• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method of manufacturing a mechanical part (51) comprising the following steps: - to provide a substrate (53) of a micro-machinable material; Photolithographically engraving, throughout the thickness of said substrate, a pattern (50) comprising said part with at least one material bridge (57); characterized in that it further comprises the steps of: - effecting embrittlement in the core of the material bridge so as to form a fracture primer along a breaking line of the material bridge (57); - Release the part (51) of the substrate (53) to mount it in a device. Such a piece is particularly intended to be used for the manufacture of a timepiece.
    公开号:CH713854A2
    申请号:CH00718/17
    申请日:2017-06-05
    公开日:2018-12-14
    发明作者:Cretenet Davy
    申请人:Nivarox Sa；
    IPC主号:
    专利说明:

    Description
    FIELD OF THE INVENTION [0001] The invention relates to a method for manufacturing a mechanical part made from a micro-machinable material and, more particularly, to such a part intended to be used for the manufacture of a timepiece.
    BACKGROUND OF THE INVENTION [0002] It is known to manufacture a part of a timepiece made of crystalline silicon material. Indeed, the use of a micro-machinable material such as crystalline silicon has advantages in terms of manufacturing accuracy thanks to advances in current processes, particularly in the field of electronics.
    A difficulty to overcome, however, is to release the component without damaging it. Generally, bridges of material are provided between the watch component and the remainder of the plate. These bridges of material serve to maintain the integral part of the plate during the entire manufacture of the component, especially during treatments applied to the component after the etching (heat treatment, deposition of a coating, etc.), while facilitating the release of the component at the end of manufacture.
    [0004] EP 2 145857 describes such a method of manufacturing a watch component. Bridges of material are etched and maintain the integral component of the plate during the various stages of manufacture of the watch component. In order to facilitate the release of the component at the end of manufacture, the material bridges comprise a narrowed section at the end connected to the component. This makes it possible to create a zone of weakness facilitating the breakage of the material bridges. At the end of manufacture, the watch component is released from the plate by brittle fracture of the material at the material bridges in response to a suitable mechanical stress. The breakage of the material by brittle fracture between the material bridge and the component is difficult to control.
    [0005] Document WO 2015/092 012 also discloses such a method that attempts to solve the problem of breakage which is difficult to control by implementing an etched pre-stain area during the formation of the components, the component being able to be released from the plate by completing the etching of the pre-stain area by means of a laser. A known problem of laser cutting technology is that the latter emits particles and / or silicon dust deposited on the surface of the components. SUMMARY OF THE INVENTION [0006] The object of the present invention is to overcome all or part of the aforementioned drawbacks by proposing a method which allows, in a simple manner, a reliable mechanical unclogging while avoiding the dust resulting from the laser treatment. the bridge of material connecting the component to the substrate. In addition, the method allows the quality manufacture of a micromechanical component that can be applied to most mechanical watch parts.
    For this purpose, the invention relates to a method of manufacturing a mechanical part comprising the following steps: - to provide a substrate of a micro-machinable material; photolithographically engraving, throughout the thickness of said substrate, a pattern comprising said part with at least one bridge of material; characterized in that it further comprises the steps of: performing a core embrittlement of the material bridge to form a fracture primer along a line of rupture L of the material bridge; - Release the part of the substrate to mount it in a device.
    According to other advantageous features of the invention: - said breaking primer is obtained by an embrittlement of the material bridge over all or part of its thickness; said rupture primer extends along the entire rupture line; the rupture primer comprises at least one row of a first zone modified along the rupture line, inside the substrate; the rupture primer comprises at least one row of a second zone modified along the rupture line, inside the substrate; the first modified zone and the second modified zone are in the form of a row of points along the rupture line; the row of the first modified zone is at a distance of at least 10 μm from the upper face of the substrate; the row of the second modified zone is at a distance of at least 50 μm from the upper face of the substrate; - The row of the first modified area and the row of the second modified area are successively made one by one from the farthest side of the upper face of the substrate; the distance between each point of the same row is 10 μm; the micro-machinable material being selected from the group comprising crystalline silicon, crystalline silica and crystalline alumina.
    BRIEF DESCRIPTION OF THE DRAWINGS [0009] Other features and advantages will become clear from the description which is given hereinafter, by way of indication and in no way limitative, with reference to the accompanying drawings, in which: FIG. 1 is a representation of a substrate after a photolithography step; fig. 2 is an enlargement of a portion of FIG. 1; figs. 3a and 3b respectively illustrate a hairspring and its material bridge and a sectional view of the material bridge along the break line; fig. 4 is a schematic representation of the method according to the invention.
    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] In the example illustrated in FIG. 4, we can see the block diagram of a method 1. The method mainly comprises four steps 3, 5, 7 and 9 for manufacturing a mechanical part 51 whose core is made of a micro-machinable material. Indeed, a micro-machinable material, thanks to its accuracy below one micrometer, is particularly useful for the manufacture of an element, for example, a timepiece and advantageously replaces a metal material usually used.
