巴西专利BR102015006552B1 electronic unit for an inverter

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专利摘要:
An electronic unit for an inverter is described which comprises a substrate with a dielectric layer and traces of metallic circuit. A plurality of terminals are arranged for connection to a direct current source. A first semiconductor and a second semiconductor are coupled together between the terminals of the direct current source. A primary metallic island (for example, strip) is located in a primary zone between the first semiconductor and the second semiconductor. The primary metallic island has a greater height or thickness than the traces of the metallic circuit. The primary metal island provides a heat sink to radiate heat.
公开号:BR102015006552B1
申请号:R102015006552-3
申请日:2015-03-24
公开日:2021-02-17
发明作者:Brij N. Singh；John N. Oenick
申请人:Deere & Company；
IPC主号:

专利说明:

[0001] [001] This document (including the drawings) claims priority and the benefit of the filing date based on provisional application US 61 / 971,590, filed on March 28, 2014, under 35 USC § 119 (e), where the application provisional is hereby incorporated by reference. Field of the Invention
[0002] [002] The description refers to an electronic unit for an inverter. Fundamentals of the Invention
[0003] [003] In a prior art, an electronic unit may have inadequate heat dissipation that reduces the longevity or maximum power output of semiconductor power switches. Thus, there is a need for an electronic unit for an inverter with better heat dissipation. Summary of the Invention
[0004] [004] In one embodiment, an electronic unit for an inverter comprises a substrate with a dielectric layer and traces of metallic circuit. A plurality of terminals are arranged for connection to a direct current source. A first semiconductor and a second semiconductor are coupled together between the terminals of the direct current source. A primary metallic island (for example, strip) is located in a primary zone between the first semiconductor and the second semiconductor. The primary metallic island has a greater height or thickness than the traces of the metallic circuit. The primary metal island provides a heat sink to radiate heat. Brief Description of Drawings
[0005] [005] Figure 1 is a perspective view of a modality of the electronic unit for an inverter.
[0006] [006] Figure 2 is an exploded perspective view of the electronic unit of Figure 1 which further illustrates an upper housing unit and a lower housing unit.
[0007] [007] Figure 3 is a perspective view of the electronic unit in Figure 2 that is mounted.
[0008] [008] Figure 4 is a first cross section of figure 3 along reference line 4-4 of figure 3, where reference line 4-4 is also shown in figure 1 and figure 2.
[0009] [009] Figure 5 is a second cross section of figure 3 along reference line 5-5 of figure 3, where reference line 5-5 is also shown in figure 1 and figure 2.
[0010] [0010] Figure 6 is a third cross section of figure 3 along reference line 6-6 in figure 3, where reference line 6-6 is also shown in figure 1 and figure 2.
[0011] [0011] Figure 7 is a cross section of an electronic unit modality that illustrates an enlarged portion of the rectangular region 7 of figure 4.
[0012] [0012] Figure 8 is a cross section of another modality that is analogous to the small enlarged portion of the rectangular region 7 of Figure 4, in which a thermal interface material is present.
[0013] [0013] Figure 9 is a cross section of yet another modality that is analogous to the small enlarged portion of the rectangular region 7 of Figure 5, in which a conductive path and a grounding plane are present.
[0014] [0014] Figure 10 is an illustrative example of a fluid cooling system that incorporates the electronic unit in figure 1.
[0015] [0015] Same reference numbers in the different drawings indicate the same elements. Detailed Description
[0016] [0016] In one embodiment, figure 1 shows a circuit board unit 11 of an electronic unit 200 for an inverter. The circuit board unit 11 of the electronic unit 200 comprises a substrate 34 with a dielectric layer 54 and one or more traces of metallic circuit on one or both sides of the substrate 34. DC terminals are arranged for connection in one direct current source. A first semiconductor 20 and a second semiconductor 22 are coupled together between the terminals of the direct current source. A primary metallic island 24 (e.g., strip) is located in a primary zone between the first semiconductor 20 and the second semiconductor 22. The primary metallic island 24 has a greater height or thickness than the metallic circuit traces. The primary metal island 24 provides a heat sink to radiate heat.
[0017] [0017] In one embodiment, the DC terminals (42, 44) comprise surface mount connectors, such as a female surface mount connector which is generally cylindrical and which comprises a metal or alloy material . Each connector (36, 38, 40, 42, 44) can comprise a surface mount connector. Each connector (36, 38, 40, 42, 44) can have a mounting platform 48 at one end for mounting on a corresponding conductive platform 50 on substrate 34, where the conductive platform 50 is associated with, or electrically connected to, one or more conductive strokes (for example, 406).
[0018] [0018] As illustrated, the electronic unit 200 shows three phases or three switching sections, where each phase has a first semiconductor 20 coupled to a second semiconductor 22. At the inputs of each switching section, the first direct current terminal 42 and the second DC terminal 44 provide DC for each switching phase or section. The output of each switching section is defined by the set of AC connectors.
[0019] [0019] For each phase, the first semiconductor 20 can comprise a semiconductor switch (for example, low side semiconductor switch) that has at least one of its switching terminals coupled on one side (for example, low side or negative terminal) of the dc bus or dc source that powers the dc terminals. For example, the switching terminals can consult the emitter and the collector if the first semiconductor 20 comprises a transistor, or the switching terminals can consult the source and the drain if the first semiconductor 20 comprises a field effect transistor. A control terminal (for example, base or port) of the first switching transistor is coupled to a control circuit or a driver that is not shown.
[0020] [0020] For each phase, the second semiconductor 22 may comprise a semiconductor switch (for example, semiconductor switch on the high side) that has at least one of its switching terminals coupled on one side (for example, high side or positive terminal) the dc bus or dc source that powers the dc terminals. For example, the switching terminals can consult the emitter and the collector if the first semiconductor 20 comprises a transistor, or the switching terminals can consult the source and the drain if the first semiconductor 20 comprises a field effect transistor. A control terminal (for example, base or port) of the first switching transistor is coupled to a control circuit or a driver that is not shown.
[0021] [0021] The output of each switching section is defined by the set of alternating current (AC) connectors (36, 38, 40). As shown in Figure 1, the AC connectors comprise a first AC 36 connector, a second AC 38 connector and a third AC 40 connector for the first phase switching section, the second phase switching section and the third section phase switching, respectively. In one embodiment, the AC connectors (36, 38, 40) comprise surface mount connectors, such as a female surface mount connector which is generally cylindrical and which comprises a metal or alloy material. Each surface-mount connector (36, 38, 40) can have a mounting platform 48 at one end for mounting on a corresponding conductive platform 50 on substrate 34, where the conductive platform 50 is associated with, or electrically connected to, one or more conductive strokes (for example, 406).
[0022] [0022] For each phase, the primary metallic island 24 (for example, strip) is located in a primary zone between the first semiconductor 20 and the second semiconductor 22. In one configuration, each primary metallic island 24, in general, has a greater height or thickness than traces of metallic circuit. For example, the primary metal island 24 provides a heat sink to radiate or conduct heat into an interior of the first housing portion 100 or the first housing unit 132. The first housing portion 100 can communicate heat radiated or conducted in the direction of a conduit or transition to circulate or conduct cooling agent through the first portion of housing 100. In one embodiment, the primary metal island 24 comprises a copper spill.
