• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a method for processing a sawing tool (10), comprising the method steps: a) providing a sawing tool (10), in particular a sawing wire; b) inserting recesses (12) in the sawing tool (10). Such a method can provide a sawing tool (10) which can improve the removal of removed material from a sawing gap in a sawing process. The present invention further relates to a sawing tool (10), a method for sawing a workpiece and a device for sawing a workpiece.
    公开号:CH707914B1
    申请号:CH00451/14
    申请日:2014-03-25
    公开日:2017-10-31
    发明作者:Schöpf Martin；Kuntzer Michael；albrecht Andreas；Puzik Arnold
    申请人:Bosch Gmbh Robert；
    IPC主号:
    专利说明:

    Description: The present invention relates to a method for processing a sawing tool. The present invention further relates to a method for sawing a workpiece. More particularly, the invention relates to a method of wire sawing a silicon workpiece to produce a silicon wafer.
    Background Art It is often desirable to saw workpieces, such as silicon workpieces, to achieve a desired size or structure. Here, the so-called wire sawing is often used. This is a mechanical separation process, especially for silicon, which is also referred to as Trennläppverfahren.
    In this case, a usually thin wire often serves as a tool. An unwind spool winds the wire over wire guide rollers with a defined wire speed until it is finally wound up again via a take-up reel. The wire dips into a suspension and draws the slurry adhering to the wire surface into the kerf of the workpiece. Slurry is additionally defined on the wire field via a nozzle. The cutting tool is thus pulled at a defined processing speed through the sawing gap and tears small particles from the solid. In this case, the workpiece dips into the wire field at the appropriate feed rate, whereby a cutting removal takes place.
    From the document DE 10 2010 040 535 A1 a method for sawing a workpiece is further known in which a sawing tool is displaced along the workpiece, wherein the sawing tool cooperates with the displacement with abrasive grains such that the abrasive grains a machining removal of the Work, and wherein between the workpiece and the sawing tool, an electrical voltage for stress-based removal of the workpiece is applied.
    DISCLOSURE OF THE INVENTION The present invention is a method for processing a sawing tool, comprising the method steps: a) providing a sawing tool, in particular a sawing wire: b) inserting recesses into the sawing tool.
    A method described above makes it possible in a particularly simple and cost-effective manner to provide a sawing tool with which in a sawing process particularly effectively removed material can be removed from the workpiece.
    For this purpose, the method according to method step a) comprises the provision of a sawing tool. The sawing tool can be configured in particular, as it is known per se for a separation of silicon wafers. For example, the sawing tool may be a sawing wire. Such a sawing wire may in particular have a diameter which is in a range of greater than or equal to 100 pm to less than or equal to 180 pm. In this case, the wire can be provided wound on a supply reel. For a treatment, the sawing tool can then be unwound from the supply reel and wound on a take-up reel after treatment, or fed directly to a sawing process, as explained in detail below.
    A treatment of the sawing tool or producing an improved sawing tool after unwinding according to the invention and according to method step b) an insertion of recesses in the sawing tool. In this method step, recesses or crater-like regions are thus produced in the sawing tool.
    By such a structuring or contouring of at least a portion of the surface of the sawing tool, preferably the entire surface of the sawing tool, the sawing tool may have a rough surface structure, which may serve particularly advantageous to allow a chipping of the workpiece and thus a sawing process ,
    In addition, in particular by the provision of recesses, a structure can be generated, which can transport removed material of the workpiece advantageous. This may in particular be the case if, in addition to the sawing tool, a fluid is used which at least partially surrounds the sawing tool during a sawing process. For in particular in a fluid, the structure produced can generate a flow to be designated as drag flow, which can advantageously transport the removed material and thus enable a particularly effective, gentle and defined sawing. Because a sawing by means of such a sawing tool can be influenced in particular with regard to the performance by a suitable removal of the removed particles.
    In the context of an embodiment, method step b) can be carried out by a stress-based material removal from the surface of the sawing tool. In this embodiment, the functional principle of spark erosion (EDM) is thus essentially used with respect to a material removal for the production of recesses. A voltage is applied between the tool and an electrode. A discharge arc or arc generated by such a voltage can cause the material of the sawing tool to melt and / or evaporate, thus becoming detached from the structure or from the surface. By means of a voltage arc, a thermal removal of material of the tool is possible. The inventive thermally ablative process is also possible with very hard metals, which can be used in particular as a sawing tool, since mainly the melting or evaporation temperature is important, but less the hardness sets a limit. Furthermore, in this embodiment, the structure of the surface to be generated can be adapted to the desired result very simply by changing conditions, such as different applied voltages.
