• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    REFRIGERATION AND ELECTRONIC APPLIANCE AND METHOD FOR COOLING AN ELECTRIC SUBSTRATE A refrigerating apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first outer cooling surface. A first fluid divergence structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second outer cooling surface. A second fluid divergence structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first outer cooling surface and the second outer cooling surface. An intermediate portion is in facing relationship with the first outer portion and the second outer portion. The intermediate portion defines an opening for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.
    公开号:BR102013027724B1
    申请号:R102013027724-0
    申请日:2013-10-29
    公开日:2021-08-31
    发明作者:Gregory K. Harmelink；Christopher J. Schmit
    申请人:Deere & Company；
    IPC主号:
    专利说明:

    Description field
    [001] The present description in general refers to an apparatus and a method for cooling an electrical substrate. Description Knowledge
    [002] To cool an electrical substrate and the electrical components mounted to it, a certain prior art uses a heat sink or housing with a heat sink for heat dissipation. Description Summary
    [003] In one embodiment, a refrigeration apparatus comprises a first external portion comprising a fluid inlet and a first external refrigeration surface. A first fluid divergence structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second outer cooling surface. A second fluid divergence structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first outer cooling surface and the second outer cooling surface. An intermediate portion is in facing relationship with the first outer portion and the second outer portion. The intermediate portion defines an opening for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. Fluid is capable of being transported through the fluid inlet, the fluid divergence structure, the first cavity, the opening, the second cavity, the second fluid divergence structure, and the fluid outlet. The fluid absorbs heat from the electrical substrate.
    [004] In another embodiment, an electronic device comprises a second electrical substrate that is coupled to the second external cooling surface. The fluid absorbs heat from the first outer cooling surface and the second outer cooling surface.
    [005] Other features and aspects will be apparent from consideration of the detailed description and attached drawings. Brief Description of Drawings
    [006] Fig. 1 is a top perspective view of a refrigeration apparatus according to an embodiment.
    [007] Fig. 2 is a bottom perspective view of the refrigeration apparatus shown in Fig. 1.
    [008] Fig. 3A is a partially exploded front view of the refrigeration apparatus shown in Fig. 1.
    [009] Fig. 3B is a close-up view of a portion of the refrigeration apparatus shown in Fig. 3A.
    [0010] Fig. 4A is a partially exploded rear view of the refrigeration apparatus shown in Fig. 1.
    [0011] Fig. 4B is a close-up view of a portion of the refrigeration apparatus shown in Fig. 4A.
    [0012] Fig. 5 is a schematic of an illustrative system incorporating the refrigeration apparatus shown in Fig. 1.
    [0013] Fig. 6 is a perspective view of a refrigeration apparatus according to another embodiment.
    [0014] Fig. 7 is a partially exploded front view of a refrigeration apparatus according to a further modality.
    [0015] Before any modalities are explained in detail, it is understood that the description is not limited in its application to the construction details and arrangement of components defined in the following description or illustrated in the following drawings. Description is capable of other modalities and of being practiced or performed in various ways. Additional embodiments of the invention may include any combination of features from one or more dependent claims, and such features may be incorporated, collectively or separately, in any independent claim. As defined herein, a substrate comprises a dielectric layer, a metallic trace layer, and one or more components, electrical devices, electronic devices, semiconductors (e.g., power semiconductors), inductors, capacitors, integrated circuits, or resistors. Detailed Description
    [0016] Figs. 1 to 5 illustrate a refrigeration apparatus 10 for dissipating heat from an electronic assembly or an electrical device. Referring to Fig. 1, the refrigeration apparatus 10 comprises a support structure 15.
