• 专利附录
  • 专利说明
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  • 类似技术
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    • 专利摘要:
    PARTICULAR MATTER IMPACT SENSOR. A particulate matter impact sensor (301) is disclosed to detect particle impacts (106) comprising: a support layer (302); and a layer of sensor media (300) disposed in front of the support layer (302).
    公开号:BR102015017370B1
    申请号:R102015017370-9
    申请日:2015-07-21
    公开日:2020-11-03
    发明作者:James J. Phelan；Lutz Bischoff；Dohn W. Pheiffer
    申请人:Deere & Company；
    IPC主号:
    专利说明:

    Field of the Invention
    [001] The invention relates to particulate matter impact sensors. More particularly, it refers to grain impact sensors for agricultural harvesters. Fundamentals of the Invention
    [002] Agricultural harvesters, such as combined, separate harvest plants from the soil, thresh the harvest plants, separate the grain from the rest of the harvest plants, deposit the rest of the harvest plants (MOG) in the soil and store the grain in a grain reservoir or tank. Periodically, the grain in the grain reservoir is unloaded on a cart or truck that moves along the agricultural harvester and is carried away for storage.
    [003] There are several mechanisms inside the agricultural harvester that are used to separate the grain from the MOG. To ensure its proper definitions and operation, the performance of several subsystems must be monitored. One way of monitoring the performance of these agricultural harvester subsystems is by determining how many grains pass through mechanisms in particular in the agricultural harvester.
    [004] One way of monitoring the grain passage is by using a particulate matter impact sensor. These impact sensors are typically called "grain sensors" or "grain loss sensors". These types of sensors are configured to perceive the impact of a heartwood in a fall of grain on a sensor surface and to convert this impact into an electrical signal. This raw electrical signal is then processed and transmitted to an ECU for further use.
    [005] This use can be as simple as displaying the amount (or relative amount) of grain that impacts the sensor. With this information only, an operator, based on his experience, can adjust the machine manually to improve performance. Alternatively, use can be simple or complex, such as by using the signal to automatically adjust the operating settings of various internal mechanisms of the agricultural harvester.
    [006] A common grain loss sensor design in agricultural harvesters comprises a flat, generally rectangular impact plate, to which a sensor element is attached to the rear side of the impact plate. The grain impacts the front side of the impact plate, causing the impact plate to flex.
    [007] A sensor element (typically a piezoelectric sensor element in the form of a thin layer) is attached to the rear side of the plate. When the plate flexes, it causes the sensor element on the back side of the plate to flex in a similar manner. The sensor element, in turn, is coupled to sensor circuits that receive tiny electrical signals from these flexions. The sensor circuits amplify and filter these signals, and convert them into a form that is usable by a digital microprocessor.
    [008] The design of the common grain loss sensor suffers from several defects. Some of these defects are due to the characteristics of the piezoelectric sensor element itself, and some of these are due to the inhomogeneity of the general design.
    [009] Piezoelectric sensor elements assembled as described generate tiny electrical signals based on the gross curvature of the sensor element instead of the curvature located at the point of impact of the grain core on the impact plate. The impact plate is typically made of relatively rigid material, such as fiber-reinforced plastic, aluminum or steel, which is a few millimeters thick. The grain heartwood perhaps contacts an area of 10 mm2 of the impact plate. The impact plate, due to its rigidity, however, does not flex locally in response to the impact. Instead, each grain impact substantially causes the entire impact plate to curve inward at an infinitesimal distance, causing an extremely small curvature of the impact plate. Previous-grade grain loss sensors
    [0010] An example of an arrangement of the prior technology can be seen in figures 1-2, whose dynamic response is discussed below.
    [0011] In figure 1, a flat metal housing or box 100 is attached to an impact plate 102. Impact plate 102 has an outer surface 104 against which harvest grains, such as soybeans 106, corn heartwood 108 and wheat, 110 impact. It has an inner surface 112 to which a piezoelectric sensor element 114 is connected. A signal conditioning circuit 116 is fixed to the sensor element 114. A signal conductor 118 is attached to the signal conditioning circuit to provide it with electrical energy and to get conditioned signals back. These signals are received by an ECU / DSP for further processing and use.
    [0012] The impact plate 102 is fixed, at its edges, at the edges of the shallow metal housing 100. It can be fixed with mechanical fasteners 120, such as rivets, cylindrical screws, conical screws, etc. ., or an adhesive 122. The edges of the impact plate 102 are therefore restricted in their movements by being fixed and / or coupled to the edges of the shallow metal housing 100.
    [0013] Impact plate 102 is homogeneous in construction, in which it has a constant thickness and material characteristics constant substantially over the entire length.
    [0014] The impact plate 102 is large, compared to the size of the seeds it contacts. Impact plate 102 typically ranges from 75 mm x 75 mm to 125 mm x 250 mm.
    [0015] The sensor element 114 does not extend over the entire internal surface of the impact plate 102. Grain can contact the impact plate 102 at any of the locations 124, for example, which are arranged away from the sensor element 114. A In order to communicate this impact to the sensor element 114 itself, the entire impact plate 102 must flex in response.
