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    • 专利摘要:
    POLYAMIDE MOLDING COMPOUND, MOLDED ARTICLE FORMED FROM A MOLDING COMPOUND AND USE OF A MOLDING COMPOUND The present invention relates to a polyamide molding compound which consists of a mixture of two specific polyamides. The first polyamide, therefore, is substantially based on 1,5-pentanediamine as a diamine component used during polycondensation. The second polyamide is therefore 6I / 6T polyamide. The polyamide molding compounds according to the invention are distinguished by extremely low shrinkage and low differential shrinkage (difference between the contraction of the molded article longitudinally and transversely in relation to the injection flow). In addition, the present invention relates to molded articles which are amenable to production from the polyamide molding compounds according to the invention and also to the purposes of using the polyamide molding compounds.
    公开号:BR102015028401B1
    申请号:R102015028401-2
    申请日:2015-11-11
    公开日:2021-02-23
    发明作者:Felix KOCH；Botho Hoffmann
    申请人:Ems-Patent Ag；
    IPC主号:
    专利说明:

    [001] The present invention relates to a polyamide molding compound which consists of a mixture of two specific polyamides. The first polyamide, therefore, is substantially based on 1,5-pentanediamine as a diamine component used during polycondensation. The second polyamide is, therefore, a partially aromatic polyamide. The polyamide molding compounds according to the invention are distinguished by an extremely low contraction and low differential contraction (difference between contraction of the molded article longitudinally and transversely in relation to the injection flow). In addition, the present invention relates to molded articles which are amenable to production from the polyamide molding compounds according to the invention and also to the purposes of using the polyamide molding compounds.
    [002] Various polyamide compositions in which the diamine component of the polyamide is derived from cadaverine (1,5-pentanediamine) are known in the art. Such polyamide compositions are produced and marketed, in particular, from the point of view of ecologically sustainable polyamides.
    [003] WO 2009/0954401 A1 refers to transparent molding compounds based on polyamide 510 with a measured transmission, according to ASTM D1003, on injection molded sheets 1 mm thick of more than or equal to 80% and a method and master batches for the production of such molding compounds and also for the use of such molding compounds for the production of molded articles of any kind. In order to increase transparency, preferred embodiments comprise nucleating agents.
    [004] JP 2010/270308 describes thermoplastic compositions based on polyamide 5X and other polymers which are electrically conductive. The other polymers used as a mixing component are polyolefins (copolyamide 6I / 6T is actually listed under test 9 in the experimental part, however, a mixture with PA 5X is not described).
    [005] JP 2004075932 A2 refers to high molecular weight PA 56 polyamide and also to a production method suitable for this polyamide. Mixtures with other polyamides are not mentioned.
    [006] The document US 2130948 mentions, in Table 1, the polyamide PA 56 and also a series of other homopolyamides based on pentanediamine.
    [007] US 2011/0020628 A1 refers to fibers made from PA 56 and their production.
    [008] US 2009/0099318 A1 describes copolyamides PA 56/6 (97-75 / 3-25 mol%).
    [009] EP 2687555 A1 refers to copolyamides PA 56/66; in Tables 2 and 3, PA 56 is mentioned. In Table 3, with comparative examples 12 and 13, molding compounds reinforced with 50% glass fibers with a PA 56 matrix are processed.
    [010] EP 1 757636 A1 describes copolyamides PA 56/66 (95-5 / 5-95), PA 56 being listed for reference.
    [011] However, such polyamide molding compounds still have a considerable tendency to contract.
    [012] Therefore, the aim of the present invention is to further improve the polyamides which are known from the state of the art and derived from cadaverine in relation to their high tendency for contraction and differential contraction, so that molded articles essentially stable dimensionally, low distortion or distortion-free can be produced from them.
    [013] The objective is achieved, in relation to the polyamide molding compound, by the characteristics of patent claim 1, by a molded article that has the characteristics of patent claim 17 and also, in relation to the purposes of use, by the characteristics of patent claim 18. Preferred embodiments are mentioned in the dependent patent claims.
    [014] The invention, therefore, relates to a polyamide molding compound which comprises or consists of a mixture of: a) 50 to 90 parts by weight of at least one polyamide obtainable by means of polycondensation of 1,5-pentanediamine or a mixture of at least two diamines, the 1,5-pentanediamine constituting at least 70 mol% of the mixture, with at least one dicarboxylic acid with 4 to 36, preferably 6 to 18 and, particularly preferably, 6 to 12 carbon atoms or a mixture of at least two dicarboxylic acids with 4 to 36, preferably 6 to 18 and, particularly preferably, 6 to 12 carbon atoms, and also b) 10 to 50 parts by weight of hair minus a partially aromatic polyamide, components a) and b) adding up to 100 parts by weight.