    [0017] With reference to Fig. 2, the support structure 15 comprises a plurality of terminals 20 for coupling to a conductor 25. The conductor 25 may terminate in a terminal that is suitable for mechanical or electrical connection to the respective terminal 20. Alternatively, conductor 25 may be coupled to terminals 27. In one embodiment, conductor 25 may comprise an insulated cable or wire with a dielectric grommet 30 or other protrusion. The dielectric grommet 30 may be positioned within a conductor deformation relief structure 35. A cover (not shown) may be positioned over the terminals 20 and conductor 25 to seal them from the environment. Conductor deformation relief structure 35 helps to reduce deformation in the area where conductor 25 is coupled to terminal 20, 27 along a longitudinal axis 40 of conductor 25. Deformation along longitudinal axis 40 is prevented by the structure of conductor deformation relief 35 which contacts the dielectric grommet 30. This helps to ensure that the conductor 25 remains coupled to the terminal 20, 27.
    [0018] Referring to Figs. 3 and 4A, a first outer portion 45 is supported by the support structure 15. A plurality of fasteners 47 (Fig. 2) can be used to secure the first outer portion 45 to the support structure 15. The first outer portion 45 comprises an inlet of fluid 50.
    [0019] The first outer portion 45 comprises a first fluid divergence structure 55. The first fluid divergence structure 55 is in fluid communication with the fluid inlet 50 for receiving fluid therefrom. The fluid can be composed of one or more of the following: water, alcohol, ethylene glycols, propylene glycol, antifreeze, an aqueous solution, a solution based on thermally conductive oil, refrigerant, fluorocarbon oil, oil or other type of refrigerant. Referring to Fig. 4A, the first fluid divergence structure 55 may define a first spiral fluid path 60. The first fluid divergence structure 55 may comprise a plurality of flow diverters 65. Referring to Fig. 4B, the spiral fluid path 60, as shown by the arrow (Fig. 4A), can be defined partially or completely by a curved wall 62 and is configured to diverge the fluid into a generally curved or spiral pattern (eg, spiral, skewed, curved spiral). Flow diverters 65 (e.g., protrusions, cylindrical members, finned channels, or other cooling features) may be positioned along the first spiral fluid path 60 to facilitate heat transfer. In one embodiment, each flow diverter 65 may have a generally cylindrical shape or a generally elliptical cross section. In an alternative embodiment, one or more curved walls or labyrinths can direct the fluid flow in a generally spiral pattern.
    [0020] Referring to Fig. 3A, the first outer portion 45 comprises a first outer cooling surface 70. A first electrical substrate 75 (eg circuit board) may be mechanically coupled to the first outer cooling surface 70. In one embodiment, the first outer cooling surface 70 may be at ground potential and electrically coupled to a ground connection of substrate 75.
    [0021] Referring to Fig. 4A, the first electrical substrate 75 may comprise a first inner electrical substrate 80 coupled to the first outer cooling surface 70 (Fig. 3). The first inner electrical substrate 80 may comprise a metal layer 85 which contacts the first outer cooling surface 70 (e.g., ground potential) to facilitate heat transfer. Additionally or alternatively, a thermally conductive adhesive 90 may be applied between the first inner electrical substrate 80 and the first outer cooling surface 70 to facilitate heat transfer and to adhesively bond the first inner electrical substrate 80 and the first surface of outdoor refrigeration 70.
    [0022] A first spacer 95 can be applied between the first inner electrical substrate 80 and the first outer cooling surface 70 to facilitate heat dissipation to the environment. First spacer 95 may comprise metal or other thermally conductive material to facilitate heat transfer.
    [0023] A first external electrical substrate 100 may be coupled to the first spacer 95. Referring to Fig. 3A, electrical components 105 (e.g., power semiconductors) may be coupled to the first external electrical substrate 100 and the first electrical substrate internal 80 (Fig. 4A).
    [0024] A second outer portion 110 is supported by the support structure 15. A plurality of fasteners 47 (Fig. 2) can be used to secure the second outer portion 110 to the support structure 15. The second outer portion 110 comprises an outlet of fluid 115.