[0023] [0023] A secondary metallic island 26 (for example, strip) is located in a secondary zone between the adjacent surface mount connectors or between any DC terminal (42, 44) and any adjacent AC connector (36, 38, 40) . For example, the secondary metal island 26 provides a heat sink for radiating / conducting heat into an interior of the first housing portion 100 or the first housing unit 132. The first housing portion 100 can communicate heat radiated or conducted in the direction of a conduit or transition to circulate or conduct cooling agent through the first housing portion 100. In one embodiment, the secondary metal island 26 comprises a copper spill.
[0024] [0024] A tertiary metal island 28 is located on substrate 34 between a second semiconductor switch 22 and a corresponding AC connector or, more generally, between a second semiconductor switch 22 and the surface mount connector. In one configuration, each tertiary metallic island 28, in general, has a greater height or thickness than the metallic circuit traces. For example, the tertiary metal island 28 provides a heat sink for radiating or conducting heat into an interior of the first housing portion 100 or the first housing unit 132. The first housing portion 100 can communicate heat radiated or conducted in the direction of conduit or transition to circulate or conduct cooling agent through the first portion of housing 100. In one embodiment, the tertiary metal island 28 comprises a copper spill.
[0025] [0025] A quaternary metallic island 30 is located on substrate 34 next to a first semiconductor switch 20 (for example, for each phase). In one configuration, each quaternary metallic island 30, in general, has a greater height or thickness than the traces of the metallic circuit. For example, the quaternary metal island 30 provides a heat sink to radiate or conduct heat into an interior of the first housing portion 100 or the first housing unit 132. The first housing portion 100 can communicate heat radiated or conducted in the direction of the conduit or transition to circulate or conduct cooling agent through the first portion of housing 100. In one embodiment, the quaternary metal island 30 comprises a copper spill.
[0026] [0026] In one embodiment, the first semiconductor switch 20 and the second semiconductor switch 22 comprise field effect transistors with metal oxide semiconductor (MOSFET's) or bipolar isolated gate transistors (IGBT's) composed of silicon, silicon carbide, gallium nitride or other semiconductor material that is packaged in the form of flat chip sets. These chip sets can be made in a flat form, packaged and ready for manufacturing processes of choice and installation on the substrate. Thermal management is enhanced by a housing (with integral cooling agent channels in the first housing portion 100 (figure 4) and the second housing portion 102) and offers the opportunity to increase the current density (A / cm2) of the first substantially flat semiconductor switch 20 and second semiconductor switch 22 (e.g., MOSFET / IGBT chip sets). Therefore, in a given nominal current of the electronic unit 200, it is possible to use a mold of a smaller size than in other circumstances possible for the semiconductor material used in the first semiconductor switch 20 and in the second semiconductor switch 22, depending on the type of the switching devices. used in the design of the inverter.
[0027] [0027] The reduction in the size of the semiconductor mold or the package size of the first semiconductor switch 20 and the second semiconductor switch 22 is supported by the double-sided thermal management of the substantially flat chip sets coupled with lateral withdrawal of the heat flow through of power interconnections. In this way, the first semiconductor switch 20 and the second semiconductor switch 22 are installed in a thermally managed environment that allows each semiconductor mold to operate at a lower junction temperature (Tj). Here, the thermally managed environment can be referred to as multifaceted thermal management of power switching devices (20, 22). A lower Tj value at a given power offers the opportunity to decrease the mold size and the package size of the first semiconductor switch 20 and the second semiconductor switch 22 without compromising or decreasing the capacity of the inverter. Decreasing the mold size of the Si, SiC and GaN material in the semiconductor switches (20, 22) can proportionally increase the area of the conductive traces, islands, heat dissipation areas or busbar around each chip knowledge, making it more the lateral flow of the heat flow from the mold to the cooling agent channel is effective in the first housing portion 100 (figure 4) and the second housing portion 102.
[0028] [0028] In one configuration, a group of capacitors 56 can be mounted on substrate 34. For example, as shown in figure 1, a first arrangement of capacitors 56 is mounted on a first side of substrate 34, while a second arrangement of capacitors 56 is mounted on a second side of the substrate 34 opposite the first side. Although two rows of four capacitors 56 are shown on each side of substrate 34, any suitable number of capacitors 56 can be used. As shown, each capacitor 56 has a first terminal 58 and a second terminal 60. In one configuration, each capacitor 56 can comprise an electrolytic capacitor 56.
[0029] [0029] In one embodiment, the capacitors comprise low profile film capacitors for surface mounting. The capacitor pack 56 with conductive terminals over a high surface area (58, 60) and thermal interface material around the capacitors 56 facilitates thermal conductor management for lower temperature increases by current in filtered ampere and higher ampere per unit of capacitance (for example, microFarad (µF)) required or used. The thermal interface material comprises a cured polymer (for example, substantially crosslinked), elastomer or plastic or solid dielectric material that is positioned, inserted, injected as a resin in an uncured state, in a liquid phase, or in a semi-solid phase between the interior of the first housing and the second housing and capacitors 56 for better heat dissipation. Capacitors 56 can be configured as parts that can withstand the lead-free reflux temperature profile required for the surface mount manufacturing line, for example.
[0030] [0030] As illustrated in figure 1, an ancillary substrate 46 is mounted on a different plane that is, in general, parallel to, or offset from, the plane of substrate 34. A connector has a dielectric portion and terminals, where the connector is mounted on, or through, the ancillary substrate 46. The ancillary circuit board may have one or more openings 52. For example, the ancillary circuit board may have ancillary openings 52 for each switching phase or section , in such a way that a second housing portion 102 or a second housing unit 134 can contact or be in close proximity to the switching section to conduct heat away from the switching section.
[0031] [0031] In an alternative embodiment, heat is conducted away from one or more metallic islands (for example, 24, 28, 30) through one or more thermally conducting paths 900 (for example, thermally conducting through holes, blind paths thermally conductive or thermally and electrically conductive pathways, or other structures) connected between one or more metal islands (for example, 24, 28, 30) and the heat dissipation island 901 or heat sink on an opposite side of the substrate 34 , as best illustrated in figure 9. In one embodiment, the heatsink or heat dissipation island 901 is isolated on a phase-by-phase basis, in such a way that each phase of the heat dissipation island (for example, first phase of the heat dissipation island) is mechanically separated and electrically isolated (for example, electromagnetically isolated in an operating frequency range) from the respective other phases of the heat dissipation islands (for example, on a lower side or on the opposite side of substrate 34) from the other phase outputs (for example, second phase of the heat dissipation island and third phase of the heat dissipation island) of the electronic unit 200. Additionally, combined with or separated from the heat transfer through the thermally conductive pathways 900, heat is transferred to the cooling fluid or agent in the channel of the cooling agent (for example, in the first shell portion 100 or the second shell portion).
[0032] [0032] The circuit board unit 11 of the electronic unit 200 can comprise a plurality of first surface-mounted connectors mounted on substrate 34 which are electrically connected to the terminals and a secondary metal island 26 located in a secondary zone between mounting connectors on the adjacent surface.