    [0016] To illustrate this effect, an exaggerated view of this flexion in response is shown in figures 3-5.
    [0017] In figure 3, the seed 106 is approaching the impact plate 102 at a "V" speed. The seed approaches the impact plate 102 in the center of the plate, equidistant from all edges of the plate. impact 102 has sensor element 114 attached to its internal surface 112. The edges of housing 100 that support the edges of impact plate 102 are shown schematically as soil symbols. They are fixed and stationary.
    [0018] In figure 4, the seed 106 has just contacted the impact plate 102. Given the deformation of the typical seed at a "V" speed, the contact area is approximately 2 mm x 2 mm.
    [0019] In figure 5, the seed 106 transferred all its kinetic energy to the impact plate 102 and decelerated to a stop. The impact plate 102 stored the kinetic energy of the seed 106 by elastic deformation. Impact plate 102 flexed inward, becoming concave on its outer surface 104 and convex on its inner surface 112.
    [0020] In figure 5, the impact plate 102 flexed inward in a "D" amount. This flexion into the impact plate 102 caused the corresponding and substantially equal flexion of the sensor element 114. Since the sensor element 114 is arranged at the back of the impact plate 102, it is stretched in an "X" direction which is , in general, parallel to the plane of the sensor element 114. It is also flexed in a similar concave shape as the impact plate 102 as it is attached to the internal surface 112 of the impact plate 102. This stretching and this flexing of the sensor element 114 have substantially full effects on the area of the sensor element 114.
    [0021] In figure 6, the energy stored in the impact plate 102 and in the sensor element 114 was released and the seed 106 was propelled in the reverse direction. The impact plate 102 returned to its initial position (in this case, in general, flat), as well as the sensor element 114. The electrical signal that was produced by the flexion of the sensor element 114 disappeared since the sensor element 114 returned to its shape initial and tensioned.
    [0022] In figure 7, the impact plate 102 and the sensor element 114 continue to move in the reverse direction until both have reached a convex configuration. In order to obtain a quick response, the loss sensors are under-damped, which allows them to oscillate in convex> concave> convex> concave as the energy inserted by the seed 106 dissipates. As this oscillation occurs, the signal from sensor element 114 continues. This "resonance" of the sensor occurs at a relatively low natural frequency, often taking 10 or 15 ms to decay. In a super-cushioned sensor array, seed 106 will bounce off the outer (concave) surface 104 (figure 5) and the impact plate 102 and sensor element 114 will gradually return to its flat position (as shown in figure 6) without reach the convex position shown in figure 7. In this situation, the gradual return of the sensor element 114 to its initial flat shape will cause a gradual difference in the signal produced by the sensor element 114. As in the case of the under-damped system, this gradual signal difference can take 5 to 10 ms.
    [0023] The decay of 5 to 10 ms of the signal from the sensor element 114 was determined according to its general size, mass and stiffness. Inhomogeneity of the Sensor Signal
    [0024] The description described illustrates the ideal situation in which a seed 106 impacts the center of the impact plate 102, causing equal deflection of the impact plate 102 and the sensor element 114 in all directions. Given the symmetry in all directions around the central contact point of the seed 106 against the impact plate, the physical characteristics of the impact plate 102 and the sensor element 114 command that the response will, in general, be shown in figures 3- 7.
    [0025] However, in the real world, substantially the integrity of the outer surface 104 of the impact plate 102 can be impacted by the seed 106. When an off-center impact occurs by the seed 106, the characteristics of the resulting signal change in unpredictable ways. An impact off the center of the seed 106 against the impact plate 102 is illustrated in figures 8-10.
    [0026] In figure 8, for example, a seed 106 approaches the impact plate 102 in a position that is off center and adjacent to the edge of the impact plate 102. Impact plate 102 is supported on all sides by the housing 100. As in the examples in figures 3-7, housing 100 is represented as a soil symbol for convenience of illustration.
    [0027] In figure 9, the seed 106 contacted the impact plate 102 and deflected it inwards in the region surrounding the impact point. Since the impact point is off-center and immediately adjacent to the housing 100 that supports the impact plate 102, the movement of the impact plate is restricted. The impact plate 102 can no longer flex symmetrically across substantially the entire surface. Instead, as the energy of the seed 108 is absorbed by the impact plate 102, the impact plate 102 is deflected in a second oscillation mode in which a portion 200 of the plate adjacent to the seed 106 is flexed in a concave shape , and a portion 202 of the impact plate 102 away from the seed 106 is flexed in a convex shape. Similannente, the sensor element 114, which is arranged in a central region of the impact plate (102) reproduces a similar convex / concave flexion.
    [0028] The distance "D" of the concave flexion is less than the distance "D" of the concave flexion for a central impact (see figure 5), since the seed impacted the impact plate 102 adjacent to the fixed support (ie , the edge of the impact plate 102 on which it is rigidly fixed in the shallow housing 100). Since the distance "D" is reduced for a seed impact adjacent to an edge of the impact plate 102, compared to a seed impact in the center of the impact plate 102, the sensor element 114 flexes much less and therefore generates a much smaller electrical signal for impacts adjacent to the edge. This change in signal amplitude based on the position of the seed impact on the surface of the impact plate 102 makes it difficult to condition the signal properly.
