• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    BE2017 / 5635
    公开号:BE1024439B1
    申请号:E2017/5635
    申请日:2017-09-07
    公开日:2018-02-20
    发明作者:Olivier Duthoit；Marc Legrand；Martin Duboc
    申请人:Amvalor Société Par Actions Simplifiée À Associé Unique；
    IPC主号:
    专利说明:

    (73) Holder (s):
    AMVALOR Simplified joint-stock company with single partner
    75013, PARIS
    France (72) Inventor (s):
    DUTHOIT Olivier
    59155 FACHES-THUMESNIL
    France
    LEGRAND Marc
    59230 SAINT-AMAND-LES-EAUX France
    DUBOC Martin 59870 VRED France (54) MULTI-LAYER COMPOSITE DEVICE OF AN ENDOGENOUS HEATING MOLD WITH FORCED COOLING SYSTEM (57) BE2017 / 5635
    200
    BELGIAN INVENTION PATENT
    FPS Economy, SMEs, Middle Classes & Energy
    Publication number: 1024439 Deposit number: BE2017 / 5635
    Intellectual Property Office International Classification: B29C 33/02 B29C 70/30 B29C 70/88 H05B 3/10
    Date of issue: 20/02/2018
    The Minister of the Economy,
    Having regard to the Paris Convention of March 20, 1883 for the Protection of Industrial Property;
    Considering the law of March 28, 1984 on patents for invention, article 22, for patent applications introduced before September 22, 2014;
    Given Title 1 “Patents for invention” of Book XI of the Code of Economic Law, article XI.24, for patent applications introduced from September 22, 2014;
    Having regard to the Royal Decree of 2 December 1986 relating to the request, the issue and the maintenance in force of invention patents, article 28;
    Given the patent application received by the Intellectual Property Office on 07/09/2017.
    Whereas for patent applications falling within the scope of Title 1, Book XI of the Code of Economic Law (hereinafter CDE), in accordance with article XI. 19, §4, paragraph 2, of the CDE, if the patent application has been the subject of a search report mentioning a lack of unity of invention within the meaning of the §ler of article XI.19 cited above and in the event that the applicant does not limit or file a divisional application in accordance with the results of the search report, the granted patent will be limited to the claims for which the search report has been drawn up.
    Stopped :
    First article. - It is issued to
    AMVALOR Simplified joint-stock company with single partner, Boulevard de l'Hôpital 151, 75013 PARIS France;
    represented by
    VANDENBOSSCHE Simon, Place Marmottan 85 - BP 30247.62405, BETHUNE Cedex;
    a Belgian invention patent with a duration of 20 years, subject to the payment of the annual fees referred to in article XI.48, §1 of the Code of Economic Law, for: COMPOSITE MULTILAYER DEVICE OF AN ENDOGENOUS HEAT MOLD WITH FORCED COOLING SYSTEM.
    INVENTOR (S):
    DUTHOIT Olivier, 29 Rue des Aubépines, 59155, FACHES-THUMESNIL;
    LEGRAND Marc, 1095 Route de la Fontaine Bouillon, 59230, SAINT-AMAND-LES-EAUX;
    DUBOC Martin, 64 Rue Voltaire Tison, 59870, VRED;
    PRIORITY (S):
    09/09/2016 FR 1670499;
    DIVISION:
    divided from the basic application: filing date of the basic application:
    Article 2. - This patent is granted without prior examination of the patentability of the invention, without guarantee of the merit of the invention or of the accuracy of the description thereof and at the risk and peril of the applicant (s) ( s).
    Brussels, 20/02/2018, By special delegation:
    BE2017 / 5635
    COMPOSITE MULTILAYER DEVICE OF AN ENDOGENOUS HEATING MOLD WITH FORCED COOLING SYSTEM
    The present invention relates to the field of molds with endogenous heating and forced cooling, the invention particularly relating to a multilayer device consisting of a structure of composite materials associated with a sandwich structure. The invention also relates to a method of manufacturing said multilayer device for implementing the mold with endogenous heating and forced cooling.
    The invention advantageously finds its application for the production of fibrous preforms having short cycle times requiring forced cooling of said mold, for example for the manufacture of automobile parts. Although particularly intended for these applications, the invention can also be implemented for the production of all composite structures requiring forced cooling.
