• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A hybrid braze tape (10) comprises a braze tape layer (20) comprising a braze alloy composition and a binder, and a polytetrafluoroethylene ("PTFE") tape layer (30) disposed adjacent a surface of the braze tape layer.
    公开号:CH710373A2
    申请号:CH01588/15
    申请日:2015-11-02
    公开日:2016-05-13
    发明作者:Cui Yan；Chandrudu Kottilingam Srikanth；Lee Tollison Brian；Lin Dechao；Edward Schick David
    申请人:Gen Electric；
    IPC主号:
    专利说明:

    STATE OF THE ART
    The subject matter disclosed herein relates to soldering tapes and methods, and more specifically to hybrid soldering tapes and methods that combine soldering tapes with polytetrafluoroethylene ("PTFE") tapes.
    A wide variety of different industrial components may be subjected to a soldering operation to add new material, modify existing material, modify the shape of a component, join multiple components, or otherwise alter the original component. The soldering work may generally involve heating a solder alloy composition above its melting temperature (i.e., above its liquidus temperature) while it is on a base substrate (i.e., the original component) and then cooling the material to bond together the solder alloy and the base substrate.
    For example, various turbine components may undergo one or more soldering cycles during initial manufacture or modification before or after use in a turbine. Some specific turbine components may also have very high strength, toughness, and / or other physical properties to facilitate continued work. Turbine elements such as blades (blades), nozzles (vanes) and other hot gas path components and combustion components of industrial and aircraft gas turbines may be formed of nickel, cobalt or iron based superalloys having suitable mechanical and environmental properties.
    In some cases, even though the efficiency of a turbomachine may depend, at least in part, on its operating temperature, a need may arise for components such as turbine blades and nozzles that are capable of withstanding ever-increasing temperatures. Likewise, components in the fuel systems may require increasingly complicated designs to facilitate mixing of air and / or fuel.
    Components, including turbine components that have undergone a soldering cycle, can thereby be reconfigured, connected to, or otherwise modified into a suitable configuration. Solder tapes may provide a way to provide the solder alloy composition for the component. However, soldering tapes can be relatively brittle and not suitable for working in tight spaces.
    Accordingly, alternative hybrid brazing tapes and methods would be welcome in the art.
    BRIEF DESCRIPTION OF THE INVENTION
    In one embodiment, a hybrid braze tape is disclosed. The hybrid braze tape comprises a braze tape layer comprising a braze alloy composition and a binder and a polytetrafluoroethylene ("PTFE") tape layer disposed adjacent a surface of the braze tape layer.
    [0008] In any embodiment of the invention, it may be advantageous if the brazing tape further comprises an adhesive material disposed between the braze tape layer and the PTFE tape layer and configured to hold them together.
    In any embodiment of the invention, it may be advantageous if the adhesive material comprises a double-sided adhesive tape.
    In any embodiment of the invention, it may be advantageous if the solder alloy composition comprises a nickel, cobalt or iron based alloy.
    In any embodiment of the invention, it may be advantageous for the solder alloy composition to comprise about 70.9 percent nickel, about 19 percent chromium, and about 10.1 percent silicon.
    In any embodiment of the invention, it may be advantageous for the braze tape layer and the PTFE tape layer to have a total thickness greater than or equal to about 0.003 inches.
    In any embodiment of the invention, it may be advantageous for the braze tape layer and the PTFE tape layer to have an overall thickness of less than or equal to about 0.08 inches.
    In any embodiment of the invention, it may be advantageous if the soldering tape further comprises an additional soldering tape layer disposed adjacent an opposite surface of the PTFE tape layer to the first soldering tape layer.
    In any embodiment of the invention, it may be advantageous if the brazing tape further comprises an additional PTFE tape layer disposed adjacent to a surface of the brazing tape layer opposite the first PTFE tape layer.
    In any embodiment of the invention, it may be advantageous if an area of the surface of the PTFE tape layer is greater than an area of the surface of the solder tape layer.
