• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A spectrometer (1) comprises a support (10) having a bottom wall portion (12) in which a recess (14) having a concavely curved inner surface (14a) is provided and a side wall portion (13) disposed on one side in that the recess is open with respect to the bottom wall part, a light-detecting member (30) supported by the side wall part while facing the recess, and a dispersive part (52) formed in the resin layer (40) on the inside Surface of the recess is provided on. The resin layer is in contact with an inner surface of the side wall part. A thickness of the resin layer (40) in a first direction in which the recess and the light-detecting member face each other is larger in a part in contact with the inner surface of the side wall part than in a part disposed on the inner surface of the recess.
    公开号:CH712951B1
    申请号:CH00122/18
    申请日:2016-08-04
    公开日:2018-12-14
    发明作者:Yokino C/O Hamamatsu Photonics K K Takafumi；Shibayama C/O Hamamatsu Photonics K K Katsumi；Kato C/O Hamamatsu Photonics K K Katsuhiko
    申请人:Hamamatsu Photonics Kk；
    IPC主号:
    专利说明:

    description
    Background of the Invention
    Technical Field The present disclosure relates to a spectrometer that disperses and detects light and a method of manufacturing the spectrometer.
    BACKGROUND ART A spectrometer is known which has a box-shaped carrier which is provided with a recess on its inside, a light detection element which is attached to an opening of the carrier, a resin layer which covers the recess of the carrier, and a dispersive part provided in the resin layer (see, for example, Patent Literature 1).
    CITATION
    patent literature
    Patent Literature 1: Japanese Unexamined Patent Publication No. 2010-256,670
    Presentation of the invention
    Technical problem The spectrometer described above requires further miniaturization in response to an expansion in use. However, if the spectrometer is further miniaturized, the resin layer in which the dispersive part is provided is more likely to be peeled off from the support, thereby increasing concerns that a property of the dispersive part may deteriorate and lowering the detection accuracy of the spectrometer can be. In addition, since the spectrometer is miniaturized, the influence of stray light becomes relatively large, which increases concerns that the detection accuracy of the spectrometer can be reduced.
    It is therefore an object of the invention to provide a spectrometer that tries to miniaturize while suppressing a decrease in detection accuracy and to provide a spectrometer manufacturing method that enables such a spectrometer to be easily manufactured.
    Solution to the problem A spectrometer according to the invention has a carrier with a bottom wall part, in which a recess is provided with a concavely curved inner surface, and a side wall part, which is arranged on a side on which the recess with respect to the Bottom wall part is open, a light detection element supported by the side wall part while facing the recess, a resin layer disposed at least on the inner surface of the recess, and a dispersive part provided in the resin layer on the inner surface of the recess , wherein the resin layer is in contact with an inner surface of the side wall part, and a thickness of the resin layer in a first direction in which the recess and the light detection element are opposed to each other is larger in a part in contact with the inner surface of the side wall part than in a part that is on the inner surface surface of the recess is arranged.
    In this spectrometer, the dispersive part is arranged on the inner surface of the recess provided on the bottom wall part of the carrier, and the light detection element is supported by the side wall part of the carrier while facing the recess. According to such an embodiment, it is possible to reduce the size of the spectrometer. In addition, the resin layer in which the dispersive part is provided is in contact with the inner surface of the side wall part, and the thickness of the part in contact with the inner surface of the side wall part is larger than the thickness of the part on the inner surface of the recess is provided in the first direction in which the recess and the light detection element are opposite to each other. In this way, since the resin layer in which the dispersive part is provided is rarely detached from the support, it is possible to suppress deterioration in a property of the dispersive part. Further, since the area in which the resin layer covers the surface of the carrier increases, it is possible to suppress the generation of stray light resulting from the scattering of light on the surface of the carrier. For example, since one end of the inner surface of the recess and at least part of the inner surface of the side wall part are covered with the resin layer, it is possible to generate stray light resulting from the scattering of light entering the part. to suppress. Therefore, according to this spectrometer, it is possible to try miniaturization while suppressing a decrease in the detection accuracy.
    CH 712 951 B1 [0007] In a spectrometer according to one aspect of the invention, the side wall part has an annular shape which surrounds the depression when viewed in the first direction. In this way, the resin layer in which the dispersive part is provided is detached from the support less often, and thus it is possible to more reliably suppress deterioration in the properties of the dispersive part.
    In a spectrometer according to one aspect of the invention, the inner surface of the recess and the inner surface of the side wall part are connected to one another in a discontinuous state. In this way, the resin layer in which the dispersive part is provided can be more reliably prevented from being detached from the carrier. In addition, compared to a case where the inner surface of the recess and the inner surface of the side wall part are connected to each other in a continuous state, stray light rarely returns to the light detection part of the light detection element.
    In a spectrometer according to an aspect of the invention, a peripheral part adjacent to the recess is further provided in the bottom wall part, and the dispersive part is offset to be arranged on one side of the peripheral part with respect to a center of the recess, when viewed in the first direction. In this way, even if light dispersed and reflected by the dispersive part is reflected by the light detection element, the light can be prevented from becoming stray light by letting the light into the peripheral part.
    In a spectrometer according to an aspect of the invention, the resin layer reaches the peripheral part, and a thickness of the resin layer in the first direction in a part that reaches the peripheral part is larger than that in the part that is on the inner surface of the Depression is arranged. In this way, it is possible to more reliably prevent the resin layer in which the dispersive part is provided from being peeled off from the support. In addition, it is possible to suppress the generation of stray light resulting from the scattering of light entering the peripheral part.
    In a spectrometer according to an aspect of the invention, the peripheral part has an inclined surface that moves away from the light sensing element while the inclined surface moves away from the recess. In this way, even if light dispersed and reflected by the dispersive part is reflected by the light detection element, the light can be more reliably prevented from becoming stray light by letting the light into the inclined surface of the peripheral part.
    In a spectrometer according to an aspect of the invention, a peripheral part adjacent to the recess is further provided in the bottom wall part, and the side wall part has a pair of first side walls opposed to each other with the recess and the peripheral part therebetween in a second direction in which a plurality of grating grooves contained in the dispersive part are aligned and a pair of second side walls opposed to each other with the recess and the peripheral part therebetween in a third direction orthogonal to the second direction when viewed in the first direction. In this way it is possible to simplify an embodiment of the carrier.
    In a spectrometer according to one aspect of the invention, an area of the peripheral part which is arranged on one side of one of the first side walls with respect to the depression is larger than an area of a peripheral part which is on one side of the other of the first Sidewalls are arranged with respect to the depression, larger than an area of the peripheral part, which is arranged on one side of one of the second sidewalls with respect to the depression, and larger than an area of the peripheral part, which is on one side of the other of the second Sidewalls are arranged with respect to the recess when viewed in the first direction. In this way, the spectrometer can be made thinner in the first direction, in which the depression and the light detection element lie opposite one another, the plurality of grating grooves arranged in the dispersive part can be aligned in a second direction and the third direction is orthogonal to the second direction. In addition, even if light that is dispersed and reflected by the dispersive part is reflected by the light detection element, the light can be prevented from becoming stray light by directing the light into the peripheral part located on one side of the first side wall Relative to the depression is left.
    In a spectrometer according to an aspect of the invention, the resin layer is in contact with each of the inner surface of the other of the first side walls, the inner surface of one of the second side walls and the inner surface of the other of the second side walls. In this way, it is possible to more reliably prevent the resin layer in which the dispersive part is provided from being peeled off from the support.
    In a spectrometer according to one aspect of the invention, the resin layer is in contact with the inner surface of the other of the first side walls and / or the inner surface of the one of the second side walls and / or the inner surface of the other of the second side walls. In this way, it is possible to prevent the resin layer in which the dispersive part is provided from being detached from the carrier.
