• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A trimming apparatus includes a chuck table causing a ring-shaped groove with an outer diameter smaller than the outer diameter of a wafer to communicate with a suction source to hold, by suction, a bottom surface of the wafer by the groove ring-shaped, a cutting unit rotating a cutting blade and annularly cutting a circumferential part of the wafer, and a cleaning unit cleaning a region outside the ring-shaped groove in the upper surface of the table and the top surface of the table including the ring-shaped groove, and being positioned on the region outside the groove in the top surface of the table and the top surface of the chuck table including the groove, and the chuck table rotates to clean groove and top surface.
    公开号:BE1028529B1
    申请号:E20205562
    申请日:2020-08-06
    公开日:2022-03-08
    发明作者:Kokichi Minato；Takeshi Kitaura；Paul Vincent Atendido
    申请人:Disco Corp；
    IPC主号:
    专利说明:

    [0001] The present invention relates to a trimming apparatus which performs trimming of the circumferential part of a wafer.
    [0002] [0002] When a wafer is ground with an abrasive wheel and its thickness is reduced, there is a problem that a chamfered part at the circumference of the wafer becomes a sharp edge and the wafer breaks with the sharp edge as a starting point. Thus, there is a trimming apparatus for removing the circumferential part of an insert before grinding (for example, see Japanese Patent Laid-open 2010-165802 or Japanese Patent Laid-open 2017- 004989).
    [0003] The trimming apparatus brings an abrasive stone into contact with the circumferential portion of a wafer held by a support surface of a chuck table and rotates the wafer to remove the circumferential portion. If the process dust discharged due to this trimming process enters a gap between the bottom surface of the wafer and the support surface of the chuck table and sticks on the support surface, the height of the bottom surface of the wafer held by the support surface is not constant. For this reason, for example, in the case where a chamfered portion of a bonded wafer obtained by bonding a wafer to a substrate by an adhesive, such as in a method disclosed in the Japanese Patent Laid-open, is completely cut out public inspection 2017-004989, there is a problem that the adhesive existing on the bonded surface adheres to a cutting blade and the cutting process becomes impossible.
    [0004] [0004] In order to solve this problem, a ring-shaped groove with an outer diameter slightly smaller than the outer diameter of the wafer is formed in a flat upper surface of the chuck table. The ring-shaped groove is made to communicate with a vacuum source and the wafer is held by suction by the ring-shaped groove. In addition, most of the upper surface of the chuck table is formed as a sliding surface to suppress adhesion of process dust.
    [0005] [0005] However, process dust enters a gap between the chuck table and the wafer from the circumferential edge of the wafer, and the process dust sticks close to the ring-shaped groove in the top surface of the table. chuck in some cases, which poses a problem.
    [0006] [0006] Thus, an object of the present invention is to provide a trimming apparatus which can hold a wafer by means of a chuck table with a support surface on which process dust has not adhered.
    [0007] [0007] According to one aspect of the present invention, there is provided a trimming apparatus comprising a chuck table which has an annular-shaped groove with an external diameter smaller than the external diameter of a wafer and brings the annular-shaped groove to communicate with a suction source for suction holding a bottom surface of the wafer through the ring-shaped groove, a table rotation mechanism which rotates the chuck table, a cutting unit which rotates a spindle on which a cutting blade is mounted and annularly cuts a circumferential portion of the wafer held by the chuck table, and a cleaning unit which cleans a region outside the ring-shaped groove in a upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove. The cleaning unit is positioned on the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove, and the chuck table is rotated by the table rotation mechanism, to clean the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the annular shape.
    [0008] [0008] Preferably, the trimming apparatus further comprises a horizontal movement mechanism which moves the cutting unit in the direction of the central axis of the spindle. The cutter unit includes a spindle unit which rotates the spindle to which a holder on which the cutter blade is mounted is coupled and a blade cover which surrounds the holder and the cutter blade. The cleaning unit comprises a cleaning nozzle which is mounted on the blade cover and ejects high pressure water in a downward direction. A high pressure water inlet area ejected from the cleaning nozzle is positioned on the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove by the horizontal moving mechanism, and the cleaning is carried out.
    [0009] [0009] Preferably, the cleaning unit comprises a sponge and a sponge nozzle which supplies the cleaning water to the sponge. The sponge is positioned on the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove, and cleaning is carried out by the sponge to which the cleaning water is supplied by the sponge nozzle.
    [0010] According to the present invention, the wafer can be held flat by the chuck table which has been cleaned and has a top surface on which process dust has not adhered. Therefore, the depth of the recess formed at the circumferential edge of the wafer by the trimming process can be made constant. In addition, since the inside of the ring-shaped groove of the chuck table can be cleaned, it is possible to prevent the lowering of the suction force of the chuck table 40 which may have place due to clogging of the ring-shaped groove with process dust.
    [0011] [0011] Furthermore, for example, in the trimming device comprising two opposing cutting units
    [0012] [0012] Furthermore, when the cleaning unit comprises the sponge and the nozzle for the sponge which supplies the cleaning water to the sponge, the sponge is positioned on the region outside the groove. ring-shaped in the upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove, and the cleaning is performed by the sponge to which the cleaning water is supplied from the sponge nozzle. Therefore, the wafer can be held flat by the chuck table which has been cleaned and has a top surface on which process dust has not adhered. Therefore, the depth of the recess formed at the circumferential edge of the wafer by the trimming process can be made constant. In addition, since the inside of the ring-shaped groove can be cleaned, it is possible to prevent the lowering of the suction force of the chuck table.
