from each other. Different technologies can be used for this, including DRIE, RIE, wet etching, laser cutting, dicing, and others. In some implementations, such an individualization is substrate block selective and allows interconnections between the subunits to be functional. One way to achieve this is to have a protective layer between the substrate being removed and the different functional layers. Another way is to use a process that is selective for the substrate block only. Another way is to use a timed process, so that the process stops before the functional layers start to be affected.
    [0102] The individualized planar sensor design from the substrate block may, for example, correspond to the polygonal lattice of a polyhedron. In some implementations, the network will have faces that define the subunits and edges that create connection points between the subunits. These edges will allow movement between the different subunits so that the structure can be assembled in three dimensions. This relative rotation of two adjacent subunits around an edge can be allowed using mechanical hinges, or latches, or through the use of flexible or plastic connections between the subunits, as described above. In some implementations, the subunits are electrically and / or optically connected through the hinges. This can be accomplished using waveguides and / or metal buses configured to go through the units, as described above.
    [0104] One or more of the subunits may include or physically connect for further electro-optical instrumentation that may extend into a portion of the substrate of a given subunit, which may act as a base for the given subunit, or may be attached to an appropriately shaped material that forms a basis for the given subunit. These subunits may contain additional electronics to amplify, digitize, parallel-to-serial convert, and / or otherwise multiplex the signals from the individual sensing subunits. These components can be attached to the base, forming extended subunits, and may have optical interfaces to an optical fiber, a light source and / or external detectors, to allow the LiDAR scanning function of the individual subunits. Alternatively, these components can be included monolithically in the base and / or included through hybrid component integration.
    [0106] The polyhedron can be one of Platonic solids, that is, a tetrahedron, a cube, an octahedron, a regular dodecahedron, or a regular icosahedron. The advantage of a regular solid is that all dihedral angles between subunits are equal, providing a uniformly spaced partition of the solid angle around the sensor. An irregular solid can also be used, such as a truncated icosahedron (or a pentakis dodecahedron), as shown in Figures 3A and 3B in assembled and unfolded states, respectively.
    [0108] As the number of faces increases, a better approximation to the sphere can be obtained, and the dihedral angles between the faces become flatter and the division of the solid angle in the desired composite field of view becomes finer, meaning that each subunit needs to scan only a smaller solid angle. A geodesic polyhedron, a sphere UV approximation, a Goldberg polyhedron or any other tessellation of the sphere with a sufficient polygon count can be used. These tessellations can be expanded into a flat web which can then be folded into a final desired 3D shape.
    [0110] The tessellation can also correspond to a non-spherical shape or only to a part of the sphere. For example, the tessellation can correspond to an ellipsoid, a cylinder, a cone or a section of these. The choice of shape will depend on the desired subunit distribution and the composite field of view that the system is trying to reproduce.
    [0112] Additionally, the device can include drive mechanisms that bias two adjacent subunits at an angle relative to each other. These drive mechanisms can define mechanical rotation and connect only the subunits mechanically, or they can be supplemented with other mechanical elements, as described above. In one implementation, a layer with projected stress levels will be used to produce an out-of-plane spring that is at equilibrium or beyond the target angle for each subunit connection. After Releasing the device during or at the end of the manufacturing process, the springs will bring the subunits to their final positions, potentially guided by contact with the support body.
    [0114] In some implementations, the actuation mechanism may be based on a two-material bundle that exhibits a bending moment when heated and induces rotation around the hinge. The two materials in this layer can be chosen so that the difference in coefficients of expansion results in a lattice curvature in the layer within a selected temperature range. The force of the actuators can be designed to counteract the device mass and stiffness of any potential mechanical hinge or support in the target position.
    [0116] Device mass can be reduced by etching part of the block substrate without affecting the optically functional layers of each of the subunits. In particular, it may be possible to remove the block substrate entirely, except for the boundaries that define the different subunits.
