• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for varying the distance (1) between a printed circuit board connection (2) of a printed circuit board (3) and a component connection (4) of a component (5) which is contacted with the printed circuit board (3). It comprises the following method steps: producing at least a first droplet (6) of an electrically conductive and viscous medium, wherein the at least first droplet (6) has a predetermined volume; Placing the at least first droplet (6) on the printed circuit board connector (2); Placing the component (5) on the printed circuit board (3) such that the at least first droplet (6) establishes a material-locking and electrical connection between the printed circuit board connection (2) and the component connection (4), wherein the distance (1) between the printed circuit board connection ( 2) and the component connection (4) is varied by the volume of the at least first droplet (6).
    公开号:CH709265B1
    申请号:CH00192/15
    申请日:2015-02-13
    公开日:2019-06-14
    发明作者:Hippin Christoph
    申请人:Endress Hauser Gmbh Co Kg；
    IPC主号:
    专利说明:

    Description [0001] The invention relates to a method for varying the distance between a printed circuit board connection of a printed circuit board and a component connection of a component.
    Modern electrical equipment, in particular measuring devices, generally have at least one printed circuit board, which is equipped with electronic components. These components are mechanically and electrically connected to the circuit board. For this purpose, the components have component connections, so-called component pads, and the printed circuit boards have printed circuit board connections, so-called printed circuit board pads, which run on the surface of the printed circuit board.
    The component terminals are connected to the PCB terminals both electrically and mechanically. This happens, for example, by means of SMD assembly process. The components are soldered by means of solderable component connections directly to the PCB terminals of the PCB. For this, the PCB connections are printed with solder paste. Subsequently, the component connections are soldered with the solder paste. The solder paste is a mixture of tin globules and flux or adhesive.
    The solder paste can be applied to the circuit board connections in several ways: either the solder paste is applied by screen printing or dosed in small portions. The latter is mainly practiced manually in prototype and small series. For gluing but also machines are used, which dose the glue. The adhesive is applied through a thin tube to the desired location or sprayed without contact (Jet Printing).
    When applying the solder paste, the screen printing process has prevailed. Where later component leads come to rest on the PCB terminals, the PCB terminals have copper pads (PCB pads) that are either gold plated or tinned. The printing screen is positioned over the PCB so that the holes of the screen are centered over the PCB connectors.
    Printed circuit board and screen are pressed against each other, and «a squeegee» pushes the solder paste through the screen so that it passes through the holes on the PCB connections. The thickness of the screen determines the amount of tin (amount of solder paste) per area.
    The screens are largely replaced today by gelasene metal stencils. Thus, smaller structures can be printed better. In order to achieve the required accuracy in printing, printers are used, which allow an accurate alignment of the template to the circuit board.
    When glued components of the adhesive is cured by heat. This is done in an oven. The solder balls in the solder paste melt and provide both a mechanical and electrical connection between the component connection and the PCB connection. In this case, distances between the printed circuit board connection and the component connection in the order of 100 pm can be achieved.
    For applications in the high frequency range, especially in the gigahertz range, minimum distances must be set by the soldering gap. Too large a solder gap leads to losses, e.g. in the dynamics of an amplifier. There are already RF components today where this requirement is named in the data sheet.
    The invention has for its object to provide a method for minimizing the distance between the PCB connection and the component connection, preferably to an order of magnitude smaller than 10 pm specify.
    The object is achieved by the subject matter of the invention. The subject of the invention is a method of varying the distance between a printed circuit board terminal of a printed circuit board and a component terminal of a component contacted with the printed circuit board, comprising the steps of: generating at least a first droplet of electrically conductive and viscous medium; Droplet having a predetermined volume, placing the at least one first droplet on the circuit board terminal;
    Placing the component on the circuit board such that the at least first droplet establishes a material and electrical connection between the circuit board terminal and the component terminal, wherein a distance between the circuit board terminal and the component terminal is varied by the volume of the at least first droplet.
    Jet printers are known from the prior art, which reduce the volume of the ejected droplets pretty much to 5 nanoliters. By means of the method according to the invention, distances between the printed circuit board connection and the component connection of 10 μm and less can be achieved by means of droplets of such size. In this way, high-frequency signals can be transmitted with low loss between the circuit board and the components.
    According to an advantageous development, a second droplet is placed next to the first droplet, wherein a distance between the first droplet and the second droplet is chosen such that the first droplet and the second droplet form a large droplet.
    Due to the van der Waals forces, the first and second droplets join together to form a large droplet. As a result, a large-area contact between the PCB connection and the component connection can be produced. This occurs at a distance of 300 pm between the first droplet and the second droplet.
    According to a favorable development, the shape of the large droplet is varied by the distance between the first droplet and the second droplet.