    [015] In addition to the components a) and b) mentioned, the polyamide molding compound comprises 10 to 250 parts by weight of fibers as component c). The fiber content, therefore, adds up to 100 parts by weight, which constitute components a) and b).
    [016] The polyamide molding compound according to the invention can comprise the components a) to c) mentioned, so that also other compounds, components or constituents can be included in the polyamide molding compound.
    [017] In the same way, however, it is possible that the polyamide molding compound consists of components a) to c), so that no other compounds or compounds, components or constituents are contained.
    [018] In addition, polyamide molding compounds can comprise 0 to 100 parts by weight of at least one additive (component d)). Likewise, the invention establishes that, for example, exclusively a single additive or a limited number of special additives are included in the molding compound. It is also possible that, in addition to at least one additive d) or exclusively an additive or a limited number of special additives, no other compound, component or constituent is included in the polyamide molding compound so that, in this case, the compound of Polyamide molding consists of components a) to d).
    [019] Alternatively or in addition to the aforementioned embodiment, it is also possible that the polyamide molding compounds according to the invention comprise from 0 to 100 parts by weight of at least one polymer (component e)), which is different from a) and b). In this way, it is also possible for the polyamide molding compounds to be formed, that is, they consist of components a) to c) and e) or components a) to e), the previous definition being adopted for the understanding of component c).
    [020] A embodiment in which the polyamide molding compounds according to the invention are formed from components a) to c) and also d) and / or e) is particularly preferred.
    [021] Molding compounds of the prior art have, in relation to the molding components according to the invention, a differential contraction that is greater by at least 20% if a similar reinforcement (fiber type, concentration) forms the base molding compounds. In this way, it is understood by differential contraction the difference between the contraction by transverse linear injection and longitudinally in relation to the injection direction. Contraction by linear injection is determined longitudinally / transversely according to ISO 2944, on a sheet, type D2, 60 x 60 x 2 mm (according to ISO 294-3). The leaves are stored, before measurement, for 24 hours (24 h) at 23 ° C in a dry atmosphere, that is, on silica gel, or for 14 days (14 d) under normal ambient conditions (23 ° C, relative humidity of 50%). The shrinkage to processing was determined longitudinally and transversely in relation to the flow direction of the injection molding compound melt during injection molding in relation to the size of the mold cavity. The arithmetic mean of the measurements on 5 sheets is indicated.
    [022] Polyamide a) therefore comprises, as a diaminic component, a component derived from 1,5-pentanediamine. Preferably, the diamine component of polyamide a) is thus formed from up to 100% pentanediamine.
    [023] Other diamines which may be included, in addition to 1,5-pentadiamine, in the polyamide a) are selected from the group consisting of 1,4-butanediamine, 2-methyl-1,5-pentanediamine, 2-butyl- 2-ethyl-1,5-pentanediamine, 1,6-hexanediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1,8-octanediamine, 2-methyl-1,8- octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11- undecanediamine, 1,12-dodecanediamine, 1,13-tridecanediamine, 1,14-tetradecanediamine, 1,3-bis (aminomethyl) cyclohexane, bis (4-amino-3-methyl-cyclohexyl) methane, bis-4-amino-cyclohexyl) methane, bis (4-amino-3-ethyl-cyclohexyl) methane, bis (4-amino- 3,5-dimethyl-cyclohexyl) methane, 2,6-norbornanediamine, 2,6-bis (aminomethyl) norbornane, 1,3-cyclohexanediamine, 1,4-cyclohexanediamine, isophoronadiamine, m-xylylenediamine and p-xylylenediamine, 1,6-hexanediamine and 1,10-decanediamine being particularly preferred.
    [024] Polyamide a) can be produced from the following dicarboxylic acids: adipic acid, submeric acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanoic acid, hexadecanic acid octadecanedioic acid, C36-fatty acid dimer, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, cis- and / or trans-cyclohexane-1,4-dicarboxylic and / or cis- and / or trans-cyclohexane-1 , 3-dicarboxylic (CHDA) and mixtures thereof.