    [0118] In some implementations, the drive mechanism depends on the change of phase or state of a material. This phase change can be induced by a change in temperature or under lighting, for example, and the change in material shape and / or volume can result in a mechanical actuation effect. These actuators include paraffin-based actuators, shape memory alloys, photoinduced phase transition polymers (eg, polydiacetylene, as described in Ikehara et al., Sensors and Actuators A: Physical, Volume 96, Issues 2 3, 28 February 2002, Pages 239-243, incorporated herein by reference) or hydrogel-based devices. An advantage of these devices is the high forces they can produce, which can reduce the need for mass reduction and substrate etching.
    [0120] Other actuation techniques may be used including MEMS-based techniques, such as depositing and stamping ferromagnetic materials on the substrate (eg, nickel, cobalt, steel, etc.). This can be done through spraying, evaporation, metallization, or a combination of these. The deposited layer would not by default be a permanent magnet. In this case, a permanent magnet can be used on the support body to produce the forces that result in self-assembly of the structure. Alternatively, fields can be applied external magnets generated by electromagnets or permanent magnets to produce the desired forces. Without being limited by theory, examples of equations that can be used to calculate various parameters include the following. The force on a ferromagnetic particle can be determined as:
    [0125] Where V is the volume, x is the susceptibility of the particle, and B and H are the magnetic induction and magnetic field strength, respectively. The field of a permanent magnet sphere is defined by that of a magnetic dipole outside its volume:
    [0130] Where m is the magnetic dipole moment. For a permanent magnet with a remanent field the dipole moment is:
    [0132] m = - nR 3 Br
    [0134] Figure 4 shows an example of a dodecahedron-shaped sensor assembly (400) in an unfolded state, including subunits (402) that include circular portions that are coated with ferromagnetic material (404), a flexible sheet material (406 ) on a surface of the subunits, and hinge areas (408) formed between neighboring subunits. A neodymium ball magnet (410) is placed in one of the subunits. Figures 5A and 5B show illustrative magnetic fields and corresponding forces, respectively, for an assembly having the dipole moment of a magnetic permanent magnet (eg, such as ball magnet 410) with a diameter of 3mm, and the forces in circular subunits with a diameter of 1.8 mm coated with 0.5 pm of ferromagnetic material (for example, such as material (404)) with susceptibility x = 20. The magnetic field pattern of Figure 5A results from a dipole pointing in the horizontal direction with intensity shown on a logarithmic scale and with superimposed field lines. The force pattern in Figure 5B resulting from the lattice force exerted by a spherical permanent magnet on the thin layer of thickness 0.5 pm, and radius 0.92 mm with intensity shown on a logarithmic scale and with lines overlapping fields.
    [0136] Alternatively, an external magnetic field can be applied and modulated in amplitude and direction to control overall operation. The materials Ferromagnetic can be put in an external field to induce permanent magnetization in its volume and support the whole. As an alternative to ferromagnetic materials, microcoils can be defined in the substrate such that they experience a Lorentz force and a torque. Therefore, the external magnetic field can be used to create the desired forces on the subunits to induce self-assembly. Each micro coil can be actuated independently or all of them simultaneously. The forces can result from the interaction with an external field or from a permanent magnet or an electromagnet, a field generated by another micro coil on the same substrate, or interaction with a ferromagnetic material that can be embedded in the substrate or in the body. of support.
    [0138] Other options, such as electrostatic actuation, piezoelectric layers, etc., can be used for the same effect. Figure 6 shows examples of various effects that can be used to provide forces for self-assembly, and corresponding regions of maximum displacement versus maximum force (represented with logarithmic scales for each axis), which is based on a similar graph that appears in DJ Bell et al. to the. J. Michromech. Microeng. 15 S153, 2005, incorporated herein by reference.
    [0140] The structure can be designed to include contact points between the subunits such that they lock in place during the actuation process. In that case, there may be no need for a support body. This blocking can be achieved solely through mechanical structures, or it can involve the use of a gluing, soldering or resistance welding step.