    State of the prior art
    The composite material parts with organic matrices are obtained by means of a mold. We place ourselves here in the case of endogenous heating. A pressurizing step and a heating step are necessary for the transformation of the resin. Two types of molds are used to make these parts: metal molds and composite molds.
    Metal molds are obtained by mass machining or rough casting, or by assembling mechanically welded sheets. Metal molds tend to standardize the temperature of the molding surface but have significant thermal inertia. Also, the cooling of this type of mold is long. These molds are not suitable for high production rates.
    Composite molds are a solution to the various drawbacks encountered with metal molds. However, although their thermal inertia is lower, their use at high speed remains limited.
    To increase the rate of manufacture of composite parts using such a composite mold with endogenous heating, it is known to provide a cooling system on said mold. As such, there are already cooling systems by forced convection of cold fluids in pipes integrated into the molds, for example by integration of silicone pipes on the back of the molding skin in composite materials, there are also cooling systems by
    BE2017 / 5635 stratification of a network of metal tubes at the back of the mold, or by sweeping the back of the mold using a flow of cold air channeled through an air stream.
    Object of the invention
    The present invention relates to a multilayer device of a composite mold with endogenous heating with an optimized cooling system, such a multilayer device that can be envisaged on composite structures requiring a cooling system of this type (light, etc.), by the integration of an exchanger with a fluid, which cools the mold while participating in the mechanical structure of the latter. The association of the cooling system with an integrated heating system allows the implementation of a multilayer device offering an optimized mold (or structure) technology for the production of parts at high speed, with an investment cost and low energy consumption.
    The present invention also aims to propose a method of integrating this exchanger during the manufacture of the multilayer device of the mold (or of the structure), said integration method being adaptable to two techniques for producing said multilayer device, as well as 'to all geometries of composite molds.
    Summary of the invention
    To this end, the invention relates to a multilayer device of a mold equipped with an endogenous heating system and a cooling system. The multilayer device comprises a multilayer structure which comprises a functional surface layer and at least one reinforcing layer of composite material. In addition, this multilayer device comprises a sandwich structure arranged on the back of the at least one reinforcing layer, that is to say on the side opposite to the functional surface. This sandwich structure incorporates a heat exchanger configured to implement at least one cooling zone and participate in the mechanical structure of said multilayer device, by stiffening the latter.
    In a preferred embodiment of the multilayer device according to the invention, the multilayer structure comprises at least two layers of reinforcements.
    In a preferred embodiment of the multilayer device according to the invention, the multilayer structure integrates said endogenous heating system which is configured to participate in the mechanical structure of said multilayer device. Preferably, this endogenous heating system comprises a resistive heating network embedded in a resin, said resin being bonded to at least one reinforcing layer. In one embodiment, this resistive heating network will comply with that described in patent FR2956555B1.
    BE2017 / 5635
    In a first embodiment of the multilayer device according to the invention, the functional surface layer is made of composite material, which is very suitable for the production of small and medium series of molded parts.
    In a second embodiment of the multilayer device according to the invention, the functional surface layer consists of a metal skin, which offers greater robustness to said device for the manufacture of molded parts in large and very large series.
    The heat exchanger of the multilayer device according to the invention can have a single zone for cooling the functional surface layer. However, in a variant, this heat exchanger implements several cooling zones distributed according to the localized cooling needs of the functional surface layer.
    According to the multilayer device which is the subject of the invention, the sandwich structure comprises a sandwich core comprising a first film of adhesive bonded to at least one reinforcing layer of composite, that is to say on the back of the multilayer structure. This sandwich core also includes a honeycomb structure which is deposited on this first adhesive film and a first covering layer composed of a second adhesive film and a prepreg fabric. In addition, this sandwich core is machined so as to create a groove circuit implementing the heat exchanger.
    This honeycomb structure makes it possible to stiffen the sandwich structure and thus the multilayer device. This also makes it possible to limit the total mass of the multilayer device.
    According to this implementation of the sandwich structure, it comprises a second covering layer composed of a prepreg fabric which covers the circuit of grooves on the sandwich core, so as to close it.
