• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Patent of Invention: "MATRIX SUBSTRATE AND MANUFACTURING METHOD OF THE SAME, FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE". The present invention relates to a matrix substrate and a method of manufacturing the same, a display panel Flexible and a display device. The matrix substrate includes a flexible substrate (1) divided into a display region (11) and a peripheral region (12), wherein the peripheral region (12) surrounds the display region (11). The matrix substrate further includes: a matrix layer and a first film layer (4) formed sequentially in the display region (11) on the flexible substrate (1); a plurality of integrated circuits (2) and a flexible printed circuit board interface (5) formed in the peripheral region (12) on the flexible substrate (1); a flexible protective film layer (6) formed at a junction of the peripheral region (12) and the first film layer (4) and at a region of the peripheral region (12) different from the integrated circuits (2) and the board interface of flexible printed circuit board (5) on the flexible substrate.
    公开号:BR112015032768B1
    申请号:R112015032768-0
    申请日:2015-02-09
    公开日:2021-05-25
    发明作者:Tao Gao；Weifeng ZHOU
    申请人:Boe Technology Group Co., Ltd；
    IPC主号:
    专利说明:

    FIELD OF TECHNIQUE
    [001] Modalities of the present invention refer to a matrix substrate and a method of fabrication thereof, a flexible display panel and a display device. BACKGROUND
    [002] Flexible display is an important development direction of display technology, and this technology, with flexible, non-friable, ultra-thin and ultra-light, low-power and portable features, has broad application prospects and good growth expectations in fields such as electronic book, mobile communications, laptop, TV and public information.
    [003] In preparing a flexible matrix substrate required by a flexible display device, a flexible substrate is typically fixed to a rigid carrier substrate and a display device is prepared on the flexible substrate, and finally the flexible substrate is separated from the substrate carrier by a mechanical method or a laser irradiation method. The flexible substrate can be divided into a display region and a peripheral region surrounding the display region, and the peripheral region of the flexible substrate is provided with integrated circuits (IC), a flexible printed circuit board (FPC) interface, and a circuit connecting the integrated circuits and a flexible circuit board. Figure 1 is a schematic diagram of a flexible substrate without deformation in an ideal case, where integrated circuits 2 and anisotropic conductive adhesive 3 for connecting integrated circuits 2 and flexible substrate 1 are formed on flexible substrate 1. Figure 2 is a schematic diagram of flexible substrate having stress deformation after peeling from carrier substrate, where connection points of integrated circuits 2 and flexible substrate 1 have cracked and part of anisotropic conductive adhesive 3 has failed. Reasons for failure as illustrated in Figure 2 include: the number of film layers in the peripheral region is much less than that in the display region, and integrated circuits or a variety of circuitry made of rigid materials affect the stress distribution. Therefore, when the flexible substrate is peeled off from the carrier substrate, the flexible substrate instantly releases stress, which is not uniform and thus is prone to cause line breakage in the peripheral region and reduce a product yield. SUMMARY OF THE INVENTION
    [004] According to an embodiment of the invention, a substrate matrix is provided. The matrix substrate comprises a flexible substrate divided into a display region and a peripheral region, wherein the peripheral region surrounds the display region. The matrix substrate further comprises: a matrix layer and a first film layer formed sequentially in the display region on the flexible substrate; a plurality of integrated circuits and a flexible printed circuit board interface formed in the peripheral region on the flexible substrate; a flexible protective film layer formed at a junction of the peripheral region and the first film layer and at a region of the peripheral region different from the integrated circuits and the flexible printed circuit board interface on the flexible substrate.
    [005] For example, the flexible protective film layer material is epoxy resin adhesive, silicone adhesive or UV curable adhesive.
    [006] For example, a viscosity range of the flexible protective film layer is 40 to 50 Pa^s; a shear strength of the flexible protective film layer after curing is 25 to 35 MPa; and a peel strength of the flexible protective film layer after curing is 9 to 12KN/m.
    [007] For example, a flexible protective film layer thickness is 5 to 15 micrometers.
    [008] For example, the first film layer is a barrier film layer, and the barrier film layer is one of a polyethylene naphthalate film doped with SiNx or SiO, a polyethylene terephthalate film or a polyimide film or a composite film layer of combination thereof.