    [0029] The signal problem is additionally complicated since the sensor element generates a signal related to its degree of stretching and its flexion. The 204 part of the sensor element 114 adjacent to the seed is under tension - it is stretched. However, part 206 of sensor element 114 on the other side of the grain loss sensor is compressed. The signal produced by the sensor element 114 is an average of the stress / compression effects across the entire surface area of the sensor element 114. Since the sensor element 114 is experiencing both a tension in one part 204 and a compression in another part 206, the electrical signal generated by the general sensor element 114 is further reduced, since these two areas generate opposite electrical signals that (in fact) cancel each other out.
    [0030] Figure 10 illustrates the oscillation of the impact plate 102 when the combination impact plate 102 plus sensor element 114 is sub-damped after the seed 106 is released. In a typical grain loss sensor of this design, the impact plate 102 can swing against and in favor between the two extreme positions illustrated in figure 10. In this case, the impact plate 102 + sensor element 114 will gradually return to the position shown in figure 8 as your energy is dissipated. This can take 5 to 10 ms.
    [0031] Alternatively, if the combination impact plate 102 plus sensor element 114 is super-cushioned, it will release the seed 106 in the position shown in figure 9 and relax to the generally flat position shown in figure 8. Depending on the degree of over-cushioning, this gradual return to the position shown in figure 9 can take 5 to 10 ms.
    [0032] An additional complication is the difference in vibrational frequencies generated by the impact of the seed in figures 3-7 and the impact of the seed 106 in figures 8-10. When the impact plate 102 oscillates in its primary mode (shown in figures 3-7), it has an oscillation frequency that is less than the oscillation frequency caused by the off-center seed impact shown in figures 8-10. This also adds complexity and difficulty in determining individual seed impacts.
    [0033] In the description described in relation to figures 3-10, only two different positions were illustrated in which the seed 106 can impact the impact plate 102. There are an infinite number of positions in which a seed can impact the impact plate 102 Additionally, the wave equation predicts that there are an infinite number of oscillation modes that can be generated by each impact, each oscillation mode having its own distinct (and different) frequency and its own distinct (and different) amplitude.
    [0034] The final complication in determining seed impacts on a grain loss sensor in this design is when several seeds make contact with the impact plate at many different locations on the impact plate in milliseconds relative to each other. Given the long decay time from a single seed impact (5-10 ms), it is virtually impossible to distinguish individual seed impacts when they are occurring faster than once every 20-30 ms or the like. There are many possible oscillation modes (based on the stroke location), there are many possible amplitudes (based on the stroke location) and there is a long decay time like this (due to the large mass of the sensor element 114 and the 102) that identifying and quantifying grain strokes with some precision is virtually impossible.
    [0035] One potential solution is to provide many more of these grain loss sensors and arrange them side by side, each of these grain loss sensors having a smaller impact plate. The costs of making this arrangement are high, however.
    [0036] Another potential solution is to have a single large impact plate 102, but connect multiple smaller sensor elements 114 in an arrangement at the back of the impact plate 102. This, too, will be quite costly. The number of electrical interconnections that should be made for each individual sensor would be prohibitive. In addition, each sensor will still generate a signal that was a composite of the effects of grain strikes across the sensor plate, since the oscillations of the impact plate 102 will still be communicated through the impact plate of the impact point to other adjacent regions of the impact plate 102. Separating spurious components of the signal from a sensor element 114 due to grain strikes in a distant part of the impact plate 102 would be virtually impossible. Finally, as the number of sensor elements 114 connected at the rear of the impact plate 102 increases, the size of each sensor element 114 will need to be correspondingly reduced. The reduced size of each sensor element 114 will cause a corresponding reduction in the amplitude of the signal which, thus, will make each sensor element 114 much less sensitive and much more subject to electrical and mechanical noise.
    [0037] What is needed, therefore, is a sensor array that is faster, has less noise, has a higher frequency response and / or has a lower dynamic mass. It is an objective of this invention to provide a sensor array like this. Detailed Description
    [0038] This unprecedented sensor array incorporates several inventions. This unprecedented sensor array has several different modalities.
    [0039] Figure 11 illustrates a first configuration of a particulate matter impact sensor 301 (for example, a grain loss sensor). In this arrangement, a layer of sensing media 300 is attached to a support layer 302. A sensor media layer 300 has a first surface 304 which faces the flow direction of the "F" grain. The sensor media layer 300 has a second surface 306 on the opposite side of the sensor media layer which faces away from the flow direction of the "F" grain. The second surface 306 is connected to a first surface 308 of the support layer 302. The first surface 308 of the support layer 302 faces the flow direction of the grain "F". The support layer 302 has a second surface 310 which faces away from the grain flow direction "F".
