LIGHT EMITTING DEVICE AND METHOD TO MANUFACTURE THE SAME

专利摘要:
light-emitting device and method of manufacturing the same. the present invention relates to a light emitting device (10, 15, 17) that includes a light emitting element (20, 207) having a first face (21), a second face (22) opposite the first face , a plurality of side faces (23) extending between the first face (21) and the second face (22), a plurality of corners (241, 242, 243, 244) where the second face (22) meets two from among the plurality of side faces (23), and a pair of electrodes (251, 252) on a second face side (22) of the light emitting element (20, 207); a light transmitting member (30) covering a portion of at least one of the side faces (23) and a portion of an edge wherein said at least one side face (23) meets the second face (22) so that at least one of the plurality of corners (241, 242, 243, 244) is exposed from the light transmitting member (30); and a covering member (40) covering the at least one exposed corner (241, 242, 243, 244) of the light emitting element (20, 207) and the exterior of the light transmitting member (30) so that the electrode pair (251, 252) is exposed from the cover member (40).
公开号:BR102016007337B1
申请号:R102016007337-5
申请日:2016-04-01
公开日:2022-01-18
发明作者:Ikuko Baike；Ryo Suzuki
申请人:Nichia Corporation；
IPC主号:

专利说明:

BACKGROUND
[001] The present invention relates to light-emitting devices and method for manufacturing light-emitting devices.
[002] Light-emitting devices that have a reflector covering the side faces of a light-emitting element, rather than a housing for the light-emitting element, have been known (e.g. see Patent Application Publication no. Examined in JP 2012-227470, Unexamined Patent Application Publication No. JP 2013-012545, International Patent Application Publication No. 2013/005646, and Unexamined Patent Application Publication No. JP 2010-219324).
[003] To increase the light extraction efficiency of these light-emitting devices, a light-transmitting member is disposed between the light-emitting element and the reflector, and the light exiting the side faces of the light-emitting element is extracted from the light-emitting element. emitting face through the light transmitting member. SUMMARY
[004] Such a light transmitting member arranged between the light emitting element and the reflector can detach (disconnect) from the light emitting element. Since such separation may change the optical characteristics at the interface between the light-emitting element and the light-transmitting member, the amount of light extracted through the light-transmitting member as well as the light-distributing properties may vary. In other words, potential variations in the light-extraction efficiency of the light-emitting device and the light-distributing properties by the separation of the light-transmitting member can make it difficult to maintain consistency in the quality of the light-emitting device to ensure a sufficient level. of reliability. Accordingly, an object of certain embodiments of the present invention is to provide a highly reliable light-emitting device by reducing the separation between the light-transmitting member and the light-emitting element.
[005] The light emitting device according to certain embodiments of the invention includes: a light emitting element having a first face, a second face opposite said first face, several lateral faces between said first face and said second face , a plurality of corners where said second face meets two of said plurality of side faces, and a pair of electrodes on said second face side; a light transmitting member covering a portion of at least one of said side faces and an edge portion wherein said at least one side face meets said second face for the purpose of exposing at least one of said corners; and a covering member covering the exposed corner of said light-emitting element and the outside of said light-transmitting member for the purpose of exposing the pair of electrodes, wherein a coefficient of thermal expansion of the covering member is less than a coefficient of thermal expansion of the light transmitting member.
[006] In accordance with certain embodiments of the present invention, the separation of the light-transmitting member from the light-emitting element can be reduced, and the reliability of the light-emitting device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[007] Figure 1 is a schematic plan view of the light emitting device according to Modality 1.
[008] Figure 2A is a schematic sectional view along the line A-A indicated in Figure 1, and Figure 2B is a schematic sectional view along the line B-B indicated in Figure 1.
[009] Figure 3 is a schematic perspective view of the light emitting device according to Embodiment 1 showing the light transmitting member in an exposed state omitting the covering member.
[0010] Figure 4 is a schematic bottom view of the light emitting device according to Embodiment 1.
[0011] Figures 5A to 5C are schematic sectional views that explain a first embodiment of method for manufacturing the light emitting device according to Embodiment 1.
[0012] Figures 6A and 6B are schematic plan views that explain a second embodiment of the method for manufacturing the light-emitting device according to Embodiment 1.
[0013] Figures 7A and 7B are schematic plan views that explain the second embodiment for manufacturing the light emitting device according to Embodiment 1.
[0014] Figure 8 is a schematic plan view explaining the second embodiment of the method for manufacturing the light emitting device according to Embodiment 1.
[0015] Figure 9A is a schematic sectional view along the line CC indicated in Figure 6A, and Figure 9B is a schematic sectional view along the line DD indicated in Figure 6B, and Figure 9C is a view in schematic section along line EE indicated in Figure 7A.
[0016] Figure 10A is a schematic sectional view along the line F-F indicated in Figure 7B, and Figure 10B is a schematic sectional view along the line G-G indicated in Figure 8.
[0017] Figures 11A and 11B are schematic plan views that explain a third embodiment of the method for manufacturing the light-emitting device according to Embodiment 1.
[0018] Figure 12A is a schematic sectional view along the line H-H indicated in Figure 11A, and Figure 12B is a schematic sectional view along the line I-I indicated in Figure 11B.
[0019] Figures 13A to 13C are schematic sectional views that explain the third embodiment of the method for manufacturing the light-emitting device according to Embodiment 1.
[0020] Figures 14A to 14C are schematic sectional views explaining a variation of the third embodiment of the method for manufacturing the light-emitting device according to Embodiment 1.
[0021] Figure 15A is a schematic plan view of the light emitting device according to Embodiment 2, Figure 15B is a schematic sectional view along line JJ indicated in Figure 15A and Figure 15C is a sectional view diagram along the line KK indicated in Figure 15A.
[0022] Figures 16A to 16E are schematic sectional views that explain a method for manufacturing the light emitting device according to Embodiment 2.
[0023] Figures 17A to 17E are schematic sectional views that explain the method for manufacturing the light-emitting device according to Embodiment 2.
[0024] Figure 18 is a schematic perspective view of the light emitting device according to Embodiment 3.
[0025] Figure 19 is a schematic plan view of the light emitting device according to Embodiment 3 showing the light transmitting member in an exposed state omitting the covering member.
[0026] Figure 20 is a schematic perspective view of the light emitting device according to Embodiment 3 showing the light transmitting member in an exposed state omitting the covering member.
[0027] Figure 21A is a schematic plan view of the light emitting device, and Figure 21B is a schematic sectional view along the L-L line indicated in Figure 21A. DESCRIPTION
[0028] Embodiments of the present invention will be explained in detail below based on the drawings. In the explanations below, terms that indicate certain directions and positions will be used as needed (eg, "top", "bottom", "direct", "left", and other terms that include the same). These terms are used for the purpose of making the invention easily understood based on the drawings being referenced, and the technical scope of the invention should not be limited by the meanings of these terms. Portions denoted by the same reference numerals appearing in multiple drawings represent the same portions or components. MODE 1
[0029] The light emitting device 10 according to that embodiment shown in Figures 1, 2A and 2B includes a light emitting element 20, a light transmitting member 30 disposed on the side faces 23 of the light emitting element 20 and a covering member 40 which covers the exterior 33 of the light transmitting member 30. The light emitting device 10 may include a wavelength converting member 50 on the first face (upper face) side 11 which functions as the emitting surface of light.
[0030] Figure 2A is a schematic sectional view along line AA which is a line perpendicular to a pair of opposing side faces 23 of the light emitting element 20 shown in Figure 1. Figure 2B is a schematic sectional view along the line BB which is a line consistent with the diagonal line of the rectangular light-emitting element 20 in a top view shown in Figure 1. As shown in Figures 2A and B, the light-emitting element 20 may include a light-emitting substrate. light 27 and a semiconductor stack 28 formed on a lower face side of the light transmitting substrate 27. The light emitting element 20 has a first face (upper face) 21 on the light transmitting substrate side 27, a second face (bottom face) 22 on the side of semiconductor stack 28 opposite the first face 21, and several side faces 23 between the first face 21 and the second face 22. The light emitted in the light emitting element 20 travels from the stack semiconductor 28 through the light transmitting substrate 27, or from the semiconductor stack 28 through the side faces 23 and the light transmitting member 30 of the light emitting element 20, to be extracted from the first face 11 of the light emitting device 10.
[0031] On the second face 22 of the light-emitting element 20 (i.e., on the side of the semiconductor stack 28 in Figures 2A and B), a pair of electrodes 251 and 252 are provided to supply electrical current to the light-emitting element 20 In this specification, the "second face 22" of the light-emitting element 20 refers to the face of the light-emitting element 20 which excludes the electrodes 251 and 252. In this embodiment, the second face 22 coincides with the lower face of the stack of semiconductor 28.
[0032] The two electrodes 251 and 252 comprising the electrode pair can each be shaped as desired. In the light-emitting device 10 shown in Figure 4, for example, the electrodes 251 and 252 may each be oblong that extend in one direction (y-direction) when viewed from the second face side 12 of the light-emitting device. light 10 (that is, viewed in the z direction). Electrodes 251 and 252 may not be the same shape. Furthermore, electrodes 251 and 252 can be arranged as desired, as long as they are separated. In Figure 4, the two electrodes 251 and 252 are arranged along the y direction in parallel.
