• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Microwave device manufacturing method based on empty waveguide integrated in substrate. The invention describes a method of manufacturing a microwave device based on an empty waveguide integrated in the substrate. The method comprises the steps of printing by 3D printing the body of the microwave device (1) from a polymeric material derived from a renewable source doped with at least one metal; metallizing the body surface of the microwave device (1) in two stages, according to a first autocatalytic metallization followed by a galvanic metallization; and modularly integrating the microwave device into a printed circuit board based system by removable connection means. (Machine-translation by Google Translate, not legally binding)
    公开号:ES2689355A1
    申请号:ES201830647
    申请日:2018-06-28
    公开日:2018-11-13
    发明作者:María Carmen BACHILLER MARTIN；Juan Rafael SANCHEZ MARIN；Vicente NOVA GIMENEZ；María Luisa MARIN GARCIA；José Manuel MERELLO GIMENEZ；Vicente Enrique BORIA ESBERT
    申请人:Consejo Superior de Investigaciones Cientificas CSIC；Universidad Politecnica de Valencia；
    IPC主号:
    专利说明:

    DESCRIPTION

    METHOD OF MANUFACTURE OF MICROWAVE DEVICE BASED ON EMPTY WAVE GUIDE INTEGRATED IN SUBSTRATE
     5
    Field of the Invention
    The present invention relates generally to the field of microwave devices, in particular to microwave devices on an integrated empty waveguide in a substrate, and more specifically to a new method of manufacturing them.
     10
    Background of the invention
    The current radiocommunication systems face the progressive saturation of the electromagnetic spectrum, with increasingly congested and noisy channels. This, together with increasing speed requirements, is forcing systems to migrate to higher frequency bands such as the millimeter wave band and 15 microwaves, where more free spectrum is available. This effect can be seen especially well in mobile communications that, starting from 900 MHz, evolved towards 1800 MHz, 2100 MHz, 2600 MHz and the future bands studied for 5G distributed between 6 GHz and 40 GHz. In addition, with the growth From the number of communication standards, the need to create new systems that treat the electromagnetic spectrum more efficiently has become apparent.
    For the manufacture of high frequency communications devices, milling techniques are traditionally used on blocks of conductive material (if the technology is waveguide), as well as milling and abrasion techniques of printed circuit board and galvanic metallization, together with assembly by welding or screws if the technology is SIC 25 (integrated circuits in substrate). These processes, tools and materials are expensive and not very accessible.
    A numerical control mechanical (or laser) milling machine is very expensive equipment and learning how to handle it is not easy. Many times researchers are limited by the tools available to them, since prototyping demonstrating a concept cannot be carried out without adequate tools. In addition the milling machines usually work on a space limited to the surface layers, and do not allow the creation of complex three-dimensional models.
    The new 3D printing techniques open an interesting way for simple prototyping and do not limit manufacturing to planar devices: it can be manufactured 35
    any piece you want, and also the materials and the way they are printed have very interesting electromagnetic characteristics. In addition, 3D printing allows the use of different melting materials (metals and polymers) and a immediacy unknown until now. Its use can be very interesting, either as dielectrics that fulfill a certain function in the devices, as well as the device itself, previously metallized with non-polluting techniques to achieve the necessary conductivity. However, the polymers used in 3D printing need a metallization treatment to be able to use them in certain applications.
    The use of 3D printing for the manufacture of microwave devices is a growing trend in the industry: examples of use can be found that use metals or polymers derived from petroleum as printing material.
    The new polymeric materials derived from renewable sources are becoming increasingly interesting as an alternative to petroleum-derived polymers. Polylactide (or polylactide acid, PLA) is an important example of such polymers, which is the subject of numerous investigations and applications. fifteen
    Currently, a growing interest in the application of PLA to manufacture electronic circuits has been aroused. However, to be able to use this material in the electronics industry, a polymer metallization process is needed. In this procedure, a metal layer is deposited by chemical reactions between metal ions and a reducing compound present in a metallization bath in which the part is submerged. This process occurs in the presence of a catalyst. Traditionally, for the metallization of petroleum-based polymers, the hexavalent chromium bath is used, but it is particularly polluting. There are no known suitable methods for the metallization of polymers based on renewable sources.