    [0013] [0013] The above objects, characteristics and advantages as well as the others of the present invention and the manner of carrying them out, will emerge more clearly and the invention itself will be better understood from a study of the description. following and appended claims with reference to the accompanying drawings showing preferred embodiments of the invention.
    [0014] [0014] [Fig. 1] Fig. 1 is a perspective view illustrating an example of a trimming apparatus in which a cleaning unit includes a cleaning nozzle;
    [0015] [0015] [Fig. 2] Fig. 2 is a sectional view showing an example of the structure of a chuck table;
    [0016] [0016] [Fig. 3] Figure 3 is a perspective view illustrating an example of a first cutting unit and the cleaning unit including the cleaning nozzle;
    [0017] [0017] [Fig. 4] Fig. 4 is a schematic plan view for explaining the structure and an arrangement position of a jet nozzle, two cutting water nozzles, a pair of blade cooling nozzles, and the first cutting unit cleaning nozzle;
    [0018] [0018] [Fig. 5] Fig. 5 is a schematic plan view for explaining the structure and deposition position of the jet nozzle, the two cutting water nozzles, the pair of blade cooling nozzles and the cleaning nozzle of a second cutting unit;
    [0019] [0019] [Fig. 6] Fig. 6 is a sectional view for explaining the state in which a region outside of a ring-shaped groove in the top surface (support surface)
    [0020] [0020] [Fig. 7] Fig. 7 is a sectional view for explaining the case where a glued wafer is held by suction by the chuck table in which the region outside the ring-shaped groove in the upper surface and the upper surface - higher including the ring-shaped groove have been cleaned and the trimming of a chamfered part of an insert is performed by the first cutting unit;
    [0021] [0021] [Fig. 8] Fig. 8 is a perspective view illustrating an example of a trimming apparatus in which a cleaning unit includes a sponge; and
    [0022] [0022] [Fig. 9] Fig. 9 is a sectional view for explaining the state in which the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the groove ring-shaped were cleaned by the cleaning unit including the sponge while the chuck table rotates. Detailed Description of Preferred Embodiments (First Embodiment)
    [0023] [0023] A trimming apparatus 1 illustrated in FIG. 1 according to the present invention (hereinafter, referred to as being the trimming apparatus 1 of a first embodiment) is an apparatus which can carry out the trimming of a wafer W held by a chuck table 30 by a first cutting unit 61 or a second cutting unit 62 comprising a cutting blade 613 which rotates. The trimming apparatus 1 is not limited to an apparatus of a type which enables double cutting (two-axis simultaneous cutting) of the wafer W.
    [0024] [0024] For example, the wafer W shown in Fig. 1 is a semiconductor wafer which comprises silicon as a base material and has a circular shape as an outer shape and, on its front surface Wa, Devices not shown, such as integrated circuits (ICs), are each formed in a respective one of the lattice-like labeled regions. In the wafer W, the chamfering process has been performed for the circumferential edge, and a chamfered part Wd (see Fig. 2), the section of which has a substantially circular arc shape, is formed. Wafer W may be composed, in addition to silicon, with gallium arsenide, sapphire, gallium nitride, ceramic, resin, silicon carbide or the like, and the devices do not don't need to be trained.
    [0025] As shown in Figure 2, the wafer W is what is generally referred to as a bonded wafer W1, for example. Specifically, for the circular wafer W, adhered to the downward-facing front surface Wa in Fig. 2, there is a substrate SB (carrier substrate) with substantially the same diameter, by an adhesive SB1 or the like. Thus, by treating the wafer W and the substrate SB as a monolithic component and performing the process, the handling property of the wafer W is improved, and the deformation and breakage of the wafer W at the time of the process can be prevented. The center of the wafer W corresponds substantially to the center of the substrate SB.
    [0026] [0026] On a base 10 of the trimming device 1, there is a feed mechanism of
    [0027] [0027] For example, the chuck table 30 shown in Fig. 2 comprises a base portion 30A whose outer shape is a circular shape in a plan view, and an annular-shaped projecting portion 30B which is formed with a A solid component which is ceramic or an alloy such as stainless steel, for example, and has a circular annular shape in a plan view, is disposed upright on the upper surface of the base portion 30A. The upper surface of the ring-shaped projection 30B is a smooth supporting surface 300 which supports, by suction, the region of the circumferential side of the lower surface of the substrate SB bonded to the front surface Wa of the wafer W.
    [0028] For example, a ring-shaped groove 301 with an outer diameter smaller than the outer diameter of the substrate SB is formed at a substantially central position of the circular ring-shaped support surface 300 in the ring width. Further, in the groove bottom of the ring-shaped groove 301, plural suction holes 301a are formed through equal intervals in the circumferential direction so as to penetrate the ring-shaped projecting part 30B and the base portion 30A in the thickness direction (Z axis direction). A suction flow path 390 such as a resin tube or a metal pipe communicates with the lower end side of each suction hole 301a, and the suction flow paths 390 are connected to a source of suction 39 such as a vacuum generating apparatus or an ejector mechanism. Here, the region outside the ring-shaped groove 301 in the support surface 300, which is the upper surface 300 of the ring-shaped projecting portion 30B of the chuck table 30, is defined. as a region 300a.
