• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    LIGHT-EMITTING DEVICE. The present invention relates to a light-emitting device includes a substrate (10), a light-emitting element (30), a first resin member (40) and a second resin member (20). The substrate (10) includes a base member (11), a plurality of electrical network portions arranged on a surface of the base member (11), and a coating layer (15) that covers the electrical network portions with a opening formed in the part of the coating layer (15). The light-emitting element (30) is arranged on the substrate (10) at the opening of the coating layer (15) and having a top surface at a higher position than the coating layer (15). The first resin member (40) is arranged at least at the opening of the coating layer (15) and at the periphery of the light-emitting element (30). The second resin member seals the substrate (10) and the light-emitting element (30). The second resin member (20) is arranged in contact with the first resin member (40).
    公开号:BR102013020170B1
    申请号:R102013020170-7
    申请日:2013-08-07
    公开日:2020-12-08
    发明作者:Kazuhiro Kamada
    申请人:Nichia Corporation；
    IPC主号:
    专利说明:

    CROSS REFERENCE TO RELATED ORDERS
    [001] This application claims priority to Japanese Patent Application No. 2012-176846 filed in Japan on August 9, 2012, the entire description of which is incorporated herein for reference. BACKGROUND OF THE INVENTION 1. Field of the Invention
    [002] The present invention relates to a light emitting device in which a sealing member is disposed on a substrate and a light emitting element. 2. Background Information
    [003] Conventionally, a light-emitting device is proposed in which a light-emitting element and other components are arranged on a substrate.
    [004] In such a light-emitting device, in order to maintain brightness and directivity etc., the light-emitting element can be covered with a light-transmitting resin member having a shape that can exert a light effect or the like (for example, see JP 2007-201171A).
    [005] However, a resin member sealing a lens shape that is projected high from the substrate, can easily detach from the substrate by receiving impact from the outside or similar. SUMMARY OF THE INVENTION
    [006] The present invention is designed to solve the problems as described above, and aims to provide a light-emitting device having a sealing resin member that has greater adhesion.
    [007] The present invention includes the aspects described below. (1) A light-emitting device includes a substrate, a light-emitting element, a first resin member and a second resin member. The substrate includes a base member, a plurality of portions of electrical network disposed on a surface of the base member, and a coating layer covering the portion of electrical network with an opening formed in a part of the coating layer. The light-emitting element is arranged on the substrate within the opening of the coating layer and with a surface superior to a position higher than the coating layer. The first resin member is arranged at least within the opening of the coating layer and at the periphery of the light-emitting element. The second resin member seals the substrate and the light-emitting element. The second resin member is arranged in contact with the first resin member. (2) The light-emitting device as described above, wherein the first resin member and the second resin member contain the same polymer. (3) The light-emitting device according to any one of the above, wherein the first resin member is disposed within the inner portion of the opening and on the coating layer. (4) The light-emitting device according to any of those described above, wherein an outer edge of the second resin member is disposed on the coating layer. (5) The light-emitting device according to any of those described above, wherein an outer edge of the second resin member is arranged above the coating layer and on the first resin member. (6) The light-emitting device according to any of those described above, wherein an outer edge of the second resin member is arranged on the first resin member at the opening of the coating layer. (7) The light emitting device according to any of the above, in which the first resin member still includes a reflective material. The present invention can provide a light-emitting device including a sealing resin member having good adhesion. BRIEF DESCRIPTION OF THE DRAWINGS
    [008] FIG. 1A is a schematic plan view showing an embodiment of a light emitting device in accordance with the present invention.
    [009] FIG. 1B is a schematic cross-sectional view showing an embodiment of a light emitting device according to the present invention.
    [0010] FIG. 2 is a schematic cross-sectional view showing another embodiment of a light-emitting device according to the present invention.
    [0011] FIG. 3 is a schematic cross-sectional view showing yet another embodiment of a light-emitting device according to the present invention.
    [0012] FIG. 4 is a schematic cross-sectional view showing yet another embodiment of a light-emitting device according to the present invention.