    For example, the document “3-D Printed Metal-Pipe Rectangular Waveguides” by Mario 25 D’auria et al. (IEEE Transactions on Components, Packaging and Manufacturing Technology, 20150821 IEEE, USA) refers to the 3D printing of rectangular waveguides from a petroleum-derived polymer (ABS) and its subsequent metallization by chemical deposition.
    The document “Surface-mountable metalized plastic waveguide filter suitable for high volume production”, by T. J. Muller et al. (European Microwave Conference, 2003, 33rd, 30 20031001 IEEE, Piscataway, NJ, USA) refers to obtaining a waveguide filter by injection molding from a polymer derived from petroleum and its subsequent metallization Chemical and galvanic.
    The document “Monolithic FFF-Printed Biocompatible, Biodegradable, Dielectric-Conductive Microsystems” by Z. Sun and L. F. Velásquez García (Journal of 35
    Microelectromechanical Systems, vol. 26, No. 6, p. 1356-1370, December 2017) refers to 3D printing from a biocompatible and biodegradable substrate, specifically PLA. However, this document does not disclose the surface metallization of the product obtained by 3D printing.
    On the other hand, one of the concerns of the communications industry with respect to its equipment is the integration of devices and technologies. Many systems are planar, that is, they are based on printed circuits on dielectric plates (called PCBs, printed circuit boards). However, the devices with the best performance are those manufactured on empty waveguides. Integrating empty waveguides into planar substrates is a technological challenge in development. 10
    Therefore, there is still a need in the art for a method that allows to obtain in a fast and economical way (3D printing) microwave devices based on empty waveguides integrated in the substrate, using as a material a polymer derived from renewable sources and its subsequent metallization, as well as the integration of said microwave devices in planar architectures, such as systems based on printed circuit boards.

    Summary of the invention
    To solve the problems of the prior art, the present invention discloses a method of manufacturing a microwave device based on an empty waveguide 20 integrated in a substrate, comprising the steps of:
    - printing, in which a body of the microwave device is printed by 3D printing from a polymeric material derived from a renewable source doped with at least one metal;
    - metallization, in which the surface of the body of the microwave device is metallized in two stages: a first autocatalytic metallization followed by a galvanic metallization; and
    - integration, in which the microwave device is modularly integrated in a system based on printed circuit board by means of detachable connection means. 30

    Brief description of the drawings
    The present invention will be better understood with reference to the following illustrative and non-limiting drawing of the invention:
    Figure 1 shows a perspective view schematically representing the
    integration of the microwave device according to the present invention in a system based on printed circuit board.

    Detailed description of the preferred embodiments
    As used herein, the term "renewable source" when referring to a polymeric material refers to a source of animal or plant origin.
    As can be seen in Figure 1, the microwave device manufactured according to the method of the present invention comprises a body of the microwave device (1), transition sections (2, 3) and an anchor base (4). As can be seen from this document, the person skilled in the art will understand that although in figure 1 two transitions (2, 3) are represented, there may be only one or more of two transition sections, depending on the particular characteristics. of the body of the microwave device (1).
    The invention generally relates to a method of manufacturing a microwave device based on an empty waveguide integrated in a substrate, comprising the steps of:
    - printing, in which the body of the microwave device (1) is printed by 3D printing from a polymeric material derived from a renewable source doped with at least one metal;
    - metallization, in which the body surface of the microwave device (1) is metallized in two stages: a first autocatalytic metallization followed by a galvanic metallization; and
    - integration, in which the microwave device is modularly integrated in a system based on printed circuit board by means of detachable connection means.