[0033] Referring again to Figure 2A, the light transmitting member 30 covers the side faces 23 of the light emitting element 20, and directs the light exiting the side faces 23 towards the first face 11 of the light emitting device 10. Light striking the side faces 23 of the light emitting element 20 may be extracted through the light transmitting member 30 before light is attenuated within the light emitting element 20 by reflection from the side faces 23. Providing the light transmitting member 23. light 30 can increase the light extraction efficiency of the light emitting device 10 by reducing a loss of light.
[0034] When the side faces 23 of the light emitting element 20 are slanted with respect to the second face 22, providing the light transmitting member 30 can be particularly effective. For example, in cases where the light emitting elements 20 are separated using cleavage in the manufacturing method, the side faces 23 of the light emitting elements 20 may not always be perpendicular to the second face 22. transversely along line AA in Figure 1, such a light-emitting element 20 is a parallelogram. In other words, the light emitting element 20 has the first face 21 and the second face 22 which are in parallel, and two opposite side faces 23 which are in parallel, where each side face 23 is slanted with respect to the first. and the second faces 21 and 22. Since one of the side faces 23 forms an obtuse angle with the second face 22, the light reflected by that side face 23 can travel towards the first face 21 to be extracted from the light emitting device. 10 as it is. However, since the other side face 23 forms an acute angle with the second face 22, light towards the second face 22 tends to be reflected by the second face 22 and attenuated within the light emitting element 20.
[0035] By covering the front side face 23 with the light transmitting member 30, light reaching that side face 23 can be effectively extracted from the light emitting device 10 via the light transmitting member 30.
[0036] Figure 3 shows the light emitting device 10 in a state where the covering member 40 is omitted so that the covering of the light emitting element 20 by the light transmitting member 30 can be easily understood. Furthermore, for the corners where the second face 22 of the light emitting element 20 meets two side faces 23 (called "second face side corners 22") to be more visually recognizable, the light emitting element 20 is shown with the second face side 22 up.
[0037] The light transmitting member 30 does not cover the side surfaces 23 completely, but covers the side surfaces 23 partially. For that reason, more specifically, in the vicinity of the side corners 241, 242, 243 and 244 of the second face 22 of the light emitting element 20, the side faces 23 are not covered by the light transmitting member 30 and are therefore exposed . The edges of the light-emitting element 20 that extend from corners 241, 242, 243, and 244 in the z-direction (called "third edges 231, 232, 233, and 234") are also exposed because they are not covered by the transmitting member. 30 in the vicinity of these corners (see Figures 3 and 2B). Now, since the portions of the side faces 23 not covered by the light transmitting member 30 (the exposed portions of the side faces 23) are covered by the covering member 40 described later, the same are not exposed on the outside of the light emitting device 10.
[0038] As shown in Figures 2A and B, the cover member 40 covers the exterior 33 of the light transmitting member 30 and the exposed portions of the side faces 23 of the light emitting element 20 (Figure 3). Cover member 40 is formed of a material that satisfies prescribed relationships with light transmitting member 30 and light emitting member 20 with respect to the magnitude of the coefficient of thermal expansion. More specifically, the material for the cover member 40 is selected in order to satisfy ΔT40<ΔT30 when comparing the difference in thermal expansion coefficient between the light transmitting member 30 and the light emitting member 20 called the "first difference". of thermal coefficient ΔT30" to the difference of coefficient of thermal expansion between the covering member 40 and the light emitting element 20 called "second difference of thermal coefficient ΔT40". In other words, the material for the covering member 40 is selected so that the coefficient of thermal expansion of the covering member is less than the coefficient of thermal expansion of the light transmitting member. This can reduce the possibility of the light transmitting member 30 becoming separate from the light transmitting member 20. The mechanism for reducing the separation of the light transmitting member 30 is believed to be as follows.
[0039] The cause for the separation of the light transmitting member 30 from the light emitting element 20 is primarily the heat generated when the light emitting element 20 is activated. In cases where the light-emitting element 20 is a semiconductor light-emitting element while the light-transmitting member 30 is a resin, the thermal expansion coefficient of the light-transmitting member 30 (e.g., expansion coefficient linear thermal, Young's modulus, or the like) is at least 10 times that of the light-emitting element 20. For that reason, when the light-emitting element 20 is activated, the tensile stress attributable to the difference in thermal expansion ratio between the light emitting element 20 and the light emitting member 30 is generated at the interface between the light emitting element 20 and the light emitting member 30. The voltage is eliminated when the light emitting element 20 is deactivated. In other words, repeated on/off operations of the light-emitting element 20 generate tensile stress at the interface between the light-emitting element 20 and the light-emitting member 30 each time it is activated, which weakens the adhesion on the surface. interface between the light-emitting member 20 and the light-emitting member 30, eventually allowing the light-emitting member 30 to separate from the light-emitting element 20.
[0040] As described above, the light transmitting member 30 is provided to extract the light that strikes the side faces 23 of the light emitting element 20 before it is reflected by the side faces 23 to be attenuated within the light emitting element. . Therefore, the optical characteristics at the interface between the light-emitting element 20 and the light-transmitting member 30 may change when the light-transmitting member 30 is separated from the light-emitting element 20. In other words, a portion of the light reaching the side faces 23 of light emitting member 20 can be reflected by side faces 23 without exiting to light transmitting member 30. As a result, the amount of light extracted through light transmitting member 30 after separation could decrease compared to that without separation. This can reduce the light-extracting efficiency of the light-emitting device 10, as well as altering the light-distributing properties of the light-emitting device 10. In the light-emitting device according to the embodiment of this invention, a light-transmitting member 30 is used, and the light transmitting member 30 can reduce the possibility of being separated from the light emitting element 20, a highly reliable light emitting device 10 which has the ability to maintain consistency in quality can be provided by being resistant to changes in light extraction efficiency and light distribution properties even after long-term use.
[0041] Upon observation of the situations involving the separations of the light transmitting member 30, it was found that such separations readily originate in the lateral corner 241, 242, 243 or 244 of the second face 22 of the light emitting element 20 shown in the Figures 2B and 3. This is believed to be due to the fact that the tensile stress occurring at the interface between the light emitting element 20 and the light transmitting member 30 is concentrated at the corners. Particularly, the second face side 22 of the light-emitting element 20 on which the semiconductor stack 28 is formed readily generates heat, and therefore, of all corners of the light-emitting element 20, the corners 241, 242, 243 and 244 of second face sides 22 are considered to be more vulnerable to separation. Furthermore, in cases where no separation of the light transmitting member 30 was observed at the corner 241, 242, 243 or 244 of the side of the second face 22 of the light emitting element 20, the light transmitting member 30 was not separated at the faces sides 23 of the light-emitting element 20, as well. In other words, reducing the light transmitting member 30 separation at the second face 22 side corners 241, 242, 243 and 244 of the light emitting member 20 can effectively reduce the light transmitting member 30 separation.
[0042] Consequently, in certain embodiments of the invention, as shown in Figures 1A, 1B and 3, the light extraction efficiency is increased by covering most of the side faces 23 of the light emitting element 20 with the light transmitting member. light 30, while reducing the separation of the light transmitting member 30 covering the side faces 23 by covering the side corners 241, 242, 243 and 244 of the second face 22 of the light emitting element 20 with a component (covering member 40) that is not vulnerable to separation from the light emitting element 20 (instead of the light emitting member 30). As discussed above, the separation can be caused by a large difference in the coefficients of thermal expansion between the light emitting element 20 and the component covering it. Consequently, when comparing the "first thermal coefficient difference ΔT30", which is the difference in thermal expansion coefficient between the light transmitting member 30 and the light emitting element 20, to the "second thermal coefficient difference ΔT40", which is the thermal expansion coefficient difference between the covering member 40 and the light emitting element 20, its relationship is expressed as follows: the second thermal coefficient difference ΔT40< the first thermal coefficient difference ΔT30. In other words, the material for the covering member 40 is selected so that the coefficient of thermal expansion of the covering member is less than the coefficient of thermal expansion of the light transmitting member. With such an arrangement, the probability of separation of the light transmitting member 30 when the second face side corners 241, 242, 243 and 244 of the light emitting element 20 are covered with the covering member 40 may be less than the probability of separation of light transmitting member 30 when second face 22 side corners 241, 242, 243 and 244 of light emitting element 20 are covered with light transmitting member 30. Consequently, this can reduce the probability of separation of the light-transmitting member 30 which covers the side faces 23 of the light-emitting element 20.
[0043] Regarding the thermal expansion coefficients of the components, the thermal expansion coefficient of the light emitting element 20 is, for example, in a range between 7 and 10 ppm/°C. The coefficient of thermal expansion of the light transmitting member 30, if a resin is used as the base material, is in a range between 200 and 300 ppm/°C, for example, under temperature conditions of at least the transition point of glass (Tg). The coefficient of thermal expansion of the cover member 40, if a resin is used as the base material, is in a range between 45 and 100 ppm/°C, for example, under the temperature condition of at least the transition point of glass (Tg).
[0044] To provide a specific example, assuming that the coefficients of thermal expansion of the light emitting element 20, the light transmitting member 30 and the covering member 40 are 7 ppm/°C, 200 ppm/°C, and 45 ppm/°C, respectively, the first thermal coefficient difference ΔT30 = (20^—7) = 193 ppm/°C, and the second thermal coefficient difference ΔT40 = (4^—7) = 38 ppm/°C. This therefore satisfies the relationship: the second thermal coefficient difference ΔT40< the first thermal coefficient difference ΔT30.
