• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method of manufacturing a part (9) with at least one decoration (8), each decoration (8) being formed mainly from solder paste. The piece can in particular constitute an element of the covering or of the movement of a timepiece.
    公开号:CH710716B1
    申请号:CH00068/16
    申请日:2016-01-19
    公开日:2020-03-13
    发明作者:Dubach Alban；Winkler Yves；Bourban Stewes；Vuille Pierry；Martin Jean-Claude
    申请人:Swatch Group Res & Dev Ltd；
    IPC主号:
    专利说明:

    Field of the invention
    The invention relates to a process for manufacturing a piece with at least one decoration for a timepiece or a piece of jewelry.
    Background of the invention
    It is known to form decorations based on hot-pressed amorphous metal allowing faithful shaping. However, the types of amorphous metal alloys are limited and the preforms are complex to manufacture because they have a lot of alloy metals. We understand that the decorations based on amorphous metal are expensive to manufacture, have very limited possible colors and cannot be used with any material because of the force of fitting induced for their shaping.
    It is also known to form decorations based on electroformed metal allowing faithful shaping. However, electroformed metal alloys are limited in their composition and complex to manufacture because they are very changeable depending on the electroplating conditions. It is understood that the decorations based on electroformed metal are expensive to manufacture because of the very long deposition process, have very limited possible colors and difficult to maintain homogeneous during deposition, and cannot be used with any material because of the need to have an electrically conductive deposition base.
    Summary of the invention
    The object of the present invention is to overcome all or part of the drawbacks mentioned above by proposing a simplified method of manufacturing a part with at least one decoration, the steps of which are easier and less time-consuming to implement and of which the raw material can be easily modified without losing quality in shaping.
    To this end, according to a first alternative embodiment, the invention relates to a method of manufacturing a part with at least one decoration comprises the following steps:<tb> a1) <SEP> provide a substrate forming the base of said part, the substrate being coated with a decorative layer;<tb> a2) <SEP> forming a mold on the decoration layer of the substrate, the mold comprising a hollow pattern according to each at least one decoration, the bottom of which is formed by the decoration layer;<tb> a3) <SEP> fill each pattern in the mold with solder paste;<tb> a4) <SEP> merge the solder paste and then cool it to form said at least one decoration;<tb> a5) <SEP> release the said piece from the mold with at least one decoration.
    According to the first embodiment, it is understood that it is possible to easily produce decorations with complex shapes with a limited number of production steps. The decorations can be manufactured directly on the decorative layer which can be formed of a metallic material, a material based on silicon, a ceramic, a cermet, an enamel or another composite ( such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.) and may or may not be of the same nature as the material of said at minus a decor.
    In addition, the solder paste for each at least one decoration can be the same or different without making the manufacturing process more difficult. In addition, the composition of the solder paste allows a large number of colors for each at least one decoration which may be formed from a metallic material or from a cermet.
    According to a second variant embodiment, the invention relates to a method for manufacturing a part with at least one decoration comprising the following steps:<tb> b1) <SEP> selectively deposit on the part an adhesion layer for each at least one decoration;<tb> b2) <SEP> selectively deposit solder paste on each adhesion layer;<tb> b3) <SEP> merge the solder paste and then cool it to form the said piece with at least one decoration.
    According to the second embodiment, it is understood that it is possible to easily produce decorations with complex shapes with a limited number of production steps. The decorations can be manufactured directly on the substrate forming the part which can be formed from a metallic material, a silicon-based material, a ceramic, a cermet, an enamel or another composite. (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.) and may or may not be of the same nature as the material of said material at least one decor.
    In addition, the solder paste for each at least one decoration can be the same or different without making the manufacturing process more difficult. In addition, the composition of the solder paste allows a large number of colors for each at least one decoration which may be formed from a metallic material or from a cermet.
    Finally, according to a third alternative embodiment, the invention relates to a process for manufacturing a part with at least one decoration which comprises the following steps:<tb> c1) <SEP> forming at least one hollow pattern according to each at least one decoration in said room;<tb> c2) <SEP> fill each pattern with solder paste;<tb> c3) <SEP> merge the solder paste and then cool it to form the said one piece with at least one decoration.