    [025] Component a) thus consists of at least half of the parts by weight of the polyamide mixture of a) and b). Components a) and b) add up to 100 parts by weight. There is a possibility that the polyamide molding compound is formed only from polyamides a) and b). However, the possibility is also provided that the polyamide molding compound also includes other components, in addition to polyamides a) and b).
    [026] According to a preferred embodiment, the dicarboxylic acid is an aliphatic dicarboxylic acid with 6 to 18, in particular, with 6 to 12 carbon atoms, preferably a linear aliphatic dicarboxylic acid with 6 to 18, in particular, with 6 to 12 carbon atoms, particularly preferably, a linear aliphatic dicarboxylic acid with 6, 8, 10 or 12 carbon atoms. Consequently, in particular, dicarboxylic acids, adipic acid, submeric acid, sebacic acid and dodecanoic acid are preferred.
    [027] In particular, preferably, exclusively 1,5-pentanediamine is used as a component of diamine, in addition to the dicarboxylic acids mentioned above, for polycondensation, ie polyamide a) is derived only from 1,5-pentanediamine, in relation to the diamine component.
    [028] According to an alternative modality, however, it is also possible that, in addition to 1,5-pentanediamine, also at least one other diamine is present, which is used in the mixture with 1,5-pentanediamine for polycondensation for the reaction. In this case, it is advantageous if the proportion of 1,5-pentanediamine in the mixture of at least two diamines is at least 80 mol% and 99 mol%, preferably at least 90 mol% and 95 mol%.
    [029] In particular, it is preferred if polyamide a) is a 5X polyamide, "5" representing 1,5-pentanediamine and "X" being a linear aliphatic dicarboxylic acid with 4-12 carbon atoms. For particular preference, polyamide a) is selected from polyamide 56, polyamide 58, polyamide 510 or 512. Both only a single of the aforementioned polyamides can thus be contained in the molding compound or mixtures of 2 or more of the polyamides previously mentioned.
    [030] Preferably partially aromatic polyamides b) are thus, for example, polyamide 5I, polyamide 6I, polyamide DI, polyamide 5I / T5, polyamide 6I / 6T, polyamide DI / DT, polyamide 5I / T5 / 6I / 6T, polyamide 5I / T5 / DI / DT, polyamide 6I / 6T / DI / DT and also mixtures, blends or combinations thereof. "D" here means 2-methylpentane-1,5-diamine. Polyamide 6I / 6T and polyamide 5I / T5, in particular polyamide 6I / 6T, are particularly preferred.
    [031] In the case of at least one partially aromatic polyamide b), it is preferred that the molar ratio of isophthalic acid to the sum of isophthalic acid and terephthalic acid is 50 to 100 mol%, preferably 60 to 80% in mol, particularly preferably from 65 to 75 mol%. A ratio of I / (I + T) = 100%, this means that exclusively isophthalic acid is used in the corresponding polyamide b). Also included here is the possibility that only a single polyamide b) is included in the molding compound. Likewise, it is conceivable that two different polyamides b), for example, two different 6I / 6T polyamides with different mixing ratios than the proportions of 6I / 6T units, are included in the molding compound. Also, the possibility of using a plurality of chemically different polyamides b), for example, mixtures of polyamide 6I / 6T and polyamide 5I / T5, is conceivable.
    [032] Preferred relative viscosities of polyamide or polyamides a) are therefore in the range of 1.5 to 3.0, preferably 1.6 to 2.4, particularly preferably 1.65 to 1.95.
    [033] Alternatively or in addition to the same, it is also advantageous if the polyamide or polyamides b) have a relative viscosity of 1.40 to 2.20, preferably from 1.45 to 1.75.
    [034] The determination of the relative viscosity of polyamides a) and b) is therefore carried out according to DIN EN ISO 307 in solutions of 0.5 g of polymer dissolved in 100 ml of m-cresol at a temperature of 20 ° C. The granulate is used as a sample.
    [035] Another embodiment of the present invention provides that the polyamide molding compound according to the invention preferably comprises, in addition, with respect to 100 parts by weight of the polyamide mixture a) and b), 20 to 180 parts by weight of fibers, in particular fibers, or the molding compound consists of them, possibly also exclusively the components d) and / or e) mentioned above being able to be contained or not.
    [036] The preferred fibers are thus c) selected from the group consisting of glass fibers, carbon fibers, metallic fibers, aramid fibers and also mixtures or combinations thereof.