    [0013] FIG. 5 is a schematic cross-sectional view showing yet another embodiment of a light-emitting device according to the present invention. DETAILED DESCRIPTION OF THE MODALITIES
    [0014] A light-emitting device according to an embodiment of the present invention includes a substrate, a light-emitting element, a first resin member, and a second resin member. Substrate
    [0015] The substrate includes at least one base member, a plurality of portions of electrical networks arranged on the base member, and a coating layer disposed on the portions of electrical networks. The base member is a base material for a light-emitting device and can be formed using an appropriate material according to the purpose and applications. The base material can be appropriately selected in view of the type of assembly of the light emitting element, the reflectance, the ability to adhere with other members, etc., and examples of them include insulation materials such as plastic, glass, and ceramics. More specifically, a resin such as polyethylene terephthalate and polyimide can preferably be used. Particularly, in the case where solder is used to assemble the light-emitting element, polished, which has high thermal resistance, it is most preferably used. In addition, a material having high optical reflectance (for example, a white filler such as titanium oxide) can be contained in the material constituting the base member. The thickness of the base member is not specifically limited and, for example, a thickness of about 10 μm for several mm can be used. The substrate can have flexibility, in which case, the thickness of 10 μm to 100 μm can be used.
    [0016] The base member can be formed with an appropriate shape (size, length) according to the purpose and use. For example, a shape such as a square shape, a rectangular shape, a polygonal shape, a circular shape, an elliptical shape, or a shape that is a combination of these shapes can be employed. In the case where the light-emitting device according to one embodiment of the present invention is used, branched-tube lamps, an elongated shape with a length ten times or greater than its width in the lateral range can preferably be employed. More specifically, for a branched tube type lamp with a length of about 120 cm, a base member having a width of 0.5 cm to 5 cm and a length of 30 cm to 120 cm can be employed. Particularly, in the case of employing a flexible base that allows its use in a deformed state, such as in a curved or inclined shape, the flexible base member having a width and length of several mm to several cm greater than the width and length of the corresponding branched tube type lighting can be used. In addition, in the event that a flexible base member is employed, several units of such an elongated base member (substrate) can be processed together using the roll-to-roll method. In this case, articulated holes can be provided in the base member.
    [0017] The plurality of portions of electrical networks are electrically conductive members that allow an external energy source to be connected are arranged on a surface of the base member, then directly or indirectly connected to the light emitting element. The portions of electrical networks can be made of an electrically conductive thin layer having a single layer structure or a stacked layer structure of metal such as copper or aluminum or an alloy thereof. The spinning portion can be arranged not only on one surface of the base member, but also on an inner side or on another surface, according to the types of the base member. The thickness of the electrical network portion is not specifically limited and a thickness of the electrical network portion of the substrates generally used in the art can be applied. For example, about several μm to several mm can be used. Particularly, in the case where a flexible base member is used as described above, the portions of electrical networks preferably have a thickness that does not impair flexibility, and thus, for example, a thickness of about 8 μm to 150 μm can be employed.
    [0018] The shape (pattern) of a plurality of portions of electrical networks is not specifically limited, and generally, a similar shape or shape of conformation of the shape or pattern of the electrical network of the substrate for mounting the light emitting element can be maid. The shape is preferably designed for additional consideration such as a property of heat release and / or mechanical strength. For example, a polygonal shape such as a crank shape, a triangular shape, and a quadrangular shape, a shape without sharp edges, such as a circular shape and an elliptical shape, and a shape with partially irregular shapes can be used alone. or in combination. The corners of the mains portions are preferably rounded.
    [0019] The plurality of portions of electrical networks are arranged spaced apart from each other in which, in addition to the portions of electrical networks directly or indirectly electrically connected to the corresponding light-emitting elements (that is, the portions of electrical networks to provide electrical continuity), a portion of electrical networks that does not contribute to conducting electricity and has a similar shape or a different shape can also be arranged. The portion of electrical networks that does not contribute to the provision of electrical continuity can serve as a heat-release member or a mounting portion for the light-emitting element. For example, in the case where the base member has a rectangular shape, portions of electrical networks that do not contribute to providing electrical continuity are preferably extended to the extremity portions in the longitudinal and also in the lateral direction, arranged in both the sides of the portions of electrical networks. Portions of electrical networks can be provided with terminals for external connection. For example, connectors, etc. they can be arranged to supply electricity to the light-emitting elements from the external energy source. Such a portion of electrical networks, particularly in the case where it is arranged on a flexible base member, can reduce the stress that is generated, for example, by bending the substrate and loaded on the light-emitting element and the second resin member, disposing a part of it in an approximately whole area (preferably in a continuous way). Specifically, in the case where a base member of the elongated shape is used, the electrical network portions are preferably arranged elongated along the longitudinal direction of the basic member, and more preferably, the electrical network portions are arranged with a length of 1/3 to 1 of the longitudinal length of the base member.