    According to the third embodiment, it is understood that it is possible to easily realize inlaid decorations with a limited number of production steps. The decorations can be manufactured directly in each hollow of the substrate forming the part which can be formed of a metallic material, a material based on silicon, a ceramic, a cermet, an enamel or a other composite (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.) and may or may not be of the same nature as material of said at least one decoration.
    In addition, the solder paste for each at least one decoration can be the same or different without making the manufacturing process more difficult. In addition, the composition of the solder paste allows a large number of colors for each at least one decoration which may be formed from a metallic material or from a cermet.
    According to other advantageous embodiments of the first, second and third alternative embodiments of the invention:the method comprises, between steps a4) and a5), step a6) intended to machine each at least one decoration;the method comprises, after step b3), step b4) intended to machine each at least one decoration;the method comprises, between steps c1) and c2), step c4) intended to increase the contact surface of the background of the patterns in order to increase the grip of future decorations;the method comprises, after step c3), step c5) intended to machine each at least one decoration;the part is made of metallic material, of silicon-based material, ceramic, enamel or cermet;the solder paste comprises at least one type of powder with an additive or an organic binder;the solder paste has a melting point below 380 ° C;said at least one type of powder comprises at least metal or metal alloy powder such as gold;said at least one type of powder comprises a mixture of gold and at least one element chosen from the group consisting of tin, silicon, antimony, germanium, indium and gallium;said at least one type of powder further comprises ceramic powder.
    Finally, the invention relates to a timepiece characterized in that it comprises a piece with at least one decoration and obtained using the method according to one of the preceding variants, said piece forming any or part of an element of the covering or movement of the timepiece.
    Brief description of the drawings
    Other features and advantages will emerge clearly from the description which is given below, for information and in no way limitative, with reference to the appended drawings, in which:<tb> fig. 1 to 6 <SEP> are schematic representations of steps in the manufacture of a first variant embodiment according to the invention;<tb> fig. 7 to 12 <SEP> are schematic representations of steps in the manufacture of a second variant embodiment according to the invention;<tb> fig. 13 to 16 <SEP> are schematic representations of steps in the manufacture of a third variant embodiment according to the invention;<tb> fig. 17 to 19 <SEP> are examples of room applications with at least one decoration according to the invention.
    Detailed description of preferred embodiments
    The invention relates to a part with at least one decoration intended to form a part of a timepiece or of an article of jewelry or bijouterie. In the field of watchmaking, the invention is intended to form all or part of a covering element such as a case, a middle part, a horn, a dial, a flange, a bezel, a push-piece, a crown, a case-back, a needle, a bracelet, a link, a clasp, a decoration, a applique or a crystal but also all or part of an element of the movement such as an oscillating weight or a date disc .
    Advantageously according to the invention, any type of material can be used to form the part, for example a metallic material, a silicon-based material, a ceramic, a cermet, an enamel or another composite (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.).
    Advantageously according to the invention, the part can thus be formed, without limitation, of an iron alloy, a copper alloy, a nickel alloy, titanium or one of its alloys, in gold or one of its alloys, in silver or one of its alloys, in platinum or one of its alloys, in ruthenium or one of its alloys, in rhodium or one of its alloys or in palladium or one of its alloys.
    According to a first embodiment, the part can also be formed from silicon such as, without limitation, monocrystalline silicon, doped monocrystalline silicon, polycrystalline silicon, doped polycrystalline silicon, porous silicon, silicon oxide, quartz, silica, silicon nitride or silicon carbide.
    According to a second embodiment, the part can also be formed from ceramic such as, without limitation, photostructurable glass, borosilicate, aluminosilicate, quartz glass, zerodur, monocrystalline corundum , polycrystalline corundum, alumina, aluminum oxide, aluminum nitride, monocrystalline ruby, polycrystalline ruby, zirconium oxide, titanium oxide, titanium nitride , titanium carbide, tungsten nitride, tungsten carbide, boron nitride or boron carbide.
    Finally, according to a third embodiment, the part can also be formed on the basis of a cermet such as, without limitation, a combination of metallic materials, enamels, composites and ceramics mentioned above,
    In addition, advantageously according to the invention, each at least one decoration can also be formed by a large number of materials. Thus, preferably, each at least one decoration can in particular be formed from a metallic material or from a cermet as explained above for the part.
    It is therefore understood that the room with at least one decoration according to the invention may include a wide variety of pairs of materials in comparison with decorations based on amorphous metal or based on electroformed metal while retaining a setting quality equivalent or even superior form depending on the complex form provided.
