专利摘要:
Method of manufacturing a porous heat sink for electronic devices using computational computer aided design techniques based on a method based on voronoi diagrams. The obtained porous heat sink is characterized by having variable and interconnected macroporosity. Said macroporosity is established from the definition of the trabecular thickness of non-constant section (tb.th), of the trabecular separation (tb.sp), of the number of voronoi nucleation points and of the volume of the area to be filled. Said porous heat sink is manufactured from additive techniques by three-dimensional printing (3d) with conductive materials. This invention is applicable in the field dedicated to the manufacture of dissipators or heat exchangers responsible for the evacuation of heat from an element with high temperature to a medium with lower temperature with or without forced circulation of air. Its high specific surface area and the possibility to shape it by adapting it to a predefined volume allows optimizing the evacuation of heat in small spaces. (Machine-translation by Google Translate, not legally binding)
公开号:ES2584429A1
申请号:ES201530394
申请日:2015-03-25
公开日:2016-09-27
发明作者:Sergio GÓMEZ GONZÁLEZ;Enrique FERNÁNDEZ AGUADO
申请人:Universitat Politecnica de Catalunya UPC;
IPC主号:
专利说明:

image 1
image2
image3
image4
image5
image6
image7
image8
image9
权利要求:
Claims (1)
[1]
image 1
类似技术:
公开号 | 公开日 | 专利标题
Huang et al.2014|Enhancement of natural convection heat transfer from horizontal rectangular fin arrays with perforations in fin base
EP2884530A3|2015-10-28|Heat sink and heat dissipation system
BR112015032627A2|2017-07-25|method and system for estimating coating wear and non-transient computer readable media
EP3098554A4|2017-02-22|Plate fin heat exchanger and manufacturing method for heat exchanger corrugated fins
ITPI20130070A1|2015-01-16|METHOD FOR THE CREATION OF DATABASES OF EVENTS WITH MEDIUM ECO ON THE INTERNET.
NO20171258A1|2017-07-28|Drilling fluids with crosslinked sulfonate-containing polymers dispersed in high density brines
ES2584429A1|2016-09-27|Method of manufacturing a porous heat sink for electronic devices |
CN203857852U|2014-10-01|Temperature uniformizing plate with good heat conducting effect
CN204244634U|2015-04-01|A kind of corrugated fins heat pipe-type heat radiation module
Putra et al.2016|Effects of radial plate fins on natural convection hollow hybrid fin heat sinks
JP2014236024A|2014-12-15|Method for molding fin of heat exchange member
Cheng2014|Mixed convection heat transfer from a vertical cylinder in a bidisperse porous medium
ES2603785A1|2017-03-01|Component of domestic appliance comprising a base element |
ES2540123A1|2015-07-08|Air-cooled absorption machine |
CN207123199U|2018-03-20|A kind of bathroom radiator
ES2565556A1|2016-04-05|Heat dissipator |
PL410534A1|2016-06-20|Central heating radiator
TH138161B|2014-11-20|"The finned heatsink is embossed for cooling electronics."
Saad et al.2013|3D CFD simulation of thermal hydraulic performances on louvered fin automotive heat exchangers
IT201700023496A1|2018-09-14|Heat transfer fluids with high thermal conductivity.
GB2571637B|2021-01-13|Finned heat exchangers
GB2559182B|2021-01-06|Finned heat exchangers
ES1123881U|2014-09-22|Corner |
TH152347A|2016-05-19|Cooling devices with micro-flow channels for electronic devices.
TH63962S1|2018-08-02|Heat sink
同族专利:
公开号 | 公开日
ES2584429B1|2017-07-17|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题
US20090321045A1|2008-06-30|2009-12-31|Alcatel-Lucent Technologies Inc.|Monolithic structurally complex heat sink designs|
WO2011060312A2|2009-11-12|2011-05-19|Smith & Nephew, Inc.|Controlled randomized porous structures and methods for making same|
CN104028758A|2014-07-04|2014-09-10|成都三鼎日新激光科技有限公司|Method for manufacturing heat sink body|
DE102020208749A1|2020-07-14|2022-01-20|Volkswagen Aktiengesellschaft|Process for manufacturing a cooled power electronics module|
法律状态:
2017-07-17| FG2A| Definitive protection|Ref document number: 2584429 Country of ref document: ES Kind code of ref document: B1 Effective date: 20170717 |
优先权:
申请号 | 申请日 | 专利标题
ES201530394A|ES2584429B1|2015-03-25|2015-03-25|Manufacturing method of a porous heatsink for electronic devices|ES201530394A| ES2584429B1|2015-03-25|2015-03-25|Manufacturing method of a porous heatsink for electronic devices|
[返回顶部]