[0033] [0033] Figure 2 illustrates a housing unit enclosing the circuit board unit 11 of figure 1. In one embodiment, the housing comprises a first housing unit 132 and a second housing unit 134, wherein the first unit housing 132 conjugates to the second housing unit 134. The first housing unit 132 comprises a first housing portion 100 and a third housing portion 104. The second housing unit 134 comprises a second housing portion 102 and a fourth portion of casing 106.
[0034] [0034] As shown, the first housing portion 100 and the second housing portion 102 have mounting holes (108, 110) for receiving one or more fasteners 117 for attaching or joining the first housing portion 100 to the second portion of enclosure 102, wherein the circuit board unit 11 of figure 1 is sandwiched between the first and second portions of enclosure 102 or enclosed by the first and second portions of enclosure 102. The third portion of enclosure 104 is secured or attached to the first housing portion 100. For example, the third housing portion 104 may comprise a heatsink or upper cover of the housing unit. Similarly, the fourth housing portion 106 may comprise a heatsink or bottom cover of the housing unit. The fourth housing portion 106 is attached or attached to the second housing portion 102. In one embodiment, the first housing portion 100 and the second housing portion 102 are composed of a polymer, a plastic, a polymer matrix with a reinforcement , such as a reinforced fiber or carbon fiber. For example, the first housing portion 100 and the second housing portion 102 can be manufactured by a three-dimensional printer capable of printing a three-dimensional structure with several openings 52, conduits or passageways to conduct fluid to cool the circuit board unit 11 or its heat generation components. In an illustrative configuration, the third housing portion 104 and the fourth housing portion 106 may be constructed of a metal material, a metallic material, an alloy material or heat dissipating material, such as aluminum and molten aluminum. The third housing portion 104 and the fourth housing portion 106 can be constructed with a three-dimensional printer capable of printing a three-dimensional structure from a polymer, plastic or resin that contains electrically conductive particles, such as metallic particles, to promote dissipation of heat, or any suitable thermally conductive polymeric materials.
[0035] [0035] A first interior surface of the first housing portion 100 can substantially conform in size and shape to conjugate or integrate with one side of the circuit board unit 11, while a second interior surface of the second housing portion 102 it can conform substantially in size and shape to conjugate or integrate with an opposite side. For example, the first housing portion 100 has, in general, cylindrical recesses that mate with corresponding AC connectors and DC terminals on substrate 34. Additionally, the first housing portion 100 has a recess in the first switching section 75 which, in general , is rectangular, polyhedron type or that otherwise conforms to the shape and size of the first switching section 75 above substrate 34; a recess 126 of the second switching section 77 which, in general, is rectangular, polyhedron type or otherwise conforms to the shape and size of the second switching section 77 above substrate 34; a recess in the third switching section 79 that is generally rectangular, polyhedron type or otherwise conforms to the shape and size of the third switching section 79 above substrate 34. Regarding capacitor arrangements 56, the first housing has an aggregate capacitor recess or individual capacitor recesses that conform to the size and shape of the corresponding capacitors 56 of the circuit board unit 11.
[0036] [0036] The second housing portion 102 has raised protrusions 124 for each switching section, wherein raised protrusions 124 can contact the underside of each switching section. In an alternative embodiment, the second housing portion 102 has raised protrusions for each switching section, wherein the raised protrusions can contact the underside of each switching section with a thermally conductive interface material, as shown in figure 8. The thermally conductive interface material comprises an intervening thermally conductive adhesive, an intervening thermally conductive grease or an intervening thermally conductive polymer. As shown, the second housing portion 102 has a recess of the aggregate capacitor 56 that conforms to the size and shape of the corresponding capacitors 56 in the circuit board unit 11.
[0037] [0037] As shown, the first housing portion 100 has a first intake 116 and a first exhaust 118 for receiving and exhausting a cooling agent, respectively. Similarly, the second housing portion 102 has a second inlet 120 and a second exhaust 122 for receiving and exhausting a cooling agent, respectively. Figure 10 provides an illustrative example of an embodiment of how the cooling agent is circulated or conducted through the electronic unit 200 to provide improved cooling of the switching sections, capacitors 56 or other components in the electronic unit 200.
[0038] [0038] Figure 3 shows the electronic unit 200 of figure 2 in its assembled state. Each of the AC connectors (36, 38, 40) and DC connectors (42, 44) can be connected to conductors 130 or cables by means of conjugated connectors 128 (for example, male plugs) that conjugate with the corresponding connectors (for example , surface-mount connectors or female connectors) of the electronics unit 200. For example, the DC connectors (42, 44) can be connected or coupled to a direct current (DC) source, such as a battery, a generator, a electrical outlet of fuel cell or rectified alternator. In this particular, the AC connectors can be coupled or connected in the corresponding phases of an electric motor (for example, any conventional, unconventional or mutually coupled reluctance motor or alternating current motor with permanent magnet) to be controlled, or an alternator or another electrical machine.
[0039] [0039] Figure 4 illustrates a cross section of the electronic unit 200 along reference line 4-4. Same reference numbers in figure 1 to figure 4, inclusive, indicate equal elements or resources. The cross section of figure 4 shows the channels of the cooling agent (420, 422, 424, 421, 428) that extend between the first intake 116 and the first exhaust 118 of the first housing unit 132 or the first housing portion 100 The cross section of figure 4 also shows the cooling agent channels (411, 412, 414, 416, 418) that extend between the second inlet 120 and the second exhaust 122 of the second housing unit 134 or the second portion of housing 102. In one embodiment, between the first intake 116 and the first exhaust 118, a first coolant channel (420, 422, 424, 421, 428) is completely contained in the first housing portion, which eliminates the need for of cooperation holes in the electronic unit 200 for the transfer of the cooling agent between the first housing portion 100 and the second housing portion 102. Similarly, between the second intake 120 and the second exhaust 122, a second gas channel cooling element is completely contained in the second housing portion 102, which eliminates the need for any cooperation holes in the electronics unit 200 for the transfer of the cooling agent between the first housing portion 100 and the second housing portion 102. In this way, all gaskets, seals or adhesive between these cooperation holes, in the first housing portion 100 and the second housing portion 102, are eliminated and there is no leakage.
[0040] [0040] For illustrative purposes, Figure 4 will be described in such a way that the visible portion of the first cooling agent channel is designated as an outlet portion (420, 422, 424, 421, 428) of the first cooling agent channel. cooling, although the first cooling agent channel has an inlet portion that appears similar to the outlet portion. The outlet portion and the intake portion of the first cooling agent channel are, in general, interchangeable in that they are merely defined in relation to the direction of the fluid or flow of the cooling agent, and in relation to the direction of discharge of the cooling agent. pump or pump inlet in relation to the first inlet and the first outlet. For example, the inlet portion and the outlet portion are redefined when the connections between the first inlet and the first outlet on the pump are reversed.