    According to a first alternative embodiment, the invention relates to a method of manufacturing a part with at least one decoration as illustrated in the examples of FIGS. 1 to 6.
    The first embodiment of the method according to the invention comprises a step a1) intended to provide a substrate 2 forming the base of the part. As shown in fig. 1, the substrate 2 is preferably coated with a decorative layer 3 over all or part of its upper surface.
    It is therefore understood that the decorative layer 3 is optional and can be of any type of material as explained above for the part, for example a metallic material, a material based on silicon, a ceramic, a cermet, an enamel or other composite (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.). For example, the decorative layer 3 could be an enamel formed on a ceramic substrate 2 to form the part 9 according to the invention.
    Step a1) may include different types of manufacturing depending on the materials chosen to constitute the part 9. Thus, the part 9 can be implemented by one (or more) method (s) destructive (s) and / or by one (or more) additive method (s).
    By way of examples, the destructive method (s) may consist of chemical etching, laser etching, deep reactive ion etching (known by the abbreviation “DRIE”) or a localized ion etching (known by the English abbreviation "FIB"). In addition, as examples, the additive method (s) may consist, for example, of sintering followed by pyrolysis, galvanic growth, growth by chemical gas deposition ( known by the English abbreviation "CVD"), a physical gas phase deposition (known by the English abbreviation "PVD") or growth by atomic layer deposition (known by the English abbreviation "ALD").
    The method, according to the first embodiment, continues with step a2) intended to form a mold 4 on the decorative layer 3. As shown in fig. 4, the mold 4 preferably comprises at least one recessed pattern 6 corresponding to each at least one desired decoration and the bottom of the pattern 6 is formed by the decorative layer 3.
    Step a2) can consist in adding a mold to the decoration layer 3 or alternatively in structuring a mold on the decoration layer 3. The mold 4 to be added to the decorative layer 3 could consist of previously forming an openwork plate of patterns 6 made of metallic material, of silicon-based material, ceramic, cermet, enamel or another composite (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.) then to bring it onto the decorative layer 3.
    In the example illustrated in Figs. 2 to 4, there is shown an example of photolithography of a photosensitive resin 4 ́ carried out on the decorative layer 3. The photosensitive resin 4 ́, which may be of the positive or negative type, is first deposited as illustrated in FIG. 2 on decoration layer 3. As shown in fig. 3, the photosensitive resin 4 'is then selectively illuminated using a mask 5 in order to define the patterns 6. Finally, as illustrated in FIG. 4, the resin 4 ́ is developed to form the mold 4, the patterns 6 of which reveal the decorative layer 3.
    The method, according to the first embodiment, then comprises step a3) intended to fill each pattern 6 of the mold with paste 7 to be soldered. The solder paste 7 is preferably composed of at least one type of powder with an additive or an organic binder.
    Advantageously according to the invention, said at least one type of powder used can be very varied. Preferably, each at least one decoration being formed from a metallic material or a cermet, said at least one type of powder comprises at least metal or metal alloy powder and, optionally, ceramic powder. Cermet has the particular advantage of being harder than metals and giving an advantageous composite appearance.
    Consequently, said at least one type of powder may include, without limitation, an iron alloy, a copper alloy, a nickel alloy, titanium or one of its alloys, gold or a of its alloys, silver or one of its alloys, platinum or one of its alloys, ruthenium or one of its alloys, rhodium or one of its alloys, palladium or one of its alloys, oxide silicon, quartz, silica, silicon nitride, silicon carbide, glass, borosilicate, aluminosilicate, quartz glass, zerodur, monocrystalline corundum, polycrystalline corundum alumina, aluminum oxide, aluminum nitride, monocrystalline ruby, polycrystalline ruby, zirconium oxide, titanium oxide, titanium nitride, titanium carbide, nitride tungsten, tungsten carbide, boron nitride and / or boron carbide.
    Preferably, the solder paste has a melting point below 380 ° C to facilitate its shaping. Said at least one type of powder can thus comprise at least metal or metal alloy powder such as for example based on gold. Said at least one type of powder can thus comprise a mixture of gold and at least one element chosen from the group consisting of tin, silicon, antimony, germanium and gallium.