    It may be advantageous if a dielectric is arranged between the sawing tool and an electrode. The dielectric can ensure the formation of a suitable discharge arc, which is not disturbed or hindered by an electrically conductive component between the sawing tool and the electrode. For example, tool and electrode may be arranged in a dielectric. For example, can serve as a dielectric deionized water, which can also cause a cooling effect.
    In particular, process step b) can be carried out by passing the sawing tool on an electrode. In particular, this configuration may be particularly advantageous for saw wires as sawing tools. For in this embodiment, a sawing wire may be unwound from an unwinding roll, passed along the electrode and then wound up on a take-up reel. For example, following along may mean that the sawing tool is guided laterally along an electrode, or else that the sawing tool is guided through an opening of the electrode, so that the sawing tool is completely surrounded by the electrode in the region of the passage or opening. In particular, the latter alternative may be advantageous, since so the circumference of the sawing tool can be particularly uniformly provided with recesses. In this case, advantageously, a suitable distance of the sawing tool to the electrode can be set in order to create advantageous conditions for the formation of a discharge arc. The distance can be chosen in particular as a function of the applied voltage and the desired structure to be generated of the surface of the sawing tool.
    Furthermore, instead of directly winding the treated sawing tool, this can be fed directly into a sawing process, so that the treatment or production of the tool can be directly preceded by the sawing process in terms of time and space. For example, the machining of the sawing tool and the sawing process can be performed in one device, which can save time and money.
    For example, a voltage can be applied which is in a range of greater than or equal to 100 V to less than or equal to 400 V. In particular, using a tension in this area, it can be advantageously made possible that recesses in a particularly suitable size and in a particularly advantageous number are made possible, so that the sawing tool produced can work particularly advantageously. Moreover, in this embodiment, no great demands are placed on a device for carrying out the method, such as, for example, to the electrode or the voltage source, so that the method can be carried out in a particularly cost-effective manner and using known components.
    As part of a further embodiment, recesses may be produced which have a size which is in a range of greater than or equal to 1 pm to less than or equal to 20 pm. In particular, such recesses can lead to a structuring of the surface of the sawing tool, such as the saw wire, which is particularly advantageous for removing removed material from the sawing frame and thus to provide effective and defined sawing conditions. Furthermore, recesses can be produced particularly advantageously in various ways, in particular in this refinement, so that the method can also be implemented without problems using stress-based removal of the surface of the sawing tool.
    In a further embodiment, the sawing tool can be selected from a copper, brass, graphite, tungsten, molybdenum or steel wire. Such metals, especially in this embodiment, the sawing tool provides a sufficiently high stability and tensile strength, so that the sawing tool or the saw wire is well suited for a wire saws. Furthermore, such sawing tools are electrically conductive, so that, for example, a stress-based shaping of recesses in the surface of the workpiece is possible without problems. The sawing tool or the metal wire can have a thickness or a diameter in a range of> 50 pm to in particular <180 pm.
    With regard to further advantages and features, reference is hereby explicitly made to the explanations in connection with the inventive sawing tool, the method for sawing a workpiece, the apparatus for sawing a workpiece and the figure. Also inventive features and advantages of the inventive method for machining a sawing tool for the inventive sawing tool, the method for sawing a workpiece, the device for sawing a workpiece should be applicable and apply as disclosed and vice versa.
    The present invention further relates to a sawing tool, in particular a sawing wire, produced according to a method configured as described above. Such a sawing tool may in particular be a copper, brass, graphite, tungsten, molybdenum or steel wire and, for example, have a thickness or a diameter in a range of> 50 pm to in particular <180 pm. In particular, such a sawing tool can provide improved removal of removed material and can be produced in a particularly simple and cost-effective manner.
    With regard to further advantages, reference is hereby explicitly made to the explanations in connection with the method according to the invention for machining a sawing tool, the method for sawing a workpiece, the device for sawing a workpiece and the figure. Also, features and advantages of the inventive sawing tool according to the invention should also be applicable to the method according to the invention for machining a sawing tool, the method for sawing a workpiece, the device for sawing a workpiece and be regarded as disclosed and vice versa.
    The present invention further provides a method for sawing a workpiece, in particular a silicon workpiece, comprising the method steps: a) machining a sawing tool according to a method configured as described above; b) displacing the sawing tool along the workpiece such that a machining removal of the workpiece is effected.
    In such a sawing method, in particular an improved removal of removed material may be possible. Furthermore, the method can be particularly simple and inexpensive to carry out.
    For this purpose, the method according to method step a) comprises machining a sawing tool according to a method configured as described above. In this regard, reference is made to the above statements regarding this method step.