    [0020] The portions of electrical networks capable of contributing to the conduction of electricity are formed from a positive terminal and a negative terminal and the number of portions of electrical networks that constitute a pair of the terminal is not specifically limited. For example, each pair of terminal portions can be formed from a single terminal or can be formed from a plurality of terminals. Portions of electrical networks capable of contributing to the conduction of electricity are, for example, preferably connected to a pair of external electrical networks respectively. With this arrangement, electrical energy is supplied from external electrical networks. The external mains pair is preferably connected to the corresponding portions of known connectors (not shown).
    [0021] As described above, the arrangement of portions of electrical networks in a relatively large flat dimension with a combination of portions of electrical networks having various shapes, makes it possible to increase the degree of freedom arrangement of the light emitting device. For example, with a rectangular base member, it is possible for six light-emitting elements to be arranged three in a longitudinal direction and two in the lateral direction as a block and connected in parallel, then twelve blocks are arranged in the longitudinal direction and connected in series by portions of electrical networks that can serve as a pair of terminal portions. It can be such that the base member has approximately a square shape, approximately a circular shape, or an approximately ellipsoidal shape, in which a light-emitting element is connected to the positive and negative standard electrical network portions respectively. Arranging the portions of electrical networks on a surface respectively with the largest possible planar dimension enables an increase in heat dissipation.
    [0022] On a surface of the base member, the plurality of portions of electrical networks are spaced apart from each other, which provides grooves where the portions of electrical networks are not arranged (that is, portions in which the base member is exposed). The grooves are arranged between the portions of electrical networks, so that the shapes of the grooves conform to the shapes of the electrical network portions, which can be, for example, in a crank shape. The width of the grooves is preferably narrower than the width of the mains portions, in other words, the mains portions preferably have a large planar dimension, and for example, a width of about 0.05 mm to 5 mm can be employed.
    [0023] Also, in the case where the portions of electrical networks (both portions of electrical networks that contribute / do not contribute to electrical continuity) are arranged over an entire area of a surface of the base member with a relatively large planar dimension, for example, even with the use of a flexible base member, appropriate strength can be added while maintaining its flexibility, in such a way that disconnecting portions of electrical grids and disrupting the substrate due to flexing the flexible substrate can be effectively avoided. More specifically, the portions of electrical networks are arranged with an area preferably 50% or greater, more preferably 70% or greater, yet preferably 90% or greater than the area of the base member.
    [0024] The coating layer covering the portions of electrical networks can preferably serve as a reflective layer to reflect the light emitted from the light emitting element. The coating layer has, as will be described later, an opening in part of it, from which the portions of electrical networks are exposed. The coating layer preferably covers approximately the entire surface of the substrate except for the opening, therefore, the coating layer preferably covers the groove portions between the portions of electrical networks described above.
    [0025] The coating layer has an opening in part of it, as described above. In order to connect the light-emitting element with two, positive and negative, portions of electrical networks, the opening is arranged to expose portions of electrical networks. The shape and size of the opening are not specifically limited, but a minimum size sufficient for electrical connection of the light-emitting element to the portions of electrical networks is preferable. In the case of a flip-chip assembly, a part of the slot is preferably exposed in a single opening.
    [0026] Generally, the number and arrangement of the light-emitting elements are adjusted according to the power energy, light distribution, or the like of the light-emitting device, and therefore the number and positions of the openings are arranged . The number of openings can be the same as the number of the light emitting element or the number of openings can be different from the number of the light emitting element. For example, in the case where 20 units of light-emitting elements are required and each light-emitting element to be mounted in an opening, 20 openings are arranged in the coating layer. Alternatively, in the case where two light-emitting elements are to be mounted in an opening, 10 openings are arranged. In some cases, the light-emitting elements may not be mounted in the openings. For example, in the case where light-emitting devices are manufactured in different categories (for example, light-emitting devices of different powers), using the same substrate (that is, the number and arrangement of the openings provided in the coating layer are the same), an opening can be provided without having a light emitting element, which makes it possible to obtain different optical powers. Also, a region where the coating layer is missing can be arranged in the region to establish electrical continuity such as a connector.
    [0027] The coating layer is preferably made of a material that reflects emission of the light emitting element and light converted into wavelength by a light length conversion member to be described later. Examples of the materials include a resin such as a phenol resin, an epoxy resin, a BT resin, a PPA, a silicone resin and a urea resin. Also, those materials can be added with a filler such as SiO2, TiO2, Al2O3, ZrO2, or MgO, for example.