    [009] For example, the matrix substrate further comprises: an organic electroluminescence film layer disposed between the matrix layer and the barrier film layer.
    [0010] For example, the first film layer is an electronic ink display film layer.
    [0011] According to an embodiment of the invention, a flexible display panel is provided. The flexible display panel comprises the matrix substrate described above.
    [0012] According to an embodiment of the invention, a display device is provided. The display device comprises the display panel described above.
    [0013] According to an embodiment of the invention, a method of manufacturing a matrix substrate is provided. The fabrication method comprises: providing a flexible substrate wherein the flexible substrate is divided into a display region and a peripheral region, wherein the peripheral region surrounds the display region; forming a matrix layer and a first film layer sequentially in the display region on the flexible substrate; forming a plurality of integrated circuits and a flexible printed circuit board interface in the peripheral region on the flexible substrate; forming a flexible protective film layer at a junction of the peripheral region and a first film layer and at a region of the peripheral region different from the integrated circuits and the flexible printed circuit board interface on the flexible substrate.
    [0014] For example, forming the flexible protective film layer at the junction of the peripheral region and the first film layer and in the peripheral region region different from the integrated circuits and the flexible printed circuit board interface on the flexible substrate, includes: apply material epoxy resin adhesive or silicone adhesive material at the junction of the peripheral region and the first film layer and in the region of the peripheral region different from the integrated circuits and the flexible printed circuit board interface on the flexible substrate, and form the protective film layer flexible through room temperature cure; or, apply UV curable adhesive material at the junction of the peripheral region and the first film layer and in a region of the peripheral region other than the integrated circuits and the flexible printed circuit board interface on the flexible substrate, and form the film layer flexible protector through UV curing.
    [0015] For example, a viscosity range of the flexible protective film layer is 40 to 50 Pa^s; a shear strength of the flexible protective film layer after curing is 25 to 35 MPa; and a peel strength of the flexible protective film layer after curing is 9 to 12KN/m.
    [0016] For example, a flexible protective film layer thickness is 5 to 15 micrometers.
    [0017] For example, the first film layer is a barrier film layer, and the barrier film layer is one of a polyethylene naphthalate film doped with SiNx or SiO, a polyethylene terephthalate film or a polyimide film or a composite film layer of combination thereof.
    [0018] For example, the fabrication method further comprises: forming an organic electroluminescence film layer between the matrix layer and the barrier film layer.
    [0019] For example, the first film layer is an electronic ink display film layer. BRIEF DESCRIPTION OF THE DRAWINGS
    [0020] In order to clearly illustrate the technical solution of the embodiments of the invention, the drawings of the embodiments will be briefly described below; it is obvious that the drawings described are only related to some embodiments of the invention and thus do not limit the invention.
    [0021] Figure 1 is a schematic diagram of a flexible substrate without deformation in an ideal case;
    [0022] Figure 2 is a schematic diagram of the flexible substrate that has stress deformation after detached from the carrier substrate;
    [0023] Figure 3 is a top view of a matrix substrate provided by an embodiment of the present invention;
    [0024] Figure 4 is a schematic diagram of a flexible substrate comprising a display region and a peripheral region;
    [0025] Figure 5 is a flowchart illustrating a method of manufacturing a matrix substrate provided by an embodiment of the present invention;
    [0026] Figure 6 is a schematic diagram of a junction of the peripheral region and a first film layer provided by an embodiment of the present invention. DESCRIPTION OF MODALITIES
    [0027] In order to realize the objectives, technical details and advantages of the embodiments of the apparent invention, the technical solutions of the embodiment will be described in a clear and fully understandable way in connection with the drawings related to the embodiments of the invention. It is obvious that the described embodiments are only a part and not all of the embodiments of the invention. Based on the modalities described in this document, those skilled in the art can obtain other modality(s), without any inventive work, which should be within the scope of the invention. MODE 1
    [0028] Referring to Figure 3 and Figure 4, the embodiment of the invention provides a matrix substrate, comprising a flexible substrate 1 divided into a display region 11 and a peripheral region 12, wherein the peripheral region 12 surrounds the region display 11. The matrix substrate further comprises: a matrix layer (not shown) and a first film layer 4 formed sequentially in the display region 11 on flexible substrate 1; a plurality of integrated circuits 2 and a flexible printed circuit board interface 5 formed in peripheral region 12 on flexible substrate 1; a flexible protective film layer 6 formed at a junction of the peripheral region 12 to the first film layer 4 and at a region of the peripheral region 12 different from the integrated circuits 2 and the flexible printed circuit board interface 5 on the flexible substrate 1 For example, the first film layer 4 is located across display region 11.