    [037] In particular, glass fibers are particularly preferred components of the polyamide molding compound.
    [038] Preferably, the fibers are therefore glass fibers with a circular cross section (round glass fibers) or glass fibers with a non-circular cross section (flat glass fibers). The present invention also comprises embodiments in which both types of glass fibers, i.e. glass fibers with a circular cross section and glass fibers with a non-circular cross section, are included in the polyamide molding compound.
    [039] Preferably, glass fibers (that is, both glass fibers with a circular cross section and glass fibers with a non-circular cross section) are short fibers. Preferred modalities of short fibers establish that the glass fibers are present as cut glass, the length of the cut glass is, therefore, from 0.2 to 20 mm.
    [040] Alternatively and preferably, in the same way, glass fibers can also be present as endless fibers, such endless fibers also being described technically as wicks. Also conceivable are modalities in which both endless fibers and short fibers are contained.
    [041] In particular, glass fibers represent E-glass fibers. Such E-glass fibers are defined according to the ASTM D578-00 standard. This definition is also adopted for the purposes of the present invention. These E-glass fibers have, in particular, a non-circular cross-section, the dimensional ratio of the main cross-sectional axis to the secondary cross-sectional axis which is at a right angle to it and is preferably more than 2.5 , more preferably being in the range of 2.5 to 6, in particular, in the range of 3 to 5.
    [042] Glass fibers with a circular cross section preferably have a diameter of 5 to 20 μm, preferably 5-15 μm, particularly preferably 5 to 10 μm.
    [043] Glass fibers with a non-circular cross section (flat glass fibers) preferably have a dimension of the main cross sectional axis in the range of 10 to 35 μm, in particular, in the range of 18 to 32 μm, and a length of the secondary cross-sectional axis in the range of 3 to 15 μm, in particular, in the range of 4 to 10 μm.
    [044] Furthermore, it is preferred that the polyamide molding compound according to the invention further comprises 0.1 to 100 parts by weight, preferably 0.5 to 70 parts by weight and, particularly preferably , 1-30 parts by weight of at least one additive d) or - in the sense of the definition given above - consists of the same.
    [045] In particular, this additive may therefore refer to tangled filaments, talc, mica, silicates, quartz, titanium dioxide, volastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, earth or precipitated calcium carbonate, lime, feldspar, barium sulphate, permanent or magnetizable metals or magnetic alloys, glass spheres, hollow glass spheres, hollow sphere silicate filling materials, natural layered silicates, synthetic layered silicates, stabilizers inorganic, organic stabilizers, lubricants, dyes, metallic pigments, metallic embellishments, metal-coated particles, halogen-free flame retardants, halogen-free flame retardants, impact resistance modifiers, antistatic agents, conductivity additives, in particular, black carbon and / or carbon nanotubes, mold release agents, optical brighteners or mixtures thereof.
    [046] Alternatively or in addition to this, it is also possible that the polyamide molding compound according to the invention further comprises 0.1 to 100 parts by weight, preferably 0.5 to 70 parts by weight and , particularly preferably, 1-30 parts by weight of at least one other polymer e) which is different from polymers a) and b). In the sense of the definition given above, the polyamide molding compound can also be formed from components a) to d).
    [047] The polymer e) preferably refers to a thermoplastic material selected from the following group:
    [048] Polyamide (other than a) and b)), polycarbonate, polyphenylene ether, polystyrene, polymethylmethacrylate, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, polyolefin, polyoxymethylene, polyester, in particular, tere polybutylene terephthalate, polysulfone (in particular, type PSU, PESU, PPSU), polyphenylene sulphide, crystalline-liquid polymers, polyether ketone, polyether ether ketone, polyimide, polyester amide, polyether ester amide, polyamide imide, polyester imide , polyether amide, polyurethane (in particular, of the type TPU, PUR), polysiloxane, polyacrylate, polymethacrylate and also mixtures or copolymers based on such systems.
    [049] In order to allow a particularly low differential contraction of the molding compound according to the invention, it is preferred, in particular, if the polyamide molding compound does not comprise any polymer other than a) and b), i.e. , is free of polymer e).
    [050] In addition, the invention relates to a molded article that can be produced from or is formed from a previously defined molding compound. Preferred molded items are therefore molded automotive parts, mobile phone housings and electrical cable wraps.