    [0025] The second outer portion 110 comprises a second fluid divergence structure 120. The second fluid divergence structure 120 is in fluid communication with the fluid outlet 115 to transfer fluid therefrom. The second fluid divergence structure 120 may define a second spiral fluid path 125. The second fluid divergence structure 120 may comprise a plurality of flow diverters 127. Referring to Fig. 3B, the second spiral fluid path 125 , as shown by the arrow (Fig. 3A) can be defined, partially or completely, by a curved wall 129 and is configured to diverge the fluid into a generally curved pattern or spiral pattern (eg spiral, skewed spiral, curved) . Flow diverters 127 (e.g., protrusions, cylindrical members, finned channels, or other cooling features) may be positioned along the second spiral fluid path 125 to facilitate heat transfer. In one embodiment, each flow diverter 127 may have a generally cylindrical shape or a generally elliptical cross section. In an alternative embodiment, one or more curved walls or labyrinths can direct the fluid flow in a generally spiral pattern.
    [0026] Referring to Fig. 4A, the second outer portion 110 comprises a second outer cooling surface 130. A second electrical substrate 135 (eg circuit board) may be coupled to the second outer cooling surface 130.
    [0027] Referring to Fig. 3A, the second electrical substrate 135 may comprise a second inner electrical substrate 140 coupled to the second outer cooling surface 130 (Fig. 4A). The second inner electrical substrate 140 may comprise a metal layer 145 which contacts the second outer cooling surface 130 (e.g., at ground potential) to facilitate heat dissipation to the environment. Additionally or alternatively, thermally conductive adhesive 90 may be applied between the second inner electrical substrate 140 and the second outer cooling surface 130 to facilitate heat transfer and to adhesively bond the second inner electrical substrate 140 and the second surface of outdoor refrigeration 130.
    [0028] A second spacer 150 can be applied between the second inner electrical substrate 140 and the second outer cooling surface 130 to facilitate heat dissipation to the environment. Second spacer 150 may comprise metal or other thermally conductive material to facilitate heat transfer.
    [0029] A second external electrical substrate 155 may be coupled to the second spacer 150. Referring to Fig. 4A, the electrical components 105 (e.g., power semiconductors) may be coupled to the second external electrical substrate 155 and the second electrical substrate internal 140 (Fig. 3A).
    [0030] An intermediate portion 160 is in a facing relationship with the first outer portion 45 and the second outer portion 110. The first outer portion 45, the intermediate portion 160 and the second outer portion 110 can be secured together using a plurality of fixatives or other techniques. Intermediate portion 160 may comprise a generally flat gasket 165 (e.g., elastic, deformable, metal, synthetic polymer, rubber, or elastomer).
    [0031] A first cavity 170 is defined between the first outer portion 45 and the intermediate portion 160. Referring to Fig. 3A, a second cavity 175 is defined between the second outer portion 110 and the intermediate portion 160.
    [0032] The intermediate portion 160 defines an opening 180 for transferring fluid between the first cavity 170 (Fig. 4A) and the second cavity 175. Alternatively, a plurality of openings 180 may be defined. Opening 180 can be centrally disposed.
    [0033] With reference to Figs. 1-4, a first coupler 185 is coupled to fluid inlet 50 for providing fluid to coupling apparatus 10. A second coupler 190 is coupled to fluid outlet 115 for receiving fluid from refrigeration apparatus 10. In a In one embodiment, the first and second couplers 185, 190 are secured to the fluid inlet 50 or fluid outlet 115 through compression fittings or corresponding threads of the first and second couplers 185, 190 and the fluid inlet and outlet 50, 115.
    [0034] Referring to Fig. 5, after the heated fluid enters the second coupler 190 (Fig. 1) of the refrigeration apparatus 10, the heated fluid is received by a radiator 195, or other apparatus, to remove heat from the fluid. The cooled fluid is then received by a pump 200 which returns the cooled fluid to the first coupler 185 (Fig. 1) of the refrigeration apparatus 10 such that the cooled fluid can absorb and transfer heat from its path through the first cavity 170 (Fig. 4A) and the second cavity 175 (Fig. 3A).