    Furthermore, the method according to method step b) comprises a displacement of the sawing tool along the workpiece such that a machining removal of the workpiece is effected. This mechanical sawing method is well suited for sawing a workpiece even in small dimensions, such as those used for the production of power semiconductors. A displacement means in particular that the sawing tool is moved along the desired cutting edge of the workpiece, wherein a cutting removal of the workpiece is made possible by the roughness of the surface of the sawing workpiece. In this case, a cutting removal means in particular that the removed material is obtained in the form of chips or particles.
    The method according to the invention is particularly suitable for sawing a silicon workpiece. However, other workpieces can also be sawn using the method according to the invention, in particular semiconductor workpieces such as gallium arsenide or indium phosphide.
    A method for sawing a workpiece is understood to mean, in particular, a method for cutting or scoring a workpiece. By a sawing process can thus be separated from the workpiece or one or more parts of the workpiece or notches or structures are created in the workpiece.
    Characterized in that the sawing tool has a rough surface with recesses, the sawing process can take place particularly effective and defined. Because the recesses can cause the separated out of the workpiece material can be effectively removed from the sawing or from the cutting gap or sawing gap, whereby specially defined sawing properties can be generated. In detail, a saw pattern according to defined specifications, such as depth or the like, be particularly accurate and possible in the smallest dimensions, since the presence of herausgetrenntem material can be minimized particularly effective at the sawmill, so this does not cause the sawing in an undesirable Way disturbs.
    In addition, the feed rate, so the speed of displacement of the sawing tool along the surface of the workpiece, can be adjusted so that feed rates of up to 1.5 mm / min or even more can be achieved. Such feed speeds are suitable for sawing as well as for a stress-based removal of the tool, so that the machining of the sawing tool can be directly preceded by the sawing process and thus proceed in one device. The feed rate is high enough to work economically, and low enough to handle even the smallest workpieces with high accuracy.
    In this case, a liquid can be arranged between the sawing tool and the workpiece. A liquid can here on the one hand cool the sawing tool as well as the workpiece, which is particularly preferred in a cutting removal. In addition, the liquid can achieve a lubricating effect that minimizes the effort required to move the sawing tool. As a result, the sawing tool is spared. Consequently, the liquid may have the function of a cooling lubricant. Suitable liquids include, for example, glycol or oil, such as a mineral or synthetic oil and in particular a liquid acting as a dielectric.
    In addition, the liquid can serve as a carrier medium for separated material of the workpiece by the separated material is separated from the sawing piece of the material and is transported away by the fluid medium. This can be realized in particular in conjunction with the specific surface of the sawing tool, since the recesses of the sawing tool can form an effective drag flow in the fluid.
    With regard to further advantages and features, reference is hereby explicitly made to the explanations in connection with the inventive method for machining a sawing tool, the sawing tool, the apparatus for sawing a workpiece and the figure. Also inventive features and advantages of the inventive method for sawing a workpiece for the inventive method for machining a sawing tool, the sawing tool, the device for sawing a workpiece should be applicable and apply as disclosed and vice versa.
    The present invention is further an apparatus for sawing a workpiece, in particular a silicon workpiece, comprising a sawing tool, wherein the apparatus comprises means for performing the method as described above.
    Such a device for sawing can be particularly advantageously designed such that an unwinding roller for a sawing tool, in particular a sawing wire is provided, from which the sawing tool is unwound. Subsequently, an electrode and a voltage source may be provided such that a voltage between the sawing tool and the electrode can be applied, whereby a stress-based removal of material of the tool to form recesses for creating a rough surface of the tool is possible. Furthermore, guide means may be provided to guide the sawing tool along a workpiece in order to saw the workpiece so as to cut. Thus, the method can in particular run in a device or the device for sawing a workpiece may contain all the components which are used to machine a sawing tool or to form a recess in the surface of the workpiece and also to displace the sawing tool along the workpiece such that a cutting Ablation of the workpiece is effected, are necessary.
    With regard to further advantages and features, reference is hereby explicitly made to the explanations in connection with the inventive method for processing a sawing tool, the method for sawing a workpiece, the sawing tool and the figure. Also inventive features and advantages of the inventive device for sawing a workpiece for the inventive method for machining a sawing tool, the sawing tool, the method for sawing a workpiece should be applicable and apply as disclosed and vice versa.
    Drawing and Example Further advantages and advantageous embodiments of the objects according to the invention are illustrated by the drawing and explained in the following description. It should be noted that the drawing has only descriptive character and is not intended to limit the invention in any way. It shows
    Fig. 1 is a schematic representation of a method for processing a sawing tool.