    In another embodiment, a hybrid braze tape method is disclosed. The hybrid brazing tape method comprises providing a base component comprising a surface and applying a hybrid braze tape to the surface of the base component. The hybrid braze tape includes a braze tape layer comprising a braze alloy composition and a binder, and a polytetrafluoroethylene ("PTFE") tape layer disposed adjacent a surface of the braze tape layer. The hybrid braze tape method further comprises applying heat to burn away the PTFE tape layer and to melt the braze tape layer so that it at least partially bonds to the base component.
    In any embodiment of the method, it may be advantageous if the method further comprises providing an additional component to the base component adjacent to the application of heat, wherein the hybrid brazing tape is disposed between the base component and the adjacent component, and then applying heat further causes the solder tape layer to at least partially connect to the additional component.
    In any embodiment of the invention, it may be advantageous if the base component comprises a tube.
    In any embodiment of the invention, it may be advantageous if the additional component comprises a plate.
    In any embodiment of the invention, it may be advantageous if the base component and the additional component comprise the same material.
    In any embodiment of the invention, it may be advantageous if the base component comprises a turbine component.
    In any embodiment of the invention, it may be advantageous if the base component comprises an alloy based on nickel, cobalt or iron.
    In any embodiment of the invention, it may be advantageous if the solder alloy composition comprises a nickel, cobalt or iron based alloy.
    In any embodiment of the invention, it may be advantageous for the solder alloy composition to comprise about 70.9 percent nickel, about 19 percent chromium, and about 10.1 percent silicon.
    In any embodiment of the invention, it may be advantageous if the hybrid braze tape further comprises an adhesive material disposed between the braze tape layer and the PTFE tape layer and configured to hold them together.
    These and other additional features provided by the embodiments discussed herein will become more fully understood in view of the following detailed description taken in conjunction with the drawings.
    BRIEF DESCRIPTION OF THE DRAWINGS
    The embodiments shown in the drawings are illustrative and exemplary in nature and are not intended to limit the invention, which is defined by the claims. The following detailed description of the illustrative embodiments can be read upon reading in conjunction with the following drawings, wherein like structure is indicated by like reference numerals and wherein:<Tb> FIG. 1 <SEP> is a schematic cross-sectional view of a hybrid braze tape according to one or more embodiments shown or described herein;<Tb> FIG. 2 <SEP> is a schematic cross-sectional view of a hybrid braze tape having an adhesive material according to one or more embodiments shown or described herein;<Tb> FIG. 3 <SEP> is a schematic cross-sectional view of a hybrid braze tape layer with an additional braze tape layer according to one or more embodiments shown or described herein;<Tb> FIG. 4 is a schematic cross-sectional view of a hybrid braze tape having an additional polytetrafluoroethylene ("PTFE") tape layer according to one or more embodiments shown or described herein;<Tb> FIG. 5 is an illustration of an exemplary hybrid braze tape method according to one or more embodiments shown or described herein;<Tb> FIG. FIG. 6 is an illustration of a hybrid braze tape disposed on a base component according to one or more embodiments shown or described herein; FIG.<Tb> FIG. FIG. 7 is an illustration of the hybrid braze disposed on the base component of FIG. 6 and further disposed adjacent an additional component according to one or more embodiments shown or described herein; FIG.<Tb> FIG. FIG. 8 is an illustration of the connected base component and additional component of FIG. 6 in accordance with one or more embodiments shown or described herein; FIG. and<Tb> FIG. FIG. 9 is an illustration of another basic component and additional component to be joined the same using a hybrid braze tape according to one or more embodiments shown or described herein. FIG.