    The invention also relates to a method for manufacturing a multilayer device for a mold with an endogenous heating system and a cooling system. According to the invention, the method implements a heat exchanger on a sandwich structure by performing the following steps:
    a step of constituting a sandwich core configured to participate in the mechanical structure of said multilayer device, said sandwich core being deposited on a support surface;
    a next step of creating a groove circuit in the sandwich core by machining the latter, said groove circuit comprising an inlet and an outlet, and defining at least one cooling zone on said sandwich structure;
    a next step of adding supply and exhaust inserts at the entry and exit of the bleeding circuit;
    BE2017 / 5635 a next step of depositing a covering layer of the sandwich core so as to cover the circuit with grooves and close it.
    In a first embodiment, the method according to the invention comprises a prior step of constituting a multilayer structure which comprises a functional surface layer, constituting the active surface of the mold, and at least one reinforcing layer of composite material. The back of this multilayer structure constitutes said support surface on which the sandwich core is deposited.
    In a second embodiment, the method according to the invention comprises a preliminary step of producing a tool sole and an insulating core constituting the base of the mold, said elements constituting said support surface on which the core is deposited sandwich. According to this second embodiment, the method comprises an additional step of constituting a multilayer structure, this multilayer structure being deposited on the sandwich structure used. Preferably, according to this second embodiment, the method comprises a complementary step of machining the external surface of this multilayer structure, said external machined surface constituting the active surface of the mold.
    Preferably, according to one or other of the variant embodiments of the method which is the subject of the invention, the step of constituting the multilayer structure incorporates a step of integrating a resistive heating network.
    Preferably, according to the process which is the subject of the invention, the stage of constitution of the sandwich core consists in the implementation of the following stages:
    deposit a first film of glue on the support surface to bond it to it; deposit the honeycomb structure on this first film of adhesive, deposit a first covering layer composed of a second film of adhesive and a prepreg fabric;
    cook the whole thing.
    When the first variant embodiment of the method is implemented, this aforementioned cooking can be carried out simultaneously with the stage of constitution of the multilayer structure.
    Brief description of the figures
    The characteristics of the present invention will appear on reading the following description of a preferred embodiment based on figures, among which:
    BE2017 / 5635
    - Figure 1 illustrates an embodiment of a composite multilayer structure incorporating a heating network system;
    - Figure 2 illustrates a multilayer device according to the invention comprising a multilayer structure and a sandwich core attached to an internal side of the multilayer structure, said sandwich core allowing the implementation of a heat exchanger;
    - Figure 3 illustrates an example of a groove circuit arranged on the sandwich core for the constitution of the heat exchanger;
    - Figure 4 illustrates a sectional view of the multilayer device thus equipped with its cooling system;
    - Figure 5 illustrates in section a first embodiment of the mold consisting of two parts each comprising such a multilayer device, the association of said part for producing a closed tool;
    FIG. 6 illustrates in section a second embodiment of a mold consisting of two parts, each comprising such a multilayer device of the mold, the association of said parts making it possible to produce closed tools,
    - Figure 7 illustrates an embodiment of a heating cord of a resistive heating network.
    Detailed description of the figures
    In the following description, the same references are used according to the two alternative embodiments of the multilayer device which is the subject of the invention.
    In a first embodiment, the basic idea of the invention is to start from a multilayer structure 1 illustrated in FIG. 1. In this FIG. 1, the multilayer structure 1 comprises a stack of layers with a surface layer 2 comprising a functional face 2a which constitutes the negative of one face of the composite part to be molded. In the figure, this surface layer is made of composite material, for example in "gelcoat", preferably used during manufacture in small or medium series. Alternatively, for manufacturing parts in large or very large series, one can also provide a surface layer 2 of metal.
    In FIG. 1, the multilayer structure comprises a first reinforcing layer 3 and a second reinforcing layer 4 made of insulating composite material, for example made of thermoplastic fibers. However, it is possible to envisage variants with electrically conductive composite materials, for example carbon fiber. Between these two reinforcing layers 3, 4 is integrated a heating network 5 of the resistive type preferably manufactured in accordance with patent FR2956555B1.