[0045] In this specification, the term "the coefficient of thermal expansion of the light-emitting element 20" means the coefficient of thermal expansion of the light-emitting element 20 as a whole. For example, when the light emitting element 20 includes multiple materials, such as the semiconductor stack 28, as shown in Figures 2A and B, the term refers to the coefficient of thermal expansion thereof as a whole.
[0046] As shown in Figure 3, when the side corners 241, 242, 243 and 244 of the second face 22 of the light emitting element 20 are exposed because they are not covered by the light transmitting member 30, the side faces 23 of the element light-emitting member 20 in the vicinity of corners 241, 242, 243, and 244 are also exposed and not covered by light-transmitting member 30. Light striking exposed portions of side faces 23 that are not in contact with the light-transmitting member 30 cannot be extracted from the light-emitting device 10 through the light-transmitting material 30. From the perspective of the light-extraction efficiency of the light-emitting device 10, it is preferable that the areas of the exposed portions of the side faces 23 are small. . On the other hand, the exposed portions of the side faces 23 are covered by the covering member 40, and therefore, from the perspective of preventing separation of the light transmitting member 30, it is preferable that the areas of the exposed portions be large. Consequently, several variations can be considered for the formats and locations of the exposed portions according to the objectives.
[0047] With the use of the light emitting element 20 which is substantially rectangular in shape and which includes the four corners 241, 242, 243 and 244 of the second face side 22 shown in Figure 3 as an example, several variations will be explained. In the example shown in Figure 3, the semiconductor stack 28 includes three semiconductor layers: a first conductive-type semiconductor layer 281, an emission layer 282, and a second conductive-type semiconductor layer 283. Among the three semiconductor layers 281 , 282 and 283 exposed on the side faces of the semiconductor stack 28, the first conductive-type semiconductor layer 281 and the emission layer 282 are completely covered by the light transmitting member 30, while only a portion of the second conductive-type semiconductor layer 283 is exposed and not covered by the light transmitting member 30.
[0048] In Variation Example 1, only one corner, for example corner 244 in Figure 3, can be exposed while covering the remaining three corners 241, 242 and 243 with light transmitting member 30. With this arrangement, the light extraction efficiency can be high due to the fact that the side faces 23 of the light emitting element 20 are largely covered with the light transmitting member 30 up to the corners 241, 242 and 243. Whereas the exposed corner 244 not covered by the light transmitting member 30 is covered by the capping member 40, as shown in Figure 2B, the separation of the light transmitting member 30 from the light transmitting element 20 can be reduced in the vicinity of the corner 244.
[0049] In Variation Example 2, two diagonally positioned corners, for example corners 241 and 243 in Figure 3, may be exposed while covering the remaining two corners 242 and 244 with the light transmitting member 30. light extraction can be good due to the fact that the side faces 23 of the light emitting element 20 are covered with the light transmitting member 30 up to the corners 242 and 244. Since the exposed corners 241 and 243 are not covered by the member light-transmitting member 30 are covered by cover member 40, as shown in Figure 2B, the separation of light-transmitting member 30 from light-emitting element 20 can be reduced in the vicinity of corners 241 and 243. The voltage generated at the interface between the light emitting element 20 and covering member 40 can be moderated at the two diagonally positioned corners 241 and 243, and therefore even at the corners 242 and 244 positioned between them, the voltage moderating effect that occurs at the interface ce between the light-emitting member 20 and the light-emitting member 30 can be expected.
[0050] In Variation Example 3, two adjacent corners, for example corners 243 and 244 in Figure 3, may be exposed while covering the remaining two corners 241 and 242 with the light transmitting member 30. light extraction can be good due to the fact that the side faces 23 of the light emitting element 20 are covered with the light transmitting member 30 up to the corners 241 and 242. Whereas the exposed corners 243 and 244 are not covered by the transmitting member 30 are covered by cover member 40, as shown in Figure 2B, separation of light transmitting member 30 from light emitting element 20 may be suppressed in the vicinity of corners 243 and 244. At that time, edge 223 located between the two corners 243 and 244 may also be exposed by not being covered by the light transmitting member 30 to be covered by the covering member 40, which may further enhance the separation reducing effect.
[0051] In Variation Example 4, three corners, for example corners 241, 242 and 243 in Figure 3, may be exposed while covering the remaining corner 244 with light transmitting member 30. light can be good due to the fact that the side faces 23 of the light emitting element 20 are largely covered with the light transmitting member 30 up to the corner 244. Whereas the exposed corners 241, 242 and 243 are not covered by the light transmitting member 30 light transmitting member 30 are covered by cover member 40, as shown in Figure 2B, the separation of light transmitting member 30 from light emitting element 20 can be effectively reduced in the vicinity of corners 241, 242 and 243.
[0052] In Variation Example 5, all four corners (corners 241, 242, 243, and 244 in Figure 3) may be exposed because they are not covered by light transmitting member 30. Whereas exposed corners 241, 242, 243 and 244 not covered by light transmitting member 30 are covered by capping member 40, as shown in Figure 2B, the effectiveness in reducing the possibility of light transmitting member 30 separating from light transmitting member 20 in the vicinity of corners 241 , 242, 243 and 244 can be improved.
[0053] Using the light emitting element 20 that exposes all four corners 241, 242, 243 and 244 by not covering them with the light transmitting member 30 (i.e. Variation Example 5) as an example, the manner in which the light-emitting element 20 is covered by the light-emitting member 30 will be described in detail with reference to Figure 3. In Figure 3, the four edges of the light-emitting element 20 where the first face 21 meets the side faces 23 are called "first edges 211, 212, 213 and 214", the four sides where the second face 22 meets the side faces 23 are called "second edges 221, 222, 223 and 224", and the four sides on which two adjacent side faces 23 meet are called "third edges 231, 232, 233 and 234".
[0054] The first edges 211, 212, 213 and 214 surrounding the first face 21 of the light emitting element 20 are covered by the light emitting member 30 entirely. The third edges 231, 232, 233 and 234 that extend from the first face 21 to the second face 22 are covered for the most part by the light transmitting member 30, except for the vicinity of the second face 22 (i.e., proximities of the corners 241, 242, 243 and 244 of second face sides 22). The second edges 221, 222, 223 and 224 surrounding the second face 22 of the light-emitting element 20 are covered by the light-transmitting member 30 in portions excluding the corners 241, 242, 243 and 244 of the sides of the second face 22 ( around the center of each side in Figure 3), but the remainder is exposed and not covered by the light transmitting member 30. By covering the light transmitting member 20 with the light transmitting member 30 in this way, the vast majority of side faces 23 of light-emitting element 20 are covered by light-emitting member 30, while side corners 241, 242, 243 and 244 of second face 22 of light-emitting element 20 are exposed.
[0055] As discussed above, Figure 3 shows the case where all side corners 241, 242, 243 and 244 of the second face 22 of the light emitting element 20 are exposed because they are not covered by the light transmitting member 30 ( i.e. Variation Example 5). Consequently, if one or more of the corners were covered by light transmitting member 30 as in Variation Examples 1 to 4, coverage of second edges 221, 222, 223 and 224 as well as third edges 231, 232, 233 and 234 by the light transmitting member 30 can be increased. For example, in the case where the corner 244 is covered by the light transmitting member 30, the corner side ends 244 of the second edges 223 and 224 extending from the corner 244 are covered by the light transmitting member 30, and the third edge 234 extending from the corner 244 is covered by the light transmitting member 30 through its entire length.
[0056] Referring again to Figure 2A, the light transmitting member 30 covering the side faces 23 of the light emitting element 20 can extend beyond the first edges (reference numerals 212 and 214 in Figure 2A) of the light emitting element 20. light 20 to partially or fully cover the first face 21. The first face 21 of the light emitting element 20 may be shielded by the light transmitting member 30. In cases where a wavelength converting member 50 is disposed on the light side first face 21 of the light emitting element 20, further arranging the light transmitting member 30 between the first face 21 of the light emitting element 20 and the wavelength converting member 50 allows the light transmitting member 30 to function as an adhesive to adhere the first face 21 to the wavelength converting member 50.
[0057] In Figure 3, the light transmitting member 30 covering the side faces 23 of the light emitting element 20 is preferably formed for the purpose of reaching the second edges 221, 222, 223 and 224 in portions, but does not exceed the second edges. In other words, as shown in Figure 3, the top edge of the light transmitting member 30 is positioned lower than the second edges 221, 222, 223, and 224 in the vicinity of corners 241, 242, 243, and 244, but otherwise shape matches the second edges. The light transmitting member 30 having such a shape can be formed easily using a liquid resin material as the raw material for the light transmitting member 30, and using the spreading and wetting of the liquid resin on the side faces 23 of the light-emitting element 20 by surface tension. Furthermore, by providing staggered portions where the second face 22 intersects with the side faces 23 of the light emitting element 20, wetting and spreading can be removed from the liquid resin in addition to the staggered portions on the second face 22. Such portions staggered steps can be created, for example, by removing a portion of the semiconductor stack 28 from the light-emitting element 20, more preferably only a portion of the second conductive-type semiconductor layer 283 that is close to the second face 22 of the light-emitting element. light 20.