    [0028] The coating layer is preferably arranged with a relatively small thickness, and it is particularly preferable that the coating layer is arranged so that the upper surface of the light-emitting element is higher than the coating layer. With such a thickness, the first resin member to be described later can be disposed on the side surfaces of the light-emitting element. As a result, a wide distribution of light can be obtained and which is suitable for applications particularly in lighting. Light-emitting element
    [0029] In the opening described above of the coating layer on the substrate, the light emitting element can be arranged in two portions of electrical networks in a chain way or arranged in a single portion of electrical networks. With such arrangements, the light-emitting element can be electrically connected to the pair of positive and negative electrical network portions respectively. The number and / or tone of the color tone and / or the arrangement of a plurality of light-emitting elements are determined to satisfy the power and light distribution projected for the light-emitting device. This is why the shape and arrangement of the portions of electrical networks and / or openings of the coating layer are adjusted.
    [0030] The light-emitting element includes a semiconductor structure, a p- side electrode, and an n- side electrode. The semiconductor structure, for example, includes an n- type layer, an active layer, and a p- type layer respectively made of a semiconductor based on gallium nitride and stacked in order on a light transmitting sapphire substrate. It is not limited to gallium nitride based semiconductors, but also, a group of II-VI based semiconductors or a group of semiconductor based on III-V can be used. Side electrode n- and side electrode p- can be formed with a single layer or stacked layer of known materials.
    [0031] The light-emitting element can be mounted on the substrate in a "flip-chip" manner or in an upward manner. In the case of a flip-chip assembly, the p- side electrode and the n- side electrode of the light emitting element are connected to a pair of electrical network portions via a pair of connecting members respectively. For the bonding member, for example, a Sn-Ag-Cu based, Sn-Cu based solder, or an Au-Sn based, or a metal boss such as Au can be used. In the case of the upward-facing assembly, the light-emitting element is fixed to the base member (in the electrical network portion) by an insulating connection member such as a resin, or by an electrically conductive connection member as described above , and then, electrically connected to the portions of electrical networks through wires. In the case where the substrate of the light-emitting element is electrically conductive, the light-emitting element is electrically connected via a connecting member as described above.
    [0032] In addition to the light-emitting element, a protective element such as a Zener diode, or a related component, can be arranged on a substrate surface of the light-emitting device. Such a protective element and related component can be arranged together in the opening in which the light-emitting element is mounted or in a different opening provided for them. Such members are preferably arranged in such a way as not to absorb the light from the light-emitting element, and it is not necessary to have the same number of protective elements as the light-emitting elements. In this way, the protective element is preferably arranged in an appropriate position, for example, a protective element is mounted on a portion of the electrical network, to which a plurality of light-emitting elements are directly connected, in a position close to a connector independent of the arrangement of the light-emitting elements. First resin member
    [0033] A first resin member is disposed on the periphery of the light-emitting element. The first resin member must be arranged at least in the opening provided in the coating layer. Since the first resin member can be disposed on the outer periphery of the opening of the coating layer, that is, the first resin member can be disposed extending over the coating layer, or independent of the portions of electrical networks, for example , can be arranged in the grooves between the portions of electrical networks and / or directly under the light emitting element.
    [0034] The first resin member is preferably in contact with the outer edge (lateral surface) of the light-emitting element. Generally, the light-emitting element is mounted on the substrate using a bonding member etc., but a portion of the surfaces of the bonding member and / or the base member (for example, portions of electrical networks, etc.) is generally more prone to deterioration due to light than the material of the first resin member. In this way, in the case where a part of the surface etc., of the connecting member and / or the base member near the light-emitting element is coated by the first resin member, light of relatively high intensity emitted from the emitting element of light can no longer be radiated directly into the connecting member and / or base member, so that light deterioration of the constituent members of the light-emitting device can be effectively prevented.
    [0035] The portion of the end of the first resin member on the side opposite the light-emitting element can be on the inside or on the outside of the external periphery of the second resin member which must be described later, but from these places, the portion of the end is preferably arranged approximately in conformity with the outer periphery or outer side of the outer periphery. With this arrangement, the contact area between the first resin member and the second resin member can be easily secured, so that the second resin member can adhere more strongly to the light-emitting device, in particular the first member of resin.
    [0036] In other words, the size of the first resin member, that is, the planar dimension of the first resin member when the light emitting device is viewed in the direction of light extraction can be similar, larger, or smaller than the planar dimension of the sealing resin member (the second resin), excluding the planar dimension of the light-emitting element. In particular, the size of the first resin member can be about 1/5 to 3 times, preferably about 1/4 to 3 times, and more preferably 1/3 to 1.5 times the dimension of the sealing planar member (the second resin) excluding the planar dimension of the light-emitting element. Thus, with a large planar dimension of the first resin member, the contact area with the second resin member increases as described later, so that due to the adhesion of both, the adhesion of the second resin member of the emitting device light can be further intensified.