    According to the preferred embodiment of the present invention, the polymeric material is PLA 25 (derived from a starch obtained from biomass) doped with copper or bronze. This material melts at low temperature (210ºC) and can be used with a wide range of low-performance 3D printers. In addition, it does not emit pollutant gases during printing nor does it require "hot bed" as a printing medium. The resulting piece contains approximately 20% conductive material, which facilitates the adhesion of the metallization layer. 30
    Once the desired microwave device body (1) is obtained by 3D printing from PLA doped with copper or bronze, the surface thereof is metallized. According to the preferred embodiment of the present invention, the metallization is carried out in two stages: a first autocatalytic metallization followed by a galvanic metallization.
    The autocatalytic metallization stage preferably consists of a first
    Basic treatment to chemically modify the surface, which is then activated with acid and metallized in a bath with a solution of copper (or some other suitable metal), which adapts the material for subsequent galvanic metallization. After this procedure a thin layer of copper is obtained on the body of the microwave device (1). However, this thin layer of copper is insufficient to achieve the required electrical performance of a microwave device based on an empty waveguide integrated into the substrate.
    Therefore, autocatalytic metallization is followed by a stage of classical galvanic metallization, obtaining a sufficiently thick copper layer, preferably approximately 30 micrometers above the body of the microwave device (1), regular, well adhered and with identical benefits to of a device manufactured by milling on 10 a piece of conductive material, but of less weight. This metallization process is less polluting than the traditional metallization of petroleum-based polymers, in which the hexavalent chromium bath is traditionally used.
    In addition, to further reduce the weight of the microwave device, at the printing stage the body of the microwave device (1) can be printed at least partially hollow, without thereby substantially affecting the mechanical strength of the final device.
    With this technique you can manufacture any microwave device based on an empty waveguide integrated in the substrate that you want in a fast, economical and highly repetitive way. twenty
    According to the preferred embodiment of the present invention, the method further comprises the integration step, in which the body of the printed and metallized microwave device (1) is integrated as described hereinbefore in a plate-based system. of printed circuit by means of removable connection means (for example, through screws), according to what is called modular architecture. Specifically, the transition sections (2, 3) are formed to the body of the microwave device (1) and the anchor base (4) for the size of the device. The body of the microwave device (1) will be integrated on the anchor base (4), which must have the necessary dimensions to fit the transition sections (2, 3) and the holes for the through screws that will connect it to the anchor base (4). 30
    In accordance with the foregoing, the present invention presents an alternative method that allows to quickly and economically obtain microwave devices based on an empty waveguide integrated in the substrate, by 3D printing from a polymeric material derived from a renewable source doped with metal. , and by a double metallization of the surface of the body of the microwave device (1), also allowing its integration into
    planar architectures quickly and easily, which solves relevant aspects that differentiate it and give it advantages over the prior art:
    - For the manufacture and integration of SIC devices, the device must be drilled, milled and metallized on the same piece as the rest of the planar circuit. In this way, if the device deteriorates or if it wants to be replaced by another one with different characteristics, the entire printed circuit board where it is integrated would have to be remanufactured. Thanks to the method disclosed in this document, if the microwave device deteriorates, it can be changed to another without the need to modify the rest of the circuit. In the same way, if you want to use a device with different characteristics, for example a filter with different central frequency or bandwidth, you only have to change it at the anchor base (4). For example, with the same anchor a resonator or a transmission line can be integrated into a system, for which the same anchor base (4) and transition sections (2, 3) have been used.
    - On the other hand, SIC devices necessarily have the height of the substrate in which they are integrated. If you want to manufacture more complex devices, you have to do it using 15 stacks of soldered PCB boards perforated, metallized and welded together. With the integration system of the present invention the parts are easily assembled, interchangeable and the manufacture of devices of different height from that of the substrate is not a problem.
    Thus, the present invention provides several innovative aspects compared to the prior art.
    For example, the type of technology of the present invention uses an empty waveguide approach integrated into the substrate, which is known as ESIW. That is, a low-height waveguide that is manufactured to be integrated into a planar technology system, while maintaining the advantages of said planar technology, but with the smooth operation of the electromagnetic devices of the empty waveguide devices. For this, specific transitions to said planar technology and a modular way of mounting on the planar system are used.