    [0040] The sensing media layer 300 is responsive to impacts by seeds 106 moving in the "F" direction of the grain flow. In response to impacts by seeds 106, the sensor media layer 300 produces an electrical signal at one or more electrical connections 312, 314. Electrical connections 312, 314 are electrically coupled to the sensor media layer 300.
    [0041] The function of the support layer 302 is to support the sensor media layer 300. A fixture is used to attach the support layer 302 to the sensor media layer 300. In an arrangement, the fixture comprises a adhesive disposed between the second surface 306 and the first surface 308. In another arrangement, the fixture comprises a frame extending around the periphery of the layer of sensing media. In another arrangement, the fastening device comprises a plurality of spaced mechanical fastening elements, such as conical thread screws, rivets, cylindrical thread screws, nuts and clamps extending between and / or through the support layer 302 and of the sensor media layer 300. In another arrangement, the support layer 302 and the sensor media layer 300 are integral with each other.
    [0042] Figure 12 illustrates a first configuration of the sensing media layer 300. In this arrangement, the sensing media layer 300 has an upper conductive layer 316, a lower conductive layer 318 and an impact-responsive layer 320.
    [0043] The upper conductive layer 316 conducts electricity to or from an impact-responsive layer surface 320 to electrical connection 314.
    [0044] The lower conductive layer 318 conducts electricity to or from an opposite surface of the impact-responsive layer 320 to electrical connection 312. Impact-responsive layer
    [0045] The impact responsive layer 320 comprises a pressure responsive medium that changes its electrical characteristics through the impact of the seed 106. The electrical characteristics can comprise a change in resistivity, a change in capacitance or a production of electricity caused by the impact of seed 106. These electrical characteristics are changed locally in the impact responsive layer 320 immediately adjacent to the seed impact site. Typical pressure-responsive media includes such things as electromechanical films, cellular polymers, polymer electrets, piezoelectric polymers, piezoelectric films and quasi piezoelectric films.
    [0046] In a particular arrangement, the impact responsive layer 320 comprises a sensing media in cellular polymer. This material is formed as a thin sheet of polypropylene that has a cellular structure. This material is manufactured by stretching a polypropylene preform in the longitudinal and transverse directions. The stretched sheet is then loaded by a corona discharge method. The stretched sheet comprises complete tiny gas voids or "cells" that extend in a longitudinal and transverse direction. These cells are separated from each other by layers of sheet-like polypropylene. The cells can be compared with large electrical dipoles that are easily compressed in a direction of thickness by an externally applied force. The change in thickness at the compression site (in our case, the impact location of the seed 106) modifies the dimensions of the dipoles that generate a corresponding electrical charge.
    [0047] The biaxial stretching and cellular nature of the material causes the cellular polymer media to respond to the compression of the media in a direction normal to the flat extent of the media. Advantageously, this also makes the media relatively unresponsive to shear forces applied to the surface of the media. In fact, cell polymer sensing media may have a 100-fold reduced sensitivity to shear forces (i.e., sliding contact) as opposed to normal forces (ie, normal particle impacts on the surface of the media).
    [0048] This is of particular benefit for grain loss sensors that are arranged normal in relation to an entry path, falling grain or other particulate matter. Grain (or other particulate matter) that impacts the surface of the normal sensor to the longitudinal and transverse extension of the impact-responsive layer will generate a strong signal upon initial (normal) impact. As these same particles slide down the face of the sensor after impact, the shear forces generated by the slip of the particles will generate a correspondingly greatly reduced electrical charge. This will innately reduce or eliminate the signals generated from the second impacts and sliding movement of the particulate matter after the initial impact. In this way, double (or triple) counts for each impact of the seed can be reduced or eliminated and, therefore, the number of tool particles contacting the sensor can be more precisely counted.
    [0049] In another arrangement, the impact responsive layer 320 comprises a polar piezoelectric polymer (for example, polyvinylidene fluoride or PVDF) that generates an electric charge upon impact.
    [0050] In another arrangement, the impact-responsive layer 320 comprises a material that changes its electrical resistance through impact and compression, such as paints based on molybdenum disulfide, or products with conductive coating, such as the "Cho- Shield "provided by Parker-Chomerics of Wobum, MA.
    [0051] In another arrangement, the impact-responsive layer 320 comprises composite polymers that further comprise polymers (for example, polymers with polarizable halves, such as polyimides, polyamides, silicon-based polymers, vinyl polymers, polyurethanes, polyureas, polythioureas, polyacrylates, polyesters and / or biopolymers) in which carbon nanotubes (eg single-walled nanotubes and multi-walled nanotubes) have been added, or in which electroceramic particles (eg conductive zirconium titanate, conductive zirconate titanate modified with lanthanum, conductive zirconate titanate modified with niobium and / or barium titanate) were added or to which both were added. See, for example, the published patent application US 2006/0084752 Al, which is incorporated by reference here for everything it prescribes. Conductive layers
    [0052] In an arrangement, the upper conductive layer 316 and the lower conductive layer 318 may comprise a film base (for example, a polyimide (for example, Kaptori), BiPEt (for example, Mylar, Melinex, Hostapharí), polyester or PTFE (polytetrafluoroethylene) (for example, Teflon) in which a conductive medium (for example, metals, such as aluminum, silver or gold; or conductive oxides, such as indium and tin oxide; or carbon, such as carbon nanotubes or graphene) is deposited by a sputtering, steam or plasma deposition process (with or without annealing or post-deposition curing) .In this arrangement, a surface of the upper conductive layer 316 in the lower conductive layer 318 on which the conductive media is applied is then bonded to the impact responsive layer 320. This arrangement has the benefit of providing an outward facing polymer layer (for example, facing surface 106) that provides strength, flexibility and durability, still covering and protecting a more fragile conductive medium.