    More specifically, a gold powder and a tin powder (Au-Sn) can be mixed. The solder paste can also consist of eutectic compositions of gold and silicon (Au-Si) whose melting point is around 363 ° C, of gold and germanium (Au-Ge, around 361 ° C) , gold and antimony (Au-Sb, around 360 ° C), an alloy of gold and gallium (Au-Ga, around 340 ° C) or gold, gallium and indium (Au-Ga-ln, around 325 ° C). In addition, other types of soft solder compositions, that is to say the melting point of which remains below 380 ° C. but without any precious element, such as gold, can be used and which are to base of tin (Sn), eatin and lead (Sn-Pb) or indium (In).
    The method, according to the first embodiment, then comprises a step a4) intended to merge the solder paste and then cool it to form said at least one decoration 8. This heating and then cooling step eliminates the additive or organic binder of the solder paste 7 and to modify solder paste 7 into a dense metallic or cermet material.
    The method, according to the first embodiment, ends with step a5) intended to release from the mold 4, the part 9 with at least one decoration 8 as shown in FIG. 6. Depending on the nature of the mold 4, a selective dissolution, a selective plasma attack or a selective chemical attack can be implemented.
    According to one embodiment of the first alternative embodiment, the method may, between steps a4) and a5), include an optional step a6) intended to machine each at least one decoration 8. As shown in FIG. 5, step a6) can, for example, make one (or more) drilling (s) in at least one decor 8 (on the left in FIG. 5), make it possible to flatten the top of at least one decor 8 to the same level as the upper surface of the mold 4 (in the center in fig. 5) and / or form one (or more) milling (s) on at least one decoration 8 (on the right in fig. 5) .
    According to a second alternative embodiment, the invention relates to a method of manufacturing a part with at least one decoration as illustrated in the examples of FIGS. 7 to 12.
    The second embodiment of the method according to the invention comprises a step b1) intended to selectively deposit a layer 13 of adhesion for each at least one decoration. Step b1) may consist in depositing directly on the part 19 the adhesion layers according to the desired patterns or alternatively in structuring a sacrificial mold to deposit the adhesion layer on the part 19 only in the cavities of the mold. Step b1) could for example consist, using a mask mask, of selectively depositing metallic layers using growth by physical gas deposition.
    As shown in FIG. 7, the part 19 can be of any type of material as explained above such as, for example, a metallic material, a silicon-based material, a ceramic, a cermet, an enamel or another composite (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.). For example, the part 19 could be formed from a transparent material such as quartz or corundum.
    Step b1) can include different types of manufacturing depending on the materials chosen to constitute the part 19. Thus, the part 19 can be implemented by one (or more) method (s) destructive (s) and / or by one (or more) additive method (s).
    By way of examples, the destructive method (s) may consist of chemical etching, laser etching, deep reactive ion etching (known by the abbreviation “DRIE”) or a localized ion etching (known by the English abbreviation "FIB"). In addition, as examples, the additive method (s) may consist, for example, of sintering followed by pyrolysis, galvanic growth, growth by chemical gas deposition ( known by the English abbreviation "CVD"), a physical gas phase deposition (known by the English abbreviation "PVD") or growth by atomic layer deposition (known by the English abbreviation "ALD").
    In the example illustrated in Figs. 8 to 11, there is shown an example of photolithography of a photosensitive resin 14 ́ carried out on the part 19. The photosensitive resin 14 ́, which may be of the positive or negative type, is first deposited as illustrated in FIG. 8 on part 19. As visible in fig. 9, the photosensitive resin 14 ́ is then selectively illuminated using a mask 15 in order to define patterns 16. Finally, as illustrated in FIG. 10, the resin 14 ́ is developed to form the mold 14, the patterns 16 of which reveal the part 19. The adhesion layer 13 is then obtained for example by means of growth by physical deposition in the gas phase and then the mold 14 is removed in order to leave the adhesion layer 13 on the part 19 only at the level where the patterns 16 of the mold 14 were formed as visible in FIG. 11.
    The method, according to the second embodiment, then includes step b2) intended to selectively deposit paste 17 to be brazed on each adhesion layer 13 as illustrated in FIG. 11. Step b2) means that the solder paste 17 must be deposited at least on each adhesion layer 13 but can also be deposited around each adhesion layer 13, that is to say also on the part 19 , without affecting the quality of future decorations as explained below. As an example, step b2) can be carried out by pad printing or by screen printing.