    In addition, using a double autocatalytic and galvanic process to metallize the surface of the microwave device body (1) (this is a chemical deposition plus another electrolyte) ensures that the conductor layer is thick enough for optimum conductivity and that said layer does not come off the base material.
    On the other hand, since a petroleum-derived material is not used as the base material, but rather a material derived from a renewable source (for example PLA, which is derived from a type of starch), it does not emit toxic gases during the printing process. In addition, in the case of 35
    use PLA doped with copper or bronze, "hot bed" printing is not needed, which makes it possible to use simpler and low cost printers.
    Additionally, by using a material derived from renewable sources (such as doped PLA) and 3D printing (such as 3D FDM printing), the present invention avoids the use of traditional plastics and mold injection processes 5 known in the art. previous. Manufacturing with 3D FDM printing allows rapid prototyping and redesign of any type of part, while the injection of plastic into a mold requires a new mold (which is usually manufactured by milling a metal part that significantly increases time and cost of the design process) every time you have to make a new prototype or redesign the already manufactured prototype. The injection of 10 plastic is a technique that gives good results for large-scale manufacturing, but not for a design (and redesign) of prototypes.
    On the other hand, the present invention makes it possible to manufacture a low height guide, that of the substrate, which significantly reduces the volume of the manufactured device. Therefore, the integration of the waveguide with other elements of the planar circuit, such as a 15 microstrip, is direct, since the transition sections (2, 3) do not require modifications in height and are implemented in the own substrate, not on the body of the microwave device (1) printed. This is a simple and very efficient way of doing such integration. In addition, since the transition sections (2, 3) are integrated into the substrate, it is very easy to replace the body of the printed microwave device (1) with another, in case of breakage or modification of the required performance, and this It could not be done in the same way on a device that has integrated the transition to the microstrip.
    Thus, the technical object of the present invention has application in the development of high frequency passive devices integrated in the substrate: filters, guides, diplexers, dividers, etc. Actually the technique can be applied to manufacture any type of device 25 in integrated guide in substrate. Preferably doped PLA is used because it is a material that provides better metallizing results.
    The main application of the invention as described hereinbefore is for the design and manufacture of a new generation of high frequency passive devices for communications of varied use: base stations of 30 mobile communications (both at the stage of input and output), in matrix feed systems of shaped beam antennas, in equipment shipped on small satellites or on terrestrial equipment. Therefore, these are technical sectors with a great social and economic impact on the current and future knowledge society.
     35
    Execution Example
    An explanatory example of an embodiment of the present invention is set forth below, with reference to Figure 1.
    It involves the manufacture of a passive empty waveguide device integrated in the substrate, in particular a resonator. The person skilled in the art will understand that the issues 5 disclosed in the present example can also be applied to other devices that are capable of being manufactured with the technology "integrated empty waveguide in substrate" (ESIW), as for example guides, filters, power dividers, etc.
    First, the printing stage is carried out, in which a piece called the body of the microwave device (1) is printed, as explained below:
    The device body is printed following the 3D printing technique “Fused Deposition Modeling” (FDM).
    As can be seen in Figure 1, the body of the microwave device (1) comprises an upper cover and two side walls in a single piece. The piece is printed using as a base the upper cover of the body of the microwave device (1) and depositing the polymeric material to form both the lid itself and the walls. It will be the design of the walls of the body of the microwave device (1) that changes its functionality. For example, in the present example shown in Figure 1 a resonant cavity has been designed. During the printing process, transition holes (h1, h2) are formed that allow the corresponding transition sections (2, 3) to be accommodated with the rest of the circuitry of the printed circuit board (PCB) into which the device. Connection holes (p1, p2, p3, p4) are also formed that allow the passage of screws that will connect the body of the microwave device (1) to the anchor base (4).