    In the explanation below, the micro-machinable material may be based on crystalline silicon such as, for example, monocrystalline silicon, crystalline silica such as quartz or crystalline alumina such as corundum ( also called synthetic sapphire). Of course, other micro-machinable materials can be envisaged.
    Step 3 consists in providing a substrate 53 of micro-machinable material such as, for example, a monocrystalline silicon wafer used for the manufacture of electronic components (also called "wafer" in English). Preferably, a thinning phase is provided in step 3 in order to adapt the final thickness of the part 51. Such a phase can be achieved by a mechanical or chemical lapping method (also known as " back lapping ").
    Step 5 consists of photolithography, in the entire thickness of the substrate 53, a pattern 50 having the mechanical part 51 to manufacture. Advantageously, as visible in FIGS. 1 and 2, the larger size of the substrate 53 relative to that of the part 51 allows the etching of several patterns 50 and thus the manufacture of several pieces 51 from the same substrate 53.
    In the example illustrated in FIGS. 1 and 2, each mechanical part 51 is an escape wheel for a timepiece. Of course, the method 1 makes it possible to manufacture other parts of a timepiece but also, as explained hereinafter, several different parts on the same substrate 53.
    An optional step makes it possible to deposit a coating which advantageously replaces any insufficient tribological qualities of the micro-machinable material.
    Such a coating may be, for example, based on a carbon allotrope. It can thus be envisaged to deposit a crystalline carbon coating such as synthetic diamond by chemical vapor deposition (also known by the abbreviation "CVD"). It can also be deposited amorphous carbon as carbon in diamond form (also known as "DLC" from the terms "Diamond-Like-Carbon") by physical vapor deposition (also known by the English abbreviation). "PVD"). Of course, one or more other materials may be used in replacing or adjuvanting carbon. Other deposition methods are also conceivable.
    Step 7 is to perform a breaking primer 91 on the part 51, at the material bridge 57, so that the part 51 p is ready to be un-picked.
    Step 9 consists in releasing each piece 51 from the substrate 53. Thus, in the example illustrated in the figures, it is possible to obtain on the same substrate 53, according to the method 1, several tens of mechanical parts 51. In the example illustrated in FIGS. 1 to 4, it is thus possible to obtain, for example, spiral / ferrule assemblies of monocrystalline silicon or exhaust wheels whose core is monocrystalline silicon.
    The method may comprise an optional cleaning step, between step 7 and step 9, in the case where the suction system is not optimal.
    The method 1 comprises the consecutive steps 3,5, 7 and 9 as illustrated in FIG. 4. The first step 3 consists in providing a substrate 53 of micro-machinable material.
    Then the second step 5 is to perform by photolithography in the entire thickness of the substrate 53, the patterns 50 each having a mechanical part 51 to manufacture. According to the embodiment illustrated in the block diagram of FIG. 4, the second step 5 comprises three phases 15, 17 and 19.
    In a first phase 15, a protective mask is structured on the substrate 53. Preferably, the protective mask is made using a photosensitive resin. The protective mask is thus formed using a selective radiation for structuring said shape mask corresponding to each pattern 50 to achieve. With this step 15, it will be possible very accurately to etch any planar shape selectively on the substrate 53.
    In a second phase 17, an attack by anisotropic etching of the substrate assembly 53 - protective mask is performed. Preferably, an attack of the deep reactive ion etching type is used (also known by the abbreviation "DRIE"). The anisotropic etching makes it possible to etch the substrate 53 substantially rectilinearly at the level of the zones not protected by said protective mask. . Preferably, the etching during the second phase 17 is carried out over the entire thickness of the substrate 53 and, optionally, along a crystallographic axis of the micro-machinable material favorable to this attack.
    Moreover, according to the invention, each pattern 50, as illustrated in FIGS. 1 and 2, comprises at least one material bridge 57. The latter allows the maintenance of the part 51 relative to the substrate 53 to step 27. As shown in FIG. 2, the material bridge 57 has a constant section.
    In a third and last phase 19 of the second step 5, the protective mask is removed from the surface of the substrate 53. A substrate 53 is then obtained comprising a plurality of patterns 50 comprising a part 51 integral with the substrate 53 by at least a material bridge 57 as illustrated in FIGS. 1 and 2. Of course, in step 5, it may be envisaged to make one or more material bridges 57.
    The third step 7 is to form a breaking primer 91 on the material bridge 57 with a laser by achieving a heart weakening (or stealth dicing in English) so that the piece 51 is ready to be de-stuck without having to touch the part made of micro-machinable material.
    According to the invention, the breaking primer 91 comprises at least one row of a first modified zone 41 along the rupture line L, inside the substrate.