    The solder paste 17 is preferably composed of at least one type of powder with an additive or an organic binder. Advantageously according to the invention, said at least one type of powder used can be very varied. Preferably, each at least one decoration being formed from a metallic material or a cermet, said at least one type of powder comprises at least metal or metal alloy powder and, optionally, ceramic powder. Cermet has the particular advantage of being harder than metals and giving an advantageous composite appearance.
    Therefore, said at least one type of powder may include, without limitation, an iron alloy, a copper alloy, a nickel alloy, titanium or one of its alloys, gold or a of its alloys, silver or one of its alloys, platinum or one of its alloys, ruthenium or one of its alloys, rhodium or one of its alloys, palladium or one of its alloys, oxide silicon, quartz, silica, silicon nitride, silicon carbide, glass, borosilicate, aluminosilicate, quartz glass, zerodur, monocrystalline corundum, polycrystalline corundum alumina, aluminum oxide, aluminum nitride, monocrystalline ruby, polycrystalline ruby, zirconium oxide, titanium oxide, titanium nitride, titanium carbide, nitride tungsten, tungsten carbide, boron nitride and / or boron carbide.
    Preferably, the solder paste has a melting point below 380 ° C to facilitate its shaping. Said at least one type of powder can thus comprise at least metal or metal alloy powder such as for example based on gold. Said at least one type of powder can thus comprise a mixture of gold and at least one element chosen from the group consisting of tin, silicon, antimony, germanium and gallium.
    More specifically, a gold powder and a tin powder (Au-Sn) can be mixed. The solder paste can also consist of eutectic compositions of gold and silicon (Au-Si) whose melting point is around 363 ° C, of gold and germanium (Au-Ge, around 361 ° C) , gold and antimony (Au-Sb, around 360 ° C), an alloy of gold and gallium (Au-Ga, around 340 ° C) or gold, gallium and indium (Au-Ga-ln, around 325 ° C). In addition, other types of soft solder compositions, that is to say the melting point of which remains below 380 ° C. but without any precious element, such as gold, can be used and which are to base of tin (Sn), eatin and lead (Sn-Pb) or indium (In).
    The method, according to the second embodiment, ends with a step b3) intended to merge the paste 17 to be brazed and then cool it to form said at least one decoration 18. This heating and then cooling step makes it possible to remove the additive or organic binder from the solder paste 17 and modify the solder paste 17 into a dense metallic or cermet material.
    Advantageously according to the second embodiment of the invention, thanks to the capillarity effect of the fused solder paste 17, the latter will tend to coat its layer 13 of associated adhesion in a homogeneous manner. not spread out on part 19.
    According to one embodiment of the second alternative embodiment, the method may, after step b3), include an optional step b4) intended to machine each at least one setting 18. As shown in FIG. 12, step b4) can, for example, make one (or more) chamfering (s) of at least one decoration 18 (on the left in FIG. 12), make it possible to smooth the top of at least one decor 18 (in the center in fig. 12) and / or form one (or more) milling (s) on at least one decor 18 (on the right in fig. 12).
    According to a third alternative embodiment, the invention relates to a method of manufacturing a part with at least one decoration as illustrated in the examples of FIGS. 13 to 16.
    The third embodiment of the method according to the invention comprises a step c1) intended to form at least one recessed pattern 26 according to each at least one decoration in said room. Step c1) may consist of directly forming the part 29 with the patterns 26 or alternatively of etching the patterns 26 in a substrate to obtain the part 29.
    As shown in FIG. 13, the part 29 can be of any type of material as explained above such as, for example, a metallic material, a silicon-based material, a ceramic, a cermet, an enamel or another composite (such as a material comprising silicon and metal, fibers and metal, fibers and ceramics, fibers, metal and ceramics, etc.). For example, the part 29 could be formed from an opaque material such as alumina or zirconia.
    Step c1) may include different types of manufacturing depending on the materials chosen to constitute the part 29. Thus, the part 29 can be implemented by one (or more) method (s) destructive (s) and / or by one (or more) additive method (s).