    In a spectrometer according to an aspect of the invention, the inner surfaces of the pair of first side walls opposed to each other are inclined to move away from each other while the inner surfaces move away from the recess and the peripheral part and away from the light sensing element approach. In this way, the thickness of the resin layer in the part in contact with the inner surface of the first side wall can be increased as the resin layer moves away from the recess and the peripheral part and approaches the light sensing element. If the thickness of the resin layer in the part on the side of the recess and the peripheral part
    CH 712 951 B1 is made relatively small and made relatively large on the side of the light detection element, it is possible to prevent the resin layer from being peeled off from the support while preventing the load from acting on the dispersive part.
    In a spectrometer according to an aspect of the invention, the inner surfaces of the pair of second side walls opposed to each other are inclined to move away from each other while the inner surfaces move away from the recess and the peripheral part and away from the light sensing element approach. In this way, the thickness of the resin layer in the part in contact with the inner surface of the second side wall can be increased as the resin layer moves away from the recess and the peripheral part and approaches the light sensing element. If the thickness of the resin layer in the part on the side of the recess and the peripheral part is made relatively small and on the side of the light detection element is made relatively large, it is possible to prevent the resin layer from being peeled off from the support during the stress is prevented from acting on the dispersive part.
    A spectrometer according to an aspect of the invention further comprises a first reflection part provided in the resin layer on the inner surface of the recess, a light transmission part, a second reflection part and a light detection part being provided in the light detection element, the first reflection part light reflected through the light transmission part, the second reflection part reflects the light reflected from the first reflection part, the dispersive part disperses and reflects light reflected from the second reflection part, and the light detection part detects the light dispersed and reflected from the dispersive part. Reflecting light which passes through the light transmission part through the first reflection part and the second reflection part facilitates setting an incident direction of the light entering the dispersive part and a diffusion or convergence state of the light. Thus, even if an optical path length from the dispersive part to the light detection part is shortened, the light scattered by the dispersive part can be precisely concentrated to a predetermined position of the light detection part.
    In a spectrometer according to an aspect of the invention, a reflective layer contained in the first reflection part and the dispersive part is arranged on the resin layer in a continuous state. In this way, since the area in which the reflective layer covers the surface of the resin layer increases, it is possible to suppress the generation of stray light resulting from the scattering of light on the surface of the resin layer.
    A method of manufacturing a spectrometer according to the invention comprises a first step of preparing a carrier having a bottom wall part in which a recess is provided with a concavely curved inner surface and a side wall part which is arranged on one side on which the recess is open with respect to the bottom wall part, and arranging a resin material on the inner surface of the recess, a second step of forming a resin layer with a lattice pattern and bringing it into contact with an inner surface of the side wall part on the inner surface of the recess Pressing a mold matrix against the resin material and curing the resin material in this state after the first step, a third step of forming a dispersive part by forming a reflective layer on at least the lattice pattern after the second step, and a fourth step of supporting an L light detection element through the side wall part so that the light detection element faces the recess after the third step, the resin layer being formed in the second step such that a thickness of the resin layer in a direction in which the recess and the light detection element face each other in one part in contact with the inner surface of the side wall part is larger than in a part arranged on the inner surface of the recess.
    According to this method of manufacturing the spectrometer, it is possible to prevent the resin layer from peeling off from the support at the time of releasing the mold, and thus it is possible to manufacture a spectrometer capable of miniaturization to try while suppressing a decrease in recognition accuracy.
    Advantageous Effects of Invention According to the invention, it is possible to provide a spectrometer that can try miniaturization while suppressing a decrease in detection accuracy, and a spectrometer manufacturing method capable of easily manufacturing such a spectrometer.
    Brief Description of the Drawings Figure 1
    Fig
    FIG. 3 is a perspective view of a spectrometer according to an embodiment of the invention.
    FIG. 1 is a cross-sectional view taken along line II-II of FIG. 1.
    FIG. 1 is a cross-sectional view taken along line III-III of FIG. 1.
    CH 712 951 B1
    Fig. 4
    5a and 5b
    6a and 6b
    7a and 7b
    8a and 8b
    9a and 9b
    10a and 10b
    11a and 11b. FIGS. 12a and 12b. FIG. 13 is a cross-sectional view taken along line IV-IV of FIG. 1.
    FIG. 4 are cross sectional views illustrating a process of a method for manufacturing the spectrometer of FIG. 1.
    FIG. 2 are cross sectional views illustrating a process of the method for manufacturing the spectrometer of FIG. 1.
    FIG. 4 are cross sectional views illustrating a process of the method for manufacturing the spectrometer of FIG. 1.
    FIG. 4 are cross sectional views illustrating a process of the method for manufacturing the spectrometer of FIG. 1.
    FIG. 4 are cross sectional views illustrating a process of the method for manufacturing the spectrometer of FIG. 1.
    FIG. 4 are cross sectional views illustrating a process of the method for manufacturing the spectrometer of FIG. 1.
    FIG. 1 is a cross-sectional view of a modified example of the spectrometer of FIG. 1. FIG. 1 is a cross-sectional view of a modified example of the spectrometer of FIG. 1.
    DESCRIPTION OF THE EMBODIMENTS An exemplary embodiment of the invention is explained in more detail below with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals, while their overlapping descriptions are omitted.
    [Design of the spectrometer] As shown in FIG. 1, in a spectrometer 1 comprises a box-shaped housing 2, a carrier 10 and a cover 20. The carrier 10 is designed as an injection-molded circuit carrier (MID) and has a multiplicity of Wirings 11 on. The spectrometer 1 is formed in a shape of a rectangular parallelepiped whose length is in an X-axis direction, a Y-axis direction (a direction orthogonal to the X-axis direction), and a Z-axis direction (a direction perpendicular to the X-axis direction and the Y -Axis direction) is less than or equal to 15 mm. In particular, the spectrometer 1 is made thinner to a length of about a few mm in the Y-axis direction.
    As shown in Figs. 2 and 3, a light detection element 30, a resin layer 40 and a reflective layer 50 are provided in the case 2. A first reflection part 51 and a dispersive part 52 are provided in the reflective layer. A light transmission part 31, a second reflection part 32, a light detection part 33 and a zero order light detection part 34 are provided in the light detection element 30. The light transmission part 31, the first reflection part 51, the second reflection part 32, the dispersive part 52, the light detection part 33 and the zero order light detection part 34 are aligned on the same straight line parallel to the X-axis direction when they are in an optical axis direction of light L1 (that is, in the Z-axis direction) can be viewed through the light transmitting part 31.
    In the spectrometer 1, the light L1 passing through the light transmission part 31 is reflected by the first reflection part 51, and the light L1 reflected by the first reflection part 51 is reflected by the second reflection part 32. The light L1 reflected by the second reflection part 32 is dispersed and reflected by the dispersive part 52. In light dispersed and reflected by the dispersive part 52, light L2 that is not zero-order light LO directed toward the light detection part 33 enters the light detection part 33 and is detected by the light detection part 33, and the zero-order light LO enters the zero order light detection part 34 and is detected by the zero order light detection part 34. An optical path of the light L1 from the light transmission part 31 to the dispersive part 52, an optical path of the light L2 from the dispersive part 52 to the light detection part 33 and an optical path of the zero order light LO from the dispersive part 52 to the zero order light detection part 34 are formed in a space S within the housing 2.
    The carrier 10 has a bottom wall part 12 and a side wall part 13. A recess 14 and peripheral parts 15 and 16 are provided on a surface of the bottom wall part 12 on the side of the space S. The side wall part 13 is arranged on a side on which the depression 14 is open with respect to the bottom wall part 12. The side wall part 13 has a rectangular ring shape, which encloses the depression 14 and the peripheral parts 15 and 16 when viewed in the Z-axis direction. More specifically, the side wall part 13 has a pair of first side walls 17 and a pair
    CH 712 951 B1 second side walls 18. The pair of first side walls 17 face each other with the recess 14 and the peripheral parts 15 and 16 interposed therebetween in the X-axis direction when viewed in the Z-axis direction. The pair of second side walls 18 face each other with the recess 14 and the peripheral parts 15 and 16 interposed therebetween in the Y-axis direction when viewed in the Z-axis direction. The bottom wall part 12 and the side wall part 13 are integrally formed from ceramics such as AIN, AI203 etc.