[0058] The light transmitting member 30 preferably covers the emission layer 282 exposed on the side faces 23 of the light emitting element 20 as much as possible, preferably particularly completely. This allows light emitted from the emission layer 282 to be effectively extracted from the light emitting element 20 via the light transmitting member 30.
[0059] The upper edge of the light-transmitting member 30 is not limited to not exceeding the second edges 221, 222, 223, and 234 of the light-emitting member 20. In other words, the upper edge of the light-transmitting member 30 may exceed the second edge 221, 222, 223 or 234 of the light emitting member 20 to partially cover the second face 22. However, covering the second face 22 as much as possible with the light transmitting member 30 can increase the occurrence of interfacial separation between the second face 22 and the light transmitting member 30.
[0060] As shown in Figures 2A, 2B and 3, the exterior 33 of the light transmitting member 30 is preferably slanted outward from the second face side 22 towards the first face side 21 of the light emitting element. In other words, in the sectional views shown in Figures 2A and 2B, the exterior 33 appearing on the left and right sides of the light transmitting member 30 preferably spreads towards the first face (emitting face) 11 of the light emitting device 10. The light that leaves the side faces 23 of the light emitting element 20 and propagates in the light transmitting member 30 reaches the oblique exterior 33. At this point, the light that is reflected from the exterior 33 can be directed towards the first face 11 of the light emitting device 10. This can increase the light extraction efficiency of the light emitting device 10.
[0061] In a sectional view parallel to a side face 23 of the light emitting element 20 in a plan view (the portion along line AA indicated in Figure 1, i.e. in Figure 2A), the angle formed by another side face 23 orthogonal to that side face 23 and the exterior 33 of the light transmitting member 30 covering the side face 23 (denoted as the "tilt angle θ1") is preferably in a suitable range. More specifically, the angle of inclination θ1 is preferably from 40° to 60° and, for example, can be set to 45°. The contour shape of the first face 31 of the light transmitting member 30 (drawn substantially circular in Figure 1) increases in size as the tilt angle θ1 is increased, thus increasing the light extraction efficiency. On the other hand, the contour shape of the first face 31 can be reduced in size as the angle of inclination θ1 is reduced, and therefore the dimension of each side of the light emitting device 10 can be reduced in a top view ( i.e. the light emitting device 10 can be made more compact). Considering both the light extraction efficiency and the compactness of the light emitting device 10, the tilt angle θ1 of 45° is preferred.
[0062] In a sectional view along the diagonal line of the light-emitting element 20 (the portion along the BB line indicated in Figure 1, that is, in Figure 2B), the angle formed by a third edge (number of reference 231 or 233 in Figure 2B) and the exterior 33 of the light transmitting member 30 covering the third edge (denoted as the "tilt angle θ2") is less than the tilt angle θ1. That is, as shown in Figure 2A and 2B, the tilt angle θ2 < the tilt angle θ1.
[0063] The exterior 33 of the light-emitting member 30 may be provided with edges coming from the points where the exterior 33 meets the third edges 231, 232, 233 and 234 of the light-emitting element 20 shown in Figure 3. that the edges are present on the exterior 33, however, when light entering the light transmitting member 30 from the side faces 23 of the light emitting element 20 is reflected by the interface between the exterior 33 of the light transmitting member 30 and the covering member 40 (see Figures 2A and 2B), light may be reflected repeatedly from faces positioned on either side of each edge (i.e., the two faces that form an edge) in the vicinity of the edges. Light may lose its intensity as it is gradually absorbed while at the same time being reflected repeatedly, which may lead to a reduction in the light extraction efficiency of the light emitting device 10. In order to increase the extraction efficiency of light, the absence of edges on the outside of the light transmitting member 30, i.e., on the outside 33 of the light transmitting member 30 formed as a smooth continuous curved surface as shown in Figure 3, is preferred. This can reduce multiple reflections that occur within the light transmitting member 30, thus increasing the light-extraction efficiency of the light-emitting device 10.
[0064] The exterior 33 of the light transmitting member 30 in the sectional view shown in Figures 2A and 2B may have a straight line, but may also have a curved line. In the present context, a "curved line" can be a curve projecting outwards (towards the covering member 40) or inwards (towards the light emitting element 20). From the perspective of light extraction efficiency, the exterior 33 is preferably formed as an outwardly projecting curve.
[0065] Exterior 33 which has an outward projecting curve in a sectional view is domed in a perspective view as shown in Figure 3. Exterior 33 which has an inward projecting curve in a sectional view has the trumpet shape (enlarged) in a perspective view as shown in Figure 20.
[0066] In cases where the light emitting element 20 includes a light transmitting substrate 27 and a semiconductor stack 28, as shown in Figure 2, the light transmitting substrate 27 can be positioned on the first face side 21 of the light emitting element 20, and semiconductor stack 28 can be positioned on the second face side 22. When light emitting element 20 is activated, heat is generated in the emission layer (reference numeral 282 in Figure 3) included in the semiconductor stack 28, and therefore the light transmitting member 30 is vulnerable to separation of the light emitting element 20 in the proximity of the semiconductor stack 28. As shown in Figure 2B, on the second face side 22 of the element light emitting element 20, the corners of the light emitting element 20 (reference numerals 241 and 243 in Figure 2B) are exposed because they are not covered by the light transmitting member 30, but are covered by the covering member 40. Therefore, the separation of member three light transmitter 30 of the light emitting element 20 on the second face side 22 of the light emitting element 20 is reduced. Accordingly, positioning the semiconductor stack 28, which is the heat generating source causing the separation, on the second face side 22 of the light emitting element 20 can effectively reduce the separation of the light transmitting member 30.
[0067] Figure 4 shows the light emitting device 10 viewed from the second face side 12. The electrode pair 251 and 252 of the light emitting element 20 is not covered by the cover member 40 and is exposed on the second face (bottom face) 12 of the light-emitting device 10. This allows the electrodes 251 and 252 of the light-emitting element 20 to be connected to external electrodes provided on a substrate, or the like, on which the light-emitting element 20 will be mounted. The light emitting element 20 is preferably covered by the covering member 40 completely, except for the portions of the second face 22 where the electrodes 251 and 252 are arranged, for the purpose of protecting the light emitting element 20 from damage. external environment.
[0068] The second face 22 of the light emitting element 20 is covered by the covering member 40 in order to expose the electrodes 251 and 252 formed on the second face 22 of the light emitting element 20 on the surface (second face 12) of the light emitting device 10. For example, the side faces (reference numerals 251c and 252c in Figure 3) of electrodes 251 and 252 may be covered by covering member 40, but the thickness of covering member 40 is adjusted to not cover surfaces 251s and 252s of electrodes 251 and 252. Surfaces 251s and 252s of electrodes 251 and 252 may project from or be substantially flush with covering member 40 (see Figure 2A).
[0069] Referring again to Figures 2A and B, as described above, the light emitting device 10 may include a wavelength converting member 50 on the first face side 11. The wavelength converting member 50 is a component for converting one wavelength of a portion of the light being transmitted to another wavelength. The wavelength converting member 50 may contain a phosphor that is excited by the light being transmitted. Being equipped with the wavelength converting member 50, the light emitting device 10 having an emission color different from that of the light emitting element 20 can be obtained. For example, the combination of a light emitting element 20, which emits blue light, with a wavelength converting member 50, which absorbs blue light and emits yellow fluorescence, can produce a light emitting device 10 which emits white light.
[0070] The wavelength converting member 50 is preferably arranged to cover the first face 21 of the light-emitting element 20 and the first face 31 of the light-transmitting member 30. The light generated in the light-emitting element 20 is extracted directly from the first face 21 of the light-emitting element 20, or extracted indirectly from the first face 31 of the light-transmitting member 30 as it leaves the side faces 23 of the light-emitting element 20 and passes through the light-transmitting member 30 Accordingly, arranging the wavelength converting member 50 for the purpose of covering the first face 21 of the light-emitting element 20 and the first face 31 of the light-transmitting member 30 allows most of the portion of the light generated in the element light emitting device 20 passes through wavelength converting member 50. In other words, emission color irregularities from light emitting device 10 can be suppressed because light that does not pass through wavelength converter member 50 is reduced. FIRST MODALITY OF THE MANUFACTURING PROCESS
[0071] A first embodiment of the manufacturing method for the light emitting device 10 according to Embodiment 1 will be explained below with reference to Figure 5.STEP 1-1. PLACEMENT OF THE LIGHT EMITTING ELEMENT 20
[0072] The light emitting element 20 is placed on the wavelength converting member 50 (Figure 5A). At that time, the light emitting element 20 is positioned so that its first face 21 is opposite the second face 52 of the wavelength converting member 50. The light emitting element 20 can be affixed to the wavelength converting member 50. 50 with the use of a light transmitting adhesive or similar. Instead of an adhesive, the light emitting element 20 may be affixed to the wavelength converting member 50 using the light transmitting member 30 which will be formed subsequently. In cases where the wavelength converting member 50 itself has adhesive properties, eg, semi-cured state or the like, the light-emitting element can be affixed without using any adhesive. STEP 1-2. LIGHT TRANSMITTING MEMBER TRAINING 30
[0073] A light transmitting member 30 is formed for the purpose of covering the side face portions 23 of the light emitting element 20 and the region of the second face 52 of the wavelength converting member 50 in the proximity of the light emitting element. 20 (Figure 5B). In cases where the light transmitting member 30 is produced from a light transmitting resin material, the liquid resin material 30L, which is the raw material for the light transmitting member 30, is applied along the edges between the first edges of the light emitting element 20 (reference numerals 212 and 214 in Figure 5B) and the wavelength converting member 50 using a dispenser, or the like. Liquid resin material 30L spreads over wavelength converting member 50 as well as travels above side faces 23 of light emitting element 20 due to surface tension. Subsequently, the liquid resin material 30L is cured by heating or the like to obtain the light transmitting member 30.