[0041] [0041] In one embodiment, an outlet portion (420, 422, 424, 421, 428) of the first channel of the cooling agent comprises a first transverse intake chamber 420, a set of first internal outlet conduits 422, a set first outgoing transitions 424, a set of first outgoing conduits 421 and a first outer transverse chamber 428, a set of first outgoing conduits, a set of first outgoing transitions, a set of first inlet inlets. The outlet portion (420, 422, 424, 421, 428) of the first coolant channel is coupled between the first intake 116 and the first exhaust 118 and can follow a circuit path or serpentine path through the first portion of housing 100 between the first intake 116 and the first exhaust 118. The outlet portion (420, 422, 424, 421, 428) of the first coolant channel can be described together with the fluid flow direction of the first intake 116 up to the first exhaust 118, in which the outlet path moves from the first intake 116 and in which the inlet path moves in the direction of the first exhaust 118.
[0042] [0042] In the first channel of the cooling agent, the first inlet 116 communicates with the first inlet transverse chamber 420. A set of first internal outlet conduits 422 comprise one or more first internal outlet conduits emanating from (by example, longitudinally in figure 4 in the plane of the sheet) first transverse intake chamber 420. The respective set of internal outlet conduits 422 is coupled in a corresponding set of the first outlet transitions 424. In one embodiment, each first region of the transition from outlet 424 may comprise a substantially spiral, substantially elliptical or substantially circular, or otherwise curved channel that connects or connects a respective of the first inner outlet conduits 422 to the corresponding first outer outlet conduits 424. In one configuration, one end of the set of the first external outlet conduits 421 is coupled to a corresponding set of the first outlet transitions 424, while the opposite end of the set of the first outer outlet conduits 421 is coupled to the first outer transverse chamber 428.
[0043] [0043] In the second cooling agent channel (411, 412, 414, 416, 418), the second inlet 120 communicates with the second inlet inlet chamber 411. A set of second internal outlet conduits 412 comprises one or more seconds internal outlet conduits emanating from (for example, longitudinal in figure 4 in the plane of the leaf) second inlet inlet chamber 411. The respective set of inner outlet conduits 412 is coupled to a corresponding set of second outlet transitions 414 In one embodiment, each second output transition 414 may comprise a substantially spiral, substantially elliptical or substantially circular, or otherwise curved channel that connects or connects a respective of the second internal outlet conduits 412 to the corresponding second external outlet conduits. 416. In one configuration, one end of the set of second external output conduits 416 is coupled to a corresponding set of d the second outlet transition 414, while the opposite end of the set of the second outer outlet conduits 416 is coupled to the second outer transverse chamber 418, or a series of conduits or curved loops, generally parallel.
[0044] [0044] In one embodiment, one or more of the transitions (424, 414) may comprise a substantially spiral, substantially elliptical, substantially circular or otherwise curved channel that circumnavigates or surrounds an exterior of a connector (e.g., connector surface mount) associated with substrate 34. In this way, each such transition (for example, 424) has an internal diameter or, in general, cylindrical surface 410 that is configured to mate with, nest with, or integrate with an external surface , in general, cylindrical 408 of connector 40. As shown in figure 4, a transition 424 (for example, first transition or upper transition) surrounds the exterior of connector 40 in immediate proximity for heat transfer from the thermal energy of connector 40 to the cooling agent in the first cooling agent channel, while transition 414 (for example, second transition or lower transition) does not surround the connector (for example, 40) in the configuration shown. The transition 414 can be composed of, or associated with, a metal or metallic structure in close proximity to a heatsink of the fourth housing portion 106.
[0045] [0045] In an illustrative configuration, the first housing portion 100 has an inner surface with a conjugated shape and size that correspond to the contour or contiguous to the first surface-mount connectors (36, 38, 40) or that correspond to direct terminals (42, 44). The first housing portion 100 has a transition region (for example, 414) of channels in a spiral path around an outside diameter of the first surface mount connector to provide thermal path for heat dissipation from the mount connector on the surface (36, 38, 40) or direct terminals (42, 44). For example, the inner surface is substantially cylindrical and fits into a corresponding outer cylindrical surface of a correspondent of the first surface mount connectors (36, 38, 40) or direct terminals (42, 44).
[0046] [0046] The first housing unit 132 comprises a first housing portion 100 which overlaps the substrate 34 and the primary metal island 24; wherein the heat is conducted away from the primary metal island 24 through a first portion of housing 100 in contact with, above or in immediate proximity to the primary metal island 24. For example, heat is conducted from the primary metal island 24 through from the enclosure portion to the ambient air around the first enclosure portion 100. Cumulative with, or separated from, heat transfer to the ambient air around the first enclosure portion 100, heat is transferred to the fluid or cooling agent. cooling in the cooling agent channel. Heat or thermal energy is conducted away from the tertiary metal island 28 through a first portion of housing 100 in contact with, above or in immediate proximity to the tertiary metal island 28. Heat or thermal energy is conducted away from a quaternary metal island 30 through a first portion of housing 100 in contact with, above or in close proximity to the quaternary metal island 30. As illustrated, one or more conductive strokes are on one or more sides of the substrate 34. Connector 32 can be mounted on the surface on conductive platforms on one side of the substrate, and can be mounted through an opening in connector 15 (figure 2) in the first housing portion 100.
[0047] [0047] In figure 4, the third portion of housing 104 has one or more fins 402 or radiation elements for radiating thermal energy. In an alternative embodiment, the third housing portion 104 can be configured as a heat sink and forged, cast, stamped or otherwise formed from metal, an alloy or metallic material. Similarly, the fourth housing portion 106 has one or more 404 fins or radiation elements for radiating thermal energy. In an alternative embodiment, the fourth housing portion 106 can be configured as a heat sink and forged, cast, stamped or otherwise formed from metal, an alloy or metallic material.
[0048] [0048] Figure 5 shows a cross section of the electronic unit 200 along reference line 5-5. Like reference numbers in figure 4 and figure 5 indicate like elements. The cross section of figure 5 does not show the cross section of any transistor or the cross section of any AC converter (36, 38, 40) or DC terminal (42, 44). Additionally, the cross section of figure 5 falls between the first channel of the cooling agent and the second channel of the cooling agent in the first housing portion 100 and the second housing portion 102, respectively.
[0049] [0049] Figure 6 shows a cross section of the electronic unit 200 along reference line 6-6. Same reference numbers in figure 4 and figure 6 indicate equal reference numbers. The cross section of figure 4 can describe an exit transition and corresponding exit portions of the first and second conduits, while the cross section of figure 5 can show an entrance transition and the corresponding entrance portions of the first and second conduits.
[0050] [0050] A set of first external inlet conduits 521 comprises one or more first external inlet conduits 521 that emanate from (for example, longitudinally in figure 4 in the plane of the sheet) the first external transverse chamber 528, or a series of conduits or curved loops, in general, parallel. The respective set of external inlet conduits 521 is coupled to a corresponding set of first inlet transitions 524. In one embodiment, each first inlet transition 524 may comprise a substantially spiral, substantially elliptical or substantially circular, or otherwise curved channel , which connects or connects a respective of the first external input conduits 521 to the corresponding first internal input conduits 522. In one configuration, one end of the set of the first internal input conduits 522 is coupled to a corresponding set of the first input transitions 524 , while the opposite end of the set of the first internal inlet conduits 522 is coupled to the first inlet intake chamber 520. The first inlet intake chamber can be coupled to the first intake 116 or the first exhaust 118.