    A first expanded part 13a and a second expanded part 13b are provided in the side wall part 13. The first expanded part 13a is a stepped part in which the space S is expanded only in the X-axis direction on the opposite side from the floor. The second expanded part 13b is a stepped part in which the first expanded part 13a is expanded in each of the X-axis direction and the Y-axis direction on the opposite side from the bottom wall part 12. A first end part 11a of each of the wirings 11 is arranged in the first expanded part 13a. Each of the wirings 11 reaches a second end part 11b, which is arranged on an outer surface of one of the second side walls 18 through the second expanded part 13b and outer surfaces of the first side walls 17 of the first end part 11a (see FIG. 1). Each of the wirings 11 reaches a second end part 11b, which is arranged on an outer surface of one of the second side walls 18 through the second expanded part 13b and outer surfaces of the first side walls 17 of the first end part 11a (see FIG. 1). Each second end part 11b functions as an electrode pad for mounting the spectrometer 1 on an external circuit board and outputs / outputs an electrical signal to / from the light detection part 33 of the light detection element 30 through each wiring 11.
    As shown in FIGS. 2, 3, and 4, a length of the recess 14 in the X-axis direction is larger than a length of the recess 14 in the Y-axis direction when viewed in the Z-axis direction. The recess 14 has a concavely curved inner surface 14a. For example, the inner surface 14a has a shape in which both sides of a spherical surface (spherical crown) are cut off by a plane parallel to a ZX plane. In this way, the inner surface 14a is curved in a shape of a curved surface in both the X-axis direction and the Y-axis direction. That is, the inner surface 14a is curved in a shape of a curved surface when viewed in the Y-axis direction (see FIG. 2) and when viewed in the X-axis direction (see FIG. 3).
    [0031] Each of the peripheral parts 15 and 16 is adjacent to the recess 14 in the X-axis direction. The peripheral part 15 is disposed on one side of the first side wall 17 (one side in the X-axis direction) with respect to the recess 14 when viewed in the Z-axis direction. The peripheral part 16 is disposed on the other first side wall 17 side (the other side in the X-axis direction) with respect to the recess 14 when viewed in the Z-axis direction. An area of the peripheral part 15 is larger than an area of the peripheral part 16 when viewed in the Z-axis direction. In the spectrometer 1, the area of the peripheral part 16 is narrowed such that an outer edge of the inner surface 14a of the recess 14 comes into contact with the inner surface 17a of the other first side wall 17 when viewed from a Z-axis direction. The peripheral part 15 has an inclined surface 15a. The inclined surface 15a is inclined to move away from the light detection element 30 along the Z-axis direction, while the inclined surface 15a is moving away from the recess 14 along the X-axis direction.
    Shapes of the recess 14 and the peripheral parts 15 and 16 are formed by a shape of the carrier 10. This means that the depression 14 and the peripheral parts 15 and 16 are only delimited by the carrier 10. The inner surface 14a of the depression 14 and an inner surface 17a of a first side wall 17 are connected to one another by the peripheral part 15 (that is to say physically separated from one another). The inner surface 14a of the recess 14 and the inner surface 17a of the other first side wall 17 are connected to each other by the peripheral part 16 (that is, physically separated from each other). The inner surface 14a of the recess 14 and an inner surface 18a of each second side wall 18 are connected by a cut line (a corner, a bending position, etc.) between a surface and a surface. In this way, the inner surface 14a of the recess 14 and the respective inner surfaces 17a and 18a of the side wall part 13 are bonded to each other in a discontinuous state (a physically separated state, a state in which they are connected by a line of intersection between a surface and a surface are). A boundary line 19 between the recess 14 and the peripheral part 15, which are adjacent in the X-axis direction when viewed in a Z-axis direction, traverses the bottom wall part 12 along the Y-axis direction (see Fig. 4). That is, both ends of the boundary line 19 reach the inner surface 18a of every second side wall 18.
    As shown in FIGS. 2 and 3, the light detection element 30 has a substrate 35. For example, the substrate 35 is formed in a rectangular plate shape using a semiconductor material such as silicone. The light transmission part 31 is a slit formed in the substrate 35 and extending in the Y-axis direction. The zero-order light detection part 34 is a slit formed in the substrate 35 and is disposed between the light transmission part 31 and the light detection part 33 when viewed in the Z-axis direction and extends in the Y-axis direction. In the light transmission part 31, an end part on an entry side of the light L1 widens to the entry side of the light L1 in each of the X-axis direction and the Y-axis directions. In addition, in the zero-order light detection part, an end part on the opposite side widens from an entry side of the zero-order light L0 to the opposite side from the entry side of the zero-order light L0 in each of the X-axis direction and the Y-axis directions. When the zero-order light L0 is designed to be oblique
    CH 712 951 B1 enters the zero order light detection part, the zero order light LO entering the zero order light detection part 34 can be prevented from returning to the room S more reliably.
    The second reflection part 32 is provided in a region between the light transmission part 31 and the zero order light detection part 34 on a surface 35a of the substrate 35 on the space S side. For example, the second reflection part 32 corresponds to a metal film made of Al, Au, etc. and functions as a planar mirror.
    [0035] The light detection part 33 is provided on the surface 35a of the substrate 35. More specifically, the light detection part 33 is inserted into the substrate 35 made of the semiconductor material and is not attached to the substrate 35. That is, the light detection part 33 has a plurality of photodiodes formed in an area of the first conductivity type within the substrate 35 made of the semiconductor material and an area of the second conductivity type provided in the area. For example, the light detection part 33 is configured as a photodiode array, a C-MOS image sensor, a CCD image sensor, etc., and has a plurality of light detection channels arranged along the X-axis direction. Lights L2 with different wavelengths are let into the respective light detection channels of the light detection part 33. A plurality of terminals 36 for input / output of electrical signals to / from the light detection part 33 are provided on the surface 35 a of the substrate 35. The light detection part 33 can be configured as a photodiode incident on the surface or a photodiode incident on the rear surface. When the light detection part 33 is configured as the photodiode incident on the rear surface, the plurality of terminals 36 are provided on a surface of the substrate on the opposite side from the surface 35a. Thus, in this case, each of the terminals is electrically connected to a first end part 11a of a corresponding wiring 11 by wire bonding.
    The light detection element 30 is arranged in the first expanded part 13a of the side wall part 13. A terminal 36 of the light detection element 30 and the first end part 11a of the wiring 11, which are opposite to each other in the first expanded part 13a, are connected to one another by a solder layer 3. For example, the terminal 36 of the light detection element 30 and the first end portion 11 a of the wiring 11, which are opposite to each other, are connected to each other by the solder layer 3, which on a surface of the terminal 36 by a plating layer of a base (Ni-Au, Ni-Pd -Au etc.) are trained. In this case, in the spectrometer 1, the light detection element 30 and the side wall part 13 are connected to each other by the solder layer 3, and the light detection part 33 of the light detection element 30 and the plurality of wirings 11 are electrically connected to each other. For example, a reinforcing member 7 made of resin is arranged to cover a connection part between the terminal 36 of the light detection element 30 and the first end part 11a of the wiring 11, which are opposite to each other, between the light detection element 30 and the first expanded part 13a , In this way, the light detection element 30 is attached to the side wall part 13 and is supported by the side wall part 13 while opposing the recess 14. In the spectrometer 1, the Z-axis direction corresponds to a first direction in which the depression 14 and the light detection element 30 lie opposite one another.
    The resin layer 40 is disposed on the inner surface 14a of the recess 14. The resin layer 40 is formed by pressing a molding tool against a resin material corresponding to a molding material (e.g. photo-curing epoxy resins, acrylic resins, fluorine-based resins, optical resins, silicone and replicas such as organic / inorganic hybrid resins) and curing the resin material (by light curing using UV Light or thermal curing, etc.) are formed in this state.