    The material used for deposition is polylactic acid (PLA) doped with 20% copper. According to an alternative embodiment, the material used for deposition is polylactic acid (PLA) doped with 20% bronze.
    The time of the printing stage is 22 minutes.
    Then proceed with the metallization stage, as explained below:
    The metallization process necessarily comprises two stages, since if one of them lacks the resulting metallization layer it would not be sufficient for optimum device conductivity.
    For this, the body of the printed microwave device (1) is initially subjected to a chemical metallization that is developed according to the following procedure:
    - Surface modification: Initially the body of the microwave device 35
    (1) immersed in a hydroalcoholic solution of NaOH according to a concentration of between 8 and 12 g / L, preferably 10 g / L, at a temperature between 45 and 60 ° C, preferably 54 ° C, for a time of between 9 and 11 minutes , preferably 10 minutes, by shaking the body of the microwave device (1) continuously. 5
    - Surface activation: Next, the body of the microwave device (1) is immersed in a solution containing PdCl₂ according to a concentration between 0.2 and 0.3 g / L, preferably 0.25 g / L, SnCl₂ according to a concentration between 10 and 15 g / L, preferably 12.5 g / L, in HCl according to a concentration of between 0.5 and 1 M, preferably 0.75 M, at room temperature, for a time of between 4 and 6 minutes, preferably 5 min, while stirring the Microwave device body (1) continuously.
    - Acceleration: The body of the microwave device (1) is subsequently immersed in a solution of HCl according to a concentration between 0.02 and 0.05 M, preferably 0.035 M, at room temperature, for a time between 4 and 6 15 min, preferably 5 min.
    - Metallization: After the acceleration process, the body of the microwave device (1) is immersed in a solution containing copper according to a concentration of between 1.8 and 2.2 g / L, preferably 2 g / L, caustic soda according to a concentration of between 8 and 10 g / L, preferably 9 g / L, chelator according to a concentration between 0.1 and 0.2 M, preferably 0.125 M, and formaldehyde according to a concentration between 3 and 5 g / L, preferably 4 g / L, at a temperature between 41 and 51 ° C, preferably 46 ° C, by stirring and aerating the body of the microwave device (1) for a time between 36 and 44 min, preferably 40 min. According to a particular embodiment, the chelator is ethylenediaminetetraacetic acid (EDTA).
    After chemical metallization, the body of the printed microwave device (1) is subjected to a classical galvanic metallization which is developed according to the following procedure:
    - Cleaning and degreasing: The body of the microwave device (1) is immersed in a degreasing solution for 15 minutes, and in acetone for 5 min.
    - Activator bath: The body of the microwave device (1) is subsequently immersed in a colloidal solution of conductive carbon, for a time between 15 and 20 min.
    - Electrodeposition: Finally, the body of the microwave device (1) is subjected to oven drying at 95 ° C for 5 minutes, and is immersed in a solution of sulfuric acid and copper sulfate by applying electric current for 90 minutes.
    Finally, we proceed with the integration stage, as explained below: 5
    The body of the metallized microwave device (1) is integrated into the rest of the circuitry of the PCB by means of the transition sections (2, 3) and the anchor base (4) that have been previously manufactured. The transition sections (2, 3) are the sections of the printed circuit on PCB board that carry the signal to the body of the printed microwave device (1). The PCB is a substrate of dielectric material with copper metallization 10 on its upper and lower faces. The lower face acts as a ground and the circuit or transmission line is designed on the upper face. In the present example, m1 and m2 are copper microtirates that make up the active microstrip line of the PCB board. The PCB board is screwed to the anchor base (4) through several holes (t1, t2, t3 and t4) made both in the transition sections (2, 3) and in the anchor base itself (4). The anchor base (4) is a metallic substrate PCB sheet at the top, to ensure the electrical continuity of the structure. To complete the device, the body of the microwave device (1) is screwed to the anchor base (4) through the connection holes (p1, p2, p3 and p4) as well as several corresponding holes made in it anchor base (4). twenty
    If it is necessary to change the device for another (to modify its features or because the device has been damaged), just unscrew the body of the microwave device (1) and replace it with another.