    [0029] An air source 38 comprising a compressor or the like which supplies air to the support surface 300 of the chuck table 30 is connected to each suction hole 301a. For example, when the glued wafer W1 is scheduled to come out of the chuck table 30 by releasing the suction and supporting the glued wafer W1 by the chuck table 30, the air source 38 supplies the compressed air to the holes suction 301a. For this reason, by the air ejected from the suction holes 301a on the supporting surface 300, the vacuum suction force remaining between the supporting surface 300 and the bonded wafer W1 is suppressed, and a state in which the glued wafer W1 can be grasped by pliers or the like and removed from the support surface 300 can be realized.
    [0030] [0030] A lifting table - lowering 31 with a form of circular plate on a view in
    [0031] [0031] For example, when the bonded wafer W1 comes out of the support surface 300 after the trimming process has been executed for the wafer W bonded to the substrate SB held by the support surface 300, the lifting-lowering table 31 lifts the glued wafer W1 on the upper side with respect to the support surface 300 to allow the transport means not shown to carry out the edge clamping of the circumferential edge of the substrate SB.
    [0032] As shown in Figure 1, the chuck table 30 is rotatable by a table rotation mechanism 32 comprising a motor disposed below the chuck table 30, a rotary shaft whose axis direction is the Z axis direction (vertical direction), and so on.
    [0033] [0033] On the rear side (X-direction side) of the base 10 shown in Figure 1, a gate-like column 14 is disposed upright to straddle the travel path of the chuck table 30. On the front surface of the door-shaped column 14, for example, there is provided a first horizontal moving mechanism 15 which causes the first cutting unit 61 to reciprocate in a Y-axis direction orthogonal to the X axis direction and the Z axis direction.
    [0034] [0034] For example, the first horizontal movement mechanism 15 comprises a spherical screw 150 having the central axis which extends in the direction of axis Y, a pair of guide rails 151 arranged parallel to the spherical screw 150, an unillustrated motor which is coupled to one end of the ball screw 150 and a movable plate 153 which has an internal nut screwed onto the ball screw 150 and has a side portion in sliding contact with the guide rails 151. Further, when the motor not shown rotates the ball screw 150, the movable plate 153 is guided by the guide rails 151 and moves in the Y-axis direction in conjunction therewith, so that the movement The horizontal (indexing feed) of the first cutting unit 61 disposed on the movable platen 153 through a first cutting feed mechanism 17 is executed in the Y-axis direction.
    [0035] The first cutter feed mechanism 17 can reciprocate the first cutter unit 61 in the Z-axis direction and includes a ball screw 170 having the central axis which is extending in the Z-axis direction, a pair of guide rails 171 arranged parallel to the ball screw 170, a motor 172 coupled to the ball screw 170, and a support component 173 which supports the first cutting unit 61 and has an internal nut screwed onto the ball screw 170 and a side portion in sliding contact with the guide rails 171. When the motor 172 rotates the ball screw
    [0036] As shown in Figure 3, the first cutting unit 61 includes a spindle unit 61 λ which rotates a spindle 610 to which an unillustrated carrier on which the cutting blade 613 is mounted is coupled, and a blade cover 614 which surrounds the support not shown and the cutting blade 613.
    [0037] [0037] The spindle unit 61A includes the spindle 610 whose axis direction is the Y axis direction, a spindle housing 611 which is attached to the lower end side of the support component 173 of the first cutting feed 17 and rotatably supports spindle 610, and a motor 612 which rotates spindle 610. The tip side of spindle 610 rotatably housed in spindle housing 611 projects from inside the spindle housing 611 on the Y-direction side, and the bracket not shown is mounted on this tip side.
    [0038] [0038] The cutting blade 613 shown in Fig. 3 is a washer-type circular ring-shaped blade which is formed in a circular ring-plate shape, has a hole into which the pin 610 is inserted in the center, and has, at the outer circumference, a circular ring-shaped cutting edge 613b formed by bonding diamond abrasive grains or the like with a suitable bond.
    [0039] [0039] An unillustrated fixing nut is screwed onto the spindle 610 and is fixed, and the cutting blade 613 is thus sandwiched by the unillustrated bracket and the fixing nut on both sides in the Y axis direction This provides a state in which the cutting blade 613 is sandwiched and fixed by the holder and a fixing flange 613a having a hole in which the pin 610 is inserted and is mounted on the pin 610, i.e. that is, in a state in which the first cutting unit 61 has been assembled, as illustrated in FIGS. 1 and 3. A state in which the center of rotation of the cutting blade 613 substantially corresponds to the central axis of pin 610, is made. Further, cutter blade 613 rotates in conjunction with the rotary drive of spindle 610 by motor 612 coupled to the rear end side of spindle 610.
    [0040] [0040] The blade cover 614 which surrounds the unillustrated support and the cutting blade 613 from the upper side comprises a blade cover base part 614a and a sliding cover part 614b which is disposed on the base part. blade cover base 614a and can slide in the X-axis direction with respect to the blade cover base part 614a.
    [0041] A nozzle support block 614c is provided on the side surface of the blade cover base part 614a on the +X direction side. In the nozzle support block 614c, for example, a nozzle jet 651 which ejects the cutting water to the cutting blade 613 from outside the cutting blade 613 in the radial direction. A water supply source 68 which can supply purified water or the like communicates with the jet nozzle 651 through a resin tube 680. As shown in FIG. by the jet nozzle 651 to the cutting blade 613 mainly plays the role of cooling the cutting blade 613.