    In Fig. 1, the operation of a method according to the invention for processing a sawing tool 10 is shown schematically. The inventive method can be used in particular to perform a wire sawing in a silicon workpiece, so as to produce, for example, a silicon wafer. In this case, during the sawing process, a displacement of the sawing tool 10 along the workpiece can take place such that a cutting removal of the workpiece is effected. In this case, in particular, a wire saw with a loose grain or a wire saw with bonded grain can be performed, with respect to the wire sawing further WEDM (Wire Electrical Discharge Machining) - or a WECDM (Wire Eletrochemical Discharge Machining) process is possible.
    In FIG. 1, it is shown that a sawing tool 10, in particular a sawing wire, is provided. The sawing tool 10 may in particular be selected from a copper, brass, graphite, tungsten, molybdenum or steel wire. The provision can be realized in particular by the unwinding of the sawing tool 10 from an unwinding roll. Subsequently, recesses 12 are inserted into the sawing tool 10, wherein recesses 12 can be produced which have a size which is in a range of greater than or equal to 1 pm to less than or equal to 20 pm. The latter method step is carried out in particular by a stress-based removal of material from the surface of the sawing tool 10 and thereby preferably, as shown in Fig. 1, by passing the sawing tool 10 on an electrode 14, in particular by passing the sawing tool 10 through an opening 16 of By providing a voltage source 18, the sawing tool 10 can be switched as a cathode and the electrode 14 can be connected as an anode, wherein a reverse circuit may be possible. For example, a voltage can be applied that is in a range of greater than or equal to 100 V to less than or equal to 400 V.
    权利要求:
    Claims (10)
    [1]
    When passing through the electrode 14, the sawing tool 10 is processed eroding on the surface. The pulses, which can be generated by a pulsed application of the voltage, which strike the surface of the sawing tool 10, melt the material of the surface punctually. When the pulse is torn off, the liquefied material is torn from the surface. This creates a surface that is roughened with many small recesses 12 or craters. The design of the recesses 12 is particularly dependent on the parameters voltage, current, pulse duration, electrode distance to the tool and can be controlled very precisely by setting these parameters. The module for carrying out this method step, in particular comprising the electrode 14 and the voltage source 18, can be incorporated directly before the actual sawing or cutting process on the processing machine or in a separate pre-process. claims
    1. A method for processing a sawing tool (10), comprising the method steps: a) providing a sawing tool (10), in particular a sawing wire; b) inserting recesses (12) in the sawing tool (10).
    [2]
    2. The method of claim 1, wherein method step b) is carried out by a stress-based material removal from the surface of the sawing tool (10).
    [3]
    3. The method of claim 2, wherein the stress-based material removal is carried out by passing the sawing tool (10) on an electrode (14).
    [4]
    4. The method of claim 3, wherein between the sawing tool (10) and the electrode (14), a voltage is applied, which is in a range of greater than or equal to 100 V to less than or equal to 400 V.
    [5]
    5. The method according to any one of claims 1 to 4, wherein the recesses (12) have a size which is in a range of greater than or equal to 1 pm to less than or equal to 20 pm.
    [6]
    6. The method according to any one of claims 1 to 5, wherein the sawing tool (10) is selected from a copper, brass, graphite, tungsten, molybdenum or steel wire.
    [7]
    7. Processed sawing tool, in particular sawing wire, processed according to a method according to one of claims 1 to 6, wherein the machined sawing tool (10) has recesses (12).
    [8]
    8. A method for sawing a workpiece, in particular a silicon workpiece, comprising the method steps: a) machining a sawing tool (10) according to a method according to one of claims 1 to 6; b) displacing the sawing tool (10) along the workpiece such that a machining removal of the workpiece is effected.
    [9]
    9. The method of claim 8, wherein between the sawing tool (10) and the workpiece, a liquid is disposed.
    [10]
    10. A device for sawing a workpiece, in particular a silicon workpiece, comprising a sawing tool (10) with recesses (12), the device comprising as means for performing the method according to one of claims 1 to 6 or 8 or 9: - electrode ( 14) and voltage source (18) for stress-based material removal from a surface of the sawing tool (10), and - guide means for following the sawing tool (10) on the workpiece to saw the workpiece.
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    同族专利:
    公开号 | 公开日
    CH707914A2|2014-10-15|
    DE102013206195A1|2014-10-09|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE102010040535A1|2010-09-10|2012-03-15|Robert Bosch Gmbh|Method for sawing a workpiece|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102013206195.1A|DE102013206195A1|2013-04-09|2013-04-09|A method of producing a sawing tool and method of sawing a workpiece using the sawing tool|
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