    A lattice pattern 41 is provided in an area of the resin layer 40 that is offset to be on the peripheral part 15 side (one side in the X-axis direction) with respect to a center of the recess 14 when viewed in the Z- Axis direction to be arranged. For example, the grating pattern 41 corresponds to a blaze grating with a jagged cross section, a binary grating with a rectangular cross section, a holographic grating with a sinusoidal cross section, etc.
    The resin layer 40 moves away from the inner surface 17a of the first side wall 17 (the first side wall 17 on the left side in Fig. 2) and comes with each of the inner surface 17a of the other first side wall 17 (the first side wall 17 on the right side in Fig. 2), an inner surface 18a of a second side wall 18 and an inner surface 18a of the other second side wall 18 in contact. The resin layer 40 expands along each of the second sidewalls 18, the inner surface 17a of the other first sidewall 17, the inner surface 18a of the one second sidewall 18 and the inner surface 18a of the other second sidewall 18 to the inner surfaces 17a and 18a rise from the inner surface 14a.
    A thickness of the resin layer 40 in the Z-axis direction is larger in a part 43 in contact with the inner surface 17a and a part 44 in contact with the inner surface 18a than in a part 42 arranged on the inner surface 14a is. That is, a “thickness H2 along the Z-axis direction” of the part 43 in the resin layer 40 in contact with the inner surface 17a and a “thickness H3 along the Z-axis direction” of the part 44 in the resin layer 40 in contact with the inner surface Surface 18a is greater than a "thickness H1 along the Z-axis direction" of part 42 in resin layer 40 disposed on inner surface 14a. For example, H1 is approximately several µ to 80 pm (a minimum value is greater than or equal to a thickness sufficient to fill the surface roughness of the carrier 10), and each of H2 and H3 is approximately a few hundred pm.
    CH 712 951 B1 The resin layer 40 reaches the inclined surface 15a of the peripheral part 15. The thickness of the resin layer 40 in the Z-axis direction is larger in a part 45 that reaches the peripheral part 15 than in the part 42 that is disposed on the inner surface 14a. That is, a “thickness H4 along the Z-axis direction” of the part 45 in the resin layer 40 that reaches the peripheral part 15 is larger than the “thickness H1 along the Z-axis direction” of the part 42 in the resin layer 40 that is on the inner surface 14a. For example, H4 is approximately a few hundred pm.
    Here, when the "thicknesses along the Z-axis direction" in the respective parts 42, 43, 44 and 45 change, an average value of the thicknesses in the respective parts 42, 43, 44 and 45 can be changed as "thicknesses along the Z. -Axis direction »of the respective parts 42, 43, 44 and 45 are assumed. A "thickness along a direction perpendicular to the inner surface 17a" of the part 43 in contact with the inner surface 17a, a "thickness along a direction orthogonal to the inner surface 18a" of the part 44 in contact with the inner surface 18a, and a " Thickness along a direction orthogonal to the inclined surface 15a »of the part 45 reaching the peripheral part 15 is larger than the« Thickness H1 along a direction orthogonal to the inner surface 14a »of the part 42 disposed on the inner surface 14a , The resin layer 40 described above is formed in a continuous state.
    The reflective layer 50 is arranged on the resin layer 40. For example, the reflective layer 50 corresponds to a metal film made of Al, Au, etc. An area of the reflective layer 50 opposite to the light transmission part 31 of the light detection element 30 in the Z-axis direction corresponds to the first reflection part 51, which acts as a concave mirror. The first reflection part 51 is disposed on the inner surface 14a of the recess 14 and is offset to be located on the peripheral part 16 side (the other side in the X-axis direction) with respect to the center of the recess 14 when in the Z-axis direction is considered. A region of the reflective layer 50 that covers the grating pattern 41 of the resin layer 40 corresponds to the dispersive part 52 that acts as a reflection grating. The dispersive part 52 is arranged on the inner surface 14a of the recess 14 and is offset to be on the side of the peripheral part 15 (the one side in the X-axis direction) with respect to the center of the recess 14 when it is is viewed in the Z-axis direction. In this way, the first reflection part 51 and the dispersive part 52 are provided in the resin layer 40 on the inner surface 14a of the recess 14.
    A plurality of grating grooves 52a included in the dispersive part 52 have a shape that corresponds to a shape of the grating pattern 41. The plurality of grating grooves 52a are oriented in the X-axis direction when viewed in the Z-axis direction, and are curved in a curved line shape (for example, an arc shape that is convex to the peripheral part 15 side) on the same side when viewed in the Z-axis direction (see Fig. 4). In the spectrometer 1, the X-axis direction corresponds to a second direction in which the plurality of grating grooves 52a are oriented when viewed in the Z-axis direction, and the Y-axis direction is viewed a third direction orthogonal to the second direction in the Z-axis direction ,
    The reflective layer 50 covers the entire part 42 (including the grid pattern 41) disposed on the inner surface 14a of the recess 14, the entire part 43 in contact with the inner surface 17a of the other first side wall 17, the whole Part 44 in contact with the inner surface 18a of every second sidewall 18, and a portion of the part 45 that reaches the peripheral part 15 in the resin layer 40. That is, the reflective layer 50 included in the first reflection part 51 and the dispersive part 52 is arranged on the resin layer 40 in a continuous state.
    The cover 20 has a translucent member 21 and a light shielding film 22. For example, the translucent member 21 is formed in a rectangular plate shape using a material that transmits the light L1, examples of which are silica, borosilicate glass (BK7), Pyrex (registered trademark), glass and Kovar glass. The light shielding film 22 is formed on a surface 21 a of the light transmission member 21 on the space S side. A light transmission opening 22a is formed in the light shielding film 22 so as to face the light transmission part 31 of the light detection element 30 in the Z-axis direction. The light transmission opening 22a is a slit formed in the light shielding film 22 and extending in the Y-axis direction.
    When an infrared ray is detected, silicon, germanium, etc. are effective as a material of the transparent member 21. In addition, the light-transmissive element 21 can be provided with an AR (anti-reflection) layer and can have such a filter function in order to transmit only a predetermined light wavelength. Further, for example, black resist, Al, etc. can be used as a material of the light shielding film 22. Here, the black resist acts as the material of the light shielding film 22 from the zero order point of view, so that light L0 entering the zero order light detection part is prevented from returning to the space S. For example, the light-shielding film 22 may correspond to a composite film having an Al layer covering the surface 21a of the light transmission member 21 and a black resist layer provided at least in a region of the Al layer opposite to the zero-order light detection part 34. That is, in the composite film, the Al layer and the black resist layer are stacked in this order on the space S side of the light transmission element 21.
    The cover 20 is arranged in the second expanded part 13b of the side wall part 13. For example, a sealing member 4 made of synthetic resin, solder, etc. is expanded between the cover 20 and the second one
    CH 712 951 B1
    Part 13b arranged. In the spectrometer 1, the cover 20 and the side wall part 13 are fastened to one another by the sealing element 4 and the space S is sealed airtight.
    [Function and Effect] According to the spectrometer 1, it is possible to try miniaturization while suppressing a decrease in the detection accuracy for the following reasons.
    First, the dispersive part 52 is placed on the inner surface 14a of the recess 14 provided in the bottom wall part 12 of the carrier 10, and the light detection element 30 is supported by the side wall part 13 of the carrier 10 while facing the recess 14 , According to such an embodiment, it is possible to reduce the size of the spectrometer 1. Specifically, in the spectrometer 1, when viewed in the Z-axis direction, the length of the recess 14 in the X-axis direction is longer than the length of the recess 14 in the Y-axis direction, and the peripheral part is not on the side of the second side wall 18 and the second side wall 18 are provided with respect to the recess 14. In this way, the spectrometer 1 can be made thinner in the Y-axis direction.