    [0053] In an arrangement, the upper conductive layer 316 and the lower conductive layer 318 are substantially continuous and homogeneous on the entire surface of the impact-responsive layer. This is particularly beneficial when used to detect random impacts from particulate matter. In the present case (that is, that of a grain impact sensor), the matter in particular impacts random locations on the surface of the sensor. Grain falls from the threshing and separation section of a combined essentially in a random pattern onto the surface of the grain impact sensor. It is not aimed at a particular region of the grain impact sensor. Each particle has its own random and unpredictable speed and location, as it falls on the surface of the grain impact sensor. As a result, there is no way to predict the point of impact of any particle.
    [0054] To accommodate this virtually infinite number of impact sites, substantially the entire surface of the particulate matter sensor is preferably equally responsive to particle impacts. Thus, the upper conductive layer 316 and the lower conductive layer 318 preferably do not vary in their conductive characteristics over the entire surface of the grain impact sensor. If grain impact occurs at a random location (X, Y) on the grain impact sensor and an identical grain impact occurs at a location, even as small as 1 mm away from the location (X, Y), an identical electrical change (for example, a change in resistivity, capacitance or electrical charge) must be generated by the impact responsive layer 320 and this identical electrical change must be identically communicated through the upper conductive layer 316 in the lower conductive layer 318 to a processing circuit signal. The transmission of this identical electrical change through the upper conductive layer 316 and the lower conductive layer 318 is enhanced by the continuous and homogeneous characteristics of the upper conductive layer 316 and the lower conductive layer 318 substantially on the entire grain impact sensor surface.
    [0055] The thickness of the upper conductive layer 316 and the lower conductive layer 318 is, in general, between 7 and 25 pm. Dynamic Mass and Dynamic Volume
    [0056] "Dynamic mass" refers to the mass of the sensor that is moved in order to cause a sufficient electrical change to indicate an impact of the grain.
    [0057] "Dynamic volume" refers to the volume of the sensor that is moved in order to cause an electrical change sufficient to indicate an impact of the grain.
    [0058] The "ratio of seed mass to sensor" refers to the mass of the seed that takes an impact divided by the dynamic mass of the sensor due to this impact.
    [0059] In prior art arrangements (shown in figures 1-10), the impact of a single seed 106 substantially flexes the integral of the impact plate 102 and the piezoelectric sensor element 114 in order to generate an electrical signal. The impact plate 102 and the piezoelectric sensor element 114 can typically have a mass that is 20 to 100 times as large as the seed itself - that is, a seed mass to sensor ratio of 0.05 to 0.01 . As the inventors discovered, and in the manner described above in conjunction with figures 1-10, as the seed and sensor mass ratio decreases, the natural frequency of the sensor decreases, making it difficult to identify individual seed impacts on the surface of the sensor. sensor. Additionally, the larger, thinner and more flexible the particulate impact sensor is made, the more vibration modes are generated in the particulate matter impact sensor, each mode having its own natural oscillation frequencies, which also makes it difficult to identify a individual seed impact 106 from the signal generated by the particulate matter impact sensor.
    [0060] Even if seed 106 is traveling at a relatively high speed when it impacts impact plate 102, the impact of seed 106 against impact plate 102 is substantially dampened and dissipated. The kinetic energy of the movement of the seed 106 must be converted into a flexion of a much larger mass (the impact plate 102 + the piezoelectric sensor element 114).
    [0061] Compared to this prior art arrangement, the dynamic mass of the 301 particulate matter impact sensor is significantly less. The dynamic mass of the particulate matter impact sensor 301 is less than the mass of the particles whose impacts are being perceived by the particulate matter impact sensor 301. A corn seed has a mass of about 1,000 mg, a soybean seed has a mass of about 800 mg, a barley seed has a mass of about 75 mg, and wheat seed has a mass of about 60 mg. These seeds 106 are generally round, spherical, ovoid or oblate, and have an overall size of 4 mm to 10 mm.
    [0062] Depending on the resilience of the sensing media layer 300 and the size and mass of the seed, a typical seed 106 can impact and deflect and / or compress a small area of the surface (2 mm2 to 10 mm2) of the sensor media layer 300 to a depth that typically ranges between 25 and 250 pm. The depth of this depression depends on the thickness of the sensing media layer 300, the thickness of any protective film layer that can be provided in front of the sensing media layer 300 and the thickness of any intermediate layer (not shown) that can be arranged between the sensor media layer 300 and the support layer 302. This intermediate layer may comprise an adhesive layer provided for attaching the sensor media layer 300 to the support layer 302.