    Advantageously, the breaking primer 91 comprises at least one row of a second modified zone 42 along the break line L, inside the substrate as well.
    The breaking primer 91 may comprise a row of a third modified zone, or even more if necessary.
    Of course, the breaking primer 91 may comprise a plurality of rows of a first modified zone 41 and a plurality of rows of a second modified zone 42.
    As can be seen in FIG. 3, the first modified zone 41 and the second modified zone 42 are in the form of a row of points 40 arranged along the break line L, these points 40 being the result of the melting of the material by means of a pulse laser such as an infrared laser for example.
    According to the invention, the row of the first modified zone 41 is at a distance of at least 10 μm from the upper face of the substrate 53, and the row of the second modified zone 42 is at a distance of from less than 50 pm of the upper face of the substrate 53. Obviously, the distance of each row can be adapted by the skilled person depending on the total thickness of the part and the geometric profile of the material bridge 57.
    When performing the breaking primer 91, the row of the first modified area 41 and the row of the second modified area 42 are successively made one by one from the farthest side of the upper face of the substrate 53, the row of the first modified area 41 and the row of the second modified area 42 being superimposed one above the other.
    The distance between each point 40 of the same row is 10 pm, the points 40 of the same row being equidistant from each other so that the rupture of the material bridge 57 is clean.
    Of course, those skilled in the art will be able to adapt the configuration of the breaking initiation, that is to say, to adapt the number of zones, the distance of each row, and the distance between each point of a same row, depending on the thickness of the part and the geometric profile of the material bridge.
    At the end of step 7, we thus obtain a substrate 53, the part 51 of each pattern 50 is ready to be de-stuck. Advantageously according to the invention, the tens of parts 51 are therefore always manipulable together and can be supplied with or without the substrate 53.
    The fourth and last step 9 consists in applying a stress on the material bridges 57, at the level of the breaking primer 91 formed during step 7, so that they yield in order to recover said piece . Advantageously according to the invention, this displacement can be achieved by pulling directly on the material bridge 57 which allows the final assembly of each piece 51 without any direct manipulation on the micro-machinable material. Step 9 can be done manually using tweezers or using a PLC.
    In the example illustrated in FIGS. 1 and 2, the part 51 is an escape wheel. However, the invention can not be limited thereto and, by way of example, the piece 51 could be another type of gear train, a crown or even a spiral-ferrule assembly.
    权利要求:
    Claims (11)
    [1]
    claims
    1. A method of manufacturing (1) a mechanical part (51) comprising the following steps: - providing (3) a substrate (53) of a micro-machinable material; - etching (5) by photolithography, in the entire thickness of said substrate, a pattern (50) comprising said piece with at least one bridge material (57); characterized in that it further comprises the steps of: - performing (13) a core embrittlement of said material bridge (91) to form a breaking primer (91) along a line of rupture (L) the material bridge (57); - Release (11) the part (51) of the substrate (53) to mount it in a device.
    [2]
    2. Method according to claim 1, characterized in that said breaking primer (91) is obtained by embrittlement of the material bridge (57) over all or part of its thickness.
    [3]
    3. Method according to claim 1 or 2, characterized in that said breaking primer (91) extends along the entire line of rupture (L).
    [4]
    4. Method according to one of claims 1 to 3, characterized in that the breaking primer (91) comprises at least one row of a first modified zone (41) along the break line (L), inside the substrate.
    [5]
    5. Method according to one of claims 1 to 4, characterized in that the breaking primer (91) comprises at least one row of a second modified zone (42) along the rupture line (L), inside the substrate.
    [6]
    6. Method according to claims 4 and 5, characterized in that the row of the first modified area (41) and the row of the second modified area (42) are in the form of a row of dots (40) the along the break line (L).
    [7]
    7. Method according to claims 4 and 6, characterized in that the row of the first modified area (41) is at a distance of at least 10 pm from the upper face of the substrate.
    [8]
    8. Method according to claims 5 and 6, characterized in that the row of the second modified zone (42) is at a distance of at least 50 pm from the upper face of the substrate.
    [9]
    9. Method according to one of claims 4 to 8, characterized in that the row of the first modified area (41) and the row of the second modified area (42) are made successively one by one from the side most away from the upper face of the substrate.
    [10]
    10. The method of claim 6, characterized in that the distance between each point (40) of the same row is 10 pm.
    [11]
    11. Method according to one of the preceding claims, characterized in that said micro-machinable material being selected from the group comprising crystalline silicon, crystalline silica and crystalline alumina.
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    同族专利:
    公开号 | 公开日
    CH713854B1|2021-08-16|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CH00718/17A|CH713854B1|2017-06-05|2017-06-05|Manufacturing process of a micromechanical part.|CH00718/17A| CH713854B1|2017-06-05|2017-06-05|Manufacturing process of a micromechanical part.|
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