    [051] Molded articles produced from the molding compounds according to the invention are used for the production of internal and external parts, preferably with a load-bearing or mechanical function in the field of electrical, electronics, furniture, sports, hygiene, medicine, power and propulsion technology, automobiles and other means of transport or accommodation material, structure or load support for telecommunications utensils and devices (eg mobile phone), consumer electronics, personal computers, tablets , phablets, appliances, mechanical engineering, heating field or fixing parts for installations or for containers and fan parts of all types. Possible applications for the molded articles produced from the molding compounds according to the invention can be mentioned, above all, the substitution field for foundry metals in which extremely high stiffness is expected in combination with good strength.
    [052] The invention further relates to the use of the molding compound for the production of the aforementioned molded articles.
    [053] The present invention is further described with reference to the examples subsequently indicated, without restricting the invention to the preferred embodiments. The test results are compiled in the subsequent tables.
    [054] The meanings in the tables are: GF: Polyamide molding compounds comprise 50% by weight of glass fibers with a round cross section (cut glass fibers Vetrotex 995 made of E-glass, with a length of 4, 5 mm and a diameter of 10 μm (circular cross section), manufacturer: Owens Corning Fiberglass) XGF: Polyamide molding compounds comprise 50% by weight of glass fibers with a non-circular cross section (flat cross section) (Nittobo CSG3PA-820, length 3 mm, width 28 μm, thickness 7 μm, ratio of axes of the transverse axes = 4, Nittobo, Japan (flat glass fibers)) Longitudinally: The distortion was measured in the direction of injection molding of the cross-shaped part: The distortion was measured in a 90 ° direction in relation to the injection molding direction 24 h: The investigated samples were stored before measurement for 24 hours (24 h) at 23 ° C in a dry environment, that is, on silica gel lica 14 d NC: The investigated samples were stored prior to measurement for 14 days (14 d) under normal ambient conditions (23 ° C, 50% relative humidity)
    [055] In subsequent tests, the following components were used: PA 66:
    [056] Polyamide PA 66 is a polycondensation product made from 1,6-hexanediamine and adipic acid; Radipol A45, viscosity of nrel solution = 1.86, melting point Tm = 260 ° C, RADICI, Italy. PA 56:
    [057] Polyamide 56 is a polycondensation product made from 1,5-pentanediamine and adipic acid; Terryl 56, relative viscosity nrel = 1.88, melting point Tm = 254 ° C, Cathay, China. PA 410:
    [058] Polyamide PA 410 is a polycondensation product made of 1,4-butanediamine and sebacic acid, relative viscosity nrel = 2.01, melting point Tm = 250 ° C. PA 510:
    [059] Polyamide PA 510 is a polycondensation product made from 1,5-pentanediamine and sebacic acid; Terryl 510, relative viscosity nrei = 1.98, melting point Tm = 218 ° C, Cathay China. Polyamide PA 6I / 6T:
    [060] Polyamide 6I / 6T is a polycondensation product of 1,6-hexanediamine, isophthalic acid and terephthalic acid with a molar ratio of isophthalic acid / terephthalic acid = 2: 1, relative viscosity nrel = 1.52, transition temperature glass Tg = 125 ° C.
    [061] From the aliphatic polyamides mentioned above (PA 66, PA 56, PA 410 and PA 510), partially aromatic polyamide PA 6I / 6T and glass fibers, compounds reinforced, respectively, with 50% by weight of fibers glass, in which polyamides a) and b) are present in the proportion of 3: 1, were produced and investigated in relation to their mechanical properties. For this purpose, the components indicated in tables 1 to 3 were composed in the concentrations mentioned above in a twin screw extruder from the company Werner and Pfleiderer with a screw diameter of 25 mm with the prescribed process parameters (cylinder temperatures: elevation of 250 to 280 ° C; rotation speed: 250 rpm; productivity: 12 kg / h). The polyamide granules were, therefore, dosed in the feeding area, while the glass fibers were dosed through a side feeder with 3 housing units in front of the nozzle in the polymeric melt. The compounds were stripped off from a nozzle with a diameter of 3 mm and granulated after cooling with water. The granulate was dried for 24 hours at 110 ° C in a vacuum of 30 mbar. The compounds were then injected with an Arburg Allrounder 320-210-750 injection molding machine to form test pieces at cylinder temperatures of 290 to 310 ° C and a mold temperature of 120 ° C (sheets, type D2, 60 x 60 x 60 x 2 mm) or injected at 100 ° C (remaining test pieces).