[0051] [0051] A set of the second external inlet conduits 516 comprises one or more second external inlet conduits 516 emanating from (for example, longitudinally in figure 4 in the plane of the sheet) the second external transverse chamber 518 or a series of conduits or curved loops, in general, parallel. The respective set of second external input conduits 516 is coupled to a corresponding set of second input transitions 514. In one embodiment, each second input transition 514 may comprise a substantially spiral, substantially elliptical or substantially circular channel, or otherwise curved, which connects or connects a respective of the second external input conduits 516 to the corresponding second internal input conduits 512. In one configuration, one end of the set of second internal input conduits 512 is coupled to a corresponding set of the second input transitions 514, while the opposite end of the set of the second internal inlet conduits 512 is coupled to the second cross exhaust chamber 511. The second cross exhaust chamber 511 can be coupled to the second inlet 120 or the second exhaust 122.
[0052] [0052] In figure 4 to figure 6, the first housing portion 100 comprises a group of channels or microchannels in the first housing portion 100 for carrying fluid or cooling agent, and wherein an inner surface of the first housing portion 100 is in contact with, above or in close proximity to one or more metallic islands (for example, the primary metallic island 24, the secondary metallic island 26, the tertiary metallic island 28 or the quaternary metallic island 30) for heat transfer from the islands metal for the cooling agent or the fluid in the channel or microchannels. In one configuration, each AC connector (36, 38, 40) comprising the surface mount connector is mounted on substrate 34. Each AC connector is electrically connected to each corresponding phase output terminal of a switching section, such as the first semiconductor 20 and the second semiconductor 22. A tertiary metal island 28 is located in a tertiary zone between adjacent connectors (26, 38, 40, 42, 44) or between adjacent surface mount connectors.
[0053] [0053] In one example, the second housing portion 102 comprises a group of channels or microchannels in the second housing portion 102, and wherein an inner surface of the second housing portion 102 is in contact with, above or in close proximity to an opposite side of the substrate 34 on which one or more metal islands are found for heat transfer from one or more metal islands. In one configuration, the first semiconductor 20 and the second semiconductor 22 comprise surface mount transistors that are mounted on substrate 34 and electrically connected in corresponding traces of metallic circuit (for example, 406 in figure 4), and in which the second portion housing 102 has an internal surface with a conjugated shape and size corresponding to the contour or contiguous surface on the opposite side of the substrate 34 and all associated components (e.g., electrical or electronic components) on the substrate 34.
[0054] [0054] Figure 7 illustrates an enlarged rectangular portion of the cross section of the electronic unit 200 shown in figure 4. Figure 7 clearly shows the transition between a connector (for example, surface mount connector) that is connected to the corresponding portion connector (for example, plug) and the conductor. Here, the corresponding portion of the connector is illustrated as a right-angle connector, although any connector (for example, straight connector or ordinary connector) may fall within the scope of the description.
[0055] [0055] In figure 7, the first housing portion 100 comprises a first conduit. In turn, the first conduit comprises a group of channels that generally extend longitudinally parallel to the first microchannels in the first housing portion 100, wherein a contiguous portion of the first housing portion 100 provides a thermal path between one or more more metal islands and the first conduit. As previously indicated, the metal islands include one or more of the following islands: a primary metal island 24, a secondary metal island 26, a tertiary metal island 28 and a quaternary metal island. In one embodiment, the channels are synonymous with the entry and exit paths previously described here.
[0056] [0056] As shown in figure 7, the second housing portion 102 comprises a second conduit. In turn, the second conduit comprises a group of channels that generally extend parallel and longitudinally or according to microchannels in the second housing portion 102, wherein a contiguous portion of the second housing portion 102 provides a thermal path between one or more more metal islands and the second conduit. As previously indicated, the metal islands include one or more of the following islands: a primary metal island 24, a secondary metal island 26, a tertiary metal island 28 and a quaternary metal island 30.
[0057] [0057] The third portion of housing 104 is attached to the first portion of the connector. The third portion of the connector comprises a cover or heatsink (for example, cover with external cooling fins or ridges, generally parallel) to provide a complementary path for transferring the heat from one or more metal islands of the electronic unit 200. The fourth housing portion 106 is attached to the second connector portion. The fourth connector portion comprises a cover or heatsink (for example, cover with external cooling fins or ridges, generally parallel) to provide a complementary path for transferring heat from one or more metal islands of the electronics unit 200.
[0058] [0058] The electronic unit 200 of figure 8 is similar to the electronic unit 200 of figure 7, except that the electronic unit 200 of figure 8 additionally includes a thermal interface material (801, 802, 803), a thermally conductive adhesive or thermally conductive lubricant. For example, the thermal interface material (801, 802, 803) is used between the primary metal island 24 and the first housing portion 100, between the tertiary metal island 28 and the first housing portion 100 and between the quaternary metal island 30 and the first housing portion 100. Reference numerals like in figure 7 and figure 8 indicate equal elements or features.
[0059] [0059] In one embodiment, the thermal interface material is a gap reinforcement that can be used between the circuit board unit 100 and an interior of the electronic unit 200. For example, a thermal interface material can be injected, forced or placed in a first gap between the circuit board unit 100 and the inner surface, in general, in accordance with the first housing portion 100 and between a second gap between the circuit board unit 100 and the second housing portion 102 The thermal interface material can fill depressions, recesses or irregular voids in one layer. The thermal interface material is well suited to leave behind zero or negligible number of connecting lines after the thermal interface material is cured. The thermal interface material is used to prevent short circuits and metal-to-metal contact, where a live metal terminal (or an electrically conductive structure at a potential other than ground) can contact a metal component at an electrical ground potential. The thermal interface material is well suited for conducting heat away from the active components in relation to the cooling agent channels formed in the first shell portion 100, the second shell portion 102 or in the housing. For example, the material of the thermal interface can be in direct connection with the metal islands (for example, 30, 24, 28) or strips of heat dissipation in the substrate. In addition, the thermal interface material can overlap capacitors 56 and can fill a void between capacitors 56 and the interior of the first shell portion 100 and the second shell portion 102 to drag or conduct heat away from the capacitors 52.
[0060] [0060] In one configuration, thermal management material is applied (for example, sprinkled) and, when it cures, it becomes a dielectric structure with relatively high thermal conductivity, such as about 240 Watts / meters-Kelvin in the xy direction and about 5 Watts / meters-Kelvin in the Z direction. When the xy plane is the plane of the surface of the substrate 34, heat transfer occurs theoretically with an anisotropic gradient in the electronic unit 200.