    [0063] The mass density of the sensing media layer 300 can be approximated as 1.3 g / cmA3.
    [0064] In an example, consider that the layer of sensing media is impacted by the seed 106 and is compressed only slightly, for example, to a depth of 25 pm, and that this compression occurs over the surface area of 2 mm2, the dynamic mass of the particulate matter impact sensor 301 being approximately 17 pg. Considering that seed 106 is a heartwood of corn that has a mass of 1 g, this arrangement provides a seed mass ratio by the lg / 17pg sensor or approximately 60,000.
    [0065] In another example, consider that the layer of sensing media is impacted by the seed 106 and is compressed significantly more, for example, at a depth of 250 pm over a surface area of 10 mm2. In this case, the dynamic mass of the particulate matter impact sensor 301 is approximately 850 pg. Considering that seed 106 is a heartwood of corn that has a mass of 1 g, this arrangement provides a seed mass ratio by the lg / 850pg sensor or approximately 1,200.
    [0066] As a comparison, the dynamic mass of a traditional grain impact sensor (for example, the one illustrated in figures 1-10) is 27 g and the dynamic volume is 21 cm3. These estimates are based on an impact plate 102 made of plastic, which has a thickness of 2 mm, a width of 7 cm and a length of 15 cm.
    [0067] To provide optimum performance, the particulate matter impact sensor 301 has a seed mass to sensor ratio greater than 5, alternatively greater than 50, alternatively greater than 500 and alternatively greater than 5,000. Alternative Constructions
    [0068] Figure 13 shows a first alternative construction of the particulate matter impact sensor 301 in which the support layer 302 similarly supports a particulate matter impact sensor 301, as described.
    [0069] In this alternative construction, however, the upper conductive layer 316 has been divided into a plurality of electrically discontinuous separate regions 400 (shown in figure 13 as 400, 400a, 400b, and following).
    [0070] The limits of each of the electrically discontinuous regions (ie, electrodes) 400 are illustrated in figure 13 as dashed lines. In figure 13, there are 28 of these regions. The regions are discontinuous in a "L" lateral direction and in an "O" direction that is orthogonal to the "L" lateral direction.
    [0071] The lateral direction "L" is oriented perpendicular to the direction of travel of the agricultural combination in which the particulate matter impact sensor 301 is mounted. By providing multiple regions 400 of the particulate matter impact sensor 301 which are oriented adjacent to each other in the "L" direction, the particulate matter impact sensor 301 is capable of determination.
    [0072] Each of the 400 regions of the upper conductive layer 316 has a corresponding electrical connection 312 which is connected to a signal processing circuit 402. For convenience of illustration, only four of these electrical connections 312 are shown (312a, 312b, 312c and 312d). The other regions 400 are similarly connected in the signal processing circuit 402.
    [0073] The lower conductive layer 318 extends, continuously, across the entire bottom surface of the impact-responsive layer and thus provides a common electrical connection on the bottom surface of the impact-responsive layer 320 for each of the individual regions 400 ( 400a, 400b, etc.). Similarly, the impact responsive layer 320 extends, continuously, across the entire lower surface.
    [0074] The signal processing circuit 402 is configured to receive electrical changes (discussed earlier) separately from each of these regions 400 as they are generated by the impact responsive layer 320. In this way, the electrical change generated by a impact on the surface of the particulate matter impact sensor 301 records in the corresponding upper electrical connection in particular (312a, 312b, etc.) and in the common electrical connection 314. The signal processing circuit 402 is configured to determine the location of the impact based on which of the 312 electrical connections (312a, 312b, etc.) generates a signal. The signal processing circuit 402 is further configured to generate an output signal on signal line 404 which indicates not only the occurrence of an impact, but also the particular region 400 (400a, 400b, etc.) of the regions 400 where the impact occurred. In this way, signal processing circuit 402 is configured to determine not only (i) the occurrence of an impact, but (ii) the relative location (for example, x, y or L, O) of the impact on the impact sensor particulate matter 301.
    [0075] In a second alternative arrangement similar to that of the arrangement of figure 13, the lower conductive layer 318 is configured as the upper conductive layer 316 is in figure 13, and the upper conductive layer 316 is configured as the lower conductive layer 318 is at In other words, the sensing media layer 300 is reversed (compared to that in figure 13) in such a way that the lower conductive layer 318 is divided into regions 400, with each region 400 having its own separate electrical connection 314 in the signal processing circuit 402 and with a single electrical connection 314 extending across the entire top surface of the particulate matter impact sensor 301. This second alternative arrangement has the advantage of providing a substantially continuous, uninterrupted upper conductive layer 316 , which is more resistant to repeated particle impacts on the first surface 304, compared to the first alternative arrangement shown in the figure 13. Whenever there are discontinuities in the upper conductive layer 316 (such as gaps between individual regions 400), it is possible for the upper conductive layer 316 to perform strip separation from the impact responsive layer 320.