    [062] The measurements were implemented according to the following standards and on the following specimens:
    [063] Unless otherwise specified, the specimens are used in the dry state, that is, after injection molding, they are stored for at least 24 h at room temperature in a dry environment, that is, on silica gel.
    [064] The thermal behavior (melting point Tm), melting enthalpy (ΔHm), glass transition temperature (Tg)) was determined on the granulate using ISO 11357-1 / -2. Differential Scanning Calorimetry - DSC was implemented at a heating rate of 20 ° C / min.
    [065] The relative viscosity (nrel) was determined according to DIN EN ISO 307 in solutions of 0.5 g of polymer dissolved in 100 ml of m-cresol at a temperature of 20 ° C. The granulate is used as a sample.
    [066] Tensile elasticity module, tensile strength and elongation at break: Modulus of elasticity under tension, tensile strength and elongation at break were determined according to ISO 527 at a tensile speed of 1 mm / min ( modulus of elasticity under tension) or at a tensile speed of 5 mm / min (tensile strength, elongation at break) on the ISO tensile test bar, ISO / CD 3167, type IA, 170 x 20/10 x 4 mm at a temperature of 23 ° C.
    [067] Impact resistance and notched impact resistance according to Charpy were measured according to ISO 179 / keU on the ISO specimen, Standard ISO / CD 3167, Type B1, 80 x 10 x 4 mm in a temperature of 23 ° C.
    [068] The contraction to processing (longitudinal contraction / transverse or contraction by linear longitudinal injection / transverse) was determined according to ISO 294-4 on a sheet, type D2, 60 x 60 x 2 mm (according to ISO 294-3 standard). The sheets were produced with the composition and molding temperatures previously indicated. They were stored before measurement for 24 hours (24 h) at 23 ° C in a dry environment, that is, on silica gel, or for 14 days (14 d) under normal ambient conditions (23 ° C, relative humidity of 50%). The shrinkage to processing was determined longitudinally and transversely in relation to the flow direction of the injection molding compound melt during injection molding in relation to the size of the mold cavity. The arithmetic mean of the measurements on 5 sheets is indicated. The differential contraction is produced from the difference of the contraction across (contraction by linear injection across) and the longitudinal contraction (contraction by linear injection across).
    [069] The following measurement values were obtained with this: Table 1


    [070] As is evident from the tests, the mixtures according to the invention, which are based on polyamide 56 (E1a, E1b) or polyamide 510 (E2a, E2b), show significantly reduced values of contraction with mechanical properties of otherwise comparable. The distortion of such molded articles, consequently, appears to be significantly less, the dimensional stability of such molded articles is consequently improved. The differential shrinkage (24 h) for comparative examples CE1a and CE1b, in which PA 56 was replaced by PA 66, for reinforcement with glass fibers of round cross section (50% by weight) was above the values of the molding compound corresponding according to the invention based on the mixture of PA 56 and PA 6I / 6T in 40% (E1a) and, for reinforcement with glass fibers of flat cross section (50% by weight), in 43% (E1b) . The difference in differential contraction seems even more evident if, in the molding compound based on PA 410 / PA 6I / 6T (CE2a, CE2b), PA 410 is replaced by PA 510. Thus, the differential contraction (24 h) for CE2a is increased, compared to E2a, by 129% and, for CE2b compared to E2b, by 139%. Table 2

    [071] As is evident from Table 2, the addition of 6I / 6T polyamide to polyamide 56 causes a noticeable reduction in contraction, both longitudinally and transversely, in relation to the injection direction. For molding compounds with a matrix consisting of polyamide PA 56 (CE3a, CE3b), the result is a differential contraction (24 h) which is increased compared to the molding compound PA 56 / PA 6I / 6T according to with the invention, for the reinforcement with glass fibers of round cross section (50% by weight) in 20% (E3a) and, for the reinforcement with glass fibers of flat cross section (50% by weight), by 50% (E3b). Table 3

    [072] As is evident from Table 3, the addition of polyamide 6I / 6T to polyamide 510 (E4a, E4B) leads to a noticeable reduction in contraction, both longitudinally and transversely, in relation to the injection direction. For molding compounds with a matrix consisting of polyamide PA 510 (CE4a, CE4b), the result is a differential contraction (24 h) which is increased compared to the molding compound PA 510 / PA 6I / 6T according to with the invention, for reinforcement with glass fibers of round cross section (50% by weight) in 26% (E4a) and, for reinforcement with glass fibers of flat cross section (50% by weight), in 100% (E4B).