    DETAILED DESCRIPTION OF THE INVENTION
    One or more specific embodiments of the present invention will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual embodiment may be described in the specification. It should be understood that in developing such an actual implementation, as in any engineering or design project, numerous application-specific decisions must be made to achieve the developer's specific goals, such as compliance with systemic and business-related conditions Implementation may vary to the next. Furthermore, it should be understood that such a development effort may be complicated and time consuming, but nevertheless would be a routine undertaking in design, manufacture, and manufacture for those of ordinary skill in the art having the benefit of this disclosure.
    When introducing elements of various embodiments of the present invention, the articles "a," "an," "this," and "this," mean that one or more of the elements are present. The terms "comprising", "containing" and "with" are meant to be inclusive and mean that additional elements may be present except for the listed elements.
    Referring to Figs. 1-4, various embodiments of hybrid braze tape 10 are illustrated. The hybrid braze tape 10 generally includes a braze tape layer 20 and a polytetrafluoroethylene ("PTFE") tape layer 30 disposed adjacent a surface of the braze tape layer 20.
    The braze tape layer 20 of the hybrid braze tape 10 generally comprises a braze alloy composition and a binder. The solder alloy composition may comprise any solder material or combination of solder materials that combine to have a melting temperature such that sufficient application of heat may melt the solder alloy composition so that it at least partially bonds with the adjacent component. In some embodiments, the melting temperature of the solder alloy composition may be sufficiently high that any suitable heat application during the soldering process may also completely burn away the PTFE tape layer 30.
    In some embodiments, the solder alloy composition may include one or more nickel, cobalt, or iron based alloys. For example, the solder alloy composition may be the same as or similar to the compositions of the commercially available Amdry B-93 solder, Amdry 788 solder, or Amdry 805 solder. In some embodiments, the solder alloy composition may comprise about 70.9 percent nickel, about 19 percent chromium, and about 10.1 percent silicon, such as commercially available BNi-5 solder tape. In some specific embodiments, the solder alloy composition and the component may comprise the same material (i.e., they have the same material composition).
    The binder of the solder tape layer 20 may comprise any suitable binder commercially available for use in soldering tapes. For example, in some embodiments, the binder may comprise fibrillated PTFE. In some embodiments, the binder may comprise any other suitable binder for holding the solder alloy composition in band form and potentially providing some flexibility.
    The polytetrafluoroethylene ("PTFE") tape layer 30 of the hybrid braze tape 10 generally comprises any polytetrafluoroethylene tape such as those used for pipe laying applications. For example, in some embodiments, the PTFE tape layer 30 may be included, which is sometimes referred to commercially as Teflon tape or thread sealing tape.
    The PTFE tape layer 30 may help impart flexibility to the hybrid solder tape 10 by assisting in holding the solder tape layer 20 while handling the hybrid solder tape 10 as a whole (such as when applied to one or more components, eg, wrapped around a threaded tube) becomes). In addition, while the PTFE tape layer 30 burns during subsequent soldering operations, the fluorine released therefrom may even aid in cleaning the surface, such as to help remove debris.
    Referring now to FIG. 2, in some embodiments, the hybrid braze tape 10 may further include an adhesive material 40 disposed between the braze tape layer 20 and the PTFE tape layer 30 and configured to hold them together. The adhesive material 40 may comprise any suitable adhesive in any suitable medium. For example, in some embodiments, the adhesive material may include glue. In such embodiments, the glue may be previously applied to one or both sides of the solder tape layer 20 and / or the PTFE tape layer 30. In some embodiments, the adhesive material may comprise a tape, such as double-sided adhesive tape.
    Referring to FIGS. 1-4, the hybrid braze tape 10 may include a number of different configurations of one or more braze tape layers 20 and one or more PTFE tape layers 30. For example, as illustrated in FIGS. 1 and 2, in some embodiments, the hybrid braze tape 10 may include a single braze tape layer 20 disposed against a single PTFE tape layer 30.