    [0042] [0042] Further, as shown in Fig. 3, for example, two cutting water nozzles 652 which eject and supply the cutting water from the obliquely upper side to the contact part (process point) between the cutter blade 613 and insert W are disposed in nozzle support block 614c. For example, the two cutting water nozzles 652 are arranged symmetrically with each other in the Y-axis direction with the cutting blade 613 being the axis of symmetry in a plan view. The water supply source 68 communicates with the cutting water nozzles 652 through a resin tube 681. As shown in Figure 4, the cutting water supplied by the two nozzles of cutting water 652 to the process point mainly plays the role of cleaning and removing the cutting dust generated at the process point by the insert W.
    [0043] [0043] The sliding cover part 614b is coupled to the blade cover base part 614a via a pneumatic cylinder (not shown) and can perform a sliding movement in the direction of axis X. , after the cutting blade 613 is mounted on the spindle 610, the blade cover 614 is mounted on the front surface of the spindle housing 611 on the —Y direction side, and the sliding cover part 614b in a state open slides in the +X direction to close the blade cover 614. can cut W wafer.
    [0044] [0044] As shown in Fig. 3, the sliding cover portion 614b supports a pair of blade cooling nozzles 653 substantially with an L shape as viewed from the Y-direction side. blade 653 pass into the sliding cover part 614b to extend downward and then extend to the side of the +X direction parallel to each other so as to sandwich the lower part of the cutter blade 613. upper end of each of the blade cooling nozzles 653 communicates with the water supply source 68 through a resin tube 683. towards the side surface of the cutter blade 613, and the cutter blade 613 is cooled and cleaned by the cutting water ejected to the slots 653a.
    [0045] [0045] The trimming apparatus 1 illustrated in FIG. 1 comprises cleaning units 7 which clean the region 300a outside the annular-shaped groove 301 in the support surface 300 (i.e. i.e. the upper surface 300) of the chuck table 30 and the upper surface 300 of the chuck table 30 including the ring-shaped groove 301.
    [0047] [0047] The cleaning nozzle 70 can also be connected to a non-illustrated air supply source and can eject a binary fluid obtained by mixing the water supplied by the water supply source 68 and the air supplied by the air supply source. Further, the cleaning nozzle 70 may be capable of ejecting cleaning water to which ultrasonic vibrations are transmitted.
    [0048] [0048] As illustrated in FIGS. 1 and 3, close to the first cutting unit 61, there is an alignment unit 11 which detects the position of the chamfered part Wd which must be cut in the wafer W held on the chuck table 30. The alignment unit 11 can execute an image process such as a matching pattern based on a taken image acquired by a camera 110 and detect the coordinate position of the chamfered part wd.
    [0049] On the front surface of the door-shaped column 14 illustrated in Figure 1, for example, there is a second horizontal movement mechanism 16 which makes a reciprocating movement of the second cutting unit 62 in the Y-axis direction. For example, the second horizontal moving mechanism 16 includes a ball screw 160 having the central axis extending in the Y-axis direction, the pair of guide rails 151 arranged parallel to the ball screw 160, a motor 162 coupled to the ball screw 160, and a movable plate 163 which has an internal nut screwed onto the ball screw 160 and has a side portion in sliding contact with the guide rails 151. Further, when the motor 162 rotates the ball screw 160, the movable plate 163 is guided by the guide rails 151 and moves in the Y-axis direction in association therewith, so that the horizontal movement (feed by indexing) of the second unit of co upe 62 arranged on the movable plate 163 through a second cutting feed mechanism 18 is executed in the Y axis direction.
    [0050] The second cutter feed mechanism 18 can reciprocate the second cutter unit 62 in the Z-axis direction and includes a ball screw 180 having the central axis which is extending in the Z-axis direction, a pair of guide rails 181 arranged parallel to the ball screw 180, a motor 182 coupled to the ball screw 180, and a support component 183 which supports the second cutting unit 62 and has an inner nut screwed onto the ball screw 180 and a side portion in sliding contact with the guide rails 181. Further, when the motor 182 rotates the ball screw 180, the support component 183 is guided by the pair of guide rails 181 and moves in the Z-axis direction. In connection therewith, the cutting feed of the second cutting unit 62 is performed in the Z-axis direction.
    [0052] The cleaning unit 7 is also placed on the blade cover 614 of the second cutting unit 62. The cleaning unit 7 placed on the blade cover 614 of the second cutting unit 62 comprises a cleaning nozzle 73 supported by a cleaning nozzle support block 71. In the cleaning nozzle 73, as shown in Fig. 5, a jet orifice 730 formed at its lower end has a circular shape, example. Thus, the cleaning nozzle 73 can eject the cleaning water in a substantially circular columnar shape from the jet port 730 at the bottom side. The upper end of the cleaning nozzle 73 communicates with the water supply source 68 shown in Figure 3 through a resin tube not shown. For example, the cleaning nozzle 73 may also be connected to an air supply source not shown and be capable of ejecting binary fluid obtained by mixing the water supplied by the water supply source 68 and the air supplied by the air supply source. Further, the cleaning nozzle 73 can eject the cleaning water to which ultrasonic vibrations are added. The cleaning nozzle 70 can be arranged on the second cutting unit 62, and the cleaning nozzle 73 can be arranged on the first cutting unit 61.