    [073] All measurement values given in Tables 2 and 3 were determined on samples that were stored, before measurement, at 23 ° C for 24 hours (24 h) in a dry environment, that is, on silica gel.
    权利要求:
    Claims (15)
    [0001]
    1. POLYAMIDE MOLDING COMPOUND, characterized by consisting of a mixture of: a) 50 to 90 parts by weight of at least one polyamide defined by the formula “5X”, where "5" is 1,5-pentanediamine and "X "is an aliphatic linear dicarboxylic acid with 4 to 12 carbon atoms, and b) 10 to 50 parts by weight of at least one partially aromatic polyamide selected from the group consisting of 6I polyamide, 5I / 5T polyamide, 6I / 6T polyamide and 5I polyamide / 5T / 6I / 6T, components a) and b) adding up to 100 parts by weight and the polyamide molding compound comprising, furthermore, with respect to 100 parts by weight of the polyamide mixture a) and b), c) 10 to 250 parts by weight of fibers, d) 0 to 100 parts by weight of at least one additive, and / or e) 0 to 100 parts by weight of at least one polymer which is different from a) and b).
    [0002]
    2. POLYAMIDE MOLDING COMPOUND according to claim 1, characterized in that at least one polyamide a) in particular is a polyamide 56, polyamide 58, polyamide 510 or 512.
    [0003]
    3. POLYAMIDE MOLDING COMPOUND according to any one of claims 1 to 2, characterized in that at least one partially aromatic polyamide b) is selected from the group consisting of polyamide 5I, polyamide 6I, polyamide DI, polyamide 5I / 5T, polyamide 6I / 6T, polyamide DI / DT, polyamide 5I / 5T / 6I / 6T, polyamide 5I / 5T / DI / DT, polyamide 6I / 6T / DI / DT and also mixtures or combinations thereof, polyamide 6I / 6T being particularly preferred and, "D" means 2-methylpentane-1,5-diamine.
    [0004]
    4. POLYAMIDE MOLDING COMPOUND, according to claim 3, characterized by the fact that the molar ratio of isophthalic acid to the sum of isophthalic acid and terephthalic acid is 50 to 100 mol%, preferably 60 to 80 mol%, particularly preferably 65 to 75 mol%.
    [0005]
    5. POLYAMIDE MOLDING COMPOUND, according to any one of the preceding claims, characterized in that: a) at least one polyamide a) has a relative viscosity determined according to DIN EN ISO 307 in solutions of 0.5 g of polymer dissolved in 100 ml of m-cresol at a temperature of 20 ° C, from 1.5 to 3.0, preferably from 1.6 to 2.4, particularly preferably from 1.65 to 1, 95, and / or b) at least one polyamide b) have a relative viscosity measured according to DIN EN ISO 307 in solutions of 0.5 g of polymer dissolved in 100 ml of m-cresol at a temperature of 20 ° C, from 1.40 to 2.20, preferably from 1.45 to 1.75.
    [0006]
    6. POLYAMIDE MOLDING COMPOUND according to any one of the preceding claims, characterized in that the polyamide molding compound comprises 20 to 180 parts by weight of fibers or consists of them.
    [0007]
    7. POLYAMIDE MOLDING COMPOUND, according to any one of the preceding claims, characterized by the fact that the fibers are selected from the group consisting of glass fibers, carbon fibers, metallic fibers, aramid fibers and also mixtures or combinations thereof.
    [0008]
    8. POLYAMIDE MOLDING COMPOUND, according to claim 7, characterized in that the glass fibers are selected from the group consisting of glass fibers with a circular cross section and also glass fibers with a non-circular cross section, the glass fibers are preferably present in the form of short fibers, particularly preferably in the form of cut glass, with a length in the range of 0.2-20 mm or in the form of continuous fibers (wicks).
    [0009]
    9. POLYAMIDE MOLDING COMPOUND, according to either of the two previous claims, characterized by the fact that the glass fibers are E-glass fibers (according to the ASTM D578-00 standard) with a non-circular cross section , the dimensional proportion of the main cross-sectional axis to the secondary cross-sectional axis, which is at a right angle to it, preferably being more than 2.5, even more preferably in the range of 2.5 to 6, in particular, in the range of 3 to 5.
