![]() Method of manufacturing a porous heat sink for electronic devices (Machine-translation by Google Tra
专利摘要:
Method of manufacturing a porous heat sink for electronic devices using computational computer aided design techniques based on a method based on voronoi diagrams. The obtained porous heat sink is characterized by having variable and interconnected macroporosity. Said macroporosity is established from the definition of the trabecular thickness of non-constant section (tb.th), of the trabecular separation (tb.sp), of the number of voronoi nucleation points and of the volume of the area to be filled. Said porous heat sink is manufactured from additive techniques by three-dimensional printing (3d) with conductive materials. This invention is applicable in the field dedicated to the manufacture of dissipators or heat exchangers responsible for the evacuation of heat from an element with high temperature to a medium with lower temperature with or without forced circulation of air. Its high specific surface area and the possibility to shape it by adapting it to a predefined volume allows optimizing the evacuation of heat in small spaces. (Machine-translation by Google Translate, not legally binding) 公开号:ES2584429A1 申请号:ES201530394 申请日:2015-03-25 公开日:2016-09-27 发明作者:Sergio GÓMEZ GONZÁLEZ;Enrique FERNÁNDEZ AGUADO 申请人:Universitat Politecnica de Catalunya UPC; IPC主号:
专利说明:
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权利要求:
Claims (1) [1] image 1
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同族专利:
公开号 | 公开日 ES2584429B1|2017-07-17|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 US20090321045A1|2008-06-30|2009-12-31|Alcatel-Lucent Technologies Inc.|Monolithic structurally complex heat sink designs| WO2011060312A2|2009-11-12|2011-05-19|Smith & Nephew, Inc.|Controlled randomized porous structures and methods for making same| CN104028758A|2014-07-04|2014-09-10|成都三鼎日新激光科技有限公司|Method for manufacturing heat sink body| DE102020208749A1|2020-07-14|2022-01-20|Volkswagen Aktiengesellschaft|Process for manufacturing a cooled power electronics module|
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申请号 | 申请日 | 专利标题 ES201530394A|ES2584429B1|2015-03-25|2015-03-25|Manufacturing method of a porous heatsink for electronic devices|ES201530394A| ES2584429B1|2015-03-25|2015-03-25|Manufacturing method of a porous heatsink for electronic devices| 相关专利
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