    [0053] The jet nozzle 651 shown in Fig. 3, the two cutting water nozzles 652, the pair of blade cooling nozzles 653, the cleaning nozzle 70 and the cleaning nozzle 73 each come in a state in which it communicates with the water supply source 68 and a state in which it does not communicate with the water supply source 68 through the switching of the opening and closing of a valve or - green-closed not shown which is arranged in a respective tube of the resin tubes which communicate with them.
    [0054] [0054] Described below is the case in which, in the trimming apparatus 1 shown in Fig. 1, the region 300a outside the ring-shaped groove 301 in the upper surface 300 (support surface 300 ) of the chuck table 30 and the upper surface 300 of the chuck table 30 including the ring-shaped groove 301 are cleaned, and then the glued wafer W1 is held by the chuck table 30 cleaned, and trimming is performed annular manner on the chamfered part Wd of the circumferential part of the insert W.
    [0055] [0055] When cleaning the chuck table 30, first of all, the chuck table 30 which does not support the glued wafer W1 illustrated in FIG. 1 is moved in the axis direction X by the mechanism. cutting feed 13, and the chuck table 30 is positioned below the cleaning unit 7 arranged on the blade cover 614 of the first cutting unit 61 and the cleaning unit 7 arranged on the cover blade 614 of the second cutting unit 62.
    [0056] [0056] A control unit, not illustrated, which executes the control of the entire apparatus of the trimming apparatus 1 seizes the central position of the chuck table 30 and can consequently seize the position of the annular-shaped groove. 301 apart from this center position 40 outward in the radial direction by a predetermined distance. Then, for example, based on the central position of the chuck table 30, the first horizontal displacement mechanism 15 moves the cleaning nozzle 70 from the cutting unit 7
    [0057] [0057] Furthermore, for example, based on the central position of the chuck table 30, the second horizontal movement mechanism 16 moves the cleaning nozzle 73 of the cleaning unit 7 arranged on the cover of the blade 614 in the Y-axis direction together with the second cutting unit 62 to position the center of the cleaning nozzle 73 which ejects the cleaning water downward in a circular column shape to the region 300a at the outside of the ring-shaped groove 301.
    [0058] Next, the first cut feed mechanism 17 shown in Fig. 1 moves the cleaning nozzle 70 in the Z-axis direction to position it at a correct height, and the second cut feed mechanism 18 moves the cleaning nozzle 73 in the Z-axis direction to position it at a correct height.
    [0059] In this state, the water supply source 68 shown in Figure 6 supplies high pressure water to the cleaning nozzle 70. As shown in Figure 6, the cleaning water is ejected to s smear down substantially in the form of a fan from the jet orifice 700 of the cleaning nozzle 70, and mainly the cutting dust adhering to the groove bottom and the side wall of the groove ring-shaped 301, the cutting dust adhering to the support surface 300 (upper surface 300), and so on are cleaned and removed by this cleaning water over a wide range. Further, the water supply source 68 supplies the high pressure water to the cleaning nozzle 73. For this reason, as shown in Fig. 6, the cleaning water is ejected downward in the form of a circular column from the jet orifice 730 of the cleaning nozzle 73, and the region 300a outside the ring-shaped groove 301 in the support surface 300 is intensively cleaned by this cleaning water as precision cleaning. Thus, the cutting dust and so on adhering to the region 300a are removed.
    [0060] [0060] Furthermore, the table rotation mechanism 32 rotates the chuck table 30 at a predetermined speed of rotation. In connection with this, the entire circumference of the ring-shaped groove 301 and the entire circumference of the support surface 300 are regularly cleaned by the cleaning water ejected from the cleaning nozzle 70 and the cleaning water. cleaning ejected by the cleaning nozzle 73.
    [0061] [0061] After the cleaning of the entire circumference of the ring-shaped groove 301 and the cleaning of the entire circumference of the support surface 300, in particular, the intensive cleaning 40 of the entire circumference of the region 300a at the outside the ring-shaped groove 301, have been performed for a predetermined period of time, the water supply source 68 stops the water supply for the cleaning nozzle 70 and the cleaning nozzle 73. Then , for example, the chuck table 30 is dried by rotary drying based on the rotation or by ejection of air from the cleaning nozzle 70 or 73 which communicates with an air source not shown.
    [0062] [0062] Next, the trimming process of the chamfered part Wd of the wafer W illustrated in FIG. 1 begins. First, so that the center of the wafer W substantially matches the center of the supporting surface 300 of the chuck table 30, the glued wafer W1 is placed on the supporting surface 300 to close the annular-shaped groove. - Lar 301, with the substrate SB facing down. Then, a suction force generated by the drive of the suction source 39 shown in Fig. 7 passes through the suction holes 301a and the ring-shaped groove 301 and is transmitted to the supporting surface 300. , and the chuck table 30 supports, by suction, the circumferential region of the substrate SB bonded to the lower surface Wa (front surface Wa) of the wafer W on the support surface 300. Further, the bonded wafer W1 comes in a state in which it is placed on the upper surface of the lifting-lowering table 31.
    [0063] [0063] The cutting feed mechanism 13 shown in Fig. 1 moves the chuck table 30 in the X-axis direction. Further, for example, the first horizontal moving mechanism 15 moves the camera 110 from the alignment unit 11 in the Y-axis direction, and the chuck table 30 is positioned at a predetermined position so that the chamfered portion Wd formed at the circumferential edge of the wafer W can fall into the gripping region of the wafer. image of the camera 110. The image pick-up of the chamfered part Wd of the wafer W is carried out by the camera 110, and the alignment unit 11 decides the position of the edge coordinates of the chamfered part Wd of the wafer. wafer W, based on the image taken.