    However, in some embodiments, the hybrid braze tape 10 may include one or more additional braze tape layers 21 and one or more additional PTFE tape layers 31 (with or without additional adhesive material 40 disposed therebetween). For example, as illustrated in FIG. 3, in some embodiments, the hybrid braze tape 10 may include an additional braze tape layer 21 disposed on an opposite surface of the PTFE tape layer 30 as the first braze tape layer 20. In such embodiments, the PTFE tape layer 30 may thereby be "sandwiched" between the two solder tape layers 20 and 21. Such embodiments may allow deposition of even more solder material by applying the hybrid braze tape 10. Likewise, as illustrated in FIG. 4, in some embodiments, the hybrid braze tape 10 may include an additional PTFE tape layer 31 disposed on an opposite surface of the braze tape layer 20 as the first PTFE tape layer 30. In such embodiments, the solder tape layer 20 may thereby be "sandwiched" by the two PTFE tape layers 30 and 31. Such embodiments may allow even more flexibility in using the hybrid braze tape 10.
    Depending on the application of the hybrid braze tape (e.g., gap size, shape, etc.), one or more dimensions may be adjusted. For example, in some embodiments, the solder tape layer 20 and the PTFE tape layer 30 of the hybrid solder tape 10 may have a total thickness greater than or equal to about 0.003 inches. Conversely, in some embodiments, the solder tape layer 20 and the PTFE tape layer 30 of the hybrid solder tape 10 may have an overall thickness of less than or equal to about 0.08 inches.
    In some embodiments, even one, either the braze tape layer 20 or the PTFE tape layer 30, may be over sized with respect to the other to ensure sufficient coverage as desired. For example, in some embodiments, the area of the surfaces of the PTFE tape layer 30 may be greater than the area of the surface of the solder tape layer 20 to ensure that the entire solder tape layer 20 can be supported by the PTFE tape layer 30. Conversely, in some embodiments, the area of the surface of the solder band layer 20 may be greater than the area of the surface of the PTFE band layer 30 when relatively less PTFE material is required to provide sufficient flexibility for the solder band layer 20.
    Referring now additionally to FIGS. 5-9, a hybrid solder bander 100 (FIG. 5) is illustrated with respect to the example of using the disclosed hybrid braze tape 10 to braze a base component 50, either as such or possibly with an additional component 55.
    The hybrid braze tape method 100 includes first providing a base component 50 in step 110. The base component 50 may comprise any metal or alloy substrate suitable for a soldering application. For example, the present disclosure is generally applicable to any metal or alloy component that can be soldered, particularly those components that operate within environments characterized by relatively high stresses and / or temperatures. Relevant examples of such components include turbine components such as turbine blades (vanes), nozzles (vanes), covers, and other hot gas path and combustion components of a turbine, such as an industrial gas or steam turbine or an aircraft gas turbine.
    For example, in some embodiments, the base component 50 may include stainless steel, such as 304 stainless steel. In some embodiments, the base component 50 may include nickel, cobalt, or iron based superalloys. For example, the base component may include nickel base superalloys such as Rene N4, Rene N5, Rene 108, GTD-111®, GTD-222®, GTD-444®, IN-738, and MarM 247 or cobalt-based superalloys such as FSX-414. The base component 50 may be formed as an equiaxed directionally solidified (DS) or single crystal (SX) casting to withstand relatively higher temperatures and stresses, such as may exist within a gas or steam turbine.
    In some embodiments, the base component 50 may include a tube, such as a tube to be soldered to a plate (as exemplified in FIGS. 6-8). In other embodiments, the base component 50 may have a gap that is to be substantially filled by soldering a part thereto (as exemplified in FIG. 9). While specific examples of basic components 50 have been discussed herein, it should be understood that these are not limiting and are exemplary only; additional or alternative base components 50 may also be used in the hybrid braze tape method 100.