    [0029] As illustrated in Figure 6, it should be noted that the seam refers to a boundary line 42 between an orthogonal projection 41 of the first film layer 4 on the flexible substrate 1 and the peripheral region 12. film 4 and the matrix layer below it are very thin, it can be considered that the first film layer 4 and the peripheral region 12 are in the same plane, and the boundary line 42 can be considered as a boundary line of a edge of the first film layer 4 in contact with the peripheral region 12. Furthermore, the boundary line 42 can also be considered as a sum of the boundary line of the edge of the first film layer 4 in contact with the peripheral region 12 thus as side surfaces above the edge of the first film layer 4. Therefore, the flexible protective film layer 6 covers the boundary line 42, which can realize a closed connection between the first film layer 4 and the peripheral region 12 and closing an edge gap between the first film layer 4 and its lower portions underneath it to prevent oxidation and internal corrosion.
    [0030] In the flexible substrate 1 of the display region 11, depending on different types of display panels to which the matrix substrate is applied, there may be different elements or film layers which typically both include the matrix layer described above. As the display region 11 has a multilayer structure, the display region 11 has greater resistance compared to the peripheral region 12. With the exception of rigid integrated circuits 2, flexible printed circuit board interface 5, and metallic wires, there is typically no other film layer provided in the peripheral region 12, and thus there is a large difference in strength between the flexible substrate 1 of the peripheral region 12 and the flexible substrate 1 of the display region 11. In the present embodiment, through forming the flexible protective film layer 6 at the junction of the peripheral region 12 and the first film layer 4 and at a region of the peripheral region 12 different from the integrated circuits and the flexible printed circuit board interface on the flexible substrate 1, the layer of flexible protective film 6 (mainly in the peripheral region 12) and the flexible substrate 1 combined therewith form a composite layered structure, which enhances the strength of flexible substrate 1 of peripheral region 12.
    [0031] For example, the material of the flexible protective film layer6 is epoxy resin adhesive, silicone adhesive or UV curable adhesive.
    [0032] In order to ensure that the flexible substrate 1 provided with the flexible protective film layer 6 has sufficient strength and uniform strength when separated from the carrier substrate, for example, the flexible protective film layer 6 is required as follows: a strip viscosity of flexible protective film layer 6 is 40 to 50 Pa^s; a shear strength of the flexible protective film layer 6 after curing is 25 to 35 MPa; and a peel strength of the flexible protective film layer 6 after curing is 9 to 12 KN/m.
    [0033] For example, a thickness of the flexible protective film layer 6 is 5 to 15 micrometers.
    [0034] For example, the first film layer 4 is a barrier film layer, and the barrier film layer is one of a Polyethylene Naphthalate (PEN) film doped with SiNx or SiO, a Polyethylene Terephthalate film (PET) or a Polyimide (PI) film or a composite film layer of combination thereof.
    [0035] If the matrix substrate is used in OLED display panel, the matrix substrate further comprises a layer of organic light-emitting OLED film (not shown) disposed between the matrix layer (not shown) and the first film layer 4 .
    [0036] If the matrix substrate is used in an electrophoresis display panel, the first film layer 4 is an electronic ink display film layer.
    [0037] Advantageous effects of the embodiment of the present invention are as follows: the flexible protective film layer is formed at the junction of the peripheral region and the first film layer and in a region of the peripheral region different from the integrated circuits and the card interface flexible printed circuit on the flexible substrate, which improves the strength of the flexible substrate in the peripheral region; and the flexible substrate has uniform strength when separated from the substrate, which prevents line breakage in the peripheral region, thereby improving product yield. MODE 2
    [0038] The embodiment of the present invention provides a flexible display panel, comprising the matrix substrate provided by the above embodiment.