    The shape of the large droplet is critical to the distance between the PCB connector and the component connector. If the first and the second droplets are very close together, the result is a tall and narrow large droplet. Otherwise, a flat and broad gross droplet results. Both embodiments affect the distance between the PCB terminal and the component terminal in their own way.
    The invention will be explained in more detail with reference to the following drawings. It shows:
    1a shows a plan view of a printed circuit board with a plurality of printed circuit board connections, wherein a plurality of droplets are arranged on the printed circuit board connections,
    FIG. 1b shows a lateral longitudinal section of a printed circuit board according to FIG. 1a, on which a component is arranged by means of the method according to the invention, FIG.
    2a shows a plan view of a printed circuit board with a plurality of printed circuit board connections, wherein on the printed circuit board connections a large droplet is arranged,
    2b shows a lateral longitudinal section of a printed circuit board according to FIG. 2a, on which a component is arranged by means of the method according to the invention, FIG.
    3a shows a lateral longitudinal section of two droplets,
    3b is a plan view of two droplets according to Fig. 3a,
    4 a: lateral longitudinal section of a large droplet,
    4a is a plan view of a large droplet according to Fig. 4a,
    5a shows a lateral longitudinal section of a large droplet, and FIG. 5b shows a plan view of a large droplet according to FIG. 5a.
    Fig. 1a shows a printed circuit board 3, on which a plurality of printed circuit board terminals 2 are arranged. A printed circuit board connection 2 extends transversely and two further printed circuit board connections 2 are arranged at the top and at the bottom. On the printed circuit board terminals 2, a plurality of droplets 6, 7 of an electrically conductive and viscous medium are arranged, which each have a fairly precise volume of 5 nanoliters. A component 5 is arranged by means of a component connection 4 on the droplets 6, 7 and soldered by means of a known method from the prior art. In this case, the droplets 6, 7 spread out and wet both the PCB connection 2 and the component connection 4 over a large area. The result is shown in FIG.
    Fig. 1b shows a lateral longitudinal section of a printed circuit board 3, on which a component 5 is arranged. The droplets have joined together during the soldering process to form a layer 10. The distance 1 between the PCB terminal 2 and the component terminal 4 is now less than 10 pm.
    Fig. 2a shows a printed circuit board 2 with a plurality of printed circuit board terminals 2 according to Fig. 1a. On one of the printed circuit board terminals 2, a first and a second droplets were arranged at a small distance 8 so that the first and second droplets joined together to form a large droplet 9 due to their Van der Waals forces. If the mentioned soldering method is used, a layer 10 results between the PCB terminal 2 and the component terminal 4, which is slightly thicker than 10 pm.
    Fig. 2b shows a lateral longitudinal section of a printed circuit board 2 according to Fig. 2a, on which the component 5 is arranged by means of the inventive method. It can clearly be seen that the distance 1 between the printed circuit board connection 2 and the component connection 4 is slightly larger than in FIG. 1b. This is due to the formation of a gross droplet 9 by a first and a second droplets placed close to each other.
    The formation of large droplets 9 by means of a first and a second droplet, which are placed close to each other, will be explained in more detail with reference to the following figures.
    3a shows a lateral longitudinal section of a first and a second droplet 6, 7 of an electrically conductive and viscous medium. The distance 8 between the tips of the first and second droplets 6, 7 is in this case 500 μm.
    Fig. 3b shows a plan view of the first and second droplets 6, 7 corresponding to Fig. 3a. The distance of 500 microns is not sufficient in this case, so that the first and the second droplets 6, 7 merge due to the van der Waals forces to a large droplet 9.
    Fig. 4a shows a lateral longitudinal section of a large droplet 9, which was formed from a first and a second droplets, the tips of which had a distance 8 of 300 pm.
    FIG. 4b shows a top view of the large droplet 9 according to FIG. 4a. The distance 8 of 300 pm is sufficient in this case, so that the first and the second droplets join together to form a large droplet 9 due to their van der Waals forces.
    Fig. 5a shows a lateral longitudinal section of a large droplet 9, which was formed from a first and a second droplets with a distance 8 of 100 pm.
    Fig. 5b shows a plan view of a large droplet 9 according to Fig. 5a. It can clearly be seen that the large droplet 9 in FIGS. 4a and 4b is wider but flatter than the large droplet 9 in FIGS. 5a and 5b. By varying the shape of the large droplet 9, the distance 1 between the printed circuit board connection 2 and the component connection 4 can likewise be varied.