[0061] [0061] As illustrated in figure 1, when flip chip or flip die methods are used for the first semiconductor switch 20 and the second semiconductor switch 22, a first layer of thermal interface material may overlap (or be bonded on) one side of the substrate 34 and the second layer of thermal interface material may overlap (or be bonded to) the first layer of thermal interface material, wherein the multiple layers of the thermal interface tend to provide shock absorption and reduction of vibration stress.
[0062] [0062] In a configuration, if the thermally conductive material comprises a resin that cures as a dielectric material, the thermally conductive material offers better resistance to abrasion and greater adhesion to the surrounding components and inside the housing than conductive grease, for example.
[0063] [0063] In an alternative embodiment, substrate 34, such as an unfilled circuit board (smooth plate) (for example, ceramic substrate), has a thermal expansion coefficient (CTE) of the interface layer to match a first CTE of the metal islands (for example, heavy copper spill pattern) with a second CTE of substrate 34 for thermal management. For example, the CTE of the interface layer comprises a dielectric layer (for example, substantially flat layer) of polymer, plastic, or fiber-reinforced polymer that reside between the metal islands (for example, 30, 24, and 28) and the substrate 34 In an illustrative example, the CTE of the interface layer comprises a bismaleimide (BT) polyimide or triazine (BT) material bonded to a substrate 34, such as a ceramic substrate (for example, FR4). In addition, the interface layer CTE, which comprises a bismaleimide (BT) polyimide or triazine (BT) material bonded to a substrate 34, can be used to provide a CTE compliance between a substrate 34 and an ancillary substrate 46 or between the substrate 34 and a door driver circuit board underlying connector 32.
[0064] [0064] In one embodiment, the electronic unit 200 of figure 9 is similar to the electronic unit 200 of figure 7, except that the electronic unit 200 of figure 9 additionally includes a thermally conductive path 900 (for example, a plastic path, a polymer pathway, a dielectric thermal conductive pathway, a thermoplastic path or thermoplastic insert) in thermal communication with a heat dissipating metal island 901 or grounding plane on an opposite side of the substrate 34 from the metal islands (24, 28 , 30). One or more thermally conductive pathways 900 (for example, thermoplastic pathways or thermoplastic inserts) can be composed of a dielectric material that is thermally conductive but electrically insulated: (1) to ensure that metallic islands (28, 24, 30) do not form or facilitate an electrical connection (for example, an electrical short circuit, if the metal island is configured to be electrically floating or to have an operational voltage potential other than the ground potential) or (2) to isolate different phase outputs of a inverter or electronic unit 200 when a common ground plane is used between one or more metallic islands (24, 38, 30) and a corresponding metallic island with heat dissipation 901 or ground plane.
[0065] [0065] In an alternative embodiment, the electronic unit 200 of figure 9 is similar to the electronic unit 200 of figure 7, except that the electronic unit 200 of figure 9 additionally includes a thermal conductive path 900, a blind conductive path or through hole metallized in thermal communication with a metal island with heat dissipation 901 or ground plane on an opposite side of the substrate 34 from the metal islands (24, 28, 30), where the thermal conductive path 900 comprises an electrically conductive metal path and thermally conductive. For example, in certain embodiments of this description, thermally conductive paths 900 can connect (for example, electrically and mechanically) one or more of the metal islands (28, 24, 30) on a first side of the substrate 34 with one or more metal islands with heat dissipation 901 or one or more grounding planes on a second side of the substrate 34, where the second side is opposite the first side. Figure 9 shows, in general, which thermally conductive pathways 900 (for example, dielectric thermal conductive pathways, metallic thermal conductive pathways or both) are connected (for example, thermally, mechanically or electrically, or any combination of the exposed connection types) between the primary metallic island 24 and the metallic ground plane 901, between the tertiary metallic island 28 and the heat dissipated metallic island 901 (also referred to as a metallic ground plane or a phase-specific ground plane), and between the quaternary metallic island 30 and the metallic ground plane 901. Same reference numbers in figure 7 and figure 8 indicate equal elements or resources.
[0066] [0066] Figure 10 is a perspective view of an illustrative example of a fluid cooling system 900 that incorporates the electronic unit 200 of figure 1. The fluid cooling system 900 comprises a radiator 950 that is coupled to a pump 952 with piping 958. In turn, pump 952 is coupled to an electronic unit 200 by means of piping (956, 962, 943). The radiator 950 has connection holes (948, 951). At least one connection port (for example, 951) is connected to an inlet of pump 954 or exhaust of pump 956 via piping 958, where the opposite connection 964 from pump 952 is connected to electronics unit 200 via piping. For example, a first connection hole for radiator 951 is coupled to a pump inlet 954, while a second connection hole for radiator 948 is coupled to an exhaust of pump 964 through the pipeline (944, 946), one or more 947 adapters, internal channels in the electronic unit 200 and piping (943, 962, 956).
[0067] [0067] The electronic unit 200 has a first housing portion 100 and a second housing portion 102 which are secured together to form a housing. The housing also has a third housing portion 104 and a fourth housing portion 106. The first housing portion 100 has a first inlet 116 and first exhaust 118. The second housing portion 102 has a second inlet 120 and the second exhaust 122 .
[0068] [0068] As shown, the exhaust of pump 964 is coupled to the first intake 116 and the second intake 120 of the electronic unit 200 by means of tubes (956, 962, 943) and T adapters, Y adapters or other appropriate connectors 947. Similarly, the second orifice of the radiator is coupled to the first exhaust 118 and the second exhaust 122 by means of tubes and T-adapters, Y-adapters or other suitable connectors 947.
[0069] [0069] During or before the operation, the radiator 950 is filled with a fluid or cooling agent. The 950 radiator can provide a coolant reservoir; the channels and associated chambers in the electronic unit 200 can provide a coolant reservoir, or both the radiator 950 and the electronic unit 200 can provide a coolant reservoir. Pump 952 draws coolant or fluid into the first intake 116 for circulation of the coolant or fluid in the first housing portion 100. The cooling fluid or agent leaves the first housing portion 100 in the first exhaust 118 which is coupled to the 950 radiator with the piping. Similarly, pump 952 draws fluid or cooling agent into a second inlet 120 for circulation of the fluid or cooling agent in the second housing portion 102. The fluid or cooling agent exits the second housing portion 102 in the second exhaust 122 which is coupled to the radiator 952 with piping.
[0070] [0070] The circuit board unit 11 can be manufactured according to various techniques, some examples of which follow here. The circuit board unit 11 (for example, printed circuit board for power switching) is filled with or by mounting capacitor elements on surface mount film, connector sockets and flat power switching devices on one side or on both sides of substrate 34 and ancillary substrate 46. For example, components can be assembled using a pick and install type mechanization. The electronics unit provides control circuits and door trigger functionality, including low voltage battery connector and electrical machine harness.
[0071] [0071] The housing (100, 102, 104, 106) may comprise a case or cover that is molded (for example, injection molded), constructed by three-dimensional printing or otherwise formed. For example, in one embodiment, the electronic unit 200 can be made in a highly automated process using three-dimensional printing for the first housing portion 100 and the second housing portion 102 to support formation in the integral cooling agent channels in the housing. The housing comprises a first housing 100 and a second housing portion 102. Each housing portion (100, 102) has a shape / profile of the inner surface and features that conform to the shape and profile of the parts and interconnections installed in the unit circuit board 11 and a control port and driver circuit board underlying connector 32. In this way, electronic unit 200 is well suited for high density packaging and uses less volume for capacity (for example, current or power ) transmitted from electronics unit 200. In one configuration, substrate 34 can be connected to ancillary substrate 46 (or door drive circuit board) by using a sphere grid arrangement (BGA) interconnect. For example, an assembled substrate 34 with self-assembled components can go through the reflux process with the door drive and control circuit board.