    The present invention has been described above with reference to specific preferred embodiments thereof, presented by way of example only. However, those skilled in the art can easily apply modifications and variations to said embodiments without thereby departing from the scope of protection of the present invention, defined only by the appended claims.
    权利要求:
    Claims (17)
    [1]

    1. Method of manufacturing a microwave device based on an empty waveguide integrated in a substrate, which includes the steps of:
    - Printing, in which a body of the 5 microwave device (1) is printed by 3D printing from a polymeric material derived from a renewable source doped with at least one metal;
    - Metallization, in which the surface of the microwave device body (1) is metallized in two stages: a first autocatalytic metallization followed by a galvanic metallization; e 10
    - Integration, in which the microwave device is modularly integrated in a system based on printed circuit board by means of detachable connection means.
    [2]
    2. Method according to claim 1, characterized in that the printing step is performed following the 3D printing technique Molten Deposition Modeling. fifteen
    [3]
    Method according to the preceding claims, characterized in that in the printing stage, the body of the microwave device (1) is printed using as a base the upper cover of the body of the microwave device (1) and depositing the polymeric material to form both the cover itself and the walls, forming transition gaps (h1, h2) that allow to accommodate transition sections (2, 3) 20 corresponding to the rest of the circuitry of the printed circuit board in which the device is integrated microwave, and forming connection holes (p1, p2, p3, p4) that allow the passage of screws that will connect the body of the microwave device (1) to an anchor base (4).
    [4]
    4. Method according to any of the preceding claims, characterized in that the polymeric material is PLA.
    [5]
    5. Method according to any of the preceding claims, characterized in that the polymeric material is doped with a metal selected from copper and bronze.
    [6]
    6. Method according to claim 5, characterized in that the polymeric material is doped according to 20% metal. 30
    [7]
    Method according to any one of the preceding claims, characterized in that the body of the microwave device (1) at least partially hollow is printed in the printing stage.
    [8]
    8. Method according to any of the preceding claims, characterized in that the autocatalytic metallization consists of a first basic treatment for modifying
    Chemically the surface, followed by activation with acid and metallization in a metal dissolution bath.
    [9]
    9. Method according to any of the preceding claims, characterized in that the body of the microwave device (1) is metallized with copper.
    [10]
    10. Method according to any of the preceding claims, characterized in that the autocatalytic metallization is carried out according to the following procedure:
    - Surface modification, in which initially the body of the microwave device (1) is immersed in a hydroalcoholic solution of NaOH according to a concentration of between 8 and 12 g / L, at a temperature of between 45 and 60 ° C, during a time between 9 and 11 minutes, shaking the body of the microwave device (1) continuously.
    - Surface activation, in which the body of the microwave device (1) is immersed in a solution containing PdCl₂ according to a concentration between 0.2 and 0.3 g / L, SnCl₂ according to a concentration between 10 and 15 g / L , in HCl according to a concentration of between 0.5 and 1 M, at room temperature, for a time of between 4 15 and 6 minutes, stirring the body of the microwave device (1) continuously.
    - Acceleration, in which the body of the microwave device (1) is subsequently immersed in a solution of HCl according to a concentration of between 0.02 and 0.05 M, at room temperature, for a time of between 4 and 6 min.
    - Metallization, in which after the acceleration procedure, the body of the microwave device (1) is immersed in a solution containing copper according to a concentration of between 1.8 and 2.2 g / L, caustic soda according to a concentration of between 8 and 10 g / L, chelator according to a concentration between 0.1 and 0.2 M, and formaldehyde according to a concentration between 3 and 5 g / L, at a temperature between 41 and 51 ° C, stirring and aerating the body of the microwave device ( 1) for a time of 25 between 36 and 44 min.