[0074] The displacement distance of the liquid resin material 30L over the light emitting element 20 can be controlled by adjusting the viscosity and amount of the liquid resin material 30L applied. For example, in the case of the light emitting member 30 shown in Figure 3, the liquid resin material 30L moves above the side faces 23 of the light emitting element 20 to contact the second edges 221, 222, 223 and 224. in portions. Liquid resin material 30L travels along third edges 231, 232, 233, and 234 partially, but does not reach corners 241, 242, 243, and 244 of light emitting element 20. Adjusting viscosity and amount of liquid resin material 30L In order to result in the shape shown in Figure 3, the corners 241, 242, 243 and 244 of the light emitting element 20 may be exposed and not covered by the light transmitting member 30. 30L liquid resin can be adjusted by adding filler or the like.
[0075] The formation of the light transmitting member 30 from the liquid resin material 30L can cause the exterior 33 of the light transmitting member 30 to be externally slanted in the z-direction (i.e., in the direction with movement in the opposite direction to the side faces 23 of light emitting element 20) due to surface tension (Figure 5B).STEP 1-3. COVERAGE MEMBER TRAINING 40
[0076] A covering member 40 is arranged to cover the exterior 33 of the light transmitting member 30, and the portion of the second face 52 of the wavelength converting member 50 not covered by the light transmitting member 30 (i.e., the exposed portion of the second face 52). In addition, the covering member 40 may also cover the portion of the second face 22 of the light-emitting element 20 not covered by the electrodes 251 and 252 (i.e., the exposed portion of the second face 22). At this time, it is preferable to adjust the thickness (i.e., dimension in the z-direction) of cover member 40 so that a portion of each of electrodes 251 and 252 (e.g., surfaces 251s and 252s of electrodes 251 and 252 ) is not covered by the covering member 40. In other words, using the second face 52 of the wavelength converting member 50 as a reference, the height of the second face 42 of the covering member 40 can be set as the height surfaces 251s and 252s of electrodes 251 and 252, or smaller.
[0077] In cases where the cover member 40 is formed from a resin material, for example, a mold is placed to enclose the light emitting element 20 and the light transmitting member 30, followed by pouring a liquid resin material 40L, which is the raw material for the cover member 40, inside the mold. At that time, the wavelength converting member 50 can be used as the bottom of the mold by fitting the mold along the perimeter of the wavelength converting member 50 as shown in Figure 5C. Subsequently, the liquid resin material 40L is cured by heating or the like to obtain the covering member 40. By removing the mold, the light emitting device 10 as shown in Figures 1, 2 and 4 can be obtained. Alternatively, cover member 40 may be formed by spray coating, compression molding, or various other methods. Alternatively, after forming the cover member for the purpose of burying the electrodes 251 and 252, the electrodes 251 and 252 may be exposed by removing either the cover member 40 alone, or the cover member 40 and a portion of the electrodes 251. and 252. SECOND MODALITY OF THE MANUFACTURING PROCESS
[0078] A second embodiment of the manufacturing process for the light emitting device 10 according to Embodiment 1 will be explained with reference to Figures 6 to 10. Several light emitting devices 10 can be produced simultaneously by the second manufacturing method .STEP 2-1. PLACEMENT OF LIGHT EMITTING ELEMENTS 20
[0079] The light emitting elements 20 are placed on the second face 520 of a wavelength conversion sheet 500 (Figures 6A and 9A). Wavelength converting sheet 500 will become wavelength converting members 50 once light emitting devices 10 are separate. At that time, with the use of a wavelength conversion sheet 500 that has a relatively large area, multiple light-emitting elements 20 can be placed on a single wavelength conversion sheet 500. light 20 are arranged at prescribed intervals. When the spacing between adjacent light-emitting elements 20 is too wide, the amount of light-emitting devices 10 that can be produced at one time will decrease, so the mass production efficiency for light-emitting devices 10 will be reduced. . Therefore, it is preferred to place the light emitting elements 20 at suitable intervals. The light emitting elements 20 are affixed at prescribed positions on the wavelength conversion sheet 500 by the same affixing methods as those explained in step 1-1 in the first manufacturing method. STEP 2-2. TRAINING OF LIGHT TRANSMITTING MEMBERS 30
[0080] A light-transmitting member 30 is formed on the periphery of each light-emitting element 20 similarly to Step 1-2 of the first manufacturing method as shown in Figures 6B and 9B. The light transmitting members 30 are formed so that the light transmitting member 30 formed at the periphery of a light emitting element 20 does not contact the light transmitting member 30 formed at the periphery of any adjacent light emitting element 20. STEP 2-3. COVERAGE MEMBER TRAINING 400
[0081] A covering member 400 is arranged to cover the exteriors 33 of the light transmitting members 30 and the second face 520 of the wavelength conversion sheet 500 similarly to Step 1-3 of the first method of manufacture as shown in Figures 7A and 9C. Cover member 400 will become cover members 40 as light emitting devices 10 are separated. Unlike in Step 1-3, the thickness (dimension in the z-direction) of the covering member 400 is adjusted to also cover the surfaces 251s and 252s of the electrodes 251 and 252 of the light-emitting elements 20 in Step 2-3. At that point, the plurality of light-emitting members 30 disposed on the peripheries of the plurality of light-emitting elements 20 affixed to the wavelength conversion sheet 500 are covered by a continuous covering member 400.
[0082] Subsequently, the thickness of the cover member 400 is reduced for the purpose of exposing the electrodes 251 and 252 of the light emitting elements 20 using a known process as shown in Figures 7B and 10A. STEP 2-4. SEPARATION OF LIGHT Emitting DEVICES 10
[0083] Cover member 400 and wavelength conversion sheet 500 are cut along dashed lines X1, X2, X3 and X4 that pass substantially through the center of adjacent light emitting elements 20 as shown in Figures 7B and 10A, using a cutter or similar. This separates the light emitting devices 10 into individual pieces as shown in Figures 8 and 10B. Several light-emitting devices 10, each of which has a light-emitting element 20, can therefore be produced simultaneously.
[0084] In the case where the light transmitting member 30 is exposed on any side face 13 of a separate light emitting device 10 (i.e. side face 40c of the covering member 40), the light emitted from the emitting element light 20 may leak transversely from the side face 13 of the light emitting device 10 through the light transmitting member 30. Accordingly, it is preferable to adjust the gaps between adjacent light emitting elements 20 and the viscosity of the light transmitting members. 30 in order not to expose the light transmitting members 30 from any side face 13 of the light emitting devices 10. THIRD TYPE OF MANUFACTURING METHOD
[0085] A third embodiment of the manufacturing method for the light-emitting device 10 according to Embodiment 1 will be explained with reference to Figures 11 to 12. The third process can produce several light-emitting devices 10 simultaneously. of steps similar to those in the second manufacturing method will be omitted.STEP 3-1. DISPOSITION OF LIGHT TRANSMITTING MEMBERS 30
[0086] A liquid resin material 300 to form the light transmitting members 30 is applied to the second face 520 of the wavelength conversion sheet 500 in the form of islands as shown in Figures 11A and 12A. At this time, using a relatively large wavelength conversion sheet 500, the liquid resin material 300 is arranged in the form of several islands. Each island of liquid resin material 300 can be any shape in a plan view, and examples include a circle, oval, square, and rectangle. In the case where the spacing between adjacent islands of the liquid resin material 300 is too wide, the amount of light emitting devices 10 that can be produced at one time can decrease the mass production efficiency for the light emitting devices 10 can be reduced. reduced. Therefore, it is preferred to arrange the liquid resin material 300 at suitable intervals. STEP 3-2. FIXING OF LIGHT EMITTING ELEMENTS 20 AND CURING LIQUID RESIN MATERIAL 300
[0087] As shown in Figures 11B and 12B, the light-emitting elements 20 are placed on the islands of the liquid resin material 300. Positioning the light-emitting elements 20 on the islands of the liquid resin material 300, or pressing them further , allows the liquid resin material 300 to travel along the side faces 23 of each light-emitting element 20 due to surface tension, providing the exterior 303 of the liquid resin material 300 which will later become the exteriors 33 of the transmitting members of light 30 a downward spread format. The liquid resin material 300 is subsequently cured to form the light transmitting members 30.
[0088] The shape of the liquid resin material 300 in a plan view may be deformed as light emitting elements 20 are placed or pressed thereon to each acquire a shape that is substantially consistent with the contour of the first face 31 of the light-transmitting member 30 of the light-emitting device 10, the finished product as shown in Figures 1 and 2.