    [0037] The first resin member can be arranged, for example, with a thickness in the range of μm to several hundred μm. In particular, portions in contact with the light-emitting element preferably have a thickness corresponding to or less than the height of the side surfaces of the light-emitting element. In the case where the first resin member is disposed in the total portion of the opening, the portion in contact with the outer periphery of the opening preferably has a thickness not exceeding the depth of the opening. Preferably, the thickness of the first resin member decreases from the light-emitting element outwards (external side in relation to the center of the light-emitting element).
    [0038] The first resin member can be formed, for example, using a resin having its base polymer, a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, an acrylic resin composition, a silicone resin, an epoxy resin. a urea resin, a fluororesin, or a hybrid resin containing one or more of these resins. Of this, a resin containing a silicone and / or an epoxy resin as its base polymer is preferable. In the specification, the term "a base polymer" means a resin having a higher content of the materials constituting the first resin member. The first resin member preferably contains, for example, a reflective material and / or diffusion material such as SiO2, TiO2, Al2O3, ZrO2, and MgO. With this arrangement, the light can be sufficiently reflected. The first resin member can be made of a single material or a combination of two or more materials. With this arrangement, the reflectance of the light can be adjusted and also the linear expansion coefficient of the resin can be adjusted. Second resin member
    [0039] The second resin seals (covers) the light-emitting element in the substrate. The second resin member preferably has transparency to the light of the light emitting element and resistance to light and electrical insulating properties. The second resin member can be arranged to cover all openings of the coating layer described above, or not to cover some of the openings. In the specification, the term "transparency to light" means properties of transmitting about 60% or greater emission of the light-emitting element, more preferably 70%, or even more preferably or 80% or more of light emitted from the emitting element of light.
    [0040] The second resin member can be formed, for example, using a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, a resin composition acrylic, a silicone resin, an epoxy resin, a urea resin, a fluororesin, or a hybrid resin containing one or more of these resins. In particular, the second resin member is preferably formed, including the same polymer as in the first resin member as described above, more particularly, including the same polymer constituting the base polymer of the first resin member, and more preferably including the same polymer of the base polymer of the first resin member as the base polymer of the second resin member. With this arrangement, in the portion where the second resin member is in contact with the first resin member, suitability and compatibility of both resin members are preferred, so that adhesion with the first resin member can be further guaranteed , and strong adhesion of the second resin member to the light-emitting device can be achieved.
    [0041] The second resin member preferably includes a wavelength converting member such as a fluorescent material capable of absorbing light from the light-emitting element and emitting light of a different wavelength. Examples of such a member converting wavelength include an oxide-based fluorescent material, a sulfide-based fluorescent material, and a nitride-based fluorescent material. For example, in the case a gallium nitride based on a light-emitting element to emit blue light is used as the light-emitting element, fluorescent materials to absorb blue light, such as YAG-based fluorescent material or a LAG-based fluorescent material for emitting yellow to green light, a fluorescent material based on SiAlON to emit green light, and a fluorescent material based on SCASN and a fluorescent material based on CASN to emit red light, are preferably used alone or in combination. In particular, for light emitting devices used for display devices such as liquid crystal display taillights and TV screens, a SiAlON fluorescent material and a SCASN fluorescent material are preferably used alone or in combination. Also, for lighting applications, a YAG-based fluorescent material or a LAG-based fluorescent material and a SCASN-based fluorescent material or a CASN-based fluorescent material are preferably used in combination. The second resin member may contain a light diffusing agent (barium sulfate, titanium oxide, aluminum oxide, silicone oxide, etc.).
    [0042] The shape of the second resin member is not specifically limited, but in view of the distribution of the light intensity of light and directivity of the light emitted from the light emitting element, a concave lens shape or a convex lens shape is preferably employed . Of these, a hemispherical convex lens shape can be more appropriately employed.
    [0043] The size of the second resin member is not specifically limited and appropriately adjusted in view of the brightness, directivity, etc., of the light emitting device. In particular, the second resin member preferably has a size that can guarantee a wider contact area with the first resin member, but in the case where a flexible substrate is employed, a size that does not compromise the flexibility of the flexible substrate is preferable. For example, the size that makes it possible to completely coat the light-emitting element or larger, preferably has a diameter or length of about ten times or less, and more preferably has a diameter or length of about twice or less than the length of one. side of the light-emitting element. More specifically, the second resin member having a side (or diameter) of about 1 mm to 4 mm can be employed. The second resin member can be disposed with its outer or edge periphery disposed on the coating layer, on the coating layer and also on the first resin member, or on the first resin member at the opening of the coating layer.