    [11]
    11. Method according to claim 10, characterized in that the autocatalytic metallization is carried out according to the following procedure:
    - Surface modification, in which initially the body of the microwave device (1) is immersed in a hydroalcocholic solution of NaOH according to a concentration of 10 g / L, at 54 ° C, for 10 minutes, while stirring the body of the device microwave (1) continuously.
    - Activation of the surface on which the body of the microwave device (1) is immersed in a solution containing PdCl₂ according to a concentration of 0.25 g / L,
    SnCl₂ according to a concentration of 12.5 g / L, in HCl according to a concentration of 0.75 M, at room temperature, for 5 min, while stirring the body of the microwave device (1) continuously.
    - Acceleration, in which the body of the microwave device (1) is subsequently immersed in a solution of HCl according to a concentration of 0.035 M, at 25 ° C, 5 for 5 min.
    - Metallization, in which after the acceleration procedure, the body of the microwave device (1) is immersed in a solution containing copper according to a concentration of 2 g / L, caustic soda according to a concentration of 9 g / L, chelating according to a concentration of 0.125 M, and formaldehyde according to a concentration of 4 g / L, 10 to 46 ° C, stirring and aerating the body of the microwave device (1) for 40 minutes.
    [12]
    12. Method according to claim 9, characterized in that the galvanic metallization is carried out according to the following procedure:
    - Cleaned and degreased, in which the body of the microwave device (1) 15 is immersed in a degreasing solution for 15 minutes, and in acetone for 5 min.
    - Activator bath, in which the body of the microwave device (1) is immersed in a colloidal solution of conductive carbon, for a time between 15 and 20 min. twenty
    - Electrodeposition, in which the body of the microwave device (1) is subjected to oven drying at 95 ° C for 5 minutes, and is immersed in a solution of sulfuric acid and copper sulfate by applying electric current for 90 minutes.
    [13]
    13. Method according to any of claims 9 to 12, characterized in that a layer of 30 µm of copper is provided on the body of the microwave device (1) in the metallization stage.
    [14]
    14. Method according to any of the preceding claims, characterized in that the following elements are formed in the integration stage:
    - transition sections (2, 3), which are sections of the printed circuit on 30 PCB boards that carry the signal to the body of the microwave device (1); Y
    - an anchor base (4).
    [15]
    15. A method according to claim 14, characterized in that the PCB is a substrate of dielectric material with copper metallization by its upper and lower faces, the lower face acting as earth and the upper face on which the design is designed.
    circuit or the transmission line, conforming by means of copper microtira (m1 and m2) the active microstrip line of the PCB board.
    [16]
    16. Method according to any of claims 14 and 15, characterized in that the anchoring base (4) is a metallic substrate PCB sheet at its top.
    [17]
    17. Method according to any one of claims 14 to 16, characterized in that in the integration stage, the body of the microwave device (1) is integrated into the rest of the circuitry of the PCB by means of the sections of transition (2, 3), and by means of the anchor base (4), the transition sections (2, 3) of the PCB board being screwed to the anchor base (4) through several holes (t1, t2 , t3 and t4), and the body by screwing the microwave device (1) to the base of 10 anchorage (4) through the connection holes (p1, p2, p3 and p4) as well as several corresponding holes made in the anchor base itself (4).
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    同族专利:
    公开号 | 公开日
    ES2689355B2|2019-03-26|
    WO2020002729A1|2020-01-02|
    ES2689355A9|2018-12-12|
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    ES201830647A|ES2689355B2|2018-06-28|2018-06-28|METHOD OF MANUFACTURING MICROWAVE DEVICE BASED ON WAVE GUIDE INTEGRATED INTO SUBSTRATE|ES201830647A| ES2689355B2|2018-06-28|2018-06-28|METHOD OF MANUFACTURING MICROWAVE DEVICE BASED ON WAVE GUIDE INTEGRATED INTO SUBSTRATE|
    PCT/ES2019/070426| WO2020002729A1|2018-06-28|2019-06-19|Method for manufacturing a microwave device based on an empty substrate-integrated waveguide|
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