[0089] In this manufacturing process, the liquid resin material 300 is present between the wavelength conversion sheet 500 and the light emitting elements 20 in the form of a film. The film-form light-transmitting member 30t obtained by curing the liquid resin material 300 can also be used as an adhesive between the wavelength conversion sheet 500 and the light-emitting elements 20. The thickness of the transmitting member of light in the form of film 30t is preferably determined taking into account the adhesion and heat dissipation of the light emitting devices 10. More specifically, the thickness of the light transmitting member in the form of film 30t can be established, for example in a range between 2 and 30 μm, preferably in a range between 4 and 20 μm, more preferably in a range between 5 and 10 μm, in order to effectively conduct the heat generated in the converting sheet wavelength 500 towards the light emitting element 20 when the light emitting device 10 is emitting light.
[0090] Subsequently, the cover member 400 is formed similarly to Step 2-3, and the light emitting devices 10 are separated similarly to Step 2-4 of the second production process. Several light-emitting devices 10, each of which has a light-emitting element 20, can therefore be produced simultaneously.
[0091] As discussed above, according to this method of fabrication, by placing the light-emitting elements 20 on islands of liquid resin material 300 disposed on the wavelength conversion sheet 500, the adhesion of the light-emitting elements light 20 and the formation of light transmitting members 30 can be carried out simultaneously. This can increase the efficiency of mass production. FOURTH MODALITY OF MANUFACTURING METHOD
[0092] A fourth embodiment of the manufacturing method for the light-emitting device 10 according to Embodiment 1 will be explained with reference to Figures 13 to 14. The fourth manufacturing method can produce several light-emitting devices 10 simultaneously. STEP 4-1. PLACEMENT OF LIGHT EMITTING ELEMENTS 20
[0093] The light emitting elements 20 are placed on the upper face 60a of a support 60 produced from a heat resistant sheet or the like as shown in Figure 13A. At that time, using a relatively large support 60, several light-emitting elements 20 are placed on a single support 60. As in the case of Step 2-1 of the second manufacturing method, the light-emitting elements 20 are placed in prescribed intervals. The light emitting elements 20 are affixed to prescribed positions of the support 60 by the same affixing methods as those explained in Step 1-1 of the first manufacturing method. STEP 4-2. TRAINING OF LIGHT TRANSMITTING MEMBERS 30
[0094] A light-emitting member 30 is formed at the periphery of each light-emitting element 20 similarly to Step 1-2 of the first method of manufacture as shown in Figure 13B. The light transmitting members 30 are formed so that the light transmitting member 30 formed at the periphery of a light emitting element 20 does not contact the light transmitting member 30 formed at the periphery of any adjacent light emitting element 20. STEP 4-3. COVERAGE MEMBER TRAINING 400
[0095] A covering member 40 is arranged to cover the exteriors 33 of the light transmitting members 30 and the top face 60a of the support member 60 in the same manner as in Step 1-3 of the first method of manufacture as shown in Figure 13C. Cover member 400 will become cover members 40 as light emitting devices 10 are separated. The various light-transmitting members 30 disposed on the peripheries of the light-emitting elements 20 affixed to the support 60 are covered by a continuous covering member 400. STEP 4-4. WAVELENGTH CONVERSION LAYER FORMING 510
[0096] The first faces 21 of the light emitting elements 20 and the first face 400a of the covering member 400 (Figure 14A) are exposed by removing (separating) the support 60. Subsequently, a wavelength converting layer 510 is formed to cover the first faces 21 of the light-emitting elements 20 and the first face 400a of the covering member 400 (hereinafter referred to as "first faces 21 and 400a"). The wavelength conversion layer 510 will become the wavelength conversion members 50 once the light emitting devices 10 are separate. Examples for methods of forming the wavelength converting layer 510 include adhering a sheet produced from a light-transmitting resin containing phosphor to the first faces 21 and 400a by a hot melt process or with the use of a adhesive, depositing a phosphor on the first faces 21 and 400a by electrophoretic deposition followed by application of a light transmitting resin to be impregnated with the phosphor; and coating the first faces 21 and 400a with a light transmitting resin containing phosphorus by potting, transfer molding, casting, spraying, electrostatic spray coating, printing, or the like. Among these methods, sprinkling is preferred, and pulsed sprinkling that blasts intermittently sprinkling is particularly preferred.STEP 4-5. SEPARATION OF LIGHT Emitting DEVICES 10
[0097] In the same way as in Step 2-4 of the second fabrication method, the covering member 400 and the wavelength converting layer 510 are cut along the dashed lines X1 and X2 that pass through the center of emitting elements adjacent lights 20 using a cutter or the like (Figure 14B). This separates the light-emitting devices 10 into individual pieces (Figure 14C). Several light-emitting devices 10, each containing a light-emitting element 20, can therefore be produced simultaneously. MODE 2
[0098] As shown in Figure 15, the light emitting device 15 according to this embodiment differs from the light emitting device 10 according to the Embodiment 1 so that the side faces 501b of the wavelength converting member 501 are covered by the cover member 403 and the cover member 403 is of a double layer structure. It is otherwise the same as Modality 1.
[0099] The light-emitting device 15, according to that embodiment, includes a light-emitting element 20, a wavelength converting member 501 that covers the first face 21 of the light-emitting element 20, a light-transmitting member 30 disposed on the side faces 23 of the light emitting element 20, and a covering member 403 covering the exterior 33 of the light transmitting member 30. In that embodiment, the covering member 403 includes a first covering member 401 covering the side faces 501b of the wavelength converting member 501 and a second covering member 402 covering the exterior 33 of the light transmitting member 30.
[00100] Covering the side faces 501b of the wavelength converting member 501 with the covering member 403 (i.e., the first covering member 401) can reduce the propagation of light emitted from the light emitting element 20 within of the wavelength converting member 501 and the transverse casting of the side faces 501b. With such an arrangement, most of the portion of the light emitted from the light emitting device 15 can be extracted from the first face (upper face) 16 which functions as the emitting face of the light emitting device 15. light from the light emitting device 15 is substantially ejected in the z direction, the light directionality of the light emitting device 15 can be accentuated.
[00101] A manufacturing method for the light emitting device 15 will be explained below with reference to Figures 16 to 17.STEP A. WAVELENGTH CONVERSION MEMBER FORMATION 501
[00102] In the first support 61 produced from a heat resistant sheet, or the like, a layer of cover member material 404 to form the first cover member 401 is formed as shown in Figure 16A. Then, frames 405 are obtained by punching holes through the cover member material layer 404 as shown in Figure 16B. The dimensions and shape of the inner face of each hole 409 of the frame 405 when viewed from the z direction are identical to the dimensions and contour shape of the wavelength converting member 501 in the plan view of the light emitting device 15 shown in Figure 15A . Holes 409 are created by penetrating the cover member material layer 404 without penetrating the first support 61.
[00103] A light-transmitting phosphor containing resin which is a pre-curing liquid resin material 502L is applied to each orifice 409 by potting as shown in Figures 16B. Subsequently, the phosphor-containing components 502 are formed by curing the light-transmitting resin 502L by heating as shown in Figure 16C. The "upper portions of the phosphorus-containing components 502" and the "upper portions of the frames 405" located above the Ct-Ct line (dashed line) indicated in Figure 16C are removed by a cutting or grinding operation. This forms a sheet component that includes the lower portions of the phosphor-containing components 502 (wavelength conversion members 501) and the lower portions of the frames 405 (hereinafter referred to as "thin frames 406") as shown in Figure 16D) . The tapered frames 406 will later become the first cover member 401 shown in Figure 15B. Then, the sheet component (wavelength converting members 501 and tapered frames 406) is transferred to the second support 62 produced from a heat resistant sheet or the like as shown in Figure 16E. Alternatively, the transfer of the foil component may be omitted.STEP B. ATTACHMENT OF LIGHT EMITTING ELEMENTS 20
[00104] On each exposed face 501x of the wavelength converting member 501, a light emitting element 20 is affixed as shown in Figure 17A. The display methods for the light emitting elements 20 are similar to those explained in Step 1-1 in Mode 1.STEP C. TRAINING LIGHT TRANSMITTING MEMBERS 30
[00105] A liquid resin material 30L which is the raw material for the light transmitting member 30 is applied to the periphery of each light emitting element 20 similarly to Step 1-2 of Embodiment 1 as shown in Figure 17B. The light transmitting member 30 is obtained by curing the liquid resin material 30L by heating or the like. The 30L liquid resin material spreads over the exposed face 501x of the wavelength converter member 501, but upon reaching the edges with the thin frames 406, it would not readily spread beyond them due to the pinning effect. ). Therefore, in the light-emitting device 15 according to this embodiment, the shape of the light-transmitting member 30 can be easily controlled. As shown in Figure 15A, the light transmitting member 30 does not reach the four corner portions 501e of the wavelength converting member 501 (hatched portions). Consequently, the four corner portions 501e are exposed as they are not covered by the light transmitting member 30.STEP D. COVERAGE MEMBER FORMATION 407
[00106] A covering member 407 is arranged to cover the exteriors 33 of the light transmitting members 30, the four corner portions of the wavelength converting members 501 (reference numeral 501e in Figure 15A), and the second faces 406b of the thinned frames 406 surrounding the wavelength conversion members 501 in the same manner as in Step 1-3 of Embodiment 1 (Figure 17C). Cover member 407 will become second cover member 402 once the light emitting devices are separate. The various light transmitting members 30 disposed on the peripheries of the light transmitting elements 20 are covered by a continuous covering member 407. As shown in Figure 15A, the wavelength converting member 501 is covered by the light transmitting member 30, except by the four corner portions 501e. Therefore, the wavelength converting member 501 is covered by the covering member 407 only in the four corner portions 501e which are not covered by the light transmitting member 30 as shown in Figure 15C.STEP E. SEPARATING THE LIGHT Emitting DEVICES 15
[00107] Cover member 407, tapered frames 406 and second support 62 are cut along dashed lines X5 and X6 passing through the center of adjacent light-emitting elements 20 using a cutter or the like. Finally, the light emitting devices 15 are obtained by removing (splitting apart) the second support 62. Alternatively, the second support 62 can be removed prior to the cutting operation, followed by the cutting of the covering member 407 and the frames. thinned 406. MODE 3
[00108] In this embodiment, the shapes of the electrodes of the light-emitting element included in the light-emitting device differ from the shapes of the electrodes 251 and 252 of the light-emitting element 20 according to Embodiment 1. The structure of the light-emitting device is , otherwise similar to that of Mode 1.