[0072] [0072] The connectors (36, 38, 40, 42, 44) comprise surface mount connectors that support plug type (pin) and socket of electrical connections between the load (for example, electric motor, generator or machine) and the power source (eg DC power source) for electronics unit 200. The connectors are filled between the capacitor elements and flat chip sets of the first semiconductor switch 20 and the second semiconductor switch 22. The exposed installation of the connectors ( 36, 38, 40, 42, 44) in the electronic unit 200 supports electrical design functionality (for example, minimizing system inductance and avoiding unnecessary current loops), thermal design functionality (for example, space between chip sets (20, 22) and capacitors (56) used to separate parts that operate in substantial temperature difference and also increase the socket in the total surface area for better heat dissipation), and mechanical functionality (for example, minimizing the total area required for circuit board 11).
[0073] [0073] In one embodiment, the ancillary substrate 46 or a circuit board underlying connector 32 comprises a door drive circuit and control board. The ancillary substrate 46 can be associated with a gate drive circuit to control one or more phases of the first semiconductor switches 20 and the second semiconductor switches. The door trigger circuit can be miniaturized using the Application Specific Integrated Circuit (ASIC) method. ASIC used to miniaturize the door actuator circuit not only simplifies the conduction scheme through the circuit envelope, but also increases immunity to electromagnetic interference and stray effects caused by the change in current over time and the change in voltage during the time. The door trigger circuit features a current sensor circuit and low voltage control with discrete circuits. In one configuration, the current sensor circuit is installed near or adjacent to the inverter that alternates the transmitted current or one or more metallic islands, in which the current sensor circuit is accompanied by any necessary shielding and flow / field concentrators. Low-voltage and discrete control circuits can be embedded in a Field Programmable Gate Array (FPGA) and discrete electronic parts and integrated circuits. The door drive and control circuit board is filled with wire harness connection of the low voltage surface mount connector with battery and sensors installed in the electric motor / generator driven by the inverter.
[0074] [0074] In one embodiment, the housing can be formed by a three-dimensional (3-D) printing process or injection molding process. The housing has a shape / surface profile and features in accordance with the circuit board unit 11 used in the drive assembly. The housing facilitates the improved thermal management of the semiconductor switches (20, 22), the film capacitor 56 (for example, film capacitors), the connector interconnections (for example, 36, 38, 40, 42, 44) on the board circuit 11 and all heat generating circuits installed on circuit board 11.
[0075] [0075] To form the housing with a 3-D printing process, first, a laser scanner is used to scan the circuit board 11. The laser scanner produces one or more three-dimensional images of the circuit board profile. Separate laser images on each side of circuit board 11 are collected as input data. Second, a preformed thermal interface material (TIM) screen can be deposited on the circuit board filled with component 11. TIM allows close contact between the heat generating components or regions, the heat conducting components or regions, or the heat radiating components or regions in assembly 200 and inside the housing. In an alternative configuration, a layer of TIM with an optimized thickness (for example, optimized for electrical insulation and thermal conduction) can be implemented on the inner face of the first housing portion 100 and the second housing portion 102.
[0076] [0076] Third, the housing can be composed of a polymer, plastic or metallic material. In one configuration, the housing is printed in 3-D from a lightweight metal, such as aluminum, or a metallic polymer compound based on one or more scanned profiles or scanned images collected by the laser scanner. The 3-D printed housing conforms to circuit board 11 parts and features. For example, the inverter's 3-D printed housing can touch or contact all components and parts on the circuit board 11. As illustrated in Figure 4 and Figure 7, the 3-D printed housing will have cooling agent channels or microchannels for cooling agent that create turbulent flow of the cooling agent. The cooling agent channels make the double-sided cooling of the semiconductor switches (20, 22) effective together with the lateral removal of heat from the power devices by the thermal management of the interconnections. This automated 3-D printing process for the inverter housing will effectively reduce the unused volume or empty space in the electronic unit 200 that supports reduced package size of the electronic unit 200. 3-D printing will allow the optimization of the housing thickness / therefore, the 3-D printing process, if properly explored, can significantly reduce the material needed and thus significant cost savings can be realized as the 3-D printing process matures. The 3-D printed housing facilitates the best access of the semiconductor switches (20, 22) to the thermally conductive liquid which results in a higher rated power for the inverter.
[0077] [0077] In an alternative embodiment, injection molding can be used to form the housing or housing portions (100, 102). The housing promotes resistance to vibrations and shocks due to the housing portions (100, 102) being tightly packed with TIM and circuit board 11 encapsulated with TIM. Unused and exposed areas of circuit board 11 will have conductive area patterns or metal islands to effectively increase the general contact area between circuit board 11 and the preformed thermal interface material (TIM). TIM provides electrical insulation and thermal conduction between the parts of the circuit board unit 11 and the housing, such as the first housing portion 100 and the second housing portion 102.
[0078] [0078] A TIM layer can be placed, rolled, injected, sprinkled or deposited on one or more of the following parts or components in the inverter set: the shells (100, 102), the substrate 34, the ancillary substrate 46, the plate printed circuit board 11, capacitors 56, metallic islands (30, 24, 28), strips, platforms, islands or fin-shaped metallic features or patterns on the surface of circuit board 11, connectors or power sockets (36, 38, 40, 42, 44), all heat generation circuits on the door control and drive circuit board, all parts that need containment for vulnerability to vibration and shocks, and / or all parts that, in other circumstances , would be susceptible to thermal shocks or temperature fluctuations. The thermal interface material (TIM) between the circuit board of the inverter 11 and the housing portions (100, 102) helps to achieve high capacity (eg current output) and high packing density (eg output current per spatial volume occupied by the set 200).
[0079] [0079] TIM facilitates improved heat dissipation from the electronic unit 200, as well as a possible double-sided cooling approach for semiconductor switches (20, 22). For example, TIM can enable a significant increase in the number of power and thermal cycles for semiconductor switches (20, 22). This heat dissipation approach potentially results in an improvement in the reliability of the semiconductor device, when compared to power semiconductor devices used in conventional electronic units. Thermal interface material (TIM) that is connected inside and components of the 200 set tend to minimize thermal resistance from the joining in channels of cooling agent in the heat exchanger (cold plate of the inverter). A larger margin between the maximum allowable junction temperature (eg, Tj_max, such as approximately 175 degrees Celsius and beyond) for power devices and maximum cooling temperature (eg, as high as 105 degrees Celsius) provides an opportunity for less mold size of semiconductor devices.
[0080] [0080] Having described the preferred modality, it will be apparent that various modifications can be made without departing from the scope of the invention defined in the appended claims.