    [0142] Each of these subunits can be coupled to a receiving module that collects light from the field of view corresponding to that subunit. The receiving modules can include components configured to discriminate the angular direction of received light within the field of view. This can be accomplished through an imaging sensor in the focal plane of a telescopic lens. It can also be achieved through in-phase array, through a single beam from a single lens-coupled waveguide and MEMS scanner, or through independent heterodyne-mixing aperture array with a local oscillator, as described in U.S. Provisional Patent Application Serial No. 62 / 839,114, filed April 26, 2019, incorporated herein by reference, for example. The LiDAR system can also include one or more modules or emission modules. These one or more emission module (s) may be coupled to the subunits (for example, in a structure with the receiver modules), or they may be independent of the subunits.
    [0144] In the case of subunits based on sensors designed as focal plane arrays, lenses can be used. Such lenses can be produced as shell sections with the individual microlenses protruding (or as inserts) from the outer surfaces, as in the microlens array (700) shown in Figure 7, and / or inner surfaces. The shape (spherical or not) and microlens distribution of that structure will reflect the internal sensor design. The self-assembled focal plane sensor can be mechanically assembled and aligned with the focusing frame. Glasses can also be used to adjust the field of view of aperture plane cluster designs, as described in United States Patent Application Publication US2017 / 0350965A1, incorporated herein by reference, such shapes can be produced using 3D printing high precision, molding, machining or through any other suitable technology.
    [0146] The emission module (s) will illuminate the composite field of view, in part or in full. In particular, a single emission module is possible. Each emitter module can include a diffuser or a focusing lens that directs light at a given solid angle; It can also include a beam steering element that allows the system to direct the light in a specific direction. This beam steering element can be based on mechanical actuation or phased array, for example.
    [0148] The emission module or modules can be coordinated with the plurality of reception modules in the different subunits through electronic circuitry. The emitting module (s) can share physical space and focusing optics with the receiving modules, or they can be separated. The overlap between the illumination of the emitting module (s) and the angularly resolved information of the receiving modules results in the ability to explore the sensor environment in 3 dimensions.
    [0150] Technical problems addressed by some of the techniques described in this document include the generation of a LiDAR system with a large FOV, which can be extended to full spherical coverage. Many previous LiDAR systems have significantly less than full spherical coverage. LiDAR systems with great Angular coverage can also be relatively expensive and bulky for many applications.
    [0152] The technical approaches described address potential problems by allowing low cost fabrication of a LiDAR system with a wide composite field of view. This is possible, in part, due to the self-assembly feature disclosed herein, coupled with monolithic fabrication of the combined LiDAR multi-sensor subsystems for each viewing direction.
    [0154] Some systems extend the field of view through the rotation of an array of sensors. Alternatively, a single set of multiple independent sensors could be used in a single body. These systems can require significantly more assembly effort, additional components, and / or can result in bulkier and more expensive devices.
    [0156] A potential advantage of the techniques described in this document is the simplicity of the assembly process, which allows a greater number of individual sensors to be used, with a more granular subdivision of the field of view. Sufficiently high space density sampling can reduce or eliminate the need for mechanical scanning, as long as there are no blind regions between individual FOVs. Conversely, greater coverage can be achieved for a limited field of view given by individual sensor.
    [0158] A polyhedral network may not have a 100% fill factor when the device is manufactured on a substrate such as a wafer. This can lead to a marginal increase in the cost of manufacturing the sensor.
    [0160] Additional processing steps may be required to create connections between the subunits and for their individualization, usually once the remainder of the device is manufactured. This can lead to an increase in manufacturing costs. However, since this can be done in a batch manner, it can have a minor impact on the total cost of the device and be considerably offset by reduced assembly time, materials, and process complexity.
    [0162] While the disclosure has been described in connection with certain embodiments, it should be appreciated that the disclosure will not be limited to the disclosed embodiments but instead rather, it is intended to cover various modifications and provisions included within the scope of the appended claims, the scope of which will be given the broadest interpretation to encompass all such modifications and equivalent structures as permitted by law.