    [0035] In operation, the fluid is capable of being transported in the first and second spiral fluid paths 60, 125 through the fluid inlet 50, the first fluid divergence structure 55, the first cavity 170, the opening 180, the second cavity 175, second fluid divergence structure 120, and fluid outlet 115. The fluid supports heat dissipation from the first and second electrical substrates 75, 135, where the fluid absorbs heat during circulation through the first cavity 170 and second cavity 175.
    [0036] In another embodiment, a method for cooling first and second electrical substrates 75, 135 comprises directing a fluid flow through a fluid inlet 50 of a first outer portion 45. The fluid flow is diverged through a first fluid diverging structure 55 of first outer portion 45 for dissipating heat from first inner electrical substrate 80 coupled to a first outer cooling surface 80 of first outer portion 45. Fluid flow is directed through a first cavity 170 defined between the first outer portion 45 and an intermediate portion 160. Fluid flow is transferred from the first cavity 170 through an opening 180 defined by the intermediate portion 160 to a second cavity 175 defined between a second outer portion 110 and the portion. intermediate 160. The flow is diverged through a second fluid diverging structure 120 of the second outer portion. 110 to dissipate heat from a second, inner electrical substrate 140 coupled to a second outer cooling surface 130 of the second outer portion 110. Fluid flow is directed through a fluid outlet 115 of the second outer portion 110.
    [0037] Fig. 6 illustrates a refrigeration apparatus 210 according to one more embodiment. The refrigeration apparatus 210 includes features similar to the refrigeration apparatus 10 of Figs. 1 to 5 and therefore similar components have been given as reference numbers plus 200 and only differences between refrigeration appliances 10 and 210 will be discussed in detail below.
    [0038] A first outer portion 245 comprises a fluid inlet 250. The fluid inlet 250 is positioned on a first side 212 of the refrigeration apparatus 210.
    [0039] A second outer portion 310 comprises a fluid outlet 315. The fluid outlet 315 is positioned on a second side 214, opposite the first side 212, of the refrigeration apparatus 210. The positioning of the fluid outlet 315 opposite the inlet of fluid 250 reduces the preheating of the cooled fluid entering the refrigeration apparatus 210 to increase the efficiency of thermal heat dissipation. The refrigeration apparatus disclosed in this document is well suited to dissipating heat generated by electrical components or devices mounted on one or more substrates of an electronic assembly (eg, an inverter, motor, or electronic controller). Additionally, the dual spiral path, with or without internal protrusions or fins, supports or facilitates the efficient thermal dissipation of heat generated by substrate components or fixtures through the fluid.
    [0040] Fig. 7 illustrates a refrigeration apparatus 410 according to one more embodiment. The refrigeration apparatus 410 includes features similar to the refrigeration apparatus 10 of Figs. 1 to 5 and therefore similar components were given as reference numerals plus 400 and only differences between refrigeration appliances 10 and 410 will be discussed in detail below.
    [0041] A first outer portion 445 comprises a first fluid divergence structure 455. A second outer portion 510 comprises a second fluid divergence structure 520. The first and second fluid divergence structures 455, 520 may define a first and a second spiral fluid path 460, 525, respectively. The first and second fluid divergence structures 455, 520 may comprise a plurality of flow diverters 465, 527, respectively. The plurality of flow diverters 465, 527 may comprise microchannels 528.
    [0042] Several functionalities are defined in the following claims.