    [0010]
    10. POLYAMIDE MOLDING COMPOUND, according to any of claims 8 and 9, characterized in that the glass fibers with a circular cross section have a diameter of 5 to 20 μ m, preferably 5-15 μ m, particularly preferably, from 5 to 10 μ m or where the non-circular glass fibers have a dimension of the main transverse sectional axis, preferably in the range of 10 to 35 μ m, in particular, in the range of 18 to 32 μ m, and the dimensioning of the secondary cross sectional axis is in the range of 3 to 15 μ m, in particular, in the range of 4 to 10 μ m.
    [0011]
    11. POLYAMIDE MOLDING COMPOUND according to any one of the preceding claims, characterized in that the polyamide molding compound comprises 0.1 to 100 parts by weight, preferably 0.5 to 70 parts by weight, particularly preferably, 1 to 30 parts by weight of at least one additive.
    [0012]
    12. POLYAMIDE MOLDING COMPOUND, according to claim 11, characterized in that the at least one additive is selected from the group consisting of tangled filaments, talc, mica, silicates, quartz, titanium dioxide, volastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, earth or precipitated calcium carbonate, lime, feldspar, barium sulphate, permanent or magnetizable metals or magnetic alloys, glass spheres, hollow glass spheres, silicate filling materials hollow-ball, natural layered silicates, synthetic layered silicates, inorganic stabilizers, organic stabilizers, lubricants, dyes, metal pigments, metal trimmings, metal-coated particles, halogen-containing flame retardants, halogen-free flame retardants, impact resistance, antistatic agents, conductivity additives, in particular carbon black and / or carbon nanotubes carbon, mold release agents, optical brighteners or mixtures thereof.
    [0013]
    13. POLYAMIDE MOLDING COMPOUND according to any one of the preceding claims, characterized in that the polyamide molding compound comprises 0.1 to 100 parts by weight, preferably 0.5 to 70 parts by weight, particularly preferably, 1 to 30 parts by weight of at least one polymer which is different from or a) and b) or consists of the same.
    [0014]
    14. POLYAMIDE MOLDING COMPOUND, according to claim 13, characterized by the fact that at least one polymer d) which is different from a) and b) is a thermoplastic material selected from the group consisting of polyamide ( other than a) and b)), polycarbonate, poly (phenylene ether), polystyrene, polymethylmethacrylate, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, polyolefin, polyoxymethylene, polyester, in particular, poly (ethylene terephthalate) , poly (butylene terephthalate), polysulfone (in particular, type PSU, PESU, PPSU), poly (phenylene sulphide), crystalline-liquid polymers, polyether ketone, polyether ether ketone, polyimide, polyester amide, polyether ester amide, polyamide imide, polyester imide, polyether amide, polyurethane (in particular, of the type TPU, PUR), polysiloxane, polyacrylate, polymethacrylate and also mixtures or copolymers based on such systems.
    [0015]
    15. MOLDED ARTICLE FORMED FROM A MOLDING COMPOSITE as defined in any one of the preceding claims, characterized by the fact that it is, in particular, in the form of internal and external parts, preferably with a load-bearing or mechanical function in the field of electrical, electronics, furniture, sports, mechanical engineering, health and hygiene, medicine, power and propulsion technology, automobiles and other means of transport or accommodation material, structure or load support for telecommunications utensils and appliances (for example, example, mobile phone), consumer electronics, personal computers, tablets, phablets, appliances, mechanical engineering, heating field or fixing parts for installations or containers and fan parts of all types or electrical cable wraps.
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    同族专利:
    公开号 | 公开日
    MX2015015608A|2016-07-15|
    EP3020746A1|2016-05-18|
    EP3020746B1|2020-08-26|
    CN105585841A|2016-05-18|
    BR102015028401A2|2016-09-27|
    KR20160056301A|2016-05-19|
    US10233326B2|2019-03-19|
    US20160130439A1|2016-05-12|
    JP2016094601A|2016-05-26|
    JP6782069B2|2020-11-11|
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    法律状态:
    2016-09-27| B03A| Publication of an application: publication of a patent application or of a certificate of addition of invention|
    2018-10-23| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|
    2020-01-07| B06U| Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure|
    2020-06-23| B06A| Notification to applicant to reply to the report for non-patentability or inadequacy of the application according art. 36 industrial patent law|
    2020-12-15| B09A| Decision: intention to grant|
    2021-02-23| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/11/2015, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    EP14192659|2014-11-11|
    EP14192659.2|2014-11-11|
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