    [0039] Advantageous effects of the embodiment of the present invention are as follows: the flexible protective film layer is formed at the junction of the peripheral region and the first film layer and in a region of the peripheral region different from the integrated circuits and the card interface flexible printed circuit on the flexible substrate, which improves the strength of the flexible substrate in the peripheral region; and the flexible substrate has uniform strength when separated from the substrate, which prevents line breakage in the peripheral region, thereby improving product yield. MODE 3
    [0040] The embodiment of the present invention provides a display device, which comprises the flexible display panel provided by the above embodiment.
    [0041] Advantageous effects of the embodiment of the present invention are as follows: the flexible protective film layer is formed at the junction of the peripheral region and the first film layer and in a region of the peripheral region different from the integrated circuits and the card interface flexible printed circuit on the flexible substrate, which improves the strength of the flexible substrate in the peripheral region; and the flexible substrate has uniform strength when separated from the substrate, which prevents line breakage in the peripheral region, thereby improving product yield. MODE 4
    [0042] Referring to Figure 5, the embodiment of the present invention provides a method of manufacturing a matrix substrate, comprising:
    [0043] 501: providing a flexible substrate, wherein the flexible substrate is divided into a display region and a peripheral region, wherein the peripheral region surrounds the display region.
    [0044] 502: forming a matrix layer and a first layer of film sequentially in the display region on the flexible substrate.
    [0045] 503: forming a plurality of integrated circuits and a flexible printed circuit board interface on the flexible substrate of the peripheral region.
    [0046] 504: forming a flexible protective film layer at a junction of the peripheral region and a packaging barrier film and at a region of the peripheral region different from the integrated circuits and the flexible printed circuit board interface on the flexible substrate.
    [0047] In the present embodiment, step 504 includes: applying 5 to 15 micrometers of epoxy resin adhesive material or silicone adhesive material at the junction of the peripheral region and the packaging barrier film and in a region of the peripheral region different from the circuits integrated and flexible printed circuit board interface on the flexible substrate, and form the flexible protective film layer by curing for 60 minutes at room temperature; or, apply 5 to 15 micrometers of UV curable adhesive material at the junction of the peripheral region and the packaging barrier film and in a region of the peripheral region other than the integrated circuits and the flexible printed circuit board interface on the flexible substrate , and form the flexible protective film layer through ultraviolet (UV) curing.
    [0048] Obviously, for the matrix substrate to be applied to different display panels, different elements or film layers need to be prepared. For example, for an OLED display panel, during the formation of the matrix layer and the first film layer sequentially on the flexible substrate of the display region, the fabrication method of the same further comprises: forming an OLED film layer between the matrix layer and the first film layer, wherein the OLED film layer can be formed through evaporation of OLED material and the first film layer is a barrier film layer to prevent the permeation of water and water. oxygen. For example, the barrier film layer is one of a polyethylene naphthalate (PEN) film doped with SiNx or SiO, a polyethylene terephthalate (PET) film and a polyimide (PI) film or a layer of composite film of combination thereof, which will not be repeated here.
    [0049] For another example, for an electrophoresis display panel, the first film layer is an electronic ink display film layer. The electronic ink display film layer can be prepared by a fixing method.
    [0050] Obviously, in the present embodiment, after step 504, a step of peeling the flexible substrate from the carrier substrate is additionally included. The back of the flexible substrate can be laser irradiated to make the flexible substrate separate from the rigid carrier substrate.
    [0051] Advantageous effects of the embodiment of the present invention are as follows: the flexible protective film layer is formed at the junction of the peripheral region and the first film layer and in a region of the peripheral region different from the integrated circuits and the card interface flexible printed circuit on the flexible substrate, which improves the strength of the flexible substrate in the peripheral region; and the flexible substrate has uniform strength when separated from the carrier substrate, which prevents line breakage in the peripheral region, thereby improving product yield.
    [0052] The above embodiments are merely exemplary embodiments of the invention, and are not intended to define the scope of the invention, and the scope of the invention is determined by the appended claims.
    [0053] This application claims the priority of Patent Application No. CH 201410567471.0, filed on October 22, 2014, the disclosure of which is incorporated herein by reference in its entirety as part of this application.