    As illustrated with reference to FIGS. 1 and 7, this heating network 5 comprises a cord 6 which includes a resistive wire 7 surrounding an electrically insulated core 8, this core 202 consisting of fibers
    BE2017 / 5635 dry as a wick. The resistive wire 7 is electrically connected by means of a connection cable (not shown). The core 8 constitutes a support for an impregnation resin 9 which ensures the adhesion of the bead 6 with the reinforcing layers 3, 4 themselves pre-impregnated with resin. The cord 6 may optionally include, in addition, a sheath 10 of dry fiber surrounding said resistive wire 7 and capable of being impregnated with resin 9. The choice of whether or not to integrate this sheath 204 will depend in particular on the electrical conductivity of the layers of reinforcements 3,4, depending on the composite material used for them. The cord 6 is secured to a dry fabric 11 by sewing 12. This dry fabric 11 is advantageously made of a fibrous composite material identical to that used for the reinforcing layers 3,4. For example, depending on the implementation envisaged, the dry fabric 11 will be made of glass fibers, carbon fibers or even thermoplastic fibers.
    In the embodiment of FIG. 1, the multilayer structure 1 comprises a metallic mesh 13 embedded in a resin 14. This metallic mesh 13 makes it possible to drain the electrostatic charges which accumulate on the surface of the multilayer structure 1, taking into account the use of reinforcing layers 3, 4 of insulating composite material. To allow the dissipation of these charges, provision is made to connect the wire mesh 13 to the ground (not shown).
    In a variant, when the surface layer 2 consists of a metal skin in place of a layer of composite material, this advantageously makes it possible to eliminate the static charges and, thus, to dispense with the use of a metal grid 13 like that provided in the embodiment of FIG. 1.
    Other alternative embodiments of the multilayer structure 1 can be envisaged with more than two reinforcing layers and two heating networks separated from one another by at least one reinforcing layer, such an implementation appearing in patent FR2956555B1 and possibly being taken up within the framework of the invention. Other possible variants within the scope of the invention also appear in this patent FR2956555B1. We can also consider other endogenous heating systems, equivalent or not, integrated within this multilayer structure 1.
    Once this multilayer structure 1 of the heating mold has been produced and polymerized, the back 15 of this multilayer structure 1 formed, in the case of FIG. 1, by the external face 4a of the second reinforcing layer 4, will serve as a support surface for placing in place of a sandwich structure 16 integrating a heat exchanger 17, as illustrated in FIG. 4. In this FIG. 4, the multilayer structure 1 is illustrated by a single thick layer; of course, this will actually consist of several layers, as described above.
    FIGS. 2 to 4 make it possible to understand the implementation of the sandwich structure 16. A first step consists in implementing a sandwich core 18 which is deposited on the back 15 of the multilayer structure 1, as illustrated in FIG. 2. For this, we deposit a first film of glue 19
    BE2017 / 5635 on the back 15 of the multilayer structure 1. A honeycomb structure 20, cut to size and chamfered around the contour 20a is then deposited on this adhesive film 19. A covering layer 21, composed of a second film of glue 22 and a prepreg 23, then covers the honeycomb structure 20 in order to close the cells 24 present on this honeycomb structure 20.
    The assembly consisting of the multilayer structure 1 provided with its endogenous heating system, and of the sandwich core 18 is then placed under a vacuum cover in order to bake the adhesive films 19, 22 and the prepreg fabric 23. This cooking can advantageously be carried out by the heating network 5 integrated into the multilayer structure 1.
    Once the cooking is complete and the sandwich core 18 has polymerized, this sandwich core 18 is machined on a conventional machine or on a machining center in order to create a groove circuit 25, as illustrated in FIG. 3. An insert of inlet 26 and an outlet insert 27 are then placed at the ends 25a, 25b of the bleeding circuit 25. These inserts 26, 27 respectively allow an inlet tube and an outlet tube of a cooling circuit (not illustrated) configured to convey a cooling fluid in order to carry out the heat exchange making it possible to accelerate the cooling of the functional face 2a on the multilayer structure 1.