    [0044] The modalities according to the present invention will be described below with reference to the drawings. MODE 1
    [0045] Mode 1 light emitting device 100 includes, as shown in FIG. 1A and FIG. 1B, a substrate 10, a light-emitting element 30 disposed on a surface of the substrate 10, a first resin member 40 disposed around the light-emitting element 30, and a second resin member 20 disposed on the substrate 10 and coating the light emitting element 30.
    [0046] The substrate 10 has a stacked layer structure formed from a flexible base member 11 made of a polyimide (about 25 μm thick), portions of electrical networks 12 (about 35 μm thick) arranged in a surface of the base member 11 and spaced apart from each other by a groove portion 14, and an insulating coating layer 15 (about 15 μm thick and made of a silicone based resin containing titanium oxide) disposed on they. In order to establish an electrical connection with the light emitting element 30, a groove portion 14 between the mains portions 12 and the mains portion 12, are exposed from the coating layer 15 in a region of the substrate 10. Among the portions of electrical networks 12, a pair of portions of electrical networks is connected to the external terminals respectively (not shown).
    [0047] The light-emitting element 30 includes a semiconductor structure, a p- side electrode, and an n- side electrode (not shown). In the semiconductor structure, the p- type semiconductor layer and the light emitting layer are partially removed to expose the n- type semiconductor layer, and an electrode on the n- side is formed on the exposed surface. A p- side electrode is formed on the top surface of the p- type semiconductor layer. In this way, the electrode on the n- side and the electrode on the p- side are formed on the same side of the surface in relation to the semiconductor structure. The light-emitting element 30, as described above, is arranged in a pair of portions of electrical networks 12 which are exposed from the coating layer 15 of the substrate 10, with the surface having the electrode on the n- side and the electrode on the side. side p- facing downwards, and is electrically connected to the portions of electrical networks through a connecting member 35. The connecting member 35 is generally arranged spread from the outer edge of the light-emitting element 30 to its outer periphery.
    [0048] The first resin member 40 is disposed on the surface of the substrate 10 at a periphery of the region in which the light-emitting element 30 is disposed. The first resin member 40 is, for example, made of a silicone resin containing about 30% by weight of titanium oxide. The first resin member 40 is disposed from an outer periphery of the light-emitting element 30 and over the connecting member 35 to the peripheral region of the light-emitting element, over the entire portion in the opening and over a part of the layer coating 15. The thickness of the first resin 40 can be approximately the same as the height of the light-emitting element 30 on the side of the light-emitting element 30, and can be gradually reduced in the connecting member 35 to reach about 10 μm of thickness in the coating layer 15. The length of the end portion of the first resin member 40 on the side of the light-emitting element 30 to the end portion on the opposite side is about 1 mm.
    [0049] As described above, in the case where the first resin member 40 is disposed on the outer periphery of the light-emitting element 30, with a relatively large planar dimension, even with a second resin member having poor adhesion as a member of connection 35 and portions of electrical networks 12 etc., the second resin member 20 can be in contact with the first resin member 40 which has better adhesion over a larger contact area, such that the second resin member 20 can be firmly adhered to the substrate 10. The first resin member 40 has a higher reflectance than that of the connecting member 35 and the portions of electrical networks 12, so that the extraction of light from the light emitting element can be performed more efficiently.
    [0050] The second resin member 20 is disposed on the substrate 10 mounted with the light emitting element 30, in the portions including the light emitting element 30, the first resin member 40 disposed around the light emitting element 30, and a portion of the coating layer 15 disposed directly from under the first resin member 40 in the coating layer 15 disposed on an external side of the light-emitting element 30. The second resin member 20 is, for example, made of a resin of silicone containing about 10% by weight of a fluorescent material (LAG ^ SCASN). That is, the second resin member 20 contains the same type of polymer used to make the first resin member. The outer or a-edge periphery of the second resin member 20 is arranged in the coating layer 15 on the substrate 10. The second resin member 20 is formed in a hemispherical form by filling. The diameter of the second resin member 20 is, for example, about 3.5 mm.