    [0076] In a third alternative arrangement similar to that of the arrangement in Figures 12 and 13, both the lower conductive layer 318 and the upper conductive layer 316 are divided into 400 regions. To perceive electrical changes due to the impacts of particulate matter in a region in particular 400 of the particulate matter impact sensor 301, individual electrical connections 312, 314, both upper and lower, in each region 400 are provided. Thus, for each region 400, an electrical connection 312 that connects on the upper surface and electrical connection 314 connected on the lower surface of this region, and this region only, is provided for each of the regions 400 of the particulate matter impact sensor 301 and are connected to signal processing circuit 402. Formation of Individual Regions 400
    [0077] The individual regions 400 of the upper conductive layer 316 and / or the lower conductive layer 318 for any of these three alternative arrangements can be provided in a variety of ways.
    [0078] In a first process, the particulate matter impact sensor 301 can be formed, as shown in figure 12, with a continuous upper conductive layer 316 and a continuous lower conductive layer 318 which are connected in the impact responsive layer 320 These continuous layers can then be divided into independent regions 400 by removing the conductive material between each adjacent region 400. This removal will follow (for example) the dashed lines shown in figure 12 (and, shown in figure 13, the dashed lines 504). In this way, each of the upper conductive layer 316, the lower conductive layer 318, or both conductive layers, can be segmented into separate regions 400. This can be done, for example, by a laser 500 that emits a beam of directing laser. by computer 502 following the dashed lines 504 (see figure 14) that marks the divisions between individual regions 400.
    [0079] This first process has the advantage of allowing the fabrication of a large standard and uniform web of material that has an upper conductive layer 316, a lower conductive layer 318 and an impact responsive layer 320 and then allowing it to be cut to small dimensions to suit the particulate matter impact sensor in particular 301, then dividing both the upper conductive layer 316 and the lower conductive layer 318 (or both) into customized regions 400 for a particular application.
    [0080] In a second process, the impact responsive layer 320 can be provided, and the upper conductive layer 316 and the lower conductive layer 318 (or both) can be applied as a coating on the impact responsive layer 320 in the form of regions. separated 400. This coating can be done, for example, by screen printing of conductive materials, such as conductive inks, vapor deposition of conductive material (for example, conductive oxides, such as tin and indium oxide, or carbon, such as graphene ), or plasma spray deposition of the conductive material (eg conductive oxides or carbon).
    [0081] If, in the second process, the coatings cannot be selectively applied as separate regions 400 in the impact responsive layer 320, then a screen, mask or stencil can be arranged between the source of the conductive material and the responsive layer itself impact 320 during the coating process to ensure that separate regions 400 are produced on the surface of the impact responsive layer 320. In other words, these uncoated and non-conductive regions are provided (for example) where the dashed lines appear in figure 13 by the interposition of the fabric, mask or stencil between the coating source and the impact responsive layer 320.
    [0082] In a third process, the upper conductive layer 316 and / or the lower conductive layer 318 can be provided as a continuous conductive layer on an inner surface of a film base (as described above in the section entitled "Conductive Layers") and then selectively removed from the film base using the first process to thereby define the 400 regions. This film base (with 400 regions defined in it) can then be attached to the impact responsive layer 320.
    [0083] In a fourth process, the upper conductive layer 316 and / or the lower conductive layer 318 can be applied as individual regions 400 on a film base (as described above in the section entitled "Conductive Layers") both directly and with a screen, mask or stencil interposed. This film base (with 400 regions defined in it) can then be attached to the impact responsive layer 320. Protective Layers
    [0084] Some particulate perception environments can damage the 301 particulate matter impact sensor. For example, in agricultural applications, the 301 particulate matter impact sensor can experience many thousands of seed impacts every minute, (depending on where the particulate matter impact sensor 301 is located on an agricultural vehicle). Single-stranded seeds 106, such as maize or coarse maize, have a sharp stalk at one end that is particularly abrasive when it impacts the 301 particulate matter sensor.
    [0085] To prevent excessive damage to the particulate matter impact sensor 301, it is beneficial to provide one or more protective layers 600 to cover the upper conductive layer 316. An arrangement of the particulate matter impact sensor 301 with a protective layer 600 is shown in figure 15 and figure 16. The protective layer 600 is attached to the particulate matter impact sensor 301. The protective layer 600 substantially covers the upper conductive layer 316, thereby protecting it against wear and erosion. When impacted by particulate matter, such as seeds, the protective layer 600 deforms (that is, flexes inward) the curvature of the upper conductive layer 316 underlying it, which in turn deforms the impact-responsive layer 320 and compresses the impact responsive layer 320 against the lower conductive layer and the support layer 302.