[00109] Figure 18 is a perspective view of the light emitting device 17 according to this embodiment. The light emitting element 207 included in the light emitting device 17 has a semiconductor stack 28 and a pair of electrodes 257 and 258. On the second face (bottom face) 172 of the light emitting device 17, the surfaces 257s and 258s of the pair of electrodes 257 and 258 are exposed because they are not covered by the covering member 40.
[00110] In this embodiment, the shape of the surface 257s of the first electrode 257 and the surface 258s of the second electrode 258 are different. The shape of the surface 257s of the first electrode 257 is substantially rectangular extending in one direction (y-direction). The surface shape 258s of the second electrode 258 is comb-shaped which alternatively has protuberances 258a and recesses 258b along a side 258L that is opposite the first electrode 257. The recesses 258b are filled with cover member 40. This can enhance the adhesion between the light emitting element 207 and the cover member 40.
[00111] Protrusions 258a and recesses 258b can be of any shape. For example, in Figure 18, the shape of each recess 258b includes an oblong portion extending in the x direction from side 258L, and a circular portion at the end of the oblong portion. In the case where two or more recesses 258b are provided, they may all have the same shape as shown in Figure 18, or some or all may have different shapes. In the case where three or more recesses 258b are provided, the gaps between adjacent recesses 258b may all be the same as shown in Figure 18, or different.
[00112] Figure 19 is a plan view of the light emitting device 17 in a state where the covering member 40 shown in Figure 18 is omitted, and Figure 20 is a perspective view of the light emitting device 17 in a state in which cover member 40 is omitted. As shown in Figures 19 and 20, the light emitting element 207 may include a reflective film 29 on the second face side 207b, more specifically on the second semiconductor layer side 283 of the semiconductor stack 28 of the light emitting element 207 as shown in Figures 20 and 3. The reflective film 29 can be formed, for example, using a high-reflectance metal such as Ag and Al, or a multilayer dielectric film, or the like. By providing the reflective film 29, light traveling towards the second face 207b can be reflected towards the first face 207a.
[00113] As shown in Figure 19, the light emitting element 207 may not have the semiconductor stack 28 or the reflective film 29 formed in the corner portions of the light transmitting substrate 27 for reasons attributable to the production steps. It is desirable to cover the corner portions, which do not have reflective film 29, with the covering member 40. The reflection of light traveling towards the corners of the light transmitting substrate 27 at the interface between the light transmitting substrate 27 and the cover member 40 can contribute to increasing the light extraction efficiency of the light emitting device 17.
[00114] Suitable materials for each component of light-emitting devices 10 in accordance with Modalities 1 to 3 will be explained below. LIGHT EMITTING ELEMENT 20, 207
[00115] For the light emitting element 20 or 207, a semiconductor light emitting element such as a light emitting diode can be used. The semiconductor light-emitting element may include a light-transmitting substrate 27 and a semiconductor stack 28 formed thereon. LIGHT TRANSMITTER SUBSTRATE 27
[00116] For the light-transmitting substrate 27 of the light-emitting element 20 or 207, for example, a light-transmitting insulating material such as sapphire (Al2O3) or spinel (MgAl2O4), or a semiconductor material that allows the emitted light from the semiconductor stack 28 transmit therethrough (e.g., a nitride-based semiconductor material) can be used. SEMICONDUCTOR CELL 28
[00117] The semiconductor stack 28 includes several semiconductor layers. As an example, the semiconductor stack 28 may include three semiconductor layers comprising a first conductive-type semiconductor layer (e.g., n-type semiconductor layer) 281, an emission layer (active layer) 282, and a second conductive-type semiconductor layer (eg, p-type semiconductor layer) 283 as shown in Figure 3. Semiconductor layers can be formed using, for example, semiconductor materials such as group III-V compound semiconductors, semiconductors of compound of group II-VI, or the like. More specifically, a nitride-based semiconductor material such as an InXAlYGa1-X-YN (0^X, 0^Y, X+Y^1) or the like (e.g. InN, AlN, GaN, InGaN, AlGaN, InGaAlN , or similar) can be used. ELECTRODES 251, 252, 257, 258
[00118] For electrodes 251, 252, 257 and 258 of light emitting element 20 and 207, a good conductor of electricity can be used, and for example a metal such as Cu is suitable. LIGHT TRANSMITTING MEMBER 30
[00119] The light transmitting member 30 may be formed from a light transmitting material, such as a light transmitting resin, glass, or the like. For the light transmitting resin, thermosetting light transmitting resins such as silicone resins, modified silicone resins, epoxy resins, phenol resins, and the like are preferred. Since the light transmitting member 30 is in contact with the side faces 23 of the light emitting element 20, it is readily affected by the heat generated in the light emitting element 20 when activated. Thermosetting resins are highly resistant to heat in general, and therefore are suitable for the light transmitting member 30. The light transmitting member 30 preferably has high light transmittance. For that reason, it is preferable not to add any additives that reflect, absorb, or scatter light to the light transmitting member 30. However, there are cases where an addition of an additive to the light transmitting member 30 is preferred in order to impart desirable properties. For example, various fillers may be added in order to adjust the reflective index of the light transmitting member 30, or the viscosity of the light transmitting member before curing (liquid resin material 300).
[00120] In a plan view of the light emitting device 10, the contour of the first face 31 of the light transmitting member 30 is greater than at least the contour of the second face 22 of the light emitting element 20. The contour of the first face 31 of the light transmitting member 30 can be shaped in various ways, and can be, for example, a circular shape as shown in Figure 21A, a quadrangle with rounded corners as shown in Figure 15A, oval, square, rectangle, or the like.
[00121] Particularly, as shown in Figure 21A, in relation to the dimensions of the first face 31 of the light-emitting member 30 in a plan view (i.e., distances between the contour of the first face 21 of the light-emitting element 20 and the contour of the first face 31 of the light transmitting member 30), it is preferred to satisfy the condition, dimension 30D < dimension 30W, when comparing dimension 30D along the diagonal line of the light emitting element 20 to dimension 30W along the line perpendicular to a side face 23 of the light emitting element 20 at the center of that side. In order to satisfy this dimensional condition, the shape of the first face 31 of the light transmitting member 30 is preferably a circle, oval or a quadrangle with rounded corners.
[00122] The contour shape of the first face 31 of the light transmitting member 30 can be determined based on other conditions. For example, when the light emitting device 10 is used in combination with an optical lens (secondary lens), the contour of the first face 31 is preferably circular, which also generates a shape close to a circle upon emission from the light emitting device 10 thereby allowing the optical lens to easily condense light. On the other hand, if a reduction in the size of the light emitting device 10 is desired, the contour of the first face 31 is preferably a quadrangle with rounded corners, which can reduce the dimension 30W, thus reducing the dimensions of the upper face 11 of the light emitting device 10.
[00123] In general, considering both the ease of condensation by an optical lens and the compactness of the light emitting device 10, the preferred ratio of dimension 30D to dimension 30W is 30D/30W = 2/3 to 1/2.
[00124] Assuming that the dimension of the first face 21 to the second face 22 of the light emitting element 20 is the "thickness 20T of the light emitting element 20" as shown in Figures 21A and B, the dimension 30W and the thickness 20T can be approximated by the relationship, tan θ 1=30W/20T. In the present context, when 30W=250 μm and 20T=150 μm, for example, the tilt angle θ 1=59°, which can increase the light extraction efficiency.
[00125] As discussed earlier, the preferred tilt angle θ1 is 40° to 60°. Therefore, once the thickness 20T of the light emitting element 20 is determined, the preferred range of 30W can also be determined. COVERAGE MEMBER 40, 403
[00126] Cover member 40 or 403 is formed from a material that satisfies a prescribed relationship with respect to coefficient of thermal expansion with light transmitting member 30 and light emitting member 20. In other words, the material for the covering member 40 or 403 is selected so that the difference in coefficient of thermal expansion ΔT40 between the covering member 40/403 and the light emitting element 20 is less than the difference in coefficient of thermal expansion ΔT30 between the light-transmitting member 30 and the light-emitting element 20. For example, when the light-emitting element 20 includes a light-transmitting substrate 27 produced from sapphire and a semiconductor stack 28 produced from a semiconductor based on GaN, the coefficient of thermal expansion of the light emitting element 20 would be in a range between 5 and 9 10-6/K. When the light transmitting member 30 is produced from a silicone resin, the coefficient of thermal expansion of the light transmitting member 30 would be in the range between 2 and 3 10-5/K. Consequently, ΔT40<ΔT30 can be satisfied by forming the cover member 40 or 403 is made from a material that has a lower coefficient of thermal expansion than that of the silicone resin.