    权利要求:
    Claims (20)
    [0001]
    1. A refrigeration apparatus (10), comprising: a first outer portion (45) comprising a fluid inlet (50), a first outer cooling surface (70), and a first fluid diverging structure (55) is in fluid communication with the fluid inlet (50); a second outer portion (110) comprising a fluid outlet (115), a second outer cooling surface (130), and a second fluid diverging structure (120) is in fluid communication with the fluid outlet (115) ; an electrical substrate (75, 80, 100, 135, 140, 155) is coupled to at least one of the first outer cooling surface (70) and the second outer cooling surface (130); and an intermediate portion (160) is in facing relationship with the first outer portion (45) and the second outer portion (110), the intermediate portion (160) defines an opening (180) for transferring a fluid between a first cavity ( 170) and a second cavity (175), the first cavity (170) is defined between the first outer portion (45) and the intermediate portion (160), the second cavity (175) is defined between the second outer portion (110) and the middle portion (160); wherein the fluid is capable of being transported through the fluid inlet (50), the first fluid divergence structure (55), the first cavity (170), the opening (180), the second cavity (175), the second fluid divergence structure (120), and fluid outlet (115), for dissipating heat from the electrical substrate (75, 80, 100, 135, 140, 155), characterized in that the opening (180) is centrally arranged.
    [0002]
    2. Refrigeration apparatus (10) according to claim 1, characterized in that the intermediate portion (160) comprises a generally flat gasket (165).
    [0003]
    3. A refrigeration apparatus (10) according to claim 1, characterized in that the first fluid divergence structure (55) defines a first spiral fluid path (60) configured to diverge the fluid in a general pattern. spiral to the opening (180) and the second fluid divergence structure (120) define a second spiral fluid path (125) configured to diverge the fluid in a generally spiral pattern to the fluid outlet (115).
    [0004]
    4. Refrigeration apparatus (10) according to claim 3, characterized in that the first spiral fluid path (60) is defined, partially or completely, by a curved wall (62) and the second spiral fluid path (125) is defined, partially or completely, by a curved wall (129).
    [0005]
    5. Cooling apparatus (10) according to claim 1, characterized in that the electrical substrate (75) comprises the first inner electrical substrate (80) coupled to the first outer cooling surface (70).
    [0006]
    6. A refrigeration apparatus (10) according to claim 5, characterized in that it further comprises a first spacer (95) coupled to the first internal electrical substrate (80) and a first external electrical substrate (100) coupled to the first spacer (95).
    [0007]
    7. Cooling apparatus (10) according to claim 1, characterized in that the electrical substrate (135) comprises a second inner electrical substrate (140) for the second outer cooling surface (130).
    [0008]
    8. A refrigeration apparatus (10) according to claim 7, characterized in that it further comprises a second spacer (150) coupled to the second internal electrical substrate (140) and a second external electrical substrate (155) coupled to the second spacer (150).
    [0009]
    9. Refrigeration apparatus (10) according to claim 1, characterized in that it further comprises a support structure (15) configured to support the first outer portion (45) and the second outer portion (110).
    [0010]
    10. Refrigeration apparatus (10) according to claim 9, characterized in that the support structure (15) comprises a terminal (20) and defines a conductor deformation relief structure (35), the terminal ( 20) configured to receive a conductor (25) that is in electrical communication with the electrical substrate (75, 80, 100, 135, 140, 155), the conductor deformation relief structure (35) configured to reduce deformation in the conductor (25).
    [0011]
    11. A refrigeration apparatus (10) according to claim 1, characterized in that the first fluid divergence structure (55) and the second fluid divergence structure (120) comprise a flow diverter (65, 127 ) configured to facilitate heat transfer with the fluid.