    [0086] In an arrangement, the protective layer 600 comprises a plastic laminate. The plastic laminate may comprise fiber-reinforced plastic. Fiber-reinforced plastic may comprise glass-fiber-reinforced plastic or carbon-fiber-reinforced plastic. The glass fiber reinforced plastic may comprise a cut fiber and resin laminate, or it may comprise a woven fiber cloth embedded in an epoxy resin binder. The woven fiber cloth that is embedded in an epoxy resin binder can comprise FR-4 grade material from the National Association of Electrical Manufacturers (NEMA) or NEMA G-10 grade material. The thickness of the protective layer 600 is in the range of 0.1 to 1.0 mm when using grade FR-4 or grade G-10 material.
    [0087] In another arrangement, the protective layer 600 comprises plastic. The plastic may comprise a polyester material. The plastic may comprise poly (ethylene terephthalate) (PET).
    [0088] In another arrangement, the protective layer 600 comprises a metal. The metal may comprise a light metal, for example, aluminum or an aluminum alloy, or a heavier metal, for example, steel.
    [0089] The protective layer, when made from G-10 or FR-4, has a thickness of 0.1 to 1.0 mm. Alternatively, it has a thickness of 0.15 to 0.8 mm. Alternatively, it has a thickness of 0.2 to 0.6 mm. When made from other materials, the protective layer 600 is of sufficient thickness to provide a flexural stiffness equivalent to the flexural stiffness of the protective layer of G-10 or FR-4 with the stated thickness ranges.
    [0090] The protective layer 600 is fixed on the particulate matter impact sensor 301 with an adhesive layer 602 which is disposed between the protective layer 600 and the upper conductive layer 316.
    权利要求:
    Claims (8)
    [0001]
    1. Particulate matter impact sensor (301), to detect impacts of grain particles (106), comprising: a support layer (302); a layer of sensing media (300) having a first surface (304) which faces the flow direction (F) of the grain particles (106) and a second surface (306) on the opposite side of the sensing media layer (300 ) attached to a first surface (308) of the support layer (302); and, a protective layer (600) which is attached to the sensor media layer (300) and located between the grain particles (106) impacting the particulate matter impact sensor (301) and the sensor media layer (300), where the sensing media layer (300) comprises an impact responsive layer (320) comprising a pressure responsive media adapted to change its electrical characteristics through the impact of a grain particle (106) going in the flow direction (F) of the grain particles (106) and to produce an electrical signal on one or more electrical connections (312, 314) electrically connected to the sensor media layer (300), and where the sensor media layer (300) still has an upper conductive layer (316) on its first surface (304), with the upper conductive layer (316) coupled to one of the electrical connections (314), and a lower conductive layer (318) on its second surface (306), the lower conductive layer being (318) coupled to another electrical connection (312), characterized by the fact that: the protective layer (600) is a flexible film layer; and, the lower conductive layer (318) and the upper conductive layer (316) each comprise a film base on which a conductive media is deposited by a sputtering, steam or plasma deposition process.
    [0002]
    2. Particulate matter impact sensor (301) according to claim 1, characterized in that the layer of sensing media (300) comprises a sheet with cellular voids.
    [0003]
    3. Particulate matter impact sensor (301) according to either of claims 1 or 2, characterized in that the layer of sensing media (300) has a thickness of not more than 500 pm.
    [0004]
    4. Particulate matter impact sensor (301) according to any one of claims 1 to 3, characterized by the fact that the sensor media layer (300) is composed of biaxially stretched polypropylene.
    [0005]
    5. Particulate matter impact sensor (301) according to claim 1, characterized in that the protective layer (600) comprises plastic or metal.
    [0006]
    6. Particulate matter impact sensor (301) according to claim 5, characterized in that the protective layer (600) comprises a plastic laminate.
    [0007]
    7. Particulate matter impact sensor (301) according to claim 6, characterized in that the plastic laminate comprises fiber-reinforced plastic, particularly glass fibers or carbon fibers.
    [0008]
    8. Particulate matter impact sensor (301) according to claim 5, characterized by the fact that the protective layer (600) comprises aluminum.
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    同族专利:
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    EP2977735A3|2016-06-15|
    EP2977735A2|2016-01-27|
    US20160025531A1|2016-01-28|
    US10126153B2|2018-11-13|
    BR102015017370A2|2016-01-26|
    EP2977735B1|2018-02-14|
    BR102015017370B8|2020-12-15|
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    法律状态:
    2016-01-26| B03A| Publication of an application: publication of a patent application or of a certificate of addition of invention|
    2018-07-31| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|
    2019-08-27| B06U| Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure|
    2020-07-07| B09A| Decision: intention to grant|
    2020-11-03| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 21/07/2015, OBSERVADAS AS CONDICOES LEGAIS. |
    2020-12-15| B16C| Correction of notification of the grant|Free format text: REF. RPI 2600 DE 03/11/2020 QUANTO A PRIORIDADE UNIONISTA. |
    优先权:
    申请号 | 申请日 | 专利标题
    US201462027514P| true| 2014-07-22|2014-07-22|
    US62/027514|2014-07-22|
    US14/794,089|US10126153B2|2014-07-22|2015-07-08|Particulate matter impact sensor|
    US14/794085|2015-07-08|
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