    权利要求:
    Claims (17)
    [1]
    1. - Method to provide a self-assembled extended field of view receiver for a LIDAR system, comprising the steps of:
    fabrication of a plurality of subunits (402) on a flat substrate, wherein each subunit (402) comprises:
    an optical sensing structure configured to receive at least a portion of an optical wavefront incident on one or more of the subunits (402), and
    material that forms at least a portion of a hinge (408) in a neighborhood of an edge with at least one adjacent subunit (402);
    removal of at least a portion of the substrate at respective edges between each of at least three different pairs of subunits (402) to enable relative movement between the subunits (402) in each pair limited by one of the hinges (408) formed from of the material; and provision of one or more actuators configured to apply a force to fold a connected network of multiple subunits (402) into a non-planar formation.
    [2]
    2. - The method of claim 1, wherein one or more of the actuators are configured to apply a magnetic force.
    [3]
    3. - The method of claim 2, wherein one or more of the actuators configured to apply a magnetic force comprise a ferromagnetic material (404).
    [4]
    4. - The method of claim 2, wherein one or more of the actuators configured to apply a magnetic force comprise a flat coil formed on a surface of a subunit (402).
    [5]
    5. - The method of claim 1, wherein the removal comprises removing at least a portion of the substrate at an edge between each of at least eleven different pairs of subunits (402).
    [6]
    6. - The method of claim 1, further comprising manufacturing at least a layer on the flat substrate that includes conductive material to provide electrical communication between at least one pair of adjacent subunits (402).
    [7]
    7. - The method of claim 1, further comprising fabricating at least one layer on the flat substrate that includes an optical waveguide to provide optical communication between at least one pair of adjacent subunits (402).
    [8]
    The method of claim 1, further comprising securing the subunits (402) together after the actuators fold the connected network of multiple subunits (402) into the non-planar formation.
    [9]
    9. - The method of claim 1, further comprising placing a solid support body in proximity to at least one of the subunits (402) to limit the movement of at least one of the multiple subunits (402) and to determine the least partially a non-planar formation geometry.
    [10]
    10. - The method of claim 9, wherein the solid support body has a remanent magnetization and interacts with the subunits (402) through its magnetic field.
    [11]
    11. - The method of claim 9, further comprising fixing the subunits (402) to the support body.
    [12]
    12. - A device comprising:
    a plurality of subunits (402) fabricated on a flat substrate, wherein each subunit (402) comprises:
    an optical sensing structure configured to receive at least a portion of an optical wavefront incident on one or more of the subunits (402), and
    material that forms at least a portion of a hinge (408) in a neighborhood of an edge with at least one adjacent subunit (402);
    at least one gap along respective edges between each of at least three different pairs of subunits (402) to enable relative movement between the subunits (402) in each pair limited by one of the hinges (408) formed from the material; and
    one or more actuators configured to apply a force to fold a connected network of multiple subunits (402) into a non-planar formation.
    [13]
    13. - The device of claim 12, further comprising at least one emission module configured to provide an optical wave of illumination that illuminates at least a portion of a field of vision.
    [14]
    14. - The device of claim 13, further comprising circuitry configured to determine distances associated with one or more portions of the field of view based on outputs from the optical detection structures.
    [15]
    15. - The device of claim 14, wherein the non-planar formation is designed to combine the field of view of the optical detection structures into an uninterrupted composite field of view.
    [16]
    16. - The device of claim 14, wherein at least one optical waveguide connecting the subunits (402) is used to provide a time, frequency or phase reference to enable distance determination.
    [17]
    17. - The device of claim 14, wherein at least one electrical conductor connecting the subunits (402) is used to provide a time, frequency or phase reference to enable distance determination.
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    ES2868573B2|2022-02-28|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE102005006922A1|2005-02-16|2006-08-24|Conti Temic Microelectronic Gmbh|Wide angle object detection sensor for vehicle use has photodiode detectors in a grid of separated stripes on non planar support including processing components|
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