[00127] When using a resin material for the cover member 40 or 403, in general, the coefficient of thermal expansion would be on the order of 10-5/K, which is greater than the coefficient of thermal expansion of an element common light emitter 20 by an order of magnitude. However, the coefficient of thermal expansion of a resin material can be reduced by adding a filler or the like. For example, by adding a filler, such as silica, to a silicone resin, the coefficient of thermal expansion can be reduced to that of the silicone resin without adding the filler.
[00128] As for the resin materials applicable to the cover member 40 or 403, thermosetting resins such as silicone resins, modified silicone resins, epoxy resins and phenol resins are particularly preferred.
[00129] Cover member 40 or 403 may be formed using a light-reflecting resin. A light-reflecting resin means a resin material that has 70% or greater reflectance with respect to light from the light-emitting element 20, for example. By reflecting light striking the cover member 40 or 403 towards the first face 11 (emitting face) of the light emitting device 10, the light extraction efficiency of the light emitting device 10 can be increased.
[00130] For light-reflecting resin, a light-transmitting resin in which a light-reflecting substance is dispersed, for example, can be used. Examples of suitable light-reflecting substances include titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride and mullite. A light-reflecting substance in a granular, fibrous or thin flake form may be used, but the fibrous form is preferred as it is also expected to have the effect of reducing the coefficient of thermal expansion of the covering member 40 or 403. . WAVELENGTH CONVERSION MEMBER 50
[00131] The wavelength converting member 50 contains a phosphor a light transmitting material. For the light transmitting material, a light transmitting resin, glass, or the like, can be used. Light transmitting resins are preferred, and thermosetting resins such as silicone resins, modified silicone resins, epoxy resins, phenol resins, or the like, as well as thermoplastic resins such as polycarbonate resins, acrylic resins, methylpentane resins, of polyborbornene, or the like, can be used. Silicone resins which can have good lightfastness and heat resistance are particularly preferred.
[00132] For phosphors, those that can be excited by light emitted from the light emitting element 20 are used. Examples of phosphors excitable by light emission from a blue light emitting element or ultraviolet light emitting element include phosphors based on aluminum garnet and yttrium activated by cerium (Ce:YAG); phosphors based on aluminum garnet and lutetium activated by cerium (Ce:LAG); phosphors based on calcium aluminum silicate containing nitrogen activated by chromium and/or europium (CaO-Al2O3-SiO2); phosphors based on europium silicate ((Sr,Ba)2SiO4); nitride-based phosphors such as β-SiAlON phosphors, CASN-based phosphors, SCASN-based phosphors; KSF-based phosphors (K2SiF6:Mn); sulfide-based phosphors and quantum dot phosphors. By combining these phosphors with a blue or ultraviolet light-emitting element, light-emitting devices of various emission colors (eg, a white light-emitting device) can be produced.
[00133] The wavelength converter member 50 may contain various fillers for the purpose of adjusting viscosity or the like.
[00134] Incidentally, the surface of the light emitting element may be covered by a light transmitting material which does not contain phosphors, instead of the 50 wavelength converting member. This light transmitting material may also contain various charges for the purpose to adjust the viscosity or the like.
[00135] Several embodiments of the invention have been exemplified above. It is evident, however, that the invention is not limited to the foregoing, and may be any known device provided it does not deviate from the spirit and scope of the invention. The settings described in one embodiment or example can be applied to other embodiments and examples. Additionally, with respect to each component that makes up the present invention, a plurality of structural elements that make up the present invention can be configured as a single piece that serves the purpose of a plurality of elements. Or vice versa, a single structural element can be configured as a plurality of parts that serve the purpose of a single element. (EXPLICATION OF REFERENCE NUMBERS)10, 15, 17 light-emitting device11 first face of the light-emitting device (upper face)12 second face of the light-emitting device (lower face)20 , 207 light-emitting element21 first face of the element light emitting element (upper face)22 second face of light emitting element (lower face)23 side face of light emitting element241 , 242, 243, 244 corner of light emitting element251, 252 electrode242 light transmitting member243 outer of transmitting member light244 covering member50 wavelength converting member500 wavelength converting sheet502 phosphor-containing component510 wavelength converting layer

权利要求:
Claims (14)
[0001]
1. Light-emitting device (10,15,17) characterized in that it comprises: a light-emitting element (20,207) having a first face (21), a second face (22) opposite the first face (21), a plurality of side faces (23) extending between the first face (21) and the second face (22), a plurality of corners (241,242,243,244) where the second face (22) meets two of the plurality of side faces (23) ), and a pair of electrodes (251,252) on a second face side (22) of the light-emitting element (20,207); a light-transmitting member (30) covering a portion of at least one of the side faces (23) and a portion of an edge where the at least one side face (23) meets the second face (22) so that at least one of the plurality of corners (241,242,243,244) is exposed from the light transmitting member (30); and a cover member (40) covering the at least one exposed corner (241,242,243,244) of the light-emitting element (20,207) and the outside of the light-transmitting member (33) so that the electrode pair (251,252) is exposed from of the covering member (40); wherein a coefficient of thermal expansion of the covering member (40) is less than a coefficient of thermal expansion of the light transmitting member (30).
[0002]
2. A light-emitting device according to claim 1, characterized in that the exterior of the light-transmitting member (33) is inclined outwards from the second face side (22) towards a first face side. face (21) of the light emitting element (20,207).
[0003]
3. Light-emitting device, according to claim 1 or 2, characterized in that: the light-emitting element (20,207) is a rectangular parallelepiped having four corners (241,242,243,244), and two corners (242,244) positioned diagonally between the four corners (241,242,243,244) are covered by the covering member (40).
[0004]
4. Light emitting device, according to claim 1 or 2, characterized in that: the light emitting element (20,207) is a rectangular parallelepiped having four of the corners (241,242,243,244), and two corners (243,244) adjacent among the four corners (241,242,243,244) and a portion of an edge between the two adjacent corners (243,244) are covered by the covering member (40).
[0005]
5. Light-emitting device according to claim 3 or 4, characterized in that all of the four corners (241,242,243,244) of the light-emitting element (20,207) are covered by the cover member (40).
[0006]
6. Light-emitting device according to any one of claims 1 to 5, characterized in that: the light-emitting element (20,207) includes a light-transmitting substrate and a semiconductor stack, and the light-transmitting substrate is disposed on the first face side (21) of the light emitting element (20,207), and the semiconductor stack is disposed on the second face side (22) of the light emitting element (20,207).
[0007]
7. Light emitting device according to any one of claims 1 to 6, characterized in that: the light transmitting member (30) is composed of a light transmitting resin, and the covering member (40) is composed of a light-reflecting resin.
[0008]
8. Light-emitting device according to any one of claims 1 to 7, characterized in that: the light-transmitting member (30) has a first face that is flush with the first face (21) of the light-emitting element (30) light (20,207), and the first face (21) of the light emitting element (20,207) and the first face of the light transmitting member (30) are covered by a wavelength converting member (50).
[0009]
9. Light-emitting device according to any one of claims 1 to 8, characterized in that the first face (21) of the light-emitting element (20,207) is covered by the light-transmitting member (30).
[0010]
10. Light-emitting device according to any one of claims 1 to 9, characterized in that a coefficient of thermal expansion of the light-emitting element (20.207) is lower than the coefficient of thermal expansion of the covering member ( 40).
[0011]
11. Method for manufacturing a light-emitting device (10,15,17) characterized in that it comprises the steps of: preparing a wavelength converting member (50); arranging a light-emitting element (20,207) on the wavelength converting member (50) such that a first face (21) of the light emitting element (20,207) is opposite a second face of the wavelength converting member (50); forming a light transmitting member ( 30) so that the light transmitting member (30) covers a portion of a side face (23) of the light transmitting member (20,207) and forming a covering member (40) so that an exterior of the light transmitting member light (30) and a corner (241,242,243,244) of the light emitting element (20,207) are exposed from the light transmitting member (30).
[0012]
12. Method according to claim 11, characterized in that: the step of forming the light transmitting member (30) includes: arranging liquid resin material on the wavelength converting member (50), arranging the light emitting element (20,207) on the liquid resin material, and cure the liquid resin material.
[0013]
13. Method according to claim 11 or 12, characterized in that: the step of forming the light transmitting member (30) includes: creating a hole in the cover layer, and forming a phosphor-containing component ( 502) in the hole.
[0014]
Method according to any one of claims 11 to 13, characterized in that a coefficient of thermal expansion of the covering member (40) is less than a coefficient of thermal expansion of the light transmitting member (30).

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法律状态:
2016-10-04| B03A| Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]|

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2020-05-12| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|

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2021-11-16| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2022-01-18| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 01/04/2016, OBSERVADAS AS CONDICOES LEGAIS. |

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JP2015076137|2015-04-02|

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JP2015-076137|2015-04-02|

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JP2016-048776|2016-03-11|

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