    By way of examples, the destructive method (s) may consist of chemical etching, laser etching, deep reactive ion etching (known by the abbreviation “DRIE”) or a localized ion etching (known by the English abbreviation "FIB"). In addition, as examples, the additive method (s) may consist, for example, of sintering followed by pyrolysis, galvanic growth, growth by chemical gas deposition ( known by the English abbreviation "CVD"), a physical gas phase deposition (known by the English abbreviation "PVD") or growth by atomic layer deposition (known by the English abbreviation "ALD").
    The method, according to the third embodiment, then comprises step c2) intended to fill each pattern 26 with paste 27 to be brazed as illustrated in FIG. 15. As an example, step c2) can be carried out by pad printing or by screen printing.
    The solder paste 27 is preferably composed of at least one type of powder with an additive or an organic binder. Advantageously according to the invention, said at least one type of powder used can be very varied. Preferably, each at least one decoration being formed from a metallic material or from a cermet, said at least one type of powder comprises at least metal or metal alloy powder and, optionally, ceramic powder. Cermet has the particular advantage of being harder than metals and giving an advantageous composite appearance.
    Consequently, said at least one type of powder may include, without limitation, an iron alloy, a copper alloy, a nickel alloy, titanium or one of its alloys, gold or a of its alloys, silver or one of its alloys, platinum or one of its alloys, ruthenium or one of its alloys, rhodium or one of its alloys, palladium or one of its alloys, oxide silicon, quartz, silica, silicon nitride, silicon carbide, glass, borosilicate, aluminosilicate, quartz glass, zerodur, monocrystalline corundum, polycrystalline corundum alumina, aluminum oxide, aluminum nitride, monocrystalline ruby, polycrystalline ruby, zirconium oxide, titanium oxide, titanium nitride, titanium carbide, nitride tungsten, tungsten carbide, boron nitride and / or boron carbide.
    Preferably, the solder paste has a melting point below 380 ° C to facilitate its shaping. Said at least one type of powder can thus comprise at least metal or metal alloy powder such as for example based on gold. Said at least one type of powder can thus comprise a mixture of gold and at least one element chosen from the group consisting of tin, silicon, antimony, germanium and gallium.
    More specifically, a gold powder and a tin powder (Au-Sn) can be mixed. The solder paste can also consist of eutectic compositions of gold and silicon (Au-Si) whose melting point is around 363 ° C, of gold and germanium (Au-Ge, around 361 ° C) , gold and antimony (Au-Sb, around 360 ° C), an alloy of gold and gallium (Au-Ga, around 340 ° C) or gold, gallium and indium (Au-Ga-ln, around 325 ° C). In addition, other types of soft solder compositions, that is to say the melting point of which remains below 380 ° C. but without any precious element, such as gold, can be used and which are to base of tin (Sn), eatin and lead (Sn-Pb) or indium (In).
    The method, according to the third embodiment, ends with a step c3) intended to merge the paste 27 to be brazed and then cool it to form said at least one decoration 28. This heating and then cooling step makes it possible to remove the additive or organic binder from the solder paste 27 and modify the solder paste 27 into a dense metallic or cermet material.
    According to a first embodiment of the third alternative embodiment, the method may, between steps cl) and c2), include an optional step c4) intended to increase the contact surface of the background of the patterns 26 in order to increase the grip of the future decorations 28 in their pattern 26. As visible in FIG. 14, step c4) can, for example, be carried out by sanding the patterns 26, by chemically etching the patterns 26 or by laser engraving the patterns 26.
    According to a second embodiment of the third alternative embodiment, the method may, after step c3), include an optional step c5) intended to machine each at least one decoration 28. As visible in FIG. 16, step b4) can, for example, make one (or more) drilling (s) in at least one decor 28, make it possible to flatten the top of at least one decor 28 to the same level as the surface upper part 29 and / or form one (or more) milling (s) on at least one decoration 28.
    Of course, the present invention is not limited to the illustrated example but is susceptible to various variants and modifications which will appear to those skilled in the art. In particular, the variant embodiments can be combined. By way of example, it would then be possible to form a part 29 of the third embodiment with engraved patterns 26 and a decoration layer 3 of the first embodiment, the decorations 18 being formed by a layer 13 of adhesion and brazing paste 17 of the second variant of the merged and then solidified embodiment.
    Therefore, it is therefore understood that the room with at least one decoration according to the invention can include a wide variety of pairs of materials in comparison with decorations based on amorphous metal or based on electro-formed metal while keeping an equivalent or even better formatting quality depending on the complex form provided.