    权利要求:
    Claims (11)
    [0001]
    1. Matrix substrate comprising a flexible substrate (1) divided into a display region (11) and a peripheral region (12), the peripheral region surrounding the display region; wherein the matrix substrate further comprises: a matrix layer and a first film layer (4) formed sequentially in the display region (11) on the flexible substrate (1); a plurality of integrated circuits (2) and a card interface flexible printed circuit (5) formed in the peripheral region (12) on the flexible substrate (1); and a flexible protective film layer (6) formed at a junction of the peripheral region (12) and the first film layer (4) and at a region of the peripheral region (12) different from that of the integrated circuits (2) and the interface of flexible printed circuit board (5) on the flexible substrate (1), wherein the flexible protective film layer has an epoxy resin adhesive material, silicone adhesive or UV curable adhesive, characterized by a viscosity range of the film layer flexible shield is 40 to 50 Pa^s; a shear strength of the flexible protective film layer after curing is 25 to 35 MPa; and a peel strength of the flexible protective film layer after curing is 9 to 12 KN/m.
    [0002]
    2. Matrix substrate, according to claim 1, characterized in that a thickness of the flexible protective film layer (6) is 5 to 15 micrometers.
    [0003]
    3. Matrix substrate, according to claim 1, characterized in that the first film layer (4) is a barrier film layer, and the barrier film layer is one of a film of polyethylene naphthalate doped with SiNx or SiO, a polyethylene terephthalate film or a polyimide film, or a composite film layer of combinations thereof.
    [0004]
    4. Matrix substrate, according to claim 3, characterized in that it additionally comprises: an organic electroluminescence film layer disposed between the matrix layer and the barrier film layer.
    [0005]
    5. Matrix substrate according to claim 1, characterized in that the first film layer (4) is an electronic ink display film layer.
    [0006]
    6. Flexible display panel, characterized in that it comprises the matrix substrate as defined in any one of claims 1 to 5.
    [0007]
    7. Display device, characterized in that it comprises the flexible display panel as defined in claim 6.
    [0008]
    8. Method of manufacturing a matrix substrate comprising the steps of: providing a flexible substrate (1), wherein the flexible substrate (1) is divided into a display region (11) and a peripheral region (12), in that the peripheral region (12) surrounds the display region (11); form a matrix layer and a first film layer (4) sequentially in the display region (11) on the flexible substrate (1); form a plurality of integrated circuits (2) and a flexible printed circuit board interface (5) in the peripheral region (12) on the flexible substrate (1); forming a flexible protective film layer (6) at a junction of the peripheral region (12) and the first film layer (4) and in a region of the peripheral region (12) different from that of the integrated circuits (2) and the flexible printed circuit board interface (5) on the flexible substrate. (a) apply epoxy resin adhesive material or silicone adhesive material at the junction of the peripheral region (12) and the first film layer and (4) and in the region of the peripheral region (12) different from those of the integrated circuits (2) and the flexible printed circuit board interface (5) on the flexible substrate (1), and form the flexible protective film layer (6 ) by curing at room temperature; or, (b) apply UV curable adhesive material at the junction of the peripheral region (12) and the first film layer (4) and in a region of the peripheral region (12) different from those of the integrated circuits (2) and the interface of flexible printed circuit board (5) on flexible substrate (1), and form the flexible protective film layer (6) by UV curing. characterized by a viscosity range of flexible protective film layer is 40 to 50 Pa ^s; a shear strength of the flexible protective film layer after curing is 25 to 35 MPa; and a peel strength of the flexible protective film layer after curing is 9 to 12 KN/m.
    [0009]
    9. Manufacturing method according to claim 8, characterized in that a thickness of the flexible protective film layer is 5 to 15 micrometers.
    [0010]
    10. Method of fabrication according to claim 8, characterized in that the first film layer is a barrier film layer, and the barrier film layer is one of a SiNx-doped polyethylene naphthalate film or SiO, a polyethylene terephthalate film or a polyimide film or a composite film layer combining them.
    [0011]
    11. Manufacturing method according to claim 8, characterized in that the first film layer (4) is an electronic ink display film layer.
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    法律状态:
    2020-04-28| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-03-16| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-05-25| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 09/02/2015, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    CN201410567471.0|2014-10-22|
    CN201410567471.0A|CN104393014B|2014-10-22|2014-10-22|A kind of array base palte and preparation method thereof, flexible display panels and display device|
    PCT/CN2015/072541|WO2016061949A1|2014-10-22|2015-02-09|Array substrate and preparation method thereof, flexible display panel and display device|
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