权利要求:
Claims (22)
[0001]
Electronic unit (200) for an inverter, characterized by the fact that the electronic unit comprises: a substrate (34) with a dielectric layer (54) and traces of metallic circuit; a plurality of DC input terminals (42, 44), each comprising a surface mount connector mounted on the substrate (34) and electrically connected to one or more of the traces of the metallic circuits; a first semiconductor (20) and a second semiconductor (22) mounted on the substrate (34) and electrically coupled together between the input terminals (42, 44); a primary metal island (24) mounted on the substrate (34) and located in a primary zone between the first semiconductor (20) and the second semiconductor (22), the primary metal island (24) having a greater height or thickness than the traces of the metallic circuit, the primary metallic island (24) providing a heat sink to radiate heat; and a secondary metal island (26) mounted on the substrate (34) and located in a secondary zone between the adjacent of the surface mount connectors (36, 38, 40, 42, 44).
[0002]
Electronic unit according to claim 1, characterized by the fact that heat is conducted away from the primary metal island (24) through thermally conducting dielectric paths connected between the primary metal island and a ground plane or heat sink in a side of the substrate (34) opposite the primary metal island.
[0003]
Electronic unit according to claim 1, characterized by the fact that it additionally comprises: a first housing portion (100) that overlaps the substrate (34) and the primary metal island (24); wherein the heat is conducted away from the primary metal island through a first housing portion in contact with, above or in immediate proximity to the primary metal island.
[0004]
Electronic unit according to claim 3, characterized by the fact that a thermal interface material, a thermally conductive adhesive or a thermally conductive lubricant is used between the primary metal island (24) and the first housing portion (100).
[0005]
Electronic unit according to claim 3, characterized by the fact that the first semiconductor (20) and the second semiconductor (22) comprise surface-mounted transistors that are mounted on the substrate (34) and electrically connected in the corresponding traces of the metallic circuit and wherein the first housing portion (100) has an inner surface of a conjugated shape and size that corresponds to a contour or contiguous surface of the primary metal island (24) and the surface-mounted transistors.
[0006]
Electronic unit according to claim 3, characterized by the fact that the first housing portion (100) comprises a group of channels with the first housing portion in contact with, above or in immediate proximity to the primary metal island (24) for transferring heat from the primary metal island.
[0007]
Electronic unit according to claim 1, characterized in that a first housing portion (100) comprises a group of channels with the first housing portion, and in which an internal surface of the first housing portion is in contact with, above or in immediate proximity to the secondary metal island (26) for heat transfer from the secondary metal island.
[0008]
Electronic unit according to claim 1, characterized by the fact that it additionally comprises: a plurality of semiconductor pairs, each pair includes the first and second semiconductors (20, 22); wherein the surface mount connectors (36, 38, 40, 42, 44) include a plurality of outlet surface mount connectors, mounted on the substrate (34) which are electrically connected to a respective phase output terminal of the pairs of the first semiconductor and the second semiconductor (20, 22); and a tertiary metal island (28) mounted on the substrate (34) and located in a tertiary zone between the adjacent connectors (36, 38, 40, 42, 44) mounted on the output surface and the first and second semiconductors (20, 22).
[0009]
Electronic unit according to claim 8, characterized in that a first housing portion (100) comprises a group of channels with the first housing portion, and in which an internal surface of the first housing portion is in contact with, above or in close proximity to the tertiary metal island (28) for heat transfer from the tertiary metal island.
[0010]
Electronic unit for an inverter, characterized by the fact that the electronic unit comprises: a substrate (34) with a dielectric layer and traces of metallic circuit; a first housing portion (100) for mounting above the substrate, the first housing portion having a plurality of cooling channels (411, 412, 414, 416, 418) located therein; a second housing portion mounted below the substrate; a plurality of DC input terminals (42, 44), each comprising a surface mount connector mounted on the substrate and electrically connected to one or more of the metallic circuits; a first semiconductor (20) and a second semiconductor (22) mounted on the substrate and electrically coupled together between the input terminals; a primary metallic island (24) mounted on the substrate and located in a primary zone between the first semiconductor and the second semiconductor, the primary metallic island having a greater height or thickness than the traces of the metallic circuit, the primary metallic island providing a heatsink from heat to radiate heat for transfer through the cooling channels in the first portion of contiguous casing in contact with, above or in immediate proximity to the primary metallic island; and a secondary metal island (26) mounted on the substrate and located in a secondary zone between the adjacent surface mount connectors.
[0011]
Electronic unit according to claim 10, characterized by the fact that the cooling channels (411, 412, 414, 416, 418) of the first housing portion (100) additionally comprise: a series of intake cooling channels for conducting / circulating the cooling agent in the first housing portion, the intake channels adapted to receive cooling agent from an intake orifice.
[0012]
Electronic unit according to claim 10, characterized by the fact that the cooling channels (411, 412, 414, 416, 418) of the first housing portion (100) additionally comprise: a series of exhaust cooling channels for conducting / circulating a cooling agent in the first housing portion, the exhaust channels adapted for exhaustion of the cooling agent to an exhaust orifice.
[0013]
Electronic unit according to claim 10, characterized by the fact that the cooling channels (411, 412, 414, 416, 418) of the first housing portion (100) comprise: an inlet port in the first housing portion for receiving a cooling agent; a series of intake cooling channels for conducting / circulating the cooling agent in the first housing portion, the intake channels communicating with a dispensing portion associated with the intake orifice; a series of exhaust cooling channels for conducting / circulating the cooling agent in the first housing portion, the exhaust channels communicating with a curved transition portion between the intake channels and the exhaust cooling channels; and an escape orifice in the first housing portion to exhaust the cooling agent.
[0014]
Electronic unit according to claim 13, characterized by the fact that it additionally comprises: a radiator (950) for receiving the exhausted cooling agent; and a pump (952) associated with the radiator to circulate the cooling agent in the radiator and in the first housing portion (100).
[0015]
Electronic unit according to claim 11, characterized by the fact that the cooling channels (411, 412, 414, 416, 418) of the second housing portion (102) comprise a series of intake cooling channels or a series of exhaust cooling channels in the second housing portion and underlying the secondary metal island (26).
[0016]
Electronic unit according to claim 11, characterized by the fact that it additionally comprises: a plurality of semiconductor pairs, each pair includes the first and second semiconductors (20, 22); where the surface mount connectors (36, 38, 40, 42, 44) include a plurality of outlet surface mount connectors mounted on the substrate (34), each of the outlet surface mount connectors is electrically connected in a respective phase output terminal of each of the pairs of the first semiconductor (20) and the second semiconductor (22); and a tertiary metal island (28) mounted on the substrate and located in a tertiary zone between the adjacent surface mount connectors and the first and second semiconductors.
[0017]
Electronic unit according to claim 16, characterized by the fact that the cooling channels (411, 412, 414, 416, 418) of the second housing portion (102) comprise a series of intake cooling channels or a series of exhaust cooling channels in the second housing portion and underlying the tertiary metal island (28).
[0018]
Electronic unit according to claim 10, characterized in that an internal surface of the first housing portion (100) conforms in size and shape to match the substrate (34) filled with one or more surface mounting components .
[0019]
Electronic unit according to claim 18, characterized by the fact that the first and second semiconductors comprise transistors, and the surface mount components comprise one or more of the following components: the transistors, capacitors and connectors (36, 38, 40, 42, 44) surface mounted.
[0020]
Electronic unit according to claim 10, characterized by the fact that the first semiconductor (20) and the second semiconductor (22) comprise surface mount transistors that are mounted on the substrate (34) and electrically connected in corresponding traces of metallic circuit .
[0021]
Electronic unit according to claim 10, characterized by the fact that the second housing portion (102) has one or more cooling fins for heat dissipation.
[0022]
Electronic unit according to claim 10, characterized in that the first housing portion (100) and the second housing portion (102) combine to form a housing for the substrate (34).

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法律状态:
2015-12-15| B03A| Publication of an application: publication of a patent application or of a certificate of addition of invention|

2018-10-30| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|

2020-07-14| B06U| Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure|

2021-01-12| B09A| Decision: intention to grant|

2021-02-17| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/03/2015, OBSERVADAS AS CONDICOES LEGAIS. |

优先权:

申请号 | 申请日 | 专利标题

US201461971590P| true| 2014-03-28|2014-03-28|

US61/971,590|2014-03-28|

US14/291,996|US9504191B2|2014-03-28|2014-05-30|Electronic assembly for an inverter|

US14/291,996|2014-05-30|

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