    In addition, the resin layer 40 in which the dispersive portion 52 is provided comes in contact with each of the inner surface 17a of the other first side wall 17, the inner surface 18a of the one second side wall 18 and the inner surface 18a of the other second side wall 18. Further, a "thickness H2 along the Z-axis direction" of the part 43 in contact with the inner surface 17a and a "thickness H3 along the Z-axis direction" of the part 44 in contact with the inner surface 18a are larger than a "thickness H1 along the Z-axis direction »of the part 42 disposed on the inner surface 14a. In this way, the resin layer 40 in which the dispersive part 52 is provided is rarely peeled off from the carrier 10, and thus it is possible to suppress deterioration of a property of the dispersive part 52.
    Furthermore, the area in which the resin layer 40 covers the surface of the carrier 10 increases, and thus it is possible to suppress the generation of stray light caused by the scattering of light on the surface of the carrier 10. When the surface of the carrier 10 is covered with the resin layer 40, it is possible to easily and accurately obtain a surface which can suppress the scattering of light without being affected by a state of the surface of the carrier 10.
    For example, a material of the support 10 ceramic may correspond from the standpoint that it is possible to suppress expansion and contraction of the support 10 resulting from a temperature change in an environment in which the spectrometer 1 is used, generation of heat in the light detection part 33, etc., and it is possible to suppress a decrease in the detection accuracy (a shift in the peak wavelength in light detected by the light detection part 33, etc.), resulting from the occurrence of a variance in a positional relationship between the dispersive Part 52 and the light detection part 33. In addition, the material of the carrier 10 may be plastic (PPA, PPS, LCP, PEAK, etc.) from a standpoint that it is possible to facilitate the molding of the carrier 10 and the weight of the carrier 10 to reduce. Regardless of the material used for the carrier 10, however, the surface roughness of the carrier 10 is likely to be large if the carrier 10 is to be produced with a certain thickness and size. In particular, if the material of the carrier 10 corresponds to ceramic, the surface roughness of the carrier 10 is likely to be large. Even if the material of the carrier 10 corresponds to plastic, the surface roughness of the carrier 10 is likely to be relatively large (for example about 40 to 50 pm) (in the small spectrometer 1 in which the depth of the grating groove 52a is 5 pm or less, the surface roughness can be from around 40 to 50 pm are considered to be relatively large). Therefore, regardless of a material used as the material of the carrier 10, it is possible to easily and accurately obtain a surface that is smoother than the surface of the carrier 10 and light scatter (the surface of the resin layer 40 has a smaller surface roughness than the surface roughness of the substrate 10) can be suppressed by covering the surface of the substrate 10 with the resin layer 40.
    As described above, according to the spectrometer 1, it is possible to try miniaturization while suppressing a decrease in the detection accuracy. In particular, the side wall part 13 in the spectrometer 1 has an annular shape which surrounds the depression 14 and the peripheral parts 15 and 16 when viewed in the Z-axis direction. In this way, the resin layer 40 in which the dispersive part 52 is provided is rarely detached from the carrier 10, and thus it is possible to reliably suppress deterioration in a property of the dispersive part 52. In addition, in the spectrometer 1, the light L1 passing through the light transmitting part 31 is sequentially reflected by the first reflection part 51 and the second reflection part 32 and enters the dispersive part 52, which is the setting of an incident direction of the light entering the dispersive part 52 L1 and a diffusion or convergence state of light L1 are facilitated. Thus, even if an optical path length from the dispersive part 52 to the light detection part 33 is shortened, the light L2 scattered by the dispersive part 52 can be accurately concentrated to a predetermined position of the light detection part 33.
    In addition, in the spectrometer 1, the inner surface 14a of the recess 14 and the respective inner surfaces 17a and 18a of the side wall part 13 are connected to each other in a discontinuous state (a physically separated state, a state of connection with each other by a line of intersection between a surface and a surface etc.). In this way, it is possible to more reliably prevent the resin layer 40 in which
    CH 712 951 B1 provided the dispersive part 52 from which the carrier 10 is detached, compared with a case in which the inner surface 14a of the recess 14 and the respective inner surfaces 17a and 18a of the side wall part 13 are bonded together in a continuous state (a physical contact and a smoothly connected condition etc.). In addition, stray light rarely returns to the light detection part 33 of the light detection element 30, compared to the case where the inner surface 14a of the recess 14 and the respective inner surfaces 17a and 18a of the side wall part 13 are connected to each other in the continuous state.
    In addition, in the spectrometer 1, the resin layer 40 reaches the peripheral part 15 adjacent to the recess 14, and the "thickness H4 along the Z-axis direction" of the part 45 reaching the peripheral part 15 is larger than the "thickness H1 along the Z-axis direction »of the part 42 disposed on the inner surface 14a. In this way, it is possible to more reliably prevent the resin layer 40 in which the dispersive part 52 is provided from being detached from the carrier 10. In addition, it is possible to suppress the generation of stray light resulting from the scattering of light entering the peripheral part 15.
    In addition, in the spectrometer 1, the dispersive part 52 is displaced so that it is arranged on the side of the peripheral part 15 with respect to the center of the recess 14 when viewed in the Z-axis direction. In this way, even when light scattered and reflected by the dispersive part 52 is reflected by the light detection element 30, the light can be prevented from becoming stray light by letting the light into the peripheral part 15. In particular, in the spectrometer 1, since the peripheral part 15 includes the inclined surface 15a that moves away from the light detection element 30 when the inclined surface 15a moves away from the recess 14, it is possible to prevent light reflected from the inclined surface 15a , return directly to the light detection part 33 of the light detection element 30.
    In addition, in the spectrometer 1, the reflective layer 50 in which the first reflection part 51 and the dispersive part 52 are formed is arranged on the resin layer 40 in a continuous state. In this way, the area in which the reflective layer 50 covers the surface of the resin layer 40 increases, and it is thus possible to suppress the generation of stray light resulting from the scattering of light on the surface of the resin layer 40. In addition, light which is dispersed and reflected by the dispersive part 52 is reflected by the light detection element 30, the light is reflected by the reflective layer 50 in the continuous state to the light transmitting part 31 side, and thus it is possible to prevent that the light returns directly to the light detection part 33. In this case, it is difficult to define an NA of the light L1 by the first reflection part 51. However, in the spectrometer 1, it is possible to define NA of the light L1 entering the space S through the light transmission opening 22a of the light shielding film 22 and the light transmission part 31 of the light detection element 30, and to define NA of the light L1 that is from the first Reflection part 51 is reflected by the second reflection part 32 of the light detection element 30.
    In addition, in the spectrometer 1, the carrier 10 has the bottom wall part 12 and the side wall part 13, and the side wall part 13 has the pair of first side walls 17 and the pair of second side walls 18. In this way, the configuration of the carrier can be simplified.
    In addition, in the spectrometer 1, the zero order light detection part 34, which detects the zero order light LO in light that is dispersed and reflected by the dispersive part 52, is provided in the light detection element 30. It is possible to prevent the zero-order light LO from becoming stray light due to multiple reflections, etc., and to decrease the detection accuracy.
    In addition, the housing 2 in the spectrometer 1 contains the carrier 10 and the cover 20, and the space S in the housing 2 is sealed airtight. In this way, it is possible to suppress a decrease in the detection accuracy resulting from the deterioration of an element in the space S due to moisture, the occurrence of condensation in the space S due to a decrease in the ambient temperature, etc.
    [Spectrometer Manufacturing Method] A description will be given of a method for manufacturing the spectrometer 1 described above. 5a and 5b, the carrier 10 is produced and a resin material 5 corresponding to a molding material (for example photo-curing epoxy resins, acrylic resins, fluorine-based resins, silicone and optical impression resins such as organic / inorganic hybrid resins) on the inner surface 14a of the depression 14 arranged (first step).