    [0051] As described above, the second resin member 20 contains the same base polymer as the first resin member 40, thus, the adhesion between the first and the second resin members can be safe. Particularly, in the light-emitting device 100, the first resin member 40 and the second resin member 20 are in contact with each other and with the entire surface of the first resin member 40 and all the side surfaces of the first resin member 40 arranged in the coating layer 15, which provides additional security for the contact area of both. In addition, the resin members are arranged containing the same base polymer, so that good suitability and compatibility between them can be obtained and in this way firm additional adhesion can be carried out. Furthermore, the surfaces and the interface between the connecting member 35 and the electrical network portions 12, and the interface between the electrical network portions and the reflective layer 15 can be coated with the coating layer 40, so that optical degradation of these members and separation or the like, due to optical degradation can be effectively avoided. MODE 2
    [0052] The light emitting device 200 according to mode 2 includes, for example, as shown in FIG. 2, a structure substantially the same as that of the light-emitting element 100 except that the diameter of the second resin member 20 is reduced so that the outer or edge periphery of the second resin member 20 is arranged from the end portion of the first resin member 40 reaching coating layer 15 on substrate 10 to one side of the center portion of the light-emitting element 30. That is, the outer or b-edge periphery of the second resin member 20 of the light-emitting device 200 it is arranged on the coating layer 15 through the first resin member 40. The diameter of the second resin member 20 is, for example, about 2 mm. Light emitting device 200 exhibits the same level of effects as that with mode 1 light emitting device 100. MODE 3
    [0053] The light emitting device 300 according to embodiment 3 may include, for example, as shown in FIG. 3, substantially the same structure as in the light emitting device 100, except that the first resin member 41 is disposed only at the opening of the coating layer 15. The outer or c-edge periphery of the second resin member 20 of the emitting device light 300 is arranged in the coating layer 15 on the substrate 10. The light emitting device 300 exhibits the same level of effects as with the light emitting device 100 of mode 1. Particularly, expanding the opening formed in the coating layer 15 makes it possible to guarantee a larger contact area from the second resin member 20 to the first resin member 41, even though the first resin member 41 is not extended over the coating layer 15, so that due to the adhesion between the first and second resin members 41, 20, the adhesion of the second resin 20 with the substrate 10 can be guaranteed. MODE 4
    [0054] The light-emitting device 400 according to embodiment 4 includes, for example as shown in FIG. 4, a structure substantially the same as in the light-emitting element 300 except that the diameter of the second resin member 20 is reduced so that the outer or edge periphery of the second resin member 20 is disposed from the end portion of the first resin member 41 extending in the coating layer 15 on the substrate 10 to one side of the center portion of the light-emitting element 30. That is, the outer or d-edge periphery of the second resin member 40 of the device light emitter 400 is disposed on the coating layer 15 through the first resin member 41. The diameter of the second resin member 20 is, for example, about 2 mm. The light emitting device 200 exhibits the same level of effects as that with the mode 3 light emitting device 300. MODE 5
    [0055] The light emitting device 500 according to embodiment 5 may include, for example, as shown in FIG. 5, substantially the same structure as in the light emitting device 100, except that the light emitting element 30 is mounted in a face-up manner, the electrode on the n- side and the electrode on the p- side (not shown) of the element light-emitting devices 30 are respectively electrically connected to portions of electrical networks 12 via wires 16, and part of the wires 16 is coated with the first resin member 41. The light-emitting device 500 exhibits the same level of effects as that with the light emitting device 100 of modality 1. In addition, this arrangement allows the connected portions of wires 16 and portions of electrical networks 12 to be coated with the first resin member 40, such that, for example, the optical degradation of those portions , separation and breakage due to the optical degradation of those portions can be efficiently avoided.
    [0056] The light emitting device according to the illustrated modalities can be used for various types of light sources, such as lighting light sources, light sources for various types of indicators, light sources for use in automobiles, light sources for displays, back light sources for liquid crystal displays, light sources for sensors, signals, car use, channel control characters for channel frames.
    [0057] It should be understood that, although the present invention has been described in relation to preferred modalities thereof, several other modalities and variants can occur for those skilled in the art, which are within the scope and spirit of the invention, and such other modalities and variants are intended to be covered by the following claims.
    权利要求:
    Claims (13)
    [0001]
    1. Light-emitting device (100, 200, 300, 400, 500) characterized by the fact that it comprises: a substrate (10) including a base member (11), a plurality of portions of electrical networks (12) arranged in a first surface of the base member (11), and a coating layer (15) covering the portions of electrical networks (12) with an opening formed in a part of the coating layer (15), a part of the first surface of the member base (11) not being covered by portions of electrical networks (2) on a base of the opening; a light-emitting element (30) disposed on the substrate (10) at the opening of the coating layer (15) and having an upper surface in a higher position than the coating layer (15), and disposed in at least one of the portions of electrical networks (2); a first resin member (40) arranged at least at the opening of the coating layer (15) and at the periphery of the light-emitting element (30); a second resin member (20) sealing the substrate (10) and the light-emitting element (30), the second resin member (20) being arranged in contact with the first resin member (40, 41), and a second surface of the base member (11), which is opposite the first surface, being exposed in a region directly below the light-emitting element (30), in which (i) the first resin member (40, 41) is arranged at the opening of the covering layer (15) and over the covering layer (15), and a part of the first resin member (40, 41) is also arranged in grooves between the portions of electrical networks (12) and directly under the light-emitting element (30), and (ii) the second resin member (20) has a convex lens shape and is disposed in the coating layer (15).