    One or more layers of prepreg 28 are then placed on the sandwich core 18 provided with the groove circuit 25 in order to close said groove circuit 25 and to constitute the heat exchanger 17, as illustrated in FIG. 4 The assembly is finally subjected to a vacuum followed by cooking to polymerize the last layers of prepreg fabrics 28 which have been added, thus making it possible to finalize the multilayer device 100 constituting a main element of a mold 200.
    This mold 200 obtained can be used alone or associated with a second mold 200 'of the same type, each constituting in this case part of the same mold 300 configured to design a molded part 400 made of composite materials by an infusion process, of RTM or any other type, this molded part 400 having for example an airplane wing profile, as illustrated in FIG. 5.
    As illustrated in FIG. 5, these molds 200, 200 ’each have a stiffening box 210, 210 ′ in which thermally insulating material 220, 220 ′ is integrated. The box 210, 210 'receiving the multilayer device 100 with its multilayer structure 1 integrating the endogenous heating system and its sandwich structure 16 integrating the heat exchanger 17. In this FIG. 5, the multilayer structure 1 comprises two heating networks 50, 51 , constituting said endogenous heating system, and two reinforcing layers 52, 53.
    BE2017 / 5635
    The multilayer device 100 on the mold 200, 200 ′ can also be manufactured according to a second technique, the integration of the cooling system on said multilayer device 100 is then very similar to that described above, with the difference that the implementation of the sandwich structure 16 is no longer based on the multilayer structure 1, but on an insulating core 230 present in a sole 231 of said mold 200, 200 ′, as illustrated in FIG. 6. The sandwich core 18 described above, and illustrated in FIG. 2, is then implemented by resting on the support surface 232 of the core 230, and no longer on the back 15 of the multilayer structure 1. The core 230 makes it possible to thermally insulate the sole 231. The sandwich core 18 is then machined after cooking, in order to implement the groove circuit 25, as described above. A layer of prepreg tissue 28 then covers the bleeding circuit, then the various layers of the multilayer structure 1 are deposited, using an arrangement similar to that described for FIG. 1, the surface layer 2 allowing the implementation of the functional face 2a of said mold 200, 220 ′.
    Finally, a firing is carried out in order to polymerize the assembly and complete the multilayer device 100.
    This cooking can be obtained by means of the endogenous heating system integrated in the multilayer structure 1. In one implementation, it is possible to carry out a complementary step of machining the external face of the surface layer 2 so as to constitute the functional face 2a.
    Other characteristics are possible without departing from the scope of the invention. By way of example, the mold 200, 200 ’will in particular have the usual characteristics, such as vents, fluid injection inserts, guiding elements between the two parts of the mold 200,
    200 ’. There will also be a system for circulating a cooling fluid over the mold 200, 200 ’for conveying said cooling fluid in the heat exchanger 17.
    In the foregoing description, the heat exchanger 17 defines a cooling zone on the multilayer device 100. However, other implementations may be provided for providing for different distributions of the honeycomb structure 20 and of the groove circuit 25 in order to constitute several cooling zones of the functional face 2a.
    BE2017 / 5635
    权利要求:
    Claims (13)
    [1]
    1. Multilayer device (100) of a mold (200, 200 ') equipped with an endogenous heating system (5, 50, 51) and a cooling system, comprising a multilayer structure (1) which comprises a functional surface layer (2) and at least one reinforcing layer (3, 4, 52, 53) of composite material, characterized in that it comprises a sandwich structure (16) comprising a sandwich core (18) which comprises a first adhesive film (19) linked to the back (4a, 15) of the at least one reinforcing layer (4, 53), a honeycomb structure (20) deposited on this first adhesive film and a first covering layer (21) composed of a second film of adhesive (22) and of a prepreg fabric (23), said sandwich core (18) being machined after a first baking so as to create a circuit of grooves (25) using a heat exchanger (17) provided with at least one cooling zone, said sandwich structure (16) comprising a secon covering layer (28) composed of a prepreg fabric which covers the groove circuit (25) on the sandwich core (18), said sandwich structure (16) participating in the mechanical structure of said multilayer device (100) .
    [2]
    2. Multilayer device (100) according to claim 1, wherein the multilayer structure (1) comprises at least two layers of reinforcements (3, 4, 52, 53).