    [0012]
    12. Electronic apparatus, comprising: a first outer portion (45) comprising a fluid inlet (50), a first outer cooling surface (70), and a first fluid diverging structure (55) is in fluid communication with the fluid inlet (50); a first inner electrical substrate (80) coupled to the first outer cooling surface (70); a second outer portion (110) comprising a fluid outlet (115), a second outer cooling surface (130), and a second fluid diverging structure (120) is in fluid communication with the fluid outlet (115) ; a second inner electrical substrate (140) coupled to the second outer cooling surface (130); and, an intermediate portion (160) is in facing relationship with the first outer portion (45) and the second outer portion (110), the intermediate portion (160) defines an opening (180) for transferring a fluid between a first cavity. (170) and a second cavity (175), the first cavity (170) is defined between the first outer portion (45) and the intermediate portion (160), the second cavity (175) is defined between the second outer portion (110 ) and the intermediate portion (160); wherein the fluid is capable of being transported through the fluid inlet (50), the first fluid divergence structure (55), the first cavity (170), the opening (180), the second cavity (175), the second fluid divergence structure (120), and fluid outlet (115), for dissipating heat from the first outer cooling surface (70) and the second outer cooling surface (130), characterized in that the opening (180) is centrally disposed.
    [0013]
    13. Electronic apparatus according to claim 12, characterized in that each of the first internal electrical substrate (80) and the second internal electrical substrate (140) comprises a metal layer (85) that contacts the first cooling surface exterior (70) and the second exterior cooling surface (130), respectively, to facilitate heat transfer.
    [0014]
    14. Electronic apparatus according to claim 12, characterized in that it further comprises a thermally conductive adhesive (90) applied between the first internal electrical substrate (80) and the first external cooling surface (70) and between the second substrate inner electrical (140) and second outer cooling surface (130) to facilitate heat transfer and to adhesively bond the first and second inner electrical substrates (80, 140) to respective first and second outer cooling surfaces (70, 130).
    [0015]
    15. Electronic apparatus according to claim 12, characterized in that it further comprises a spacer (95, 150) applied between the first internal electrical substrate (80) and the first external cooling surface (70) and between the second substrate internal electric (140) and the second external cooling surface (130) to facilitate heat transfer.
    [0016]
    16. Electronic apparatus according to claim 15, characterized in that the spacer (95, 150) comprises a metal.
    [0017]
    17. Electronic device according to claim 12, characterized in that the intermediate portion (160) comprises a generally flat gasket (165).
    [0018]
    18. The electronic apparatus of claim 12, characterized in that the first fluid divergence structure (55) defines a first spiral fluid path (60) configured to diverge the fluid in a generally spiral pattern to the opening (180) and the second fluid divergence structure (120) define a second spiral fluid path (125) configured to diverge fluid in a generally spiral pattern to the fluid outlet (115).
    [0019]
    19. Electronic apparatus according to claim 12, characterized in that it further comprises a support structure (15) configured to support the first outer portion (45) and the second outer portion (110).
    [0020]
    20. A method for cooling an electrical substrate (75, 80, 100, 135, 140, 155), the method comprising: directing a flow of fluid through a fluid inlet (50) of a first outer portion (45); diverging fluid flow through a first fluid diverging structure (55) of the first outer portion (45) to dissipate heat from the first inner electrical substrate (80) coupled to a first outer cooling surface (70) of the first outer portion (45); directing fluid flow through a first cavity (170) defined between the first outer portion (45) and an intermediate portion (160); characterized by transferring fluid flow from the first cavity (170) through a centrally disposed opening (180) defined by the intermediate portion (160) to a second cavity (175) defined between a second outer portion (110) and the middle portion (160); diverging flow through a second fluid diverging structure (120) of the second outer portion (110) to dissipate heat from a second inner electrical substrate (140) coupled to a second outer cooling surface (130) of the second portion external (110); and, directing fluid flow through a fluid outlet (115) of the second outer portion (110).
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    同族专利:
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    US10483028B2|2017-12-18|2019-11-19|Deere & Company|Electrical assembly having cavities for coolant|
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    法律状态:
    2014-12-30| B03A| Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]|
    2018-11-21| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-01-14| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-03-02| B07A| Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]|
    2021-08-03| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-08-31| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/10/2013, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    US13/664,823|US8867210B2|2012-10-31|2012-10-31|Cooling apparatus for an electrical substrate|
    US13/664823|2012-10-31|
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