    [0064] [0064] For example, after the position of the edge coordinates of the chamfered part Wd of the wafer W has been detected in the manner described above, the glued wafer W1 held by the chuck table 30 is positioned at the -below the cutting blade 613 of the first cutting unit 61, for example. Then, based on the position of the edge coordinates of the chamfered portion Wd of the wafer W obtained by the edge alignment, the first horizontal moving mechanism 15 moves the first cutting unit 61 in the direction of Y axis and positions the cutting blade 613 at a position separated from the chamfered portion Wd of the wafer W inwardly in the radial direction by a predetermined distance, as shown in Fig. 7. Specifically, for example , the cutter blade 613 is positioned so that approximately 2/3 of the lower end surface of the cutter blade 613 contacts the chamfered portion Wd of the insert W.
    [0065] [0065] Then, by rotating the spindle 610 at a high speed counterclockwise, as seen from the +Y direction side, the cutter blade 613 attached to the spindle 610 is rotated. counterclockwise at high speed as viewed from the +Y direction side. cuts 61 and causes the cutting blade 613 to cut into the wafer W to a predetermined depth from a rear surface Wb of the wafer W. The cutting depth of the cutting blade 613 is a cutting depth with which the chamfered part Wd is completely cut, and the cutting blade 613 does not reach the adhesive SB1 or cuts slightly into the adhesive SB1, for example. After the cutting feed of the cutting blade 613 has been completed in the predetermined height position, the chuck table 30 rotates 360 degrees counterclockwise, as viewed from the side of the direction + Z, with the cutting blade 613 held in rotation. The entire circumference of the chamfered part Wd of the wafer W is thus cut. The double trimming of the chamfered part Wd of the insert W can be carried out by the first cutting unit 61 and the second cutting unit 62.
    [0066] [0066] During the trimming of the chamfered part Wd of the wafer W, the cutting water is supplied to the cutting blade 613 from the outside of the cutting blade 613 in the radial direction by the nozzle 651 illustrated in FIG. 3 and FIG. 4, and mainly, the cooling of the cutting blade 613 is carried out. Further, the cutting water is supplied to the contact part between the cutting blade 613 and the insert W by the two cutting water nozzles 652, and mainly, cooling the contact part and eliminating by cleaning the cutting dust generated at the contact part are made by this cutting water. Further, cutting water is supplied to the cutting blade 613 from the thickness direction of the cutting blade 613 (Y-axis direction) through the pair of blade cooling nozzles 653, and the cooling of the cutting blade 613 is made.
    [0067] [0067] As described above, the trimming apparatus 1 according to the present invention comprises the cleaning unit 7 which cleans the region 300a outside the annular-shaped groove 301 in the upper surface 300 of the chuck table 30 and the upper surface 300 of the chuck table 30 comprising the ring-shaped groove 301. The cleaning unit 7 is positioned on the region 300a and the upper surface 300 of the chuck table 30 comprising the ring-shaped groove 301, and the chuck table 30 is rotated by the table rotating mechanism 32 to clean the region 300a and the upper surface 300 of the chuck table 30 comprising the ring-shaped groove. annular
    [0068] In the trimming device 1 according to the present invention, the cleaning units 7 of the first embodiment comprise cleaning nozzles 70 and 73 which are mounted on the blade cover 614 and eject the water at high pressure in the downward direction. The inlet area for the high pressure water ejected from the cleaning nozzle 70 is positioned at the region 300a outside of the ring-shaped groove 301 in the upper surface 300 of the chuck table 30 and the upper surface 300 of the chuck table 30 including the ring-shaped groove 301 by the first horizontal moving mechanism 15, and cleaning is performed while the chuck table 30 is rotating. The glued wafer W1 can thus be held flat by the chuck table 30 which has been cleaned and has a top surface 300 on which process dust does not adhere. Therefore, the depth of the recess formed by the trimming process of the chamfered part Wd of the insert W can be made constant. Further, since the inside of the ring-shaped groove 301 can be cleaned, it is possible to prevent the lowering of the suction force of the chuck table 30 which possibly takes place due to the clogging. of the ring-shaped groove 301 with the process dust.
    [0069] [0069] Further, for example, in the trimming apparatus 1 comprising the first cutting unit 61 and the second cutting unit 62 as in the present first embodiment, so that the two cutting units are opposed between Here, the first cutting unit 61 includes the cleaning nozzle 70 as the cleaning unit 7, and the second cutting unit 62 includes the cleaning nozzle 73 as the cleaning unit 7, for example. Also, the cleaning areas of the respective cleaning nozzles can be made different to change the role during cleaning. For example, a cleaning nozzle 73 is used as a dedicated heavy-duty cleaning nozzle for the region 300a outside the ring-shaped groove 301 in the upper surface 300 of the chuck table 30 and is caused to eject the high-pressure cleaning water in a circular column shape, and the cleaning water is caused to reach the region 300a. At the same time, the other cleaning nozzle 70 is used as a dedicated nozzle for cleaning a wide range of the upper surface 300 of the chuck table 30 and the ring-shaped groove 301 and is brought to ejecting the high pressure cleaning water substantially in a fan shape. This makes it possible to clean the ring-shaped groove 301 and the upper surface 300 of the chuck table 30 more efficiently so that no place is left dirty.