    Subsequently, a molding die 6 is pressed against the resin material 5, and the resin material 5 is cured in this state, as shown in FIGS. 6a and 6b (for example by light curing using UV light or thermal curing etc.). , Thereby, the resin layer 40 is formed on the inner surface 14a of the recess 14 as shown in Figs. 7a and 7b (second step). As shown in FIGS. 6a and 6b, a molding surface 6a corresponding to the inner surface 14a of the recess 14 is provided on the molding die 6, and a pattern 6b corresponding to the lattice structure 41 is provided on the molding surface 6a. The molding surface 6a has a smoothness close to that of a mirror surface.
    In this case, the resin layer 40 having the lattice pattern 41 is formed to be in contact with each of the inner surface 17a of the other first side wall 17, the inner surface 18a of the one second side wall 18, and the one in FIG
    CH 712 951 B1 surface 18a of the other second side wall 18 comes into contact. The resin layer 40 having the lattice pattern 41 is formed so that the “thickness H2 along the Z-axis direction” of the part 43 in contact with the inner surface 17a and the “thickness H3 along the Z-axis direction” of the part 44 in contact with the inner surface 18a is greater than the "thickness H1 along the Z-axis direction" of the part 42 which is arranged on the inner surface 14a.
    When the molding die 6 is pressed against the resin material 5, the peripheral part 15 serves as protection for excess resin. In this way, it is possible to obtain the thin and very accurate grid pattern 41.
    Subsequently, as shown in FIGS. 8a and 8b, the first reflection part 51 and the dispersive part 52 are formed by forming the reflective layer 50 on the resin layer 40 (third step). For example, the reflective layer 50 is formed by evaporating metal such as Al, Au, etc. The reflective layer 50 can be formed by a method other than the evaporation of metal.
    Subsequently, as shown in FIGS. 9a and 9b, the light detection element 30 is arranged in the first expanded part 13a of the side wall part 13, and the connection 36 of the light detection element 30 and the first end part 11a of the wiring 11, which are opposite to each other in FIG the first expanded part 13a are connected to each other by the solder layer 3. That is, the light detection element 30 is attached to the side wall part 13 opposite to the recess 14, so that the side wall part 13 supports the light detection element 30 (fourth step). In this case, the self-alignment of the light detection element 30 is realized by melting / re-solidification of the solder layer 3 provided at each connection 36. It is possible to realize self-alignment of the light detection element 30 by using a solder ball with a core for connection between the terminal 36 of the light detection element 30 and the first end part 11a of the wiring 11. Then, for example, the reinforcing member 7 made of resin is arranged to cover the connection part between the terminal 36 of the light detection element 30 and the first end part 11a of the wiring 11, which are opposite to each other, between the light detection element 30 and the first widened part 13a ,
    Subsequently, as shown in Figs. 10a and 10b, the cover 20 is arranged in the second expanded part 13b of the side wall part 13, and the sealing member 4, which is made of resin, etc., is between the cover 20 and the second expanded part 13b. In this way, the space S is sealed airtight and the spectrometer 1 is obtained.
    According to the above-described method for manufacturing the spectrometer 1, it is possible to easily manufacture the spectrometer 1, which can prevent the resin layer 40 from separating from the carrier 10 at the time of releasing the molding die 6, thereby miniaturizing and at the same time Suppression of a decrease in detection accuracy is attempted.
    [Modified Example] Although the embodiment of the disclosure has been described above, one aspect of the disclosure is not limited to the above embodiment.
    For example, as shown in Figs. 11a and 11b, the inner surfaces 17a of the pair of first side walls 17 facing each other may be inclined to move away from each other when the inner surfaces 17a separate from the recess 14 and remove the peripheral parts 15. Similarly, the inner surfaces 18a of the pair of second side walls 18, which face each other, may be inclined to move away from each other when the inner surface 18a moves away from the recess 14 and the peripheral parts 15 and 16 approach the light sensing element 30 , In this way, it is possible to prevent tension from acting on the dispersive part 52 by relatively increasing the thickness of the side wall part 13 on the side of the depression 14 in which the dispersive part 52 is provided. In addition, it is possible to reduce the weight of the carrier 10 by relatively reducing the thickness of the side wall part 13 on the light detection element 30 side. Further, the thickness of the resin layer 40 in the part in contact with the inner surface 17a of the first side wall 17 and the inner surface 18a of the second side wall 18 can be increased when the resin layer 40 is removed from the recess 14 and the peripheral parts 15 and 16 and approaches the light sensing element 30. If the thickness of the resin layer 40 in the part on the side of the recess 14 and the peripheral parts 15 and 16 is relatively small and relatively large on the side of the light detection element 30, it is possible to inhibit the resin layer 40 from the carrier 10 separately are prevented while tension acting on the dispersive portion 52 is prevented. In addition, it is possible to easily release the mold 6 at the time the spectrometer 1 is manufactured.
    As shown in Figures 12a and 12b, the cover 20 and the light sensing element 30 can be connected together. In this case, the cover 20 and the light detection element 30 are mounted with respect to the carrier 10 as follows. More specifically, the cover 20 and the light detection element 30 in the first expanded part 13a of the side wall part 13 and the terminal 36 of the light detection element 30 and the first end part 11a of the wiring 11, which are arranged opposite to each other in the first expanded part 13a, are through the solder layer 3 connected to each other. Then, the sealing member 4 made of resin is placed between the cover 20 and the light sensing member 30 and the first expanded part 13a. In this way, if the cover 20 and the light detection element 30 are connected to each other in advance, it is possible to facilitate the assembly of the cover 20 and the light detection element 30 with respect to the carrier 10. For example
    CH 712 951 B1 prepares the cover 20 and the light detection element 30 by connecting them together in a state in which one of the covers 20 and the light detection element 30 is on a wafer level, and then dicing is performed.
    In addition, for example, the terminal 36 of the light detection element 30 and the first end part 11a of the wiring 11, which are opposite to each other, can be connected to each other by a bump made of Au, solder, etc. or a conductive resin such as e.g. be designed as a silver paste. In this case, for example, the reinforcing member 7, which is made of resin, may be arranged to expand the connection part between the terminal 36 of the light detection element 30 and the first end part 11 a of the wiring 11, which are opposite to each other, between the light detection element 30 and the first Cover part 13a.
    In addition, the light detection element 30 may be indirectly attached to the side wall part 13 (for example, by another element such as a glass substrate, etc.) as long as the light detection element 30 is supported by the side wall part 13.
    In addition, the second end part 11b, which serves as the electrode field for fastening the spectrometer 1 to the external printed circuit board, can be arranged in a region other than the outer surface of the one second side wall 18, as long as the region corresponds to the outer surface of the carrier 10 , In any case, the second end part 11b can be directly attached to the surface of the external circuit board using a bump, a solder, etc.
    In addition, without the spectrometer 1 including the first reflecting part 51 and the second reflecting part 32, the light L1 that passes through the light transmitting part 31 can be dispersed and reflected by the dispersive part 52, and the light L2 that passes through the dispersive part 52 is dispersed and reflected, can strike the light detection part 33 and be detected by the light detection part 33.
    In addition, the resin layer 40 can come into contact with at least a part of the inner surface of the side wall part 13 so as to have a thickness in the Z-axis direction that is larger than that of the part 42 that is on the inner surface 14a of the Well 14 is arranged. For example, the resin layer 40 may be in contact with at least one of the inner surface 17a of one first sidewall 17, the inner surface 17a of the other first sidewall 17 and the inner surface 18a of one second sidewall 18 and the inner surface 18a of the other second sidewall 18 come. In this case, it is possible to prevent the resin layer 40 in which the dispersive part 52 is provided from being detached from the carrier 10. However, when the resin layer 40 comes into contact with the inner surface 17a, since the inner surface 17a corresponds to a surface that intersects with a surface on which an optical path is formed, the effect of suppressing the generation of stray light is enhanced. When the resin layer 40 comes into contact with the inner surface 18a, the effect of suppressing the peeling of the resin layer 40 is enhanced.