    Still referring additionally to FIGS. 5-9, the hybrid braze tape method 100 further comprises applying the hybrid braze tape 10 to the surface of the base component 50 in step 120. The braze braze tape 10 may be applied to the surface of the base component 50 by any suitable method , For example, if the base component 50 comprises a tube (as illustrated, for example, in FIGS. 6-8), the hybrid braze tape 10 may be wrapped around the base component 50. If the base component 50 includes a gap to which a part or other type of component is to be connected, the hybrid braze tape 10 may simply be slid against the surface of the base component 50, squeezed, unwound, or simply otherwise applied. Further, the hybrid braze tape 10 may be secured in place using any suitable material, such as a solder paste or the like.
    In addition, it should be understood that the base component 50 may be subjected to proper preparation prior to application of the hybrid braze tape 10. For example, the base component 50 may be ground, particle blasted, cleaned, treated, or otherwise modified prior to positioning of the hybrid braze tape 10. In addition, the hybrid braze tape 10 may be arranged in any orientation with respect to the base component 50 suitable for the specific application. For example, either the solder tape layer 20 or the PTFE tape layer 30 may be the layer disposed directly on the surface of the base component 50. Further, in some embodiments, multiple pieces of hybrid braze tape 10 may be used at one or more different locations with respect to the base component 50.
    In some embodiments, the hybrid braze tape 10 may be used to brace two pieces of material (such as a pipe to a panel as illustrated in FIGS. 6-8 or a portion to a substrate as illustrated in FIG. 9). In such embodiments, the hybrid braze tape method 100 may further include providing an additional component 55 adjacent the base component in step 130.
    For example, in embodiments where the base component 50 comprises a tube, the additional component 55 may include a plate, as illustrated in FIGS. 6-8. In embodiments where the base component 50 includes a substrate with a gap, the additional component 55 may include a portion to be disposed within the gap. The additional component 55 may otherwise have any other type of component that is to be soldered to the base component 50. In some embodiments, the base component 50 and the additional component 55 may comprise the same material.
    Still referring additionally to FIGS. 5-9, the hybrid braze tape process finally involves applying heat in step 140. By applying heat in step 140, both the PTFE tape layer 30 may burn away in addition to melting the braze tape layer 20 it at least partially connects to the base component 50 (and possibly the additional component 55 if present).
    The temperature, heat source (s), iterations, rate of increase, hold time, cycle and other relevant parameters of the heat application may be adjusted so that the hybrid braze tape at least partially melts. For example, in some embodiments, heat may be applied within a non-oxidizing atmosphere (e.g., vacuum or inert gas). In some embodiments, heat may be applied within a range of about 2050 ° F to about 2336 ° F (about 1120 ° C to about 1280 ° C), depending on the composition, for a period of about 10 minutes to about 60 minutes.
    As illustrated in Figure 8, the application of heat in step 140 of the hybrid braze tape method 100 allows the braze tape layer 20 to melt and bond to the base component 50 while the PTFE tape layer 30 disappears. The PTFE tape layer 30 can thereby help give the solder tape layer 20 additional flexibility, help to ensure a firm bond in any gap in which the hybrid solder tape 10 is applied, and / or release fluorine during the application of heat, which Basic component 50 may further clean before it connects to the Lötbandschicht 20.
    While the invention has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention may be modified to incorporate any number of variations, changes, substitutions, or equivalent arrangements not heretofore described, which, however, are in accordance with the spirit and scope of the invention. Additionally, it should be understood that while various embodiments of the invention have been described, embodiments of the invention may include only some of the described embodiments. Accordingly, the invention is not to be considered limited by the above description, but is limited only by the scope of the appended claims.
    A hybrid braze tape includes a braze tape layer comprising a braze alloy composition and a binder, and a polytetrafluoroethylene ("PTFE") tape layer disposed adjacent a surface of the braze tape layer.