    [0070] [0070] The water supply source 68 comprising a pump or the like need not be of the type which can send water at high pressure to the cleaning nozzles 70 and 73, for example. The cleaning nozzles 70 and 73 can be made to also communicate with an air supply source in addition to the water supply source 68 and the air can be mixed with the water in each nozzle, by example, to cause the binary fluid to be ejected from each jet orifice, and the pressure of the water drops impinging on the landing points in the cleaning zone can be set to high pressure by the pressure of the 'air.
    [0071] A trimming apparatus 1A of a second embodiment illustrated in Fig. 8 is an apparatus obtained by changing some of the constituent elements of the trimming apparatus 1 of the first embodiment illustrated in Fig. 1. The part different from the configuration of the trimming apparatus 1 of the first embodiment in the trimming apparatus 1A of the second embodiment will be described below.
    [0073] [0073] For example, a support bridge 88 is arranged straight on the base 10 of the trimming device 1A in order to straddle the displacement path of the chuck table 30, and the cleaning unit 8 is attached to the support bridge 88. The cleaning unit 8 may be capable of reciprocating the support bridge 88 in the Y-axis direction by a slide not shown, for example. A jet port of the sponge nozzle 81 is open to the sponge 80 and communicates with the water supply source 68.
    [0074] [0074] The type of sponge 80 is not particularly limited and, for example, a polyvinyl alcohol (PVA) sponge or the like is used. The sponge 80 is formed into a circular column shape, for example, and can move up and down in the Z-axis direction by a sponge lifting-lowering mechanism 84 fixed to the support bridge 88. shape of sponge 80 is not limited to this example.
    [0075] [0075] The sponge raising-lowering mechanism 84 is a pneumatic cylinder, for example, and comprises a tubular cylinder tube 840 having, inside the latter, an unillustrated piston and a piston rod 841 which is inserted into the cylinder tube 840 and has the upper end side attached to the piston. Further, the sponge 80 is detachably attached to the lower end side of the piston rod 841.
    [0076] [0076] For example, an air nozzle 86 which extends in the Y axis direction is fixed on the support bridge 88. The air nozzle 86 has a length equal to or greater than the external diameter of the table. chuck 30, for example, and has several downward facing slots 860 in its side surface. Further, the air nozzle 86 can dry the supporting surface 300 of the chuck table 30 and the interior of the ring-shaped groove 301 with compressed air ejected through the slots 860. Air 86 includes a compressor or the like and communicates with an air source 869 which can supply compressed air through a resin tube or the like.
    [0077] [0077] Described below is the case in which, in the trimming apparatus 1A shown in Fig. 8, the ring-shaped groove 301 of the chuck table 30 and the region 300a outside the groove 301 in the upper surface of the chuck table 30 are cleaned, and then the glued wafer W1 is held by the cleaned chuck table 30, and the trimming is performed annularly on the chamfered part Wd of the circumferential part of the W plate.
    [0078] [0078] When cleaning the chuck table 30, first, the chuck table 30 which does not hold the glued wafer W1 shown in Fig. 8, is moved in the X-axis direction by the cutting feed 13, and the chuck table 30 is positioned below the sponge 80 of the cleaning unit 8. The sponge 80 is thus positioned to cross substantially, in the direction of the width of the groove, the region 300a outside of the ring-shaped groove 301 in the upper surface 300 of the chuck table 30 and the upper surface 300 of the chuck table 30 including the ring-shaped groove 301.
    [0079] [0079] Next, the sponge lifting-lowering mechanism 84 shown in Fig. 8 lowers the sponge 80 and brings the deformed sponge 80, as shown in Fig. 9, into contact with the sponge 80.
    [0080] [0080] Further, the water supply source 68 supplies the cleaning water to the sponge nozzle 81, and the sponge 80 absorbs the cleaning water ejected from the sponge nozzle 81. This causes sponge 80 to swell and exhibit elasticity. Sponge 80 can be a sponge that does not swell when it absorbs cleaning water. Further, the cleaning water can be directly supplied from the sponge nozzle 81 to the ring-shaped groove 301 and the region 300a of the chuck table 30.
    [0081] [0081] Further, in conjunction with the rotation of the chuck table 30 at a rotational speed predetermined by the table rotation mechanism 32, the entire circumference of the ring-shaped groove 301 and the entire circumference of the surface of support 300 are cleaned by the sponge 80 supplied with the cleaning water, and the adhering cutting dust and so on are removed.
    [0082] [0082] After the cleaning of the entire circumference of the ring-shaped groove 301 and the entire circumference of the support surface 300, in particular, the intensive cleaning of the entire circumference of the region 300a outside the ring-shaped groove 301, have been made for a predetermined period of time, the water supply source 68 stops supplying water to the sponge nozzle 81. Further, the sponge lift-lower mechanism 84 lifts the sponge 80 away from the chuck table.
    [0083] Next, the chuck table 30 moves in the X-axis direction below the air nozzle 86 by the cutting feed mechanism 13 shown in Fig. 1. In addition, the air high pressure may blow through the air nozzle 86 toward the supporting surface 300 of the chuck table 30. For this reason, cleaning water adhering to the supporting surface 300 and the ring-shaped groove 301 is blown off by air, and the support surface 300 and the ring-shaped groove 301 are dried. For example, the mandrel table 30 can be dried by rotary drying on the basis of the rotation or by the ejection of air through the sponge nozzle 81 which communicates with an air source not shown.