    By way of non-limiting examples, the three alternative embodiments used alone or in combination can make it possible to obtain the elements 31, 41, 51. As can be seen in FIG. 17, the element 31 is a bezel comprising a piece 39 of alumina or zirconia comprising decorations 38, 38 ́ and 38 ́ ́ of a different nature. The metal decoration 38 forms a ring. The decorations 38 ́ form triangular or rectangular figures and are formed by a phosphorescent cermet. Finally, the 38 ́ ́ decorations form cermet figures.
    As shown in FIG. 18, the element 41 is a dial comprising a piece 49 of quartz or corundum comprising decorations 48 of metal forming a revolution of hours or index hours. Finally, as shown in fig. 19, the element 51 is a display disc comprising a piece 59 of ceramic coated with enamel comprising decorations 58, 58 ́ and 58 ́ ́ of a different nature. The decoration 58 in precious metal forms a personified moon. The decorations 58 ́ form stars formed by a phosphorescent cermet. Finally, the decorations 58 ́ ́ form a disc in dark cermet.
    权利要求:
    Claims (16)
    [1]
    1. Method for manufacturing a part (9) comprising at least one decoration (8) comprising the following steps:a1) provide a substrate (2) forming the base of said part;a2) forming a mold on the substrate, the mold (4) comprising a hollow pattern (6, 8) according to each at least one decoration, the bottom of which is formed by the substrate;a3) fill each pattern in the mold with solder paste;a4) merge the solder paste and then cool it to form said at least one decoration;a5) release said part from the mold with at least one decoration.
    [2]
    2. Method according to the preceding claim, characterized in that the method comprises, between steps a4) and a5), the following step:a6) machine each at least one decor.
    [3]
    3. Method for manufacturing a part (19) comprising at least one decoration (18) comprising the following steps:b1) selectively depositing on the part an adhesion layer (13) for each at least one decoration;b2) selectively deposit solder paste on each adhesion layer (13);b3) merge the solder paste and then cool it to form said part with at least one decoration.
    [4]
    4. Method according to the preceding claim, characterized in that the method comprises, after step b3), the following step:b4) machine each at least one decor.
    [5]
    5. Method of manufacturing a part (29) with at least one decoration (28) comprising the following steps:c1) forming at least one recessed pattern (26) according to each at least one decoration in said part;c2) fill each pattern with solder paste;c3) merge the solder paste and then cool it to form the said one piece with at least one decoration.
    [6]
    6. Method according to the preceding claim, characterized in that the method comprises, between steps c1) and c2), the following step:c4) increase the contact surface of the background of the patterns in order to increase the grip of future decorations.
    [7]
    7. Method according to the preceding claim, characterized in that the method comprises, after step c3), the following step:c5) machine each at least one decor.
    [8]
    8. Method according to one of the preceding claims, characterized in that the substrate forming the base of the part is made of metallic material, of silicon-based material, ceramic, enamel or cermet.
    [9]
    9. Method according to one of the preceding claims, characterized in that the solder paste comprises at least one type of powder with an additive or an organic binder.
    [10]
    10. Method according to the preceding claim, characterized in that the solder paste has a melting point below 380 ° C.
    [11]
    11. Method according to claim 9 or 10, characterized in that said at least one type of powder comprises at least metal or metal alloy powder.
    [12]
    12. Method according to the preceding claim, characterized in that said at least one type of metal powder or of metal alloy comprises gold.
    [13]
    13. Method according to the preceding claim, characterized in that said at least one type of powder comprises a mixture of gold and at least one element chosen from the group consisting of tin, silicon, antimony, germanium, indium and gallium.
    [14]
    14. Method according to the preceding claim, characterized in that said at least one type of powder further comprises ceramic powder.
    [15]
    15. Timepiece characterized in that it comprises a part with at least one decoration obtained using the method according to one of the preceding claims.
    [16]
    16. Timepiece according to the preceding claim, characterized in that said piece with at least one decoration forms all or part of an element of the covering or movement of the timepiece.
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    同族专利:
    公开号 | 公开日
    CH710716A2|2016-08-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP3336614A1|2016-12-16|2018-06-20|Rubattel et Weyermann S.A.|Trim element or timepiece dial made of non-conductive material|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CH1872015|2015-02-12|
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