    In addition, the inner surfaces 17a and 18a of the side wall part 13 may correspond to non-flat surfaces and may correspond to curved surfaces. In addition, for example, the inner surface 14a of the recess 14 and the inner surfaces 17a and 18a of the side wall part 13 may be connected in a continuous state, for example connected by an R-beveled surface.
    In addition, in the spectrometer 1, when a condition is viewed in the Z-axis direction, the area of the peripheral part 15 located on the side of the first side wall 17 with respect to the recess 14 is larger than each area of the peripheral portion located on one second side wall 18 with respect to the depression 14 and the area of the peripheral portion located on the side of the other second side wall 18 with respect to the depression 14 may be the peripheral The part which is arranged on the side of the one second side wall 18 with respect to the depression 14, and the peripheral part which is arranged on the side of the other second side wall 18 with respect to the depression 14, can be provided in the bottom wall part 12. In addition, the peripheral part 16 disposed on the other first side wall 17 side with respect to the recess 14 may be provided in the bottom wall part 12. In any case, the spectrometer 1 can be made thinner in the Y-axis direction. Even if light that is dispersed and reflected by the dispersive part 52 is reflected by the light detection element 30, the light can be prevented from becoming stray light by referring to the light in the peripheral part 15 on the side of the first side wall 17 is left on the recess 14.
    The “area of the peripheral part which is on the side of the other first side wall 17 with respect to the depression 14”, the “area of the peripheral part which is on the side of the one second side wall 18 with respect to the depression 14 ", And the" area of the peripheral part located on the other second side wall 18 with respect to the recess 14 "include the case of" 0 ".
    In addition, the inner surface 14a of the recess 14 may not be curved in a shape of a curved surface in each of the X-axis direction and the Y-axis direction, and may be in a shape of a curved surface in one of the X-axis direction and the Y- Axis direction to be curved.
    Furthermore, as shown in Fig. 13, in the first expanded part (first stepped part) 13a in which the light detection element 30 is arranged, a side surface 13a 2 of the first expanded part 13a may be inclined by an obtuse angle with a To form bottom surface 13ai of the first expanded part 13a. In addition, in
    CH 712 951 B1 to the second expanded part (second stepped part) 13b, in which the cover 20 is arranged, a side surface 13b 2 of the second expanded part 13b is inclined to form an obtuse angle with a bottom surface 13bi of the second expanded part 13b , In this way, it is possible to easily and precisely pull the wiring 11. In addition, it is possible to reduce the voltage generated in the wiring 11.
    In addition, the reinforcing member 7 made of resin can be filled between the side surface 13a 2 of the first expanded part 13a and the light sensing member 30. In this way, since the reinforcement member 7 easily enters a gap when the side surface 13a 2 is inclined, it is possible to reinforce the support of the light detection member 30 sufficiently and to ensure the airtightness in the part sufficiently. In addition, a shift in the position of the light detection element 30 in the X-axis direction (the second direction in which the plurality of grating grooves 52a contained in the dispersive part 52 is oriented) can be caused by a synergistic effect by arranging a bump 16 which described later, can be suppressed more reliably. In addition, the sealing member 4 made of resin may be filled between the side surface 13b 2 of the second expanded part 13b and the cover 20. In this way, since the sealing member 4 easily enters a gap when the side surface 13b 2 is inclined, it is possible to sufficiently reinforce the support of the cover 20 and to ensure the airtightness in the part sufficiently. The airtightness can be ensured by filling the reinforcing member 7 made of resin between the side surface 13a 2 of the first expanded part 13a and the light detection element 30, by inserting the sealing member 4 made of synthetic resin between the side surface 13b 2 of the second expanded part 13b and the cover 20 is filled, or by filling the reinforcing element 7 between the side surface 13a 2 and the light detection element 30 and filling the sealing element 4 between the side surface 13b 2 and the cover 20. The airtightness can be achieved by a different configuration (the spectrometer 1 is accommodated in a different housing and the inside of the housing is sealed airtight) than the configurations related to the airtightness.
    As shown in FIG. 13, an area 10a-i in which at least the wiring 11 is arranged on an end face 10a on the opposite side from the bottom wall part 12 of the carrier 10 can additionally be arranged on the bottom wall part 12. In this way, it is possible to prevent the wiring 11 from coming into contact with another element at the time of mounting the spectrometer 1. In addition, it is possible to reduce the length of the wiring 11. The entire end surface 10a of the bracket 10 may be arranged on the bottom wall part 12 side with respect to the surface 20a of the cover 20.
    As shown in Fig. 13, the cover 20 and the light sensing element 30 may also be spaced apart. In this way, stray light can be trapped in a space between the cover 20 and the light detection element 30, and the stray light can be removed more reliably.
    In addition, a coefficient of thermal expansion of the carrier 10 in the X-axis direction (the second direction in which the plurality of lattice grooves 52a included in the dispersive part 52 is oriented) is less than or equal to a coefficient of thermal expansion of the carrier 10 in the Y-axis direction (a third direction orthogonal to the first direction in which the recess 14 and the light detection element 30 face each other and are orthogonal to the second direction) (more preferably, the coefficient of thermal expansion of the carrier 10 in the X-axis direction is smaller than that Coefficient of thermal expansion of the carrier 10 in the Y-axis direction). That is, when the coefficient of thermal expansion of the beam 10 in the X-axis direction is set to α and the coefficient of thermal expansion of the beam 10 in the Y-axis direction is set to β, a relationship of a <β is satisfied (more preferred is a relationship of a <ß met). In this way, it is possible to prevent a positional relationship between the plurality of grating grooves 52a in the dispersive part 52 and the plurality of light detection channels in the light detection part 33 of the light detection element 30 from varying due to thermal expansion of the carrier 10.
    In addition, as shown in Fig. 13, for example, a terminal 36 of the light detection element 30 and a first end part 11a of the wiring 11, which are opposite to each other, can be connected to each other by a plurality of bumps 61 made of Au, solder, etc., and the The plurality of bumps 61 may be aligned along the X-axis direction (the second direction in which the plurality of lattice grooves 52a contained in the dispersive part 52 are aligned). Furthermore, a plurality of sets of such a connector 36, a first end portion 11a and a plurality of bumps 61 in the Y-axis direction may be provided. In this way, for example, it is possible to prevent a positional relationship between the plurality of grating grooves 52a in the dispersive part 52 and the plurality of light detection channels in the light detection part 33 of the light detection element 30 from varying due to the thermal expansion of the carrier 10. In addition, it is possible to sufficiently secure the area of each terminal 36 by two-dimensionally arranging the protrusions 61 in comparison with a case in which the protrusions 61 are arranged in a row because there is space in the available space.
    In addition, the first expanded part 13a may correspond to a stepped part in which the space S (the space in which the optical path of the light L1 runs from the light transmitting part 31 to the dispersive part 52) is the optical path of the light L2 of the dispersive part 52 to the light detection part 33, and the optical path of the zero-order light LO is formed from the dispersive part 52 to the zero-order light detection part 34) in at least one direction (eg, the X-axis direction) on the opposite side from the bottom wall part 12 is expanded. The first expanded part 13a may have one step or a plurality of steps. Similarly, the second expanded portion 13b may correspond to a stepped portion in which the first expanded portion 13a is at least in one direction
    CH 712 951 B1 (for example the X-axis direction) is expanded on the opposite side from the bottom wall part 12. The second expanded part 13b may have one step or a plurality of steps. In a case where the light detection part 33 is configured as a photodiode incident on a rear surface and the plurality of terminals 36 are provided on the surface of the substrate 35 on the opposite side from the surface 35a when each terminal 36 is electrically connected to the first end part 11 a of each of the corresponding wiring 11 is connected by wire bonding, the first end part 11 a of each terminal 11 may be arranged in a different stage (a stage on the outer and upper side of a stage in which the light detection element 30 is arranged) the stage in which the light detection element 30 is disposed in the first expanded part 13a having the plurality of stages.