    [0084] [0084] Then, the trimming process of the wafer W begins. The trimming of the wafer W is carried out in a manner similar to the case of the trimming apparatus 1 of the first embodiment described previously.
    [0085] In the trimming apparatus 1A of the second embodiment according to the present invention, the cleaning unit 8 comprises the sponge 80 and the sponge nozzle 81 which supplies the cleaning water to the sponge 80. The sponge 80 is positioned on the region 300a outside of the ring-shaped groove 301 in the top surface 300 of the chuck table 30 and the top surface 300 of the chuck table 30 including the ring-shaped groove. 301, and cleaning is performed by the sponge 80 to which cleaning water is supplied from the sponge nozzle 81. The glued wafer W1 can thus be held flat by the chuck table 30 which has been cleaned and which has the upper surface 300 on which the process dust 40 has not adhered. Therefore, the depth of the recess formed by the trimming process of the chamfered part Wd at the circumferential edge of the insert W can be made constant. Further, since the inside of the ring-shaped groove 301 can be cleaned, it becomes possible to prevent the lowering of the suction force of the chuck table 30 which possibly takes place due to the clogging of ring-shaped groove 301 with cutting dust.
    [0086] The trimming apparatus according to the present invention is not limited to the first and second embodiments described above. Further, the respective configurations and so on of the apparatus illustrated in the accompanying drawings are also not limited thereto and changes may be made, if necessary, within a range in which the effects of the present invention may be exercised. For example, the trimming apparatus 1 of the first embodiment may include the air nozzle 86 of the trimming apparatus 1A of the second embodiment.
    [0087] The present invention is not limited to the details of the embodiments described above. The scope of the invention is defined by the appended claims and all changes and modifications where they fall within the equivalent scope of the claims are therefore to be understood by the invention.
    权利要求:
    Claims (1)
    [1]
    Claims [Claim 1] A trimming apparatus (1) comprising: a chuck table (30) which has a ring-shaped groove (301) with an outer diameter smaller than an outer diameter of a wafer (W) and brings the groove ring-shaped (301) to communicate with a suction source (39) to hold, by suction, a lower surface of the wafer (W) by the ring-shaped groove (301); a table rotation mechanism (32) which rotates the chuck table (30); a cutting unit (61,62) which rotates a spindle (610) on which a cutting blade (613) is mounted and annularly cuts a circumferential portion of the wafer (W) held by the chuck table (30) ; characterized in that the trimming apparatus (1) includes a cleaning unit (7) which cleans a region outside the ring-shaped groove (301) in an upper surface of the chuck table (30) and the upper surface of the chuck table (30) including the ring-shaped groove (301), wherein: the cleaning unit (7) is positioned on the region (300a) outside the ring-shaped groove (301) in the upper surface of the chuck table (30) and the upper surface of the chuck table (30) including the ring-shaped groove (301), and the chuck table (30) is rotated by the table rotation mechanism (32), for cleaning the region outside the ring-shaped groove (301) in the upper surface of the chuck table (30) and the upper surface of the chuck table (30 ) including the ring-shaped groove (301).
    [Claim 2] A trimming apparatus (1) according to claim 1, further comprising: a horizontal moving mechanism (15) which moves the cutting unit (61,62) in a spindle center axis direction ( 610), wherein: the cutting unit (61,62) comprises a spindle unit (610) which rotates the spindle (610) to which a holder on which the cutting blade is mounted is coupled and a cover blade cover (614) which surrounds the holder and the cutting blade (613), the cleaning unit (7) includes a cleaning nozzle (70) which is mounted on the blade cover (614) and ejects water pressure in a downward direction, and an inlet area of the high pressure water ejected from the cleaning nozzle (70) is positioned on the region outside the ring-shaped groove (301) in the upper surface of the chuck table (30) and the upper surface of the chuck table (30) including the ring-shaped groove (301) by the horizontal displacement (15), and the cleaning is carried out.
    [Claim 3] A trimming apparatus (1) according to claim 1, wherein: the cleaning unit (8) comprises a sponge (80) and a sponge nozzle (81) which supplies the cleaning water to the sponge (80), and the sponge (80) is positioned on the region outside the ring-shaped groove (301) in the upper surface of the chuck table (30) and the upper surface of the chuck (30) including the ring-shaped groove (301), and cleaning is performed by the sponge (80) to which cleaning water is supplied from the sponge nozzle (81).
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    同族专利:
    公开号 | 公开日
    CN112349622A|2021-02-09|
    SG10202006744YA|2021-03-30|
    US20210043473A1|2021-02-11|
    FR3099718A1|2021-02-12|
    BE1028529A1|2022-02-28|
    JP2021024036A|2021-02-22|
    TW202107555A|2021-02-16|
    KR20210018060A|2021-02-17|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20150151337A1|2013-12-04|2015-06-04|Disco Corporation|Cleaning apparatus|
    JP2017004989A|2015-06-04|2017-01-05|株式会社ディスコ|Manufacturing method for wafer, and manufacturing apparatus of wafer|
    JP5349982B2|2009-01-14|2013-11-20|株式会社ディスコ|Processing method for wafer with substrate|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP2019144404A|JP2021024036A|2019-08-06|2019-08-06|Edge trimming device|
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