    LIST OF REFERENCE NUMBERS
    [0055]<Tb> 10 <September> Hybridlötband<Tb> 20 <September> Lötbandschicht<tb> 21 <SEP> Additional soldering tape layer<Tb> 30 <September> PTFE tape layer<tb> 31 <SEP> Additional soldering tape layer<Tb> 40 <September> adhesive material<Tb> 50 <September> Basic component<tb> 55 <SEP> Additional component<Tb> 100 <September> Hybridlötbandverfahren<tb> 110 <SEP> Step (Providing the Basic Component)<tb> 120 <SEP> Step (Disposal of the Hybrid Solder Tape)<tb> 130 <SEP> Step (Deploying Additional Component)<tb> 140 <SEP> step (heat)
    权利要求:
    Claims (10)
    [1]
    1. Hybrid soldering tape comprising:a solder tape layer comprising a solder alloy composition and a binder; anda polytetrafluoroethylene ("PTFE") tape layer disposed adjacent a surface of the solder tape layer.
    [2]
    The hybrid braze tape of claim 1, further comprising an adhesive material disposed between the braze tape layer and the PTFE tape layer and configured to hold the braze tape layer and the PTFE tape layer together.
    [3]
    A hybrid braze tape according to any one of the preceding claims wherein the braze alloy composition comprises a nickel, cobalt or iron based alloy.
    [4]
    The hybrid braze tape of claim 3, wherein the braze alloy composition comprises about 70.9 percent nickel, about 19 percent chromium, and about 10.1 percent silicon.
    [5]
    5. The hybrid braze tape of claim 1, wherein the braze tape layer and the PTFE tape layer have a total thickness of greater than or equal to about 0.003 inches and / or wherein the braze tape layer and the PTFE tape layer have a total thickness of less than or equal to about 0.08 Inch.
    [6]
    6. The hybrid soldering tape of claim 1, further comprising an additional soldering tape layer disposed adjacent to a surface of the PTFE tape layer opposite the first soldering tape layer and / or further comprising an additional PTFE tape layer attached to one of the first PTFE tape layers. Band layer opposite surface of the Lötbandschicht is arranged adjacent.
    [7]
    7. Hybrid soldering tape according to one of the preceding claims, wherein a surface of a surface of the PTFE tape layer is greater than an area of a surface of the solder tape layer.
    [8]
    8. Hybrid brazing tape method comprising:providing a base component comprising a surface;applying a hybrid braze tape to the surface of the base component, the hybrid braze tape comprising:a solder tape layer comprising a solder alloy composition and a binder; anda polytetrafluoroethylene ("PTFE") tape layer disposed adjacent a surface of the solder tape layer; andapplying heat to burn away the PTFE tape layer and to melt the solder tape layer so that it at least partially bonds to the base component.
    [9]
    The hybrid braze tape method of claim 8, further comprising providing an additional component adjacent the base component prior to application of heat, wherein the hybrid braze tape is disposed between the base component and the adjacent component, and wherein the subsequent application of heat further causes the braze tape layer to settle at least partially connect to the additional component.
    [10]
    A hybrid brazing tape method according to claim 8 or 9, wherein the base component and / or the brazing alloy composition comprises a nickel, cobalt or iron based alloy.
    类似技术:
    公开号 | 公开日 | 专利标题
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    DE60219982T2|2008-01-17|Additional powder for diffusion brazing of workpieces made of nickel, cobalt or iron-based alloys
    EP1321214A1|2003-06-25|Workpiece comprising a cavity covered by a soldering foil and method for covering a cavity using a soldering foil
    WO2017194275A1|2017-11-16|Construction platform for additive manufacturing, and method
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    同族专利:
    公开号 | 公开日
    DE102015118277A1|2016-05-12|
    CN105584150A|2016-05-18|
    US20160129533A1|2016-05-12|
    引用文献:
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    法律状态:
    2017-03-15| NV| New agent|Representative=s name: GENERAL ELECTRIC TECHNOLOGY GMBH GLOBAL PATENT, CH |
    2019-07-31| AZW| Rejection (application)|
    优先权:
    申请号 | 申请日 | 专利标题
    US14/535,721|US20160129533A1|2014-11-07|2014-11-07|Hybrid braze tapes and hybrid braze tape methods|
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