    [0002]
    2. Light-emitting device according to claim 1, characterized by the fact that the first resin member (40, 41) and the second resin member (20) contain the same polymer.
    [0003]
    3. Light-emitting device according to claim 1, characterized by the fact that an outer edge of the second resin member (20) is arranged on the coating layer (15).
    [0004]
    4. Light-emitting device according to claim 1, characterized in that an outer edge of the second resin member (20) is arranged above the coating layer (15) and on the first resin member (40, 41) ).
    [0005]
    5. Light-emitting device according to claim 1, characterized in that an outer edge of the second resin member (20) is arranged on the first resin member (40, 41) at the opening of the coating layer (15 ).
    [0006]
    6. Light-emitting device according to claim 1, characterized by the fact that the first resin member (40, 41) still includes a reflective material.
    [0007]
    7. Light-emitting device according to claim 1, characterized by the fact that the first resin member (40, 41) covers the part of the base member (11) that is not covered by the portions of electrical networks (2 ).
    [0008]
    8. Light-emitting device, according to claim 1, characterized by the fact that the portions of electrical networks (2) are partially covered by the first resin member (40, 41).
    [0009]
    9. Light-emitting device, according to claim 1, characterized by the fact that the second resin member contains fluorescent material.
    [0010]
    10. Light-emitting device according to claim 1, characterized in that the second resin member contains at least one of an oxide-based fluorescent material, a sulfide-based fluorescent material and a fluorescent-based material of nitride.
    [0011]
    11. Light-emitting device according to claim 1, characterized in that the second resin member contains at least one of a YAG-based fluorescent material, a LAG-based fluorescent material, a fluorescent-based material of SiAlON, a fluorescent material based on SCASN and a fluorescent material based on CASN.
    [0012]
    12. Light-emitting device (100, 200, 300, 400, 500) characterized by the fact that it comprises: a substrate (10) including a base member (11), a plurality of portions of electrical networks (12) arranged in a surface of the base member (11), and a coating layer (15) covering the portions of electrical networks (12) with an opening formed in a part of the coating layer (15), a part of the base member (11 ) not being covered by portions of electrical networks (2) on an opening basis; a light-emitting element (30) disposed on the substrate (10) at the opening of the coating layer (15) and having a top surface in a higher position than the coating layer (15), and disposed in at least one of the portions of electrical networks (2); a first resin member (40) arranged at least at the opening of the coating layer (15) and at the periphery of the light-emitting element (30); and a second resin member (20) sealing the substrate (10) and the light-emitting element (30), the second resin member (20) being arranged in contact with the first resin member (40, 41), a coating layer being exposed in a region outside the second resin member, or the coating layer and the first resin member being exposed in the region outside the second resin member; wherein (i) the first resin member (40, 41) is arranged in the opening of the coating layer (15) and on the coating layer (15), and a part of the first resin member (40, 41) is still arranged in grooves between the portions of electrical networks (12) and directly under the light-emitting element (30), and (ii) the second resin member (20) has a convex lens shape and is arranged in the coating layer .
    [0013]
    13. Rear light source characterized by the fact that it comprises the light emitting device as defined in claim 12.
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    同族专利:
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    TW201727945A|2017-08-01|
    US20170250326A1|2017-08-31|
    KR102218518B1|2021-02-22|
    JP5994472B2|2016-09-21|
    US20140042897A1|2014-02-13|
    CN103579466A|2014-02-12|
    TWI589030B|2017-06-21|
    US10109777B2|2018-10-23|
    AU2017225120A1|2017-09-28|
    AU2013211571A1|2014-02-27|
    AU2017225120B2|2018-06-28|
    JP2014036127A|2014-02-24|
    MX2013009266A|2014-02-21|
    CN108878623B|2021-06-08|
    EP2696377A1|2014-02-12|
    KR102135763B1|2020-07-20|
    BR102013020170A2|2015-08-11|
    KR20200089250A|2020-07-24|
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    法律状态:
    2015-08-11| B03A| Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]|
    2018-11-21| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-03-03| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-09-15| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2020-12-08| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/08/2013, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    JP2012-176846|2012-08-09|
    JP2012176846A|JP5994472B2|2012-08-09|2012-08-09|Light emitting device|
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