    [3]
    3. Multilayer device (100) according to one of the preceding claims, in which the multilayer structure (1) integrates said endogenous heating system (5, 50, 51) which is configured to participate in the mechanical structure of said multilayer device.
    [4]
    4. Multilayer device (100) according to claim 3, wherein the endogenous heating system comprises a resistive heating network (5, 50, 51) embedded in a resin (9), said resin being bonded to at least one layer reinforcement (3, 4, 52, 53).
    [5]
    5. Multilayer device (100) according to one of the preceding claims, in which the surface layer (2) is made of composite material.
    [6]
    6. Multilayer device (100) according to one of claims 1 to 4, wherein the surface layer (2) consists of a metallic skin.
    [7]
    7. Multilayer device (100) according to one of the preceding claims, in which the heat exchanger (17) implements several cooling zones distributed according to the localized cooling needs of the surface layer (2).
    [8]
    8. A method of manufacturing a multilayer device (100) of a mold (200, 200 ') with an endogenous heating system and a cooling system, characterized in that it implements a heat exchanger (17) on a sandwich structure (16) by performing the following steps:
    - constitution of a sandwich core (18) comprising a first film of adhesive (19) deposited on a support surface (15, 232), a honeycomb structure (20) deposited on this first film of adhesive and a first cover layer (21) composed of a second adhesive film (22) and a prepreg fabric (23);
    BE2017 / 5635
    - Creation of a groove circuit (25) in the sandwich core by machining it after a first baking, said groove circuit comprising an inlet (25a) and an outlet (25b), and defining at least one zone cooling on said sandwich structure (16),
    - addition of supply (26) and exhaust (27) inserts at the inlet and outlet;
    - depositing a covering layer (28) of the sandwich core (18) so as to cover the circuit with grooves.
    [9]
    9. The method of claim 8, which comprises a prior step of constituting a multilayer structure (1) comprising a functional surface layer (2) and at least one reinforcing layer (3, 4, 52, 53) of material composite, the back (15) of said multilayer structure constituting said support surface on which the sandwich core is deposited.
    [10]
    10. The method of claim 8, which comprises a prior step of producing a tool sole (231) and an insulating core (230) constituting the base of the mold, said elements making it possible to constitute said support surface ( 232) on which the sandwich core (18) is deposited.
    [11]
    11. The method of claim 10, which comprises a step of constituting a multilayer structure (1) deposited on the sandwich structure (16).
    [12]
    12. The method of claim 11, which comprises a step of machining the outer surface of this multilayer structure (1), said machined outer surface constituting the functional face (2a) of the mold.
    [13]
    13. Method according to one of claims 9 or 11, the step of constituting the multilayer structure (1) incorporates a step of integrating a resistive heating network (5, 50, 51).
    BE2017 / 5635
    1/4
    Hi
    22 23 20a
    BE2017 / 5635
    2/4
    200
    100
    2a
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    BE2017 / 5635
    BE2017 / 5635
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    同族专利:
    公开号 | 公开日
    FR3055571A1|2018-03-09|
    FR3055571B1|2019-12-20|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    CN201357532Y|2009-03-13|2009-12-09|苏州红枫风电模具有限公司|Electric heating and air cooling system for dies|
    FR2956555B1|2010-02-15|2012-04-13|Arts|MULTILAYER DEVICE FOR ENDOGENEOUS HEATING MOLD AND METHOD OF MANUFACTURING SAME|
    DE102011119613B4|2011-11-29|2017-07-27|Airbus Defence and Space GmbH|Mold and manufacturing device for the production of plastic components and mold manufacturing method|FR3106772B1|2020-01-31|2022-01-28|Ecole Nat Superieure D’Arts Et Metiers|FLEXIBLE HEATING MAT FOR PREFORMING OR CONSOLIDATING COMPOSITE PARTS|
    法律状态:
    2018-03-14| FG| Patent granted|Effective date: 20180220 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1670499|2016-09-07|
    FR1670499A|FR3055571B1|2016-09-07|2016-09-07|MULTI-LAYERED COMPOSITE DEVICE OF AN ENDOGENOUS HEATING MOLD WITH FORCED COOLING SYSTEM.|
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