    List of Reference Numerals 1 Distance between the PCB connection and the component connection 2 PCB connection 3 PCB 4 Component connection 5 Component 6 First droplet 7 Second droplet 8 Distance between the tips of the first and second droplets 9 Large droplets 10 Layer of the droplets
    权利要求:
    Claims (3)
    [1]
    claims
    A method for minimizing the distance (1) between a printed circuit board terminal (2) of a printed circuit board (3) and a component terminal (4) of a component (5) which is contacted with the printed circuit board (3), comprising the steps of: generating at least a first droplet (6) of an electrically conductive and viscous medium, the at least first droplet (6) having a predetermined volume; Placing the at least first droplet (6) on the printed circuit board connector (2); Placing the component (5) on the printed circuit board (3) such that the at least first droplet (6) establishes a material-locking and electrical connection between the printed circuit board connection (2) and the component connection (4), wherein the distance (1) between the printed circuit board connection ( 2) and the component port (4) is defined by the predetermined volume of the at least first droplet (6); Fixing the component (5) on the printed circuit board (3), whereby a mechanical and electrical connection between the component connection (4) and the printed circuit board connection (2) is produced during the fastening.
    [2]
    The method of claim 1, wherein a second droplet (7) is placed adjacent to the first droplet (6), and wherein a distance (8) between the first droplet (6) and the second droplet (7) is selected to be the first droplet (6) and the second droplet (7) form a gross droplet (9).
    [3]
    A method according to claim 2, wherein the shape of the large droplet (9) is varied by the distance (8) between the first droplet (6) and the second droplet (7).
    类似技术:
    公开号 | 公开日 | 专利标题
    DE19541334C2|2003-05-22|Method for producing a large number of printed circuit boards and printed circuit board arrangement
    DE102004005685B4|2007-12-20|Method for producing an electronic component
    DE3616723A1|1987-11-19|MICROWAVE BLOCK
    EP0487782B1|1995-11-29|Method of soldering circuit boards
    DE102005013599A1|2006-10-05|Method of repair soldering multipolar miniature connectors
    DE69833401T2|2006-11-02|Surface mounted arrangement of electronic components
    DE102010010331A1|2011-09-08|Electrical contact arrangement
    EP1371273A1|2003-12-17|Laminate comprised of flat conductor elements
    DE112012002829T5|2014-04-24|Multilayer printed circuit board and method for producing a multilayer printed circuit board
    CH709265B1|2019-06-14|Method for varying the distance between a printed circuit board connection and a component connection.
    DE102016101757A1|2016-08-04|CIRCUIT MODULE WITH SURFACE MOUNTABLE SURFACE BLOCKS FOR CONNECTING A PCB
    WO2017032638A1|2017-03-02|Pin contact strip, assembled printed circuit board and method for producing an assembled printed circuit board
    DE102004038401B4|2017-07-06|Method for connecting a flexible flat conductor to a printed circuit board
    DE102012112546A1|2014-06-18|Method for manufacturing mixed printed circuit board of measuring device, involves printing stencil with solder paste, and fitting surface mount device components with side of board, where components are soldered during soldering process
    DE102016219557B4|2019-05-29|Method for printing connection materials on contact surfaces on a circuit carrier
    EP3668284A1|2020-06-17|Circuit board and method for manufacturing a circuit board
    DE102015220676A1|2017-04-27|Printed circuit board and arrangement with a printed circuit board
    DE102019129971A1|2021-05-06|Method for soldering a component onto a printed circuit board, electronic unit and field device in automation technology
    DE102013226294A1|2015-06-18|Resistor component, its manufacture and use
    WO2016000909A1|2016-01-07|Circuit-board connecting element
    DE102018215672A1|2020-03-19|Method of manufacturing a circuit board arrangement and circuit board arrangement
    DE3040460C2|1982-12-16|Electronic circuit and method of making it
    DE102020208814A1|2022-01-20|Capacitor arrangement and method for connecting an electronic capacitor to a carrier substrate
    DE112019007081T5|2021-12-23|Circuit board
    EP3751626A1|2020-12-16|Electronic module and method for producing at least one electrical connection to an electronic module
    同族专利:
    公开号 | 公开日
    CH709265A2|2015-08-28|
    DE102014102597A1|2015-08-27|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    FR2651025B1|1989-08-18|1991-10-18|Commissariat Energie Atomique|ASSEMBLY OF PARTS HAVING AN ANGLE BETWEEN THEM AND METHOD FOR OBTAINING THIS ASSEMBLY|
    FR2651083B1|1989-08-18|1995-12-29|Commissariat Energie Atomique|ELECTRICAL CONNECTION OR DISCONNECTION ELEMENT, INTEGRATED CIRCUIT COMPRISING SUCH ELEMENTS AND CORRESPONDING CONNECTION OR DISCONNECTION METHOD|
    DE19931110A1|1999-07-06|2001-01-25|Ekra Eduard Kraft Gmbh|Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder|
    AU2892602A|2000-11-10|2002-05-21|Unitive Electronics Inc|Methods of positioning components using liquid prime movers and related structures|
    DE10325559B3|2003-06-05|2004-12-09|Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.|Method and device for producing a system with a component applied to a predetermined location on a surface of a substrate|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102014102597.0A|DE102014102597A1|2014-02-27|2014-02-27|Method for varying the distance between a printed circuit board connection and a component connection|
    [返回顶部]