    In addition, the material of the carrier 10 is not limited to ceramic and may be another molding material such as a resin such as LCP, PPA, epoxy, etc., or molded glass. Furthermore, the shape of the carrier 10 is not limited to the shape of the rectangular parallelepiped and can, for example, correspond to a shape in which a curved surface is provided on the outer surface. Further, the shape of the side wall part 13 is not limited to the rectangular annular shape as long as the shape corresponds to an annular shape surrounding the recess 14 when viewed in the Z-axis direction, and may correspond to a circular annular shape. In this way, a material and a shape of each component of the spectrometer 1 are not limited to the material and shape described above, and it is possible to use various materials and shapes.
    Reference symbol list [0089]
    spectrometer
    resin material
    forming die
    carrier
    Floor panels
    Sidewall portion
    deepening
    14a inner surface
    15.16 peripheral area
    15a inclined surface first side wall
    17a inner surface second side wall
    18a inner surface
    Light sensing element
    Light transmission part second reflection part
    Light detection part
    resin layer
    Lattice pattern reflecting layer first reflection part dispersive part
    52a grid groove
    权利要求:
    Claims (15)
    [1]
    claims
    1. Spectrometer (1) comprising:
    a carrier (10) with a bottom wall part (12), in which a recess (14) with a concavely curved inner surface (14a) is provided, and a side wall part (13), which is arranged on a side on which the recess ( 14) is open with respect to the bottom wall part (12);
    a light sensing element (30) supported by the side wall portion (12) while facing the recess (14);
    a resin layer (40) disposed at least on the inner surface (14a) of the recess (14); and a dispersive portion (52) provided in the resin layer (40) on the inner surface (14a) of the recess (14), the resin layer (40) in contact with an inner surface of the side wall portion (13), and a thickness of the resin layer (40) in a first direction, in which the recess (14) and the light detection element (30) face each other, is larger in a part in contact with the inner surface of the side wall part (13) than in a part which is arranged on the inner surface (14a) of the depression (14).
    CH 712 951 B1
    [2]
    2. Spectrometer according to claim 1, wherein the side wall part (13) has an annular shape which encloses the recess (14) when viewed in the first direction.
    [3]
    3. Spectrometer according to claim 1 or 2, wherein the inner surface (14a) of the recess (14) and the inner surface of the side wall part (13) in a physically separated state or a state in which they are separated by a line of intersection between a surface and a Surface are connected to each other, are connected to each other.
    [4]
    4. Spectrometer according to one of claims 1 to 3, wherein an adjacent to the recess (14) peripheral part (16) is further provided in the bottom wall part (12), and the dispersive part (52) is offset so that it is at a Side of the peripheral part (16) is arranged with respect to a center of the recess (14) when viewed in the first direction.
    [5]
    The spectrometer according to claim 4, wherein the resin layer reaches the peripheral part, and a thickness of the resin layer (40) in the first direction is larger in a part reaching the peripheral part (16) than in the part reaching the inner surface (14a) of the recess (14) is arranged.
    [6]
    6. Spectrometer according to claim 4 or 5, wherein the peripheral part (16) has an inclined surface which moves away from the light detection element (30), while the inclined surface moves away from the recess (14).
    [7]
    The spectrometer of claim 1, wherein a peripheral portion (16) adjacent the recess (14) is further provided in the bottom wall portion (12), and the side wall portion (13) is a pair of first side walls (17) opposed to each other, wherein the recess (14) and the peripheral part (16) are arranged therebetween in a second direction, in which a plurality of grating grooves (52a) contained in the dispersive part (52) are aligned and have a pair of second side walls (18), facing each other with the recess (14) and the peripheral part (16) therebetween in a third direction orthogonal to the second direction when viewed in the first direction.
    [8]
    8. Spectrometer according to claim 7, wherein an area of the peripheral part (16), which is arranged on one side of one of the first side walls (17) with respect to the recess (14), is larger than an area of a peripheral part (16) which is arranged on one side of the other of the first side walls (17) with respect to the recess (14) is larger than a region of the peripheral part (16) which is on one side of one of the second side walls (18) with respect to the recess (14) is arranged and is larger than a region of the peripheral part (16) which is arranged on one side of the other of the second side walls (18) with respect to the recess (14) when viewed in the first direction ,
    [9]
    The spectrometer of claim 8, wherein the resin layer (40) is in contact with each of the inner surface of the other of the first side walls (17), the inner surface of the one of the second side walls (18) and the inner surface of the other of the second side walls (18) 18) is.
    [10]
    10. The spectrometer of claim 7, wherein the resin layer (40) in contact with the inner surface of the other of the first side walls (17) and / or the inner surface of one of the second side walls (18) and / or the inner surface of the other of the second side walls (18).
    [11]
    The spectrometer according to claim 7, wherein the inner surfaces of the pair of first side walls (17) opposed to each other are inclined to move away from each other while the inner surfaces are separated from the recess (14) and the peripheral part (16 ) and approach the light detection element (30).
    [12]
    The spectrometer according to claim 7, wherein the inner surfaces of the pair of second side walls (18) opposed to each other are inclined to move away from each other while the inner surfaces are detached from the recess (14) and the peripheral part (16 ) and approach the light detection element (30).
    [13]
    13. Spectrometer according to one of claims 1 to 12, further comprising:
    a first reflection part (51) provided in the resin layer (40) on the inner surface of the recess (14), a light transmission part (31), a second reflection part (32) and a light detection part (33) in the light detection element (30 ) are provided, the first reflection part (51) reflects light which passes through the light transmission part (31), the second reflection part (32) reflects the light reflected by the first reflection part (51), the dispersive part (52) disperses and reflects light which is reflected by the second reflection part (32) and the light detection part (33) detects the light dispersed and reflected by the dispersive part (52).
    [14]
    The spectrometer according to claim 13, wherein a reflective layer (50) included in the first reflection part (31) and the dispersive part (52) is arranged on the resin layer (40) in a continuous state.
    [15]
    15. A method of making a spectrometer, the method comprising:
    a first step of preparing a carrier (10) with a bottom wall part (12), in which a recess (14) with a concavely curved inner surface (14a) is provided, and a side wall part (13), which is arranged on one side, where the recess (14) is open with respect to the bottom wall part (12) and placing a resin material (5) on the inner surface (14a) of the recess (14);
    CH 712 951 B1 a second step of forming a resin layer (40) with a lattice pattern and bringing it into contact with an inner surface of the side wall part (13) on the inner surface of the depression (14) by pressing a mold matrix against the resin material (5) and curing the resin material (5) in this state after the first step;
    a third step of forming a dispersive portion (52) by forming a reflective layer (40) at least on the grid pattern after the second step; and a fourth step of supporting a light detection element (30) by the side wall part (13) so that the light detection element (30) faces the recess (14) after the third step, the resin layer (40) being formed in the second step so that that a thickness of the resin layer (40) in a direction in which the recess (14) and the light detection element (30) face each other is larger in a part in contact with the inner surface of the side wall part (13) than in a part which is arranged on the inner surface (14a) of the recess (14).
    7
    CH 712 951 B1
    CH 712 951 B1
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    同族专利:
    公开号 | 公开日
    JP6106811B1|2017-04-05|
    WO2017022840A1|2017-02-09|
    CN107850489B|2019-12-20|
    JPWO2017022840A1|2017-08-03|
    DE112016003515T5|2018-05-17|
    US20180216997A1|2018-08-02|
    KR20180037176A|2018-04-11|
    US10408677B2|2019-09-10|
    CN107850489A|2018-03-27|
    引用文献:
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    CN111537066A|2015-08-04|2020-08-14|浜松光子学株式会社|Light splitter|JP6251073B2|2014-02-05|2017-12-20|浜松ホトニクス株式会社|Spectrometer and method of manufacturing the spectrometer|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP2015153862|2015-08-04|
    PCT/JP2016/073016|WO2017022840A1|2015-08-04|2016-08-04|Spectroscope, and spectroscope production method|
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